A field microenvironment control system

Abstract

The present invention seeks to protect a field microenvironment control system, which includes a shell, a sealed accommodating chamber is provided in the shell, a rack is arranged in the accommodating chamber, the rack is connected to the shell through a shock absorbing component, and a gas insulation layer is formed between the rack and the shell. A temperature control component is provided on the shell, and the temperature control component is used to adjust the temperature of the gas insulation layer. A power supply system coupled to the temperature control component is also provided on the shell, and the power supply system is used to control the temperature control component. In summary, the above technical scheme has the following beneficial effects: the field microenvironment control system provides an independent microenvironment for the communication node, because the accommodating chamber in the shell is a closed space, so the communication node arranged in the rack is isolated from the outside world, avoiding the influence of dust and environmental humidity; in addition, the rack is arranged in the accommodating chamber through a shock absorbing component, which can play a shock absorbing role in the field, avoiding the communication node from being affected by vibration.

Description

Technical Field

[0001] The present invention relates to the technical field of control systems, and more specifically, to a field combat microenvironment control system. Background Art

[0002] Fixed communication stations need to set up communication nodes, i.e. relay stations, in field environments to support troop operations, exercises and non-war military operations. However, the equipment used are all military-selected civilian equipment. Currently, the environmental adaptability of military-selected civilian equipment is poor. At the beginning of its design, it was based on a fixed machine room environment with temperature and humidity control measures, less dust and less electromagnetic interference conditions. The design temperature range is generally between 0℃ and +50℃, and the ambient humidity is ≤80%. There are no dust and shockproof measures. The equipment failure rate increases in the field environment, affecting the reliability and stability of communications. These problems limit the practical occasions of military-selected civilian equipment and the performance of its performance.

[0003] The large-capacity communication needs of the troops must be met. The advantages of military-selected civilian equipment cannot be replaced in a short period of time. The harsh conditions of the field environment cannot be avoided, and the environmental adaptability of military-selected civilian equipment cannot be improved. Therefore, how to make fixed communication stations operate stably in the field environment is the technical problem to be solved by this application. Summary of the invention

[0004] In view of the shortcomings of the existing technology, a field micro-environment control system is provided, which is used to provide an independent micro-environment for communication nodes to ensure their stable operation.

[0005] In order to achieve the above purpose, the following technical solutions are provided:

[0006] A field microenvironment control system comprises a shell, a sealed accommodating chamber is provided in the shell, a frame is arranged in the accommodating chamber, the frame is connected to the shell through a shock absorbing component, and a gas insulation layer is formed between the frame and the shell.

[0007] The shell is provided with a temperature control component, which is used to adjust the temperature of the gas insulation layer.

[0008] The shell is also provided with a power supply system coupled with the temperature control component, and the power supply system is used to control the temperature control component.

[0009] In summary, the above technical scheme has the following beneficial effects: the field microenvironment control system provides an independent microenvironment for the communication node. Because the accommodating cavity in the shell is a closed space, the communication node arranged in the rack is isolated from the outside world, avoiding the influence of dust and environmental humidity; in addition, the rack is arranged in the accommodating cavity through the shock-absorbing component, which can play a shock-absorbing role in the field to avoid the communication node from being affected by vibration. There is no direct contact between the rack and the shell, thereby forming a gas insulation layer. The gas insulation layer can provide a buffer space for the shock-absorbing component during vibration. In addition, the formation of the gas insulation layer can effectively isolate the external temperature, so that the communication node in the rack is kept within a relatively stable temperature range, thereby improving the reliability and stability of the communication of the communication node; the temperature control component is used to actively adjust the temperature in the accommodating cavity so that the accommodating cavity is within the range of 0°C to +50°C, thereby avoiding the influence of high temperature or low temperature on the communication node. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 A schematic diagram of a shell of a field microenvironment control system;

[0011] Figure 2 It is a schematic diagram of a module diagram of a field microenvironment control system;

[0012] Figure 3 It is a schematic diagram of a voltage stabilization channel of a field microenvironment control system;

[0013] Figure 4 A schematic diagram of the active area and connection area of ​​a field microenvironment control system;

[0014] Figure 5 This is a schematic diagram of an enlarged view of a voltage stabilization channel of a field microenvironment control system.

