Vapor deposition mask, method for manufacturing vapor deposition mask, and method for manufacturing display device

Abstract

The vapor deposition mask comprises a mask frame and a mask portion, wherein the mask frame comprises: a main body portion having a first surface, a first back side opposite to the first surface, and a first opening portion extending between the first surface and the first back side; and a frame-shaped portion having a second surface and a second back side opposite to the second surface, and a second opening portion extending between the second surface and the second back side, wherein the mask frame is configured so that the frame-shaped portion can be detachably mounted on the main body portion on the first back side in such a manner that the position of the second opening portion on the second surface is aligned with the position of the first opening portion on the first surface, and the mask portion has a plurality of mask holes and is joined to the second back side in such a manner as to cover the second opening portion.

Description

Technical Field

[0001] The present invention relates to a vapor deposition mask, a method for manufacturing the vapor deposition mask, and a method for manufacturing a display device. Background Art

[0002] In the manufacture of an organic EL display device, vacuum evaporation is used to form an organic light-emitting layer of an organic EL display element. When the organic light-emitting layer is formed by vacuum evaporation, a evaporation mask is used to form an organic light-emitting layer having a predetermined shape at a predetermined position in an evaporation object. The evaporation mask includes a plurality of mask portions and a mask frame. Each mask portion is a metal foil formed with a plurality of mask holes. The plurality of mask holes have shapes and configurations corresponding to the shapes and configurations of the organic light-emitting layer. The mask frame has frame holes for allowing the evaporation material to reach the mask portion mounted on the mask frame. Each mask portion is joined to the mask frame in a manner of blocking a frame hole that is different from each other (for example, refer to Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: International Publication No. 2019 / 054462 Summary of the invention

[0006] Problems to be solved by the invention

[0007] However, the mask part is joined to the mask frame by welding, for example. When the mask part is joined by welding, a joining mark where the mask part is joined is formed on the mask frame. The joining mark is a depression formed in a portion of the mask frame where the mask part is welded.

[0008] On the other hand, when vapor deposition is performed multiple times using one vapor deposition mask, sometimes a portion of the mask portion is deformed, or vapor deposition material accumulates on a portion of the mask portion. In this regard, in the above-mentioned vapor deposition mask, only the mask portion that needs to be replaced can be removed from the mask frame, and a new mask portion can be joined to the mask frame. However, a joining mark is formed on the mask frame due to the joining of the mask portion, so in order to suppress the positional displacement of the mask portion relative to the mask frame due to the joining mark, or the mask portion is not joined to the mask frame, it is necessary to process the joining mark. Therefore, corresponding to the situation where the joining mark needs to be processed, the re-joining of the mask portion to the mask frame becomes cumbersome.

[0009] The above-mentioned problem is not limited to the case where welding is used for joining the mask portion, but is also common when bonding is used for joining the mask portion. When bonding is used for joining the mask portion, an adhesive layer is formed as a joining mark.

[0010] An object of the present invention is to provide a vapor deposition mask capable of easily rejoining a mask portion to a mask frame, a method for manufacturing the vapor deposition mask, and a method for manufacturing a display device.

[0011] Means for solving problems

[0012] A vapor deposition mask for solving the above-mentioned problems comprises a mask frame and a mask portion, wherein the mask frame comprises: a main body portion comprising a first surface, a first back side opposite to the first surface, and a first opening portion extending between the first surface and the first back side; and a frame-like portion comprising a second surface and a second back side opposite to the second surface, and a second opening portion extending between the second surface and the second back side, wherein the mask frame is configured such that the frame-like portion can be detachably mounted on the main body portion on the first back side in such a manner that the position of the second opening portion on the second surface is aligned with the position of the first opening portion on the first surface, and the mask portion has a plurality of mask holes and is joined to the second back side in such a manner as to cover the second opening portion.

[0013] The manufacturing method of the vapor deposition mask for solving the above-mentioned problems includes: the step of joining the mask part to the frame-like part having the second opening part passing through the second surface and the second back side; and the step of installing the above-mentioned frame-like part to the main body having the first opening part passing through the first surface and the first back side, the step of joining the mask part includes the step of joining the above-mentioned mask part to the above-mentioned second back side in a manner covering the above-mentioned second opening part, and the step of installing the frame-like part includes the step of detachably mounting the above-mentioned frame-like part to the above-mentioned main body on the above-mentioned first back side in a manner that the position of the above-mentioned second opening part on the above-mentioned second surface is aligned with the position of the above-mentioned first opening part on the above-mentioned first surface.

[0014] A method for manufacturing a display device for solving the above-mentioned problem includes the step of forming a pattern on a vapor deposition object using the vapor deposition mask manufactured by the above-mentioned method for manufacturing the vapor deposition mask.

[0015] According to the above-mentioned vapor deposition mask, the manufacturing method of the vapor deposition mask, and the manufacturing method of the display device, when the mask portion of the vapor deposition mask is replaced with a new mask portion, the mask portion can be removed from the main body together with the frame-shaped portion that can be removed from the main body. As a result, the joining marks formed on the frame-shaped portion due to the joining of the mask portion to the frame-shaped portion are also removed from the main body. Therefore, by installing a new frame-shaped portion on the main body and joining a new mask portion to the new frame-shaped portion, a vapor deposition mask can be obtained. In this way, when the mask portion is rejoined to the mask frame, it is not necessary to process the joining marks of the mask frame, so it is easy to rejoin the mask portion to the mask frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a perspective view showing the structure of the vapor deposition mask in the first embodiment.

[0017] Figure 2 Yes means Figure 1 A cross-sectional view of a portion of the structure of the vapor deposition mask shown.

[0018] Figure 3 Yes means Figure 2 A cross-sectional view of a portion of the structure of the vapor deposition mask shown.

[0019] Figure 4 Yes means Figure 2 A plan view of the structure of a mask portion included in the vapor deposition mask shown.

[0020] Figure 5 Yes Figure 2 The illustrated sectional view is an enlarged view of the structure of a mask portion included in the vapor deposition mask.

[0021] Figure 6 This is a process diagram for explaining a method for manufacturing a vapor deposition mask.

[0022] Figure 7 This is a process diagram for explaining a method for manufacturing a vapor deposition mask.

[0023] Figure 8 This is a process diagram for explaining a method for manufacturing a vapor deposition mask.

[0024] Fig. 9 This is a process diagram for explaining a method for manufacturing a vapor deposition mask.

[0025] Fig.10 This is a process diagram for explaining a method for manufacturing a vapor deposition mask.

[0026] Fig.11 This is a process diagram for explaining a method for manufacturing a vapor deposition mask.

[0027] Fig.12 This is a process diagram for explaining a method for manufacturing a vapor deposition mask.

[0028] Fig.13 Yes Fig.12 The region A shown is an enlarged cross-sectional view.

[0029] Fig.14 This is a process diagram for explaining a method for manufacturing a vapor deposition mask.

[0030] Fig.15 This is a process diagram for explaining a method for manufacturing a vapor deposition mask.

[0031] Fig.16 This is a functional diagram for explaining the function of the vapor deposition mask.

[0032] Fig.17 This is a diagram schematically showing the configuration of a vapor deposition apparatus together with a vapor deposition mask and a vapor deposition object.

[0033] Fig.18 It is a plan view showing the structure of a vapor deposition mask in the second embodiment.

[0034] Fig.19 It means along Fig.18 A cross-sectional view of the structure taken along line XIX-XIX is shown.

[0035] Fig. 20 Yes means Fig.18 A cross-sectional view of the fixing portion and the surrounding structure of the fixing portion shown.

[0036] Fig.21 It means along Fig.18 A cross-sectional view of the structure taken along line XIX-XIX is shown.

[0037] Fig. 22 Yes means Fig.18 A cross-sectional view of the fixing portion and the surrounding structure of the fixing portion shown.

[0038] Fig.23 It is a plan view showing the structure of a vapor deposition mask in the third embodiment.

[0039] Fig.24 It is along Fig.23 A cross-sectional view of the structure taken along line XXIV-XXIV is shown.

[0040] Fig.25 It is a plan view showing the structure of a vapor deposition mask in the fourth embodiment.

[0041] Fig.26 It means along Fig.25 A cross-sectional view of the structure taken along line XXVI-XXVI is shown.

[0042] Fig. 27 It is a plan view showing the structure of a vapor deposition mask in the fifth embodiment.

[0043] Fig.28 It means along Fig. 27 A cross-sectional view of the structure along line XXVIII-XXVIII is shown. DETAILED DESCRIPTION

[0044] [First embodiment]

[0045] Reference Figures 1 to 17A first embodiment of a vapor deposition mask, a method for manufacturing the vapor deposition mask, and a method for manufacturing a display device will be described. Hereinafter, a vapor deposition mask, a method for manufacturing the vapor deposition mask, and a method for manufacturing a display device will be described in sequence.

[0046] [Evaporation mask]

[0047] The vapor deposition mask comprises a mask frame and a mask portion. The mask frame comprises a main body portion and a frame-shaped portion. The main body portion comprises a surface, a back side opposite to the surface, and a first through hole penetrating between the surface and the back side. The frame-shaped portion comprises a surface, a back side opposite to the surface, and a second through hole penetrating between the surface and the back side. The mask frame is configured so that, on the back side of the main body portion opposite to the surface of the main body portion, the frame-shaped portion can be mounted on the main body portion in a manner such that the opening of the surface in the second opening portion is opposite to the opening of the surface in the first opening portion, and the frame-shaped portion can be removed from the main body portion. The mask portion has a plurality of mask holes, and is joined to the back side of the frame-shaped portion in a manner such that the second opening portion is covered.

[0048] That is, the main body has a first surface, a first back surface opposite to the first surface, and a first opening extending between the first surface and the first back surface. The frame has a second surface and a second back surface opposite to the second surface. The frame has a second opening extending between the second surface and the second back surface. The mask frame is configured so that the frame can be detachably mounted on the main body on the first back surface side in such a manner that the position of the second opening on the second surface is aligned with the position of the first opening on the first surface.

[0049] Below, refer to Figures 1 to 5 The vapor deposition mask according to the first embodiment will be described. Figure 1 The three-dimensional structure of the vapor deposition mask viewed from a viewpoint corresponding to the back surface of a main body portion of the mask frame of the vapor deposition mask is shown.

[0050] like Figure 1 As shown, the vapor deposition mask 10 includes a mask frame 11 and a plurality of mask portions 12. The mask frame 11 has a plurality of frame holes 11H. Each mask portion 12 is bonded to the mask frame 11 so as to cover a different frame hole 11H.

[0051] The outer shape of the mask frame 11 is, for example, a quadrilateral shape. The mask frame 11 includes a surface 11F and a back surface 11R on the opposite side of the surface 11F. When the vapor deposition mask 10 is mounted on the vapor deposition device, the back surface 11R of the mask frame 11 faces the vapor deposition object S, and the surface 11F of the mask frame 11 faces the vapor deposition source. When viewed from a viewpoint facing the back surface 11R of the mask frame 11, the outer shape of the mask frame 11 is larger than the vapor deposition object S. In addition, Figure 1In the example shown, the outer shape of the mask frame 11 is larger than the vapor deposition object S, but the outer shape of the mask frame 11 may be smaller than the vapor deposition object S.

[0052] When observed from a viewpoint opposite to the back surface 11R, each frame hole 11H has a rectangular shape. The plurality of frame holes 11H are arranged in a rectangular lattice at equal intervals in the first direction D1 and the second direction D2 orthogonal to the first direction D1. In addition, the frame holes 11H may not have a rectangular shape. For example, the frame holes 11H may have shapes such as a square, a circle, and an ellipse. In addition, the plurality of frame holes 11H may include frame holes 11H having a first shape and frame holes 11H having a second shape. The plurality of frame holes 11H may not be arranged in a rectangular lattice shape. For example, the plurality of frame holes 11H may be arranged in a staggered lattice shape. In addition, the plurality of frame holes 11H may be arranged irregularly in at least one of the first direction D1 and the second direction D2.

