A high-density connector structure and test equipment supporting semiconductor testing

Abstract

The present application relates to a high-density connector structure and testing equipment supporting semiconductor testing, including: a board-end connector, which includes a PCB board, and a plurality of first connectors fixed on the PCB board and arranged in a linear array or circumferentially on the PCB board; a line-end connector, which includes a second connector pluggable and unpluggable with the first connector, and a flat cable is connected to the second connector; the second connector has at least two layers of contact springs connected to the first connector in a slot, and each layer of contact springs is pluggable and unpluggable with the first connector in a sequential order. The test signal of the present application is sent out through a signal test board in a test machine, and different test signal mapping sequences can be quickly matched by flexibly defining the arrangement of the flat cable of the line-end connector, and then docking is performed through the first connector and the second connector, which greatly reduces the signal link loss of multiple links compared to the spring pin connection, and improves the signal integrity and reliability of the test machine.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chip testing, and in particular to a high-density connector structure and testing equipment supporting semiconductor testing. Background Art

[0002] Wafer testing is between wafer manufacturing and packaging in the entire chip production process. After wafer production is completed, thousands of unpackaged chips are regularly distributed throughout the wafer. Since dicing and packaging have not yet been performed, the pins of the chips are all exposed. These extremely tiny pins need to be connected to the test machine through finer probes.

[0003] In most cases at present, the probes used in wafer testing are still cantilever probes. The cantilever probes are relatively long and suspended in the air, which makes it very difficult to control signal integrity and the test rate is relatively low, generally 100-400Mbps, making it very difficult to test high-speed data signals. In addition, the direct contact between the probe and the pad also has limitations in electrical characteristics, which can easily cause electrical leakage and loop resistance, and will also have a great impact on the accurate measurement of high-precision data signals.

[0004] The equipment commonly used in wafer testing includes testers, probe stations, and the interface between the testers and probe stations. Finished product testing is the last interception before the chip leaves the factory. The test object is the packaged chip. After wafer testing, it will be packaged, and after packaging, finished product testing will be carried out. Finished product testing requires the use of testers, sorters, and the interfaces between the testers and sorters, Hi-fix and Socket.

[0005] With the development of advanced semiconductor manufacturing processes, the integration and speed of wafer testing and finished product testing are getting higher and higher, which poses higher challenges to test efficiency and test quantity. In existing solutions, the test machine and the object to be tested are mostly connected through spring pins, which are connected through elastic contact between the spring pins and the pads on the surface of the PCB board. In order to ensure that all spring pins are effectively in contact, the elastic pressure of the spring pins needs to be greater than a certain value, such as 30g / pin. In this way, the more spring pins there are, the greater the positive pressure or retention force required between the PCB board and the spring pins, which cannot meet the current increasingly high-density test requirements.

[0006] Moreover, with an increasing number of spring pins, it is impossible to ensure that all of them are reliably connected. In extreme cases, it is easy to cause damage or burn of the spring pins. In addition, the direct contact between the spring pins and the pads also has limitations in the characteristics of electrical equipment, which can easily cause leakage and loop resistance, which will also cause great harm to the precise measurement of high-precision data signals. Summary of the invention

[0007] The embodiments of the present application provide a high-density connector structure and test equipment that support semiconductor testing, so as to solve the problem in the related art that the connection between the test machine and the object under test is mostly through spring pins. The more spring pins there are, the greater the positive pressure or holding force required between the PCB board and the spring pins, which cannot meet the current increasingly high-density testing requirements.

[0008] A first aspect of an embodiment of the present application provides a high-density connector structure supporting semiconductor testing, including:

[0009] A board-end connector, the board-end connector comprising a PCB board, and a plurality of first plug-in components fixed to the PCB board and arranged in a linear array or a circumferential array on the PCB board;

[0010] A line-end connector, the line-end connector comprising a second plug-in connector connected to the first plug-in connector, the second plug-in connector being connected to a flat cable;

[0011] At least two layers of contact springs connected to the first plug-in connector are arranged in the slot of the second plug-in connector, and each layer of contact springs is plug-in-and-unplug-connected to the first plug-in connector in a sequential order.

