Printed circuit structure

Abstract

This invention discloses a printed circuit structure comprising a printed circuit layer and a printed conductive adhesive layer. The printed circuit layer includes a first printed circuit layer and a second printed circuit layer. One of the first basic circuit wiring segments of the first printed circuit layer and the first basic circuit wiring segment of the first printed conductive adhesive layer extends along a first direction, and the other extends along a second direction perpendicular to the first direction. The difference in length between the two in the first direction allows the first printed circuit layer and the first printed conductive adhesive layer to maintain electrical connection even when there is an error in the first direction. Similarly, the second basic circuit wiring segments of the second printed circuit layer and the second basic circuit wiring segment of the second printed conductive adhesive layer also maintain electrical connection even when there is an error in the first direction. This invention, through structural improvements, prevents the conductive adhesive layer from failing to adhere to the printed circuit layer due to errors.

Description

Technical Field

[0001] This invention relates to a circuit structure, and more particularly to a printed circuit structure that achieves fault tolerance in printing by utilizing the connection design between the printed circuit layer and the printed conductive adhesive layer. Background Technology

[0002] In recent years, there has been an increasing demand for placing LEDs on circuit boards, such as on the circuit board of a keyboard, where LEDs are turned on when a key is pressed, thus illuminating the circuit.

[0003] Since most existing printed circuit boards are formed on an insulating substrate using an etching process, if a light-emitting diode (LED) is to be placed on a printed circuit board, solder paste is usually used to connect the electrode pins of the LED to the metal lines on the circuit board. However, the soldering process requires a high-temperature furnace, which increases the manufacturing cost.

[0004] To address the high cost of soldering LEDs using high-temperature furnaces, existing technology has been improved by using conductive adhesive to bond the LEDs to the metal circuitry. (See also...) Figure 1 , Figure 1 A planar schematic diagram showing a prior art printed circuit structure that uses conductive adhesive to bond light-emitting diodes. (e.g.) Figure 1 As shown, a printed circuit structure PA100 includes a printed circuit layer PA1 and a conductive adhesive layer PA2. The printed circuit layer PA1 includes a first printed circuit PA11 and a second printed circuit PA12. The conductive adhesive layer PA2 includes a first conductive adhesive PA21 and a second conductive adhesive PA22.

[0005] The first conductive adhesive PA21 is used to bond the first printed circuit PA11, and the second conductive adhesive PA22 is used to connect the second printed circuit PA12. In this way, the user can bond the first electrode pin PA201 and the second electrode pin PA202 of the light-emitting diode PA200 to the first conductive adhesive PA21 and the second conductive adhesive PA22 respectively, so that the printed circuit layer PA1 can conduct the light-emitting diode PA200 through the conductive adhesive layer PA2.

[0006] Please continue reading. Figure 2 , Figure 2 A schematic diagram showing the conductive adhesive of prior art deviating from the printed circuit layer due to errors in printing and coating. (See attached diagram.) Figure 2As shown, although the conductive adhesive layer PA2 can conduct light-emitting diode PA200 and printed circuit layer PA1, since the conductive adhesive layer PA2 is formed on the printed circuit layer PA1 by screen printing, in practice, the conductive adhesive layer PA2 is easily deviated from the original preset contact position with the printed circuit layer PA1 due to printing and coating errors. Even if the light-emitting diode PA200 can be accurately connected to the conductive adhesive layer PA2, it will not be electrically connected to the printed circuit layer PA1 through the conductive adhesive layer PA2 due to printing errors in the conductive adhesive layer PA2. Summary of the Invention

[0007] In view of the fact that in the prior art, although the existing printed circuit structure can use a conductive adhesive layer to conduct and connect the light-emitting diode to the printed circuit layer, since the conductive adhesive layer is formed on the printed circuit layer by screen printing, it is easy to deviate from the printed circuit layer due to errors in practice, and thus fail to adhere to the printed circuit layer; therefore, the main objective of the present invention is to provide a printed circuit structure that can prevent the problem of the conductive adhesive layer failing to adhere to the printed circuit layer due to errors through structural improvements.

[0008] To address the problems of prior art, this invention proposes a printed circuit structure formed on a substrate for electrically connecting a light-emitting diode (LED). The LED includes a pair of electrode pins, specifically a first electrode pin and a second electrode pin, which are arranged along a first direction. The printed circuit structure includes a printed circuit layer and a printed conductive adhesive layer.

[0009] The printed circuit layer includes a first printed circuit layer and a second printed circuit layer. The first printed circuit layer includes a first basic circuit wiring segment extending along a first direction, the first basic circuit wiring segment having a first length in the first direction. The second printed circuit layer includes a second basic circuit wiring segment extending along the first direction, the second basic circuit wiring segment having a second length in the first direction.

[0010] The printed conductive adhesive layer includes a first printed conductive adhesive layer and a second printed conductive adhesive layer. The first printed conductive adhesive layer includes a first basic adhesive conductive segment extending along a second direction perpendicular to the first direction and having a third length in the first direction that is less than the first length, and the first basic adhesive conductive segment is adhered to the first basic circuit wiring segment. The second printed conductive adhesive layer includes a second basic adhesive conductive segment extending along the second direction and having a fourth length in the first direction that is less than the second length, and the second basic adhesive conductive segment is adhered to the second basic circuit wiring segment.

[0011] The first printed conductive adhesive layer and the second printed conductive adhesive layer are respectively used to adhere the first electrode pin and the second electrode pin. The overlap position of the first basic adhesive conductive segment and the first basic circuit wiring segment does not overlap with the orthographic projection of the light-emitting diode. The first basic circuit wiring segment has a fifth length in the second direction, and the first length of the first basic circuit wiring segment in the first direction is greater than the fifth length in the second direction.

[0012] In a supplementary technical means derived from the aforementioned necessary technical means, the first printed circuit layer further includes a first extended circuit wiring segment, which extends integrally from the first basic circuit wiring segment along the second direction. Preferably, the first extended circuit wiring segment is integrally connected to the middle or end of the first basic circuit wiring segment.

[0013] In a supplementary technical means derived from the aforementioned necessary technical means, the first printed conductive adhesive layer further includes a first extended adhesive conductive segment, which extends along the first direction and is integrally connected to the first base adhesive conductive segment. The first electrode pin of the light-emitting diode is attached to the first extended adhesive conductive segment. Preferably, the first extended adhesive conductive segment is integrally connected to the middle or end of the first base adhesive conductive segment.

[0014] In an auxiliary technical means derived from the aforementioned necessary technical means, the first basic circuit wiring segment has a fifth length in the second direction, and the first basic adhesive conductive segment has a sixth length in the second direction that is greater than the fifth length.

[0015] In a supplementary technical means derived from the aforementioned necessary technical means, the first basic circuit wiring segment has an edge, and the first basic adhesive conductive segment is bonded to the first basic circuit wiring segment at a distance from the edge. In one embodiment, the light-emitting diode corresponds to one of the keycaps of the keyboard module. In one embodiment, the second basic circuit wiring segment has a second length in the first direction and a seventh length in the second direction, the second length being greater than the seventh length.

[0016] Furthermore, the present invention also proposes a printed circuit structure formed on a substrate for electrically connecting a light-emitting diode, the light-emitting diode including a pair of electrode pins, such as a first electrode pin and a second electrode pin, the pair of electrode pins being arranged along a second direction, and the printed circuit structure including a printed circuit layer and a printed conductive adhesive layer.

