Power supply device and control method thereof

By introducing a temperature sensing unit and a power control chip into the power supply device, the output power is dynamically adjusted to adapt to temperature changes, solving the problems of poor heat dissipation and slow charging speed of small USB charging ports, and improving safety and user experience.

CN115208008BActive Publication Date: 2026-01-13ANKER INNOVATIONS TECH CO LTD
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Patent Information

Application Number
CN202210784417.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-06-28
Publication Date
2026-01-13
Estimated Expiration
2042-06-28

AI Technical Summary

Technical Problem

Conventional small USB charging port sockets suffer from poor heat dissipation, leading to overheating or slow charging speeds, which fails to meet users' safety and fast charging needs.

Method used

By incorporating a temperature measurement unit, a processing unit, and an output unit into the power supply unit, and utilizing a thermistor and a power control chip, the output power is dynamically adjusted to adapt to changes in the casing temperature, ensuring maximum power output within a safe temperature range.

Benefits of technology

This achieves reduced temperature rise of the power supply unit casing while ensuring output efficiency, improving safety and user experience, and avoiding problems such as excessive temperature or slow charging speed.

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Abstract

The application discloses a power supply device and a control method thereof. The power supply device comprises a temperature measuring unit configured to obtain a shell temperature of the power supply device; a processing unit configured to, when a difference between the shell temperature and a preset temperature threshold is within a preset difference range, perform proportional and integral operation on the difference between the shell temperature and the preset temperature threshold to obtain an operation result, and determine a target output power according to the operation result; and an output unit configured to obtain the target output power and adjust a current output power of the output unit to the target output power. According to the power supply device and the control method thereof, the power supply efficiency is optimized, the temperature rise of the shell of the power supply device is reduced, and the user experience is improved.
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Description

Technical Field

[0001] This application relates to the field of electronic equipment, and more specifically to a power supply device and its control method. Background Technology

[0002] Conventional, small-sized sockets with USB charging ports (especially Type-C charging ports), such as power strips, typically have a constant charging power, which presents the following problems:

[0003] 1. Some of the aforementioned sockets have high charging power and poor heat dissipation. As a result, the socket casing temperature is high, posing a certain safety hazard and resulting in a poor user experience.

[0004] 2. For the other part of the above-mentioned sockets, the charging power is relatively small. Although the temperature of the outer shell is not high, the charging speed is slow and it is difficult to meet the user's demand for fast charging.

[0005] Therefore, improvements are needed to address the aforementioned issues. Summary of the Invention

[0006] This application provides a power supply device and its control method, which enables the power supply device to output maximum power at the current casing temperature, ensuring output efficiency while reducing the temperature rise of the power supply device casing.

[0007] According to one aspect of this application, a power supply device is provided, comprising:

[0008] Temperature measuring unit, used to obtain the casing temperature of the power supply device;

[0009] The processing unit is configured to: when the difference between the outer casing temperature and a preset temperature threshold is within a preset difference range, perform proportional and integral calculations on the difference between the outer casing temperature and the preset temperature threshold to obtain a calculation result, and determine a target output power based on the calculation result;

[0010] An output unit is configured to acquire the target output power and adjust the current output power of the output unit to the target output power, wherein when the outer casing temperature is less than the preset temperature threshold, the target output power is greater than the current output power; and when the outer casing temperature is greater than the preset temperature threshold, the target output power is less than the current output power.

[0011] In one embodiment of this application, the processing unit is configured to: when the difference between the outer casing temperature and a preset temperature threshold is within a preset range, perform proportional and integral calculations on the difference between the outer casing temperature and the preset temperature threshold to obtain a calculation result, including:

[0012] Obtain the difference between the current shell temperature and the preset temperature threshold;

[0013] Determine whether the difference is within a preset difference range;

[0014] When the difference is within the preset difference range, the difference is multiplied by a scaling factor to obtain the first output value;

[0015] Obtain the historical cumulative difference between the current outer casing temperature and the preset temperature threshold, as well as the temperature before the current time.

[0016] Multiply the historical cumulative difference by the integration coefficient to obtain the second output value;

[0017] The first output value and the second output value are summed to obtain the calculation result.

[0018] In one embodiment of this application, the processing unit is configured to determine a target output power based on the calculation result, including:

[0019] The target output power is obtained by multiplying the maximum output power of the output unit by the calculation result.

