Silicon wafer wet processing method and system

Abstract

The application provides a silicon wafer wet processing method and system, and the silicon wafer wet processing system comprises a factory system, a self-activation system and a wafer processing unit; the factory system comprises an instruction receiving module and a chemical liquid preparation module; the instruction receiving module is connected with a control terminal to receive an instruction sent by the control terminal; the chemical liquid preparation module is used for preparing an initial chemical liquid according to the instruction in proportion; the factory system is connected with the self-activation system; the self-activation system is connected with the wafer processing unit; the self-activation system is used for generating an activated chemical liquid from the initial chemical liquid; the activated chemical liquid is a chemical liquid containing active ingredients; the activated chemical liquid flows into the wafer processing unit through an outlet end of the first self-activation system; and the wafer processing unit is used for processing wafer products. The silicon wafer wet processing method and system can realize self-activation of the chemical liquid, do not occupy the production capacity of the equipment, and improve the effective utilization rate of the equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of integrated circuit manufacturing, and in particular to a silicon wafer wet processing method and system. BACKGROUND

[0002] In a backside illumination image sensor (BSI) manufacturing process, a silicon wafer is usually wet etched using HNA (a mixture of HF, HNO3 and CH3COOH). HNA reacts with silicon to generate nitrous acid, which further promotes the chemical reaction. Generally, the concentration of nitrous acid generated by the above chemical reaction at the process temperature cannot meet the actual production requirements, so the HNA needs to be pretreated to obtain a nitrous acid solution with sufficient concentration.

[0003] Because the particulate impurities in the chemical liquid circulation system have great harm to the circulating pump, filter and product, high-doped control wafers that generate fewer particles are usually used to pretreat HNA in the current production. The control wafers and product wafers have the same doping type. However, the existing process has the following defects: a) the surface area of high-doped silicon wafers is limited, so that the activation efficiency of the chemical liquid is low; b) the pretreatment action is completed in the product processing unit of the equipment, which occupies the production capacity of the equipment and reduces the effective utilization rate of the equipment; c) the activated HNA liquid loses its active ingredients after being placed for a period of time, and needs to be reactivated, which increases the production cost.

[0004] Therefore, the present application provides a silicon wafer wet processing method and system to improve the effective utilization rate of the equipment. SUMMARY

[0005] In a first aspect, the present application provides a silicon wafer wet processing system, comprising: a factory system and a self-activation system; the factory system comprises an instruction receiving module and a chemical liquid preparation module, the instruction receiving module is connected to a control terminal to receive instructions sent by the control terminal, and the chemical liquid preparation module is used to prepare an initial chemical liquid according to the instructions in proportion; a first factory system outlet of the factory system is connected to a first self-activation system inlet of the self-activation system, and a first self-activation system outlet of the self-activation system is connected to a wafer processing unit; the initial chemical liquid flows into the self-activation system through the first factory system outlet, the self-activation system is used to generate an activated chemical liquid from the initial chemical liquid, and the activated chemical liquid is a chemical liquid containing active ingredients; the activated chemical liquid flows into the wafer processing unit through the first self-activation system outlet, and the wafer processing unit is used to process wafer products.

[0006] The beneficial effect of the present application is that the self-activation system for the silicon wafer wet processing system can realize self-activation of the liquid medicine, does not occupy the production capacity of the equipment, and improves the effective utilization rate of the equipment.

[0007] Optionally, the self-activation system internally places high-doped active silicon balls, the doping type of the high-doped active silicon balls is P type, and the diameter size of the high-doped active silicon balls includes 1 um-1 mm. The beneficial effect of the present application is that for the same total volume of the silicon balls and the silicon wafer, the silicon balls react more fully with the liquid medicine when placed in the liquid medicine, which is more conducive to improving the activation efficiency of the liquid medicine.

[0008] Further optionally, the self-activation system includes at least one filter, the filter is arranged at the first self-activation system inlet end side or the second self-activation system inlet end side of the self-activation system, and the filter is used to filter impurities in the initial liquid medicine or the activated liquid medicine. The beneficial effect of the present application is that the design facilitates disassembly, replacement and maintenance of the self-activation system.