[0017] The printed circuit layer includes a first printed circuit layer and a second printed circuit layer. The first printed circuit layer includes a first basic circuit wiring segment extending along a first direction, the first basic circuit wiring segment having a first length in a second direction perpendicular to the first direction. The second printed circuit layer includes a second basic circuit wiring segment extending along the first direction, the second basic circuit wiring segment having a second length in the second direction.

[0018] The printed conductive adhesive layer includes a first printed conductive adhesive layer and a second printed conductive adhesive layer. The first printed conductive adhesive layer includes a first basic adhesive conductive segment extending along the second direction and having a third length greater than the first length in the second direction, and the first basic adhesive conductive segment is adhered to the first basic circuit wiring segment. The second printed conductive adhesive layer includes a second basic adhesive conductive segment extending along the second direction and having a fourth length greater than the second length in the second direction, and the second basic adhesive conductive segment is adhered to the second basic circuit wiring segment.

[0019] The first printed conductive adhesive layer and the second printed conductive adhesive layer are used to adhere the first electrode pin and the second electrode pin, respectively. The overlap between the first basic adhesive conductive segment and the first basic circuit wiring segment does not overlap with the orthographic projection of the light-emitting diode; wherein the third length of the first basic adhesive conductive segment along the second direction is greater than the first length of the first basic circuit wiring segment in the second direction.

[0020] In a supplementary technical means derived from the aforementioned necessary technical means, the first printed conductive adhesive layer further includes a first extended adhesive conductive segment, which extends along the first direction and is integrally connected to the first base adhesive conductive segment. The first electrode pin of the light-emitting diode is attached to the first extended adhesive conductive segment. Preferably, the first extended adhesive conductive segment is integrally connected to the middle or end of the first base adhesive conductive segment.

[0021] In a supplementary technical means derived from the aforementioned necessary technical means, the first basic circuit wiring segment has an edge, and the first basic adhesive conductive segment is bonded to the first basic circuit wiring segment at a distance from the edge.

[0022] Furthermore, the present invention also proposes a printed circuit structure formed on a substrate for electrically connecting a light-emitting diode, the light-emitting diode including multiple pairs of electrode pins, such as multiple first electrode pins and multiple second electrode pins, the printed circuit structure including a printed circuit layer and a printed conductive adhesive layer.

[0023] The printed circuit layer includes a plurality of first printed circuit layers and a plurality of second printed circuit layers. Each first printed circuit layer includes a first basic circuit wiring segment extending along a first direction, the first basic circuit wiring segment having a first length in the first direction.

[0024] Each second printed circuit layer includes a second basic circuit wiring segment extending along the first direction, the second basic circuit wiring segment having a second length in the first direction.

[0025] The printed conductive adhesive layer includes a plurality of first printed conductive adhesive layers and a plurality of second printed conductive adhesive layers. Each first printed conductive adhesive layer includes a first basic adhesive conductive segment extending along a second direction perpendicular to the first direction. The first basic adhesive conductive segment has a third length in the first direction that is less than the first length, and the first basic adhesive conductive segments of the first printed conductive adhesive layers are respectively adhered to the first basic circuit wiring segments of the first printed circuit layers.

[0026] Each second printed conductive adhesive layer includes a second basic adhesive conductive segment extending along the second direction, the second basic adhesive conductive segment having a fourth length less than the second length in the first direction, and the second basic adhesive conductive segments of the second printed conductive adhesive layers are respectively adhered to the second basic circuit wiring segments of the second printed circuit layers.

[0027] The first printed conductive adhesive layers and the second printed conductive adhesive layers are respectively used to adhere the first electrode pins and the second electrode pins. The overlap position of each of the first basic adhesive conductive segments and each of the first basic circuit wiring segments does not overlap with the orthographic projection of the light-emitting diode; wherein, the first basic circuit wiring segment has a fifth length in the second direction, and at least one of the first basic circuit wiring segments has a first length in the first direction that is greater than the fifth length in the second direction.

[0028] In a supplementary technical means derived from the aforementioned necessary technical means, each first printed circuit layer further includes a first extended circuit wiring segment, which extends along the second direction and is integrally connected to the first basic circuit wiring segment. Preferably, the first extended circuit wiring segment is integrally connected to the middle of the first basic circuit wiring segment.

[0029] In a supplementary technical means derived from the aforementioned necessary technical means, at least one of the plurality of first printed conductive adhesive layers further includes a first extended adhesive conductive segment, which extends along the first direction and is integrally connected to the first base adhesive conductive segment. At least one of the first electrode pins of the light-emitting diode is adhered to the first extended adhesive conductive segment. Preferably, the first extended adhesive conductive segment is integrally connected to the end of the first base adhesive conductive segment.

[0030] Furthermore, the present invention also proposes a printed circuit structure formed on a substrate for electrically connecting a light-emitting diode, the light-emitting diode including multiple pairs of electrode pins, such as multiple first electrode pins and multiple second electrode pins, the printed circuit structure including a printed circuit layer and a printed conductive adhesive layer.

[0031] The printed circuit layer includes a plurality of first printed circuit layers and a plurality of second printed circuit layers. Each first printed circuit layer includes a first basic circuit wiring segment extending along a first direction, the first basic circuit wiring segment having a first length in the first direction. Each second printed circuit layer includes a second basic circuit wiring segment extending along a second direction perpendicular to the first direction.

[0032] The printed conductive adhesive layer includes a plurality of first printed conductive adhesive layers and second printed conductive adhesive layers. Each first printed conductive adhesive layer includes a first basic adhesive conductive segment extending along the second direction, the first basic adhesive conductive segment having a third length in the second direction that is less than the first length, and the first basic adhesive conductive segments of the first printed conductive adhesive layers are respectively adhered to first basic circuit wiring segments of the first printed circuit layers. The second printed conductive adhesive layers extend along the first direction and are respectively adhered to second basic circuit wiring segments of the second printed circuit layers.

[0033] The first printed conductive adhesive layers are used to adhere to the first electrode pins, and the second printed conductive adhesive layer is used to adhere to the second electrode pins.

[0034] In a supplementary technical means derived from the aforementioned necessary technical means, each first printed circuit layer further includes a first extended circuit wiring segment, which extends along the second direction and is integrally connected to the first basic circuit wiring segment. Preferably, the first extended circuit wiring segment is integrally connected to the middle of the first basic circuit wiring segment.

[0035] As described above, the printed circuit structure of the present invention utilizes the fact that the length of either the first basic circuit wiring segment or the first basic adhesive conductive segment in the first direction is greater than the length of the other in the first direction, and the length of either the second basic circuit wiring segment or the second basic adhesive conductive segment in the first direction is greater than the length of the other in the first direction. This results in a permissible error space being generated in the first direction when the first basic adhesive conductive segment is formed using a coating process. This effectively prevents the printed conductive adhesive layer from failing to contact the printed circuit layer due to errors, thereby relatively improving the manufacturing yield of the printed circuit structure.

