Laser grinding machine

Abstract

The invention relates to the field of laser processing technology and discloses a laser grinder, wherein a first laser grinding structure is located in front of a second laser grinding structure, the first laser grinding structure, the second laser grinding structure and a processing turntable are arranged at right angles, and the structure is compact. By cleverly arranging the second laser grinding structure behind a first column and a second column, the space behind the laser grinder is fully utilized, and the outer shape is square under horizontal projection, so that the length of the laser grinder is avoided to be too large and the occupied space of the laser grinder is reduced; when processing a workpiece, the first laser grinding structure and the second laser grinding structure are synchronously processed in a mutually coordinated manner, and the workpiece is cleverly subjected to secondary grinding during the reset return stroke, without redundant moving lines, thereby greatly improving the grinding efficiency and making the surface of the workpiece smoother and flatter.

Description

[0001] This application is a divisional application of the patent application with patent application number "202210526535.7", application date "May 16, 2022", and name "A laser grinder and laser grinding method". Technical Field

[0002] The invention relates to the technical field of laser processing, and in particular to a laser grinder. Background Art

[0003] When the surface of the product is thinned, a grinding wheel is generally used to grind the surface of the workpiece to be processed, but this method has a low processing efficiency. At present, in order to improve the efficiency of product thinning, lasers are usually used to grind and thin the surface of the workpiece to be processed, but there are the following shortcomings: 1. The processing efficiency of a single laser head is slow. If two laser heads are used for processing, the two laser heads are generally arranged left and right, and the two laser heads can only move horizontally, which makes the length of the entire processing machine tool larger, occupies a large space, and is difficult to place reasonably in the workshop; 2. When the laser grinds the surface of the workpiece, a large amount of dust and chips will be generated. Even if an outer plate structure is set to prevent dust and waste chips from spreading outward and polluting the workshop environment, dust and waste chips will still fly inside the entire machine tool, and are easily attached to the linear drive or some precision mechanisms, affecting its normal operation. In addition, although exhaust dust removal is performed inside the outer plate structure, the exhaust dust removal effect is not good due to the large space of the machine tool and poor sealing.

[0004] It can be seen that the existing technology still needs to be improved and enhanced. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a laser grinder and a laser grinding method, aiming to make the structure of the processing machine tool more compact and reduce the occupied space; and also to limit the spread of dust and waste chips and improve the exhaust dust removal effect.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A laser grinding machine comprises a base frame, a base plate arranged on the base frame, a processing turntable arranged on the base plate, a first column and a second column arranged vertically on the base plate, a crossbeam arranged across the top of the first column and the second column, a longitudinal beam arranged on the top of the second column, an X-axis linear drive arranged on the crossbeam, a first Z-axis linear drive arranged on the X-axis linear drive, a first laser grinding structure arranged on the first Z-axis linear drive, a Y-axis linear drive arranged on the longitudinal beam, a second Z-axis linear drive arranged on the Y-axis linear drive, a second laser grinding structure arranged on the second Z-axis linear drive, and an inner protective device arranged on the base frame. Protective shell and outer plate structure; the first laser grinding structure is located in front of the second laser grinding structure, the processing turntable is used to clamp multiple workpieces and drive the multiple workpieces to rotate synchronously, the first laser grinding structure and the second laser grinding structure are used to emit lasers to process the workpieces on the processing turntable; the inner protective shell is located below the crossbeam, the interior of the inner protective shell and the outer plate structure enclose a T-shaped processing area, the T-shaped processing area includes a transverse movement area for the first laser grinding structure to move laterally and a longitudinal movement area for the second laser grinding structure to move longitudinally, the processing turntable is located in the transverse movement area and in front of the longitudinal movement area, and the T-shaped processing area is exhausted and dusted by a dust suction structure.

[0008] As a further improvement of the above technical solution, the first laser grinding structure includes a support arm extending vertically, two adjustment plates arranged in parallel at the bottom of the support arm, a rotating head arranged between the two adjustment plates, and a laser assembly arranged on the rotating head; one of the adjustment plates is provided with a dial and a locking structure coaxially arranged with the rotating head, and the rotation of the rotating head is limited by the locking structure; the rotating head is provided with a pointer matching the dial; the laser assembly is used to emit laser so that the laser can grind and thin the workpiece.

[0009] As a further improvement of the above technical solution, the inner protective shell includes a front shell and a rear shell, the front shell is located in front of the first column and the second column, the rear shell is located between the first column and the second column, the top of the front shell is provided with a front avoidance opening for avoiding the lateral movement of the first laser grinding structure, the first laser grinding structure cooperates with the first follow-up enclosure structure to enclose the front avoidance opening, the top of the rear shell is provided with a rear avoidance opening for avoiding the longitudinal movement of the second laser grinding structure, the second laser grinding structure cooperates with the second follow-up enclosure structure to enclose the rear avoidance opening.

[0010] As a further improvement of the above technical solution, the first follow-up enclosure structure includes a first accordion cover, a second accordion cover, and a front slide arranged on the top of the front shell body and movable along the extension direction of the front avoidance opening, one end of the front avoidance opening is connected to the front slide through the first accordion cover, and the other end of the front avoidance opening is connected to the front slide through the second accordion cover, and the front slide is provided with a first opening for the support arm of the first laser grinding structure to pass through; the front slide includes a front cover plate and a front tray arranged at the bottom of the front cover plate, the first opening is opened on the front cover plate, and a first square opening is opened on the front tray, and each edge of the first square opening is provided with a booster assembly, and each booster assembly includes a support and two rollers rotatably arranged at both ends of the support.