[0053] When viewed from a viewpoint opposite to the back surface 11R of the mask frame 11, the mask portion 12 has a shape and size that can cover the frame hole 11H. In the present embodiment, the mask portion 12 has a rectangular shape. One mask portion 12 is installed for each frame hole 11H. Therefore, the vapor deposition mask 10 has the same number of mask portions 12 as the frame holes 11H.

[0054] The mask frame 11 and the mask portion 12 are made of metal. The metal forming the mask frame 11 and the metal forming the mask portion 12 are preferably the same. As a result, the difference between the linear expansion coefficient of the vapor deposition mask 10 and the linear expansion coefficient of the mask portion 12 is small, so that even if the vapor deposition mask 10 is heated during use of the vapor deposition mask 10, deformation of the mask portion 12 can be suppressed. As a result, the reduction in accuracy at the position of the pattern formed using the vapor deposition mask 10 can be suppressed.

[0055] The material forming the mask portion 12 can be an alloy containing iron and nickel as main components, that is, an iron-nickel alloy. The material forming the mask portion 12 is, for example, an alloy containing 30% by mass or more of nickel and the remainder of iron. The material forming the mask portion 12 is preferably an alloy containing 36% by mass of nickel in the iron-nickel alloy, that is, Invar alloy. The material forming the mask portion 12 may also be an alloy containing 42% by mass of nickel, that is, 42 alloy. In addition to iron and nickel, the mask portion 12 may also contain additives such as chromium, manganese, carbon, and cobalt.

[0056] When the material forming the mask portion 12 is an iron-nickel-cobalt alloy, the material is an alloy with iron, nickel and cobalt as main components, and for example, contains more than 30% by mass of nickel, more than 3% by mass of cobalt and the remainder of iron. In the iron-nickel-cobalt alloy, it is further preferred to use an alloy containing 32% by mass of nickel and more than 4% by mass and less than 5% by mass of cobalt, that is, a super-invar alloy, as a material for forming the mask portion 12. In the super-invar alloy, the remainder relative to 32% by mass of nickel and more than 4% by mass and less than 5% by mass of cobalt sometimes includes additives other than iron as the main component. The additives are, for example, chromium, manganese and carbon. The maximum additive contained in the iron-nickel-cobalt alloy is less than 0.5% by mass.

[0057] In addition, the vapor deposition object S is preferably a glass substrate. When the vapor deposition object S is a glass substrate, the mask portion 12 is made of Invar, thereby being able to suppress the difference between the linear expansion coefficient of the vapor deposition object S and the linear expansion coefficient of the mask portion 12 from becoming larger. In addition, the vapor deposition object S may also be a laminate of a glass substrate and a resin layer. In this case, a pattern may also be formed on the resin layer of the vapor deposition object S. In addition, the vapor deposition object S may also be a resin film. The material forming the resin layer and the resin film is preferably, for example, a polyimide resin.

[0058] Figure 2 The cross-sectional structure of the vapor deposition mask 10 along a plane orthogonal to the back surface 11R of the mask frame 11 is shown. Figure 2 Only a partial structure including one frame hole 11H and one mask portion 12 is shown in the cross-sectional structure of the vapor deposition mask 10 .

[0059] like Figure 2 As shown, the mask frame 11 includes a main body 11A and a plurality of frame-shaped parts 11B. The main body 11A includes a surface 11AF, a back surface 11AR on the opposite side of the surface 11AF, and a plurality of first openings 11AH. The surface 11AF is an example of a first surface, and the back surface 11AR is an example of a first back surface. The first opening 11AH passes through between the surface 11AF and the back surface 11AR. The main body 11A has a step portion AH1 formed by expanding the opening at the back surface 11AR of the main body 11A in the first opening 11AH.

[0060] Each frame-shaped portion 11B has a frame shape embedded in the step portion AH1 so as to define a second opening portion 11BH that is opposite to the opening of the surface 11AF in the first opening portion 11AH that is different from each other. In other words, the position of the surface 11BF of the second opening portion 11BH of each frame-shaped portion 11B is aligned with the position of the surface 11AF of the first opening portion 11AH that is different from the position of the surface 11AF of the first opening portion 11AH that is aligned with the position of the surface 11BF of the other second opening portions 11BH.

[0061] Each frame-shaped portion 11B includes a front surface 11BF and a back surface 11BR. The front surface 11BF is an example of a second front surface, and the back surface 11BR is an example of a second back surface. The back surface 11BR of the frame-shaped portion 11B is an example of an exposed surface exposed to the side opposite to the step portion AH1. Each frame-shaped portion 11B is configured to be detachable from the step portion AH1 of the main body 11A.

[0062] Each mask portion 12 has a plurality of mask holes 12H. Each mask portion 12 is bonded to the back surface 11BR of the frame-shaped portion 11B in a manner that covers the second opening portion 11BH of a frame-shaped portion 11B that is different from each other. In other words, each mask portion 12 is bonded to the back surface 11BR of the frame-shaped portion 11B that is different from the frame-shaped portion 11B bonded to the other mask portions 12. The mask portion 12 is bonded to the back surface 11BR of the frame-shaped portion 11B by, for example, welding.

[0063] When the mask portion 12 of the vapor deposition mask 10 is replaced with a new mask portion 12, the mask portion 12 can be removed from the main body 11A together with the frame portion 11B that can be removed from the main body 11A. As a result, the joining marks formed on the frame portion 11B due to the joining of the mask portion 12 to the frame portion 11B are also removed from the main body 11A. Therefore, the vapor deposition mask 10 can be obtained by fitting the new frame portion 11B to the main body 11A and joining the new mask portion 12 to the new frame portion 11B. In this way, when the mask portion 12 is rejoined to the mask frame 11, it is not necessary to process the joining marks of the mask frame 11, so that the mask portion 12 can be easily rejoined to the mask frame 11.

[0064] The frame-shaped portion 11B is located at the step portion AH1, so that the gap between the back surface 11AR of the main body 11A and the mask portion 12 can be reduced compared to the case where the main body 11A does not have the step portion AH1. Therefore, when the vapor deposition mask 10 is in contact with the vapor deposition object, the difference in force between the portion of the vapor deposition object that is in contact with the vapor deposition mask 10 and the portion that is not in contact with the vapor deposition mask 10 can be reduced.

[0065] When viewed from above facing the back surface 11AR of the main body 11A, the outer shape of the frame portion 11B has a rectangular shape, and the frame portion 11B divides a rectangular area. The frame portion 11B includes a back surface 11BR to which the mask portion 12 is bonded and a surface 11BF on the opposite side of the back surface 11BR. The back surface 11BR is a surface located on the opposite side of the surface 11AF of the main body 11A relative to the surface 11BF.

[0066] In the cross section perpendicular to the back surface 11AR of the main body 11A, the second opening 11BH of the frame 11B has a trapezoidal shape. On the other hand, in the cross section perpendicular to the back surface 11AR of the main body 11A, each first opening 11AH of the main body 11A has a shape formed by connecting a portion opened on the surface 11AF and having a trapezoidal shape and a portion opened on the back surface 11AR and having a rectangular shape. The frame 11B is embedded in the step portion AH1 of the main body 11A, thereby forming a frame hole 11H through the first opening 11AH of the main body 11A and the second opening 11BH of the frame 11B. In the cross section perpendicular to the back surface 11AR of the main body 11A, the frame hole 11H has a trapezoidal shape.

[0067] In the cross section perpendicular to the rear surface 11AR of the main body 11A, the frame hole 11H may have a shape other than a trapezoidal shape. For example, the frame hole 11H may have a semicircular arc shape tapering from the front surface 11AF toward the rear surface 11AR, or may have a rectangular shape.

[0068] The frame hole 11H is a passage for the vapor deposition material vaporized or sublimated from the vapor deposition source. The frame hole 11H has a trapezoidal shape, in other words, a shape that tapers from the front surface 11AF of the main body 11A toward the back surface 11AR, thereby suppressing the shadow effect of the mask frame 11.

[0069] In a cross section orthogonal to the back surface 11AR of the main body 11A, the frame-shaped portion 11B has a thickness TB greater than the depth D of the step portion AH1 of the main body 11A. In the present embodiment, the depth D of the step portion AH1 of the main body 11A is equal to the thickness TB of the frame-shaped portion 11B. When the frame-shaped portion 11B is embedded in the step portion AH1 of the main body 11A, the back surface 11BR of the frame-shaped portion 11B is flush with the back surface 11AR of the main body 11A. Therefore, it is possible to suppress the back surface 11AR of the main body 11A from protruding relative to the back surface 11BR of the frame-shaped portion 11B, thereby suppressing the formation of a gap between the mask portion 12 and the vapor deposition object S.

[0070] In addition, when the thickness TB of the frame-shaped portion 11B is greater than the depth D of the step portion AH1, the back surface 11BR of the frame-shaped portion 11B protrudes relative to the back surface 11AR of the main body portion 11A. Therefore, similar to the case where the back surface 11BR of the frame-shaped portion 11B and the back surface 11AR of the main body portion 11A are flush with each other, the back surface 11AR of the main body portion 11A can be suppressed from protruding relative to the back surface 11BR of the frame-shaped portion 11B, thereby suppressing the formation of a gap between the mask portion 12 and the vapor deposition object S.

[0071] In a cross section perpendicular to the rear surface 11AR of the main body 11A, the thickness TB of the frame 11B is thinner than the thickness TA of the main body 11A. The thickness TA of the main body 11A may be, for example, 5 mm to 50 mm. The thickness TB of the frame 11B may be, for example, 100 μm to 10 mm.

[0072] The surface 11F of the mask frame 11 is the surface 11AF of the main body 11A. On the other hand, the back surface 11R of the mask frame 11 is formed by the back surface 11AR of the main body 11A and the back surfaces 11BR of the frame-shaped portions 11B.

[0073] In addition, in a cross section orthogonal to the back surface 11AR of the main body 11A, the side surface connecting the surface 11BF and the back surface 11BR in the frame-shaped portion 11B may have a curvature such that the center of curvature is located inside the frame-shaped portion 11B or on the mask portion 12 side relative to the frame-shaped portion 11B in the thickness direction of the frame-shaped portion 11B. In addition, when observed from a viewpoint opposite to the back surface 11AR of the main body 11A, the corner portion of the opening of the back surface 11BR in the second opening portion 11BH may have a curvature such that the center of curvature is located inside the opening. In addition, when observed from a viewpoint opposite to the back surface 11AR of the main body 11A, the corner portion of the outer edge of the frame-shaped portion 11B may have a curvature such that the center of curvature is located inside the frame-shaped portion 11B.

[0074] Furthermore, when viewed from a viewpoint opposite to the back surface 11AR of the main body 11A, the corner portion of the inner edge of the step portion AH1 may have a curvature such that the center of curvature is located within the region surrounded by the inner edge of the step portion AH1. Furthermore, when viewed from a viewpoint opposite to the front surface 11AF of the main body 11A, the corner portion of the opening of the front surface 11AF in the first opening 11AH may have a curvature such that the center of curvature is located within the opening.

[0075] Since each corner has a curvature, compared with a case where each corner has no curvature, when the frame-like portion 11B is embedded relative to the main body 11A, damage caused by contact between the corners of the frame-like portion 11B and the main body 11A, and damage caused by contact between the corners of the main body 11A and the frame-like portion 11B can be suppressed.

[0076] The mask frame 11 can include a fixing portion that fixes the frame-shaped portion 11B to the main body portion 11A. Figure 3 An example of the fixing portion is schematically shown. The fixing portion fixes the frame-shaped portion 11B to the main body portion 11A so as to be detachable from the main body portion 11A.

[0077] When the frame portion 11B is formed of a metal having magnetism, the main body 11A may include a fixing portion that fixes the frame portion 11B to the main body 11A by magnetic attraction in a manner that allows the frame portion 11B to be detached from the main body 11A. Thus, the frame portion 11B is magnetically attracted to the main body 11A, so that the accuracy of the position of the frame portion 11B relative to the main body 11A is less likely to decrease compared to a case where the frame portion 11B is fixed to the main body 11A using a fastening member such as a screw.