[0036] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention. Attached Figure Description

[0037] Figure 1 A planar schematic diagram showing a prior art printed circuit structure that uses conductive adhesive to bond light-emitting diodes;

[0038] Figure 2 A planar schematic diagram showing the conductive adhesive of the prior art deviating from the printed circuit layer due to errors in printing and coating;

[0039] Figure 3 This is a plan view of the printed circuit structure provided in the first preferred embodiment of the present invention;

[0040] Figure 4 A plan view showing the printed circuit structure provided in the first preferred embodiment of the present invention, which increases the permissible printing range when printing a conductive adhesive layer by means of a first basic circuit wiring segment and a second basic circuit wiring segment extending along a first direction.

[0041] Figure 5 This is a planar schematic diagram showing the printed circuit structure provided in the first preferred embodiment of the present invention applied to a keyboard module;

[0042] Figure 6 This shows a cross-sectional schematic diagram of the printed circuit structure provided in the first preferred embodiment of the present invention applied to another keyboard module;

[0043] Figure 7 for Figure 6 Enlarged schematic diagram of circle A;

[0044] Figure 8 A plan view showing the printed circuit structure provided in the second preferred embodiment of the present invention;

[0045] Figure 9 A plan view showing the printed circuit structure provided in the third preferred embodiment of the present invention;

[0046] Figure 10A plan view showing the printed circuit structure provided in the fourth preferred embodiment of the present invention;

[0047] Figure 11 A plan view showing the printed circuit structure provided in the fifth preferred embodiment of the present invention;

[0048] Figure 12 A plan view showing the printed circuit structure provided in the sixth preferred embodiment of the present invention;

[0049] Figure 13 A plan view showing the printed circuit structure provided in the seventh preferred embodiment of the present invention;

[0050] Figure 14 A plan view showing the printed circuit structure provided in the eighth preferred embodiment of the present invention; and

[0051] Figure 15 This is a plan view of the printed circuit structure provided in the ninth preferred embodiment of the present invention. Detailed Implementation

[0052] To provide a further understanding of the purpose, structure, features and functions of the present invention, detailed descriptions are provided below with reference to embodiments.

[0053] Please see Figure 3 , Figure 3 This is a plan view of the printed circuit structure provided in the first preferred embodiment of the present invention. (See diagram below.) Figure 3 As shown, a printed circuit structure 100 includes a printed circuit layer 1 and a printed conductive adhesive layer 2.

[0054] Printed circuit layer 1 includes a first printed circuit layer 11 and a second printed circuit layer 12. The first printed circuit layer 11 includes a first basic circuit wiring segment 111 and a first extended circuit wiring segment 112. The first basic circuit wiring segment 111 extends along a first direction D1, and the first extended circuit wiring segment 112 extends along a second direction D2 perpendicular to the first direction D1 and is integrally connected to the middle of the first basic circuit wiring segment 111. The first basic circuit wiring segment 111 has a first length d1 in the first direction D1 and a fifth length d5 ​​in the second direction D2.

[0055] The second printed circuit layer 12 includes a second basic circuit wiring segment 121 and a second extended circuit wiring segment 122. The second basic circuit wiring segment 121 extends along a first direction D1, and the second extended circuit wiring segment 122 extends along a second direction D2 and is integrally connected to the middle of the second basic circuit wiring segment 121. The second basic circuit wiring segment 121 has a second length d2 in the first direction D1 and a seventh length d7 in the second direction D2.

[0056] The printed conductive adhesive layer 2 includes a first printed conductive adhesive layer 21 and a second printed conductive adhesive layer 22. The first printed conductive adhesive layer 21 includes a first basic adhesive conductive segment 211, which extends along the second direction D2 and overlaps and adheres to the middle of the first basic circuit wiring segment 111. The first basic adhesive conductive segment 211 has a third length d3 in the first direction D1 that is less than the first length d1, and a sixth length d6 in the second direction D2 that is greater than the fifth length d5.

[0057] The second printed conductive adhesive layer 22 includes a second basic adhesive conductive segment 221, which extends along the second direction D2 and overlaps and adheres to the middle of the second basic circuit wiring segment 121. The second basic adhesive conductive segment 221 has a fourth length d4 in the first direction D1 that is less than the second length d2, and an eighth length d8 in the second direction D2 that is greater than the seventh length d7.

[0058] As described above, the first basic adhesive conductive segment 211 of the first printed conductive adhesive layer 21 is used to adhere to the first electrode pin of the light-emitting diode 200 (not shown in the figure), and the second basic adhesive conductive segment 221 of the second printed conductive adhesive layer 22 is used to adhere to the second electrode pin of the light-emitting diode 200 (not shown in the figure), so that the circuit connected by the first printed circuit layer 11 and the second printed circuit layer 12 can conduct the light-emitting diode 200.

[0059] Please continue reading. Figure 4 , Figure 4 This is a plan view showing the printed circuit structure provided in the first preferred embodiment of the present invention, which increases the permissible printing range during the printing of the conductive adhesive layer by means of a first basic circuit wiring segment and a second basic circuit wiring segment extending along a first direction.

[0060] like Figure 3 and Figure 4As shown, since both the first basic circuit wiring segment 111 and the second basic circuit wiring segment 121 extend along the first direction D1 and have a first length d1 greater than the third length d3 of the first basic adhesive conductive segment 211 and a second length d2 greater than the fourth length d4 of the second basic adhesive conductive segment 221, when the first basic adhesive conductive segment 211 and the second basic adhesive conductive segment 221 are printed and coated with the middle of the first basic circuit wiring segment 111 and the second basic circuit wiring segment 121 respectively, even if they deviate from the first basic circuit wiring segment 111 and the second basic circuit wiring segment 121 due to process errors, In the middle of wiring segment 121, the first basic adhesive conductive segment 211 and the second basic adhesive conductive segment 221 can also be formed on the first basic circuit wiring segment 111 and the second basic circuit wiring segment 121 respectively within the range of the first length d1 and the third length d3. That is, the design of the first basic circuit wiring segment 111 and the second basic circuit wiring segment 121 extending along the first direction D1 can effectively improve the allowable error range of the printed conductive adhesive layer 2 in the printing process, thereby effectively preventing the printed conductive adhesive layer 2 from failing to contact the printed circuit layer 1 due to errors, and relatively improving the manufacturing yield of the printed circuit structure 100.

[0061] Furthermore, since the first base adhesive conductive segment 211 and the second base adhesive conductive segment 221 have a sixth length d6 that is greater than the fifth length d5 ​​of the first base circuit wiring segment 111 and an eighth length d8 that is greater than the seventh length d7 of the second base circuit wiring segment 121 respectively in the second direction D2, the first base adhesive conductive segment 211 and the second base adhesive conductive segment 221 can be effectively used as extensions of the first base circuit wiring segment 111 and the second base circuit wiring segment 121 respectively for bonding the light-emitting diode 200.

[0062] Please continue reading. Figure 5 , Figure 5 This diagram shows a planar schematic of the printed circuit structure provided in the first preferred embodiment of the present invention applied to a keyboard module. (See diagram below.) Figure 3 and Figure 5 As shown, the printed circuit structure 100 of the present invention can be practically applied to a keyboard module 300. The keyboard module 300 includes a substrate 301, a keyboard bottom frame 302, and keycaps (not shown). The keyboard bottom frame 302 is disposed on the substrate 301, and the keycaps are assembled to the keyboard bottom frame 302. The substrate 301 is actually a circuit board, and the first printed circuit layer 1 of the printed circuit structure 100 is formed on the circuit board by etching, for example, and then a printed conductive adhesive layer 2 is coated on the substrate 301 by screen printing to form part of the printed circuit layer 1.