[0020] In one embodiment of this application, the temperature measuring unit includes a thermistor that is in contact with or close to the housing of the power supply device; and / or,

[0021] The processing unit includes a microcontroller; and / or,

[0022] The output unit includes a power control chip and at least one output port. The power control chip is used to adjust the current output power of the at least one output port to the target output power.

[0023] In one embodiment of this application, the thermistor is a negative temperature coefficient thermistor; and / or,

[0024] The power control chip is a USB power transfer protocol chip; and / or,

[0025] The output port is a Type-C port.

[0026] In one embodiment of this application, the power supply device is a socket, the socket includes a housing, the housing is provided with one or more sockets and one or more USB interfaces, and the temperature measuring unit, the processing unit and the output unit are disposed inside the housing.

[0027] According to another aspect of this application, a control method for a power supply device is provided, the power supply device including a temperature measuring unit, a processing unit, and an output unit, the control method comprising the following steps:

[0028] The temperature of the power supply device's casing is obtained through the temperature measuring unit.

[0029] When the difference between the outer casing temperature and a preset temperature threshold is within a preset difference range, the processing unit performs proportional and integral calculations on the difference between the outer casing temperature and the preset temperature threshold to obtain the calculation result, and determines a target output power based on the calculation result.

[0030] The current output power of the output unit of the power supply device is adjusted to the target output power, wherein when the casing temperature is less than the preset temperature threshold, the target output power is greater than the current output power; when the casing temperature is greater than the preset temperature threshold, the target output power is less than the current output power.

[0031] In one embodiment of this application, the step of performing proportional and integral calculations on the difference between the outer casing temperature and a preset temperature threshold by the processing unit to obtain the calculation result includes:

[0032] Obtain the difference between the current shell temperature and the preset temperature threshold;

[0033] Determine whether the difference is within a preset difference range;

[0034] When the difference is within the preset difference range, the difference is multiplied by a scaling factor to obtain the first output value;

[0035] Obtain the historical cumulative difference between the current outer casing temperature and the preset temperature threshold, as well as the temperature before the current time.

[0036] Multiply the historical cumulative difference by the integration coefficient to obtain the second output value;

[0037] The first output value and the second output value are summed to obtain the calculation result.

[0038] In one embodiment of this application, determining a target output power by the processing unit based on the calculation result includes:

[0039] The target output power is obtained by multiplying the maximum output power of the output unit by the calculation result.

[0040] In one embodiment of this application, the temperature measuring unit includes a thermistor that is in contact with or close to the housing of the power supply device; and / or, the processing unit includes a microcontroller; and / or,

[0041] The output unit includes a power control chip and at least one output port. The power control chip is used to adjust the current output power of the at least one output port to the target output power.

[0042] According to the power supply device and control method of this application, the output power of the power supply device can be dynamically adjusted according to the casing temperature of the power supply device, so that the power supply device can output at maximum power under the current casing temperature, ensuring output efficiency, reducing the temperature rise of the casing of the power supply device, avoiding excessive temperature, improving the safety and reliability of the power supply device, and enhancing the user experience. Attached Figure Description

[0043] The following drawings, which are incorporated herein by reference and are used to understand this application, illustrate embodiments of the invention and their descriptions, thereby explaining the apparatus and principles of the invention. In the drawings,

[0044] Figure 1 A schematic structural block diagram of a power supply device according to an embodiment of this application is shown.

[0045] Figure 2 A schematic diagram of the power supply device according to an embodiment of this application is shown;

[0046] Figure 3 A flowchart illustrating a control method for a power supply device according to an embodiment of this application is shown.

[0047] Explanation of reference numerals in the attached figures:

[0048] 10-Power supply unit, 11-Temperature measurement unit, 12-Processing unit, 13-Output unit

[0049] 100 - Socket, 110 - Housing, 111 - Three-prong socket, 112 - Type-C port, 113 - Type-A port, 120 - Power cord. Detailed Implementation

[0050] The following description provides numerous specific details to offer a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described to avoid confusion with this application.

[0051] It should be understood that this application can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of this application to those skilled in the art.