[0078] For example, Figure 3 As shown, the main body 11A can have a magnet 11AM inside the main body 11A. The magnet 11AM is, for example, a permanent magnet. The magnet 11AM can have a first state and a second state. The first state is a state in which the magnet 11AM is located along the surface that divides the step difference portion AH1, whereby the magnet 11AM fixes the frame-like portion 11B to the main body 11A by magnetic adsorption. On the other hand, the second state is a state in which the magnet 11AM is away from the surface that divides the step difference portion AH1 compared to the first state, and when the magnet 11AM has the second state, the magnet 11AM releases the fixation of the frame-like portion 11B relative to the main body 11A.

[0079] Therefore, when magnet 11AM is in the first state, frame 11B can be fixed to body 11A. Then, by changing the state of magnet 11AM from the first state to the second state, frame 11B fixed to body 11A can be removed from body 11A.

[0080] Figure 4 The planar structure of the mask portion 12 bonded to the frame-shaped portion 11B is schematically shown. Figure 5 The structure of the mask portion 12 is shown along a cross section perpendicular to a plane along which the mask portion 12 extends.

[0081] like Figure 4 As shown, the mask portion 12 includes a mask region 12A having a plurality of mask holes 12H formed therein, and a peripheral region 12B having no mask holes 12H. The peripheral region 12B surrounds the mask region 12A. A portion of the peripheral region 12B is bonded to the frame portion 11B.

[0082] exist Figure 4In the example shown, the mask portion 12 has only one mask area 12A. In addition, the mask portion 12 may also have a plurality of mask areas 12A. In the case where the mask portion 12 has a plurality of mask areas 12A, the mask areas 12A adjacent to each other are distinguished from each other by the peripheral area 12B. In addition, it may be that, in all of the plurality of mask portions 12 included in the evaporation mask 10, the number of mask areas 12A included in each mask portion 12 is the same. Alternatively, it may be that the plurality of mask portions 12 include a mask portion 12 having a first number of mask areas 12A and a mask portion 12 having a second number of mask areas 12A. The second number is different from the first number.

[0083] like Figure 5 As shown, the mask portion 12 includes a surface 12F and a back surface 12R on the opposite side of the surface 12F. The surface 12F is a surface for facing the vapor deposition source in the vapor deposition device by being exposed in the area divided by the frame hole 11H of the mask frame 11. The back surface 12R is a surface for contacting the vapor deposition object S in the vapor deposition device.

[0084] The mask portion 12 may be formed by a single metal plate or by a plurality of metal plates. When the mask portion 12 is formed by a plurality of metal plates, the plurality of metal plates are stacked in the thickness direction of the mask portion 12. The hole side surface that divides the mask holes 12H has a semicircular arc shape with the top end tapering from the surface 12F toward the back surface 12R in the cross section along the thickness direction of the mask portion 12. Each mask hole 12H is separated from the mask holes 12H adjacent to each other. In addition, each mask hole 12H may also be connected to the mask holes 12H adjacent to each other.

[0085] The surface 12F is a surface joined to the frame-shaped portion 11B of the mask frame 11. The surface 12F includes the opening of the mask hole 12H, namely the surface opening H1. The back surface 12R includes the opening of the mask hole 12H, namely the back surface opening H2. When observed from a viewpoint opposite to the surface 12F, the size of the surface opening H1 is larger than the back surface opening H2. Each mask hole 12H is a passage through which the vapor deposition particles vaporized or sublimated from the vapor deposition source pass. The vapor deposition particles vaporized or sublimated from the vapor deposition source advance in the mask hole 12H from the surface opening H1 toward the back surface opening H2. In the mask hole 12H, since the surface opening H1 is larger than the back surface opening H2, when observing the vapor deposition object from the vapor deposition particles flying toward the mask portion 12, the portion that becomes a shadow due to the vapor deposition mask 10 can be reduced, that is, the shadow effect can be suppressed.

[0086] The thickness of the mask portion 12 is, for example, not less than 1 μm and not more than 15 μm. With such a thin mask portion 12 , it is possible to suppress the shadow effect on the vapor deposition particles entering from the surface opening H1 .

[0087] [Method for producing vapor deposition mask]

[0088] Reference Figures 6 to 15 A method for manufacturing the vapor deposition mask 10 will be described.

[0089] The method for manufacturing the vapor deposition mask 10 includes: a step of bonding the mask portion 12 to the frame portion 11B having the second opening 11BH extending between the surface 11BF and the back surface 11BR; and a step of attaching the frame portion 11B having the second opening 11BH to the main body 11A having the first opening 11AH extending between the surface 11AF and the back surface 11AR. The step of bonding the mask portion 12 includes a step of bonding the mask portion 12 to the back surface 11BR of the frame portion 11B in a manner covering the second opening 11BH.

[0090] The step of installing the frame-shaped portion 11B includes the step of installing the frame-shaped portion 11B on the back side 11AR of the main body 11A opposite to the surface 11AF of the main body 11A so that the opening at the surface 11BF of the second opening portion 11BH faces the opening of the surface 11AF in the first opening portion 11AH and is detachable from the main body 11A. That is, the step of installing the frame-shaped portion 11B includes the step of detachably installing the frame-shaped portion 11B on the first back side so that the position of the second opening portion 11BH on the second surface is aligned with the position of the first opening portion 11AH on the first surface. Hereinafter, the manufacturing method of the vapor deposition mask 10 will be described in more detail with reference to the drawings.

[0091] in addition, Figures 6 to 11 The steps from the step of preparing a substrate for forming the mask portion 12 to the step of forming the mask portion 12 are shown. Figures 12 to 15 1 and 2 show the steps from the step of joining the mask unit 12 to the mask frame 11 to the step of removing the support body from the mask unit 12. Figures 12 to 15 In FIG. 1 , for convenience of illustration, the mask frame 11 has only one frame hole 11H, and the vapor deposition mask 10 has one mask portion 12 .

[0092] like Figures 6 to 11 As shown, in the method for manufacturing the vapor deposition mask 10, first, a substrate 20 (see FIG. 1 ) for forming the mask portion 12 is prepared. Figure 6 ). The base material 20 of the mask part 12 includes a metal plate 21 for forming the mask part 12 and a support 22 for supporting the metal plate 21. The support 22 is formed of a resin layer 22a and a glass substrate 22b. In the base material 20, the resin layer 22a is sandwiched by the metal plate 21 and the glass substrate 22b.

[0093] As described above, the metal plate 21 may be formed of an iron-nickel alloy. The glass substrate 22b may be formed of any one selected from the group consisting of alkali-free glass, quartz glass, crystallized glass, borosilicate glass, high silicate glass, porous glass, and soda-lime glass.

[0094] Next, the metal plate 21 is etched from the surface 21F, thereby reducing the thickness of the metal plate 21. For example, the thickness of the metal plate 21 can be reduced to a thickness of less than 1 / 2 of the thickness of the metal plate 21 before etching (see Figure 7 Then, a resist layer PR is formed on the surface 21F of the metal plate 21 (see Figure 8 ). The resist layer PR is exposed and developed, thereby forming a resist mask RM on the surface 21F (see Fig. 9 ).

[0095] Next, the metal plate 21 is wet-etched from the surface 21F using the resist mask RM. Thus, a plurality of mask holes 12H (see Fig.10 ). In the wet etching of the metal plate 21, a surface opening H1 is formed on the surface 21F, and then a back opening H2 smaller than the surface opening H1 is formed on the back surface 21R. Next, the resist mask RM is removed from the surface 21F, thereby manufacturing the mask portion 12 (see Fig.11 ). In addition, the surface 21F of the metal plate 21 corresponds to the surface 12F of the mask portion 12 , and the back surface 21R of the metal plate 21 corresponds to the back surface 12R of the mask portion 12 .

[0096] In the step of preparing the substrate 20 (see Figure 6 ) includes: a process of sandwiching a resin layer 22a between a metal plate 21 and a glass substrate 22b, and bonding the metal plate 21 to the glass substrate 22b via the resin layer 22a. When the metal plate 21, the resin layer 22a and the glass substrate 22b are bonded, first, among the surfaces of the metal plate 21 and the glass substrate 22b, at least the surface in contact with the resin layer 22a is subjected to CB (Chemical bonding) treatment. The surfaces of the metal plate 21 and the glass substrate 22b subjected to CB treatment are target surfaces. In the CB treatment, for example, a chemical solution is applied to the target surface, thereby imparting a functional group reactive with the resin layer 22a to the target surface. In the CB treatment, for example, a Si-based compound is imparted to the target surface.

[0097] Then, after the metal plate 21, the resin layer 22a and the glass substrate 22b are overlapped in the order described, they are hot pressed. At this time, the target surface of the metal plate 21 and the target surface of the glass substrate 22b are brought into contact with the resin layer 22a. Thus, the functional groups imparted to the target surfaces react with the functional groups located on the surface of the resin layer 22a, thereby the metal plate 21 and the resin layer 22a are bonded, and the glass substrate 22b and the resin layer 22a are bonded.

[0098] The resin layer 22a is preferably made of polyimide. In this case, the linear expansion coefficient of the metal plate 21, the linear expansion coefficient of the resin layer 22a, and the linear expansion coefficient of the glass substrate 22b are about the same. Therefore, in the process of manufacturing the evaporation mask 10, even if the laminated body formed by the metal plate 21, the resin layer 22a, and the glass substrate 22b is heated, the warping of the laminated body caused by the difference in the linear expansion coefficient between the layers forming the laminated body can be suppressed.

[0099] The method for manufacturing the metal plate 21 uses electrolysis or rolling. As post-treatment of the metal plate 21 obtained by these methods, grinding, annealing, etc. are appropriately used. In the case of using electrolysis in the manufacture of the metal plate 21, the metal plate 21 is formed on the surface of the electrode used for electrolysis. Then, the metal plate 21 is separated from the surface of the electrode. Thus, the metal plate 21 is manufactured. In the above-mentioned joining process, it is preferred to join the metal plate 21 having a thickness of 10μm or more to the glass substrate 22b via the resin layer 22a. In addition, in the case of manufacturing the metal plate 21 by rolling, the thickness of the metal plate 21 is preferably 15μm or more. In the case of manufacturing the metal plate 21 by electrolysis, the thickness of the metal plate 21 is preferably 10μm or more.

[0100] A thinning step of reducing the thickness of the metal plate 21 before forming the resist mask RM on the metal plate 21 (see Figure 7 ), wet etching can be used. As described above, in the thinning process, the thickness of the metal plate 21 after thinning can be reduced to less than 1 / 2 of the thickness of the metal plate 21 before thinning. Therefore, the thickness of the metal plate 21 can be made more than twice the thickness of the mask portion 12. Thus, even if the thickness required by the mask portion 12 is as thin as 15 μm or less as described above, before the metal plate 21 is joined to the glass substrate 22b, a metal plate 21 having higher rigidity than the mask portion 12 of the evaporation mask 10 can be used. Therefore, it is easier to join the metal plate 21 to the glass substrate 22b than in the case of joining a metal plate 21 having the same thickness as the mask portion 12 to the glass substrate 22b. In addition, the process of reducing the thickness of the metal plate 21 can be omitted.

[0101] The etching liquid used to make the metal plate 21 thinner by wet etching can be an acidic etching liquid. When the metal plate 21 is formed of Invar alloy, the etching liquid can be any etching liquid that can etch Invar alloy. The acidic etching liquid can be, for example, a solution obtained by mixing any one of perchloric acid, hydrochloric acid, sulfuric acid, formic acid and acetic acid with any one of ferric perchlorate solution and a mixture of ferric perchlorate solution and ferric chloride solution. The surface 21F can be etched by any one of immersion, spraying and spin coating.

[0102] In the etching step for forming the plurality of mask holes 12H in the metal plate 21 (see Fig.10 ), an acidic etching liquid can be used as the etching liquid. When the metal plate 21 is formed of Invar alloy, any etching liquid that can be used in the above-mentioned thinning process can be used as the etching liquid. Any etching method that can be used in the thinning process can also be used in the etching method for forming the mask hole 12H.