[0015] Figure numerals: 10, shell; 11, accommodating chamber; 12, gas insulation layer; 13, shielding layer; 14, graphene heating film; 20, frame; 30, shock absorbing component; 40, temperature control component; 50, power supply system; 60, temperature detection component; 70, air convection component; 80, voltage stabilizing channel; 81, piston; 82, active area; 83, connection area; 84, resistor bar; 85, electrical contact. DETAILED DESCRIPTION

[0016] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. The same parts are represented by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the accompanying drawings, and the words "bottom surface" and "top surface", "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0017] like Figure 1 As shown, a field microenvironment control system includes a shell 10, a sealed accommodating chamber 11 is opened in the shell 10, a frame 20 is arranged in the accommodating chamber 11, the frame 20 is connected to the shell 10 through a shock absorbing component 30, and a gas insulation layer 12 is formed between the frame 20 and the shell 10; a temperature control component 40 is arranged on the shell 10, and the temperature control component 40 is used to adjust the temperature of the gas insulation layer 12; the shell 10 is also provided with a power supply system 50 coupled to the temperature control component 40, and the power supply system 50 is used to control the temperature control component 40. The field microenvironment control system provides an independent microenvironment for the communication node. Since the accommodating chamber 11 in the shell 10 is a closed space, the communication node arranged in the rack 20 is isolated from the outside world, avoiding the influence of dust and environmental humidity. In addition, the rack 20 is arranged in the accommodating chamber 11 through the shock-absorbing component 30, which can play a shock-absorbing role in the field to avoid the communication node from being affected by vibration. There is no direct contact between the rack 20 and the shell 10, thereby forming a gas insulation layer 12. The gas insulation layer 12 can provide the shock-absorbing component 30 with a buffer space during vibration. In addition, the formation of the gas insulation layer 12 can effectively isolate the external temperature, so that the communication node in the rack 20 is kept within a relatively stable temperature range, thereby improving the reliability and stability of the communication of the communication node. The temperature control component 40 is used to actively adjust the temperature in the accommodating chamber 11 so that the accommodating chamber 11 is within the range of 0°C to +50°C, thereby avoiding the influence of high temperature or low temperature weather on the communication node.

[0018] The temperature control component 40 is a semiconductor refrigeration device, which is arranged in the housing 10. One side of the semiconductor refrigeration device is located in the accommodating cavity 11, and the other side is located in the external environment. The power system 50 is coupled to the semiconductor refrigeration device to control the heating or cooling of the side of the semiconductor refrigeration device located in the accommodating cavity 11. Temperature is a key factor affecting the performance of equipment under field conditions. Therefore, temperature control is the main function of the field microenvironment control system. Temperature control is divided into two aspects, one is heating in an external low-temperature environment, and the other is cooling in an external high-temperature environment. The present application adopts a semiconductor refrigeration device, which is also called a thermoelectric refrigeration sheet. The two ends of the electric couple absorb heat and release heat respectively. The positive and negative electrodes of the semiconductor refrigeration device can be controlled by the power system 50 to achieve cooling or heating of the side of the semiconductor refrigeration device located in the accommodating cavity 11. The air-cooling heat dissipation method in the closed accommodating cavity 11 cannot work. The semiconductor refrigeration device can effectively solve this problem. The semiconductor refrigeration device has the characteristics of no mechanical rotating parts and separation of the cold end and the hot end, so as to achieve effective heat dissipation and heating in a sealed environment.

