Substrate processing method

Abstract

A substrate processing method shortens a time required for substrate processing. A flow processing program is provided in advance, the flow processing program including a first process processing program that sets contents of a first processing performed on a substrate, a second process processing program that sets contents of a second processing performed on the substrate after the first processing, and a pre-processing program that sets contents of a preliminary action with respect to the second process processing program; the first processing includes ejection of a first chemical liquid onto the substrate, the second processing includes ejection of the first chemical liquid onto the substrate, and the preliminary action includes discharge of the first chemical liquid. The substrate processing method has the following steps: performing the first processing, determining whether a time from an end of the first processing to a start of the second processing is shorter than a first threshold, and if the result of the determination is positive, reducing a time of the preliminary action and performing the second processing.

Description

Technical Field

[0001] This disclosure relates to a method for processing a substrate. Background Technology

[0002] In the process of manufacturing electronic devices (such as semiconductor devices and liquid crystal display devices) using substrates, various processes are performed on the substrates (hereinafter referred to as "substrate processing"). Substrate processing includes, for example, so-called sheet-by-sheet processing, which processes substrates one by one. Sheet-by-sheet processing includes, for example, cleaning processing and etching processing.

[0003] The chemical solution used in substrate processing (hereinafter also referred to as "processing solution") is supplied to the substrate, for example, from a nozzle. To improve processing efficiency, a processing solution that has been adjusted (e.g., heated) to a suitable temperature for processing is supplied to the nozzle from a piping. The content of substrate processing is defined as a process procedure.

[0004] After substrate processing, sometimes the processing solution remains in the nozzle or piping, and the temperature of the remaining processing solution is lower than the suitable processing temperature. It is also assumed that the specific gravity of the processing solution changes due to the precipitation of components contained within it. This phenomenon easily leads to the deterioration of the processing solution. If a deteriorated processing solution is used, it is difficult to perform proper substrate processing.

[0005] Patent Document 1 proposes a pre-processing procedure, such as disposing of residual processing liquid, as a preliminary action performed before substrate processing. The content of this preliminary action is defined as a pre-processing program. Patent Document 2 proposes a technique for performing substrate processing and pre-processing on each substrate.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: Japanese Patent Application Publication No. 2009-231733

[0009] Patent Document 2: Japanese Patent Application Publication No. 2019-160910 Summary of the Invention

[0010] The problem the invention aims to solve

[0011] Assuming that the processing fluid remains in the nozzle or piping for a shorter time, the processing fluid will not deteriorate to the point where it cannot properly process the substrate. Even if multiple substrate processes are performed discontinuously, if the time not spent processing the substrate is shortened, the substrate processing can be properly performed even if the time required for the pre-dispensing action (also known as "pre-processing") is reduced. Reducing the time required for the pre-dispensing action will shorten the time required for substrate processing. This disclosure provides a simplified substrate processing method.

[0012] means for solving problems

[0013] In the substrate processing method disclosed herein, a pre-set process program is included, comprising: a first process program specifying the content of a first process performed on the substrate; a second process program specifying the content of a second process performed on the substrate after the first process; and a pre-processing program specifying the content of preparatory actions for the second process program. In a first embodiment of this substrate processing method, the first process includes spraying a first chemical solution onto the substrate, the second process includes spraying the first chemical solution onto the substrate, and the preparatory actions include discharging the first chemical solution.

[0014] The first aspect of the substrate processing method includes the following steps: performing the first processing; determining whether the time from the end of the first processing to the start of the second processing is shorter than a first threshold; and if the result of the determination is positive, reducing the time of the preparatory action and performing the second processing.

[0015] The second aspect of the substrate processing method is that, according to the first aspect, if the time from the end of the spraying of the first liquid in the first process to the start of the spraying of the first liquid in the second process is shorter than a second threshold and longer than a first threshold, then the time of the preparatory action is reduced, and the second threshold is longer than the first threshold.

[0016] The third aspect of the substrate processing method is that, according to the second aspect, if the time from the end of the spraying of the first liquid in the first process to the start of the spraying of the first liquid in the second process is longer than a third threshold, then the time of the preparatory action is increased, wherein the third threshold is longer than the second threshold.

