Display panel and display device

Abstract

The present invention discloses a display panel and a display device, wherein the display panel comprises: a substrate, wherein the substrate has a display area and a non-display area, wherein the non-display area is arranged around the display area; the non-display area comprises a binding area located on one side of the display area and a retaining ring layer surrounding the display area, wherein the binding area comprises a plurality of conductive touch pads, and the distance between the retaining ring layer and the binding area is greater than the distance between two adjacent conductive touch pads among the plurality of conductive touch pads. By providing the retaining ring layer, the strength of the substrate can be enhanced, cracks generated when the substrate is cut can be prevented from extending into the interior of the substrate, and the electrical reliability and trust level of the silicon-based OLED can be improved. By making the distance between the retaining ring layer and the binding area greater than the distance between two adjacent conductive touch pads among the plurality of conductive touch pads, a short circuit caused by the overlap of the residual metal particles generated by the cutting of the silicon substrate on the adhesive backing area with the gold finger of the circuit board can be avoided, thereby improving the reliability of the panel.

Description

Technical Field

[0001] The present invention belongs to the field of display technology, and in particular relates to a display panel and a display device. Background Art

[0002] Silicon-based organic light-emitting diodes (OLEDs) are small in size. After the entire silicon wafer has been processed through the OLED process and the packaging process, it needs to be cut into individual silicon substrates. During cutting, cracks will appear on the edge of the silicon substrate, and the vibration during the cutting and subsequent welding process will cause these cracks to extend into the silicon substrate, seriously damaging the electrical reliability and trust level of the silicon-based OLED. The overlap between the gold fingers of the circuit board and the metal particles left by the cutting of the silicon substrate in the adhesive backing area is prone to short circuits. Summary of the invention

[0003] The purpose of the embodiments of the present invention is to provide a display panel and a display device to solve the problem that the gold fingers of the circuit board and the metal particles left over from the cutting of the silicon substrate in the adhesive backing area are easily overlapped to cause short circuits.

[0004] In a first aspect, an embodiment of the present invention provides a display panel, including:

[0005] A substrate, the substrate having a display area and a non-display area, wherein the non-display area is arranged around the display area;

[0006] The non-display area includes a binding area located on one side of the display area and a retaining ring layer surrounding the display area, the binding area includes a plurality of conductive touch pads, and the distance between the retaining ring layer and the binding area is greater than the distance between two adjacent conductive touch pads among the plurality of conductive touch pads.

[0007] Wherein, the distance between the retaining ring layer and the binding area is greater than the distance between the retaining ring layer and the edge of the substrate.

[0008] Wherein, the distance between the retaining ring layer and the binding area is greater than the sum of the width of one conductive contact pad among the plurality of conductive contact pads and the width of an adjacent conductive contact pad.

[0009] Wherein, the width of the retaining ring layer is smaller than the width of the binding area.

[0010] Wherein, the retaining ring layer is a conductive material; and / or

[0011] The spacing distance between the binding area and the retaining ring layer is greater than or equal to 15 μm.

[0012] The display panel further includes:

[0013] A connecting portion, wherein conductive glue is provided between the connecting portion and the conductive contact pad.

[0014] Wherein, the conductive adhesive is an anisotropic conductive adhesive film, and the conductive adhesive conducts the conductive contact pad and the connecting portion in the direction from the conductive contact pad to the connecting portion; and / or

[0015] The conductive adhesive and the retaining ring layer are spaced apart; and / or

[0016] The connecting portion is provided with an encapsulation layer; and / or

[0017] The orthographic projection of the conductive contact pad on the substrate is located within the orthographic projection of the connecting portion on the substrate.

[0018] Wherein, a sealing layer is provided between the connecting portion and the substrate, and the edge of the sealing layer extends to the conductive adhesive.

[0019] Part of the connecting portion extends out of the substrate, an edge of the substrate is provided with adhesive, and the sealing layer extends between the adhesive and the portion of the connecting portion extending out of the substrate.

[0020] In a second aspect, an embodiment of the present invention provides a display device, including:

[0021] The display panel described in the above embodiments.

