Pickup device

Abstract

The present invention relates to a pickup device. A plurality of pickups are aligned in a row on a pickup support, each pickup including a main nozzle having a vacuum pressure applied or released to a bottom and a lifting driving device supported by the pickup support to lift the main nozzle. A sub nozzle docking module includes one or more sub nozzles that adsorb or desorb a conveyed article as the vacuum pressure is applied or released to the bottom, a connection carrier that supports the sub nozzle in a state of connection with the main nozzle to transmit the vacuum pressure from the main nozzle to the sub nozzle through a vacuum passage, and a mounting and demounting device that mounts and demounts the connection carrier on the pickup support.

Description

Technical Field

[0001] This invention relates to a pickup device, specifically a pickup device for conveying items such as semiconductor components. Background Technology

[0002] Semiconductor components are typically tested after being manufactured using semiconductor processes and before leaving the factory. Defects inside or on the surface of a semiconductor component's package can have a fatal impact on its performance. Therefore, semiconductor components should undergo various inspections, including checks for electrical characteristics and surface defects.

[0003] The pickup device applies vacuum pressure to a single-row pickup unit to attract semiconductor components, and releases the vacuum pressure to detach them. Since semiconductor components vary in type and size, the trays are also designed to fit various sizes of semiconductor components.

[0004] The spacing of the tray bags for placing semiconductor components will also vary according to the size of the semiconductor components, so the pickup spacing of the pickup device can also be adjusted according to the spacing of the tray bags.

[0005] Furthermore, as related technologies advance, semiconductor components are becoming increasingly smaller to accommodate more electronic devices. Consequently, the spacing between tray bags on a pallet also decreases with the miniaturization of semiconductor components. This means that the number of tray bags in the pickup arrangement may exceed the number of pickups, reducing the transport efficiency of the semiconductor components.

[0006] To address this issue, the pickup can be increased in number according to the arrangement of the tray bags, but its size needs to be adjusted accordingly to reduce the spacing between the tray bags. However, if the pickup size becomes too small, it will affect the adhesion to semiconductor components and make it unable to stably pick up larger semiconductor components. Summary of the Invention

[0007] [Technical problems to be solved]

[0008] The technical problem to be solved by the present invention is how to provide a picking device that can flexibly respond to the placement of items on a pallet.

[0009] Technical solutions to solve technical problems

[0010] To solve the above-mentioned technical problems, the pickup device of the present invention includes a pickup bracket, pickups, and a sub-nozzle docking module. The pickups are arranged in a row on the pickup bracket, with a main nozzle at the bottom for conveying or cutting off vacuum pressure and a lifting drive device supported by the pickup bracket and capable of raising and lowering the main nozzles. The sub-nozzle docking module includes one or more sub-nozzles that convey or cut off vacuum pressure to adsorb or detach items when connected or disconnected from each main nozzle; a connecting carrier that supports the sub-nozzles and docks with the main nozzles, transmitting vacuum pressure to the sub-nozzles through a vacuum channel; and a loading and unloading device for fixing or releasing the connecting carrier to the pickup bracket.

[0011]

Beneficial Effects of the Invention

[0012] According to the present invention, when the spacing between small conveyed items on the tray is less than the main nozzle interval or the spacing between large conveyed items on the tray is greater than the main nozzle interval, the items can be grasped and conveyed simply by replacing the corresponding sub-nozzle docking module. Therefore, it can be flexibly adapted to the spacing situation.

[0013] According to this invention, even if height deviations occur between the main nozzles due to errors in mounting the pickup on the pickup bracket or errors in the pickup itself, the interaction between the clamp and the brake ensures that each main nozzle maintains the same minimum height. As a result, visual inspection can be performed even when the main nozzles are picking up and transporting items, ensuring the accuracy of the inspection results.

[0014] Furthermore, according to the embodiments of the present invention, as long as the height of each card platform and brake is properly managed, the consistency of the minimum height of each main nozzle can be ensured, thus providing convenience for the management of the main nozzle height. Attached Figure Description

[0015] Figure 1 This is a perspective view of the pickup device in an embodiment of the present invention.

[0016] Figure 2 for Figure 1 An exploded perspective view.

