Integrated mems two-dimensional scanning probe system, capacitive angle measurement method and apparatus

Abstract

This application relates to an integrated MEMS two-dimensional scanning detection system, a capacitance angle measurement method, and an apparatus. The integrated MEMS two-dimensional scanning detection system includes: a laser detection component and a magnetic circuit component disposed below the laser detection component. The laser detection component is an integral structure formed by connecting a scanning lens to a riveting area via a Y-shaped two-dimensional rotation axis. The magnetic circuit component is a hollow structure enclosed by two types of magnetic circuit modules, which are used to generate magnetic fields in different directional dimensions. The riveting area of ​​the laser detection component is connected to the magnetic circuit modules in the magnetic circuit component. The scanning lens is located in the cavity enclosed by multiple magnetic circuit modules, and under the drive of magnetic fields in different directional dimensions, the Y-shaped two-dimensional rotation axis drives the scanning lens to rotate in the corresponding directional dimension within the cavity. This integrated MEMS two-dimensional scanning detection system can reduce the overall size of the electromagnetic scanning mirror.

Description

Technical Field

[0001] This application relates to the field of lidar technology, and in particular to an integrated MEMS two-dimensional scanning detection system, a capacitance angle measurement method, and an apparatus. Background Technology

[0002] With the continuous development of LiDAR technology, LiDAR can be applied to fields such as autonomous vehicles, drones, and ground robots. LiDAR emits a laser beam towards a target object and calculates the distance between the LiDAR and the target object based on the light reflected from the target object, thus obtaining a three-dimensional representation of the target object.

[0003] In related technologies, lidar consists of two parts: a scanning mirror and a laser. A typical electromagnetic scanning mirror achieves two-dimensional deflection of the scanning mirror through two pairs of mutually perpendicular torsion beams to complete the scanning process of target objects at different angles.

[0004] However, the overall size of electromagnetic scanning mirrors in related technologies is relatively large. Summary of the Invention

[0005] Therefore, it is necessary to provide a miniature two-dimensional scanning mirror system solution, angle measurement method, and device that can reduce the overall size of the electromagnetic scanning mirror in order to address the above-mentioned technical problems.

[0006] In a first aspect, this application provides an integrated MEMS two-dimensional scanning detection system, comprising: a mirror-integrated laser detection component and a magnetic circuit component and a capacitive angle measuring component disposed below the laser detection component. The laser detection component is an integrated structure formed by connecting the scanning lens to the riveting area via a Y-shaped two-dimensional rotation axis; the magnetic circuit component is a hollow structure surrounded by two types of magnetic circuit modules, with different types of magnetic circuit modules used to generate magnetic fields in different directional dimensions; the riveting area of ​​the laser detection component is connected to the magnetic circuit modules in the magnetic circuit component, the scanning lens is located in the cavity surrounded by multiple magnetic circuit modules, and under the drive of magnetic fields in different directional dimensions, the Y-shaped two-dimensional rotation axis drives the scanning lens to rotate in the cavity in the corresponding directional dimension.

[0007] In one embodiment, a plurality of laser detection modules are provided on the scanning lens, and each laser detection module is uniformly attached to the surface of the scanning lens.

[0008] In one embodiment, each laser detection module includes a signal transmitter, a signal receiver, and a lens. The lens and the mirror surface of the scanning lens form a receiving cavity. The signal transmitter and the signal receiver are arranged side by side in the receiving cavity. The signal transmitter is used to emit a laser signal to the target object. The signal receiver is used to receive the signal reflected by the target object.

[0009] In one embodiment, the laser detection assembly further includes a drive ring and a drive ring torsion beam. The scanning lens is disposed in the drive ring and both ends of the scanning lens are connected to the inner ring of the drive ring through a Y-shaped two-dimensional rotating shaft. The outer ring of the drive ring is connected to the riveting area through the drive ring torsion beam. A rectangular coil is attached below the drive ring to convert the electromagnetic energy generated by the rectangular coil into kinetic energy and transfer the kinetic energy to the scanning lens through the drive ring torsion beam.

[0010] In one embodiment, the magnetic circuit assembly includes a first magnetic circuit module and a second magnetic circuit module, which are vertically arranged to form a cavity; the first magnetic circuit module is used to generate a magnetic field required for the scanning lens to rotate in a first directional dimension; the second magnetic circuit module is used to generate a magnetic field required for the scanning lens to rotate in a second directional dimension.

[0011] In one embodiment, the first magnetic circuit module includes two first magnet groups disposed at opposite ends of the cavity in one direction; wherein each first magnet group includes a first N-pole magnet and a first S-pole magnet arranged side by side with their polarities facing upward; the second magnetic circuit module includes two second magnet groups disposed at opposite ends of the cavity in another direction; wherein each second magnet group includes a second N-pole magnet and a second S-pole magnet arranged side by side with their polarities facing upward.

[0012] In one embodiment, the integrated MEMS two-dimensional scanning detection system further includes a capacitive angle measuring component; the capacitive angle measuring component is used to determine the deflection angle of the scanning lens.

[0013] Secondly, this application also provides a capacitance angle measurement method, the method comprising:

[0014] Based on the differential capacitance value of the capacitive angle measuring component at the current scanning moment, the measured deflection angle of the scanning lens in different directional dimensions and the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions are obtained.

[0015] Based on the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions, the theoretical deflection angle of the scanning lens in the corresponding directional dimension is determined;

[0016] Based on the difference between the measured deflection angles in each direction dimension corresponding to the theoretical deflection angle, the scanning coefficient of the scanning lens is adjusted; the adjusted scanning coefficient ensures that the difference between the theoretical deflection angle and the measured deflection angle in each direction dimension is less than the preset value.

[0017] The target object is scanned by adjusting the scanning coefficient of the scanning lens.

[0018] In one embodiment, obtaining the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions includes:

[0019] Acquire the magnetic field generated by the magnetic circuit module in the integrated MEMS two-dimensional scanning detection system at the current scanning moment;

[0020] Based on the magnetic field generated by the magnetic circuit module in the integrated MEMS two-dimensional scanning detection system at the current scanning moment, the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions in the integrated MEMS two-dimensional scanning detection system is determined.