[0103] In addition, the process of preparing the substrate 20 may include: before the metal plate 21, the resin layer 22a, and the glass substrate 22b are bonded to each other, the process of thinning the metal plate 21 from one surface of the metal plate 21. In this case, the thinning process included in the process of preparing the substrate 20 is the first thinning process, and the thinning process performed after the process of preparing the substrate 20 is the second thinning process.

[0104] In the first thinning step, the metal plate 21 is thinned by etching from the first surface. In contrast, in the second thinning step, the metal plate 21 is thinned by etching from the second surface different from the first surface. The surface obtained after the first surface is etched is the surface of the metal plate 21 that is bonded to the resin layer 22a and is the surface that is subjected to the CB treatment.

[0105] By etching both the first surface and the second surface of the metal plate 21, the residual stress of the metal plate 21 can be adjusted from both the first surface and the second surface. As a result, the residual stress of the metal plate 21 after etching can be suppressed from being deviated compared to the case where only one surface is etched. Therefore, when the mask portion 12 obtained from the metal plate 21 is joined to the mask frame 11, wrinkles in the mask portion 12 can be suppressed. In the metal plate 21, the surface obtained by etching the first surface corresponds to the back surface 12R of the mask plate, and the surface obtained by etching the second surface corresponds to the surface 12F of the mask portion 12.

[0106] In addition, the etching amount when the metal plate 21 is etched from the first surface is the first etching amount, and the etching amount when the metal plate 21 is etched from the second surface is the second etching amount. The first etching amount and the second etching amount may be equal or different. In the case where the first etching amount and the second etching amount are different, the first etching amount may be greater than the second etching amount, or the second etching amount may be greater than the first etching amount. However, in the case where the second etching amount is greater than the first etching amount, the etching amount of the metal plate 21 in the state supported by the resin layer 22a and the glass substrate 22b is greater, so the metal plate 21 has good handleability, and as a result, the metal plate 21 is easier to etch.

[0107] like Figures 12 to 15 As shown, a portion of the mask frame 11 and a portion of the mask portion 12 are joined (see Fig.12 ). At this time, the plurality of mask portions 12 are joined to a single mask frame 11 in such a manner that each mask portion 12 covers a frame hole 11H that is different from each other. Then, the glass substrate 22b is removed from the resin layer 22a (see Fig.14 ). Next, the resin layer 22a is removed from each mask portion 12 (see Fig.15 ). Thus, the above-mentioned vapor deposition mask 10 can be obtained.

[0108] like Fig.12 As shown in FIG. 1 , in the process of joining a part of the mask frame 11 to a part of the mask portion 12, the mask frame 11 is first prepared. At this time, the frame-shaped portion 11B is embedded in the step portion AH1 of the main body portion 11A, thereby forming the mask frame 11. The mask frame 11 may be made of Invar alloy or may be formed of a metal other than Invar alloy. The metal other than Invar alloy may be, for example, stainless steel. The metal used to form the main body portion 11A and the metal used to form the frame-shaped portion 11B may be the same or different from each other.

[0109] In the step of joining the mask portion 12 to the frame portion 11B of the mask frame 11 (see Fig.12 ), laser welding can be used as a joining method. The first laser light L1 is irradiated to the portion included in the peripheral area 12B in the mask portion 12 through the glass substrate 22b and the resin layer 22a. Therefore, the glass substrate 22b and the resin layer 22a need to be transmissive to the first laser light L1. In other words, the first laser light L1 needs to have a wavelength that can penetrate the glass substrate 22b and the resin layer 22a. By intermittently irradiating the first laser light L1 along the edge of the second opening 11BH, an intermittent joining portion is formed. On the other hand, by continuously irradiating the first laser light L1 along the edge of the second opening 11BH, a continuous joining portion is formed. Thus, the mask portion 12 is welded to the frame-shaped portion 11B of the mask frame 11. The wavelength of the first laser light L1 is preferably 355nm.

[0110] Fig.13 Will Fig.12 The region A shown is an enlarged view. The region A includes a bonding mark formed by welding the mask portion 12 to the frame portion 11B. Fig.13 The joining marks are schematically shown in FIG.

[0111] like Fig.13 As shown, each frame-shaped portion 11B has a welding mark 11BW formed by welding the mask portion 12 to the frame-shaped portion 11B. When the mask portion 12 is laser-welded to the frame-shaped portion 11B, the mask portion 12 and the frame-shaped portion 11B are irradiated with the first laser beam L1. By irradiating the mask portion 12 with the first laser beam L1, the portion of the mask portion 12 irradiated with the first laser beam L1 is deformed in a manner concave toward the frame-shaped portion 11B along the direction from the back surface 11BR of the frame-shaped portion 11B toward the front surface 11BF. As a result, a depression is formed in the frame-shaped portion 11B by the amount of a part of the mask portion 12 being concave. That is, the welding mark 11BW of the frame-shaped portion 11B is a depression formed on the back surface 11BR.

[0112] The process of removing the support body 22 includes a first process (see Fig.14 ) and the second step (refer to Fig.15 ). In the first step, the interface between the resin layer 22a and the glass substrate 22b is irradiated with the second laser light L2. The second laser light L2 has a wavelength that is transmitted through the glass substrate 22b and absorbed by the resin layer 22a. Thus, the glass substrate 22b is removed from the resin layer 22a. The wavelength of the second laser light L2 is preferably 308nm or 355nm.

[0113] In the first step, the second laser beam L2 is irradiated to the interface between the resin layer 22a and the glass substrate 22b, so that the resin layer 22a absorbs the heat of the second laser beam L2. As a result, the resin layer 22a is heated, thereby reducing the chemical bonding strength between the resin layer 22a and the glass substrate 22b. Then, the glass substrate 22b is removed from the resin layer 22a. In the first step, it is preferred to irradiate the entire joint with the second laser beam L2, but as long as the bonding strength between the glass substrate 22b and the resin layer 22a in the entire joint can be reduced, the second laser beam L2 may be irradiated to a part of the joint.

[0114] In the wavelength of the second laser light L2, the transmittance of the glass substrate 22b is preferably higher than the transmittance of the resin layer 22a. Thus, compared with the case where the transmittance of the glass substrate 22b is lower than the transmittance of the resin layer 22a, the efficiency of heating the portion of the resin layer 22a that forms the interface between the glass substrate 22b and the resin layer 22a can be improved.

[0115] As described above, the resin layer 22a is preferably made of polyimide. The resin layer 22a is preferably formed of colored polyimide among polyimides. The glass substrate 22b is preferably transparent.

[0116] In the second step, after the first step, the resin layer 22a is dissolved using the liquid medicine LM, thereby removing the resin layer 22a from the mask portion 12. The liquid medicine LM can be a liquid that can dissolve the material forming the resin layer 22a and is non-reactive with the material forming the mask portion 12. For example, the liquid medicine LM can be an alkaline solution. For example, the alkaline solution can be an aqueous sodium hydroxide solution. Fig.15 In the embodiment, the immersion method is exemplified as a method for bringing the resin layer 22a into contact with the chemical solution LM. However, a spraying method or a spin coating method may also be used as a method for bringing the resin layer 22a into contact with the chemical solution LM.

[0117] In this way, in the process of removing the support body 22 from the mask part 12, the glass substrate 22b is removed from the resin layer 22a by the first process, and the resin layer 22a is removed from the mask part 12 by the second process. Therefore, compared with the case where the support body 22 is removed from the mask part 12 by interface destruction caused by the external force applied to the laminated body of the glass substrate 22b, the resin layer 22a, and the mask part 12, the external force acting on the mask part 12 can be reduced. As a result, the deformation of the mask part 12 caused by the removal of the support body 22 can be suppressed, and the deformation of the mask hole 12H included in the mask part 12 can be suppressed.

[0118] As described above, the mask portion 12 may be bonded to the frame portion 11B after the frame portion 11B is fitted into the step portion AH1 of the body portion 11A, or may be bonded to the frame portion 11B before the frame portion 11B is fitted into the step portion AH1 of the body portion 11A.

[0119] [Role of the evaporation mask]

[0120] Reference Fig.16 The operation of the vapor deposition mask 10 in which the mask portion 12 is welded to the frame-shaped portion 11B will be described. Fig.16 1 and 2 show a step of removing the mask portion 12 together with the frame-shaped portion 11B from the main body portion 11A of the mask frame 11 .

[0121] like Fig.16 As shown, when the mask portion 12 joined to the mask frame 11 is replaced with a new mask portion 12, the mask portion 12 is removed from the main body portion 11A together with the frame portion 11B. Therefore, the welding mark 11BW formed by welding the mask portion 12 to the mask frame 11 is removed from the main body portion 11A together with the frame portion 11B.

[0122] The welding mark 11BW formed on the mask frame 11 by welding the mask portion 12 is a depression formed on the surface of the mask frame 11 to which the mask portion 12 is joined. Therefore, in order to remove the welding mark 11BW from the mask frame 11, it is necessary to remove the welding mark 11BW from the mask frame 11 or fill the welding mark 11BW. It is difficult to perform these processes when the mask portion 12 other than the mask portion 12 to be processed is joined to the mask frame 11. Therefore, in the case where the mask portion 12 is welded to the frame-shaped portion 11B, the effect brought about by joining the mask portion 12 to the frame-shaped portion 11B provided in the mask frame 11 can be more significantly obtained.

[0123] In addition, in order to remove the welding mark 11BW from the mask frame 11, the second opening 11BH defined by the frame-shaped portion 11B may be expanded when the portion of the mask frame 11 including the welding mark 11BW is removed from the other portions of the mask frame 11. As a result, the size of the second opening 11BH defined by the frame-shaped portion 11B changes when viewed from a viewpoint opposite to the surface 11BF of the frame-shaped portion 11B.

[0124] When a new mask unit 12 is joined to the mask frame 11, the mask unit 12 may be joined to the frame-shaped unit 11B after the frame-shaped unit 11B is inserted into the main body 11A. In this case, the glass substrate 22b and the resin layer 22a are removed from the mask unit 12 mounted on the main body 11A together with the frame-shaped unit 11B. Therefore, when the resin layer 22a is removed from the mask unit 12, for example, the mask frame 11 needs to be fixed in such a manner that only the mask unit 12 and the resin layer 22a are in contact with the chemical solution LM.

[0125] Alternatively, the frame-shaped portion 11B may be embedded in the main body portion 11A after the mask portion 12 is joined to the frame-shaped portion 11B. In this case, the glass substrate 22b and the resin layer 22a are removed from the mask portion 12 joined to the frame-shaped portion 11B. Therefore, when the resin layer 22a is removed from the mask portion 12, for example, the frame-shaped portion 11B needs to be fixed in such a manner that only the mask portion 12 and the resin layer 22a are in contact with the chemical solution LM.

[0126] In either case, the welding mark 11BW is formed in the frame-shaped portion 11B by welding the mask portion 12 to the frame-shaped portion 11B. However, the welding mark 11BW of the frame-shaped portion 11B is removed from the main body 11A together with the mask portion 12 to be replaced, so it is easy to rejoin the mask portion 12 to the mask frame 11. In addition, by rejoining the mask portion 12 to the mask frame 11 in this way, one mask frame 11 can be reused.

[0127] [Manufacturing method of display device]

[0128] Reference Fig.17 A method for manufacturing a display device will be described.

[0129] The method for manufacturing a display device includes a step of forming a pattern on a vapor deposition object S using the vapor deposition mask 10 manufactured by the method for manufacturing the vapor deposition mask 10. Hereinafter, the pattern forming step will be described together with an example of a vapor deposition apparatus.

[0130] like Fig.17 As shown, the vapor deposition device 30 includes a receiving tank 31 for receiving the vapor deposition mask 10 and the vapor deposition object S. The receiving tank 31 is configured to hold the vapor deposition object S and the vapor deposition mask 10 at a predetermined position in the receiving tank 31. A holding portion 32 for holding the vapor deposition material Mvd and a heating portion 33 for heating the vapor deposition material Mvd are located in the receiving tank 31. The vapor deposition material Mvd held by the holding portion 32 is, for example, an organic light-emitting material. The receiving tank 31 positions the vapor deposition object S and the vapor deposition mask 10 in the receiving tank 31 in such a manner that the vapor deposition mask 10 is located between the vapor deposition object S and the holding portion 32 and the vapor deposition mask 10 and the holding portion 32 are opposed to each other. The vapor deposition mask 10 is arranged in the receiving tank 31 in a state in which the back side 12R of the mask portion 12 is in close contact with the vapor deposition object S.