[0009] Optionally, the silicon wafer wet processing system further includes a first pipeline, a liquid medicine circulating tank and a liquid storage tank, the first pipeline is connected to the second factory system outlet end of the factory system and the second self-activation system inlet end, the first self-activation system outlet end is connected to the first liquid storage tank inlet end of the liquid storage tank, and the first liquid storage tank outlet end of the liquid storage tank is connected to the first liquid medicine circulating tank inlet end of the liquid medicine circulating tank, the first factory system outlet end is connected to the second liquid medicine circulating tank inlet end of the liquid medicine circulating tank, and the first liquid medicine circulating tank outlet end of the liquid medicine circulating tank is connected to the first self-activation system inlet end, the first pipeline includes nitrogen, and the nitrogen in the first pipeline is used to discharge the activated liquid medicine in the self-activation system to the liquid storage tank through the first self-activation system outlet end. The beneficial effect of the present application is that the activated liquid medicine in the present application can be reused, which reduces the production cost.

[0010] Optionally, the silicon wafer wet processing system further comprises a pump, a first check valve, a second valve, a second check valve, a first filter, a second filter, and a third valve; the pump, the first check valve, and the second valve are arranged on a pipeline connecting the first liquid outlet of the first liquid circulating tank and the first inlet of the first self-activation system; the second outlet of the second self-activation system is connected to the fourth liquid inlet of the liquid circulating tank, and the second check valve, the first filter, and the second filter are arranged on a pipeline connecting the second outlet of the second self-activation system and the fourth liquid inlet of the liquid circulating tank; the first liquid outlet of the first liquid circulating tank is connected to the fourth liquid inlet of the liquid circulating tank, and the third valve and the second filter are arranged on a pipeline connecting the first liquid outlet of the first liquid circulating tank and the fourth liquid inlet of the liquid circulating tank. The beneficial effect of the design is that the initial liquid or the activated liquid can be switched according to actual needs by arranging control valves on the corresponding pipelines to prepare the liquid that meets the actual needs.

[0011] Optionally, the silicon wafer wet processing system further comprises a detection system, one end of the detection system being connected to the first liquid outlet of the first liquid circulating tank through the pump, and the other end of the detection system being connected to the first inlet of the first self-activation system through the first check valve and the second valve; the detection system is used to detect the impurity content in the initial liquid or the activated liquid flowing out of the first liquid outlet of the first liquid circulating tank.

[0012] Optionally, the silicon wafer wet processing system further comprises a second pipeline, the second pipeline connecting the third outlet of the factory system and the third liquid inlet of the liquid circulating tank, and the liquid circulating tank being connected to one end of the wafer processing unit; the second pipeline contains nitrogen.

[0013] Optionally, the silicon wafer wet processing system further comprises a liquid level sensor and a first valve, the liquid level sensor and the first valve being arranged on a pipeline connecting the first outlet of the first self-activation system and the first liquid inlet of the first liquid tank, and the first valve being arranged between the first outlet of the first self-activation system and the liquid level sensor. The beneficial effect of the design is that when the liquid level in the pipeline where the liquid level sensor is arranged is lower than the liquid level sensor, the first valve is closed, and the activated liquid can be separated from the high-doped active silicon ball.

[0014] In a second aspect, the present application further provides a silicon wafer wet processing method applied to the silicon wafer wet processing system as described in the above embodiments, which comprises: the instruction receiving module receives the instruction sent by the control terminal, the chemical liquid preparation module prepares the initial chemical liquid according to the instruction in proportion, the initial chemical liquid flows into the self-activation system through the first factory system outlet end, the self-activation system generates the activated chemical liquid according to the initial chemical liquid, the activated chemical liquid is a chemical liquid containing active ingredients, the activated chemical liquid flows into the wafer processing unit through the first self-activation system outlet end, and the wafer processing unit processes the wafer product through the activated chemical liquid.

[0015] Optionally, the silicon wafer wet processing method further comprises: when the concentration of the active ingredients in the activated chemical liquid is lower than a set value, the activated chemical liquid flows out of the chemical liquid circulating tank and flows through the self-activation system again for re-activation to increase the concentration of the active ingredients in the activated chemical liquid. The beneficial effect of this step is that when the concentration of the active ingredients in the obtained activated chemical liquid is not enough, the concentration of the active ingredients in the activated chemical liquid can be increased again through this step. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 An embodiment structure schematic diagram of a silicon wafer wet processing system provided by the present application is shown in the figure.

[0017] Figure 2 An embodiment schematic diagram of the pipeline flow direction of a silicon wafer wet processing system in a self-activation state provided by the present application is shown in the figure.