[0017] The fourth aspect of the substrate processing method is that, according to the first aspect, the second aspect, or the third aspect, if the spraying of the first liquid is not restarted after the spraying of the first liquid ends, and a time longer than a fourth threshold is elapsed, then the discharge of the first liquid is performed, wherein the fourth threshold is longer than the first threshold.

[0018] The fifth aspect of the substrate processing method is as follows: according to the first aspect, the second aspect, the third aspect, or the fourth aspect, the process program includes N first processes corresponding to N substrates respectively, where N is an integer greater than 2. At the time point when the first process performed on the first to N-1 substrates ends and the first process performed on the Nth substrate begins, it is determined whether the time from the end of the Nth first process to the start of the second process is shorter than the first threshold.

[0019] The effects of the invention

[0020] According to the first aspect of the substrate processing method disclosed herein, the time required for substrate processing can be shortened.

[0021] According to the second aspect of the substrate processing method disclosed herein, the time required for substrate processing can be shortened.

[0022] According to the third aspect of the substrate processing method disclosed herein, the impact of chemical degradation on the second processing can be reduced.

[0023] According to the fourth method of substrate processing disclosed herein, the impact of chemical degradation on subsequent processing can be reduced.

[0024] According to the fifth aspect of the substrate processing method disclosed herein, even if the processing program is changed during the execution of the process processing program, it is possible to appropriately determine whether preprocessing is required. Attached Figure Description

[0025] Figure 1 This is a schematic top view illustrating an example of the general structure of a substrate processing apparatus.

[0026] Figure 2 This is a schematic diagram illustrating the structure of a processing unit.

[0027] Figure 3 This is a schematic diagram illustrating the structure of the processing fluid supply unit.

[0028] Figure 4 This is a diagram illustrating an example of the schematic structure of a substrate processing system.

[0029] Figure 5 This is a block diagram illustrating an example of the electrical structure of the host computer.

[0030] Figure 6 This is a block diagram illustrating an example of the electrical structure of the main control unit.

[0031] Figure 7 This is a block diagram illustrating an example of the electrical structure of a liquid management control unit.

[0032] Figure 8 This is a diagram illustrating an example of processing that uses a processing unit.

[0033] Figure 9 It is a sequence diagram that conceptually illustrates the process flow.

[0034] Figure 10 It is a timing diagram that illustrates the content of the process procedure as it changes over time.

[0035] Figure 11 It is a timing diagram that illustrates the content of the process procedure as it changes over time.

[0036] Figure 12 It is a timing diagram that illustrates the content of the process procedure as it changes over time.

[0037] Figure 13 This is a timing diagram illustrating the changes in the preprocessor's contents over time.

[0038] Figure 14 This is a timing diagram illustrating the changes in the preprocessor's contents over time.

[0039] Figure 15 It is a timing diagram showing a part of the process handling procedure.

[0040] Figure 16 This is a flowchart illustrating an example of a routine for determining whether preprocessing is required.

[0041] Figure 17 It shows the timing diagram of substrate processing using process procedures and pre-processing procedures.

[0042] Figure 18 It shows the timing diagram of substrate processing using process procedures and pre-processing procedures.

[0043] Figure 19 It shows the timing diagram of substrate processing using process procedures and pre-processing procedures.

[0044] Explanation of reference numerals in the attached figures

[0045] DHF, IPA, SC1: treatment solutions

[0046] J1, J2, J3: Processing program group

[0047] J1(1)~J1(25), J1(k), J2(1)~J2(25), J2(k), J3(1)~J3(25), J3(k): Processing procedures,

[0048] J11(1)~J11(25), J11(k), J12(1)~J12(25), J12(k), J22(1)~J22(25), J22(k), J31(1)~J31(25), J31(k), J33(1)~J33(25), J33(k), Pr11, Pr12, Pr31, Pr33: Ejection processing program,

