A flexible deformable heat flow sensor and its manufacturing device

Abstract

The present invention discloses a flexible deformable heat flux sensor, comprising a flexible substrate, a pin group is arranged at one end of the flexible substrate, a metal measuring point group is arranged on the surface of the flexible substrate away from the pin group, the pin group is electrically connected to the metal measuring point group through a wire arranged in the flexible substrate; wherein two adjacent pins in the pin group are connected in series with a metal measuring point in the metal measuring point group through a wire, and its preparation device comprises an injection molding mold and a wire clamping assembly arranged on one side of the injection molding mold; a cavity is arranged inside the injection molding mold, and a metal measuring point molding seat is arranged near the end of the cavity away from the wire clamping assembly; ports for injecting material into the cavity are arranged at the top and bottom of the injection molding mold; and the wire clamping assembly is used to clamp the wire placed in the cavity. The present invention solves the problem of measuring the surface heat flux rate of complex surface models. The heat flux sensor has a flexible substrate, which not only makes the installation of the sensor more convenient, and the measuring end face and the model surface completely overlap, but also increases the density of the measuring points, and more clearly obtains the heat flux distribution of the model surface.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal flow sensors, and in particular to a flexible and deformable thermal flow sensor and a preparation device thereof. Background Art

[0002] As an important method for measuring the aerodynamic thermal environment in shock tunnels, the measurement technology based on thin film resistor heat flux sensors has been continuously developed and innovated for decades. On the one hand, in order to obtain more data per unit area, integration has become a trend in the development of sensor technology. On the other hand, in order to reduce the measurement error caused by sensor installation, sensor miniaturization has also been continuously innovated as a research direction. Since the existing Pt thin film resistor temperature sensor uses glass or ceramic as the base material, when measuring the heat flux rate on the surface of a model with complex shapes, the distance between the sensor's measuring points is large, and the sensor's measuring end face does not overlap well with the model surface, which will have a certain impact on the flow field and thus affect the measurement accuracy. Summary of the invention

[0003] The object of the present invention is to provide a flexible deformable heat flow sensor and a preparation device to solve the technical problem of measuring the surface heat flow rate of a complex surface model in the prior art.

[0004] In order to solve the above technical problems, the present invention specifically provides the following technical solutions:

[0005] A flexible deformable heat flow sensor and a manufacturing device, comprising a flexible substrate, one end of the flexible substrate is provided with a pin group, a surface of the flexible substrate away from the pin group is provided with a metal measuring point group, and the pin group is electrically connected to the metal measuring point group through a wire arranged in the flexible substrate;

[0006] Wherein, two adjacent pins in the pin group are connected in series with a metal measuring point in the metal measuring point group through one of the wires.

[0007] As a preferred embodiment of the present invention, the flexible substrate includes a first substrate, a second substrate and a measuring point substrate, the first substrate is arranged on the surface of the second substrate, and the measuring point substrate is connected to one end of the whole connected between the first substrate and the second substrate; the pin group is arranged at the other end of the whole connected between the first substrate and the second substrate; the metal measuring point group is arranged on the surface of the measuring point substrate, and the wire extends from between the contact surfaces of the first substrate and the second substrate to the inside of the measuring point substrate to electrically connect the metal measuring point group.

[0008] As a preferred solution of the present invention, the surfaces of the first substrate and the second substrate are provided with wire grooves matching the wires, and the aperture of the wire grooves is larger than the diameter of the wires.

[0009] As a preferred solution of the present invention, the pin group includes two fitted clamps, and the two clamps are mirror images, a pin board is arranged between the two clamps, the pin group is arranged on the pin board, and an inner cavity matching the pin board is arranged inside the whole connected by the two clamps, the inner cavity is the same thickness as the pin, and the width of the inner cavity is larger than that of the pin board.

[0010] A manufacturing device for manufacturing the flexible deformable thermal flow sensor of the hypersonic shock wave wind tunnel, comprising an injection molding die and a wire clamping assembly arranged on one side of the injection molding die;

[0011] A cavity is provided inside the injection molding mold, and a metal measuring point molding seat is provided near the end of the cavity away from the clamping assembly; ports for injecting material into the cavity are provided at the top and bottom of the injection molding mold;

[0012] The wire clamping assembly is used to clamp the wire placed in the cavity.