[0011] As a further improvement of the above technical solution, the dust suction structure includes a bracket fixed on the outside of the support arm and a dust suction connector arranged at the bottom of the bracket. A pipe clamp is arranged on the top of the support arm, and an outlet for the dust suction branch pipe to be routed is opened on the support arm. The dust suction branch pipe passes through the pipe clamp into the inner cavity of the support arm, and is connected to the dust suction connector on the bracket after being led out from the outlet.

[0012] As a further improvement of the above technical solution, the dust suction structure also includes a dust suction port arranged on the inner protective shell, the dust suction port is arranged in the longitudinal movement area and faces the transverse movement area, and the dust suction port is connected to the dust suction main pipe.

[0013] As a further improvement of the above technical solution, the processing turntable includes a base, a circular turntable rotatably arranged above the base, and a driving device for driving the circular turntable to rotate. A plurality of magnetic clamps are arranged on the circular turntable, and the magnetic clamps are arranged in an array around the edge of the circular turntable.

[0014] As a further improvement of the above technical solution, the magnetic suction clamp includes a seat body and a limiting assembly arranged on the seat body. The upper surface of the seat body is provided with a plurality of grooves, and a magnet matching the shape of the groove is placed in each groove. The magnet is used to magnetically attract the workpiece so that the workpiece is pressed flat on the upper surface of the seat body. The limiting assembly is used to limit the edge of the workpiece to prevent the workpiece from slipping out of the seat body.

[0015] As a further improvement of the above technical solution, the adjustment plate is provided with a probe fixing seat, and the probe fixing seat is provided with a workpiece probe; the rotating head is provided with an air blow pipe fixing seat, and the air blow pipe fixing seat is provided with an air blow pipe; the adjustment plate is connected and reinforced by a cross plate, and a turning tool is provided on one of the adjustment plates.

[0016] A laser grinding method based on the laser grinding machine as described above, wherein the method comprises

[0017] S1: clamping multiple workpieces to be processed onto the processing turntable;

[0018] S2: adjusting the angle of the laser assembly of the first laser grinding structure so that the angle between the laser emission direction of the laser assembly and the upper surface of the workpiece is a preset angle;

[0019] S3: adjusting the angle of the laser assembly of the second laser grinding structure so that the angle between the laser emission direction of the laser assembly and the upper surface of the workpiece is a preset angle;

[0020] S4: measuring the height of the upper surface of the workpiece, and then the processing turntable drives all the workpieces to rotate synchronously, and when the processing turntable drives all the workpieces to rotate, a circular processing area is formed, and the circular processing area forms an outer circle boundary and an inner circle boundary;

[0021] S5: The height of the first laser grinding structure is adjusted by the first Z-axis linear drive. The first laser grinding structure emits a laser and moves laterally toward the central axis of the processing turntable under the drive of the X-axis linear drive. The laser first crosses the outer circle boundary of the circular processing area and enters the circular processing area. The laser irradiates the surface of the workpiece to perform grinding and moves toward the inner circle boundary at a preset speed. The surface grinding amount of the workpiece is x1.

[0022] S6: The height of the second laser grinding structure is adjusted by the second Z-axis linear drive. The second laser grinding structure emits a laser and moves longitudinally toward the central axis of the processing turntable under the drive of the Y-axis linear drive. The laser first crosses the outer circle boundary of the circular processing area and enters the circular processing area. The laser irradiates the surface of the workpiece to perform grinding and moves toward the inner circle boundary at a preset speed. The surface grinding amount of the workpiece is x2.

[0023] S7: When the laser emitted by the first laser grinding structure crosses the inner circle boundary, the first laser grinding structure stops emitting laser until the laser emitted by the second laser grinding structure crosses the inner circle boundary, the first Z-axis linear drive drives the first laser grinding structure to rise to a set height, the first laser grinding structure emits laser again and moves laterally in a direction away from the central axis of the processing turntable, the laser first crosses the inner circle boundary and enters the annular processing area, the laser irradiates the surface of the workpiece to perform grinding and moves toward the outer circle boundary at a preset speed, and the surface grinding amount of the workpiece is x3;

[0024] S8: The second Z-axis linear drive drives the second laser grinding structure to rise to a set height, and the second laser grinding structure emits laser light again and moves laterally in a direction away from the central axis of the processing turntable. The laser light first crosses the inner circle boundary and enters the annular processing area. The laser light is irradiated on the surface of the workpiece to perform grinding and moves toward the outer circle boundary at a preset speed. The surface grinding amount of the workpiece is x4.

[0025] S9: When the laser emitted by the first laser grinding structure crosses the outer circle boundary, the first laser grinding structure stops laser emission and resets to the initial position; when the laser emitted by the second laser grinding structure crosses the outer circle boundary, the second laser grinding structure stops laser emission and resets to the initial position, and the total grinding amount of the workpiece X=x1+x2+x3+x4, x1>0.1mm, x2>0.1mm, x3<0.1mm, x4<0.1mm.