[0049] M: Count value,

[0050] M0: Specified value,

[0051] P(1), P(2), P(3): Ejected,

[0052] S1, S2, S3, S4, S5, S6, S50, S51, S52, S53, S54, S55, S56, S57, S58, S59: Steps,

[0053] W: substrate,

[0054] t11e(24), t12s(24), t12e(24), t10(25), t11s(25), t11e(25), t12s(25), t12e(25), t2s, t2e, t22s(1), t22e(1), t22s(24), t22e(24), t20(25), t22s(25), t22e(25), tr31S, tr31e, tr33s, tr33e, t31s(1), t31e(1), t33s(1), t33e(1): time. Detailed Implementation

[0055] <Notes in the instructions>

[0056] Hereinafter, embodiments will be described with reference to the accompanying drawings. Furthermore, the drawings are schematic representations, and for ease of explanation, structures have been appropriately omitted and simplified. Additionally, the sizes and relative positions of the structures shown in the drawings are not necessarily accurately described and can be appropriately altered.

[0057] Furthermore, in the following description, the same constituent elements are given the same reference numerals for illustration, and their names and functions are also the same. Therefore, to avoid repetition, detailed descriptions related to them are sometimes omitted.

[0058] Furthermore, in the following description, even when ordinal numbers such as "first" or "second" are used, these terms are used for convenience in order to make the content of the implementation easier to understand, and are not limited to the order generated according to these ordinal numbers.

[0059] Unless otherwise stated, expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along a direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) not only strictly indicate the positional relationship but also indicate a state of displacement relative to an angle or distance within tolerance or to achieve the same level of functionality. Unless otherwise stated, expressions indicating equality (e.g., "same," "equal," "uniform," etc.) not only indicate a state of strict quantitative equality but also indicate a state of difference in tolerance or to achieve the same level of functionality. Unless otherwise stated, expressions indicating shape (e.g., "quadrilateral" or "cylindrical," etc.) not only strictly indicate the shape geometrically but also indicate a shape with features such as concavity, convexity, or chamfering, to achieve the same level of effect. Expressions describing a constituent element as "having," "possessing," "having," "including," or "having" are not exclusive expressions excluding the existence of other constituent elements. The expression “at least one of A, B and C” includes only A, only B, only C, any two of A, B and C, and all of A, B and C.

[0060] <1-1. Example of the structure of a substrate processing apparatus>

[0061] Figure 1 This is a schematic top view showing an example of the general structure of the substrate processing apparatus 20. Figure 1 The direction perpendicular to the paper surface corresponds to the vertical direction in the substrate processing apparatus 20. The substrate processing apparatus 20, for example, supplies processing liquid to the surface of the substrate W and performs single-sheet processing. Hereinafter, an example will be given using a semiconductor substrate (wafer) as the substrate W.

[0062] The following description uses a cleaning process that removes foreign matter and the object to be removed using a cleaning solution as an example of substrate processing. Examples of cleaning solutions used in this cleaning process include a mixture of ammonia and hydrogen peroxide (Standard Cleaning 1 used in so-called RCA cleaning; hereinafter referred to as "cleaning solution SC1"), dilute hydrofluoric acid (HF) diluted with pure water (hereinafter referred to as "cleaning solution DHF"), and isopropyl alcohol (hereinafter referred to as "cleaning solution IPA").

[0063] Besides this example, other treatment solutions can be used in the cleaning process. For example, etching with an etchant, rinsing with water, or coating with a resist can be used instead of or in conjunction with the cleaning process.

[0064] The substrate processing apparatus 20 includes loading ports LP1, LP2, LP3, and LP4. The number of loading ports is not limited to four. Each loading port LP1, LP2, LP3, and LP4 functions as a holding mechanism for the carrier C. The carrier C functions as a FOUP (Front Opening Unified Pod) for accommodating multiple (e.g., 25) substrates W.

[0065] For example, the carrier C is transported from the carrier placement point 40 via the transport device 30 and placed on the loading ports LP1, LP2, LP3, and LP4. When multiple substrate processing devices 20 are provided, for example, the transport device 30 transports the carrier C between the substrate processing devices 20.