[0012] In some embodiments: the line end connector further comprises a fixing plate for fixing the second plug-in components, and the second plug-in components are arranged in a linear array or a circumferential array on the fixing plate;

[0013] The second plug-in connector is provided with a mounting hole, and a screw for fixing the second plug-in connector on the fixing plate is loosely fitted in the mounting hole.

[0014] In some embodiments: the notch of the second connector slot is provided with a chamfer or a rounded corner, and the plug of the first connector is provided with a conical guide head.

[0015] In some embodiments: the line end connector also includes a third connector connected to the test machine, and at least two third connectors are provided, and each of the third connectors is connected to the second connector via a flat cable.

[0016] In some embodiments: a rivet plate for fixing the first connector to the PCB is provided on the side wall of the first connector, and a rivet for riveting the first connector to the PCB is provided on the rivet plate.

[0017] In some embodiments: a plurality of asymmetrically arranged riveted plates are disposed on the side wall of the first connector, and the riveted plates between two adjacent first connectors are arranged in a staggered manner along the length direction of the first connector.

[0018] In some embodiments: the PCB board is a circular structure, the first connectors are evenly distributed in a radial circle on the PCB board, and the riveted plate is located on the first connector at an end away from the center of the PCB board.

[0019] In some embodiments: the first connector is welded to a PCB board via pins, and a probe connected to a semiconductor chip to be tested is fixedly provided on the PCB board.

[0020] In some embodiments, the number of the first connectors and the second connectors are 100-200 respectively, and the wires of the flat cable are separated by insulators.

[0021] A second aspect of an embodiment of the present application provides a test device supporting semiconductor testing, including a high-density connector structure supporting semiconductor testing described in any of the above embodiments.

[0022] The beneficial effects of the technical solution provided by this application include:

[0023] The embodiment of the present application provides a high-density connector structure and testing equipment that support semiconductor testing. Since the high-density connector structure of the present application is provided with a board-end connector, the board-end connector includes a PCB board, and a plurality of first connectors fixed on the PCB board and arranged in a linear array or a circular array on the PCB board; a line-end connector, the line-end connector includes a second connector that is pluggable connected to the first connector, and the second connector is connected to a flat cable; at least two layers of contact springs connected to the first connector are provided in the slot of the second connector, and each layer of contact springs is pluggable connected to the first connector in a sequential order.

[0024] Therefore, the high-density connector structure of the present application has a plurality of first connectors arranged in a linear array or a circumference on the PCB board of the board-end connector, and a second connector connected to the first connector on the line-end connector, and a flat cable is connected to the second connector. The test signal is sent out through the signal test board in the test machine, and different test signal mapping sequences can be quickly matched by flexibly defining the arrangement of the flat cable of the line-end connector, and then docked through the first connector and the second connector, which greatly reduces the signal link loss of multiple links compared to the spring pin connection, and improves the signal integrity and reliability of the test machine.

[0025] The high-density connector structure of the present application has at least two layers of contact springs connected to the first plug-in connector in the slot of the second plug-in connector, and each layer of contact springs is plugged and unplugged with the first plug-in connector in a sequential order. When a plurality of first plug-ins and a plurality of second plug-ins are docked, it is avoided that all the contact springs of the second plug-ins contact the first plug-in connector at the same time, which reduces the contact resistance and friction, thereby realizing a low plug-in force structural connection, ensuring a small overall plug-in force when the whole machine interface is connected as a whole, and ensuring the reliability of the connection.

[0026] The line-end connector of the high-density connector structure of the present application also includes a fixing plate for fixing the second connector, and the second connector is arranged in a linear array or a circumferential array on the fixing plate; the second connector is provided with a mounting hole, and the clearance in the mounting hole is matched with a screw that fixes the second connector to the fixing plate. The notch of the second connector slot is provided with a chamfer or a rounded corner, and the plug of the first connector is provided with a conical guide head. When the first connector and several second connectors are docked, the second connector is adaptively aligned under the guidance of the conical guide head and the notch of the second connector slot. In actual application, it can ensure that up to 100-200 groups of first connectors and second connectors are accurately and reliably docked at the same time.