[0013] As a preferred solution of the present invention, the injection molding die includes a first molding die and a second molding die;

[0014] A reciprocating drive assembly is provided at the bottom of the second molding die;

[0015] Wherein, the first molding die is fixedly connected to one end of the reciprocating drive assembly, the wire clamping assembly is fixedly connected to the other end of the reciprocating drive assembly, and the second molding die is relatively fixed to the reciprocating drive assembly;

[0016] The reciprocating drive assembly is used to drive the first molding die to move toward and away from the end of the second molding die, and to drive the wire clamping assembly to move away from or toward the end of the second molding die;

[0017] The first molding die is used to inject a material body into a cavity in the first molding die through a port to form a measuring point matrix;

[0018] The second molding die is used to inject a material body into a mold cavity in the second molding die through a port to form an integral body in which the first substrate and the second substrate are connected.

[0019] As a preferred solution of the present invention, an upper edge plate is provided at the upper part of the end surface where the first molding die and the second molding die are connected, and a lower edge plate is provided at the lower part of the end surface, and the lower surface of the upper edge plate is consistent with the top surface of the cavity of the first molding die, and the upper surface of the lower edge plate is consistent with the bottom surface of the cavity of the first molding die;

[0020] The end of the second molding die that contacts the first molding die is provided with a groove that matches the upper edge plate and the lower edge plate.

[0021] As a preferred embodiment of the present invention,

[0022] The first molding die and the second molding die both include an upper die seat and a lower die seat, the contact surfaces of the upper die seat and the lower die seat form the cavity, and the metal measuring point molding seat is arranged on the lower die seat of the first molding die.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The present invention solves the problem of measuring the surface heat flux rate of a complex surface model. The heat flux sensor has a flexible substrate, which not only makes the installation of the sensor more convenient, and the measuring end face and the model surface completely coincide, but also increases the density of measuring points, and more clearly obtains the heat flux distribution on the model surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the implementation of the present invention or the technical solution in the prior art, the following briefly introduces the drawings required for the implementation or the prior art description. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0026] Figure 1 A schematic diagram of the structure of a sensor is provided for an embodiment of the present invention;

[0027] Figure 2 A schematic diagram of the structure of a splint is provided for an embodiment of the present invention;

[0028] Figure 3 A schematic structural diagram of the assembly of a flexible substrate and a pin group is provided for an embodiment of the present invention;

[0029] Figure 4 A schematic structural diagram of an injection molding die is provided for an embodiment of the present invention;

[0030] Figure 5 Provided for embodiments of the present invention Figure 4 A structural diagram of the installation position of the metal measuring point forming seat;

[0031] Figure 6 Provided for embodiments of the present invention Figure 5 Schematic diagram of the structure of the longitudinal section of the injection molding mold.

[0032] The numbers in the figure represent the following:

[0033] 1-flexible substrate; 2-pin group; 3-metal measuring point group; 4-conductor; 5-injection molding mold; 6-clip wire assembly; 7-cavity; 8-metal measuring point molding seat;

[0034] 101-first substrate; 102-second substrate; 103-measuring point substrate; 104-wire slot;

[0035] 201- clamping plate; 202- pin plate; 203- inner cavity;

[0036] 51-first molding die; 52-second molding die; 53-reciprocating drive assembly; 54-upper edge plate; 55-lower edge plate; 56-groove. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] like Figures 1 to 3 As shown, the present invention provides a flexible deformable heat flow sensor, comprising a flexible substrate 1, a pin group 2 is arranged at one end of the flexible substrate 1, a metal measuring point group 3 is arranged on the surface of the flexible substrate 1 away from the pin group 2, and the pin group 2 is electrically connected to the metal measuring point group 3 through a wire 4 arranged in the flexible substrate 1;

[0039] Two adjacent pins in the pin group 2 are connected in series with a metal measuring point in the metal measuring point group 3 via a wire 4 .

[0040] The preparation method using existing technology specifically includes:

[0041] A mask is made according to the designed size, and a finished polyimide film with a thickness of 0.18 mm is fixed on the silicon wafer substrate. The sensor pattern on the mask is transferred to the platinum layer on the polyimide film using photolithography technology to form a sensitive element. Then, polyimide film is plated on the area except for the temperature-sensing parts and pin parts using photolithography technology to play a protective and heat-insulating role, preventing other parts except the sensitive parts from being affected by temperature. Finally, the polyimide base layer and the silicon substrate are separated. The size of each measuring point is 0.1×1mm, and it can be installed on a curved surface with a certain curvature.

[0042] The selection of substrate material is the basis for making this flexible substrate heat flow sensor. It not only needs to have certain bending properties, but also good thermal insulation properties. According to this requirement, polyimide is selected as the substrate material.