[0019] like Figure 2As shown, a temperature detection component 60 coupled to the power system 50 is provided in the housing 10. The temperature detection component 60 is used to detect the temperature in the accommodating chamber 11. The power system 50 operates according to the temperature control component 40 detected by the temperature detection component 60. The temperature detection component 60 is a temperature sensor or other related device that can detect temperature. When the temperature detection component 60 detects that the temperature in the accommodating chamber 11 is lower than the low temperature preset value, the temperature control component 40 is controlled to heat the side of the accommodating chamber 11; when the temperature detection component 60 detects that the temperature in the accommodating chamber 11 is higher than the high temperature preset value, the temperature control component 40 is controlled to cool the side of the accommodating chamber 11. The operating temperature of the communication node is generally between 0°C and

[0020] +50℃ range, so the judgment interval of the temperature detection component 60 can be any interval in the range of 0℃~+50℃, that is, 0<low temperature preset value<high temperature preset value<50. The closer the low temperature preset value and the high temperature preset value are, the more sensitive the temperature control is. Set the corresponding preset value according to the actual environmental conditions. For example, the low temperature preset value is 15 and the high temperature preset value is 35.

[0021] A shielding layer 13 is provided on the inner surface of the housing 10 .

[0022] The shielding layer 13 is a metal mesh. Preferably, the metal mesh is a double-layer metal mesh. The shell 10 is made of engineering plastics to reduce the overall weight and improve the ability to resist falling and shock. The shielding layer 13 is laid on the inner surface of the shell 10 to achieve electromagnetic protection. The method of electromagnetic shielding is to wrap the electronic equipment with a metal material with relatively good conductivity and magnetic permeability, and provide a good grounding wire, and take necessary measures for the seams, holes, openings, etc. on the shell 10 to ensure the continuity of the shielding. For example, in order to prevent electromagnetic energy from entering the shell 10 through the seams of the shell 10, conductive rubber is added to the seams of the shell 10. Devices that are sensitive to electromagnetic radiation or have strong radiation (such as crystal oscillators) can take protective measures by adding a shielding shell to the outside of the device.

[0023] According to relevant theoretical derivation and practical proof, for the flat-plate electromagnetic shielding form, its absorption loss is: Where t is the thickness of the shielding layer, and δ is the skin depth. It can be seen that increasing the thickness of the shielding layer and reducing the skin depth can increase the absorption loss and improve the electromagnetic shielding effect. However, the skin depth is related to the frequency of electromagnetic interference, and the frequency of electromagnetic interference is an uncontrolled random factor. Therefore, the shielding effect can only be improved by increasing the thickness of the shielding layer. Experiments have shown that the use of a pure copper shielding plate at a frequency of 1MHz requires a copper plate thickness of about 0.3mm to achieve a 40dB absorption loss effect. Such a thick copper plate will inevitably increase the weight of the entire machine. The current lightweight electromagnetic shielding solution is to use metal wire mesh as the shielding material. Although its shielding effect is inferior to that of flat materials under the same thickness conditions, a double-layer metal wire mesh can be used to form a shielding cavity, and the spatial reflection loss of the electromagnetic signal in the shielding cavity can be used to improve the shielding effect. When the interference frequency is much lower than the cutoff frequency: (where b is the mesh width), its shielding effectiveness is If the spatial reflection loss of the double-layer shielding layer is utilized, a more ideal shielding effect can be achieved.

[0024] Good grounding can solve both conducted interference and radiated interference, making shielding and filtering measures work better. When designing the ground wire, the corresponding signal ground, noise ground, power ground and shielding ground should be considered comprehensively and laid separately. Electrostatic protection can maintain moderate conductivity on the surface of all structures by adding conductive coating to non-conductive structures, thereby ensuring good electrical bonding of the equipment and forming a good electrostatic discharge path.

[0025] The inner surface of the housing 10 is provided with a graphene heating film 14 coupled to the power supply system 50. The graphene heating film 14 is used for active heating.