[0027] The line-end connector of the high-density connector structure of the present application also includes a third connector connected to the test machine. There are at least two third connectors, and each of the third connectors is connected to the second connector through a flat cable. The line-end connector is composed of a flat cable and a second connector and a third connector located at both ends of the flat cable. The second connector is used to connect with the first connector, and the third connector is used to connect with the test machine. There are at least two third connectors, and different test signals can be connected by adjusting the plugging position of the third connector and the test machine.

[0028] The side wall of the first connector of the high-density connector structure of the present application is provided with a riveting plate for fixing the first connector to the PCB board, and the riveting plate is provided with rivets for riveting the first connector to the PCB board. In practical applications, wafer testing and finished product testing both have harsh environmental tests at high or low temperatures, and traditional connectors are difficult to replace and maintain by welding or crimping. The first connector of the present application is installed with the PCB board by a rivet mechanical structure, which has a simple structure installation and strong replacement and maintainability.

[0029] The side wall of the first connector of the high-density connector structure of the present application is provided with a plurality of asymmetrically arranged riveted plates, and the riveted plates between two adjacent first connectors are arranged in a staggered manner along the length direction of the first connector. The area available for the first connector on the PCB is limited, and the riveted plates are designed to be arranged in an asymmetrical structure, which can ensure that all contact springs of the first connector are reliably electrically connected after the first connector is riveted; at the same time, a avoidance structure can be formed when the first connector is regularly arranged horizontally or vertically and arranged in a circle, and the area per unit area can increase the arrangement density of the first connector, effectively increasing the test density. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 This is a schematic diagram of the structure of an embodiment of the present application;

[0032] Figure 2 This is a schematic diagram of a first connector and a second connector after being plugged into each other according to an embodiment of the present application;

[0033] Figure 3 This is a schematic diagram of a first connector and a second connector before being plugged into each other according to an embodiment of the present application;

[0034] Figure 4 This is a schematic diagram of the connection between the first connector and the PCB board in an embodiment of the present application;

[0035] Figure 5 A schematic diagram of the arrangement of a plurality of first connectors according to an embodiment of the present application;

[0036] Figure 6 This is a schematic diagram of the structure of a linear array of first connectors on a PCB board according to an embodiment of the present application;

[0037] Figure 7 This is a schematic diagram of the structure in which the first connectors of the embodiment of the present application are arranged circumferentially on the linear surface of the PCB board;

[0038] Figure 8 A structural cross-sectional view of a second connector according to an embodiment of the present application;

[0039] Fig. 9 This is a structural cross-sectional view of the first connector according to an embodiment of the present application.

[0040] Reference numerals:

[0041] 1. Board-end connector; 2. Line-end connector; 3. Tester; 11. First connector; 12. PCB board; 13. Plug; 14. Rivet; 15. Riveted plate; 21. Flex cable; 22. Second connector; 23. Third connector; 24. Contact spring; 25. Screw; 26. Slot; 27. Chamfer. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0043] The embodiment of the present application provides a high-density connector structure that supports semiconductor testing, which can solve the problem in the related art that the test machine and the object under test are mostly connected through spring pins. The more spring pins there are, the greater the positive pressure or holding force required between the PCB board and the spring pins, which cannot meet the current increasingly high-density testing requirements.

[0044] See also Figures 1 to 3 As shown, an embodiment of the present application provides a high-density connector structure supporting semiconductor testing, including:

[0045] A board-end connector 1 includes a PCB board 12, and a plurality of first connectors 11 fixed on the PCB board 12 and arranged in a linear array or a circumferential array on the PCB board 12. The first connector 11 is welded to the PCB board 12 through a pin, and a probe connected to the semiconductor chip to be tested is fixed on the PCB board 12. A line-end connector 2 includes a second connector 22 pluggable and connected to the first connector 11, and a flat cable 21 is connected to the second connector 22. The wires of the flat cable 21 are separated by an insulator to avoid signal interference between the wires. At least two layers of contact springs 24 connected to the first connector 11 are arranged in the slot 26 of the second connector 22. Each layer of the contact springs 24 is pluggable and connected to the first connector 11 in a sequence, and each layer of the contact springs 24 is connected to the wires of the flat cable 21.