[0043] Polyimide is an aromatic heterocyclic polymer compound with imide chain segments in its molecular structure. Its English name is Polyimide (PI), which can be divided into four categories: homophenyl PI, soluble PI, polyamide-imide (PAI) and polyetherimide (PEI). Polyimide has been widely used in aviation, aerospace, microelectronics, nano, liquid crystal, separation membrane, laser and other fields. Its initial decomposition temperature is generally around 500℃. Polyimide synthesized from biphenyl dianhydride and p-phenylenediamine has a thermal decomposition temperature of 600℃, which is one of the polymers with the highest thermal stability to date.

[0044] Furthermore, in order to achieve complete adhesion of the flexible substrate 1 to the curved surface in the structural construction of the thermal flux sensor, the flexible substrate 1 includes a first substrate 101, a second substrate 102 and a measuring point substrate 103. The first substrate 101 is arranged on the surface of the second substrate 102, and the measuring point substrate 103 is connected to one end of the whole connected between the first substrate 101 and the second substrate 102; the pin group 2 is arranged at the other end of the whole connected between the first substrate 101 and the second substrate 102; the metal measuring point group 3 is arranged on the surface of the measuring point substrate 103, and the wire 4 extends from between the contact surfaces of the first substrate 101 and the second substrate 102 to the inside of the measuring point substrate 103 to electrically connect the metal measuring point group 3.

[0045] The surfaces of the first substrate 101 and the second substrate 102 are provided with a wire groove 104 that matches the wire 4, and the aperture of the wire groove 104 is larger than the diameter of the wire 4. The purpose is that the wire groove 104 and the wire 4 are not completely fixedly contacted and connected, and the wire 4 can move between the wire groove 104 installed with the wire 4. This movement is to cooperate with the first substrate 101 and the second substrate 102 when the whole body is attached to the curved surface, and there is a curvature difference between the first substrate 101 and the second substrate 102 (the first substrate 101 is in contact with the flow field of the shock tunnel, while the first substrate 101 is in contact with the flow field of the shock tunnel, and the first substrate 101 is in contact with the flow field of the shock tunnel). The surface of the second substrate 102 is in contact with the curved rudder or wing surface of the aircraft), of course, this curvature difference is determined by the difference in thickness between the first substrate 101 and the second substrate 102, that is to say, the smaller the thickness difference, the smaller the curvature difference (which is essentially manifested in the expansion deformation on the length of the surface of the first substrate 101 and the second substrate 102). When the heat flow sensor is in contact with the curved surface of the rudder or wing surface of the aircraft, the expansion deformation of the first substrate 101 in the length direction will be greater than the expansion deformation of the second substrate 102 in the length direction.

[0046] That is to say, the expansion deformation between the two causes that if the wire 4 and the wire slot 104 are fixedly connected, the second substrate 102 will exert a deformation force on the wire in length during the completion process, thereby causing the wire 4 to be broken. In addition, the smaller the bending angle of the curved surface of the rudder or wing of the aircraft to which the thermal flux sensor is to be attached, the greater the traction force generated by the expansion deformation along the length direction of the wire 4 of the thermal flux sensor, which is more likely to cause the wire 4 to be broken.

[0047] That is, based on the above problems, the sensor itself is divided into theoretical parts of a first substrate 101 and a second substrate 102. When the thermal flux sensor is finally formed, the first substrate 101 and the second substrate 102 are integrally formed to ensure the overall structural rigidity of the thermal flux sensor.

[0048] In order to further adapt to the adaptive changes of the wire 4 when the first substrate 101 and the second substrate 102 are expanded and deformed on the surface of the curved surface, the pin group 2 is required to include two fitted clamps 201, and the two clamps 201 are mirror images. A pin plate 202 is arranged between the two clamps 201, and the pin group 2 is arranged on the pin plate 202. The whole interior connected by the two clamps 201 is provided with an inner cavity 203 that cooperates with the pin plate 202. The inner cavity 203 has the same thickness as the pin, and the width of the inner cavity 203 is greater than the pin plate 202. The purpose is that, during installation, no part of the pin group 2 is exposed on the surface of the curved part of the aircraft control surface or wing surface, but is installed inside it. However, when the first substrate 101 and the second substrate 102 expand and deform when fitting with the curved surface, the connection with the pin group 2 needs to be adaptively changed (displacement or deformation along the length direction of the first substrate 101) to reduce the force on the wire 4. One end of the wire 4 is fixedly connected to the metal measuring point group 3 in the measuring point substrate 103. The deformation of the measuring point substrate 103 as a whole during bending can be ignored compared with the first substrate 101 and the second substrate 102. Therefore, the other end of the wire 4 needs to undergo an adaptive expansion deformation change (that is, a relative displacement occurs between the wire 4 and the wire slot 104). Then, when the wire 4 undergoes adaptive displacement, the pin plate 202 needs to be relatively displaced in the inner cavity 203.

