Heat sink installation jig and production equipment for flip chip packaging

Abstract

The present application discloses a heat sink installation jig and production equipment for flip chip film packaging, including a base, a pressure plate installed on the base, and the pressure plate is provided with a groove for accommodating a predetermined chip. With the heat sink installation jig and production equipment of the present application, after the predetermined chip is aligned with the groove, the heat sink is placed on the surface of the predetermined chip by taking the label head, and then rolling is performed, so that the predetermined chip can be at least partially accommodated in the groove downward, thereby reducing the height difference, improving the attachment yield, and better meeting the production needs.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and in particular to a heat dissipation paste installation fixture and production equipment for flip chip film packaging. Background Art

[0002] In order to improve the heat dissipation performance of chip on film (COF) products, a heat sink is usually attached to the surface of the chip. Specifically, the heat sink can be grabbed, aligned and placed on the chip surface by a predetermined labeling head, and then the heat sink is attached to the chip surface by rolling.

[0003] In actual operation, the heat sink needs to completely cover the surface of the chip and ensure that the two are in contact to achieve better heat dissipation performance. However, due to the certain height of the chip and the poor ductility of the heat sink commonly used in the industry at this stage, it often has abnormalities such as local bulges or wrinkles after rolling (such as Figure 1 The heat dissipation performance and appearance of the product will be affected.

[0004] In view of this, it is necessary to provide a new heat sink installation fixture and production equipment for flip chip film packaging. Summary of the invention

[0005] The purpose of the present invention is to provide a heat sink installation jig and production equipment for chip-on-film packaging, which can better meet the production of chip-on-film packaging products, improve the attachment effect of the heat sink, and increase the product yield.

[0006] The present invention provides a heat sink installation jig for a heat sink machine, comprising a base and a pressure plate installed on the base, wherein the pressure plate is provided with a groove for accommodating a predetermined chip.

[0007] As a further improvement of the present invention, the groove is set up to penetrate vertically; the heat sink installation fixture also includes a support seat arranged between the base and the pressure plate, and the support seat has a substrate and a support platform protruding upward from the substrate into the groove.

[0008] As a further improvement of the present invention, a first receiving cavity is formed between the pressure plate and the base, the substrate is accommodated in the first receiving cavity, and at least a portion of the lower surface of the pressure plate is in contact with the base.

[0009] As a further improvement of the present invention, the heat sink mounting fixture also includes a light source arranged on the side of the substrate away from the support platform; at least a portion of the support seat is light-transmissive so that the light emitted by the light source can pass through the groove to irradiate above the pressure plate.

[0010] As a further improvement of the present invention, the light source includes a circuit board, a light-emitting element mounted on the circuit board, and a power cord; a second accommodating cavity is formed between the substrate and the base, the second accommodating cavity includes a accommodating portion and a lead-out portion connected to the accommodating portion, the circuit board and the light-emitting element are arranged in the accommodating portion, and the power cord extends outward from the lead-out portion.

[0011] As a further improvement of the present invention, the base includes a bottom plate and a positioning step protruding upward from the bottom plate, the pressure plate abuts against the positioning step, and the positioning step does not extend upward beyond the upper surface of the pressure plate.

[0012] As a further improvement of the present invention, the pressure plate is also provided with a plurality of vacuum holes and a vacuum channel connected to the vacuum holes, and the plurality of vacuum holes are arranged at intervals along the circumference of the groove; the base is provided with a vacuum opening that passes through from top to bottom and is connected to the vacuum channel.

[0013] As a further improvement of the present invention, an initial alignment mark is provided on the upper surface of the pressure plate, and the initial alignment mark is arranged adjacent to the edge of the pressure plate.

[0014] The present invention also provides a production device for flip chip packaging, comprising the heat sink installation fixture and a label removal head as described above, wherein the label removal head is used to absorb the heat sink adapted to a given chip.

[0015] As a further improvement of the present invention, the label taking head has a vacuum adsorption surface, and the vacuum adsorption surface is provided with a groove adapted to a predetermined chip, so that when the label taking head absorbs the heat dissipation sticker, the heat dissipation sticker forms a corresponding recessed portion.