[0131] In the process of forming the pattern, the evaporation material Mvd is heated by the heating unit 33, thereby vaporizing or sublimating the evaporation material Mvd. The vaporized or sublimated evaporation material Mvd passes through the mask hole 12H provided in the mask unit 12 of the evaporation mask 10 and adheres to the evaporation object S. Thus, an organic layer having a shape corresponding to the shape and position of the mask hole 12H provided in the evaporation mask 10 is formed at a predetermined position of the evaporation object S. In addition, the evaporation material Mvd may also be a metal material or the like used to form a pixel electrode provided in a pixel circuit of a display layer.

[0132] As described above, according to the first embodiment of the vapor deposition mask, the method for manufacturing the vapor deposition mask, and the method for manufacturing the display device, the effects described below can be obtained.

[0133] (1-1) When the mask portion 12 is rejoined to the mask frame 11 , it is not necessary to process the joining marks of the mask frame 11 , and thus the mask portion 12 can be easily rejoined to the mask frame 11 .

[0134] (1-2) Since the back surface 11BR of the frame portion 11B is flush with the back surface 11AR of the main body portion 11A, the back surface 11AR of the main body portion 11A can be prevented from protruding relative to the back surface 11BR of the frame portion 11B, thereby preventing a gap from being formed between the mask portion 12 and the vapor deposition object S.

[0135] (1-3) Since the frame portion 11B is magnetically attracted to the main body portion 11A, the accuracy of the position of the frame portion 11B relative to the main body portion 11A is less likely to decrease compared to a case where the frame portion 11B is fixed to the main body portion 11A using a fastening member such as a screw.

[0136] (1-4) When the mask portion 12 is welded to the frame portion 11B, the mask portion 12 is joined to the frame portion 11B of the mask frame 11 , thereby more significantly achieving the effect of facilitating the recombination of the mask portion 12 .

[0137] (1-5) The frame portion 11B is located at the step portion AH1, so that the gap between the back surface 11AR of the main body 11A and the mask portion 12 can be reduced, thereby reducing the difference in force between the portion of the vapor deposition object that contacts the vapor deposition mask 10 and the portion that does not contact the vapor deposition mask 10.

[0138] [Modification of the first embodiment]

[0139] In addition, the above-mentioned first embodiment can be implemented with modifications as follows.

[0140] [Fixed part]

[0141] The fixing part may not have a permanent magnet, but may have an electromagnet, for example. Alternatively, the fixing part may fix the frame-shaped part 11B to the main body 11A by electrostatic force, vacuum adsorption, etc. instead of magnetic adsorption. Alternatively, the fixing part may fix the frame-shaped part 11B to the main body 11A by a fastening member. Alternatively, the fixing part may be an adhesive containing indium.

[0142] The main body 11A may not have the fixing portion. In this case, by bonding the mask portion 12 to the frame portion 11B embedded in the step portion AH1 of the main body 11A, the effect corresponding to the above (1-1) can be obtained.

[0143] [Frame-like portion]

[0144] In the cross section perpendicular to the back surface 11AR of the main body 11A, the thickness TB of the frame portion 11B may be smaller than the depth D of the step portion AH1 of the main body 11A. In this case as well, by bonding the mask portion 12 to the frame portion 11B embedded in the step portion AH1 of the main body 11A, the effect corresponding to the above (1-1) can be obtained.

[0145] In this case, in the cross section perpendicular to the back surface 11AR of the main body 11A, the back surface 12R of the mask 12 preferably protrudes from the back surface 11AR of the main body 11A. This can suppress the formation of a gap between the mask 12 and the vapor deposition object S, and as a result, the accuracy of the shape of the pattern formed on the vapor deposition object S can be improved.

[0146] [Main body]

[0147] The main body 11A may include only one first opening 11AH. In this case, the vapor deposition mask 10 only needs to include one frame-shaped portion 11B and one mask portion 12. In this case, by joining the mask portion 12 to the frame-shaped portion 11B embedded in the step portion AH1 of the main body 11A, the effect of (1-1) described above can be obtained.

[0148] The main body 11A may not have the step portion AH1. In this case, the frame portion 11B can be located on the flat rear surface 11AR of the main body 11A. In this case, since the mask frame 11 has the main body 11A and the frame portion 11B, the effect of (1-1) can also be obtained.

[0149] [Join]

[0150] The joining of the mask portion 12 to the frame portion 11B is not limited to laser welding, and resistance welding, ultrasonic welding, etc. may also be used. In any of these cases, by joining the mask portion 12 to the frame portion 11B embedded in the step portion AH1 of the main body portion 11A, the effect of (1-1) above can be obtained.

[0151] The joining of the mask part 12 to the frame part 11B is not limited to welding, and bonding may be used. In this case, an adhesive layer is formed as a bonding mark for joining the mask part 12 to the frame part 11B. By bonding the mask part 12 to the frame part 11B and inserting the frame part 11B into the main body part 11A, the frame part 11B on which the adhesive layer is formed as a bonding mark is replaced with a new frame part 11B, and the adhesive layer can be removed from the main body part 11A.

[0152] In addition, when bonding is used to join the frame-shaped portion 11B and the mask portion 12, the evaporation device carrying the evaporation mask 10 preferably includes a cooling unit for cooling the evaporation mask 10. In addition, from the viewpoint of improving the strength and heat resistance of the joining between the frame-shaped portion 11B and the mask portion 12, the mask portion 12 is preferably joined to the frame-shaped portion 11B by welding.

[0153] [Second embodiment]

[0154] Reference Figures 18 to 22A second embodiment of a vapor deposition mask, a method for manufacturing a vapor deposition mask, and a method for manufacturing a display device is described. In the second embodiment, the structure of fixing the frame-shaped portion to the main body portion is different from that in the first embodiment. Therefore, the following describes such differences in detail. On the other hand, for the structures in the second embodiment that are common to the first embodiment, the same reference numerals as those in the first embodiment are given and the detailed description of the structures is omitted.

[0155] [Evaporation mask]

[0156] Fig.18 The structure of the vapor deposition mask viewed from a viewpoint facing the back side of the mask frame is shown. Fig.18 Only one first opening in the vapor deposition mask and the structure around the first opening are shown.

[0157] like Fig.18 As shown in FIG. 1 , the vapor deposition mask 40 includes a mask frame 41 and a mask portion 12. Like the mask frame 11 of the first embodiment, the mask frame 41 includes a main body portion 41A and a frame portion 41B. The mask frame 41 includes a fixing portion 41C. The fixing portion 41C fixes the frame portion 41B to the main body portion 41A. Fig.18 In the example shown, the mask frame 41 includes three fixing portions 41C. Since the frame portion 41B is fixed to the main body portion 41A by the three fixing portions 41C, the position of the frame portion 41B on the plane where the mask portion 12 extends can be determined with high accuracy.

[0158] exist Fig.18 In the example shown, the outer shape of the frame portion 41B has a rectangular shape. The fixing portions 41C are located at the ends of one of a pair of opposing sides of the frame portion 41B and at the center of the other side. The fixing portions are an example of a first position adjusting portion.

[0159] Fig.19 Indicates along Fig.18 The cross section is taken along the line XIX-XIX shown in FIG. The line XIX-XIX is a line segment passing through the two fixing portions 41C.

[0160] like Fig.19 As shown, similar to the main body 11A of the first embodiment, the main body 41A includes a first opening 41AH and a step AH1. The first opening 41AH passes through between the front surface 41AF and the back surface 41AR. The step AH1 of the main body 41A is a depression located on the back surface 41AR and surrounds the first opening 41AH when viewed from above facing the back surface 41AR.

[0161] Similar to the frame-shaped portion 11B of the first embodiment, the frame-shaped portion 41B has a second opening portion 41BH. The second opening portion 41BH passes through between the surface 41BF and the back surface 41BR. When observed from a viewpoint opposite to the surface 41AF of the main body 41A, the second opening portion 41BH is located in the area divided by the first opening portion 41AH. The frame-shaped portion 41B also has fixing holes BH1. The frame-shaped portion 41B of this embodiment has the same number of fixing holes BH1 as the fixing portion 41C. Each fixing hole BH1 is configured so that one fixing portion 41C can be located in the fixing hole BH1. The fixing portion 41C fixes the frame-shaped portion 41B to the main body 41A in a manner that allows it to be removed from the main body 41A.

[0162] The mask portion 12 is bonded to the back surface 41BR of the frame portion 41B. The mask portion 12 is bonded to the frame portion 41B by any of the methods for bonding the mask portion 12 to the frame portion 41B in the first embodiment and the modified example of the first embodiment.

[0163] Fig. 20 One fixing portion 41C in the mask frame 41 and the surrounding structure of the fixing portion 41C are shown.

[0164] like Fig. 20 As shown, the fixing portion 41C includes a threaded portion 41C1 and an adsorption portion 41C2. A groove (not shown) into which the threaded portion 41C1 is screwed is formed on the surface that divides the fixing hole BH1. The outer peripheral surface of the threaded portion 41C1 has a shape that can be screwed into the groove of the fixing hole BH1. The threaded portion 41C1 has a rod shape extending in a direction from the back side 41BR of the frame-shaped portion 41B toward the surface 41BF. When the entire threaded portion 41C1 is located in the fixing hole BH1, in the threaded portion 41C1, the end that is closer to the back side 41BR is the base end, and the end on the opposite side to the base end is the front end. The adsorption portion 41C2 is located at the front end of the threaded portion 41C1.

[0165] The adsorption part 41C2 is formed by a magnet. The main body 41A is formed by a ferromagnetic body. Alternatively, a portion of the main body 41A including the area where the adsorption part 41C2 contacts is formed by a ferromagnetic body. Thus, when the adsorption part 41C2 contacts the main body 41A, the adsorption part 41C2 is fixed to the main body 41A, and the frame part 41B is fixed to the main body 41A. In addition, Fig.19 as well as Fig. 20 This shows a state where the adsorption portion 41C2 is separated from the main body portion 41A, and a state where the frame-shaped portion 41B is not fixed to the main body portion 41A.

[0166] [Fixing method]

[0167] Reference Figures 19 to 22A method of fixing the frame-shaped portion 41B to the main body portion 41A will be described.

[0168] like Fig.19 as well as Fig. 20 As shown, when the frame-like portion 41B is not fixed to the main body 41A, the fixing portion 41C is attached to the frame-like portion 41B in a manner that the adsorption portion 41C2 does not contact the main body 41A. By rotating the fixing portion 41C in the first rotation direction, the position of the fixing portion 41C relative to the frame-like portion 41B is changed in a manner that the adsorption portion 41C2 approaches the surface 41BF of the frame-like portion 41B. By rotating the fixing portion 41C until the adsorption portion 41C2 and the surface 41BF of the frame-like portion 41B are flush with each other, the adsorption portion 41C2 can be brought into contact with the main body 41A. Thus, the frame-like portion 41B can be fixed to the main body 41A by the magnetic force of the adsorption portion 41C2.

[0169] like Fig.21 As shown, by further rotating the fixing portion 41C in the first rotation direction, the tip of the screw portion 41C1 can be made to protrude from the surface 41BF of the frame-shaped portion 41B.

[0170] like Fig. 22 As shown, the distance between the surface 41BF of the frame-shaped portion 41B and the front end of the threaded portion 41C1 is the protrusion of the fixing portion 41C. The smaller the protrusion, the smaller the distance between the back surface 41BR of the frame-shaped portion 41B and the back surface 41AR of the main body 41A. In other words, the larger the protrusion, the larger the distance between the back surface 41BR of the frame-shaped portion 41B and the back surface 41AR of the main body 41A. In this way, according to the fixing portion 41C, in the thickness direction of the main body 41A, the position of the frame-shaped portion 41B relative to the main body 41A can be changed between the first position and the second position. Therefore, the position deviation of the mask portion 12 caused by the thickness deviation between the plurality of frame-shaped portions 41B can be suppressed by the fixing portion 41C.