[0021] Thirdly, this application also provides a capacitance angle measuring device, which includes:

[0022] The acquisition module is used to acquire the measured deflection angle of the scanning lens in different directional dimensions and the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions based on the differential capacitance value of the capacitive angle measuring component at the current scanning moment.

[0023] The determination module is used to determine the theoretical deflection angle of the scanning lens in the corresponding directional dimension based on the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions.

[0024] The adjustment module is used to adjust the scanning coefficient of the scanning lens based on the difference between the measured deflection angle and the corresponding directional dimension of each theoretical deflection angle; the adjusted scanning coefficient makes the difference between the theoretical deflection angle and the measured deflection angle of each directional dimension less than the preset value.

[0025] The scanning module is used to scan the target object using the adjusted scanning coefficients of the scanning lenses.

[0026] Fourthly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the method steps in any of the embodiments of the second aspect described above.

[0027] Fifthly, this application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, which, when executed by a processor, implements the method steps of any of the embodiments in the second aspect described above.

[0028] Sixthly, this application also provides a computer program product. The computer program product includes a computer program that, when executed by a processor, implements the method steps in any of the embodiments of the second aspect described above.

[0029] The aforementioned integrated MEMS two-dimensional scanning detection system, capacitance angle measurement method, and device include a laser detection component and a magnetic circuit component disposed below the laser detection component. The laser detection component is an integral structure formed by connecting the scanning lens to the riveting area via a Y-shaped two-dimensional rotation axis. The magnetic circuit component is a hollow structure formed by two types of magnetic circuit modules, which are used to generate magnetic fields in different directional dimensions. The riveting area of ​​the laser detection component is connected to the magnetic circuit modules in the magnetic circuit component. The scanning lens is located in the cavity formed by multiple magnetic circuit modules, and under the drive of magnetic fields in different directional dimensions, the Y-shaped two-dimensional rotation axis drives the scanning lens to rotate in the cavity in the corresponding directional dimension. The magnetic circuit component in this integrated MEMS two-dimensional scanning detection system is a hollow structure formed by two types of magnetic circuit modules, which minimizes the distance between the scanning mirror and the magnetic circuit module and avoids the problem of the scanning mirror being restricted during rotation. At the same time, the scanning mirror can rotate in different directional dimensions through a Y-shaped two-dimensional rotation axis. Compared with the orthogonal support beam double frame structure of traditional technology, the rotation direction of this Y-shaped two-dimensional rotation axis is easier to control. The Y-shaped two-dimensional rotation axis requires less space, resulting in a smaller overall volume of the electromagnetic scanning mirror and a higher mirror fill rate. This is more conducive to achieving the long-range measurement requirements of solid-state lidar in a confined space. In addition, the structure of this integrated MEMS two-dimensional scanning detection system is more compact and simple, with strong robustness and shock resistance, and it is more stable in the strong vibration environment of vehicle. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of an integrated MEMS two-dimensional scanning detection system in one embodiment;

[0031] Figure 2 This is a schematic diagram of the structure of an integrated MEMS two-dimensional scanning detection system in one embodiment;

[0032] Figure 3 This is a schematic diagram of the structure of the laser detection module in one embodiment;

[0033] Figure 4 This is a schematic diagram of the structure of an integrated MEMS two-dimensional scanning detection system in one embodiment;

[0034] Figure 5 This is a schematic diagram of the magnetic circuit assembly in one embodiment;

[0035] Figure 6 This is a schematic diagram of the structure of the first magnetic circuit module and the second magnetic circuit module in one embodiment;

[0036] Figure 7 This is a schematic diagram of the structure of a capacitive angle measuring component in one embodiment;

[0037] Figure 8 This is a schematic diagram of the structure of the laser detection component rotating about the Y-axis in one embodiment;

[0038] Figure 9 This is a schematic diagram of the structure of the laser detection component rotating about the X-axis in one embodiment;

[0039] Figure 10 This is a schematic diagram of the structure of an integrated MEMS two-dimensional scanning detection system in one embodiment;

[0040] Figure 11 This is a diagram illustrating the application environment of the capacitance angle measurement method in one embodiment;

[0041] Figure 12 This is a flowchart illustrating a capacitance angle measurement method in one embodiment;

[0042] Figure 13 This is a flowchart illustrating a capacitance angle measurement method in one embodiment;

[0043] Figure 14 This is a schematic diagram of the magnetic force experienced by a magnetic circuit component in one embodiment;

[0044] Figure 15 This is a flowchart illustrating a capacitance angle measurement method in one embodiment;

[0045] Figure 16 This is a schematic diagram of the capacitive angle measuring device in one embodiment.

[0046] Explanation of reference numerals in the attached figures:

[0047] 1. Integrated MEMS two-dimensional scanning detection system; 11. Laser detection component;

[0048] 111. Y-shaped two-dimensional rotation axis; 112. Scanning lens; 113. Riveting area;

[0049] 114. Laser detection module; 1141. Signal transmitter;

[0050] 1142. Signal receiver; 1143. Lens; 1144. Receiving cavity;

[0051] 115. Drive ring; 116. Drive ring torsion beam; 12. Magnetic circuit assembly;

[0052] 121. Magnetic circuit module; 1211. First magnetic circuit module; 1212. Second magnetic circuit module;

[0053] 122. Cavity; 13. Capacitive angle measuring component. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0055] First, before introducing the technical solutions of the embodiments of this application in detail, the technical background on which the embodiments of this application are based will be introduced.

[0056] With the continuous development of lidar technology, solid-state lidar is being applied to autonomous vehicles. The two-dimensional scanning mirror in solid-state lidar has the following characteristics: (1) The two-dimensional scanning mirror needs to have a larger lens, i.e. a larger fill rate, in a small space to achieve a longer measurement range, thereby ensuring the driving safety of autonomous vehicles; (2) The total volume of the optomechanical system composed of the scanning mirror and the laser in the two-dimensional scanning mirror is small enough to meet the miniaturization requirements of lidar; (3) The power consumption of the two-dimensional scanning mirror system is low enough to save energy consumption; (4) The two-dimensional scanning mirror system aims at the high-precision angle measurement requirements, integrates an angle measurement module, and promotes the miniaturization development of lidar.