[0018] Figure 3 An embodiment schematic diagram of the pipeline flow direction of a silicon wafer wet processing system in a self-circulation state provided by the present application is shown in the figure.

[0019] Figure 4 An embodiment schematic diagram of the pipeline flow direction of a silicon wafer wet processing system in a self-circulation state when the concentration of nitrous acid is lower than a set value provided by the present application is shown in the figure.

[0020] Figure 5 An embodiment schematic diagram of the pipeline flow direction of a silicon wafer wet processing system in a product processing state provided by the present application is shown in the figure.

[0021] Figure 6 A flow chart of a silicon wafer wet processing method provided by the present application is shown in the figure. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. In the description of the embodiments of the present application, the terms used in the following embodiments are only for the purpose of describing the specific embodiments and are not intended to be limiting on the present application. As used in the specification and the appended claims of the present application, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that “at least one” and “one or more” as used in the embodiments herein indicates one or two or more (including two), unless otherwise indicated. The term “and / or” is used to describe the association relationship of the associated objects, which means that there can be three relationships; for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone, where A and B can be singular or plural. The character “ / ” generally represents an “or” relationship between the associated objects.

[0023] In this specification, the reference “one embodiment” or “some embodiments” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases “in one embodiment”, “in some embodiments”, “in other embodiments”, “in additional embodiments”, etc. in various places in the specification are not necessarily all referring to the same embodiment, but can refer to one or more but not all embodiments, unless otherwise specifically stated. The terms “comprising”, “including”, “having” and their variants mean “including but not limited to”, unless otherwise specifically stated. The term “connected” includes both direct connection and indirect connection, unless otherwise stated. “First”, “second”, etc. are used only for the purpose of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0024] In the embodiments of the present application, the words “exemplary” or “for example” are used to mean serving as an example, instance, or illustration. Any embodiment or design presented as “exemplary” or “for example” in the embodiments of the present application is not necessarily to be construed as preferred or advantageous over other embodiments or design solutions. Rather, the use of the words “exemplary” or “for example” is intended to present concepts in a particular manner.

[0025] The application provides a silicon wafer wet processing system which can be arranged in a circulation pipeline of equipment required in a backside illumination image sensor manufacturing process, and does not need to be arranged in a product processing unit of equipment required in a BSI manufacturing process, so as to improve equipment productivity. The silicon wafer wet processing system comprises a factory system and a self-activation system. The factory system comprises an instruction receiving module and a chemical liquid preparation module. The instruction receiving module is connected with a control terminal to receive an instruction sent by the control terminal. The chemical liquid preparation module is used for preparing an initial chemical liquid according to the instruction in a certain proportion. A first factory system outlet of the factory system is connected with a first self-activation system inlet of the self-activation system. A first self-activation system outlet of the self-activation system is connected with a wafer processing unit. The initial chemical liquid flows into the self-activation system through the first factory system outlet. The self-activation system is used for generating an activated chemical liquid according to the initial chemical liquid. The activated chemical liquid is a chemical liquid containing active ingredients. The activated chemical liquid flows into the wafer processing unit through the first self-activation system outlet. The wafer processing unit is used for processing wafer products.

[0026] The initial chemical liquid comprises an initial HNA chemical liquid or other chemical liquid which needs to be pretreated, such as high-temperature phosphoric acid. The activated chemical liquid is a chemical liquid containing active ingredients.

[0027] Example one: when the initial chemical liquid is an HNA chemical liquid, the factory system comprises at least three funnels with the same shape and valves for controlling liquid outflow of the funnels. The funnels are respectively filled with a solution containing HF, a solution containing HNO3 and a solution containing CH3COOH. The valves realize information interaction with a control device. The control device realizes proportion control of HF, HNO3 and CH3COOH by controlling opening time of the valves, so as to prepare the required initial HNA chemical liquid. The initial HNA chemical liquid flows into the self-activation system through the first factory system outlet. The self-activation system is internally configured with a substance containing silicon. The substance reacts with the initial HNA chemical liquid to generate an activated HNA chemical liquid. Active ingredients in the activated HNA chemical liquid comprise nitrous acid, nitric oxide and nitrogen dioxide.

[0028] Example two: when the initial chemical liquid is high-temperature phosphoric acid, the high-temperature phosphoric acid flows into the self-activation system through the first factory system outlet. The self-activation system is internally configured with a substance containing silicon, such as silicon nitride. The substance reacts with the high-temperature phosphoric acid to generate a chemical liquid with high silicon concentration.