[0017] Figure 3 for Figure 1 Cross-sectional view of the pickup.

[0018] Figure 4 for Figure 1 Front cross-sectional view.

[0019] Figure 5 This is a front cross-sectional view of another embodiment of the sub-nozzle docking module.

[0020] Figure 6 for Figure 1 View of the back of the pickup device.

[0021] Figure 7This is a perspective view of a pickup device according to another embodiment of the present invention.

[0022] Figure 8 for Figure 7 Rear perspective view of the pickup device.

[0023] Figure 9 for Figure 7 A perspective view of the pickup and brake.

[0024] Figure 10 This is a cross-sectional view of the pickup.

[0025] Figure 11 for Figure 7 The back view.

[0026] Figure 12 To introduce Figure 11 A diagram illustrating the function of each chuck and brake.

[0027] Figure 13 An illustration showing the inspection performed using a vision inspection device while the pickup is picking up and delivering items. Detailed Implementation

[0028] The present invention will now be described in detail with reference to the accompanying drawings. The same symbols are used for the same structures, and repeated descriptions and detailed explanations of functions and structures that may confuse the key points of the invention are omitted. The embodiments of the present invention are intended to provide a detailed introduction to the invention for those with a moderate level of knowledge in the industry. Therefore, to ensure the effectiveness of the explanation, the shapes and sizes of elements in the drawings may be exaggerated.

[0029] Figure 1 This is a perspective view of the pickup device in an embodiment of the present invention. Figure 2 for Figure 1 An exploded perspective view. Figure 3 for Figure 1 Cross-sectional view of the pickup. Figure 4 for Figure 1 Front cross-sectional view.

[0030] refer to Figures 1 to 4 The pickup device (100) in the embodiments of the present invention includes a pickup bracket (110), a pickup (120) and a sub-nozzle docking module (130).

[0031] A pickup holder (110) supports pickups (120). Each pickup (120) is arranged in a row on the pickup holder (110). Each pickup (120) is arranged in the same orientation and supported by the pickup holder (110). Each pickup (120) includes a main nozzle (121) and a lifting drive (126).

[0032] Vacuum pressure can be applied to or disconnected at the bottom of the main nozzle (121). Vacuum pressure can be applied to or disconnected at the bottom of the main nozzle (121) by a vacuum pressure generating means. The main nozzle (121) can adsorb or detach the transported item (1) when it is separated from the sub-nozzle docking module (130). Here, the transported item (1) can be a semiconductor device placed on a tray (2) for testing.

[0033] A nozzle lifting body (122) is installed on the upper end of the main nozzle (121). The nozzle lifting body (122) is controlled by a lifting drive device (126) to cause the main nozzle (121) to move up and down. The nozzle lifting body (122) is connected to a vacuum pressure generating device and delivers vacuum pressure to the main nozzle (121) through an internal channel.

[0034] The main nozzle (121) can be connected to the nozzle lifting body (122). The main nozzle (121) is easy to replace when the type of the conveyed item (1) changes or when it is damaged. For example, the main nozzle (121) can be connected or disconnected from the nozzle lifting body (122) with one click, which improves the ease of operation.

[0035] The top structure of the main nozzle (121) can be inserted into the bottom of the nozzle lifting body (122). One side of the top of the main nozzle (121) and the bottom of the nozzle lifting body (122) has a fixing protrusion (121a), and the other side has a fixing groove (122a) into which the fixing protrusion (121a) can be inserted and fixed. To prevent leakage of vacuum pressure, a sealing material (123) is used at the insertion point between the top of the main nozzle (121) and the bottom of the nozzle lifting body (122).

[0036] The lifting drive device (126) is supported by the pickup bracket (110) and lifts and lowers the main nozzle (121). Therefore, after the main nozzle (121) is lowered by the lifting drive device (126), it is connected to the connecting support (132) of the sub-nozzle docking module (130), and can be separated from the connecting support (132) when the lifting drive device (126) rises. Moreover, when the main nozzle (121) is separated from the connecting support (132) and directly picks up and places the conveyed item (1), its lifting and lowering can be controlled by the lifting drive device (126).