[0057] According to their operating principles, existing scanning mirrors can be categorized into electrostatic, electrothermal, piezoelectric, and electromagnetic scanning mirrors. Electrostatic scanning mirrors have a simple driving method and are currently the most mature type. However, they require high driving voltages, especially when the mirror aperture is very large, which is difficult for autonomous vehicles to provide. Electrothermal scanning mirrors have high driving torque, but due to the hysteresis effect of thermal brakes, their response speed is slow, making them unsuitable for autonomous navigation. Piezoelectric two-dimensional scanning mirrors have low driving voltage and high driving force, but their output displacement is small, making it difficult to meet the deflection angle requirements of large-aperture two-dimensional scanning mirrors. Electromagnetic two-dimensional scanning mirrors have high driving force and low driving voltage, while also meeting the low driving voltage and low power consumption requirements of automotive LiDAR. However, electromagnetic scanning mirrors require two pairs of mutually perpendicular torsion beams to achieve two-dimensional deflection. In addition to the mirrors, more space is needed to accommodate the two pairs of mutually perpendicular torsion beams, which reduces the mirror fill rate of electromagnetic scanning mirrors and is not conducive to increasing the mirror aperture.

[0058] Furthermore, common optomechanical systems typically consist of a scanning mirror and a laser arranged independently, which leads to a relatively large overall size. Additionally, the angle measurement module in a common scanning mirror system comprises a laser emission module and a position sensor module; the multiple sensors in the scanning mirror system also contribute to its overall large size.

[0059] Therefore, for long-range solid-state lidar, how to improve the fill rate of the scanning mirror, reduce system power consumption, reduce the overall size of the optomechanical system, and integrate a miniaturized angle measurement module while ensuring that the deflection angle of the scanning mirror of the solid-state lidar is large enough and the resonant frequency is high enough has become an urgent problem to be solved.

[0060] In one embodiment, such as Figure 1 As shown, Figure 1 An integrated MEMS two-dimensional scanning detection system 1 is provided. The integrated MEMS two-dimensional scanning detection system 1 includes: a laser detection component 11 and a magnetic circuit component 12 disposed below the laser detection component. The laser detection component 11 is an integral structure formed by connecting the scanning lens 112 and the riveting area 113 through a Y-shaped two-dimensional rotation axis 111. The magnetic circuit component 12 is a hollow structure surrounded by two types of magnetic circuit modules 121. Different types of magnetic circuit modules 121 are used to generate magnetic fields in different directional dimensions. The riveting area 113 of the laser detection component 11 is connected to the magnetic circuit modules 121 in the magnetic circuit component 12. The scanning lens 112 is located in a cavity 122 surrounded by multiple magnetic circuit modules 121. Under the drive of magnetic fields in different directional dimensions, the Y-shaped two-dimensional rotation axis 111 drives the scanning lens 112 to rotate in the cavity 122 in the corresponding directional dimension.

[0061] The laser detection component includes a Y-shaped two-dimensional rotation axis, a scanning lens, and a riveting area. Driven by magnetic fields in different directional dimensions, the rotation of the Y-shaped two-dimensional rotation axis in different directional dimensions allows the scanning lens to rotate in the X-axis direction, or in the Y-axis direction, or simultaneously in both directions. For example, the scanning lens can rotate at a 5° angle in the X-axis direction and a 10° angle in the Y-axis direction. The Y-shaped two-dimensional rotation axis can be a "Y"-shaped structure, with one vertical axis enabling rotation of the scanning lens in the X-axis direction, and the other two vertical axes enabling rotation of the scanning lens around the Y-axis direction.

[0062] Optionally, the scanning lens can be a single-sided or double-sided lens, and its shape can be rectangular, square, circular, or other irregular. The scanning lens can be processed using silicon-based processing technology or laser wire cutting technology. Silicon-based processing technology is advantageous due to its mature technology and ability to achieve mass production. Laser wire cutting of titanium alloys offers advantages in ductility and fatigue resistance, but its processing efficiency per piece is relatively lower. In practice, the optimal choice should be made based on different processing conditions.

[0063] Optionally, the riveting area of ​​the laser detection component can be connected to the magnetic circuit module in the magnetic circuit component via a fixed connection. This fixed connection can be achieved through bolting, riveting, or other methods. The riveting area connects the laser detection component and the magnetic circuit component into an integrated MEMS two-dimensional scanning detection system. Simultaneously, the riveting area can fix the position of the scanning lens and the Y-shaped two-dimensional rotation axis.

[0064] The aforementioned integrated MEMS two-dimensional scanning detection system includes a laser detection component and a magnetic circuit component located below the laser detection component. The laser detection component is an integral structure formed by connecting the scanning lens to the riveting area via a Y-shaped two-dimensional rotation axis. The magnetic circuit component is a hollow structure formed by two types of magnetic circuit modules, which are used to generate magnetic fields in different directional dimensions. The riveting area of ​​the laser detection component is connected to the magnetic circuit modules in the magnetic circuit component. The scanning lens is located in the cavity formed by multiple magnetic circuit modules, and under the drive of magnetic fields in different directional dimensions, the Y-shaped two-dimensional rotation axis drives the scanning lens to rotate in the cavity in the corresponding directional dimension. The magnetic circuit component in this integrated MEMS two-dimensional scanning detection system is a hollow structure formed by two types of magnetic circuit modules, which minimizes the distance between the scanning mirror and the magnetic circuit module and avoids the problem of the scanning mirror being restricted during rotation. At the same time, the scanning mirror can rotate in different directional dimensions through a Y-shaped two-dimensional rotation axis. Compared with the orthogonal support beam double frame structure of traditional technology, the rotation direction of this Y-shaped two-dimensional rotation axis is easier to control. The Y-shaped two-dimensional rotation axis requires less space, resulting in a smaller overall volume of the electromagnetic scanning mirror and a higher mirror fill rate. This is more conducive to achieving the long-range measurement requirements of solid-state lidar in a confined space. In addition, the structure of this integrated MEMS two-dimensional scanning detection system is more compact and simple, with strong robustness and shock resistance, and it is more stable in the strong vibration environment of vehicle.

[0065] In one embodiment, such as Figure 2 As shown, the scanning lens 112 of the integrated MEMS two-dimensional scanning detection system 1 is provided with multiple laser detection modules 114, and each laser detection module 114 is uniformly attached to the scanning lens 112.