[0049] The pin board 202 is a circuit board or a pin group for electrically connecting the control circuit.

[0050] The length of the measuring point matrix 103 in the length direction of the first matrix 101 is obviously much smaller than the length of the first matrix 101, so the main expansion and deformation force-bearing part of the wire 4 is located inside the first matrix 101 and the second matrix 102, so it is necessary to flexibly install the wire 4 between the wire trough 104.

[0051] like Figures 4 to 6As shown, the present invention provides a preparation device for a flexible deformable thermal flow sensor for a hypersonic shock wave wind tunnel, comprising an injection molding mold 5 and a wire clamping assembly 6 arranged on one side of the injection molding mold 5; a cavity 7 is arranged inside the injection molding mold 5, and a metal measuring point molding seat 8 is arranged near the end of the cavity 7 away from the wire clamping assembly 6; the top and bottom of the injection molding mold 5 are both provided with ports for injecting material into the cavity 7; the wire clamping assembly 6 is used to clamp and fix the wire 4 placed in the cavity 7.

[0052] The preparation device in the present invention is mainly aimed at the preparation of the measuring point matrix 103, the first matrix 101, the second matrix 102 and the wire groove 104. The cavity 7 in the present invention is designed to be the same as the specific size structure of the first matrix 101, the second matrix 102 and the measuring point matrix 103. At this time, the first matrix 101, the second matrix 102 and the measuring point matrix 103 are an integrally formed structure. The clamping assembly 6 is used to fix the wire 4. At this time, the metal measuring point group 3 and the wire 4 are welded in advance and then pre-buried in the cavity 7, and the clamping assembly 6 is used to clamp and fix the metal measuring point group 3 and the wire 4 as a whole.

[0053] Furthermore, the present invention provides an injection molding mold 5, that is, the measuring point base 103 and the first base 101 and the second base 102 are injection molded separately, which specifically includes a first molding mold 51 and a second molding mold 52; a reciprocating drive assembly 53 is arranged at the bottom of the second molding mold 52, wherein the specific function of the reciprocating drive assembly 53 is to realize the movable installation between the wire 4 and the wire groove 104 by driving the movement of the wire clamping assembly 6, and the specific method is to first perform injection molding of the first base 101 and the second base 102 part (the wire 4 has been installed in the cavity 7), and during the cooling and molding process, the first molding mold 51 is fixedly connected to one end of the reciprocating drive assembly 53, the wire clamping assembly 6 is fixedly connected to the other end of the reciprocating drive assembly 53, and the second molding mold 52 is relatively fixed to the reciprocating drive assembly 53. The reciprocating drive assembly 53 is used to drive the first molding die 51 to move closer to and away from the end of the second molding die 52, and to drive the wire clamping assembly 6 to move away from or closer to the end of the second molding die 52. In this way, during the molding process of the first substrate 101 and the second substrate 102, the wire 4 cannot achieve a fixed connection with the first substrate 101 and the second substrate 102. The wire 4 is equivalent to cutting the first substrate 101 and the second substrate 102 to form a wire groove 104 through the reciprocating drive assembly 53.

[0054] The first molding die 51 is used to inject a material body into a cavity in the first molding die 51 through a port to form a measuring point matrix;

[0055] The second molding die 52 is used to inject a material into a mold cavity in the second molding die 52 through a port to form a whole body in which the first substrate and the second substrate are connected.

[0056] Furthermore, in the present invention, an upper edge plate 54 is provided on the upper part of the end surface where the first molding mold 51 and the second molding mold 52 are connected, and a lower edge plate 55 is provided on the lower part of the end surface, and the lower surface of the upper edge plate 54 is consistent with the top surface of the cavity 7 of the first molding mold 51, and the upper surface of the lower edge plate 55 is consistent with the bottom surface of the cavity 7 of the first molding mold 51. The purpose is that during the driving process of the reciprocating drive component 53, the upper edge plate 55 levels the upper surface of the first substrate 101, and the lower edge plate 55 levels the lower surface of the second substrate 102; the end of the second molding mold 52 that contacts the first molding mold 51 is provided with a groove 56 that cooperates with the upper edge plate 54 and the lower edge plate 55. The purpose of the groove 56 is to guide the driving process of the reciprocating drive component 53.

[0057] The first molding die 51 and the second molding die 52 both include an upper die seat and a lower die seat, the contact surfaces of the upper die seat and the lower die seat form a cavity 7, and a metal measuring point molding seat 8 is arranged on the lower die seat of the first molding die 51.