[0046] The high-density connector structure of the embodiment of the present application has a plurality of first connectors 11 arranged in a linear array or a circumference on the PCB board 12 of the board-side connector 1, and a second connector 22 is provided on the line-side connector 2 to be plugged in and out of the first connector 11, and a flat cable 21 is connected to the second connector 22. The test signal is sent out through the signal test board in the test machine 3, and different test signal mapping sequences can be quickly matched by flexibly defining the arrangement of the flat cable 21 of the line-side connector 2, and then docking is performed through the first connector 11 and the second connector 22, which greatly reduces the signal link loss of multiple links compared to the spring pin connection, and improves the signal integrity and reliability of the test machine 3.

[0047] The high-density connector structure of the embodiment of the present application is provided with at least two layers of contact springs 24 connected to the first plug connector 11 in the slot 26 of the second plug connector 22. The contact springs 24 of each layer are plug-in-connected with the first plug connector 11 in a sequential order, and the contact springs 24 located in the upper layer first contact the first plug connector 11. When a plurality of first plug connectors 11 and a plurality of second plug connectors 22 are docked, it is avoided that all the contact springs 24 of the second plug connector 22 contact the first plug connector 11 at the same time, which reduces the docking contact resistance and friction, thereby realizing a low plug-in force structural connection, ensuring that the overall plug-in force is small when the whole machine interface is connected as a whole, and ensuring the reliability of the connection.

[0048] In some alternative embodiments: See Figure 2 , Figures 5 to 8 As shown, an embodiment of the present application provides a high-density connector structure that supports semiconductor testing. The line-end connector 2 of the high-density connector structure also includes a fixing plate (not shown) for fixing the second connector 22, and the second connector 22 is arranged in a linear array or a circumferential array on the fixing plate. The number of the first connector 11 and the second connector 22 is 100-200 respectively. A mounting hole is provided on the second connector 22, and a screw 25 for fixing the second connector 22 on the fixing plate is provided in the gap in the mounting hole. The notch of the slot 26 of the second connector 22 is provided with a chamfer 27 or a fillet, and the plug 13 of the first connector 11 is provided with a conical guide head. The conical guide head and the chamfer 27 or the fillet provide guidance, so as to facilitate the one-time insertion of the plug 13 of the first connector 11 into the slot 26 of the second connector 22.

[0049] The line-end connector 2 of the high-density connector structure of the embodiment of the present application also includes a fixing plate for fixing the second connector 22, and the second connector 22 is arranged in a linear array or a circumferential array on the fixing plate; the second connector 22 is provided with a mounting hole, and the clearance in the mounting hole is matched with a screw 25 for fixing the second connector 22 on the fixing plate. The notch of the slot 26 of the second connector 22 is provided with a chamfer 27 or a rounded corner, and the plug 13 of the first connector 11 is provided with a conical guide head. When a plurality of first connectors 11 and a plurality of second connectors 22 are docked, the second connector 22 is adaptively aligned under the guidance of the conical guide head and the notch of the slot 26 of the second connector 22. In actual applications, it can ensure that up to 100-200 groups of first connectors 11 and second connectors 22 are accurately and reliably docked at the same time.

[0050] In some alternative embodiments: See Figure 1 As shown, the embodiment of the present application provides a high-density connector structure supporting semiconductor testing. The line-end connector 2 of the high-density connector structure also includes a third connector 23 connected to the tester 3. There are at least two third connectors 23, and each of the third connectors 23 is connected to the second connector 22 through the flat cable 21. The line-end connector 2 is composed of the flat cable 21 and the second connector 22 and the third connector 23 located at both ends of the flat cable 21. The second connector 22 is used to connect with the first connector 11, and the third connector 23 is used to connect with the tester 3. There are at least two third connectors 23, and different test signals can be connected by adjusting the plugging position of the third connector 23 and the tester 3.