[0022] In the display panel of the embodiment of the present invention, the non-display area includes a binding area located on one side of the display area and a retaining ring layer surrounding the display area, the binding area includes a plurality of conductive touch pads, and the distance between the retaining ring layer and the binding area is greater than the distance between two adjacent conductive touch pads among the plurality of conductive touch pads. By providing a retaining ring layer, the strength of the substrate can be enhanced, cracks generated when the substrate is cut can be prevented from extending into the interior of the substrate, and the electrical reliability and trust level of the silicon-based OLED can be improved. By making the distance between the retaining ring layer and the binding area greater than the distance between two adjacent conductive touch pads among the plurality of conductive touch pads, a short circuit caused by the overlap of the gold fingers of the circuit board and the residual metal particles generated by the cutting of the silicon substrate on the backing adhesive area can be avoided, thereby improving the reliability of the panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 FIG. 4 is a schematic diagram of a display panel according to an embodiment of the present invention.

[0024] Reference numerals

[0025] Substrate 10; binding area 20; conductive contact pad 21;

[0026] Retaining ring 30;

[0027] Connecting portion 40; conductive adhesive 50; packaging layer 60;

[0028] Adhesive backing 70; sealing layer 80. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] The terms "first", "second", etc. in the specification and claims of the present invention are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable under appropriate circumstances, so that the embodiments of the present invention can be implemented in an order other than those illustrated or described herein. In addition, the term "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0031] The following is combined with Figure 1 As shown, the display panel provided by the embodiment of the present invention is described in detail through specific embodiments and application scenarios.

[0032] like Figure 1As shown, the display panel of the embodiment of the present invention includes: a substrate 10, which can be a silicon substrate, and the substrate 10 has a display area and a non-display area, and the non-display area is arranged around the display area. The non-display area includes a binding area 20 located on one side of the display area and a retaining ring layer 30 surrounding the display area, the retaining ring layer 30 can be annular, and the binding area 20 can be located at the inner periphery of the retaining ring layer 30. The binding area 20 includes a plurality of conductive pads 21, and the plurality of conductive pads 21 can be evenly spaced, and the conductive pads 21 and the retaining ring layer 30 can be spaced. The distance between the retaining ring layer 30 and the binding area 20 is greater than the distance between two adjacent conductive pads 21 in the plurality of conductive pads 21, so that the retaining ring layer 30 has a long distance from the binding area 20, which can avoid the short circuit caused by the overlap of the metal particles remaining from the cutting of the silicon substrate on the back glue area with the gold finger of the circuit board. Improve the reliability of the panel. The plurality of conductive pads 21 in the binding area 20 can be used to be electrically connected to the gold finger, and the conductive pads 21 can be electrically connected to the circuit board through the gold finger. The retaining ring layer 30 may extend along the circumference of the substrate 10, and the retaining ring layer 30 may be located in the edge region of the substrate 10. The number of the retaining ring layer 30 may be one or more circles. When the number of the retaining ring layer 30 is multiple circles, the multiple circles of the retaining ring layer 30 may be arranged at intervals. The surface of the non-display area of ​​the substrate 10 may be provided with a groove, and the groove may extend along the circumference of the substrate 10. The retaining ring layer 30 may be arranged in the groove, and part of the retaining ring layer 30 may extend out of the groove to reduce the space occupied by the retaining ring layer 30.

[0033] In the display panel of the embodiment of the present invention, the strength of the substrate can be enhanced by providing the retaining ring layer 30, so as to prevent cracks generated when the substrate is cut from extending into the inside of the substrate, thereby improving the electrical reliability and trust level of the silicon-based OLED. By making the distance between the retaining ring layer 30 and the binding area 20 larger than the distance between two adjacent conductive contact pads 21 among the plurality of conductive contact pads 21, it is possible to avoid short circuits caused by the overlap between the gold fingers of the circuit board and the metal particles remaining when the silicon substrate is cut on the adhesive backing area, thereby improving the reliability of the panel.

[0034] In some embodiments, the distance between the retaining ring layer 30 and the binding area 20 is greater than the distance between the retaining ring layer 30 and the edge of the substrate 10. The retaining ring layer 30 is arranged close to the edge of the substrate 10, which can effectively prevent the cracks generated when the substrate is cut from extending into the inside of the substrate. At the same time, the distance between the retaining ring layer 30 and the binding area 20 is far enough to effectively avoid the short circuit caused by the overlap of the gold fingers of the circuit board and the metal particles remaining generated by the cutting of the silicon substrate on the backing adhesive area.