[0063] In addition, the substrate 301 is provided with a first circuit 3011 and a second circuit 3012. The first circuit 3011 is turned on when the button is pressed. The first extension circuit wiring segment 112 and the second extension circuit wiring segment 122 of the printed circuit structure 100 are electrically connected to the first circuit 3011 and the second circuit 3012, respectively. Thus, when the button is pressed, the first circuit 3011 can be turned on, and the current can pass through the printed circuit structure 100 to the light-emitting diode 200, so that the light-emitting diode 200 emits light.

[0064] Please continue reading. Figure 6 and Figure 7 , Figure 6 This shows a cross-sectional schematic diagram of the printed circuit structure provided in the first preferred embodiment of the present invention applied to another keyboard module; Figure 7 for Figure 6 Enlarged diagram of circle A.

[0065] like Figure 3 , Figure 6 and Figure 7 As shown, the printed circuit structure 100 of the present invention can also be applied to another keyboard module 300a. The keyboard module 300a includes a substrate 301a, a key assembly 302a, and keycaps 303a. The substrate 301a is also a circuit board. The key assembly 302a is disposed on the substrate 301a, and the keycaps 303a are assembled to the key assembly 302a. The printed circuit structure 100 of the present invention is disposed on the substrate 301a, and is formed by... Figure 6 and Figure 7 It can be seen that the first electrode pin 201 and the second electrode pin 202 of the light-emitting diode 200 are respectively attached to the first base adhesive conductive segment 211 and the second base adhesive conductive segment 221.

[0066] Please see Figure 8 , Figure 8 This is a plan view of the printed circuit structure provided in the second preferred embodiment of the present invention. (See diagram below.) Figure 8 As shown, a printed circuit structure 100a includes a printed circuit layer 1a and a printed conductive adhesive layer 2a.

[0067] Printed circuit layer 1a includes a first printed circuit layer 11a and a second printed circuit layer 12a. The first printed circuit layer 11a includes a first basic circuit wiring segment 111a and a first extended circuit wiring segment 112a. The first basic circuit wiring segment 111a extends along a first direction D1a, and the first extended circuit wiring segment 112a extends along a second direction D2a perpendicular to the first direction D1a, and is integrally connected to the end of the first basic circuit wiring segment 111a. The first basic circuit wiring segment 111a has a first length d1a in the first direction D1a and a fifth length d5a in the second direction D2a.

[0068] The second printed circuit layer 12a includes a second basic circuit wiring segment 121a and a second extended circuit wiring segment 122a. The second basic circuit wiring segment 121a extends along a first direction D1a, and the second extended circuit wiring segment 122a extends along a second direction D2a and is integrally connected to the end of the second basic circuit wiring segment 121a. The second basic circuit wiring segment 121a has a second length d2a in the first direction D1a and a seventh length d7a in the second direction D2a.

[0069] The printed conductive adhesive layer 2a includes a first printed conductive adhesive layer 21a and a second printed conductive adhesive layer 22a. The first printed conductive adhesive layer 21a includes a first basic conductive adhesive segment 211a, which is overlapped and adhered to the middle of a first basic circuit wiring segment 111a, and has a third length d3a, less than the first length d1a, in the first direction D1a, and a sixth length d6a, greater than the fifth length d5a, in the second direction D2a. The second printed conductive adhesive layer 22a includes a second basic conductive adhesive segment 221a, which is overlapped and adhered to a second basic circuit wiring segment 121a, and has a fourth length d4a, less than the second length d2a, in the first direction D1a, and an eighth length d8a, greater than the seventh length d7a, in the second direction D2a.

[0070] As described above, the first basic adhesive conductive segment 211a is used to attach the first electrode pin (not shown in the figure) of the light-emitting diode 200a, and the second basic adhesive conductive segment 221a is used to attach the second electrode pin (not shown in the figure) of the light-emitting diode 200a, so that the circuit connected by the first printed circuit layer 11a and the second printed circuit layer 12a can conduct the light-emitting diode 200a.

[0071] Please see Figure 9 , Figure 9 This is a plan view of the printed circuit structure provided in the third preferred embodiment of the present invention. (See diagram below.) Figure 9As shown, a printed circuit structure 100b includes a printed circuit layer 1b and a printed conductive adhesive layer 2b.

[0072] Printed circuit layer 1b includes a first printed circuit layer 11b and a second printed circuit layer 12b. The first printed circuit layer 11b includes a first basic circuit wiring segment 111b, which extends along a first direction D1b and has a first length d1b in a second direction D2b perpendicular to the first direction D1b.

[0073] The second printed circuit layer 12b includes a second basic circuit wiring segment 121b, which extends along a first direction D1b and has a second length d2b in a second direction D2b.

[0074] The printed conductive adhesive layer 2b includes a first printed conductive adhesive layer 21b and a second printed conductive adhesive layer 22b. The first printed conductive adhesive layer 21b includes a first basic conductive adhesive segment 211b and a first extended conductive adhesive segment 212b. The first basic conductive adhesive segment 211b extends along a second direction D2b and has a third length d3b in the second direction D2b that is greater than the first length d1b. The first basic conductive adhesive segment 211b is overlapped and adhered to the end of the first basic circuit wiring segment 111b at its middle portion. The first extended conductive adhesive segment 212b extends along the first direction D1b and is integrally connected to the end of the first basic conductive adhesive segment 211b.

[0075] The second printed conductive adhesive layer 22b includes a second basic adhesive conductive segment 221b and a second extended adhesive conductive segment 222b. The second basic adhesive conductive segment 221b extends along a second direction D2b and has a fourth length d4b in the second direction D2b that is greater than the second length d2b. The second basic adhesive conductive segment 221b is overlapped and adhered to the end of the second basic circuit wiring segment 121b at its middle portion. The second extended adhesive conductive segment 222b extends along a first direction D1b and is integrally connected to the end of the second basic adhesive conductive segment 221b.

[0076] As described above, the first extended adhesive conductive segment 212b is used to adhere to the first electrode pin 201b of the light-emitting diode 200b, and the second extended adhesive conductive segment 222b is used to adhere to the second electrode pin 202b of the light-emitting diode 200b, thereby enabling the circuit connecting the first printed circuit layer 11b and the second printed circuit layer 12b to conduct the light-emitting diode 200b. Furthermore, the printed circuit structure 100b of this embodiment mainly utilizes the fact that the first basic adhesive conductive segment 211b has a third length d3b in the second direction D2b that is greater than the first length d1b, and the second basic adhesive conductive segment 221b has a fourth length d4b in the second direction D2b that is greater than the second length d2b. This allows the printed conductive adhesive layer 2b to have a tolerance space in the second direction D2b during the printing and coating process, effectively preventing the printed conductive adhesive layer 2b from failing to contact the printed circuit layer 1b due to errors, thereby relatively improving the manufacturing yield of the printed circuit structure 100b.

[0077] Please see Figure 10 , Figure 10 This is a plan view of the printed circuit structure provided in the fourth preferred embodiment of the present invention. (See diagram below.) Figure 10 As shown, a printed circuit structure 100c includes a printed circuit layer 1c and a printed conductive adhesive layer 2c.