[0052] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0053] To fully understand this invention, detailed structures and steps will be presented in the following description to illustrate the technical solution proposed by this invention. Preferred embodiments of the invention are described in detail below; however, in addition to these detailed descriptions, the invention may have other embodiments.

[0054] To at least partially resolve the aforementioned technical problems, see Appendix Figure 1 According to one aspect of this application, a power supply device 10 is provided. The power supply device 10 includes a temperature measuring unit 11, a processing unit 12, and an output unit 13 connected in sequence.

[0055] The temperature measuring unit 11 is used to acquire the casing temperature of the power supply device 10. In one embodiment of this application, the temperature measuring unit 11 includes a thermistor that is in contact with or close to the casing of the power supply device 10. In some embodiments, the thermistor can be connected to the casing of the power supply device 10 by adhesive bonding or by fasteners, directly contacting the casing. Therefore, changes in the temperature of the casing of the power supply device 10 will cause changes in the resistance of the thermistor, thereby allowing the acquisition of the casing temperature of the power supply device 10. In some embodiments, the thermistor is not in direct contact with the casing of the power supply device 10, but is located very close to the casing of the power supply device 10. In some embodiments, the thermistor is in contact with or close to the casing of the output unit 13. The thermistor can be a positive temperature coefficient (PTC) thermistor or a negative temperature coefficient (NTC) thermistor; preferably, the thermistor is a negative temperature coefficient thermistor. Specifically, in some embodiments, the first terminal of the negative temperature coefficient thermistor is grounded, and the second terminal of the negative temperature coefficient thermistor is connected to the first terminal of a fixed-value resistor whose resistance does not change with temperature. The second terminal of the fixed-value resistor is connected to a power supply voltage. The processing unit 12 samples the voltage of the negative temperature coefficient thermistor every preset time interval, for example, through an AD sampling port. In some embodiments, the processing unit 12 determines the resistance value of the negative temperature coefficient thermistor based on the power supply voltage and the resistance value of the fixed-value resistor, and then determines the temperature corresponding to the resistance value, i.e., the casing temperature of the power supply device 10, by looking up a table. In some embodiments, a lookup table between AD sampling values ​​and temperatures can be directly established and stored in the processing unit 12, so that after the processing unit 12 samples the thermistor voltage, it can directly determine the temperature corresponding to the thermistor, i.e., the casing temperature of the power supply device 10, by looking up the table based on the AD sampling value.

[0056] The processing unit 12 is used to: when the difference between the outer casing temperature and a preset temperature threshold is within a preset difference range, perform proportional and integral calculations on the difference between the outer casing temperature and the preset temperature threshold to obtain a calculation result, and determine a target output power based on the calculation result. In one embodiment of this application, the processing unit 12 includes a microcontroller. A microcontroller is an integrated circuit chip that uses very large-scale integrated circuit technology to integrate a central processing unit (CPU) with data processing capabilities, random access memory (RAM), read-only memory (ROM), various I / O ports and interrupt systems, timers / counters, etc. (and may also include display driver circuits, pulse width modulation circuits, analog multiplexers, A / D converters, etc.) onto a single silicon chip to form a small but complete microcomputer system.

[0057] In some embodiments, the processing unit 12 is configured to perform proportional and integral operations on the difference between the outer casing temperature and a preset temperature threshold when the difference is within a preset difference range, to obtain a calculation result. Specifically, this includes: obtaining the difference between the outer casing temperature and the preset temperature threshold at the current moment; determining whether the difference is within the preset difference range; when the difference is within the preset difference range, multiplying the difference by a proportional coefficient to obtain a first output value; obtaining the historical cumulative difference between the outer casing temperature and the preset temperature threshold at the current moment and before the current moment; multiplying the historical cumulative difference by an integral coefficient to obtain a second output value; and summing the first output value and the second output value to obtain a calculation result. Specifically, in some embodiments, the preset temperature threshold can be 50°C, 60°C, 70°C, or any temperature value or range between the above temperatures. The specific value can be flexibly set by those skilled in the art according to the usage requirements of the power supply device 10 and stored in the processing unit 12. Preferably, the preset temperature threshold can be 70°C. In some embodiments, the preset difference range can be less than or equal to -2℃ and greater than or equal to 2℃. In some embodiments, the preset difference range can be less than or equal to -1℃ and greater than or equal to 1℃. Those skilled in the art can set this range as needed. That is, when the current shell temperature differs significantly from the preset temperature threshold, the temperature difference is proportionally and integrally calculated; when the current shell temperature differs significantly from the preset temperature threshold, the temperature difference is not proportionally and integrally calculated. The proportionality coefficient and integral coefficient are determined based on the preset temperature threshold. Different preset temperature thresholds correspond to different proportionality coefficients and integral coefficients, and their specific values ​​can be determined through a large number of experiments. Whenever the processing unit 12 obtains the shell temperature of the power supply device 10, the processing unit 12 calculates the difference between the shell temperature and the preset temperature threshold and stores the difference. In some embodiments, the historical cumulative difference can be the sum of all differences (differences between the shell temperature and the preset temperature threshold) stored by the processing unit 12 at the current time and before the current time. In some embodiments, the historical cumulative difference can be the sum of all differences (differences between the casing temperature and a preset temperature threshold) stored by the processing unit 12 within the current time and a preset time period (e.g., 1 hour, 1 day, etc.) prior to the current time. In some embodiments, the historical cumulative difference can be the sum of a preset number of differences (differences between the casing temperature and a preset temperature threshold) stored by the processing unit 12 within the current time and prior to the current time.