[0026] It also includes an air convection component 70, which is arranged at the angle formed by any two surfaces on the inner surface of the shell 10, and controls the circulation of gas along the extension direction of one of the surfaces. The cross-section of the gas insulation layer 12 is annular, and the air convection component 70 is used to control the gas in the gas insulation layer 12 to circulate in one direction, thereby driving the gas at the temperature control component 40 to circulate around the rack 20, so that the cooling or heating of the rack 20 is more uniform. The air convection component 70 is a fan, and the fan is coupled to the power system 50. When the power system 50 controls the temperature control component 40 to work, the fan starts synchronously.

[0027] like Figure 3As shown, a pressure-stabilizing channel 80 is provided on one side of the shell 10. The pressure-stabilizing channel 80 is provided in the vertical direction. One end of the pressure-stabilizing channel 80 is connected to the accommodating chamber 11, and the other end is connected to the outside world. A piston 81 is slidably arranged in the pressure-stabilizing channel 80. Because the accommodating chamber 11 is a closed space, when the temperature of the gas insulation layer 12 changes, the pressure of the accommodating chamber 11 will change. The long-term change of the pressure value will cause the connection of the shell 10 to rupture, affecting the stability of the field microenvironment control system. Preferably, the higher end of the pressure-stabilizing channel 80 is connected to the outside world, and the lower end is connected to the accommodating chamber 11. The piston 81 in the pressure-stabilizing channel 80 can control the volume of the accommodating chamber 11 by moving up and down, thereby ensuring that the pressure of the accommodating chamber 11 remains unchanged. When the temperature of the gas insulation layer 12 increases and causes the gas to expand, the piston 81 moves along the end close to the end connected to the outside world to increase the volume of the gas insulation layer 12, thereby ensuring that the pressure of the gas insulation layer 12 remains unchanged. When the temperature of the gas insulation layer 12 decreases and causes the gas to shrink, the piston 81 moves along the end close to the end connected to the accommodating chamber 11 to reduce the volume of the gas insulation layer 12, thereby ensuring that the pressure of the gas insulation layer 12 remains unchanged.

[0028] like Figure 4 and Figure 5 As shown, the pressure stabilizing channel 80 includes an active area 82 and a connecting area 83, both of which are opened in the vertical direction, the lower end of the active area 82 is connected to the accommodating chamber 11, and the higher end is connected to the higher end of the connecting area 83, the lower end of the connecting area 83 is connected to the outside, and the piston 81 is slidably connected to the active area 82. The setting of the connecting area 83 can prevent external dust or rain from entering the active area 82 and affecting the movement of the piston 81.

[0029] A resistance bar 84 is provided in the active area 82, and the resistance bar 84 extends along the extension direction of the active area 82. An electric contact 85 cooperating with the resistance bar 84 is provided on the piston 81. The resistance bar 84 and the electric contact 85 are respectively connected to the power supply system 50, thereby forming a resistance loop. The power supply system 50 is used to control the temperature change of the temperature control component 40 through the resistance of the resistance loop. The power supply system 50 is preset with a standard resistance. When the temperature of the gas insulation layer 12 increases and causes the gas to expand, the piston 81 moves up to cause the resistance to increase / decrease, and the power supply system 50 controls the temperature control component 40 to cool until the resistance of the resistance loop is equal to the standard resistance; when the temperature of the gas insulation layer 12 decreases and causes the gas to contract, the piston 81 moves down to cause the resistance to decrease / increase, and the power supply system 50 controls the temperature control component 40 to heat until the resistance of the resistance loop is equal to the standard resistance.