[0078] The printed circuit layer 1c includes a first printed circuit layer 11c and a second printed circuit layer 12c. The first printed circuit layer 11c includes a first basic circuit wiring segment 111c, which extends along a first direction D1c and has a first length d1c in a second direction D2c perpendicular to the first direction D1c.

[0079] The second printed circuit layer 12c includes a second basic circuit wiring segment 121c, which extends along a first direction D1c and has a second length d2c in a second direction D2c.

[0080] The printed conductive adhesive layer 2c includes a first printed conductive adhesive layer 21c and a second printed conductive adhesive layer 22c. The first printed conductive adhesive layer 21c includes a first basic conductive adhesive segment 211c and a first extended conductive adhesive segment 212c. The first basic conductive adhesive segment 211c extends along a second direction D2c and has a third length d3c in the second direction D2c that is greater than a first length d1c. The first basic conductive adhesive segment 211c is overlapped and adhered to the end of the first basic circuit wiring segment 111c at its middle portion. The first extended conductive adhesive segment 212c extends along the first direction D1c and is integrally connected to the middle portion of the first basic conductive adhesive segment 211c.

[0081] The second printed conductive adhesive layer 22c includes a second basic adhesive conductive segment 221c and a second extended adhesive conductive segment 222c. The second basic adhesive conductive segment 221c extends along a second direction D2c and has a fourth length d4c in the second direction D2c that is greater than the second length d2c. The second basic adhesive conductive segment 221c is overlapped and adhered to the end of the second basic circuit wiring segment 121c at its middle portion. The second extended adhesive conductive segment 222c extends along a first direction D1c and is integrally connected to the middle portion of the second basic adhesive conductive segment 221c.

[0082] As described above, the first extended adhesive conductive segment 212c is used to adhere to the first electrode pin 201c of the light-emitting diode 200c, and the second extended adhesive conductive segment 222c is used to adhere to the second electrode pin 202c of the light-emitting diode 200c, so that the circuit connected by the first printed circuit layer 11c and the second printed circuit layer 12c can conduct the light-emitting diode 200c.

[0083] Furthermore, the printed circuit structure 100c in this embodiment mainly utilizes the fact that the first basic adhesive conductive segment 211c has a third length d3c in the second direction D2c that is greater than the first length d1c, and the second basic adhesive conductive segment 221c has a fourth length d4c in the second direction D2c that is greater than the second length d2c. This allows the printed conductive adhesive layer 2c to have a tolerance space in the second direction D2c when it is formed using a printing coating process. This effectively prevents the printed conductive adhesive layer 2c from failing to contact the printed circuit layer 1c due to errors, thereby improving the manufacturing yield of the printed circuit structure 100c.

[0084] Please see Figure 11 , Figure 11 This is a plan view of the printed circuit structure provided in the fifth preferred embodiment of the present invention. (See diagram below.) Figure 11 As shown, a printed circuit structure 100d includes a printed circuit layer 1d and a printed conductive adhesive layer 2d.

[0085] Printed circuit layer 1d includes a first printed circuit layer 11d and a second printed circuit layer 12d. The first printed circuit layer 11d includes a first basic circuit wiring segment 111d, which extends along a first direction D1d and has a first length d1d in a second direction D2d perpendicular to the first direction D1d. The first basic circuit wiring segment 111d also has an edge 1111d.

[0086] The second printed circuit layer 12d includes a second basic circuit wiring segment 121d, which extends along a first direction D1d and has a second length d2d in a second direction D2d. The second basic circuit wiring segment 121d also has an edge 1211d.

[0087] The printed conductive adhesive layer 2d includes a first printed conductive adhesive layer 21d and a second printed conductive adhesive layer 22d. The first printed conductive adhesive layer 21d includes a first basic adhesive conductive segment 211d, which extends along a second direction D2d and has a third length d3d in the second direction D2d that is greater than the first length d1d. The first basic adhesive conductive segment 211d is overlapped with the first basic circuit wiring segment 111d at intervals from the edge 1111d.

[0088] The second printed conductive adhesive layer 22d includes a second basic adhesive conductive segment 221d, which extends along the second direction D2d and has a fourth length d4d in the second direction D2d that is greater than the second length d2d. The second basic adhesive conductive segment 221d is overlapped with the second basic circuit wiring segment 121d at intervals from the edge 1211d.

[0089] As described above, the first basic adhesive conductive segment 211d is used to adhere to the first electrode pin 201d of the light-emitting diode 200d, and the second basic adhesive conductive segment 221d is used to adhere to the second electrode pin 202d of the light-emitting diode 200d, so that the circuit connected by the first printed circuit layer 11d and the second printed circuit layer 12d can conduct the light-emitting diode 200d.

[0090] Furthermore, the printed circuit structure 100d in this embodiment mainly utilizes the fact that the first basic adhesive conductive segment 211d has a third length d3d in the second direction D2d that is greater than the first length d1d, and the second basic adhesive conductive segment 221d has a fourth length d4d in the second direction D2d that is greater than the second length d2d. This allows the printed conductive adhesive layer 2d to have a tolerance space in the second direction D2d when it is formed using a printing coating process. This effectively prevents the printed conductive adhesive layer 2d from failing to contact the printed circuit layer 1d due to errors, thereby improving the manufacturing yield of the printed circuit structure 100d.

[0091] Please see Figure 12 , Figure 12 This is a plan view of the printed circuit structure provided in the sixth preferred embodiment of the present invention. (See diagram below.) Figure 12 As shown, a printed circuit structure 100e includes a printed circuit layer 1e and a printed conductive adhesive layer 2e.

[0092] Printed circuit layer 1e includes a first printed circuit layer 11e and a second printed circuit layer 12e. The first printed circuit layer 11e includes a first basic circuit wiring segment 111e, which extends along a first direction D1e and has a first length d1e in a second direction D2e. The first basic circuit wiring segment 111e also has an edge 1111e.

[0093] The second printed circuit layer 12e includes a second basic circuit wiring segment 121e, which extends along a first direction D1e and has a second length d2e in a second direction D2e. The second basic circuit wiring segment 121e also has an edge 1211e.

[0094] The printed conductive adhesive layer 2e includes a first printed conductive adhesive layer 21e and a second printed conductive adhesive layer 22e. The first printed conductive adhesive layer 21e includes a first basic conductive adhesive segment 211e and a first extended conductive adhesive segment 212e. The first basic conductive adhesive segment 211e extends along a second direction D2e and has a third length d3e in the second direction D2e that is greater than a first length d1e. The first basic conductive adhesive segment 211e is overlapped with the first basic circuit wiring segment 111e at intervals from the edge 1111e. The first extended conductive adhesive segment 212e extends along the first direction D1e and is integrally connected to the end of the first basic conductive adhesive segment 211e.

[0095] The second printed conductive adhesive layer 22e includes a second basic adhesive conductive segment 221e and a second extended adhesive conductive segment 222e. The second basic adhesive conductive segment 221e extends along a second direction D2e and has a fourth length d4e in the second direction D2e that is greater than the second length d2e. The second basic adhesive conductive segment 221e is overlapped with the second basic circuit wiring segment 121e at intervals from the edge 1211e. The second extended adhesive conductive segment 222e extends along a first direction D1e and is integrally connected to the end of the second basic adhesive conductive segment 221e.