[0029] In some embodiments, the self-activation system internally places high-doped active silicon balls, the high-doped active silicon balls are P-type, and the diameter of the high-doped active silicon balls ranges from 1 um to 1 mm. For the same total volume of multiple silicon balls and silicon wafers, when placed in the liquid, the silicon balls react more fully with the liquid, which is more conducive to improving the activation efficiency of the liquid. Alternatively, when the size of the high-doped active silicon balls placed inside the self-activation system is different, the number of high-doped active silicon balls of different sizes is configured to conform to a normal distribution. As the reaction of the high-doped active silicon balls with the initial liquid progresses, small silicon balls will gradually disappear, and large silicon balls will gradually become smaller. When the self-activation system lacks high-doped active silicon balls, a certain number of larger silicon balls need to be supplemented to facilitate the control of the reaction rate and the maintenance of the self-activation system in the later stage. The specific number of high-doped active silicon balls placed inside the self-activation system can be customized according to the liquid preparation amount or process time of the liquid circulating tank.

[0030] In some embodiments, the self-activation system includes at least one filter arranged on the side of the first self-activation system inlet or the second self-activation system inlet of the self-activation system, and the filter is used to filter impurities in the initial liquid or the activated liquid. The beneficial effect is that the design facilitates the disassembly, replacement, and maintenance of the self-activation system.

[0031] In some embodiments, the silicon wafer wet processing system further includes a first pipeline, a liquid circulating tank, and a liquid storage tank. The first pipeline is connected to the second factory system outlet of the factory system and the second self-activation system inlet. The first self-activation system outlet is connected to the first liquid storage tank inlet of the liquid storage tank. The first liquid storage tank outlet of the liquid storage tank is connected to the first liquid circulating tank inlet of the liquid circulating tank. The first factory system outlet is connected to the second liquid circulating tank inlet of the liquid circulating tank. The first liquid circulating tank outlet of the liquid circulating tank is connected to the first self-activation system inlet. The first pipeline includes nitrogen gas, and the nitrogen gas in the first pipeline is used to discharge the activated liquid in the self-activation system through the first self-activation system outlet into the liquid storage tank.

[0032] In some embodiments, the silicon wafer wet processing system further comprises: a pump, a first check valve, a second valve, a second check valve, a first filter, a second filter, and a third valve; the pump, the first check valve, and the second valve are arranged on a pipeline connecting the first liquid outlet of the first liquid tank to the first inlet of the first self-activation system; the second outlet of the second self-activation system is connected to the fourth inlet of the liquid tank, and the second check valve, the first filter, and the second filter are arranged on a pipeline connecting the second outlet of the second self-activation system to the fourth inlet of the liquid tank; the first liquid outlet of the first liquid tank is connected to the fourth inlet of the liquid tank, and the third valve and the second filter are arranged on a pipeline connecting the first liquid outlet of the first liquid tank to the fourth inlet of the liquid tank.

[0033] In some embodiments, the silicon wafer wet processing system further comprises: a detection system, one end of the detection system being connected to the first liquid outlet of the first liquid tank through the pump, and the other end of the detection system being connected to the first inlet of the first self-activation system through the first check valve and the second valve; the detection system is used to detect the impurity content in the initial liquid or the activated liquid flowing out of the first liquid outlet of the first liquid tank. Optionally, the detection system is used to identify nanoscale impurities. The nanoscale impurities include silicon particles and photoresist particles.

[0034] In some embodiments, the silicon wafer wet processing system further comprises: a second pipeline connecting the third outlet of the factory system to the third inlet of the liquid tank, and the liquid tank being connected to one end of the wafer processing unit; the second pipeline contains nitrogen. The activated liquid flowing into the wafer processing unit through the first outlet of the first self-activation system includes: the nitrogen in the second pipeline entering the liquid tank through the third inlet of the liquid tank; the activated liquid flowing into the first liquid tank through the first outlet of the first self-activation system, flowing into the first liquid tank through the first outlet of the first liquid tank, and flowing into the wafer processing unit through the liquid tank; and the waste liquid in the wafer processing unit flowing into the second inlet of the liquid tank through the other end of the wafer processing unit.

[0035] In some embodiments, the silicon wafer wet processing system further comprises: a liquid level sensor and a first valve, the liquid level sensor and the first valve being arranged on a pipeline connecting the first outlet of the first self-activation system to the first inlet of the first liquid tank, and the first valve being arranged between the first outlet of the first self-activation system and the liquid level sensor.