[0030] The field micro-environment control system can enable military-selected civilian equipment to adapt to the climate, mechanical physics and electromagnetic environment under field conditions, and achieve the effects of high and low temperature environment control, dustproof, moisture-proof, shockproof and electromagnetic protection. The shell 10 has front and rear openings, and is embedded with a standard 19-inch rack 20. It is connected to the shell through shock-absorbing rubber and shock-absorbing springs, and conductive rubber is used at the joints to enhance the sealing and electromagnetic protection performance. The semiconductor refrigeration device is embedded in the equipment shell 10, and the cold end and the hot end are arranged evenly to achieve the dual functions of cooling and heating under the sealed condition of the shell 10. The temperature control component 40 and the resistor bar 84 are both used to automatically detect internal temperature changes, and can be used in combination or alone to achieve adaptive power control. The temperature control component 40 can also perform multi-point detection of the internal temperature, and start the air convection component 70 in time to improve the internal temperature control progress and temperature uniformity. The power supply system 50 mainly completes the functions of AC / DC conversion, power management, etc., and provides a stable and reliable power supply for the semiconductor refrigeration device, the air convection component 70 and the temperature control component 40.

[0031] The above are only preferred embodiments of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A field microenvironment control system, characterized in that: The invention comprises a shell (10), wherein a sealed accommodating chamber (11) is provided in the shell (10), a frame (20) is arranged in the accommodating chamber (11), the frame (20) is connected to the shell (10) via a shock absorbing component (30), and a gas insulation layer (12) is formed between the frame (20) and the shell (10); The shell (10) is provided with a temperature control component (40), and the temperature control component (40) is used to adjust the temperature of the gas insulation layer (12); The housing (10) is also provided with a power supply system (50) coupled to the temperature control component (40), and the power supply system (50) is used to control the temperature control component (40); A pressure stabilizing channel (80) is provided on one side of the housing (10), the pressure stabilizing channel (80) is provided in a vertical direction, one end of the pressure stabilizing channel (80) is connected to the accommodating chamber (11), and the other end is connected to the outside, and a piston (81) is slidably provided in the pressure stabilizing channel (80); The pressure stabilizing channel (80) comprises an active area (82) and a connecting area (83), the active area (82) and the connecting area (83) are both opened in the vertical direction, the lower end of the active area (82) is connected to the accommodating chamber (11), and the higher end is connected to the higher end of the connecting area (83), the lower end of the connecting area (83) is connected to the outside, and the piston (81) is connected to the active area (82) by sliding; A resistance bar (84) is arranged in the active area (82), and the resistance bar extends along the extension direction of the active area (82). An electric contact (85) cooperating with the resistance bar (84) is arranged on the piston (81). The resistance bar (84) and the electric contact (85) are respectively connected to the power supply system (50), thereby forming a resistance loop. The power supply system (50) is used to control the temperature change of the temperature control component (40) through the resistance of the resistance loop.

2. The field microenvironment control system according to claim 1, characterized in that: The temperature control component (40) is a semiconductor refrigeration device, which is arranged in a housing (10), one side of the semiconductor refrigeration device is located in the accommodating cavity (11), and the other side is located in an external environment. The power supply system (50) is coupled to the semiconductor refrigeration device and is used to control the heating or cooling of the side of the semiconductor refrigeration device located in the accommodating cavity (11).

3. The field microenvironment control system according to claim 1, characterized in that: A temperature detection component (60) coupled to the power supply system (50) is arranged in the housing (10), and the temperature detection component (60) is used to detect the temperature in the accommodating cavity (11). The power supply system (50) operates according to the temperature control component (40) detected by the temperature detection component (60).

4. The field microenvironment control system according to claim 1, characterized in that: The inner surface of the housing (10) is provided with a shielding layer (13).

5. The field microenvironment control system according to claim 4, characterized in that: The shielding layer (13) is a metal mesh.

6. The field microenvironment control system according to claim 1, characterized in that: The inner surface of the housing (10) is provided with a graphene heating film (14) coupled to a power supply system (50).

7. The field microenvironment control system according to claim 1, characterized in that: It also includes an air convection component (70), which is arranged at an angle formed by any two surfaces on the inner surface of the shell (10) and controls the circulation of gas along the extension direction of one of the surfaces.

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