[0058] In some embodiments, the processing unit 12 determines an output power based on the calculation result, including multiplying the maximum output power of the output unit 13 by the calculation result to obtain a target output power. In some embodiments, the maximum output power refers to the maximum power that the power supply device 10 (or output unit 13, output port) hardware can withstand. In some embodiments, the maximum output power refers to the rated output power of the power supply device 10 (or output unit 13, output port). In some embodiments, the value of the maximum output power is stored in the processing unit 12. The calculation result is a percentage value, and multiplying the maximum output power of the output unit 13 by this percentage value yields the target output power.

[0059] Output unit 13 is used to acquire a target output power and adjust the current output power of output unit 13 to the target output power. When the casing temperature is lower than a preset temperature threshold, the target output power is greater than the current output power; when the casing temperature is greater than the preset temperature threshold, the target output power is less than the current output power. In one embodiment of this application, output unit 13 includes a power control chip and at least one output port connected thereto. The power control chip is connected to processing unit 12 to acquire the target output power and adjust the current output power of at least one output port to the target output power. Specifically, when the casing temperature is lower than the preset temperature threshold, the current output power is continuously increased to improve output efficiency; when the casing temperature is greater than the preset temperature threshold, the current output power is decreased to avoid excessive casing temperature. In some embodiments, the power control chip is a USB Power Delivery (PD) protocol chip, and the output port is a USB Type-C port. In some embodiments, the power control chip is a Quick Charge (QC) protocol chip. In some embodiments, the output port is a USB Type-A port and / or a Micro-B port. Since the temperature at the output port is usually high, in some embodiments, the thermistor is in contact with or close to the housing at the output port of the power supply device 10, so that the temperature of the housing at the output port can be stabilized at a preset temperature threshold. Then the temperature of other areas of the housing will generally be lower than the temperature at the output port. Therefore, the overall temperature of the housing can be controlled at a suitable temperature, thereby avoiding the problem of excessive housing temperature.

[0060] The target output power determined by proportional and integral calculations is the current maximum output power based on the current casing temperature of the power supply device 10. Using this target output power for output ensures output efficiency and avoids safety risks caused by excessively rapid casing temperature rise. By repeatedly acquiring the casing temperature of the power supply device 10 and adjusting the current output power of the output unit 13 to the corresponding target output power, the casing can gradually heat up to a preset temperature threshold at a relatively reasonable rate (initially with a higher output power, then gradually decreasing), and stabilize at the preset temperature threshold. This stabilization can include fluctuations within a range less than a predetermined temperature (e.g., the predetermined temperature could be 0.5°, 1°, 1.5°, or 2°), and the output power remains stable during this period. Therefore, the technical solution of this application effectively avoids the problem of excessively high casing temperature caused by the conventional power supply device 10 always outputting at a high power, and also avoids the problem of low charging power due to temperature control requirements, resulting in slow charging speeds and difficulty in meeting users' needs for fast charging.