[0096] As described above, the first extended adhesive conductive segment 212e is used to adhere to the first electrode pin 201e of the light-emitting diode 200e, and the second extended adhesive conductive segment 222e is used to adhere to the second electrode pin 202e of the light-emitting diode 200e, so that the circuit connected by the first printed circuit layer 11e and the second printed circuit layer 12e can conduct the light-emitting diode 200e.

[0097] Furthermore, the printed circuit structure 100e of this embodiment is similar to the printed circuit structure 100 described above. The main difference is that the third length d3e, which is greater than the first length d1e, and the fourth length d4e, which is greater than the second length d2e, allow the printed conductive adhesive layer 2e to have a tolerance space in the second direction D2e when it is formed by the printing coating process. This effectively prevents the printed conductive adhesive layer 2e from failing to contact the printed circuit layer 1e due to errors, thereby improving the manufacturing yield of the printed circuit structure 100e.

[0098] Please see Figure 13 , Figure 13 This is a plan view of the printed circuit structure provided in the seventh preferred embodiment of the present invention. (See diagram below.) Figure 13 As shown, a printed circuit structure 100f includes a printed circuit layer 1f and a printed conductive adhesive layer 2f.

[0099] Printed circuit layer 1f includes a first printed circuit layer 11f and a second printed circuit layer 12f. The first printed circuit layer 11f includes a first basic circuit wiring segment 111f, which extends along a first direction D1f; wherein the first basic circuit wiring segment 111f has a first length d1f in a second direction D2f perpendicular to the first direction D1f.

[0100] The second printed circuit layer 12f includes a second basic circuit wiring segment 121f, which extends along a first direction D1f; wherein the second basic circuit wiring segment 121f has a second length d2f in a second direction D2f.

[0101] The printed conductive adhesive layer 2f includes a first printed conductive adhesive layer 21f and a second printed conductive adhesive layer 22f. The first printed conductive adhesive layer 21f includes a first basic adhesive conductive segment 211f, which has a third length d3f in the second direction D2f that is greater than the first length d1f, and the first basic adhesive conductive segment 211f is adhered to the first basic circuit wiring segment 111f.

[0102] The second printed conductive adhesive layer 22f includes a second basic adhesive conductive segment 221f, which has a fourth length d4f greater than the second length d2f in the second direction D2f, and is adhered to the second basic circuit wiring segment 121f.

[0103] As described above, the first basic adhesive conductive segment 211f is used to adhere to the first electrode pin 201f of the light-emitting diode 200f, and the second basic adhesive conductive segment 221f is used to adhere to the second electrode pin 202f of the light-emitting diode 200f, so that the circuit connected by the first printed circuit layer 11f and the second printed circuit layer 12f can conduct the light-emitting diode 200f.

[0104] In this embodiment, the printed circuit structure 100f mainly uses a third length d3f that is greater than the first length d1f and a fourth length d4f that is greater than the second length d2f, so that when the printed conductive adhesive layer 2f is formed by the printing coating process, it can have a tolerance space in the second direction D2f. This effectively prevents the printed conductive adhesive layer 2f from failing to contact the printed circuit layer 1f due to errors, thereby improving the manufacturing yield of the printed circuit structure 100f.

[0105] Please see Figure 14 , Figure 14 This is a plan view of the printed circuit structure provided in the eighth preferred embodiment of the present invention. (See diagram below.) Figure 14 As shown, a printed circuit structure 100g includes a printed circuit layer 1g and a printed conductive adhesive layer 2g.

[0106] The printed circuit layer 1g includes three first printed circuit layers 11g, 12g, and 13g, and three second printed circuit layers 14g, 15g, and 16g. The first printed circuit layer 11g includes a first basic circuit wiring segment 111g and a first extended circuit wiring segment 112g. The first basic circuit wiring segment 111g extends along a first direction D1g, and the first extended circuit wiring segment 112g extends along a second direction D2g perpendicular to the first direction D1g, and is integrally connected to the middle of the first basic circuit wiring segment 111g. The first basic circuit wiring segment 111g has a first length (not shown in the figure) in the first direction D1g and a fifth length (not shown in the figure) in the second direction D2g.

[0107] The first printed circuit layer 12g includes a first basic circuit wiring segment 121g and a first extended circuit wiring segment 122g, and the first printed circuit layer 13g includes a first basic circuit wiring segment 131g and a first extended circuit wiring segment 132g. Since the structures of the first printed circuit layers 12g and 13g are similar to those of the first printed circuit layer 12g, they will not be described in detail here.

[0108] The second printed circuit layer 14g includes a second basic circuit wiring segment 141g and a second extended circuit wiring segment 142g. The second basic circuit wiring segment 141g extends along a first direction D1g, and the second extended circuit wiring segment 142g extends along a second direction D2g. The second basic circuit wiring segment 141g has a second length (not shown in the figure) in the first direction D1g and a seventh length (not shown in the figure) in the second direction D2g.

[0109] The second printed circuit layer 15g includes a second basic circuit wiring segment 151g and a second extended circuit wiring segment 152g, and the second printed circuit layer 16g includes a second basic circuit wiring segment 161g and a second extended circuit wiring segment 162g. Since the structures of the second printed circuit layers 15g and 16g are similar to those of the second printed circuit layer 14g, they will not be described in detail here.

[0110] The printed conductive adhesive layer 2g includes three first printed conductive adhesive layers 21g, 22g, and 23g, and three second printed conductive adhesive layers 24g, 25g, and 26g. The first printed conductive adhesive layer 21g includes a first basic conductive adhesive segment 211g and a first extended conductive adhesive segment 212g. The first basic conductive adhesive segment 211g extends along a second direction D2g and overlaps with the end of the first basic circuit wiring segment 111g, and has a third length (not shown) in the first direction D1g that is less than the first length. The first extended conductive adhesive segment 212g extends along the first direction D1g and is integrally connected to the end of the first basic conductive adhesive segment 211g.

[0111] The first printed conductive adhesive layer 22g includes a first basic adhesive conductive segment 221g, which extends along the second direction D2g and overlaps with the end of the first basic circuit wiring segment 121g, and has a third length (not shown in the figure) in the first direction D1g that is less than the first length of the first basic circuit wiring segment 121g.

[0112] The first printed conductive adhesive layer 23g includes a first basic adhesive conductive segment 231g and a first extended adhesive conductive segment 232g. The first basic adhesive conductive segment 231g extends along the second direction D2g and overlaps with the end of the first basic circuit wiring segment 131g, and has a third length (not shown) in the first direction D1g that is smaller than the first length of the first basic circuit wiring segment 131g. The first extended adhesive conductive segment 232g extends along the first direction D1g and is integrally connected to the end of the first basic adhesive conductive segment 231g. The first printed conductive adhesive layer 21g and the first printed conductive adhesive layer 23g have similar structures. The only difference is that the first extended conductive adhesive segment 212g and the first extended conductive adhesive segment 232g are respectively connected to the opposite side of the first base conductive adhesive segment 211g and the first base conductive adhesive segment 231g, so that the first extended conductive adhesive segment 212g and the first extended conductive adhesive segment 232g extend to both sides of the first base conductive adhesive segment 221g.