[0016] The beneficial effects of the present invention are as follows: by using the heat sink installation jig and production equipment of the present application, after a predetermined chip is aligned with the groove, the heat sink is placed on the surface of the predetermined chip by taking a label head and then rolling it. The predetermined chip can be at least partially accommodated downward in the groove, thereby reducing the height difference from the back of the predetermined chip to the surface of the corresponding tape, effectively overcoming the resulting bulge or wrinkle abnormalities, improving the attachment yield, and better meeting on-site production needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a diagram showing abnormal attachment of heat dissipation patch in the prior art related to this application;

[0018] Figure 2 It is a schematic diagram of the attachment process of the heat dissipation paste;

[0019] Figure 3 This is a schematic diagram of the overall structure of the heat dissipation paste installation fixture of the present application;

[0020] Figure 4yes Figure 3 Schematic diagram of the exploded structure of the heat sink installation fixture;

[0021] Figure 5 It is a schematic diagram of the structure of the pressure plate in the heat sink installation fixture of the present application;

[0022] Figure 6 This is a schematic diagram of the structure of the support seat in the heat sink installation fixture of this application.

[0023] Figure 7 It is a top view of the heat dissipation paste installation fixture of the present application;

[0024] Figure 8 yes Figure 7 Cross-sectional view of the heat sink installation fixture along the AA direction;

[0025] Fig. 9 This is a schematic diagram of the working state of another embodiment of the heat dissipation paste installation fixture of the present application;

[0026] Fig.10 It is a structural schematic diagram of a label removal head of a production device for flip chip thin film packaging in the present application.

[0027] 100-heat sink installation fixture; 10-base; 11-bottom plate; 111-installation hole; 112-first part; 113-vacuum opening; 12-positioning step; 13-slot; 20-pressure plate; 21-groove; 210-initial alignment mark; 22-fixing hole; 23-first receiving cavity; 24-notch; 25-vacuum hole; 26-vacuum channel; 261-horizontal channel; 262-vertical channel; 30-support Support; 31-substrate; 311-second part; 312-lead-out part; 32-support platform; 40-light source; 41-circuit board; 42-light-emitting element; 43-power line; 50-fixing bolt; 60-sealing ring; 70-plug; 200-labeling head; 201-vacuum adsorption surface; 202-grooving; 203-vacuum hole; 101-predetermined chip; 102-reel; 103-heat dissipation paste; 104-roller. DETAILED DESCRIPTION

[0028] The present invention will be described in detail below in conjunction with the embodiments shown in the accompanying drawings. However, the embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on the embodiments are all within the protection scope of the present invention.

[0029] Ginseng Figure 2 As shown, in the conventional flip chip packaging production process, a predetermined chip 101 is fixed on a reel 102 , and after a heat sink 103 is placed on the surface of the predetermined chip 101 , the heat sink 103 is rolled by a roller 104 to complete the attachment of the heat sink.

[0030] In order to improve the attachment yield of the heat dissipation sticker 103 on the surface of a given chip 101 and the heat dissipation performance of the product, Figure 3 As shown, the present invention provides a heat sink installation fixture 100, comprising a base 10, a pressure plate 20 installed on the base 10, and the pressure plate 20 is provided with a groove 21 for accommodating a predetermined chip 101. Through the above design, the predetermined chip 101 can at least partially fall into the groove 21 during the rolling process, reducing the height difference during the attachment process of the heat sink 103 and improving the attachment performance; the design size of the groove 21 also needs to consider the positioning error and the influence of the tape 102, as long as it can accommodate the predetermined chip 101.

[0031] Combination Figures 4 to 8 As shown, the base 10 includes a bottom plate 11 and a positioning step 12 formed by protruding upward from the bottom plate 11. The bottom plate 11 is arranged in a rectangular shape in the horizontal direction, and has a long side extending along a first direction (X direction) and a short side extending along a second direction (Y direction) perpendicular to the first direction; the positioning step 12 extends along the first direction and is arranged adjacent to one of the long sides of the bottom plate; a slot 13 extending along the second direction is also formed at the middle position of the bottom of the base 10. The pressure plate 20 is also arranged in a rectangular shape in the horizontal direction, and the long side of the pressure plate 20 also extends along the first direction, and the lengths of the long sides of the pressure plate 20 and the long sides of the bottom plate 11 are preferably arranged to be consistent. The pressure plate 20 abuts against the positioning step 12 in the second direction. When the pressure plate 20 is installed, the positioning step 12 is conducive to positioning and stabilizing the pressure plate 20. The positioning step 12 does not extend upward beyond the upper surface of the pressure plate 20 , that is, the height of the positioning step 12 is less than or equal to the thickness of the pressure plate 20 , so as to avoid affecting the rolling attachment of the heat dissipation sticker 103 .