[0066] The scanning lens includes both mirror and non-mirror surfaces, and the multiple laser detection modules on the scanning lens can be spaced apart at a preset distance. The arrangement of the multiple laser detection modules can be determined according to the shape of the scanning lens. For example, when the scanning lens is rectangular or square, the multiple laser detection modules will form a rectangular or square shape; when the scanning lens is circular, the multiple laser detection modules will form a circular shape; when the scanning lens is irregularly shaped, the multiple laser detection modules will form the corresponding irregular shape.

[0067] Optionally, each laser detection module can be glued to the surface of the scanning lens, or each laser detection module can be connected to the surface of the scanning lens via an adsorption connector. The adhesive used includes glue, hot melt adhesive, sealant, etc.

[0068] The aforementioned integrated MEMS two-dimensional scanning detection system incorporates multiple laser detection modules mounted on the scanning lens, with each module evenly attached to the lens. The rotation angle of these laser detection modules aligns with that of the scanning lens, and their uniform attachment allows for a wider detection range. Furthermore, compared to traditional methods of independently assembling the scanning lens and laser transceiver modules, this approach facilitates the miniaturization and integration of the lidar system.

[0069] In one embodiment, such as Figure 3 As shown, each laser detection module 114 in the integrated MEMS two-dimensional scanning detection system 1 includes a signal transmitter 1141, a signal receiver 1142, and a lens 1143. The lens 1143 and the mirror surface of the scanning lens 112 form a receiving cavity 1144. The signal transmitter 1141 and the signal receiver 1142 are arranged side by side in the receiving cavity 1144. The signal transmitter 1141 is used to emit laser signals to the target object. The signal receiver 1142 is used to receive the signals reflected by the target object.

[0070] The signal transmitter is a device that provides electrical signals of various frequencies, waveforms, and output levels. For example, a signal transmitter can be a Vertical-Cavity Surface-Emitting Laser (VCSEL), an X-ray emitting laser, or an infrared emitting laser. The signal receiver is capable of extracting information reflected from the target object from the interference signal to the greatest extent possible. For example, a signal receiver can be an Avalanche Photodiode (APD) receiver. The VCSEL laser transmitter can send laser signals to the target object, and the APD receiver can receive the laser signals generated by the VCSEL reflected from the target object.

[0071] Optionally, the lens can be made of glass, or it can be made of polyurethane film. The shape of the lens can be semi-circular or semi-elliptical, etc. The individual lenses can be glued to the surface of the scanning lens, and the lenses are used to protect the signal transmitter and signal receiver.

[0072] Optionally, the volume of the receiving cavity formed by the lens and the mirror surface of the scanning lens is related to the area and shape of the lens. The signal transmitter and the signal receiver are set on the scanning lens inside the receiving cavity, and the distance between the signal transmitter and the signal receiver must be greater than a preset distance.

[0073] Each laser detection module in the aforementioned integrated MEMS two-dimensional scanning detection system includes a signal transmitter, a signal receiver, and a lens. The lens and the mirror surface of the scanning lens form a receiving cavity, and the signal transmitter and signal receiver are arranged side by side in the receiving cavity. The signal transmitter is used to emit laser signals towards the target object; the signal receiver is used to receive the signals reflected by the target object. In this device, the signal transmitter and signal receiver in each laser detection module can emit laser signals and receive signals reflected by the target object through the lens. Compared to traditional technologies that require a laser to emit and receive signals, the scanning lens in this device has both laser emission and reception capabilities.

[0074] In one embodiment, such as Figure 4 As shown, the laser detection component 11 in the integrated MEMS two-dimensional scanning detection system 1 also includes a drive ring 115 and a drive ring torsion beam 116. The scanning lens 112 is disposed in the drive ring 115 and both ends of the scanning lens 112 are connected to the inner ring of the drive ring 115 through a Y-shaped two-dimensional rotating shaft 111. The outer ring of the drive ring 115 is connected to the riveting area 113 through the drive ring torsion beam 116. A rectangular coil is attached below the drive ring 115 to convert the electromagnetic energy generated by the rectangular coil into kinetic energy and transfer the kinetic energy to the scanning lens 112 through the drive ring torsion beam 116.

[0075] The scanning lens and the Y-shaped two-dimensional rotation axis need to be set in the inner ring of the drive ring, and the outer ring of the drive ring is connected to the drive ring torsion beam. The drive ring and the rectangular coil attached below form a whole, which is used to convert the electromagnetic energy generated by the rectangular coil into kinetic energy to realize the micro-vibration of the drive ring. The micro-vibration of the drive ring drives the scanning lens to rotate.

[0076] The laser detection component in the aforementioned integrated MEMS two-dimensional scanning detection system also includes a drive ring and a drive ring torsion beam. The scanning lens is disposed within the drive ring, with both ends connected to the inner ring of the drive ring via a Y-shaped two-dimensional rotating shaft. The outer ring of the drive ring is connected to the riveting area via the drive ring torsion beam. A rectangular coil is attached below the drive ring to convert the electromagnetic energy generated by the rectangular coil into kinetic energy, which is then transferred to the scanning lens via the drive ring torsion beam. Under the influence of a magnetic field, the drive ring and drive ring torsion beam drive the Y-shaped two-dimensional rotating shaft to rotate, thereby causing the scanning lens to rotate in different directional dimensions, simplifying the structure of the laser detection module. Simultaneously, arranging the rectangular coil at the interface yields a greater magnetic induction intensity, reducing the current required to achieve a specified Ampere force according to Ampere's law, ultimately reducing system power consumption.

[0077] In one embodiment, such as Figure 5As shown, the magnetic circuit assembly 121 in the integrated MEMS two-dimensional scanning detection system 1 includes a first magnetic circuit module 1211 and a second magnetic circuit module 1212. The first magnetic circuit module 1211 and the second magnetic circuit module 1212 are arranged alternately and orthogonally to form a cavity 122. The first magnetic circuit module 1211 is used to generate the magnetic field required for the scanning lens 112 to rotate in a first dimensional direction. The second magnetic circuit module 1212 is used to generate the magnetic field required for the scanning lens 112 to rotate in a second dimensional direction.