[0037] The lifting drive device (126) can be lifted and lowered independently from the main nozzle (121). Therefore, the main nozzle (121) can independently pick up and transport the transported item (1) while it is separated from the connecting support (132). The lifting drive device (126) includes a cylinder (127).

[0038] The cylinder (127) can be a reciprocating cylinder. When compressed gas is selectively supplied to the internal space on both sides of the cylinder body (127a) in the reciprocating cylinder through the supply port, the piston rod (127b) can extend and retract the cylinder body (127a).

[0039] The cylinder body (127a) is also supported by the pickup bracket (110) when the piston rod (127b) moves back and forth at the bottom. The piston rod (127b) and the nozzle lifting body (122) are connected by a connecting bracket (128). When the piston rod (127b) moves back and forth, the nozzle lifting body (122) will also move up and down, thereby causing the main nozzle (121) to move up and down.

[0040] To provide a cushioning effect when the main nozzle (121) and the connecting support (132) are connected, a cushioning material (129) is installed in the lifting drive device (126). The cushioning material (129) is an elastic device and is installed between the connecting bracket (128) and the piston rod (127b).

[0041] The sub-nozzle docking module (130) is connected to or separated from each main nozzle (121). The sub-nozzle docking module (130) includes one or more sub-nozzles (131), a connecting carrier (132), and a loading and unloading device (136).

[0042] When a vacuum pressure is applied or disconnected at the bottom of the sub-nozzle (131), it can adsorb or detach the conveyed item (1). The sub-nozzles (131) can be arranged in a smaller interval than the main nozzles (121) according to the arrangement direction of the pickup (120), and in a greater number than the main nozzles (121).

[0043] The trays (2) are arranged in the direction of the pickups (120), with more tray bags (2a) than pickups (120), and the spacing between the tray bags (21) is less than the minimum spacing between the main nozzles (121). This arrangement can accommodate a large number of small semiconductor components transported as items (1). At this time, the number of sub-nozzles (131) should be consistent with the number of tray bags (2a) in the direction of the main nozzles (121), and the spacing should also be consistent with the spacing between the tray bags (2a). Multiple rows of sub-nozzles (131) can be arranged.

[0044] For ease of understanding, the direction of arrangement of the pickups (120) is defined as the X-axis, and the direction perpendicular to the direction of arrangement of the pickups (120) is defined as the Y-axis. The X-axis spacing of the sub-nozzles (131) is consistent with the X-axis spacing of the pallet bag (2a). If there are more than two rows of sub-nozzles (131), the Y-axis spacing of the sub-nozzles (131) is consistent with the Y-axis spacing of the pallet bag (2a).

[0045] Therefore, each sub-nozzle (131) corresponds one-to-one with a small conveyor item (1) arranged on the tray (2) at a spacing smaller than the minimum interval of the main nozzle (121), and a row of small conveyor items (1) can be picked up and conveyed at one time. When the sub-nozzle (131) rises and falls, its main body (131a) is equipped with a tip (131b) at the bottom, and the tip (131b) is subjected to the downward elastic force of the spring (131c). Therefore, the sub-nozzle (131) can act as a buffer when it picks up the conveyor item (1).

[0046] The connecting support (132) supports the connection between the bottom sub-nozzle (131) and the main nozzle (121). The vacuum pressure output by the main nozzle (121) is transmitted to the sub-nozzle (131) through the vacuum channel (134). The bottom outlet of the connecting support (132) and the top of the sub-nozzle (131) are respectively inserted and fixed. Here, the connection between the connecting support (132) and the sub-nozzle (131) is sealed with a sealing material to prevent air pressure leakage.

[0047] The top inlet of the connecting carrier (132) can be connected to or separated from the bottom of the main nozzle (121). The lifting drive (126) raises the main nozzle (121) to a height higher than the mounting position of the connecting carrier (132). After the loading and unloading device (136) secures the connecting carrier (132) to the pickup bracket (110), each main nozzle (121) descends from its waiting position and is inserted into the inlet of the connecting carrier (132).