[0032] The groove 21 is arranged to penetrate from top to bottom; the heat sink mounting fixture 100 also includes a support seat 30 arranged between the base 10 and the pressure plate 20. The support seat 30 has a substrate 31 and a support platform 32 protruding upward from the substrate 31 into the groove 21. It is easy to understand that the support platform 32 is used to support the predetermined chip 101, and the height difference between the top of the support platform 32 and the upper surface of the pressure plate 20 is less than the thickness of the predetermined chip 101, so that the predetermined chip 101 can be directly pressurized to ensure the adhesion effect of the heat sink 103 and the surface of the predetermined chip 101 away from the tape 102.

[0033] The heat sink mounting fixture 100 further includes a light source 40 disposed on the side of the substrate 31 away from the support platform 32; at least a portion of the support seat 30 is light-transmissive, so that the light emitted by the light source 40 can be irradiated to the top of the pressure plate 20 through the groove 21. The support seat 30 is generally designed as an integrated molding, preferably made of transparent material, to achieve a similar function as a light guide plate; the light emitted by the light source 40 can pass through the support seat 30 upward and be emitted outward from the groove 21, thereby facilitating the positioning operation and ensuring the alignment accuracy.

[0034] It should be noted that the aforementioned “horizontal”, “up and down” and “height” are all for the purpose of more clearly describing the key points of the present application scheme, and are based on the description of the heat sink mounting fixture 100 placed on a horizontal surface and combined with the accompanying drawings, and are not limitations on the structural design and application of the present application.

[0035] In this embodiment, the bottom plate 11 is provided with a plurality of mounting holes 111 penetrating from top to bottom; the pressure plate 20 is correspondingly provided with fixing holes 22, and the fixing holes 22 are configured as blind holes, that is, the fixing holes 22 do not penetrate the upper surface of the pressure plate 20, so as to maintain the integrity of the upper surface of the pressure plate 20. The heat sink mounting fixture 100 also includes fixing bolts 50, which pass through the mounting holes 111 from bottom to top and cooperate with the fixing holes 22 to achieve mutual fixation between the pressure plate 20 and the base 10.

[0036] A first receiving cavity 23 is formed between the pressure plate 20 and the base 10, the substrate 31 is received in the first receiving cavity 23, and at least a portion of the lower surface of the pressure plate 20 abuts against the base 10. The lower surface of the pressure plate 20 is in contact with the bottom plate 11, which can also prevent the light emitted by the light source 40 from being emitted from the side.

[0037] Here, the light source 40 includes a circuit board 41, a light-emitting element 42 and a power line 43 mounted on the circuit board 41; a second receiving cavity is formed between the substrate 31 and the bottom plate 11 of the base 10, and the second receiving cavity includes a receiving portion, and the circuit board 41 and the light-emitting element 42 are arranged in the receiving portion. Specifically, the upper surface of the bottom plate 11 is recessed to form a first portion 112, and the lower surface of the substrate 31 is formed with a second portion 311, and the first portion 112 and the second portion 311 together constitute the receiving portion. The recess depth of the first portion 112 can be adapted to the thickness of the circuit board 41, and the first portion 112 can also realize the placement and positioning of the circuit board 41. The corners of the first portion 112 are also formed with protrusions outwardly to facilitate the placement and removal of the circuit board 41. The second receiving cavity also includes a lead-out portion 312 formed on the lower surface of the substrate 31 and connected to the receiving portion, and the power line 43 extends outward from the lead-out portion 312. Correspondingly, the pressure plate 20 is further formed with a notch 24 corresponding to the position of the lead-out portion 312 so that the power line 43 can be connected to an external power supply terminal.

[0038] The pressure plate 20 is also provided with a plurality of vacuum holes 25 and vacuum channels 26 connected to the vacuum holes 25. The plurality of vacuum holes 25 are arranged at intervals along the circumference of the groove 21 to ensure that the tape 102 is attached to the upper surface of the pressure plate 20. The bottom plate 11 of the base 10 is provided with a vacuum opening 113 that passes through from top to bottom and is connected to the vacuum channel 26; the heat sink mounting fixture 100 also includes a sealing ring 60 provided between the vacuum channel 26 and the vacuum opening 113 to ensure the airtightness of the connection between the two.

[0039] For example, the vacuum holes 25 are arranged in two rows and are respectively located on both sides of the groove 21, and the vacuum holes 25 in the same row are evenly spaced along the first direction. The vacuum channel 26 includes a horizontal channel 261 and a vertical channel 262, and the horizontal channel 261 and the vertical channel 262 are respectively arranged in two rows, and the two rows of vacuum holes 25 are respectively connected to the two horizontal channels 261; for the convenience of processing, one end of the horizontal channel 261 is open and then blocked by a corresponding plug 70.