[0035] In other embodiments, the distance between the retaining ring layer 30 and the binding area 20 is greater than the sum of the width of one conductive contact pad 21 and the width of an adjacent conductive contact pad 21 among the multiple conductive contact pads 21. Compared with the sum of the width of one conductive contact pad 21 and the width of an adjacent conductive contact pad 21, the retaining ring layer 30 and the binding area 20 have a larger distance, which can effectively avoid short circuits caused by overlapping of metal particles remaining from cutting of the silicon substrate on the backing adhesive area and the gold fingers of the circuit board.

[0036] Optionally, the width of the retaining ring layer 30 is smaller than the width of the binding area 20. The width of the retaining ring layer 30 is small, which reduces the space occupied. The width and thickness of the retaining ring layer 30 can be reasonably selected according to actual conditions. The retaining ring layer 30 needs to have a certain strength to enhance the strength of the substrate and prevent cracks generated when the substrate is cut from extending into the substrate.

[0037] In some embodiments, the retaining ring layer 30 may be a conductive material, and the retaining ring 30 layer may be a metal material or a conductive adhesive material, so as to improve the electrostatic discharge protection capability of the silicon-based OLED.

[0038] Optionally, the spacing distance between the binding area 20 and the retaining ring layer 30 can be greater than or equal to 15μm, and the spacing distance between the conductive contact pad 21 and the retaining ring layer 30 can be greater than or equal to 15μm, so that the binding area 20 or the conductive contact pad 21 and the retaining ring layer 30 have sufficient spacing to avoid short circuits caused by overlapping of gold fingers connected on the circuit board and metal particles remaining produced by cutting of the substrate in the back glue area, thereby improving electrical reliability.

[0039] Optionally, the display panel may further include: a connection portion 40, a conductive adhesive 50 is provided between the connection portion 40 and the conductive contact pad 21, and the connection portion 40 may be a gold finger, through which the conductive contact pad 21 may be electrically connected to the circuit board. The conductive adhesive 50 may be an anisotropic conductive film (ACF), and the conductive adhesive 50 may conduct the conductive contact pad 21 and the connection portion 40 in the direction from the conductive contact pad 21 to the connection portion 40. The orthographic projection of the connection portion 40 on the substrate 10 covers the orthographic projection of the conductive contact pad 21 on the substrate 10, and the orthographic projection of the connection portion 40 on the substrate 10 may extend beyond the orthographic projection of the conductive contact pad 21 on the substrate 10, so as to ensure the contact area between the connection portion 40 and the conductive contact pad 21, and ensure the reliable connection between the connection portion 40 and the conductive contact pad 21. The connection portion 40 may be arranged in parallel with the substrate 10, and a part of the connection portion 40 may extend out of the substrate 10, so as to facilitate the electrical connection of the connection portion 40 with the circuit board.

[0040] Optionally, the conductive adhesive 50 can be an anisotropic conductive adhesive film, and the conductive adhesive 50 can conduct electricity between the conductive contact pad 21 and the connecting part 40 in the direction from the conductive contact pad 21 to the connecting part 40. The conductive adhesive 50 can conduct electricity in one direction. The conductive adhesive 50 can conduct electricity between the conductive contact pad 21 and the connecting part 40 in the thickness direction of the substrate 10, thereby preventing the conductive adhesive 50 from conducting electricity in other directions and reducing the risk of short circuit.

[0041] Optionally, the conductive adhesive 50 and the retaining ring layer 30 may be spaced apart. For example, the distance between the conductive adhesive 50 and the retaining ring layer 30 in the direction parallel to the substrate 10 may be greater than or equal to 15 μm. The space between the conductive adhesive 50 and the retaining ring layer 30 can avoid short circuits caused by overlapping of the gold fingers connected on the circuit board and the metal particles remaining from the cutting of the substrate on the back adhesive area, thereby improving electrical reliability.

[0042] In some embodiments, an encapsulation layer 60 may be provided on the connection portion 40, and the connection portion 40 may be encapsulated by the encapsulation layer 60, so as to protect the connection portion 40 and prevent the connection portion 40 from contacting and connecting with other device structures. The encapsulation layer 60 may be an insulating layer, and the encapsulation layer 60 may be a polyimide material layer, so as to prevent the connection portion 40 from contacting and electrically connecting with other device structures and reduce the risk of short circuit. The encapsulation layer 60 may be an elastic material layer, which has a certain elasticity and can reduce external collision.

[0043] Optionally, the orthographic projection of the conductive contact pad 21 on the substrate 10 is located within the orthographic projection of the connecting portion 40 on the substrate 10, and the orthographic projection of the connecting portion 40 on the substrate 10 can extend beyond the orthographic projection of the conductive contact pad 21 on the substrate 10, thereby ensuring the contact area between the connecting portion 40 and the conductive contact pad 21 and ensuring reliable connection between the connecting portion 40 and the conductive contact pad 21.