[0048] The bottom outer diameter of the main nozzle (121) is smaller than the top outer diameter, allowing it to be inserted into the inlet of the connecting carrier (132). After the inlet of the connecting carrier (132) is inserted into the bottom of the main nozzle (121), it is sealed with packaging material (133a). The packaging material (133c) also provides a cushioning effect when the main nozzle (121) descends and is inserted into the inlet of the connecting carrier (132).

[0049] The vacuum channel (134) connecting the carrier (132) can uniformly transmit the vacuum pressure of the main nozzle (121) to the sub-nozzle (131). The vacuum channel (134) includes an inlet channel (134a) connected to the inlet, an outlet channel (134b) connected to the outlet, and a connecting channel (134c) connecting the inlet channel (134a) and the outlet channel (134b).

[0050] Therefore, the connecting carrier (132) receives vacuum pressure from the main nozzle (121) through the inlet channel (134a) and then uniformly transmits the vacuum pressure through the connecting channel (134c) to each sub-nozzle (131) connected to the outlet channel (134b), ensuring that each sub-nozzle (131) picks up and transmits the item (1) with the same vacuum pressure. In other examples, although not marked on the diagram, the outlet channels (134b) are grouped according to the number of inlet channels (134a), and the connecting channel (134c) connects the designated group of outlet channels (134b) and inlet channels (134a).

[0051] The connecting carrier (132) comprises a carrier body (132a) and a pair of carrier blocks (132b). The carrier body (132a) supports the sub-nozzle (131) at the bottom. The carrier blocks (132b) are connected to both sides of the carrier body (132a) and are loaded and unloaded on the pickup bracket (110) by the loading and unloading device (136). The carrier blocks (132b) are fixed to the carrier body (132a) with bolts. Therefore, when the sub-nozzle docking module (130) needs to replace the sub-nozzle (131), only the carrier body (132a) needs to be replaced.

[0052] The pickup bracket (110) includes support blocks (111) that contact both sides of the connecting carrier (132), i.e., the outer surfaces of the carrier blocks (132b). Thus, the connecting carrier (132) is located in the middle of the support blocks (111), and is provided with stable support by the surface contact between each support block (111) and the carrier block (132b).

[0053] The loading / unloading device (136) loads and unloads the connecting carrier (132) onto the pickup bracket (110). The loading / unloading device (136) includes multiple reference pins (137) and multiple connecting handles (138). The reference pins (137) are protruding parts on the connecting carrier (132), which, after being inserted into the reference slots (112) of the pickup bracket (110), allow the connecting carrier (132) to be arranged according to the reference position of the pickup bracket (110).

[0054] Therefore, the mounting position of the connecting support (132) on the pickup bracket (110) can remain unchanged. The cross-sections of the reference pin (137) and the reference groove (112) can be various shapes such as circular or polygonal. The reference pin (137) is a paired shape, so the reference groove (112) is also a paired structure. In other embodiments, the reference pin (137) can be mounted on the pickup bracket (110), and the reference groove (112) can be mounted on the connecting support (132).

[0055] Each screw connection point (138a) of the connecting handle (138) is fixed to the pickup bracket (110) by a connecting carrier (132), in which the connecting carrier (132) can be installed and removed from the pickup bracket (110). The connecting handle (138) has a circular head (138b) that is coaxially fixed with the screw connection point (138a). The outer periphery of the circular head (138b) is an anti-slip part (138c).

[0056] The operator grasps the circular head (138b) around its perimeter and rotates it using the anti-slip feature (138c). The anti-slip feature (138c) has a textured surface. A wrench groove (138d) is located in the center of the circular head (138b), and the wrench groove (138d) is hexagonal in shape.

[0057] Therefore, when the operator installs the connecting support (132) on the pickup bracket (110), he grasps the anti-slip part (138c) of the round head (138b) and rotates the round head (138b) to temporarily fix the screw connection part (138a) to the pickup bracket (110). Then, he inserts the wrench bar into the wrench slot (138d) and rotates it to firmly fix the screw connection part (138a) on the pickup bracket (110).

[0058] When the operator removes the connecting support (132) from the pickup bracket (110), he inserts the wrench into the wrench slot (138d) and rotates it to loosen the screw connection (138a) from the pickup bracket (110). Then, he grasps the anti-slip part (138c) of the round head (138b) and rotates the round head (138b) to remove the screw connection (138a) from the pickup bracket (110).