[0171] In addition, when removing the frame-shaped portion 41B from the main body 41A, it is sufficient to rotate the fixing portion 41C in the second rotation direction. The second rotation direction is the direction opposite to the first rotation direction. Thus, by positioning the front end of the threaded portion 41C1 in the fixing hole BH1, a gap can be formed between the adsorption portion 41C2 and the main body 41A. As a result, the fixing of the frame-shaped portion 41B relative to the main body 41A can be released.

[0172] Thus, according to the vapor deposition mask 40 of this embodiment, the frame-shaped portion 41B can be fixed to the main body portion 41A by the fixing portion 41C. Furthermore, the distance between the back surface 41BR of the frame-shaped portion 41B and the back surface 41AR of the main body portion 41A can be changed by the fixing portion 41C. In other words, the position of the frame-shaped portion 41B in the thickness direction of the mask portion 12 can be changed by the fixing portion 41C.

[0173] As described above, according to the second embodiment of the vapor deposition mask, the method for manufacturing the vapor deposition mask, and the method for manufacturing a display device, in addition to the above (1-1), (1-3), and (1-4), the following effects can be obtained.

[0174] (2-1) The frame-shaped portion 41B can be fixed to the main body portion 41A by the fixing portion 41C.

[0175] (2-2) The fixing portion 41C can change the position of the frame portion 41B in the thickness direction of the mask portion 12. Therefore, the fixing portion 41C can suppress positional deviation of the mask portion 12 due to thickness variations among the plurality of frame portions 41B.

[0176] (2-3) By fixing the frame-shaped portion 41B to the main body portion 41A using the three fixing portions 41C, the position of the frame-shaped portion 41B on the plane where the mask portion 12 extends can be determined with high accuracy.

[0177] [Modification of the Second Embodiment]

[0178] The second embodiment described above can be implemented with modifications as follows.

[0179] [Fixed part]

[0180] The mask frame 41 may include four or more fixing portions 41C. For example, when the mask frame 41 includes four fixing portions 41C, the fixing portions 41C may be located at corners of the frame-shaped portion 51B, respectively.

[0181] The mask frame 41 may include only two fixing portions 41C. In this case, the fixing portions 41C may be located on the same diagonal line among the corners of the frame-shaped portion 41B.

[0182] [Third Embodiment]

[0183] Reference Fig.23 as well as Fig.24A third embodiment of a vapor deposition mask, a method for manufacturing a vapor deposition mask, and a method for manufacturing a display device is described. In the third embodiment, the structure of fixing the frame-shaped portion to the main body portion is different from that in the first embodiment. Therefore, the following describes such differences in detail. On the other hand, in the third embodiment, for the structure common to the first embodiment, the same reference numerals as those in the first embodiment are given and the detailed description of the structure is omitted.

[0184] [Evaporation mask]

[0185] Fig.23 1 shows the structure of the vapor deposition mask viewed from a viewpoint opposite to the back side of the mask frame. Fig.23 Only one first opening in the vapor deposition mask and the surrounding structure of the first opening are shown.

[0186] like Fig.23 As shown in FIG. 1 , the vapor deposition mask 50 includes a mask frame 51 and a mask portion 12. Similar to the mask frame 11 of the first embodiment, the mask frame 51 includes a main body portion 51A and a frame portion 51B. The main body portion 51A has a first opening portion 51AH. Fig.23 In the example shown, the first opening 51AH has a rectangular shape. The main body 51A includes a plurality of support platforms 51A1 that protrude into the first opening 51AH from the side surface that divides the first opening 51AH. The support platforms 51A1 protrude into the first opening 51AH from the back surface 51AR of the main body 51A toward the front surface 51AF.

[0187] exist Fig.23 In the example shown, the main body 51A has a plurality of support platforms 51A1 for each first opening 51AH. In this example, the main body 51A has three support platforms 51A1 for each first opening 51AH. When viewed from a viewpoint opposite to the back surface 51AR, support platforms 51A1 are respectively present at two corners adjacent to each other on the X-axis among the corners of the first opening 51AH. The remaining support platforms 51A1 are located at the center of the side surface opposite to the side surface where the two corners are located among the side surfaces extending along the X-axis. When viewed from a viewpoint opposite to the back surface 51AR, each support platform 51A1 has a quadrilateral shape.

[0188] The main body 51A further includes a plurality of fixing pieces 51A2 protruding from the side surface that defines the first opening 51AH into the first opening 51AH. Each fixing piece 51A2 extends from the back surface 51AR of the main body 51A toward the front surface 51AF (see FIG. 1 ). Fig.24 ) protrudes into the first opening 51AH. Fig.23In the example shown, a pair of fixing pieces 51A2 protrude into the first opening 51AH from the side surfaces extending along the Y axis among the side surfaces dividing the first opening 51AH. In addition, a pair of fixing pieces 51A2 protrude into the first opening 51AH from the center of the side surfaces extending along the X axis among the side surfaces dividing the first opening 51AH and where the support platform 51A1 is not located.

[0189] The frame portion 51B is located on an XY plane defined by an X-axis and a Y-axis orthogonal to the X-axis. The axis orthogonal to the XY plane is the Z-axis. The frame portion 51B includes a frame body 51B1 and a plurality of protruding pieces 51B2. The frame body 51B1 has a rectangular frame shape. The frame portion 51B is located in the first opening 51AH. Each protruding piece 51B2 is located on a surface 51BF (see Fig.24 Each protruding piece 51B2 extends downward from the frame body 51B1 toward the surface 51AF of the main body 51A. Fig.23 In the example shown, the frame portion 51B has three protruding pieces 51B2. When viewed from a point opposite to the back surface 51BR of the frame portion 51B, one protruding piece 51B2 is located between a pair of fixing pieces 51A2. Fig.23 In the embodiment, the second opening defined by the frame-shaped portion 51B is covered by the mask portion 12 .

[0190] Fig.24 Indicates along Fig.23 A cross section along line XXIV-XXIV is shown.

[0191] like Fig.24 As shown, the mask frame 51 further includes an X-axis adjustment screw 51C, a fixing screw 51E, and a Z-axis adjustment screw 51F. On the X-axis, the protruding piece 51B2 of the frame-shaped portion 51B is clamped by a pair of fixing pieces 51A2, and is clamped by the X-axis adjustment screw 51C and the fixing screw 51E. The X-axis adjustment screw 51C mounts the protruding piece 51B2 to one of the pair of fixing pieces 51A2. The fixing screw 51E mounts the protruding piece 51B2 to the other of the pair of fixing pieces 51A2. By changing the tightening amount of the X-axis adjustment screw 51C relative to the protruding piece 51B2, the position of the frame-shaped portion 51B on the X-axis can be changed.

[0192] In addition, the mask frame 51 further includes two Y-axis adjustment screws 51D and two fixing screws 51E (see Fig.23). The remaining protruding piece 51B2 is clamped on the Y axis by a pair of fixed pieces 51A2 and by a Y axis adjustment screw 51D and a fixing screw 51E. The Y axis adjustment screw 51D mounts the protruding piece 51B2 on one of the pair of fixed pieces 51A2. The fixing screw 51E mounts the protruding piece 51B2 on the other of the pair of fixed pieces 51A2. By changing the tightening amount of the Y axis adjustment screw 51D relative to the protruding piece 51B2, the position of the frame-shaped portion 51B on the Y axis can be changed.

[0193] That is, in this embodiment, an example of a second position adjustment unit is constituted by the X-axis adjustment screw 51C, the Y-axis adjustment screw 51D, and the fixing screw 51E. According to the second position adjustment unit, the position of the frame-shaped portion 51B relative to the main body portion 51A can be changed between the third position and the fourth position in the plane extended by the frame-shaped portion 51B. Therefore, the positional deviation of the second openings between the plurality of frame-shaped portions 51B can be suppressed by the second position adjustment unit.

[0194] The Z-axis adjustment screw 51F has a rod shape extending along the Z-axis. The Z-axis adjustment screw 51F passes through a through hole that penetrates the support platform 51A1 along the Z-axis, whereby the Z-axis adjustment screw 51F is mounted on the main body 51A. When the Z-axis adjustment screw 51F is in contact with the frame-shaped portion 51B, the end of the Z-axis adjustment screw 51F that is in contact with the frame-shaped portion 51B is the front end, and the end on the opposite side of the front end is the base end. The adsorption portion not shown is located at the front end of the Z-axis adjustment screw 51F. The adsorption portion is formed by a magnet. The frame body 51B1 of the frame-shaped portion 51B is formed by a ferromagnetic body. Alternatively, a portion of the frame body 51B1, which includes the area contacted by the Z-axis adjustment screw 51F, is formed by a ferromagnetic body. Thus, when the Z-axis adjustment screw 51F is in contact with the frame body 51B1, the frame body 51B1 is fixed to the Z-axis adjustment screw 51F. By changing the amount by which the front end of the Z-axis adjustment screw 51F protrudes from the support platform 51A1, the position of the frame-shaped portion 51B on the Z-axis can be changed. That is, in the present embodiment, the Z-axis adjustment screw 51F is an example of a first position adjustment portion. According to the Z-axis adjustment screw 51F, in the thickness direction of the main body 51A, that is, on the Z-axis, the positional deviation of the mask portion 12 caused by the thickness deviation between the plurality of frame-shaped portions 51B can be suppressed by the Z-axis adjustment screw 51F.

[0195] [Fixing method]

[0196] The following describes a method for fixing the frame-like portion 51B to the main body 51A. In addition, when fixing the frame-like portion 51B to the main body 51A, a holding table for holding the frame-like portion 51B can be used. For example, when viewed from a viewpoint opposite to the back surface 51AR of the main body 51A, the holding table can be located in an area inside the first opening 51AH that is closer to the inside than the support table 51A1. The holding table includes a loading portion and a lifting portion. The frame-like portion 51B is placed on the loading portion. The lifting portion can be configured to lift and lower the loading portion on the Z axis to change the position of the frame-like portion 51B relative to the main body 51A.

[0197] In the vapor deposition mask 50 of the present embodiment, when the frame-shaped portion 51B is fixed to the main body 51A, first, the position of the frame-shaped portion 51B on the Z axis is determined by three Z-axis adjustment screws 51F while the frame-shaped portion 51B is held on the holding table. At this time, the amount of protrusion of each Z-axis adjustment screw 51F from the support table 51A1 is set to a predetermined size, and then the frame-shaped portion 51B is fixed relative to the Z-axis adjustment screw 51F. Then, each protruding piece 51B2 is fixed to the fixed piece 51A2 using the fixing screw 51E. Next, while the protruding piece 51B2 of the frame-shaped portion 51B is fixed to the fixed piece 51A2 of the main body 51A using the X-axis adjustment screw 51C, the position of the frame-shaped portion 51B on the X axis is determined. In addition, while the protruding piece 51B2 is fixed to the fixed piece 51A2 using the Y-axis adjustment screw 51D, the position of the frame-shaped portion 51B in the Y axis is determined. Thus, the frame-shaped portion 51B is fixed to the main body portion 51A at predetermined positions on the XY plane and on the Z axis.

[0198] Furthermore, by removing the X-axis adjustment screw 51C, the Y-axis adjustment screw 51D, and the Z-axis adjustment screw 51F from the frame-shaped portion 51B, the fixation of the frame-shaped portion 51B to the main body portion 51A can be released.

[0199] As described above, the vapor deposition mask, the method for manufacturing the vapor deposition mask, and the method for manufacturing a display device can obtain the following effects in addition to the above (1-1), (1-3), and (1-4).

[0200] (3-1) The position of the frame portion 51B on the XY plane can be adjusted using the X-axis adjustment screw 51C and the Y-axis adjustment screw 51D. This can suppress positional deviation of the second openings between the plurality of frame portions 51B.