[0026] Beneficial effects:

[0027] Compared with the prior art, the laser grinding machine provided by the present invention has the following advantages:

[0028] 1. The first laser grinding structure is located in front of the second laser grinding structure. The moving grinding direction of the first laser grinding structure is horizontal, and the moving grinding direction of the second laser grinding structure is vertical. The moving grinding directions of the two do not overlap and do not interfere with each other. By cleverly arranging the second laser grinding structure behind the first column and the second column, the space behind the laser grinder is fully utilized. The laser grinder is square in horizontal projection. The first laser grinding structure, the second laser grinding structure and the processing turntable are arranged at right angles. The structure is compact, which avoids the laser grinder from being too long, reduces the space occupied by the laser grinder, and is better suitable for placement in the workshop.

[0029] 2. Since the T-shaped processing area formed by the inner protective shell and the outer plate structure is in a closed state, the dust and chips generated by the workpiece during the processing are confined within the T-shaped processing area, preventing the dust and chips from polluting the parts outside the T-shaped processing area, ensuring the normal operation of these parts and reducing the maintenance cycle. At the same time, the vacuum cleaner extracts air from the T-shaped processing area. Since the spatial volume of the T-shaped processing area is less than half of the spatial volume of the entire laser grinder cavity, and the T-shaped processing area has good sealing, the T-shaped processing area can form a greater negative pressure during dust extraction, greatly reducing the amount of dust and chips remaining in the laser grinder, and achieving better waste chip treatment effects. Even after the workpiece is processed, the staff opens the front door, and no dust and chips will spread outward from the front door, ensuring the cleanliness of the production workshop.

[0030] 3. The laser processing of the first laser grinding structure and the second laser grinding structure do not interfere with each other, and the processing is synchronized in a coordinated manner, and the workpiece is cleverly ground a second time during the reset return stroke without any extra moving lines, which greatly improves the grinding efficiency and makes the surface of the workpiece smoother and flatter. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 Schematic diagram of the internal structure of the laser grinding machine Figure 1 .

[0032] Figure 2 Schematic diagram of the internal structure of the laser grinding machine Figure 2 .

[0033] Figure 3 For laser grinding machine Figure 1 .

[0034] Figure 4 For laser grinding machine Figure 2 .

[0035] Figure 5 It is a stereoscopic diagram of the first laser grinding structure.

[0036] Figure 6 A perspective view of the rotor and laser assembly.

[0037] Figure 7 It is a three-dimensional diagram of the inner protective shell.

[0038] Figure 8 for Figure 7 A partial enlarged view of area A.

[0039] Fig. 9 This is a three-dimensional view of the processing turntable.

[0040] Fig.10 This is a top view of the machining turntable.

[0041] Fig.11 This is a three-dimensional diagram of the magnetic clamp.

[0042] Fig.12 This is a three-dimensional picture of the workpiece after being clamped by the magnetic fixture. DETAILED DESCRIPTION

[0043] The present invention provides a laser grinding machine and a laser grinding method. In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the scope of protection of the present invention.

[0044] See also Figure 1-Figure 12The present invention provides a laser grinding machine including a base frame 1, a base plate 11 arranged on the base frame 1, a processing turntable 2 arranged on the base plate 11, a first column 31 and a second column 32 vertically arranged on the base plate 11, a crossbeam 33 arranged across the tops of the first column 31 and the second column 32, a longitudinal beam 34 arranged on the tops of the second column 32, an X-axis linear drive 35 arranged on the crossbeam 33, a first Z-axis linear drive 36 arranged on the X-axis linear drive 35, a first laser grinding structure 4 arranged on the first Z-axis linear drive 36, a Y-axis linear drive 37 arranged on the longitudinal beam 34, a second Z-axis linear drive 38 arranged on the Y-axis linear drive 37, a second laser grinding structure 40 arranged on the second Z-axis linear drive 38, and a base frame 1 arranged on the base frame 1. Inner protective shell 6 and outer plate structure 7; the first laser grinding structure 4 is located in front of the first column 31 and the second column 32, and the second laser grinding structure 40 is located behind the two first columns 31 and the second column 32, that is, the first laser grinding structure 4 is located in front of the second laser grinding structure 40, and the moving grinding direction of the first laser grinding structure 4 is horizontal, and the moving grinding direction of the second laser grinding structure 40 is longitudinal, and the moving grinding directions of the two do not overlap and do not interfere with each other. By cleverly arranging the second laser grinding structure 40 behind the first column 31 and the second column 32, the space behind the laser grinder is fully utilized. The laser grinder is square in horizontal projection, which avoids the laser grinder from being too long, reduces the space occupied by the laser grinder, and is better suitable for placement in the workshop.

[0045] The processing turntable 2 is used to clamp multiple workpieces 20 and drive multiple workpieces 20 to rotate synchronously. The first laser grinding structure 4 and the second laser grinding structure 40 are used to emit lasers to process the workpieces on the processing turntable 2. The inner protective shell 6 is located below the crossbeam 33. The interior of the inner protective shell 6 and the outer plate structure 7 enclose a T-shaped processing area 63. The T-shaped processing area 63 includes a transverse movement area 631 for the first laser grinding structure 4 to move transversely and a longitudinal movement area 632 for the second laser grinding structure 40 to move longitudinally. The T-shaped processing area 63 is exhausted and dusted by a dust suction structure. The processing turntable 2 is located in the transverse movement area 631 and in front of the longitudinal movement area 632, that is, in the non-working state, the first laser grinding structure 4, the second laser grinding structure 40 and the processing turntable 2 are arranged at right angles, with a compact structure and flexible processing.