[0051] In some alternative embodiments: See Figure 4 , Figure 5 and Fig. 9 As shown, an embodiment of the present application provides a high-density connector structure that supports semiconductor testing, and a rivet plate 15 for fixing the first connector 11 on a PCB board 12 is provided on the side wall of the first connector 11 of the high-density connector structure, and a rivet 14 for riveting the first connector 11 to the PCB board 12 is provided on the rivet plate 15. The first connector 11 of the high-density connector structure of the embodiment of the present application is riveted to the PCB board 12 by the rivet 14. In practical applications, both wafer testing and finished product testing have harsh environmental tests at high or low temperatures, and traditional connectors are difficult to replace and maintain by welding or crimping. The first connector 11 and the PCB board 12 of the embodiment of the present application are mechanically installed by rivets 14, and the structure is simple to install, and replacement and maintainability are strong.

[0052] In some alternative embodiments: See Figure 4 and Figure 5As shown, the embodiment of the present application provides a high-density connector structure supporting semiconductor testing, wherein a plurality of asymmetrically arranged riveted plates 15 are provided on the side wall of the first connector 11 of the high-density connector structure, and the riveted plates 15 between two adjacent first connectors 11 are arranged in a staggered interval along the length direction of the first connector 11. The riveted plates 15 on the side wall of the first connector of the high-density connector structure of the present application are arranged in a staggered interval along the length direction of the first connector 11. The area available for the arrangement of the first connector 11 on the PCB board 12 is limited, and the design position of the riveted plates 15 is arranged in an asymmetrical structure, which can ensure that all the contact springs 24 of the first connector 11 are reliably electrically connected after the first connector 11 is riveted; at the same time, a avoidance structure can be formed when the first connector 11 is regularly arranged horizontally or vertically and arranged circumferentially, and the area per unit area can increase the arrangement density of the first connector 11, effectively improving the test density.

[0053] In some alternative embodiments: See Figures 5 to 7 As shown, the embodiment of the present application provides a high-density connector structure supporting semiconductor testing, wherein the PCB board 12 of the high-density connector structure is a circular structure, the first connectors 11 are evenly arranged on the PCB board 12 in a radial circumferential pattern, and the rivet plate 15 is located on the first connector 11 at an end away from the center of the PCB board 12. The rivet plate 15 of the first connector 11 of the embodiment of the present application is located on the first connector 11 at an end away from the center of the PCB board 12, and as few rivets 14 as possible are provided at the other end of the first connector 11. When the PCB board 12 is arranged, the PCB signal lines are all concentrated toward the center of the circle, thereby reducing the impact on the internal signal path of the PCB board 12 and reducing the cost of hardware equipment.

[0054] A second aspect of an embodiment of the present application provides a test device supporting semiconductor testing, wherein the test device includes a high-density connector structure supporting semiconductor testing as described in any of the above embodiments.

[0055] How it works

[0056] The embodiment of the present application provides a high-density connector structure and testing equipment that support semiconductor testing. Since the high-density connector structure of the present application is provided with a board-end connector 1, the board-end connector 1 includes a PCB board 12, and a plurality of first connectors 11 fixed on the PCB board 12 and arranged in a linear array or a circle on the PCB board 12; a line-end connector 2, the line-end connector 2 includes a second connector 22 that is plugged in and out of the first connector 11, and a flat cable 21 is connected to the second connector 22; at least two layers of contact springs 24 connected to the first connector 11 are provided in the slot of the second connector 22, and each layer of contact springs 24 is plugged in and out of the first connector 11 in a sequential order.

[0057] Therefore, the high-density connector structure of the present application has a plurality of first connectors 11 arranged in a linear array or in a circumferential manner on the PCB board 12 of the board-side connector 1, and a second connector 22 is provided on the line-side connector 2 to be plugged in and out of the first connector 11, and a flat cable 21 is connected to the second connector 22. The test signal is sent out through the signal test board in the test machine 3, and different test signal mapping sequences can be quickly matched by flexibly defining the arrangement of the flat cable 21 of the line-side connector 2, and then docked through the first connector 11 and the second connector 22, which greatly reduces the signal link loss of multiple links compared to the spring pin connection, and improves the signal integrity and reliability of the test machine.