[0040] Ginseng Fig. 9As shown, optionally, an initial alignment mark 210 is provided on the upper surface of the pressure plate 20, and the initial alignment mark 210 is arranged adjacent to the edge of the pressure plate 20. Since the position of the groove 21 is not easily observed due to the coloring of the tape 102 itself, the initial alignment mark 210 can more conveniently achieve the preliminary alignment of the given chip 101. Here, the given chip 101 and the tape 102 are transported along the second direction, i.e., the short side direction of the pressure plate 20, the width of the tape 102 is less than the length of the pressure plate 20, and the initial alignment mark 210 is arranged in two and respectively adjacent to the two short sides of the pressure plate 20.

[0041] The present invention further provides a production device for flip chip packaging, comprising the heat sink mounting fixture 100 and the label removal head 200 as described above, wherein the label removal head 200 is used to absorb the heat sink 103 adapted to the predetermined chip 101 .

[0042] The labeling head 200 has a vacuum adsorption surface 201, and the vacuum adsorption surface 201 is provided with a groove 202 adapted to the predetermined chip 101. The vacuum adsorption surface 201 and the groove 202 are both provided with vacuum holes 203, so that when the labeling head 200 absorbs the heat dissipation sticker 103, the heat dissipation sticker 103 forms a corresponding concave portion. After the heat dissipation sticker 103 with the above-mentioned concave portion is aligned and placed on the surface of the predetermined chip 101, it can also further avoid possible bulges or wrinkles during the rolling process.

[0043] In summary, the heat sink mounting jig 100 and production equipment of the present application can effectively reduce the height difference between the back surface of a given chip 101 and the surface of the corresponding tape 102 during the rolling process, and can also achieve better alignment, reduce or even avoid abnormal bulges or wrinkles, improve the attachment yield, and better meet on-site production needs.

[0044] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0045] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat sink mounting fixture for flip chip packaging, used to attach the heat sink to a predetermined chip, characterized by: It includes a base and a pressure plate installed on the base, the pressure plate is provided with a groove for accommodating a predetermined chip, the upper surface of the pressure plate is used to fit with the tape, and the predetermined chip is fixed on the tape; the groove is set up through the top and bottom; the pressure plate is also provided with a plurality of vacuum holes and vacuum channels connected to the vacuum holes, and the plurality of vacuum holes are arranged at intervals along the circumference of the groove; the base is provided with a vacuum opening that passes through the top and bottom and is connected to the vacuum channel; the heat sink installation fixture also includes a support seat arranged between the base and the pressure plate, the support seat has a substrate, and a support platform protruding upward from the substrate into the groove; the height difference between the top of the support platform and the upper surface of the pressure plate is less than the thickness of the predetermined chip.

2. The heat sink installation fixture according to claim 1, characterized in that: A first receiving cavity is formed between the pressure-bearing plate and the base, the substrate is accommodated in the first receiving cavity, and at least a portion of the lower surface of the pressure-bearing plate is in contact with the base.

3. The heat sink installation fixture according to claim 1, characterized in that: The heat sink installation fixture also includes a light source arranged on the side of the substrate away from the support platform; at least a portion of the support seat is light-transmissive so that the light emitted by the light source can pass through the groove and irradiate above the pressure plate.

4. The heat dissipation sticker installation fixture according to claim 3, characterized in that: The light source includes a circuit board, a light-emitting element mounted on the circuit board, and a power line; a second receiving cavity is formed between the substrate and the base, the second receiving cavity includes a receiving portion and a lead-out portion connected to the receiving portion, the circuit board and the light-emitting element are arranged in the receiving portion, and the power line extends outward from the lead-out portion.

5. The heat dissipation sticker installation fixture according to claim 1, characterized in that: The base includes a bottom plate and a positioning step protruding upward from the bottom plate, the pressure plate abuts against the positioning step, and the positioning step does not exceed the upper surface of the pressure plate upward.

6. The heat sink installation fixture according to claim 1, characterized in that: An initial alignment mark is provided on the upper surface of the pressure plate, and the initial alignment mark is arranged adjacent to the edge of the pressure plate.

7. A production equipment for flip chip packaging, characterized in that: It comprises the heat sink installation jig and the label removal head as described in any one of claims 1 to 6, wherein the label removal head is used to absorb the heat sink adapted to a given chip.

8. The production equipment according to claim 7, characterized in that: The label taking head has a vacuum adsorption surface, and the vacuum adsorption surface is provided with a groove adapted to a predetermined chip, so that when the label taking head absorbs the heat dissipation sticker, the heat dissipation sticker forms a corresponding concave portion.

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