[0046] During processing, the staff opens the front door 711 on the outer plate structure 7, clamps the batch of workpieces on the processing turntable 2, and then closes the front door 711. The processing turntable 2 drives all the workpieces 20 to rotate synchronously. The first laser grinding structure 4 emits a laser and moves laterally under the control of the control system to laser grind the workpiece 20 on the processing turntable 2. Similarly, the second laser grinding structure 40 also emits a laser and moves longitudinally under the control of the control system, and cooperates with the first laser grinding structure 4 to laser grind the workpiece on the processing turntable 2, thereby improving the laser grinding efficiency. Since the T-shaped processing area 63 enclosed by the inner protective shell 6 and the outer plate structure 7 is in a closed state, the dust and chips generated by the workpiece during the processing are confined to the T-shaped processing area 63, thereby preventing the dust and chips from polluting the components outside the T-shaped processing area 63, thereby ensuring the normal operation of these components and reducing the maintenance cycle. At the same time, the vacuum cleaner extracts air from the T-shaped processing area 63 to remove dust. Since the spatial volume of the T-shaped processing area 63 is less than half of the spatial volume of the entire laser grinder cavity and the T-shaped processing area 63 has good sealing performance, the T-shaped processing area 63 can form a greater negative pressure when exhausting dust, greatly reducing the amount of dust and chips remaining in the laser grinder, achieving a better waste chip treatment effect. Even if the worker opens the front door 711 after the workpiece is processed, no dust and chips will spread outward from the front door 711, ensuring the cleanliness of the production workshop.

[0047] The X-axis linear drive 35, the Y-axis linear drive 37, the first Z-axis linear drive 36, and the second Z-axis linear drive 38 are linear module structures, and their main function is to provide an output end for linear motion; the X-axis linear drive 35 is used to drive the first Z-axis linear drive 36 and the first laser grinding structure 4 to move horizontally; the first Z-axis linear drive 36 is used to drive the first laser grinding structure 4 to move vertically, and the Y-axis linear drive 37 is used to drive the second Z-axis linear drive 38 and the second laser grinding structure 40 to move longitudinally; the second Z-axis linear drive 38 is used to drive the second laser grinding structure 40 to move vertically.

[0048] For details, please refer to Figure 5 and Figure 6The first laser grinding structure 4 includes a support arm 41 extending vertically, two adjustment plates 42 arranged in parallel at the bottom of the support arm 41, a rotating head 43 arranged between the two adjustment plates 42, and a laser assembly 44 arranged on the rotating head 43; one of the adjustment plates 42 is provided with a dial 45 and a locking structure 47 coaxially arranged with the rotating head 43, and the locking structure 47 is used to limit the rotation of the rotating head 43; the rotating head 43 is provided with a pointer 46 matching the dial 45; the laser assembly 44 is used to emit laser, so that the laser can grind and thin the workpiece. In this embodiment, the workpiece is in the shape of a round block or a polygonal block, and the workpiece is placed flat on the fixture, that is, the workpiece is parallel to the horizontal plane. The angle between the laser emitted by the laser component 44 and the upper surface of the workpiece is a preset angle, wherein the preset angle is 0° to 45°. Before batch processing, the staff can adjust the laser inclination angle (that is, the angle between the laser and the horizontal plane) according to the workpiece processing requirements; when the material of the workpiece is harder or the cutting amount is larger, the angle between the laser and the upper surface of the workpiece should be increased; when the material hardness of the workpiece is smaller or the cutting amount is smaller, the angle between the laser and the upper surface of the workpiece should be reduced.

[0049] During adjustment, the locking structure 47 is loosened to slowly rotate the rotating head 43. The reading of the pointer 46 changes accordingly with the rotation of the rotating head 43, providing a reference for the staff's operation. When the rotating head 43 is slowly rotated to a suitable angle, the rotating head 43 is re-locked to complete the adjustment of the laser emission angle of the laser assembly 44. The adjustment is flexible and convenient to ensure the laser grinding effect.

[0050] Specifically, the locking structure 47 includes at least one elongated through hole arranged on the periphery of the dial 45, and a threaded hole arranged on the rotating head 43 and corresponding to the elongated through hole. A screw passes through each elongated through hole and is connected to the threaded hole, and the head of the screw is locked on the adjustment plate 42. In this embodiment, in order to improve the locking force of the rotating head 43, there are 4 elongated through holes arranged; the elongated through hole refers to a non-circular hole, which can be a rectangular hole, a waist-shaped hole, a rounded rectangular hole, etc. When the direction of the rotating head 43 needs to be changed, the screw is loosened, the direction of the rotating head 43 is adjusted according to the reading of the pointer 46 on the dial 45, and then it is locked again, which is convenient to adjust.

[0051] Specifically, the laser assembly 44 includes a laser head 441 fixed on the top of the rotating head 43, a reflector arranged inside the rotating head 43, a mirror base 442 fixed on the rotating head 43, and a galvanometer arranged on the mirror base 442. The top of the laser head 441 extends into the inner cavity of the support arm 41. The laser head 441 is used to emit laser into the rotating head, so that the laser is emitted through the reflector and the galvanometer in sequence.