[0061] Appendix Figure 2 A schematic diagram of a power supply device 10 according to an embodiment of this application is shown, wherein the power supply device 10 is a socket 100. As known to those skilled in the art, a socket refers to a device having sockets for inserting electrical cables to connect to a power line. Common sockets include standard three-prong sockets, standard two-prong sockets, USB interfaces, etc., and the USB interface may include one or more of Type-C ports, Type-A ports, and Micro-B ports. In this embodiment, the socket 100 includes a housing 110, within which are disposed the temperature measuring unit 11 (not shown in the figure), processing unit 12 (not shown in the figure), and output unit 13 (not fully shown in the figure) as described above. The output unit 13 includes a power control chip (not shown in the figure), two three-prong sockets 111 located on the upper side of the socket 100, two Type-C ports 112 and two Type-A ports 113 located on the left side of the socket 100. A power cord 120 is disposed on the right side of the socket 100, and a plug is disposed at the end of the power cord 120 away from the housing 110. Figure 2 (Not shown in the image). The processing unit 12 receives power through the power line 120 and adjusts the output power of one or more of the Type-C port 112 and Type-A port 113 through a power control chip. In this embodiment, the temperature measuring unit 11 includes a housing 110 on the side where the Type-C port 112 and Type-A port 113 of the power supply device 10 are located (i.e., Figure 2The processing unit 12 obtains the temperature of the housing 110 by contacting or approaching the thermistor on the left side wall of the housing 110. In this embodiment, the socket 100 is a portable socket, that is, it can be moved from one place to another before or during use. For example, the socket 100 according to this application can be a commonly known power strip. In some other embodiments, the power supply device 10 can also be a fixed socket, such as a socket fixed to a wall. In some other embodiments, the power supply device 10 can also be a charger for a mobile terminal (e.g., a smartphone, tablet, etc.).

[0062] See appendix Figure 3 According to another aspect of this application, a control method for the power supply device 10 as described above is provided, comprising the following steps:

[0063] S100: The temperature of the casing of the power supply device 10 is obtained through the temperature measuring unit 11.

[0064] In step S100, the processing unit 12 acquires the casing temperature of the power supply device 10 through the temperature measuring unit 11. Specifically, in one embodiment, the temperature measuring unit 11 includes a thermistor that is in contact with or close to the casing of the power supply device 10. The thermistor is preferably a negative temperature coefficient (NTC) thermistor. The processing unit 12 acquires the voltage at the thermistor and determines the casing temperature of the power supply device 10 accordingly. In some embodiments, the processing unit 12 calculates the resistance value of the thermistor based on the acquired voltage and determines the casing temperature of the power supply device 10 by looking up a table based on the resistance value of the thermistor. In some embodiments, the processing unit 12 acquires the voltage of the thermistor through its AD sampling port and directly determines the casing temperature of the power supply device 10 according to a pre-stored lookup table of AD sampling values ​​and temperatures.

[0065] S200: When the difference between the outer casing temperature and a preset temperature threshold is within a preset difference range, the processing unit 12 performs proportional and integral calculations on the difference between the outer casing temperature and the preset temperature threshold to obtain the calculation result, and determines a target output power based on the calculation result.

[0066] In step S200, the processing unit 12 performs proportional and integral calculations on the difference between the outer casing temperature and a preset temperature threshold to obtain the calculation results, including:

[0067] S210: Obtain the difference between the current shell temperature and the preset temperature threshold;

[0068] S220: Determine whether the difference is within a preset difference range. In some embodiments, the preset difference range can be less than or equal to -2℃ and greater than or equal to 2℃. In some embodiments, the preset difference range can be less than or equal to -1℃ and greater than or equal to 1℃. Those skilled in the art can set the range as needed.

[0069] S230: When the difference is within the preset difference range, multiply the difference by the scaling factor to obtain the first output value;

[0070] S240: Obtain the historical cumulative difference between the current temperature and the preset temperature threshold at the current time and before the current time;

[0071] S250: Multiply the historical cumulative difference by the integral coefficient to obtain the second output value;

[0072] S260: Sum the first output value and the second output value to obtain the calculation result.

[0073] It should be noted that in some embodiments, the above steps S210-S260 may not be strictly performed in the order of S210-S260. For example, steps S210 and S220 may be performed first, and when the difference is within the preset difference range, steps S240 and S250 may be performed, then step S230 may be performed, and finally step S260 may be performed.