[0059] As different embodiments, such as Figure 5 The sub-nozzles (231) of the sub-nozzle docking module (230) can be arranged in fewer numbers than the main nozzles (121) according to the arrangement direction of the pickups (120). The trays (2) are arranged in the direction of the pickups (120), with fewer tray bags (2a) than the number of pickups (120), and the spacing between tray bags (21) is greater than the minimum spacing between the main nozzles (121). This allows for the transport of a larger number of large semiconductor components (1).

[0060] At this time, the number of sub-nozzles (231) should be consistent with the number of tray bags (2a) in the direction of the main nozzles (121), and the spacing should also be consistent with the spacing of the tray bags (2a). Sub-nozzles (231) can be arranged in multiple rows. Therefore, sub-nozzles (231) correspond one-to-one with large transport items (1) arranged on the tray (2) at a spacing smaller than the minimum spacing of the main nozzles (121), and one row of large transport items (1) can be picked up and transported at one time.

[0061] The vacuum channel (234) of the connecting carrier (232) can uniformly transmit the vacuum pressure of the main nozzle (121) to the sub-nozzle (231). The vacuum channel (234) includes an inlet channel (234a) connected to the inlet of the connecting carrier (232), an outlet channel (234b) connected to the outlet of the connecting carrier (232), and a connecting channel (234c) connecting the inlet channel (234a) and the outlet channel (234b).

[0062] Therefore, the connecting carrier (232) receives vacuum pressure from the main nozzle (121) through the inlet channel (234a) and then uniformly transmits the vacuum pressure through the connecting channel (234c) to each sub-nozzle (231) connected to the outlet channel (234b), ensuring that each sub-nozzle (231) picks up and transmits the item (1) with the same vacuum pressure. In other examples, although not marked on the diagram, the outlet channels (234b) are grouped according to the number of inlet channels (234a), and the connecting channel (234c) connects the designated group of outlet channels (234b) and inlet channels (234a).

[0063] In this embodiment, the picking device (100) does not need to change the structure of the main nozzle (121) when the spacing between small conveyed items (1) on the tray (2) is less than the spacing between the main nozzles (121) or the spacing between large conveyed items on the tray (2) is greater than the spacing between the main nozzles (121). It can pick up and convey items (1) simply by replacing the corresponding sub-nozzle docking modules (130, 230). Therefore, the picking device (100) in this embodiment can flexibly respond to the placement of conveyed items (1) on the tray (2).

[0064] In addition, according to Figure 1 , Figure 2 and Figure 6 The pickup device (100) includes a distance variable device (150) that allows adjustment of the distance between the pickup (120) and the sub-nozzle docking module (130) when they are separated. The distance variable device (150) can adjust the distance between the main nozzles (121) according to the distance between the transported items (1), such as the distance between semiconductor components on the tray (2). The distance variable device (150) includes multiple variable moving bodies (151), a hinge connector (152), and a connection actuator (153).

[0065] The variable moving bodies (151) are spaced apart and fixed to different pickups (120). The variable moving bodies (151) can be connected to corresponding lifting drive devices (126). The variable moving bodies (151) can slide horizontally on the pickup bracket (110) in the direction of the pickups (120) using linear guide rails (151a).

[0066] The hinge connector (152) includes a plurality of first connecting parts (152a) joined in a zigzag hinge pattern and a second connecting part (152b) hinged at a symmetrically intersecting central portion of the first connecting parts (152a). The central hinged joint of the first connecting parts (152a) and the second connecting parts (152b) can be fixed to a movable body (151).

[0067] The hinge connector (152) tightens or opens the central hinge joint of the first connecting part (152a) and the second connecting part (152b) by folding the hinge joint of the first connecting part (152a) and the second connecting part (152b) in a folding manner, so as to adjust the distance between the pickups (120) and thus the distance between the main nozzles (121).

[0068] The connecting actuator (153) has a foldable hinge connector (152). The connecting actuator (153) includes a pair of horizontal moving parts (154), a horizontal thread (155), and a rotary motor (156).