[0036] The present example provides a silicon wafer wet processing system, as shown inFigure 1 As shown, the system includes: a plant system 1, a chemical circulation tank 2, a detection system 3, a self-activation system 4, a storage tank 5, a wafer processing unit 6, a first filter F1, and a second filter F2. The self-activation system 4 includes highly doped active silicon spheres 401, a third filter 402, and a fourth filter 403. The first pipeline PN2-1 connects the second plant system outlet of the plant system 1 and the second self-activation system inlet, and a fourth valve V4 is installed on the first pipeline PN2-1. A first valve V3 and a level sensor S1 are installed on the pipeline connecting the outlet of the first self-activating system to the inlet of the first storage tank of the storage tank 5. The outlet of the first storage tank of the storage tank 5 is connected to the inlet of the first medicine circulation tank of the medicine circulation tank 2. The outlet of the first plant system is connected to the inlet of the second medicine circulation tank of the medicine circulation tank 2. A pump P1, a detection system 3, a first check valve Z1, and a second valve V2 are installed on the pipeline connecting the outlet of the first medicine circulation tank of the medicine circulation tank 2 to the inlet of the first self-activating system. A second check valve Z2, a first filter F1, and a second filter F2 are installed on the pipeline connecting the outlet of the second self-activating system of the self-activating system 4 to the inlet of the fourth medicine circulation tank of the medicine circulation tank 2. A third valve V1 and a second filter F2 are installed on the pipeline connecting the outlet of the first medicine circulation tank to the inlet of the fourth medicine circulation tank. The second pipeline PN2-2 connects the third plant system outlet of the plant system 4 and the third medicine circulation tank inlet of the medicine circulation tank 2. By controlling the states of the first check valve Z1, the second valve V2, and the third valve V1, the flow path of the medicine flowing out of the medicine circulation tank 2 can be switched.

[0037] When the initial HNA solution is prepared in the plant system 1, the entire system is in a self-activating state, that is, according to... Figure 2 The thick conduit shown in the diagram is in operation. Plant system 1 prepares the initial HNA solution according to instructions, opening the first check valve Z1, the second valve V2, and the second check valve Z2. The initial HNA solution flows sequentially through the solution circulation tank 2, pump P1, detection system 3, self-activation system 4, first filter F1, second filter F2, and back to the solution circulation tank 2, circulating within the aforementioned structure. When the initial HNA solution passes through the self-activation system 4, it reacts with the highly doped active silicon spheres in the system to generate an activated HNA solution. The active components of the activated HNA solution include nitrous acid, nitric oxide, and nitrogen dioxide. At this time, the third valve V1, the first valve V3, and the fourth valve V4 are closed.

[0038] Once the nitrite concentration in the HNA activation solution reaches a set value, the entire system enters a self-circulating state, i.e., according to... Figure 3The thick conduit shown in the diagram operates. The second valve V2 is closed, while the third valve V1 is opened. The activating HNA solution flows sequentially through pump P1, detection system 3, second filter F2, and solution circulation tank 2, undergoing self-circulation. Simultaneously, the first valve V3 and the fourth valve V4 are opened, and nitrogen in the first conduit PN2-1 discharges the solution in the self-activating system 4 into the storage tank 5. The activating HNA solution flows back to the solution circulation tank 2, simultaneously separating the silicon balls from the solution, thus conserving silicon balls. When the liquid level in the self-activating system 4 is lower than the height of the level sensor S1, the first valve V3 and the fourth valve V4 are closed. At this time, the nitrogen in the self-activating system 4 protects the silicon balls, preventing oxidation and the formation of silicon dioxide on the surface, thereby maintaining the surface activity of the silicon balls. Preferably, the level sensor is positioned close to the outlet end of the first self-activating system 4. This design allows the first valve V3 to be closed immediately when there is no liquid in the self-activating system 4, thus conserving silicon balls.

[0039] When the concentration of nitrite in the solution is lower than the set value (at which point the concentration of nitrite is still sufficient to meet production requirements), the system enters a self-activation state, i.e., according to... Figure 4 The thick conduit shown in the diagram is in operation. At this time, the third valve V1 is closed, and the second valve V2, the first check valve Z1, and the second check valve Z2 are open. The activating HNA solution flows out of the solution circulation tank 2 and sequentially flows through pump P1, self-activation system 4, first filter F1, second filter F2, and solution circulation tank 2 for re-activation. When the solution passes through self-activation system 4, it reacts with the highly doped active silicon spheres to generate nitrous acid, thereby further increasing the concentration of nitrous acid in the activating HNA solution.