[0201] (3-2) The position of the frame-shaped portion 51B on the Z axis can be adjusted using the Z axis adjustment screw 51F. Thus, the positional deviation of the mask portion 12 caused by the thickness variation among the plurality of frame-shaped portions 51B can be suppressed by the Z axis adjustment screw 51F.

[0202] [Modification of the Third Embodiment]

[0203] The third embodiment described above can be implemented with modifications as follows.

[0204] [Supporting platform]

[0205] The main body 51A may also include four or more support platforms 51A1. For example, when the main body 51A includes four support platforms 51A1, each support platform 51A1 may protrude from a corner of the first opening 51AH. In addition, when the main body 51A includes four or more support platforms 51A1, the mask frame 51 may include the same number of Z-axis adjustment screws 51F as the number of support platforms 51A1.

[0206] The support base 51A1 of the main body 51A may have a shape protruding toward the first opening 51AH over the entire circumference of the first opening 51AH. That is, the main body 51A may include a step portion formed by expanding the opening of the rear surface 51AR of the main body 51A in the first opening 51AH.

[0207] [cover]

[0208] The vapor deposition mask 50 may include a cover that covers the support platform 51A1, the fixing piece 51A2, and the protruding piece 51B2. When observed from a viewpoint opposite to the surface 51AF of the main body 51A, the cover covers the support platform 51A1, the fixing piece 51A2, and the protruding piece 51B2. Thus, when the vapor deposition mask 50 is mounted on the vapor deposition device, the cover is located between the vapor deposition source and the support platform 51A1, the fixing piece 51A2, and the protruding piece 51B2. Therefore, the cover can prevent the vapor deposition material from adhering to the support platform 51A1, the fixing piece 51A2, and the protruding piece 51B2. Thus, the cover can also prevent the vapor deposition material from adhering to the X-axis adjustment screw 51C, the Y-axis adjustment screw 51D, the fixing screw 51E, and the Z-axis adjustment screw 51F.

[0209] [Fourth Embodiment]

[0210] Reference Fig.25 as well as Fig.26 A fourth embodiment of a vapor deposition mask, a method for manufacturing a vapor deposition mask, and a method for manufacturing a display device is described. In the fourth embodiment, the structure of fixing the frame-shaped portion to the main body portion is different from that in the first embodiment. Therefore, the following describes such differences in detail. On the other hand, in the fourth embodiment, for the structure common to the first embodiment, the same reference numerals as in the first embodiment are given and the detailed description of the structure is omitted.

[0211] [Evaporation mask]

[0212] Fig.25 1 shows the structure of the vapor deposition mask viewed from a viewpoint opposite to the back side of the mask frame. Fig.25 Only one first opening in the vapor deposition mask and the structure around the first opening are shown.

[0213] like Fig.25 As shown, the vapor deposition mask 60 includes a mask frame 61 and a mask portion 12. Like the mask frame 11 of the first embodiment, the mask frame 61 includes a main body 61A and a frame-shaped portion 61B. The frame-shaped portion 61B includes a frame body 61B1 and a plurality of protruding pieces 61B2. The frame body 61B1 has a rectangular frame shape and is configured to support the mask portion 12. The frame body 61B1 is located on an XY plane defined by an X-axis and a Y-axis orthogonal to the X-axis. The axis orthogonal to the XY plane is the Z-axis.

[0214] The protruding piece 61B2 protrudes from the edge of the frame body 61B1 toward the outside of the edge. Fig.25 In the example shown, the frame-shaped portion 61B includes three protrusion pieces 61B2. The frame-shaped portion 61B includes the protrusion piece 61B2 extending along the Y axis from the side extending along the X axis among the edges of the frame body 61B1. The frame-shaped portion 61B includes the protrusion piece 61B2 extending along the X axis from one side extending along the Y axis among the edges of the frame body 61B1, and the protrusion piece 61B2 extending along the X axis from the other side extending along the Y axis among the edges of the frame body 61B1.

[0215] The main body 61A includes a supporting portion 61A1 and a plurality of fixing pieces 61A2. The supporting portion 61A1 has a plurality of first openings 61AH. Each fixing piece 61A2 is supported by the supporting portion 61A1. The fixing piece 61A2 is located around the first opening 61AH. A protruding piece 61B2 is fixed to each fixing piece 61A2. When viewed from a viewpoint opposite to the XY plane, in a state where the frame-shaped portion 61B is fixed to the main body 61A, each fixing piece 61A2 has a U-shape surrounding the protruding piece 61B2 fixed to the fixing piece 61A2. By fixing the protruding piece 61B2 to the fixing piece 61A2, the supporting portion 61A1 supports the frame main body 61B1.

[0216] The mask frame 61 further includes an X-axis adjustment screw 61C, a Y-axis adjustment screw 61D, and a fixing screw 61E. Fig.25 In the illustrated example, the mask frame 61 includes one X-axis adjustment screw 61C, two Y-axis adjustment screws 61D, and three fixing screws 61E.

[0217] The X-axis adjustment screw 61C and a fixing screw 61E together fix the protruding piece 61B2 extending along the Y-axis to the fixing piece 61A2 surrounding the protruding piece 61B2. The X-axis adjustment screw 61C and the fixing screw 61E fix the protruding piece 61B2 to the fixing piece 61A2 while clamping the protruding piece 61B2 along the X-axis. The X-axis adjustment screw 61C and the fixing screw 61E are both screws having a shape that can be screwed with respect to the side surface that divides the through hole formed in the fixing piece 61A2. By changing the tightening amount of the X-axis adjustment screw 61C, the position of the protruding piece 61B2 on the X-axis can be changed, and the position of the frame-shaped portion 61B can be changed.

[0218] Each Y-axis adjustment screw 61D, together with a fixing screw 61E, fixes the protruding piece 61B2 extending along the X-axis to the fixing piece 61A2 surrounding the protruding piece 61B2. The Y-axis adjustment screw 61D and the fixing screw 61E fix the protruding piece 61B2 to the fixing piece 61A2 while clamping the protruding piece 61B2 along the Y-axis. The Y-axis adjustment screw 61D and the fixing screw 61E are screws that can be screwed relative to the side surface that divides the through hole formed in the fixing piece 61A2. By changing the tightening amount of the Y-axis adjustment screw 61D, the position of the protruding piece 61B2 on the Y-axis can be changed, and then the position of the frame-shaped portion 61B can be changed.

[0219] That is, in the present embodiment, an example of a second position adjustment unit is configured by the X-axis adjustment screw 61C, the Y-axis adjustment screw 61D, and the fixing screw 61E.

[0220] The mask frame 61 further includes a plurality of Z-axis adjustment screws 61F. Fig.25 In the example shown, three Z-axis adjustment screws 61F are provided. When viewed from a viewpoint opposite to the XY plane, one Z-axis adjustment screw 61F is located near a portion of the edge of the frame body 61B1 where the fixing piece 61A2 extending along the Y axis is located. The remaining Z-axis adjustment screws 61F are located at two adjacent corners on the X axis among the corners of the frame body 61B1, and together with the portion where the one Z-axis adjustment screw 61F is located, form the top of a triangle.

[0221] Fig.26 Indicates along Fig.25 A cross section along line XXVI-XXVI is shown.

[0222] like Fig.26As shown, each Z-axis adjustment screw 61F is installed in a through hole formed in the support portion 61A1. Each Z-axis adjustment screw 61F includes a threaded portion 61F1 and an adsorption portion 61F2. The threaded portion 61F1 has a rod shape extending along the Z axis. When the Z-axis adjustment screw 61F is installed on the support portion 61A1, the end of the threaded portion 61F1 that is closer to the frame-shaped portion 61B is the front end, and the end on the opposite side to the front end is the base end. The adsorption portion 61F2 is located at the front end of the threaded portion 61F1.

[0223] The adsorption portion 61F2 is formed by a magnet. The frame body 61B1 of the frame-shaped portion 61B is formed by a ferromagnetic body. Alternatively, a portion of the frame body 61B1, which includes the area in contact with the adsorption portion 61F2, is formed by a ferromagnetic body. Thus, when the adsorption portion 61F2 is in contact with the frame body 61B1, the adsorption portion 61F2 is fixed to the frame body 61B1. By changing the amount by which the Z-axis adjustment screw 61F protrudes from the support portion 61A1, the position of the frame-shaped portion 61B on the Z-axis can be changed. That is, in the present embodiment, the Z-axis adjustment screw 61F is an example of a first position adjustment portion.

[0224] [Fixing method]

[0225] Hereinafter, a method of fixing the frame-shaped portion 61B to the main body portion 61A will be described. In the fourth embodiment, when fixing the frame-shaped portion 61B to the main body portion 61A, a holding base similar to the holding base described in the third embodiment can be used.

[0226] In the vapor deposition mask 60 of the present embodiment, when the frame-like portion 61B is fixed to the main body 61A, first, the amount of protrusion of the Z-axis adjustment screw 61F from the support portion 61A1 is adjusted while the holding table holds the frame-like portion 61B, so that the adsorption portion 61F2 located at the front end of the Z-axis adjustment screw 61F is adsorbed on the frame-like portion 61B. Thus, the position of the frame-like portion 61B on the Z axis is determined by the three Z-axis adjustment screws 61F. Then, each protruding piece 61B2 is fixed to the fixed piece 61A2 using the fixing screw 61E. Next, the position of the frame-like portion 61B on the XY plane is determined using one X-axis adjustment screw 61C and two Y-axis adjustment screws 61D. Thus, the frame-like portion 61B is fixed to the main body 61A at a predetermined position on the XY plane and on the Z axis. Furthermore, by removing the X-axis adjustment screw 61C, the Y-axis adjustment screw 61D, and the Z-axis adjustment screw 61F from the frame-shaped portion 61B, the fixation of the frame-shaped portion 61B to the main body portion 61A can be released.

[0227] As described above, according to the fourth embodiment of the vapor deposition mask, the method for manufacturing the vapor deposition mask, and the method for manufacturing a display device, in addition to the above (1-1), (1-3), and (1-4), the following effects can be obtained.

[0228] (4-1) The position of the frame portion 61B on the XY plane can be adjusted using the X-axis adjustment screw 61C and the Y-axis adjustment screw 61D. This can suppress positional deviation of the second openings between the plurality of frame portions 61B.

[0229] (4-2) The position of the frame-shaped portion 61B on the Z axis can be adjusted using the Z axis adjustment screw 61F. Thus, the positional deviation of the mask portion 12 caused by the thickness variation among the plurality of frame-shaped portions 61B can be suppressed by the Z axis adjustment screw 61F.

[0230] [Modification of the Fourth Embodiment]

[0231] The fourth embodiment described above can be implemented with modifications as follows.

[0232] [Frame-like portion]

[0233] The frame-shaped portion 61B may also include four or more protruding pieces 61B2. For example, when the frame-shaped portion 61B includes four protruding pieces 61B2, the frame-shaped portion 61B may include two protruding pieces 61B2 protruding from each of a pair of sides extending along the X-axis of the edge of the frame body 61B1. In this case, the main body 61A only needs to include the same number of fixing pieces 61A2 as the number of protruding pieces 61B2.

[0234] [Z-axis adjustment screw]

[0235] The mask frame 61 may include four or more Z-axis adjustment screws 61F. For example, when the mask frame 61 includes four Z-axis adjustment screws 61F, the Z-axis adjustment screws 61F may be located at positions overlapping corners of the frame body 61B1 when viewed from a viewpoint opposite to the XY plane.

[0236] [Fifth Embodiment]

[0237] Reference Fig. 27 as well as Fig.28 A fifth embodiment of a vapor deposition mask, a method for manufacturing a vapor deposition mask, and a method for manufacturing a display device is described. In the fifth embodiment, the structure of fixing the frame-shaped portion to the main body portion is different from that in the first embodiment. Therefore, the following describes such differences in detail. On the other hand, in the fifth embodiment, for the structures common to the first embodiment, the same reference numerals as those in the first embodiment are given and the detailed description of the structures is omitted.

[0238] [Evaporation mask]

[0239] Fig. 27 1 shows the structure of the vapor deposition mask viewed from a viewpoint opposite to the back side of the mask frame. Fig. 27 Only one first opening in the vapor deposition mask and the structure around the first opening are shown.