[0069] The horizontal moving body (154) is fixed to the two outermost variable moving bodies (151). The horizontal thread (155) is mounted on the pickup bracket (110) according to the arrangement direction of the pickups (120) and is rotatable. The horizontal thread (155) is fixed to the horizontal moving body (154) with screws. The horizontal thread (155) can be pulled closer to or pulled apart from the horizontal moving body (154) according to the direction of rotation to fold the hinge connector (152).

[0070] A rotary motor (156) provides forward and reverse rotational forces to a horizontal thread (155). The rotary motor (156) transmits these forces to the horizontal thread (155) via a transmission (157). The transmission (157) includes a drive wheel coaxially fixed to the rotary motor (156), a driven wheel coaxially fixed to the horizontal thread (155), and a conveyor belt that transmits the rotation of the drive wheel to the driven wheel. The variable distance device (150) can employ various common structures.

[0071] Not shown in the diagram, but the pickup device (100) can raise and lower the pickup (120) via a pickup lifting device, thereby adjusting the height of the pickup (120). The pickup lifting device can raise and lower the main nozzle (121) by raising and lowering the pickup bracket (110). The pickup lifting device includes a universal linear actuator.

[0072] Furthermore, the pickup device (100) can horizontally reciprocate the pickups (120) according to their arrangement via a pickup horizontal movement device. The pickup horizontal movement device horizontally moves the main nozzle (121) via a horizontally reciprocating pickup lifting device. The pickup horizontal movement device includes a universal linear actuator.

[0073] Figure 7 This is a perspective view of a pickup device according to another embodiment of the present invention. Figure 8 for Figure 7 Rear perspective view of the pickup device. Figure 9 for Figure 7 A perspective view of the pickup and brake. Figure 10 This is a cross-sectional view of the pickup. Figure 11 for Figure 7 The back view. Figure 12 To introduce Figure 11 A diagram illustrating the function of each chuck and brake.

[0074] refer to Figures 7 to 12 The pickup device (300) in the embodiments of the present invention includes a pickup bracket (310), a plurality of pickups (320), a plurality of card holders (330) and a brake (340).

[0075] The pickup holder (310) supports the pickups (320). The pickups (320) are arranged in the same row and supported by the pickup holder (310). Each pickup (320) includes a main nozzle (321) and a lifting drive (326).

[0076] The bottom of the main nozzle (321) can adsorb or detach the conveyed item (1). When the main nozzle (321) receives negative pressure from the air pressure supply device, it can adsorb the conveyed item (1), and when it receives positive pressure, it can detach the conveyed item (1).

[0077] A nozzle lifting body (322) is installed on the upper end of the main nozzle (321). The nozzle lifting body (322) is controlled by a lifting drive device (326) to cause the main nozzle (321) to move up and down. The nozzle lifting body (322) is connected to a vacuum pressure generating device. After receiving negative or positive pressure, it can deliver vacuum pressure to the main nozzle (321) through an internal channel.

[0078] The lifting drive device (326) is supported by the pickup bracket (310) and raises and lowers the main nozzle (321). Therefore, the lifting drive device (326) can control the raising and lowering of the main nozzle (321) when it picks up and puts down the conveyed item (1). Therefore, the lifting drive device (326) controls the lowering of the main nozzle (321) when it is picking up the conveyed item (1), and the conveyed item (1) can be detected under the condition that the chuck (330) and the brake (340) control the minimum height. The lifting drive device (326) can raise and lower the main nozzle (321) independently. Each main nozzle (321) can independently pick up and convey the item (1). The lifting drive device (326) includes a cylinder (327).

[0079] The cylinder (327) can be a reciprocating cylinder. When compressed gas is selectively supplied to the internal space on both sides of the cylinder body (327a) in the reciprocating cylinder through the supply port, the piston rod (327b) can extend and retract the cylinder body (327a).

[0080] The cylinder body (327a) is also supported by the pickup bracket (310) when the piston rod (327b) extends and retracts at the bottom. One side of the cylinder body (327a) can be supported by a nozzle lifting body (322) that extends vertically. The piston rod (327b) and the nozzle lifting body (322) are connected by a connecting bracket (328). During the extension and retraction movement, the nozzle lifting body (322) also rises and falls, thereby causing the main nozzle (321) to rise and fall.