[0074] In some embodiments, a preset temperature threshold is stored in the processing unit 12, and its value is fixed and cannot be adjusted. In some embodiments, step S100' is included before step S100: setting the preset temperature threshold. In some embodiments, S100' specifically includes: connecting a smart terminal for setting the preset temperature threshold to the processing unit 12 via the output unit 13, and setting the preset temperature threshold stored in the processing unit 12.

[0075] In step S200, the processing unit 12 determines a target output power based on the calculation result, including:

[0076] S260: Multiply the maximum output power of output unit 13 by the calculation result to obtain the target output power.

[0077] S300: Adjust the current output power of the output unit 13 of the power supply device 10 to the target output power, wherein when the casing temperature is less than a preset temperature threshold, the target output power is greater than the current output power; when the casing temperature is greater than the preset temperature threshold, the target output power is less than the current output power.

[0078] Specifically, in some embodiments, the output unit 13 includes a power control chip (e.g., a USB Power Delivery (PD) protocol chip and / or a Quick Charge (QC) protocol chip) and at least one output port (e.g., a USB Type-C port, a USB Type-A port, and / or a Micro-B port). In step S300, the power control chip obtains the target output power from the processing unit 12 and adjusts the current output power of at least one output port to the target output power. Specifically, when the casing temperature is lower than a preset temperature threshold, the current output power is continuously increased to improve output efficiency; when the casing temperature is higher than the preset temperature threshold, the current output power is decreased to avoid excessive casing temperature.

[0079] After step S300 is completed, steps S100-S300 are repeated, and so on. Eventually, the casing temperature of the power supply device 10 will stabilize at the preset temperature threshold, and the current output power of the output unit 13 will also stabilize accordingly.

[0080] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of this application. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of this application. All such changes and modifications are intended to be included within the scope of this application as claimed in the appended claims.

[0081] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0082] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not executed.

[0083] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0084] Similarly, it should be understood that, in order to streamline this application and aid in understanding one or more of the various inventive aspects, features of this application may sometimes be grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of this application. However, this approach should not be construed as reflecting an intention that the claimed application requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, its inventive point lies in solving the corresponding technical problem with features fewer than all features of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of this application.

[0085] Those skilled in the art will understand that, apart from the mutual exclusion of features, all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or elements of any method or apparatus so disclosed can be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature serving the same, equivalent, or similar purpose.

[0086] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0087] It should be noted that the above embodiments are illustrative of this application and not limiting of it, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. This application can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

Claims

1. A power supply device characterized by comprising: The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof.

2. The power supply device according to claim 1, characterized by The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof. The application relates to a power supply device and a control method thereof.

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The application relates to determining, by the processing unit, a target output power of the output unit of the power supply device according to the operation result, when the difference between the shell temperature and the preset temperature threshold is within a preset difference range, performing proportional and integral operation on the difference between the shell temperature and the preset temperature threshold to obtain an operation result, and determining a target output power according to the operation result; adjusting the current output power of the output unit of the power supply device to the target output power, wherein when the shell temperature is less than the preset temperature threshold, the target output power is greater than the current output power; when the shell temperature is greater than the preset temperature threshold, the target output power is less than the current output power; wherein the target output power determined by the processing unit according to the operation result comprises: multiplying the maximum output power of the output unit by the operation result to obtain the target output power.

7. The control method of claim 6, wherein the proportional and integral operation performed by the processing unit on the difference between the shell temperature and the preset temperature threshold to obtain an operation result comprises: obtaining the difference between the shell temperature at the current time and the preset temperature threshold; determining whether the difference is within a preset difference range; when the difference is within the preset difference range, multiplying the difference by a proportional coefficient to obtain a first output value; obtaining the historical cumulative difference between the shell temperature and the preset temperature threshold before the current time and at the current time; multiplying the historical cumulative difference by an integral coefficient to obtain a second output value; summing the first output value and the second output value to obtain the operation result.

8. The control method of claim 6, wherein the temperature measuring unit comprises a thermistor in contact with or close to the shell of the power supply device; and / or, the processing unit comprises a single-chip microcomputer; and / or, the output unit comprises a power control chip and at least one output port, and the power control chip is configured to adjust the current output power of the at least one output port to the target output power. ​ ​ ​

Citation Information

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