[0240] like Fig. 27 As shown, the vapor deposition mask 70 includes a mask frame 71 and a mask portion 12. Like the mask frame 11 of the first embodiment, the mask frame 71 includes a main body 71A and a frame portion 71B. The frame portion 71B has a rectangular frame shape. The frame portion 71B is located on an XY plane defined by an X-axis and a Y-axis orthogonal to the X-axis. The axis orthogonal to the XY plane is a Z-axis.

[0241] The main body 71A has a first opening 71AH. When observed from a viewpoint opposite to the back surface 71AR of the main body 71A, the outer shape of the first opening 71AH has a rectangular shape. When observed from a viewpoint opposite to the back surface 71AR, the frame-shaped portion 71B is located inside the first opening 71AH. The main body 71A has a plurality of recesses 71A1 for each first opening 71AH. The plurality of recesses 71A1 include two pairs of recesses 71A1 that clamp the first opening 71AH along the X-axis, and two pairs of recesses 71A1 that clamp the first opening 71AH along the Y-axis. In the two pairs of recesses 71A1 that clamp the first opening 71AH along the X-axis, each recess 71A1 is adjacent to a different corner of the first opening 71AH. In the two pairs of recesses 71A1 sandwiching the first opening 71AH along the Y axis, the respective recesses 71A1 are adjacent to mutually different corners of the first opening 71AH.

[0242] The mask frame 71 further includes a plurality of X-axis adjustment screws 71C, a plurality of Y-axis adjustment screws 71D, and a plurality of Z-axis adjustment portions 71E. Fig. 27 In the illustrated example, the mask frame 71 includes four X-axis adjustment screws 71C.

[0243] One X-axis adjustment screw 71C is installed at each corner of the frame-shaped portion 71B. Each X-axis adjustment screw 71C has a rod shape extending from the corner of the frame-shaped portion 71B toward the outside of the frame-shaped portion 71B. In the X-axis adjustment screw 71C, the end installed on the frame-shaped portion 71B is the front end, and the end on the opposite side of the front end is the base end. The front end of the X-axis adjustment screw 71C, which is not shown in the figure, has a spherical shape and is retained in a groove formed in the frame-shaped portion 71B. Therefore, the front end of the X-axis adjustment screw 71C is not fixed to the frame-shaped portion 71B. The X-axis adjustment screw 71C passes through the through hole formed between the first opening 71AH and the recess 71A1, thereby the X-axis adjustment screw 71C is supported by the main body 71A. The base end of the X-axis adjustment screw 71C is located in the recess 71A1. By changing the amount of the X-axis adjustment screw 71C protruding into the recess 71A1, the position of the frame-shaped portion 71B on the X-axis can be changed. The amount by which the X-axis adjustment screw 71C protrudes can be changed by the amount by which the X-axis adjustment screw 71C is tightened.

[0244] The mask frame 71 includes four Y-axis adjustment screws 71D. One Y-axis adjustment screw 71D is installed at each corner of the frame-shaped portion 71B. Each Y-axis adjustment screw 71D has a rod shape extending from the corner of the frame-shaped portion 71B toward the outside of the frame-shaped portion 71B. In the Y-axis adjustment screw 71D, the end portion installed on the frame-shaped portion 71B is the front end, and the end portion on the opposite side of the front end is the base end. The front end of the Y-axis adjustment screw 71D, which is not shown in the figure, has a spherical shape and is retained in a groove formed in the frame-shaped portion 71B. Therefore, the front end of the Y-axis adjustment screw 71D is not fixed to the frame-shaped portion 71B. The Y-axis adjustment screw 71D passes through a through hole formed between the first opening 71AH and the recess 71A1, whereby the Y-axis adjustment screw 71D is supported by the main body 71A. The base end of the Y-axis adjustment screw 71D is located in the recess 71A1. By changing the amount by which the Y-axis adjustment screw 71D protrudes into the recess 71A1, the position of the frame-shaped portion 71B on the Y-axis can be changed. The amount by which the Y-axis adjustment screw 71D protrudes can be changed by the amount by which the Y-axis adjustment screw 71D is tightened.

[0245] That is, in the present embodiment, an example of a second position adjustment unit is configured by the X-axis adjustment screw 71C and the Y-axis adjustment screw 71D.

[0246] Fig.28 Indicates along Fig. 27 A cross section along line XXVIII-XXVIII is shown.

[0247] like Fig.28As shown, the main body 71A includes a step portion AH1 formed by expanding the opening of the back surface 71AR of the main body 71A in the first opening 71AH. The mask frame 71 includes four Z-axis adjustment portions 71E. On the Z axis, there is a Z-axis adjustment portion 71E between the side surface dividing the step portion AH1 and the corner of the frame-shaped portion 71B.

[0248] Each Z-axis adjustment part 71E is an elastic body, such as a spring. By placing the frame-shaped part 71B on the Z-axis adjustment part 71E, the Z-axis adjustment part 71E contracts according to the load given from the frame-shaped part 71B. Therefore, the position of the frame-shaped part 71B on the Z-axis is determined by the elastic force of the Z-axis adjustment part 71E and the load given to the Z-axis adjustment part 71E by the frame-shaped part 71B. In addition, the load given to the Z-axis adjustment part 71E includes not only the load based on the weight of the frame-shaped part 71B, but also the load based on the vapor deposition object placed on the frame-shaped part 71B. The vapor deposition object is, for example, a glass substrate as described above. In the glass substrate, a bank for separating the pixels formed on the glass substrate from other pixels is formed on the surface in contact with the frame-shaped part 71B. Therefore, when a glass substrate is placed on the frame-shaped part 51B, the load based on the glass substrate is given to the Z-axis adjustment part 71E via the bank of the glass substrate.

[0249] [Fixing method]

[0250] Hereinafter, a method of fixing the frame-shaped portion 71B to the main body portion 71A will be described. In the fifth embodiment, when fixing the frame-shaped portion 71B to the main body portion 71A, a holding base similar to the holding base described in the third embodiment can be used.

[0251] In the vapor deposition mask 70 of the present embodiment, when the frame-like portion 71B is fixed to the main body 71A, first, the frame-like portion 71B is made to hold the X-axis adjustment screw 71C and the Y-axis adjustment screw 71D mounted on the main body 71A while the holding table holds the frame-like portion 71B. Next, at least one of the amount of the X-axis adjustment screw 71C protruding into the recess 71A1 and the amount of the Y-axis adjustment screw 71D protruding into the recess 71A1 is adjusted. Thus, the frame-like portion 71B is fixed to the main body 71A at a predetermined position on the XY plane. Then, by removing the holding table from the frame-like portion 71B, the load of the frame-like portion 71B is applied to the Z-axis adjustment portion 71E. Thus, the frame-like portion 71B is supported by the Z-axis adjustment portion 71E at a predetermined position on the Z-axis. Furthermore, by removing the X-axis adjustment screw 71C and the Y-axis adjustment screw 71D from the frame-shaped portion 71B, the fixation of the frame-shaped portion 71B to the main body portion 71A can be released.

[0252] As described above, according to the fifth embodiment of the vapor deposition mask, the method for manufacturing the vapor deposition mask, and the method for manufacturing a display device, in addition to the above (1-1) and (1-4), the following effects can be obtained.

[0253] (5-1) The position of the frame portion 61B on the XY plane can be adjusted using the X-axis adjustment screw 71C and the Y-axis adjustment screw 71D. This can suppress positional deviation of the second openings between the plurality of frame portions 71B.

[0254] [Modification of the Fifth Embodiment]

[0255] In addition, the fifth embodiment described above can be implemented with modifications as follows.

[0256] [X-axis adjustment screw]

[0257] The mask frame 71 may include only three X-axis adjustment screws 71C. In this case, any one of the four X-axis adjustment screws 71C included in the mask frame 71 may be omitted.

[0258] [Y-axis adjustment screw]

[0259] The mask frame 71 may include only three Y-axis adjustment screws 71D. In this case, any one of the four Y-axis adjustment screws 71D included in the mask frame 71 may be omitted.

[0260] Description of Reference Numerals

[0261] 10, 40, 50, 60, 70: evaporation mask;

[0262] 11, 41, 51, 61, 71: mask frame;

[0263] 11A, 41A, 51A, 61A, 71A: main body;

[0264] 11AF, 11BF, 11F, 12F, 41AF, 41BF, 51AF, 51BF: surface;

[0265] 11AH, 41AH, 51AH, 61AH, 71AH: first opening;

[0266] 11AR, 11BR, 11R, 12R, 41AR, 41BR, 51AR, 51BR, 71AR: back;

[0267] 11B, 41B, 51B, 61B, 71B: frame-shaped portion;

[0268] 11BH, 41BH: second opening;

[0269] 12: mask part;

[0270] 12H: Mask hole.

Claims

1. A vapor deposition mask, wherein: A mask frame and a mask portion are provided. The mask frame has: a main body having a first surface, a first back surface opposite to the first surface, and a first opening extending between the first surface and the first back surface; and The frame-shaped portion includes a second surface and a second back surface opposite to the second surface, and includes a second opening portion penetrating between the second surface and the second back surface. The mask frame is configured such that the frame-like portion can be detachably mounted on the main body portion on the first back side in such a manner that the position of the second opening portion on the second surface is aligned with the position of the first opening portion on the first surface. The mask portion has a plurality of mask holes and is bonded to the second back surface in a manner covering the second opening. The frame is made of a magnetic metal. The mask frame further includes a fixing portion that fixes the frame-shaped portion to the main body portion by magnetic attraction in a detachable manner relative to the main body portion.

2. The evaporation mask according to claim 1, wherein The mask portion is one of a plurality of mask portions. The main body has a plurality of first openings, and the first opening is one of the plurality of first openings. The mask frame includes a plurality of frame-shaped portions, and the frame-shaped portion is one of the plurality of frame-shaped portions. The position of the second opening of each frame-shaped portion on the second surface is aligned with the position of the first opening on the first surface which is different from the position of the first opening on the first surface which is aligned with the position of the other second opening on the second surface. Each mask portion is joined to the second back surface of the frame portion that is different from the frame portion to which the other mask portions are joined by welding, Each frame-shaped portion includes a welding mark formed by welding the mask portion to the frame-shaped portion, and the welding mark is a depression formed on the second rear surface.

3. The evaporation mask according to claim 1 or 2, wherein The mask frame includes a first position adjusting portion configured to change a position of the frame-shaped portion relative to the main body portion between a first position and a second position in a thickness direction of the main body portion.

4. The evaporation mask according to claim 1 or 2, wherein The mask frame includes a second position adjusting portion configured to change a position of the frame-shaped portion relative to the main body portion between a third position and a fourth position in a plane in which the frame-shaped portion extends.

5. The evaporation mask according to claim 1 or 2, wherein The main body has a step portion formed by expanding the opening of the first opening at the first back surface. The frame-shaped portion is configured to be located at the step portion.

6. The evaporation mask according to claim 5, wherein The frame-shaped portion has a thickness greater than a depth of the step portion of the main body portion in a cross section perpendicular to the second rear surface.

7. A method for manufacturing a vapor deposition mask according to any one of claims 1 to 6, comprising: a step of joining a mask portion to a frame-shaped portion having a second opening portion penetrating between the second surface and the second back surface; as well as The step of installing the frame-like portion on the main body having the first opening portion penetrating between the first surface and the first back surface, The step of joining the mask portion includes the step of joining the mask portion to the second back surface in a manner covering the second opening portion. The step of installing the frame-like portion includes the step of fixing the frame-like portion to the main body portion by magnetic adsorption on the first back side in a manner that the position of the second opening portion on the second surface is aligned with the position of the first opening portion on the first surface, through a fixing portion formed of a magnetic metal possessed by the frame-like portion, in a manner that the frame-like portion can be removed from the main body portion.

8. A method for manufacturing a display device, comprising: A step of forming a pattern on a vapor deposition object using the vapor deposition mask manufactured by the method for manufacturing a vapor deposition mask according to claim 7.

Images