[0052] Specifically, the inner protective shell 6 includes a front shell 61 and a rear shell 62, the front shell 61 is located in front of the first column 31 and the second column 32, the rear shell 62 is located between the first column 31 and the second column 32, the bottom of the front shell 61 and the rear shell 62 are provided with a bottom sealing flange 601 connected to the bottom plate 11, and the front shell 61 and the rear shell 62 are provided with a side sealing flange 602 connected to the peripheral plate structure; by providing the bottom sealing flange 601 and the side sealing flange 602, on the one hand, it is convenient to fix the front shell 61 and the rear shell 62 by screws, and on the other hand, since the bottom sealing flange 601 is close to the bottom plate 11, and the side sealing flange 602 is close to the peripheral plate structure 7, the bottom gap between the front shell 61 and the rear shell 62 and the bottom plate 11, and the side gap between the front shell 61 and the rear shell 62 and the peripheral plate structure 7 are eliminated, thereby preventing dust and waste chips from escaping from the T-shaped processing area 63 from the bottom gap and the side gap, thereby improving the sealing of the T-shaped processing area 63.

[0053] Furthermore, a front avoidance opening 64 for avoiding the lateral movement of the first laser grinding structure 4 is opened at the top of the front shell 61, and the first laser grinding structure 4 cooperates with the first follow-up enclosure structure 5 to enclose the front avoidance opening 64 to prevent dust and chips from escaping from the T-shaped processing area 63 through the front avoidance opening 64; a rear avoidance opening 65 for avoiding the longitudinal movement of the second laser grinding structure 40 is opened at the top of the rear shell 62, and the second laser grinding structure 40 cooperates with the second follow-up enclosure structure 8 to enclose the rear avoidance opening 65 to prevent dust and chips from escaping from the T-shaped processing area 63 through the rear avoidance opening 65.

[0054] In this embodiment, the first follow-up enclosure structure 5 includes a first accordion cover 51, a second accordion cover 52, and a front slide 53 disposed on the top of the front shell 61 and movable along the extension direction of the front avoidance opening 64. One end of the front avoidance opening 64 is connected to the front slide 53 through the first accordion cover 51, and the other end of the front avoidance opening 64 is connected to the front slide 53 through the second accordion cover 52. The front slide 53 is provided with a first opening 54 for the support arm 41 of the first laser grinding structure to pass through; that is, the first opening 54 through which the support arm 41 on the first laser grinding structure 4 passes. When the first laser grinding structure 4 is working, the support arm 41 on the first laser grinding structure 4 moves horizontally, which will pull the front slide 53 to move synchronously, thereby driving the first accordion cover 51 and the second accordion cover 52 to telescope, and always ensuring that the front avoidance opening 64 is in an enclosed state to prevent dust and chips from escaping from the T-shaped processing area 63 from the front avoidance opening 64.

[0055] Furthermore, the front slide 53 includes a front cover plate 531 and a front tray 532 arranged at the bottom of the front cover plate 531, the first opening 54 is opened on the front cover plate 531, and a first square opening 55 is opened on the front tray 532. Each edge of the first square opening 55 is provided with a booster assembly 56, and each booster assembly 56 includes a support 561 and two rollers 562 rotatably arranged at both ends of the support 561. The rollers 562 of each group of booster assemblies 56 are pressed against the wall surface of the support arm 41 of the first laser grinding structure 4 to prevent the support arm 41 of the first laser grinding structure 4 from causing a rigid impact on the front slide 53, thereby improving the lateral stability of the front slide 53; in addition, when the support arm 41 of the first laser grinding structure 4 moves vertically, the support arm 41 of the first laser grinding structure 4 drives the rollers 562 to rotate, and the friction force is small, thereby preventing the support arm 41 of the first laser grinding structure 4 from scratching the front cover plate 531 and the front tray 532 of the front slide 53.

[0056] Preferably, two transversely extending front guide rails 68 are provided on the front shell body 61, and the front slide 53 is slidably connected to the front guide rails 68 via a slider 69, so that the front slide 53 moves smoothly and reduces the load on the first laser grinding structure as much as possible.

[0057] It should be noted that the structures of the first follower enclosure structure 5 and the second follower enclosure structure 8 are the same. Those skilled in the art can set the second follower enclosure structure 8 according to the first follower enclosure structure 5, so the structure of the second follower enclosure structure 8 is not described in detail.

[0058] Furthermore, the outer panel structure 7 includes a front panel 71, a rear panel 72, a left panel 73, a right panel, an upper panel 75, a front door body 711 arranged on the front panel 71, a left door body 731 arranged on the left panel 73, a right door body arranged on the right panel, and a rear door body 721 arranged on the rear panel 72; a dust suction pipe interface 722 is arranged on the rear panel 72, and the front door body 711, the left door body 731, the right door body and the rear door body 721 are all connected to the corresponding panels through hinges, and the front panel 71, the rear panel 72, the left panel 73 and the right panel form a square wrapping structure with an opening at the bottom.

[0059] Specifically, the dust suction structure includes a bracket 971 fixed on the outside of the support arm 41 and a dust suction connector 972 arranged at the bottom of the bracket 971. A pipe clamp 973 is arranged on the top of the support arm 41. An outlet for the dust suction branch pipe 974 is provided on the support arm 41. The dust suction branch pipe 974 passes through the pipe clamp 973 and enters the inner cavity of the support arm 41. After being led out from the outlet, it is connected to the dust suction connector 972 on the bracket 971. When the workpiece is laser ground, the dust suction branch pipe 974 forms a negative pressure under the action of the vacuum cleaner, and the dust and chips are sucked into the dust suction branch pipe 974. On the one hand, the dust and chips inside the CNC machine tool are better collected and processed to improve the cleanliness inside the CNC machine tool; on the other hand, the dust and chips reduce the shielding of the laser to ensure the laser grinding effect.