[0113] The second printed conductive adhesive layer 24g includes a second basic adhesive conductive segment 241g and a second extended adhesive conductive segment 242g. The second basic adhesive conductive segment 241g extends along the second direction D2g and is adhered to the second basic circuit wiring segment 141g. The second basic adhesive conductive segment 241g has a fourth length (not shown in the figure) in the first direction D1g that is less than the second length.

[0114] The second printed conductive adhesive layer 25g includes a second basic conductive adhesive segment 251g, and the second printed conductive adhesive layer 26g includes a second basic conductive adhesive segment 261g and a second extended conductive adhesive segment 262g; wherein, since the second printed conductive adhesive layers 24g, 25g and 26g are in Figure 14 The structure in the middle is similar to that of the first printed conductive adhesive layers 21g, 22g and 23g respectively, and is reversed vertically. Therefore, those skilled in the art should be able to easily understand it by referring to the description of the first printed conductive adhesive layers 21g, 22g and 23g or the relevant description of the above embodiments, so it will not be elaborated further here.

[0115] As described above, in this embodiment, since the first printed conductive adhesive layers 21g and 23g can extend to both sides of the first basic conductive adhesive section 221g via the first extended conductive adhesive sections 212g and 232g, and the second printed conductive adhesive layers 24g and 26g can similarly extend to both sides of the second basic conductive adhesive section 251g via the second extended conductive adhesive sections 242g and 262g, the first extended conductive adhesive section 212g, the first basic conductive adhesive section 221g, and the first extended conductive adhesive section 232g can be used respectively to bond the three first electrode pins 20 of the light-emitting diode 200g. Similarly, 1g, 202g, and 203g, the second extended adhesive conductive segment 242g, the second basic adhesive conductive segment 251g, and the second extended adhesive conductive segment 262g can be used to bond the three second electrode pins 204g, 205g, and 206g of the light-emitting diode 200g, respectively. This allows the light-emitting diode 200g to be electrically connected to the first printed circuit layers 11g, 12g, and 13g via the first printed conductive adhesive layers 21g, 22g, and 23g, respectively, and to the second printed circuit layers 14g, 15g, and 16g via the second printed conductive adhesive layers 24g, 25g, and 26g, respectively, thereby turning on the light-emitting diode 200g.

[0116] Furthermore, since the first lengths of the first basic circuit wiring segments 111g, 121g, and 131g in the first direction D1g are all greater than the third lengths of the first basic adhesive conductive segments 211g, 221g, and 231g in the first direction D1g, and the second lengths of the second basic circuit wiring segments 141g, 151g, and 161g in the first direction D1g are also greater than the fourth lengths of the second basic adhesive conductive segments 241g, 251g, and 261g in the first direction D1g, the entire printed conductive adhesive layer 2g can have an allowable error range in the printing process in the first direction D1g. This effectively prevents the printed conductive adhesive layer 2g from failing to contact the printed circuit layer 1g due to errors, thereby improving the manufacturing yield of the printed circuit structure 100g.

[0117] like Figure 3 and Figure 14As shown, the connection relationship between the first printed circuit layer 11g, the second printed circuit layer 14g, the first printed conductive adhesive layer 21g, and the second printed conductive adhesive layer 24g in the printed circuit structure 100g is similar to the connection relationship between the first printed circuit layer 11, the second printed circuit layer 12, the first printed conductive adhesive layer 21, and the second printed conductive adhesive layer 22 in the printed circuit structure 100. That is, in other embodiments, the first printed conductive adhesive layer 21 may further include a first extended adhesive conductive segment (not shown) equivalent to the first extended adhesive conductive segment 212g, so that the first The extended adhesive conductive segment extends integrally from the middle or end of the first base adhesive conductive segment 211 along the first direction D1, and the second printed conductive adhesive layer 22 may further include a second extended adhesive conductive segment (not shown) equivalent to the second extended adhesive conductive segment 242g, such that the second extended adhesive conductive segment extends integrally from the middle or end of the second base adhesive conductive segment 221 along the first direction D1, and the first electrode pin of the light-emitting diode 200 may be adhered to the first extended adhesive conductive segment, and the second electrode pin of the light-emitting diode 200 may be adhered to the second extended adhesive conductive segment.

[0118] Please see Figure 15 , Figure 15 This is a plan view of the printed circuit structure provided in the ninth preferred embodiment of the present invention. (See diagram below.) Figure 15 As shown, a printed circuit structure 100h includes a printed circuit layer 1h and a printed conductive adhesive layer 2h.

[0119] Printed circuit layer 1h includes three first printed circuit layers 11h, 12h, and 13h, and three second printed circuit layers 14h, 15h, and 16h. First printed circuit layer 11h includes a first basic circuit wiring segment 111h and a first extended circuit wiring segment 112h; first printed circuit layer 12h includes a first basic circuit wiring segment 121h and a first extended circuit wiring segment 122h; and first printed circuit layer 13h includes a first basic circuit wiring segment 131h and a first extended circuit wiring segment 132h. The structures of first printed circuit layers 11h, 12h, and 13h are similar to those of the first printed circuit layers 11g, 12g, and 13g in the above embodiments, and therefore will not be described in detail here.

[0120] The second printed circuit layer 14h includes a second basic circuit wiring segment 141h extending along the second direction D2h, the second printed circuit layer 15h includes a second basic circuit wiring segment 151h extending along the second direction D2h, and the second printed circuit layer 16h includes a second basic circuit wiring segment 161h extending along the second direction D2h. The second basic circuit wiring segments 141h, 151h, and 161h have a wiring area length dah in the first direction D1h. More specifically, the wiring area length dah refers to the length enclosed by the edges of the two opposite sides of the second basic circuit wiring segments 141h, 151h, and 161h, that is, from the other edge of the second basic circuit wiring segment 141h relative to the other edge of the second basic circuit wiring segment 151h to the other edge of the second basic circuit wiring segment 161h relative to the second basic circuit wiring segment 151h, which is equivalent to the sum of the lengths of the second basic circuit wiring segments 141h, 151h, and 161h in the first direction D1h and the gaps between them.

[0121] The printed conductive adhesive layer 2h includes three first printed conductive adhesive layers 21h, 22h and 23h and a second printed conductive adhesive layer 24h.

[0122] The first printed conductive adhesive layer 21h includes a first basic conductive adhesive segment 211h and a first extended conductive adhesive segment 212h; the first printed conductive adhesive layer 22h includes a first basic conductive adhesive segment 221h; and the first printed conductive adhesive layer 23h includes a first basic conductive adhesive segment 231h and a first extended conductive adhesive segment 232h. Since the first printed conductive adhesive layers 21h, 22h, and 23h have similar structures to the first printed conductive adhesive layers 21g, 22g, and 23g described above, the description of the structure of the first printed conductive adhesive layers 21h, 22h, and 23h can refer to the description of the structure of the first printed conductive adhesive layers 21g, 22g, and 23g described above, and will not be repeated here.

[0123] The second printed conductive adhesive layer 24h extends along the first direction D1h and has a second length (not shown) in the first direction D1h that is greater than the wiring area length dah. Thus, the second printed conductive adhesive layer 24h can span the second basic circuit wiring segments 141h, 151h and 161h and be adhered to the second basic circuit wiring segments 141h, 151h and 161h respectively.