[0081] To provide a buffering effect when the platform (330) and brake (340) collide, a buffer material (329) is installed in the lifting drive device (326). The connecting bracket (328) is fixed to the nozzle lifting body (322), and the buffer material (329) during the lifting of the piston rod (327b) is an elastic device installed between the connecting bracket (328) and the piston rod (327b).

[0082] In other embodiments, when the connecting bracket (328) is fixed to the piston rod (327b) and the nozzle lifting body (322) is raised or lowered, the buffer material (329) provides an elastic buffering effect between the connecting bracket (328) and the nozzle lifting body (322). The buffer material (329) is made of materials such as helical springs.

[0083] The height of the clamp (330) is the same as that of the main nozzle (321). The clamp (330) protrudes in the same direction from all sides of the main nozzle (321). The clamp (330) controls the main nozzle (321) to stop at the brake (340) position when it descends, so the brake (340) can be used to limit the minimum height of the main nozzle (321).

[0084] The bottom of the clamp (330) is flush with the horizontal plane, thus ensuring good contact with the top of the brake (340). The connection area between the clamp (330) and the main nozzle (321) is relatively large, allowing for a more secure fixation. The clamp (330) can be integrated with the main nozzle (321) or manufactured separately and assembled together with the main nozzle (321).

[0085] The brake (340) is mounted on the pickup bracket (310). When the lifting drive device (326) operates the main nozzle (321) to descend, the clamp (330) brakes the main nozzle (321) from below, ensuring that the minimum height of all main nozzles is consistent. The brake (340) is arranged horizontally in the direction of the main nozzle (321) and fixed on both sides to the pickup bracket (310), and can brake the main nozzle (321) and the clamp (330).

[0086] The top of the brake (340) remains horizontal and flat, and the chuck (330) can stop at the same height. Therefore, the top of the brake (340) is the standard for limiting the minimum height of the main nozzle (321).

[0087] The brake (340) is made of metal to prevent deformation when pressure is applied by the chuck (330). In the embodiment, the cross-sectional area of ​​the central part of the brake (340) is uniform along all lengths, but a structure that gradually widens from the two edges to the center can also be used to ensure its rigidity. The two sides of the brake (340) are bolted to the pickup bracket (310) for easy replacement.

[0088] According to this embodiment, even if there is an error when installing the pickup (320) on the pickup bracket (310) or if the pickup (320) itself has an error, resulting in a height deviation between the main nozzles (321), the interaction between the mounting platform (330) and the brake (340) can ensure that each main nozzle (321) maintains the same minimum height. Furthermore, according to this embodiment, as long as the height management of each mounting platform (330) and the brake (340) is properly managed, the consistency of the minimum height of each main nozzle (321) can be ensured, thus providing convenience for the height management of the main nozzles (321).

[0089] In other embodiments, the pickup device (300) includes a distance variable device (350) that adjusts the distance between the pickups (320), similar to the embodiments described above. The distance variable device (350) includes a plurality of variable moving bodies (351), a hinge connector (352), and a connection actuator (353). The variable moving bodies (351) are fixed to each lifting drive device (326) via pickup brackets (320a).

[0090] The hinge connector (352) includes a plurality of first connecting parts (352a) joined in a zigzag hinge and a second connecting part (352b) joined at the symmetrically intersecting central portion of the first connecting parts (352a).

[0091] The connecting actuator (353) includes a pair of horizontal moving bodies (354), a horizontal thread (355), and a rotary motor (356). The rotary motor (356) transmits rotational forces in both directions to the horizontal thread (355) via a transmission (357).

[0092] Not marked in the diagram, but the pickup device (300) can raise and lower the pickup (320) via the pickup lifting device, thereby adjusting the height of the pickup (320). The pickup lifting device can raise and lower the main nozzle (321) by raising and lowering the pickup bracket (310).

[0093] Furthermore, the pickup device (300) can horizontally reciprocate the pickup (320) according to its arrangement via the pickup horizontal moving device. The pickup horizontal moving device horizontally moves the main nozzle (321) by means of the horizontally reciprocating pickup lifting device.