[0060] Furthermore, the dust suction structure also includes a dust suction port 98 disposed on the inner protective shell 6, the dust suction port 98 is disposed in the longitudinal movement area 632 and faces the transverse movement area 631, and the dust suction port 98 is connected to the dust suction main pipe 99. Since the T-shaped processing area 63 enclosed by the inner protective shell 6, the bottom plate 11 and the peripheral plate structure 7 is in a closed state, the dust and chips generated during the processing of the workpiece are confined in the T-shaped processing area 63, preventing the dust and chips from contaminating the components outside the T-shaped processing area 63, ensuring the normal operation of these components, and reducing the maintenance cycle. At the same time, the vacuum cleaner draws air and dust from the T-shaped processing area 63. Since the spatial volume of the T-shaped processing area 63 is less than half of the spatial volume of the entire inner cavity of the laser CNC machine tool, and the T-shaped processing area 63 has good sealing performance, the T-shaped processing area 63 can form a greater negative pressure when drawing air and removing dust. Dust and chips are more easily sucked out from the dust suction port 98 driven by a strong airflow, which greatly reduces the amount of dust and chips remaining in the laser CNC machine tool and achieves a better waste chip treatment effect. Even if the worker opens the front door 711 after the workpiece is processed, dust and chips will not spread outward from the front door 711, ensuring the cleanliness of the production workshop.

[0061] Specifically, the processing turntable 2 includes a base 21, a circular turntable 22 rotatably arranged above the base 21, and a driving device 23 for driving the circular turntable 22 to rotate. A plurality of magnetic clamps 24 are arranged on the circular turntable 22. The magnetic clamps 24 are arranged in an array around the edge of the circular turntable 22. Two adjacent magnetic clamps 24 are closely arranged, that is, the gap between two adjacent magnetic clamps 24 is small, thereby maximizing the number of magnetic clamps 24.

[0062] Furthermore, the magnetic suction clamp 24 includes a seat body 241 and a limiting component 242 arranged on the seat body 241. The upper surface of the seat body 241 is provided with a plurality of grooves 243. A magnet 244 matching the shape of the groove 243 is placed in each groove 243. The magnet 244 is used to magnetically attract the workpiece 20 so that the workpiece 20 is pressed flat on the upper surface of the seat body 241. The limiting component 242 is used to limit the edge of the workpiece to prevent the workpiece from slipping out of the seat body 241.

[0063] In order to facilitate the manufacture of the magnet 244, the groove 243 is a circular blind hole, and the magnet 244 is annular. The magnet 244 is fixed in the groove 243 by a countersunk screw to prevent the magnet 244 from being taken away from the groove 243 by the workpiece.

[0064] In this embodiment, a countersunk hole 245 extending vertically and passing through the seat body 241 is provided in the middle portion of the seat body 241, and the circular turntable 22 of the processing turntable 2 is provided with positioning threaded holes having the same number and one-to-one correspondence as the countersunk holes 245, and each of the countersunk holes 245 is provided with a positioning screw, which passes through the countersunk hole 245 and is fixedly connected with the positioning threaded hole, so that the seat body 241 is locked on the circular turntable 22.

[0065] Furthermore, there are three grooves 243 arranged circumferentially around the countersunk hole 245, that is, three magnets 244 distributed in a triangle are placed on the seat body 241 to ensure that sufficient magnetic force is generated to firmly adsorb the workpiece on the seat body 241.

[0066] Preferably, the stopper assembly 242 includes a stopper 2421 and a locking screw 2422. The stopper 2421 is provided with a waist-shaped hole extending vertically. The peripheral wall of the seat 241 is provided with mounting planes having the same number as the stopper assembly 242. The mounting plane is provided with threaded holes that cooperate with the locking screws 2422. When installing the stopper 2421, ensure that the stopper 2421 is placed vertically and the top surface of the stopper 2421 is higher than the upper surface of the seat 241. Then, the stopper 2421 is fixed by the locking screw 2422. The stopper 2421 plays a positioning role when the workpiece is placed. When the machining turntable 2 is working, the workpiece will generate centrifugal force under the action of rotation. Therefore, the stopper assembly 242 is provided with two groups and is close to the outer ring boundary 27. The stopper assembly 242 blocks the workpiece to prevent the workpiece from slipping off the seat 241 and affecting the machining effect.

[0067] When the workpiece is processed, the worker pushes the workpiece to move in a direction away from the limiting assembly 242, and the magnetic attraction force on the workpiece gradually decreases, so that the workpiece can be easily removed.

[0068] The adjusting plate 42 is provided with a probe fixing seat 91, and the probe fixing seat 91 is provided with a workpiece probe 92. The workpiece probe 92 is moved to the top of the workpiece and then vertically moved downward. When the workpiece probe 92 contacts the upper surface of the workpiece, the height of the upper surface of the workpiece can be determined as the height of the machining reference surface.

[0069] Preferably, a probe fixing seat 91 is provided on the adjustment plate 42, and a workpiece probe 92 is provided on the probe fixing seat 91; an air blow pipe fixing seat 93 is provided on the rotating head 43, and an air blow pipe 94 is provided on the air blow pipe fixing seat 93; since a large amount of dust and chips will be generated during laser grinding, the air blow pipe 94 continuously blows air in the direction of laser emission to prevent dust and chips from blocking the laser and affecting the chip cutting effect.