[0124] In this embodiment, the first extended adhesive conductive segment 212h, the first basic adhesive conductive segment 221h, and the first extended adhesive conductive segment 232h are used to adhere the three first electrode pins 201h, 202h, and 203h of the light-emitting diode 200h, respectively, while the second printed conductive adhesive layer 24h is used to adhere the three second electrode pins 204h, 205h, and 206h of the light-emitting diode 200h, so that the light-emitting diode 200h can be connected to the printed circuit layer 1h through the printed conductive adhesive layer 2h. Since the second printed conductive adhesive layer 24h is adhered to the second basic circuit wiring segments 141h, 151h, and 161h, the second printed conductive adhesive layer 24h can serve as a common cathode or common anode pin for the light-emitting diode 200h.

[0125] As described above, since the first lengths of the first basic circuit wiring segments 111h, 121h, and 131h in the first direction D1h are all greater than the third lengths of the first basic adhesive conductive segments 211h, 221h, and 231h in the first direction D1h, and the second printed conductive adhesive layer 24h spans the second basic circuit wiring segments 141h, 151h, and 161h in the first direction D1h, the entire printed conductive adhesive layer 2h can have an allowable error range in the printing process in the first direction D1h, thereby effectively preventing the printed conductive adhesive layer 2h from failing to contact the printed circuit layer 1h due to errors, and relatively improving the manufacturing yield of the printed circuit structure 100h.

[0126] In summary, compared to previous technologies that used conductive adhesive layers to connect LEDs to the printed circuit layer, where the conductive adhesive layer was formed on the printed circuit layer through stencil printing, making it easy for the conductive adhesive layer to deviate from the printed circuit layer due to printing errors, this invention mainly utilizes the fact that the length of either the first basic circuit wiring segment or the first basic adhesive conductive segment in a first direction is greater than the length of the other in the first direction, and that the length of either the second basic circuit wiring segment or the second basic adhesive conductive segment in a first direction is greater than the length of the other in the first direction. This allows for a permissible error space in the first direction when the first basic adhesive conductive segment is formed using the coating process, effectively preventing the printed conductive adhesive layer from failing to contact the printed circuit layer due to errors, thereby relatively improving the manufacturing yield of the printed circuit structure.

[0127] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.

Claims

1. A printed circuit structure, characterized in that... Include: A light-emitting diode having a pair of electrode leads disposed along a first direction; A first printed circuit layer includes a first basic circuit wiring segment extending along the first direction, the first basic circuit wiring segment having a first length in the first direction; The second printed circuit layer includes a second basic circuit wiring segment extending along the first direction; A first printed conductive adhesive layer includes a first basic adhesive conductive segment extending along a second direction perpendicular to the first direction, and the first basic adhesive conductive segment being adhered to the first basic circuit wiring segment; and The second printed conductive adhesive layer includes a second basic adhesive conductive segment, and the second basic adhesive conductive segment is adhered to the second basic circuit wiring segment; The first printed conductive adhesive layer and the second printed conductive adhesive layer are used to adhere the electrode pins, and the overlapping position of the first basic adhesive conductive segment and the first basic circuit wiring segment does not overlap with the orthographic projection of the light-emitting diode. The first printed circuit layer further includes a first extended circuit wiring segment, which extends along the second direction. The first direction is perpendicular to the circuit extension direction of the first extended circuit wiring segment, and the second direction is parallel to the circuit extension direction of the first extended circuit wiring segment. The first base circuit wiring segment has a fifth length in the second direction, and the first length in the first direction is greater than the fifth length in the second direction. The first base adhesive conductive segment is adhered to the side of the first base circuit wiring segment parallel to the first direction.

2. The printed circuit structure according to claim 1, characterized in that, The first extension circuit wiring segment is integrally connected to the first basic circuit wiring segment.

3. The printed circuit structure according to claim 2, characterized in that, The first extension circuit wiring segment is integrally connected to the middle or end of the first basic circuit wiring segment.

4. The printed circuit structure according to claim 1, characterized in that, This LED corresponds to one of the keycaps on the keyboard module.

5. The printed circuit structure according to claim 1, characterized in that, The second basic circuit wiring segment has a second length in the first direction and a seventh length in the second direction, the second length being greater than the seventh length.

6. The printed circuit structure according to claim 1, characterized in that, The first basic adhesive conductive segment has a sixth length in the second direction that is greater than the fifth length.

7. The printed circuit structure according to claim 1, characterized in that, The first basic circuit wiring segment has an edge, and the first basic adhesive conductive segment is bonded to the first basic circuit wiring segment at a distance from the edge.

8. A printed circuit structure, characterized in that... Include: A light-emitting diode having multiple pairs of electrode pins arranged along a second direction; A plurality of first printed circuit layers, each first printed circuit layer comprising a first basic circuit wiring segment extending along a first direction, the first basic circuit wiring segment having a first length in the first direction; Multiple second printed circuit layers, each second printed circuit layer including a second basic circuit wiring segment extending along the first direction; A plurality of first printed conductive adhesive layers, each first printed conductive adhesive layer comprising a first basic adhesive conductive segment extending along a second direction perpendicular to the first direction, and the first basic adhesive conductive segments of the plurality of first printed conductive adhesive layers are respectively adhered to the first basic circuit wiring segments of the plurality of first printed circuit layers; as well as A plurality of second printed conductive adhesive layers, each second printed conductive adhesive layer including a second basic adhesive conductive segment extending along the second direction, and the second basic adhesive conductive segments of the plurality of second printed conductive adhesive layers are respectively adhered to the second basic circuit wiring segments of the plurality of second printed circuit layers; Each of the first printed conductive adhesive layers and each of the second printed conductive adhesive layers are used to adhere to each pair of electrode pins, and the overlapping position of each of the first basic adhesive conductive segments and each of the first basic circuit wiring segments does not overlap with the orthographic projection of the light-emitting diode. Each of the first printed circuit layers further includes a first extended circuit wiring segment, which extends along the second direction. The first direction is perpendicular to the circuit extension direction of the first extended circuit wiring segment, and the second direction is parallel to the circuit extension direction of the first extended circuit wiring segment. Each first basic circuit wiring segment has a fifth length in the second direction. At least one of the first basic circuit wiring segments has a first length in the first direction that is greater than the fifth length in the second direction. Each first basic adhesive conductive segment is respectively adhered to the side of each first basic circuit wiring segment parallel to the first direction.

9. The printed circuit structure according to claim 8, characterized in that, The first extension circuit wiring segment is integrally connected to the corresponding first basic circuit wiring segment.

10. The printed circuit structure according to claim 9, characterized in that, The first extension circuit wiring segment is integrally connected to the middle of the first basic circuit wiring segment.

11. The printed circuit structure according to claim 8, characterized in that, At least one of the plurality of first printed conductive adhesive layers further includes a first extended adhesive conductive segment extending along the first direction and integrally connected to a corresponding first base adhesive conductive segment, wherein at least one of the plurality of electrode pins of the light-emitting diode is attached to the first extended adhesive conductive segment.

12. The printed circuit structure according to claim 11, characterized in that, The first extended adhesive conductive segment is integrally connected to the end of the corresponding first base adhesive conductive segment.

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