[0058] The high-density connector structure of the present application is provided with at least two layers of contact springs 24 connected to the first plug connector 11 in the slot 26 of the second plug connector 22, and each layer of contact springs 24 is plug-in-connected with the first plug connector 11 in a sequential order. When a plurality of first plug connectors 11 and a plurality of second plug connectors 22 are docked, it is avoided that all the contact springs 24 of the second plug connector 22 contact the first plug connector 11 at the same time, which reduces the contact resistance and friction force, thereby realizing a low plug-in force structural connection, ensuring a small overall plug-in force when the whole machine interface is connected as a whole, and ensuring the reliability of the connection.

[0059] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0060] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0061] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A high-density connector structure supporting semiconductor testing, characterized in that: include: A board-end connector (1), the board-end connector (1) comprising a PCB board (12), and a plurality of first plug-in connectors (11) fixed on the PCB board (12) and arranged in a linear array or circumferentially on the PCB board (12); A line end connector (2), the line end connector (2) comprising a second plug connector (22) pluggably connected to the first plug connector (11), the second plug connector (22) being connected to a flat cable (21); At least two layers of contact springs (24) connected to the first plug-in connector (11) are arranged in the slot (26) of the second plug-in connector (22), and each layer of contact springs (24) is plug-in-and-unplug-connected to the first plug-in connector (11) in a sequential order.

2. A high-density connector structure supporting semiconductor testing as claimed in claim 1, characterized in that: The line end connector (2) further comprises a fixing plate for fixing the second plug connector (22), and the second plug connector (22) is arranged in a linear array or a circumferential array on the fixing plate; The second plug-in connector (22) is provided with a mounting hole, and a screw (25) is loosely fitted in the mounting hole to fix the second plug-in connector (22) on the fixing plate.

3. A high-density connector structure supporting semiconductor testing as claimed in claim 2, characterized in that: The notch of the slot (26) of the second connector (22) is provided with a chamfer (27) or a rounded corner, and the plug (13) of the first connector (11) is provided with a conical guide head.

4. A high-density connector structure supporting semiconductor testing as claimed in claim 1, characterized in that: The line end connector (2) further comprises a third plug-in connector (23) connected to the test machine (3), at least two third plug-in connectors (23) are provided, and each of the third plug-in connectors (23) is connected to the second plug-in connector (22) via a wiring cable (21).

5. A high-density connector structure supporting semiconductor testing as claimed in claim 1, characterized in that: A riveting plate (15) for fixing the first plug-in connector (11) on the PCB board (12) is provided on the side wall of the first plug-in connector (11), and a rivet (14) for riveting the first plug-in connector (11) on the PCB board (12) is provided on the riveting plate (15).

6. A high-density connector structure supporting semiconductor testing as claimed in claim 5, characterized in that: A plurality of asymmetrically arranged riveted plates (15) are provided on the side wall of the first plug-in connector (11), and the riveted plates (15) between two adjacent first plug-in connectors (11) are arranged in a staggered manner along the length direction of the first plug-in connector (11).

7. A high-density connector structure supporting semiconductor testing as claimed in claim 5 or 6, characterized in that: The PCB board (12) is of a circular structure, the first connectors (11) are evenly distributed on the PCB board (12) in a radially circumferential manner, and the riveted plate (15) is located on the first connector (11) at an end away from the center of the PCB board (12).

8. A high-density connector structure supporting semiconductor testing as claimed in claim 1, characterized in that: The first connector (11) is welded to a PCB board (12) via pins, and a probe connected to a semiconductor chip to be tested is fixedly provided on the PCB board (12).

9. A high-density connector structure supporting semiconductor testing as claimed in claim 1, characterized in that: The number of the first connector (11) and the number of the second connector (22) are respectively 100-200, and the wires of the wiring cable (21) are separated by insulators.

10. A test device supporting semiconductor testing, characterized in that: A high-density connector structure supporting semiconductor testing comprising any one of claims 1 to 9.

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