[0070] Preferably, the adjustment plates 42 are connected and reinforced by a transverse plate 95, and a turning tool 96 is provided on one of the adjustment plates 42. When the fixture is used for a long time, the upper surface of the seat body 241 will be worn, resulting in unstable clamping of the workpiece, affecting the laser grinding and thinning effect. During maintenance, when the processing turntable 2 drives all the fixtures to rotate around their main axis, the turning tool 96 can turn the upper surface of all the seat bodies 241 flat, ensuring that the workpiece is placed stably and the cutting effect is good.

[0071] The present invention also provides a laser grinding machine and a laser grinding method as described above, wherein the method comprises the following steps:

[0072] S1: Clamp a plurality of workpieces to be processed onto the processing turntable 2.

[0073] S2: Adjust the angle of the laser component 44 of the first laser grinding structure 4 so that the angle between the laser emission direction of the laser component 44 and the upper surface of the workpiece is a preset angle; the size of the preset angle is set according to the material of the workpiece and the amount of cutting.

[0074] S3: Adjust the angle of the laser component 44 of the second laser grinding structure 40 so that the angle between the laser emission direction of the laser component 44 and the upper surface of the workpiece is a preset angle; the size of the preset angle is set according to the material of the workpiece and the amount of cutting.

[0075] S4: Measure the height of the upper surface of the workpiece, obtain the processing reference surface, and then drive all the workpieces to rotate synchronously by the processing turntable 2. When driving all the workpieces to rotate, the processing turntable 2 forms a circular processing area 25. Under horizontal projection, the circular processing area 25 forms an outer circle boundary 27 and an inner circle boundary. It should be noted that all the workpieces are processed synchronously. During the processing, the processing turntable 2 drives all the workpieces to rotate continuously until the processing is completed.

[0076] S5: The height of the first laser grinding structure 4 is adjusted by the first Z-axis linear driver 36. The first laser grinding structure 4 emits a laser and moves laterally toward the central axis of the processing turntable 2 under the drive of the X-axis linear driver 35. The laser first crosses the outer circle boundary 27 of the processing area and enters the circular processing area. The laser is irradiated on the surface of the workpiece to achieve grinding and moves toward the inner circle boundary at a preset speed. The surface grinding amount of the workpiece is x1. It should be understood that the preset speed at which the X-axis linear drive 35 drives the first laser grinding structure 4 to move laterally is slow, while the speed at which the processing turntable 2 drives all workpieces to rotate is high. After the laser crosses the outer circle boundary of the processing area, it will first irradiate the outer edge of the surface of one of the workpieces to form a first grinding pit, and the workpiece is laser-processed into an arc-shaped grinding pit under the drive of the processing turntable. Then, under the drive of the processing turntable, the remaining workpieces are subjected to the same grinding by the laser one by one, until the workpiece that first contacts the laser passes through the laser again, and a second grinding pit is formed on the workpiece. Since the laser moves laterally at a slow speed and the workpiece rotates at a high speed, the first grinding pit and the second grinding pit intersect and merge, that is, the area between the first grinding pit and the second grinding pit is laser-ground; as the laser slowly moves toward the inner circle boundary, the surfaces of all workpieces are gradually ground, so that the first laser grinding laser grinds the surfaces of all workpieces by the same amount.

[0077] S6: The height of the second laser grinding structure 40 is adjusted by the second Z-axis linear driver 38. The second laser grinding structure 40 emits a laser and moves longitudinally toward the central axis of the processing turntable 2 under the drive of the Y-axis linear driver 37. The laser first crosses the outer circle boundary 27 of the annular processing area and enters the processing area. The laser irradiates the surface of the workpiece to achieve grinding and moves toward the inner circle boundary at a preset speed. The surface grinding amount of the workpiece is x2. It should be noted that in order to improve the processing efficiency, when the laser emitted by the first laser grinding structure 4 enters the annular processing area, the laser emitted by the second laser grinding structure 40 can immediately follow and enter the annular processing area. The moving speed of the first laser grinding structure 4 should be greater than or equal to the moving speed of the second laser grinding structure 40. The method of synchronously processing all workpieces by the second laser grinding structure 40 is the same as the method of synchronously processing all workpieces by the first laser grinding structure 4, which will not be repeated here.

[0078] S7: When the first laser grinding structure 4 emits a laser that crosses the inner circle boundary, the first laser grinding structure 4 stops emitting laser until the second laser grinding structure 40 emits a laser that crosses the inner circle boundary. The first Z-axis linear driver 36 drives the first laser grinding structure 4 to rise to a set height. The first laser grinding structure 4 emits a laser again and moves laterally away from the central axis of the processing turntable 2. The laser first crosses the inner circle boundary 26 and enters the circular processing area. The laser is irradiated on the surface of the workpiece to achieve grinding and moves toward the outer circle boundary 27 at a preset speed. The surface grinding amount of the workpiece is x3.