[0078] Specifically, the first magnetic circuit module can be positioned at both opposite ends of the scanning lens and is fixedly connected to the riveting area in the laser detection assembly. The first magnetic circuit module is used to drive the scanning lens to rotate around the X-axis. The second magnetic circuit module can be positioned at the other opposite ends of the scanning lens. The second magnetic circuit module is used to drive the scanning lens to rotate around the Y-axis. When the positions of the first and second magnetic circuit modules are interchanged, the first magnetic circuit module drives the scanning lens to rotate around the Y-axis, and the second magnetic circuit module drives the scanning lens to rotate around the X-axis.

[0079] The magnetic circuit assembly in the aforementioned integrated MEMS two-dimensional scanning detection system includes a first magnetic circuit module and a second magnetic circuit module, which are arranged in an alternating orthogonal manner to form a cavity. The first magnetic circuit module generates the magnetic field required for the scanning lens to rotate in a first dimensional direction, and the second magnetic circuit module generates the magnetic field required for the scanning lens to rotate in a second dimensional direction. The two magnetic circuit modules are arranged in an alternating manner so that the directions of the magnetic fields generated by the two modules are different, allowing for more precise driving of the scanning lens to rotate in different dimensions. Simultaneously, by not placing magnets below the scanning lens to form a cavity, the distance between the scanning lens and the magnetic circuit module is minimized, thus avoiding the problem of limited vibration of the scanning lens.

[0080] In one embodiment, such as Figure 6 As shown, the first magnetic circuit module 1211 in the magnetic circuit assembly 121 includes two first magnet groups, which are disposed at opposite ends of each other in one direction of the cavity; wherein, each first magnet group includes a first N-pole magnet and a first S-pole magnet arranged side by side with their polarities facing upward; the second magnetic circuit module 1212 includes two second magnet groups, which are disposed at opposite ends of each other in another direction of the cavity; wherein, each second magnet group includes a second N-pole magnet and a second S-pole magnet arranged side by side with their polarities facing upward.

[0081] Optionally, the magnet can be a naturally formed permanent magnet or an artificially manufactured non-permanent magnet. For example, the magnet can be a sintered neodymium iron boron magnet, a sintered samarium cobalt permanent magnet, or an AlNiCo magnet. The riveting area of ​​the laser detection module can be divided into a first riveting area or a second riveting area. The first and second riveting areas are respectively fixedly connected to any position above both ends of the first magnet assembly. The Y-shaped two-dimensional rotating axis and the scanning lens are vertically arranged inside the cavity of the first magnet assembly. Alternatively, the first and second riveting areas are respectively fixedly connected to any position above both ends of the second magnet assembly. The Y-shaped two-dimensional rotating axis and the scanning lens are vertically arranged inside the cavity of the second magnet assembly.

[0082] Furthermore, optionally, the first magnet assembly can be used to generate the magnetic field required for the scanning lens to deflect around the X-axis, or it can be used to generate the magnetic field required for the scanning lens to deflect around the Y-axis. Correspondingly, the second permanent magnet can be used to generate the magnetic field required for the scanning lens to deflect around the X-axis, or it can be used to generate the magnetic field required for the scanning lens to deflect around the Y-axis.

[0083] The first magnetic circuit module in the aforementioned integrated MEMS two-dimensional scanning detection system includes two first magnet groups, which are disposed at opposite ends of the cavity in one direction. The second magnetic circuit module includes two second magnet groups, which are disposed at opposite ends of the cavity in the other direction. Each first magnet group in the aforementioned integrated MEMS two-dimensional scanning detection system includes a first N-pole magnet and a first S-pole magnet arranged side-by-side with their polarities pointing upwards. Each second magnet group includes a second N-pole magnet and a second S-pole magnet arranged side-by-side with their polarities pointing upwards. The polarities of the magnets in both the first and second magnet groups are upwards, which can be used to constrain the direction of the magnetic field lines at the junction of the magnets, forming denser magnetic field lines at the junction of the two magnets. This increases the magnetic induction intensity, reduces the current required to reach a specified Ampere force, and thus reduces system power consumption.

[0084] Furthermore, it is understood that iron pole pieces can be installed below the first and second magnet groups to prevent magnetic field lines from spreading to the outside, increase the density of magnetic field lines inside the magnet, and enhance the magnetism of the magnet.

[0085] In one embodiment, such as Figure 7 As shown, the integrated MEMS two-dimensional scanning detection system 1 also includes a capacitive angle measuring component 13; the capacitive angle measuring component 13 is used to determine the deflection angle of the scanning lens 112.

[0086] The capacitive angle measuring component is composed of multiple electrodes, with a minimum of four electrodes. These four electrodes determine the deflection angles of the scanning lens along the X and Y axes. When there are four electrodes, two are positioned on the non-mirror side of the scanning lens, and the other two are positioned on the other side. When there are more than four electrodes, the number of electrodes must be even, and the electrodes are arranged according to the actual situation.

[0087] The aforementioned integrated MEMS two-dimensional scanning detection system also includes a capacitive angle measuring component; this component is used to determine the deflection angle of the scanning lens. The capacitive angle measuring component in this device rotates simultaneously with the scanning lens, enabling precise determination of the scanning lens's deflection angle.

[0088] Furthermore, it is understandable that Figure 8 This is a schematic diagram of the laser detection component rotating around the Y-axis in an integrated MEMS two-dimensional scanning detection system. Figure 9 This is a schematic diagram of the structure of a laser detection component rotating around the X-axis in an integrated MEMS two-dimensional scanning detection system. The integrated MEMS two-dimensional scanning detection system rotates simultaneously in the X and Y axes. This rotation around the X-axis is... Figure 9 A simple illustration. Figure 10 This is a schematic diagram of the structure of an integrated MEMS two-dimensional scanning detection system. Figure 10 In the image, the laser scanning module was partially magnified to facilitate more precise observation of the integrated MEMS two-dimensional scanning detection system.

[0089] The capacitance angle measurement method provided in this application embodiment can be applied to, for example... Figure 11 In the application environment shown, the integrated MEMS two-dimensional scanning detection system 102 communicates with the server 104 via a network. The data storage system can store the data that the server 104 needs to process. The data storage system can be integrated onto the server 104, or it can be located in the cloud or on other network servers. The server 104 can be implemented using a standalone server or a server cluster consisting of multiple servers.