[0040] During wafer fabrication, the HNA solution is activated according to... Figure 5 The thick-lined conduit shown in the diagram is in operation. The activating solution in the solution circulation tank 2 is supplied to the wafer processing unit 6 through the nitrogen pressure in the second conduit PN2-2. The waste liquid flows through the storage tank 5 and then flows back into the solution circulation tank 2. At this time, the system can be in a self-activation state or a self-circulation state. The initial activation of the HNA solution or the reactivation of the activating HNA solution does not affect the processing of normal products.

[0041] The self-activation system 4 is equipped with filters at both ends, and the entire system is equipped with a detection system 3, which can effectively monitor and prevent particle problems caused by silicon ball breakage. The self-activation system 4 is easy to disassemble, replace, and maintain.

[0042] Based on the silicon wafer wet processing system described in any of the above embodiments, the present invention provides a silicon wafer wet processing method, the steps of which are as follows: Figure 6 As shown, it includes:

[0043] S601: The instruction receiving module receives the instruction sent by the control terminal, and the medicine preparation module prepares the initial medicine according to the instruction in proportion;

[0044] S602: The initial liquid medicine flows into the self-activation system through the outlet of the first plant system;

[0045] S603: The self-activation system generates an activating solution based on the initial solution, wherein the activating solution is a solution containing active ingredients;

[0046] S604: The activating solution flows into the wafer processing unit through the outlet of the first self-activation system, and the wafer processing unit processes the wafer products using the activating solution.

[0047] For example, according to Figure 2 The thick conduit shown in the diagram operates, the instruction receiving module receives the instruction sent by the control terminal, and the drug preparation module prepares the initial HNA drug solution according to the instruction in proportion; the first check valve Z1, the second valve V2, and the second check valve Z2 are opened, and the initial HNA drug solution flows sequentially and circulates through the drug solution circulation tank 2, pump P1, detection system 3, self-activation system 4, first filter F1, second filter F2, and drug solution circulation tank 2; when the initial HNA drug solution passes through the self-activation system 4, the initial HNA drug solution reacts with the highly doped active silicon spheres in the self-activation system 4 to generate nitrous acid, and obtains the activated HNA drug solution; the first valve V3, the third valve V1, and the fourth valve V4 are closed.

[0048] In some embodiments, when the concentration of the active ingredient in the activating solution is lower than a set value, the activating solution flows out of the solution circulation tank and flows through the self-activation system again for re-activation, so as to increase the concentration of the active ingredient in the activating solution.

[0049] For example, when the concentration of nitrite in the HNA activation solution is lower than a set value, according to... Figure 4 The thick pipeline shown in the diagram operates as follows: when the concentration of nitrite in the activating HNA solution is lower than the set value, the third valve V1 closes, and the second valve V2, the first check valve Z1, and the second check valve Z2 open. The activating HNA solution flows out of the solution circulation tank 2 and flows sequentially through the pump P1, the self-activation system 4, the first filter F1, the second filter F2, and the solution circulation tank 2 for re-activation, thereby increasing the concentration of nitrite in the activating HNA solution.

[0050] The above merely illustrates the specific implementation of the embodiments of the present application, but the protection scope of the embodiments of the present application is not limited to this. Any change or replacement within the technical scope disclosed by the embodiments of the present application should be covered in the protection scope of the embodiments of the present application. Therefore, the protection scope of the embodiments of the present application should be subject to the protection scope of the claims.