[0066] The substrate processing apparatus 20 includes six processing units 21. The number of processing units 21 is not limited to six. Figure 1 In the example shown, three processing units 21 are arranged as a group, stacked vertically. Hereinafter, a group of processing units 21 (here, three processing units 21 stacked vertically) will be described as one tower 21t. When viewed from above, two towers 21t are presented.

[0067] The substrate processing apparatus 20 also includes, for example, a sorting robot 91, a central robot 92, a main control unit 22, storage tanks 261, 262, 263, 264, a liquid management control unit 24, and a processing liquid supply unit 28.

[0068] Indexing robot 91, for example, transports substrate W between loading ports LP1, LP2, LP3, LP4 and central robot 92. Central robot 92 has the function of transporting substrate W between indexing robot 91 and processing unit 21, for example. Indexing robot 91 and central robot 92 function as transport units 93 that move multiple substrates W housed in carrier C from carrier C toward each processing unit 21.

[0069] The main control unit 22 controls the operation of various components, such as those in the substrate processing device 20, and the opening and closing of valves. The main control unit 22, for example, transmits and receives various signals with the liquid management control unit 24.

[0070] Storage tanks 261, 262, 263, and 264 store the processing liquid supplied to processing unit 21 as described below. For example, storage tank 261 stores processing liquid DHF, storage tank 262 stores processing liquid SC1, storage tank 263 stores processing liquid IPA, and storage tank 264 stores any one of processing liquids DHF, SC1, and IPA. The following example illustrates the case where storage tank 264 stores processing liquid DHF.

[0071] Each of the storage tanks 261, 262, 263, and 264 is equipped with, for example, a sensor 27. The sensor 27 measures the state of the processed liquid, such as the physical quantities of concentration, hydrogen ion index (pH: power of hydrogen), and temperature. Mechanisms for, for example, stirring the stored processed liquid can be provided in each of the storage tanks 261, 262, 263, and 264.

[0072] The liquid management control unit 24 can manage the state of the processed liquid stored in the storage tanks 261, 262, 263, and 264 by controlling the operation of each part installed in the storage tanks 261, 262, 263, and 264. Specifically, the liquid management control unit 24 obtains signals of physical quantities indicating the state of the processed liquid from the sensors 27 corresponding to the storage tanks 261, 262, 263, and 264, respectively.

[0073] The liquid management control unit 24, for example, transmits and receives various signals with the main control unit 22. For example, the liquid management control unit 24 sends a signal obtained from the sensor 27 or a value representing a physical quantity identified from the signal to the main control unit 22.

[0074] Two processing liquid supply units 28 correspond to two towers 21t, respectively. The flow rate of the processing liquid in storage tanks 261, 262, 263, and 264 is controlled by any one of the processing liquid supply units 28. Each processing liquid supply unit 28 supplies the processing liquid via piping assembly 35 to all processing units 21 included in its corresponding tower 21t. The flow rate of the processing liquid is limited by the processing liquid supply unit 28 under the control of the liquid management control unit 24, as described later.

[0075] Loading ports LP1, LP2, LP3, and LP4 function as a part for moving substrate assemblies between the substrate processing apparatus 20 and the outside of the substrate processing apparatus 20 (hereinafter also referred to as "moving in and out section"). Here, "substrate assembly" refers to multiple substrates constituting a batch.

[0076] exist Figure 1In the example, the loading ports LP1, LP2, LP3, and LP4 are arranged along a first direction DR1 that is orthogonal to the vertical direction (in other words, "horizontal"). The loading ports LP1, LP2, LP3, and LP4 and each processing unit 21 are spaced apart on a second direction DR2 that is orthogonal to the first direction DR1 and horizontal (and therefore also orthogonal to the vertical direction).

[0077] For example, the transport device 30 transports multiple substrate assemblies to loading ports LP1, LP2, LP3, and LP4. Figure 1 In the example, the transport device 30 is capable of moving along a first direction DR1 and a second direction DR2. For example, a carrier C, which respectively holds multiple substrates W constituting a substrate group, is transported from the carrier placement 40 and placed on any one of the loading ports LP1, LP2, LP3, LP4.

[0078] The indexing robot 91 has the function of transporting multiple substrates W from the carrier C to the central robot 92 one by one.