[0090] In one embodiment, such as Figure 12 As shown, a capacitance angle measurement method is proposed and applied in a server. The method includes the following steps:

[0091] S1201, based on the differential capacitance value of the capacitive angle measuring component at the current scanning moment, obtains the measured deflection angle of the scanning lens in different directional dimensions and the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions.

[0092] Specifically, with Figure 7 Taking the arrangement of the capacitive angle measuring components in the example, in Figure 7 In the diagram, the four electrodes are labeled A, B, C, and D. Electrodes A and B are used to determine the deflection angle of the scanning lens in the X-axis direction, while electrodes C and D are used to determine the deflection angle of the scanning lens in the Y-axis direction.

[0093] The expression for the differential capacitance value can be given as:

[0094]

[0095] In the above formula, This represents the difference between the capacitance values ​​of the two lower plates on the right and their corresponding upper plates, and the sum of the capacitance values ​​of the two lower plates on the left and their corresponding upper plates. This indicates the angle by which the scanning mirror rotates around the x-axis.

[0096] The relationship between the deflection angle of the scanning lens on the X-axis and the capacitances of plates A and B can be expressed as:

[0097] in, Represents the vacuum permittivity. , These represent the distances from the left endpoints of the upper and lower plates to the intersection of the extended lines of the plates, respectively. W represents the width of the plates, and h represents the distance between the two plates when no deflection occurs.

[0098]

[0099] The relationship between the deflection angle of the scanning lens on the Y-axis and the capacitance of the C and D plates can be expressed as:

[0100]

[0101] in, Represents the vacuum permittivity. , These represent the distances from the left endpoints of the upper and lower plates to the intersection of the extended lines of the plates, respectively. W represents the width of the plates, and h represents the distance between the two plates when no deflection occurs.

[0102] Furthermore, the server can determine the magnitude of the magnetic field strength generated by the magnet module in different directional dimensions based on the relevant parameters of the magnet module, and then determine the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions based on the magnitude of the magnetic field strength in different directional dimensions.

[0103] S1202, based on the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions, determines the theoretical deflection angle of the scanning lens in the corresponding directional dimension.

[0104] Specifically, the relationship between the torque of the Y-shaped two-dimensional rotation axis in the X-axis direction and the theoretical deflection angle of the scanning lens in the X-axis direction can be expressed as:

[0105]

[0106] The relationship between the torque of the Y-type two-dimensional rotation axis in the Y-axis direction and the theoretical deflection angle of the scanning lens in the Y-axis direction can be expressed as:

[0107]

[0108] in: This represents the moment of inertia of the scanning mirror lens. , The damping coefficients represent the vibrations of the scanning mirror mirror around the X and Y axes. , This represents the spring coefficients of the Y-shaped two-dimensional rotating axis vibrating about the X and Y axes. The damping coefficients of the scanning mirror lens vibrating about the X and Y axes, and the spring coefficients of the Y-shaped two-dimensional rotating axis vibrating about the X and Y axes, are obtained through simulation or experimentation.

[0109] The expression for the moment of inertia of the scanning lens can be given as:

[0110]

[0111] Where V represents the volume of the scanning mirror lens. This indicates the density of titanium alloy materials. This indicates the distance between the integration point and the torsion beam of the drive ring.

[0112] The server can obtain the theoretical deflection angles of the scanning lens in the X and Y axes based on the above calculation formulas, the torques of the Y-shaped two-dimensional rotation axis in the X and Y axes directions.

[0113] S1203, adjust the scanning coefficient of the scanning lens according to the difference between the measured deflection angle and the corresponding directional dimension of each theoretical deflection angle; the adjusted scanning coefficient makes the difference between the theoretical deflection angle and the measured deflection angle of each directional dimension less than the preset value.

[0114] The scanning coefficients of the scanning lens include the moment of inertia of the scanning lens, the damping coefficients of the scanning lens vibration about the X and Y axes, and the spring coefficients of the Y-shaped two-dimensional rotation axis vibration about the X and Y axes. The moment of inertia of the scanning lens is related to the volume of the scanning lens, the density of the titanium alloy material, and the distance between the integration point and the torsion beam of the drive ring.

[0115] Optionally, the server can adjust one of the scanning coefficients of the scanning lens in a preset order, while keeping the other scanning coefficients unchanged, to obtain the adjusted scanning coefficients. Optionally, the server can also adjust all the coefficients of the scanning lens simultaneously, traversing all possibilities to determine the value of the scanning coefficient with the smallest difference. This embodiment does not limit the method of adjusting the scanning coefficients of the scanning lens.

[0116] S1204 measures the angle of the target object by adjusting the scanning coefficient of the scanning lens.

[0117] Specifically, the difference between the theoretical deflection angle determined by the adjusted scanning coefficient of the scanning lens and the measured deflection angle is smaller, eliminating the influence of redundant displacement of the scanning lens in the Z-axis direction on the measured deflection angle. By scanning the target object with the adjusted scanning coefficient, the scanning results are more accurate.

[0118] The aforementioned capacitive angle measurement method obtains the measured deflection angle of the scanning lens in different directional dimensions and the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions based on the differential capacitance value of the capacitive angle measurement component at the current scanning moment. Based on the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions, the theoretical deflection angle of the scanning lens in the corresponding directional dimension is determined. The scanning coefficient of the scanning lens is adjusted based on the difference between the measured deflection angle and the measured deflection angle in the corresponding directional dimension. The target object is then scanned using the adjusted scanning coefficient. This method adjusts the scanning coefficient of the scanning lens based on the difference between the measured deflection angle and the theoretical deflection angle to minimize the difference, resulting in a more accurate measured deflection angle. Simultaneously, while ensuring the accuracy of the measured deflection angle, it eliminates the influence of redundant displacement of the scanning lens in the Z-axis direction on the measured deflection angle.

[0119] Figure 13 This application provides a capacitance angle measurement method. This embodiment relates to an optional implementation for obtaining the torque of a Y-shaped two-dimensional rotation axis in different directional dimensions. Based on the above embodiment, as... Figure 13 As shown, the above S1201 may include the following steps:

[0120] S1301, acquire the magnetic field generated by the magnetic circuit module in the integrated MEMS two-dimensional scanning detection system at the current scanning moment.