Claims

1. A silicon wafer wet processing system, characterized by, Comprise: Plant management system, self-activation system; The plant management system comprises an instruction receiving module and a liquid preparation module, the instruction receiving module is connected with a control terminal to receive instructions sent by the control terminal, and the liquid preparation module is used for preparing initial liquid according to the instructions in proportion; The first plant management system outlet of the plant management system is connected with the first self-activation system inlet of the self-activation system, and the first self-activation system outlet of the self-activation system is connected with a wafer processing unit; The initial liquid flows into the self-activation system through the first plant management system outlet, the self-activation system is used for generating activated liquid according to the initial liquid, and the activated liquid is liquid containing active ingredients; The activated liquid flows into the wafer processing unit through the first self-activation system outlet, and the wafer processing unit is used for processing wafer products; The silicon wafer wet processing system further comprises a first pipeline, a liquid circulating tank and a liquid storage tank; The first pipeline is connected with the second plant management system outlet of the plant management system and the second self-activation system inlet, the first self-activation system outlet is connected with the first liquid storage tank inlet of the liquid storage tank, and the first liquid storage tank outlet of the liquid storage tank is connected with the first liquid circulating tank inlet of the liquid circulating tank; The second self-activation system outlet of the self-activation system is connected with the fourth liquid circulating tank inlet of the liquid circulating tank; The first plant management system outlet is connected with the second liquid circulating tank inlet of the liquid circulating tank, and the first liquid circulating tank outlet of the liquid circulating tank is connected with the first self-activation system inlet; Nitrogen is contained in the first pipeline, and the nitrogen in the first pipeline is used for discharging the activated liquid in the self-activation system into the liquid storage tank through the first self-activation system outlet.

2. The silicon wafer wet processing system of claim 1, wherein High-doped active silicon balls are placed in the self-activation system, the doping type of the high-doped active silicon balls is P type, and the diameter size of the high-doped active silicon balls comprises 1um-1mm.

3. The silicon wafer wet processing system of claim 2, wherein The self-activation system comprises at least one filter, the filter is arranged on the side of the first self-activation system inlet or the side of the second self-activation system inlet of the self-activation system, and the filter is used for filtering impurities in the initial liquid or the activated liquid.

4. The silicon wafer wet processing system of claim 3, wherein Further comprise: Pump, first check valve, second valve, second check valve, first filter, second filter, third valve; The pump, the first check valve and the second valve are arranged on the pipeline connected with the first liquid circulating tank outlet and the first self-activation system inlet; The second self-activation system outlet is connected with the fourth liquid circulating tank inlet of the liquid circulating tank, and the second check valve, the first filter and the second filter are arranged on the pipeline connected with the second self-activation system outlet and the fourth liquid circulating tank inlet; The first liquid circulating tank outlet is connected with the fourth liquid circulating tank inlet, and the third valve and the second filter are arranged on the pipeline connected with the first liquid circulating tank outlet and the fourth liquid circulating tank inlet.

5. The silicon wafer processing system of claim 4, wherein the at least one of the plurality of process stations is a wet bench station. Further comprise: A detection system, one end of which is connected to the first liquid tank outlet through the pump, and the other end of which is connected to the first self-activation system inlet through the first check valve and the second valve, is used to detect the impurity content in the initial liquid or the activated liquid flowing out of the first liquid tank outlet.

6. The silicon wafer processing system of claim 5, wherein the at least one of the plurality of process stations is a wet bench station. Further comprising: A second pipeline, which is connected to the third factory system outlet of the factory system and the third liquid tank inlet of the liquid tank, and is connected to one end of the wafer processing unit inside the liquid tank; the second pipeline contains nitrogen.

7. The silicon wafer processing system of claim 6, wherein the wafer carrier is a wafer boat. Further comprising: A liquid level sensor and a first valve, which are arranged on the pipeline connecting the first self-activation system outlet and the first liquid tank inlet, and the first valve is arranged between the first self-activation system outlet and the liquid level sensor.

8. A method of wet processing a silicon wafer, characterized by, Applied to the silicon wafer wet processing system of claim 1, comprising: The instruction receiving module receives the instruction sent by the control terminal, and the liquid preparation module prepares the initial liquid according to the instruction in proportion; The initial liquid flows into the self-activation system through the first factory system outlet; The self-activation system generates activated liquid from the initial liquid, and the activated liquid is a liquid containing active ingredients; The activated liquid flows into the wafer processing unit through the first self-activation system outlet; The wafer processing unit processes the wafer product through the activated liquid; The activated liquid is also discharged into the liquid circulation tank and the liquid tank through the second self-activation system outlet and the first self-activation system outlet of the self-activation system respectively, so as to reuse the activated liquid.

9. The method of claim 8, wherein the step of rinsing the silicon wafer is performed by spraying the silicon wafer with a rinse solution. Further comprising: When the concentration of the active ingredient in the activated liquid is lower than the set value, the activated liquid flows out of the liquid circulation tank and flows through the self-activation system again for re-activation, so as to increase the concentration of the active ingredient in the activated liquid.

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