[0044] In an embodiment of the present invention, a sealing layer 80 may be provided between the connection part 40 and the substrate 10, and the edge of the sealing layer 80 may extend to the conductive adhesive 50. The sealing layer 80 may reduce the gap between the connection part 40 and the substrate 10, and the connection part 40 may be supported by the sealing layer 80. The sealing layer 80 may be an insulating layer, and the sealing layer 80 may be a polyimide material layer. The sealing layer 80 may reduce the short circuit between the retaining ring layer 30 and other structures. The sealing layer 80 may be an elastic layer. When the connection part 40 is deformed or squeezed, the deformation of the sealing layer 80 may reduce the influence of the external force on the connection part 40. The thickness of the sealing layer 80 may be the same as that of the conductive adhesive 50, and the sealing layer 80 and the conductive adhesive 50 may be in the same plane. The sealing layer 80 and the conductive adhesive 50 may be arranged parallel to the substrate 10, so as to facilitate the contact and connection between the connection part 40 and the sealing layer 80 and the conductive adhesive 50.

[0045] Optionally, part of the connection part 40 may extend out of the substrate 10, and the edge of the substrate 10 may be provided with a backing glue 70, and the sealing layer 80 may extend between the backing glue 70 and the part of the connection part 40 extending out of the substrate 10. Part of the sealing layer 80 may be located between the connection part 40 and the substrate 10, and part of the sealing layer 80 may be located between the connection part 40 and the backing glue 70. The sealing layer 80 has a reinforcing effect, and the connection part 40 can be supported by the sealing layer 80, thereby reducing the risk of short circuit between the connection part 40 and the backing glue 70. The backing glue 70 may be an elastic glue. Due to its elasticity, when the connection part 40 is deformed or squeezed, the deformation of the backing glue 70 can reduce the influence of external forces on the connection part 40.

[0046] The display device of the embodiment of the present invention includes: the display panel described in the above embodiment. The display device having the display panel in the above embodiment can prevent cracks generated when the substrate is cut from extending into the interior of the substrate, thereby improving the electrical reliability and trust level of the silicon-based OLED.

[0047] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A display panel, characterized in that: include: A substrate, wherein the substrate has a display area and a non-display area, and the non-display area is arranged around the display area; The non-display area includes a binding area located at one side of the display area and a retaining ring layer surrounding the display area, the binding area includes a plurality of conductive pads, and a distance between the retaining ring layer and the binding area is greater than a distance between two adjacent conductive pads among the plurality of conductive pads; The distance between the retaining ring layer and the binding area is greater than the distance between the retaining ring layer and the edge of the substrate; The retaining ring layer is made of a conductive material.

2. The display panel according to claim 1, characterized in that: The distance between the retaining ring layer and the binding area is greater than the sum of the width of one conductive contact pad among the plurality of conductive contact pads and the width of an adjacent conductive contact pad.

3. The display panel according to claim 1, characterized in that: The width of the retaining ring layer is smaller than the width of the binding area.

4. The display panel according to claim 1, characterized in that: The spacing distance between the binding area and the retaining ring layer is greater than or equal to 15 μm.

5. The display panel according to claim 1, characterized in that: Also includes: A connecting portion, wherein conductive glue is provided between the connecting portion and the conductive contact pad.

6. The display panel according to claim 5, characterized in that: The conductive adhesive is an anisotropic conductive adhesive film, and the conductive adhesive conducts electricity between the conductive contact pad and the connecting portion in the direction from the conductive contact pad to the connecting portion; and / or The conductive adhesive and the retaining ring layer are spaced apart; and / or The connecting portion is provided with an encapsulation layer; and / or The orthographic projection of the conductive contact pad on the substrate is located within the orthographic projection of the connecting portion on the substrate.

7. The display panel according to claim 5, characterized in that: A sealing layer is provided between the connecting portion and the substrate, and an edge of the sealing layer extends to the conductive adhesive.

8. The display panel according to claim 7, characterized in that: A portion of the connecting portion extends out of the substrate, a backing glue is provided on the edge of the substrate, and the sealing layer extends between the backing glue and a portion of the connecting portion extending out of the substrate.

9. A display device, characterized in that: include: The display panel according to any one of claims 1 to 8.

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