[0079] S8: The second Z-axis linear drive 38 drives the second laser grinding structure 40 to rise to the set height. The second laser grinding structure 40 emits laser again and moves laterally away from the central axis of the processing turntable 2. The laser first crosses the inner circle boundary 26 and enters the circular processing area. The laser is irradiated on the surface of the workpiece to achieve grinding and moves toward the outer circle boundary 27 at a preset speed. The surface grinding amount of the workpiece is x4. S9: When the laser emitted by the first laser grinding structure 4 crosses the outer circle boundary 27, the first laser grinding structure 4 stops laser emission and resets to the initial position; when the laser emitted by the second laser grinding structure 40 crosses the outer circle boundary 27, the second laser grinding structure 40 stops laser emission and resets to the initial position, and the total grinding amount of the workpiece X=x1+x2+x3+x4, x1>0.1mm, x2>0.1mm, x3<0.1mm, x4<0.1mm, the grinding amount of x1 and x2 is greater than the grinding amount of x3 and x4. Since the grinding amount of x3 and x4 is smaller, the surface of the workpiece is smoother, so that the flatness of the processed surface is higher. It should be noted that, since the focal length of the laser is fixed, the first laser grinding structure and the second laser grinding structure can adjust the height of the first laser grinding structure 4 by the first Z-axis linear drive 36, and adjust the height of the second laser grinding structure 40 by the second Z-axis linear drive 38 while keeping the angles unchanged, thereby controlling the height of the corresponding laser head relative to the workpiece and changing the laser grinding amount.

[0080] To sum up, the laser processing of the first laser grinding structure 4 and the second laser grinding structure 40 do not interfere with each other, and the processing is synchronized in a coordinated manner, and the workpiece is cleverly ground a second time during the reset return stroke without any unnecessary moving routes, thereby greatly improving the grinding efficiency and making the surface of the workpiece smoother and flatter.

[0081] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0082] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0083] It is understandable that those skilled in the art can make equivalent substitutions or changes based on the technical solution and inventive concept of the present invention, and all these changes or substitutions should fall within the protection scope of the present invention.

Claims

1. Laser grinding machine, characterized in that, It includes a base frame, a base plate arranged on the base frame, a processing turntable arranged on the base plate, a first column and a second column arranged vertically on the base plate, a crossbeam arranged across the top of the first column and the second column, a longitudinal beam arranged on the top of the second column, an X-axis linear drive arranged on the crossbeam, a first Z-axis linear drive arranged on the X-axis linear drive, a first laser grinding structure arranged on the first Z-axis linear drive, a Y-axis linear drive arranged on the longitudinal beam, a second Z-axis linear drive arranged on the Y-axis linear drive, a second laser grinding structure arranged on the second Z-axis linear drive, and a peripheral plate structure arranged on the base frame; The first laser grinding structure is located in front of the second laser grinding structure, the processing turntable is used to clamp multiple workpieces and drive the multiple workpieces to rotate synchronously, the first laser grinding structure and the second laser grinding structure are used to emit lasers to process the workpieces on the processing turntable; the peripheral plate structure includes a front panel, a rear panel, a left panel, a right panel, an upper panel, a front door body arranged on the front panel, a left door body arranged on the left panel, a right door body arranged on the right panel, and a rear door body arranged on the rear panel; a dust suction pipe interface is arranged on the rear panel; an inner protective shell is arranged on the chassis below the cross beam, the interior of the inner protective shell and the peripheral plate structure enclose a T-shaped processing area, the T-shaped processing area includes a transverse movement area for the first laser grinding structure to move horizontally and a longitudinal movement area for the second laser grinding structure to move vertically, the processing turntable is located in the transverse movement area and in front of the longitudinal movement area, and the T-shaped processing area is exhausted and dusted by the dust suction structure.

2. The laser grinding machine according to claim 1, characterized in that: The inner protective shell includes a front shell and a rear shell, the front shell is located in front of the first column and the second column, the rear shell is located between the first column and the second column, the top of the front shell is provided with a front avoidance opening for avoiding the lateral movement of the first laser grinding structure, the first laser grinding structure cooperates with the first follow-up enclosure structure to enclose the front avoidance opening, the top of the rear shell is provided with a rear avoidance opening for avoiding the longitudinal movement of the second laser grinding structure, the second laser grinding structure cooperates with the second follow-up enclosure structure to enclose the rear avoidance opening.

3. The laser grinding machine according to claim 2, characterized in that: The first follow-up enclosure structure includes a first accordion cover, a second accordion cover, and a front slide arranged on the top of the front shell body and movable along the extension direction of the front avoidance opening. One end of the front avoidance opening is connected to the front slide through the first accordion cover, and the other end of the front avoidance opening is connected to the front slide through the second accordion cover. The front slide is provided with a first opening for the support arm of the first laser grinding structure to pass through.

4. The laser grinding machine according to claim 3, characterized in that: The front slide comprises a front cover plate and a front tray arranged at the bottom of the front cover plate, the first opening is arranged on the front cover plate, a first square opening is arranged on the front tray, and each edge of the first square opening is provided with a boosting assembly.

5. The laser grinding machine according to claim 4, characterized in that: Each boosting assembly comprises a support and two rollers rotatably arranged at two ends of the support.

6. The laser grinding machine according to claim 5, characterized in that: The front housing is provided with two transversely extending front guide rails, and the front slide is slidably connected to the front guide rails via slide blocks.

7. The laser grinding machine according to claim 2, characterized in that: The dust suction structure comprises a dust suction port arranged on the inner protective shell, the dust suction port is arranged in the longitudinal movement area and faces the transverse movement area, and the dust suction port is connected to the dust suction main pipe.

8. The laser grinding machine according to claim 1, characterized in that: The front door body, the left door body, the right door body and the rear door body are all connected to corresponding panels through hinges, and the front panel, the rear panel, the left panel and the right panel form a square package structure with an opening at the bottom.

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