[0121] Specifically, the hollow magnetic circuit with alternating N and S poles generates horizontal magnetic field lines pointing to the right at the rectangular coil. The server can calculate the magnetic induction intensity generated by the magnet based on the relevant parameters of the magnet in the hollow magnetic circuit, and thus obtain the magnetic field strength of the magnetic circuit module in the integrated MEMS two-dimensional scanning detection system at the current scanning moment.

[0122] S1302, Based on the magnetic field generated by the magnetic circuit module in the integrated MEMS two-dimensional scanning detection system at the current scanning moment, determine the torque of the Y-shaped two-dimensional rotating axis in different directional dimensions in the integrated MEMS two-dimensional scanning detection system.

[0123] Specifically, after obtaining the magnetic field strength generated by the magnetic circuit module at the current scanning moment through step S1302, the current direction of the rectangular coil is determined according to the left-hand rule, and then the direction and magnitude of the Ampere force received by the rectangular coil are determined according to Ampere's law, thus obtaining the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions. Specifically, the left side of the rectangular coil experiences a vertically downward Ampere force, and the right side experiences a vertically upward Ampere force. This is achieved by superimposing two alternating sinusoidal current signals of different frequencies within the rectangular coil. According to Ampere's law, this generates periodic torques that deflect about the X and Y axes. , This signal is then transmitted to the rectangular scanning mirror via a Y-shaped two-dimensional rotation axis, causing it to deflect around the X and Y axes. Alternating sinusoidal current signal It is expressed as follows:

[0124]

[0125] in, , These represent the amplitudes of the two alternating sinusoidal current signals, , These represent the resonant frequencies of the scanning mirror as it deflects around the X and Y axes, respectively.

[0126] The torques of the Y-shaped two-dimensional rotation axis in the X and Y directions can be expressed as:

[0127]

[0128]

[0129] Where B represents the magnetic flux density. , These represent the equivalent length and width of the rectangular coil, respectively.

[0130] Furthermore, it is understandable that Figure 14 The torque of the Y-shaped two-dimensional rotation axis in the X and Y axes of the integrated MEMS two-dimensional scanning detection system is as follows: For the X-axis, the torque on the left side of the Y-shaped two-dimensional rotation axis is inward, and the torque on the right side is outward; For the Y-axis, the torque on the left side of the Y-shaped two-dimensional rotation axis is downward, and the torque on the right side is upward.

[0131] The aforementioned capacitance angle measurement method acquires the magnetic field generated by the magnetic circuit module in the integrated MEMS two-dimensional scanning detection system at the current scanning moment. Based on the magnetic field generated by the magnetic circuit module in the integrated MEMS two-dimensional scanning detection system at the current scanning moment, the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions of the integrated MEMS two-dimensional scanning detection system is determined. This method can more accurately determine the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions based on the magnetic field generated at the current scanning moment, thereby enabling a more accurate determination of the theoretical deflection angle of the scanning lens at the current moment.

[0132] In another embodiment, Figure 15 This application provides a capacitance angle measurement method for its embodiments. This embodiment relates to an optional implementation of constructing a point cloud image of a target object. Based on the above embodiments, such as... Figure 15 As shown, the above steps may also include the following steps:

[0133] S1501, acquire the reflection signal of the target object at each measured deflection angle after adjustment; the reflection signal is the signal received by the signal receiver in the integrated MEMS two-dimensional scanning detection system.

[0134] S1502: Based on the reflection signals of each target object, obtain the corresponding scanning distance for each reflection signal. The scanning distance represents the distance between the target object and the integrated MEMS two-dimensional scanning detection system.

[0135] S1503 constructs a point cloud image of the target object based on the adjusted deflection angle of the scanning lens and each scanning distance.

[0136] Specifically, in the integrated MEMS 2D scanning detection system, after the signal transmitter sends a laser signal, the target object reflects the laser signal back to the integrated MEMS 2D scanning detection system. The signal receiver in the integrated MEMS 2D scanning detection system receives the laser signal reflected by the target object. The server can obtain the reflected signal of the target object through the signal receiver, and then determine the distance between each reflected signal and the target object based on the time difference between the transmitted and received signals and the speed of laser propagation in the air. Finally, the point cloud map of the target object is constructed using the Simultaneous Localization and Mapping (SLAM) method to obtain a 3D point cloud representation of the target object.

[0137] The aforementioned capacitive angle measurement method acquires the reflected signals of the target object at each adjusted measurement deflection angle. Based on the reflected signals of each target object, the corresponding scanning distance is obtained. The scanning distance represents the distance between the target object and the integrated MEMS two-dimensional scanning detection system. A point cloud image of the target object is constructed based on the adjusted deflection angle of the scanning lens and each scanning distance. In this method, the reflected signals are those received by the signal receiver in the integrated MEMS two-dimensional scanning detection system. By using the adjusted measurement deflection angle and measurement distance, a more accurate point cloud image of the target object can be constructed.

[0138] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0139] Based on the same inventive concept, this application also provides a capacitance angle measuring device for implementing the capacitance angle measuring method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations of the one or more capacitance angle measuring device embodiments provided below can be found in the limitations of the capacitance angle measuring method described above, and will not be repeated here.

[0140] In one embodiment, such as Figure 16 As shown, a capacitance angle measuring device is provided, including: an acquisition module 11, a determination module 12, and an adjustment module 13, wherein:

[0141] The acquisition module is used to acquire the measured deflection angle of the scanning lens in different directional dimensions and the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions based on the differential capacitance value of the capacitive angle measuring component at the current scanning moment.

[0142] The determination module is used to determine the theoretical deflection angle of the scanning lens in the corresponding directional dimension based on the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions.

[0143] The adjustment module is used to adjust the scanning coefficient of the scanning lens based on the difference between the measured deflection angle and the corresponding directional dimension of each theoretical deflection angle; the adjusted scanning coefficient makes the difference between the theoretical deflection angle and the measured deflection angle of each directional dimension less than the preset value.

[0144] The scanning module is used to measure the angle of the target object by adjusting the scanning coefficient of the scanning lens.

[0145] The capacitance angle measuring device provided in this embodiment can perform the above method embodiment, and its implementation principle and technical effect are similar, so it will not be described again here.