[0058] The above embodiments are only exemplary embodiments of the present application and are not intended to limit the present application. The protection scope of the present application is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present application within the essence and protection scope of the present application, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present application.

Claims

1. A flexible deformable heat flow sensor, It is characterized in that It comprises a flexible substrate (1), one end of the flexible substrate (1) is provided with a pin group (2), a surface of the flexible substrate (1) away from the pin group (2) is provided with a metal measuring point group (3), and the pin group (2) is electrically connected to the metal measuring point group (3) via a wire (4) provided in the flexible substrate (1); Wherein, two adjacent pins in the pin group (2) are connected in series with a metal measuring point in the metal measuring point group (3) via a wire (4); The flexible substrate (1) comprises a first substrate (101), a second substrate (102) and a measuring point substrate (103); the first substrate (101) is arranged on the surface of the second substrate (102); the measuring point substrate (103) is connected to one end of a whole connected to the first substrate (101) and the second substrate (102); and the pin group (2) is arranged at the other end of a whole connected to the first substrate (101) and the second substrate (102); The metal measuring point group (3) is arranged on the surface of the measuring point substrate (103), and the wire (4) extends from between the contact surfaces of the first substrate (101) and the second substrate (102) to the inside of the measuring point substrate (103) to electrically connect the metal measuring point group (3); Wire grooves (104) matching the wires (4) are provided on the surfaces of the first substrate (101) and the second substrate (102), and the hole diameter of the wire grooves (104) is larger than the diameter of the wires (4).

2. A flexible deformable thermal flow sensor according to claim 1, It is characterized in that The pin group (2) comprises two fitted clamping plates (201), and the two clamping plates (201) are mirror images, a pin plate (202) is arranged between the two clamping plates (201), the pin group (2) is arranged on the pin plate (202), and an inner cavity (203) matching the pin plate (202) is arranged inside the whole connected by the two clamping plates (201), the inner cavity (203) is the same as the thickness of the pin, and the width of the inner cavity (203) is greater than that of the pin plate (202).

3. A preparation device for preparing the flexible deformable heat flow sensor according to any one of claims 1 to 2, It is characterized in that It comprises an injection molding mold (5) and a wire clamping assembly (6) arranged on one side of the injection molding mold (5); A cavity (7) is provided inside the injection molding mold (5), and a metal measuring point molding seat (8) is provided at an end close to the cavity (7) and away from the wire clamping assembly (6); The top and bottom of the injection molding mold (5) are both provided with ports for injecting material into the mold cavity (7); The wire clamping assembly (6) is used to clamp the wire placed in the cavity (7).

4. A preparation device according to claim 3, It is characterized in that The injection molding mold (5) comprises a first molding mold (51) and a second molding mold (52); A reciprocating drive assembly (53) is provided at the bottom of the second molding die (52); Wherein, the first molding die (51) is fixedly connected to one end of the reciprocating drive assembly (53), the wire clamping assembly (6) is fixedly connected to the other end of the reciprocating drive assembly (53), and the second molding die (52) is relatively fixed to the reciprocating drive assembly (53); The reciprocating drive assembly (53) is used to drive the first molding die (51) to move closer to or farther away from the end of the second molding die (52), and to drive the wire clamping assembly (6) to move away from or closer to the end of the second molding die (52); The first molding die (51) is used to inject a material body into a mold cavity in the first molding die (51) through a port to form a measuring point matrix; The second molding die (52) is used to inject a material body into a mold cavity in the second molding die (52) through a port to form a whole body in which the first base body and the second base body are connected.

5. A preparation device according to claim 4, It is characterized in that An upper edge plate (54) is provided at the upper portion of the end surface where the first molding die (51) and the second molding die (52) are connected, and a lower edge plate (55) is provided at the lower portion of the end surface, and the lower surface of the upper edge plate (54) is consistent with the top surface of the cavity (7) of the first molding die (51), and the upper surface of the lower edge plate (55) is consistent with the bottom surface of the cavity (7) of the first molding die (51); The end of the second molding die (52) that contacts the first molding die (51) is provided with a slot (56) that matches the upper edge plate (54) and the lower edge plate (55).

6. A preparation device according to claim 5, It is characterized in that in, The first molding die (51) and the second molding die (52) both comprise an upper die seat and a lower die seat, the contact surfaces of the upper die seat and the lower die seat form the mold cavity (7), and the metal measuring point molding seat (8) is arranged on the lower die seat of the first molding die (51).

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