[0094] Regarding the function of the aforementioned pickup device (300), please refer to... Figure 13 The specific explanation is as follows.

[0095] like Figure 13 As shown, each pickup (320) descends from above the tray (2) under the action of the pickup lifting device and the lifting drive device (326) to pick up the transport item (1) in the tray (2), such as a semiconductor component, and place it into the main nozzle (321). During this process, the chuck (330) of the main nozzle (321) stops under the action of the brake (340), so the minimum height of each main nozzle (321) is the same.

[0096] In this state, the pickup (320) has been sent to the vision inspection instrument (3) by the pickup horizontal movement device. The main nozzle (321) picks up the semiconductor components and they are all at the same minimum height. The vision inspection instrument (3) then performs the inspection. At this time, the imaging position of the vision inspection instrument (3) on the semiconductor components is at the same height, so high-definition imaging can be performed. The result can accurately detect the semiconductor components.

[0097] Although the present invention is described using the accompanying drawings as examples, these are merely illustrative, and those skilled in the art will understand that the invention has various other modifications or equivalent embodiments. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A pickup device, comprising: Pickup holder; The main nozzles, which are arranged in a row on the aforementioned pickup bracket, apply or disconnect vacuum pressure at the bottom; Multiple pickups, which are supported by the pickup bracket and whose main nozzle is moved up and down by a lifting drive device; as well as The sub-nozzle docking module includes one or more sub-nozzles, a connecting support, and a loading / unloading device. When the sub-nozzles are connected to or separated from the main nozzle, they utilize the application or disconnection of bottom vacuum pressure to adsorb or detach items for transport. The connecting support supports the bottom sub-nozzles and is connected to multiple main nozzles, transmitting vacuum pressure from the main nozzles to the sub-nozzles via a vacuum channel. The loading / unloading device loads and unloads the connecting support on the pickup bracket. The main nozzle can adsorb or detach and convey items when it is separated from the sub-nozzle docking module. The vacuum channel of the connecting carrier includes an inlet channel extending from the inlet, an outlet channel extending from the outlet, and a connecting channel that allows communication between all the inlet channels and the outlet channels, such that the vacuum pressure supplied from the main nozzle through the inlet channel is evenly distributed to the outlet channel and transmitted to the sub-nozzle through the connecting channel.

2. The pickup device according to claim 1, characterized in that, The sub-nozzles are arranged in the pickup direction at a smaller interval than the main nozzle interval and in a greater number than the main nozzle. The vacuum channel of the aforementioned connecting support member uniformly transmits the vacuum pressure of the main nozzle to the sub-nozzle.

3. The pickup device according to claim 1, characterized in that, The sub-nozzles are arranged in the pickup direction at a greater interval than the main nozzle interval and in fewer numbers than the main nozzle; The vacuum channel of the aforementioned connecting support member uniformly transmits the vacuum pressure of the main nozzle to the sub-nozzle.

4. The pickup device according to claim 1, characterized in that, The aforementioned loading and unloading equipment includes: The protruding portion on the connecting carrier is a plurality of reference pins that, after being inserted into the reference slot of the pickup bracket, arrange the connecting carrier according to the reference position of the pickup bracket, and The connecting handle, each of its screw connection points, is used when it is fixed to or removed from the pickup bracket by screws via the connecting carrier.

5. The pickup device according to claim 1, further comprising: Multiple mounting platforms, which are at the same height as the main nozzle mentioned above; and The brake is mounted on the pickup bracket, and when the plurality of main nozzles descend under the action of the lifting drive device, the plurality of chucks brake the plurality of main nozzles from below to ensure that they all stop at the same minimum height.

6. The pickup device according to claim 5, characterized in that, The aforementioned lifting drive device includes a cylinder.

7. The pickup device according to claim 5, characterized in that, The aforementioned lifting drive device is equipped with a buffer material, which acts as a buffer for the main nozzle when the aforementioned plate stops under the action of the aforementioned brake.

8. The pickup device according to claim 5, characterized in that, The aforementioned pickup includes a distance-adjustable device.

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