[0146] In one embodiment, the acquisition module includes an acquisition unit and a determination unit, wherein:

[0147] The acquisition unit is used to acquire the magnetic field generated by the magnetic circuit module in the integrated MEMS two-dimensional scanning detection system at the current scanning moment;

[0148] The determination unit is used to determine the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions in the integrated MEMS two-dimensional scanning detection system based on the magnetic field generated by the magnetic circuit module in the integrated MEMS two-dimensional scanning detection system at the current scanning moment.

[0149] The capacitance angle measuring device provided in this embodiment can perform the above method embodiment, and its implementation principle and technical effect are similar, so it will not be described again here.

[0150] Each module in the aforementioned capacitive angle measuring device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0151] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in any of the above method embodiments.

[0152] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps in any of the above method embodiments.

[0153] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps of any of the above method embodiments.

[0154] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties.

[0155] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0156] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0157] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. An integrated MEMS two-dimensional scanning detection system, characterized in that, The integrated MEMS two-dimensional scanning detection system includes: a laser detection component and a magnetic circuit component disposed below the laser detection component. The laser detection component is an integral structure formed by connecting the scanning lens and the riveting area through a Y-shaped two-dimensional rotation axis. The magnetic circuit component is a hollow structure surrounded by two types of magnetic circuit modules, and the different types of magnetic circuit modules are used to generate magnetic fields in different directional dimensions. The riveting area of ​​the laser detection component is connected to the magnetic circuit module in the magnetic circuit component. The scanning lens is located in the cavity surrounded by the multiple magnetic circuit modules. Under the drive of the magnetic field in different directional dimensions, the Y-shaped two-dimensional rotation axis drives the scanning lens to rotate in the cavity in the corresponding directional dimension. The scanning lens is provided with multiple laser detection modules, and each laser detection module is uniformly attached to the surface of the scanning lens.

2. The integrated MEMS two-dimensional scanning detection system according to claim 1, characterized in that, Each laser detection module includes a signal transmitter, a signal receiver, and a lens. The lens and the mirror surface of the scanning lens form a receiving cavity. The signal transmitter and the signal receiver are arranged side by side in the receiving cavity. The signal transmitter is used to emit laser signals toward the target object; The signal receiver is used to receive signals reflected by the target object.

3. The integrated MEMS two-dimensional scanning detection system according to claim 1, characterized in that, Each of the laser detection modules is glued to the surface of the scanning lens.

4. The integrated MEMS two-dimensional scanning detection system according to any one of claims 1-3, characterized in that, The laser detection assembly further includes a drive ring and a drive ring torsion beam. The scanning lens is disposed in the drive ring and both ends of the scanning lens are connected to the inner ring of the drive ring through the Y-shaped two-dimensional rotation axis. The outer ring of the drive ring is connected to the riveting area through the drive ring torsion beam. A rectangular coil is attached below the drive ring to convert the electromagnetic energy generated by the rectangular coil into kinetic energy, and then the kinetic energy is transmitted to the scanning lens through the drive ring torsion beam.

5. The integrated MEMS two-dimensional scanning detection system according to any one of claims 1-3, characterized in that, The magnetic circuit assembly includes a first magnetic circuit module and a second magnetic circuit module, which are arranged in an alternating orthogonal manner to form the cavity; The first magnetic circuit module is used to generate the magnetic field required for the scanning lens to rotate in a first directional dimension; the second magnetic circuit module is used to generate the magnetic field required for the scanning lens to rotate in a second directional dimension.

6. The integrated MEMS two-dimensional scanning detection system according to claim 5, characterized in that, The first magnetic circuit module includes two first magnet groups, which are disposed at opposite ends in one direction of the cavity; wherein each first magnet group includes a first N-pole magnet and a first S-pole magnet arranged side by side with their polarities facing upward. The second magnetic circuit module includes two second magnet groups, which are disposed at opposite ends of the cavity in another direction; wherein each second magnet group includes a second N-pole magnet and a second S-pole magnet arranged side by side with their polarities facing upward.

7. The integrated MEMS two-dimensional scanning detection system according to any one of claims 1-3, characterized in that, The integrated MEMS two-dimensional scanning detection system also includes a capacitive angle measurement component; The capacitive angle measuring component is used to determine the deflection angle of the scanning lens.

8. A capacitance angle measurement method, characterized in that, The method is applied to the integrated MEMS two-dimensional scanning detection system as described in any one of claims 1-7, and the method includes: Based on the differential capacitance value of the capacitive angle measuring component at the current scanning moment, the measured deflection angle of the scanning lens in different directional dimensions and the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions are obtained. Based on the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions, the theoretical deflection angle of the scanning lens in the corresponding directional dimension is determined; The scanning coefficient of the scanning lens is adjusted based on the difference between the measured deflection angles in the corresponding directional dimensions of each theoretical deflection angle; the adjusted scanning coefficient makes the difference between the theoretical deflection angle and the measured deflection angle in each directional dimension less than a preset value. The angle of the target object is measured by adjusting the scanning coefficient of the scanning lens.

9. The method according to claim 8, characterized in that, The process of obtaining the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions includes: Obtain the magnetic field generated by the magnetic circuit module in the integrated MEMS two-dimensional scanning detection system at the current scanning moment; Based on the magnetic field generated by the magnetic circuit module in the integrated MEMS two-dimensional scanning detection system at the current scanning moment, the torque of the Y-shaped two-dimensional rotation axis in the integrated MEMS two-dimensional scanning detection system in different directional dimensions is determined.

10. A capacitance angle measuring device, characterized in that, The device is applied to the integrated MEMS two-dimensional scanning detection system as described in any one of claims 1-7, and the device comprises: The acquisition module is used to acquire the measured deflection angle of the scanning lens in different directional dimensions and the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions based on the differential capacitance value of the capacitive angle measuring component at the current scanning moment. The determination module is used to determine the theoretical deflection angle of the scanning lens in the corresponding directional dimension based on the torque of the Y-shaped two-dimensional rotation axis in different directional dimensions. The adjustment module is used to adjust the scanning coefficient of the scanning lens according to the difference between the measured deflection angles in the corresponding directional dimensions of each theoretical deflection angle; the adjusted scanning coefficient makes the difference between the theoretical deflection angle and the measured deflection angle in each directional dimension less than a preset value; The scanning module is used to measure the angle of the target object by adjusting the scanning coefficient of the scanning lens.

Images