[0079] The central robot 92 has the function of transferring multiple substrates W from the indexing robot 91 to each processing unit 21 one by one. The central robot 92 also has the function of transporting multiple substrates W from each processing unit 21 to the indexing robot 91 one by one. Furthermore, for example, the central robot 92 has the function of transporting substrates W between multiple processing units 21 as needed.

[0080] For example, the indexing robot 91 has four hands (not shown). Each hand has the function of supporting the substrate W in a horizontal position. The indexing robot 91 has the function of moving the hands in the horizontal and vertical directions. The indexing robot 91 has the function of rotating (self-rotating) about an axis along the vertical direction and changing the orientation of the hands by means of this rotation.

[0081] In path 201 through the delivery position, the indexing robot 91 moves along the first direction DR1. In a top-down view, the delivery position is where the indexing robot 91 and the central robot 92 face each other in the second direction DR2.

[0082] The indexing robot 91 has the function of facing the hand towards both the carrier C and the central robot 92. For example, the indexing robot 91 performs a loading action of moving the substrate W into the carrier C and a unloading action of moving the substrate W out of the carrier C by moving the hand. For example, the indexing robot 91 cooperates with the central robot 92 to perform a delivery action at the delivery position, moving the substrate W from one of the indexing robot 91 and the central robot 92 to the other.

[0083] The central robot 92, like the indexing robot 91, has, for example, four hands (not shown). Each hand has the function of supporting the substrate W in a horizontal position. The central robot 92 moves the hands, for example, in both the horizontal and vertical directions. The central robot 92 rotates (self-rotates) about an axis along the vertical direction and changes the orientation of the hands by this rotation.

[0084] The central robot 92 has the function of facing either the processing unit 21 or the indexing robot 91. For example, the central robot 92 performs a loading action of moving the substrate W into each processing unit 21 and a unloading action of moving the substrate W out of each processing unit 21 by moving the hand. For example, the central robot 92 cooperates with the indexing robot 91 to perform a delivery action of moving the substrate W from one of the indexing robot 91 and the central robot 92 to the other.

[0085] <1-2. Example of Processing Unit Structure>

[0086] Figure 2 This is a schematic diagram illustrating the structure of a processing unit 21. Figure 2 This is a view taken from a direction perpendicular to the vertical direction. Processing unit 21 is a single-sheet unit that processes substrates W one by one. Processing unit 21 is located in main control unit 22 (see reference). Figure 1 The main control unit 22 controls the operation of each part of the processing unit 21 and the operation of the processing fluid supply unit 28.

[0087] Each processing unit 21 includes a chamber 4, a rotary chuck 5, nozzles 341, 342, 343, 344, and a protective mechanism 7. The chamber 4 houses the rotary chuck 5, the processing fluid supply mechanism 6, the nozzles 341, 342, 343, 344, and the protective mechanism 7.

[0088] The rotary chuck 5 functions as a substrate holding mechanism that holds a substrate W in a horizontal position within the chamber 4. The rotary chuck 5 rotates the substrate W about a substrate rotation axis A1 that is parallel to the vertical direction. For example, the center of the substrate W is positioned on the substrate rotation axis A1. A protective mechanism 7 surrounds the rotary chuck 5 about the substrate rotation axis A1.

[0089] Nozzles 341, 342, and 343 supply processing fluid to the surface Wu above the substrate W held by the rotating chuck 5 (hereinafter also referred to as the "upper surface"). Nozzle 344 supplies processing fluid to the surface Wb below the substrate W held by the rotating chuck 5 (hereinafter also referred to as the "lower surface").

[0090] The rotary chuck 5 includes a rotary base 11, a rotary shaft 14, and a rotary motor 15. The rotary base 11 is circular and held in a horizontal position. The outer diameter of the rotary base 11 is smaller than the diameter of the substrate W. The rotary base 11, for example, has the function of adsorbing and holding the substrate W using a vacuum chuck (not shown). With the lower surface Wb of the substrate W adsorbed onto the upper surface of the rotary base 11, the substrate W is held horizontally.

[0091] The centerline of the rotating base 11 is located on the substrate rotation axis A1. The rotating base 11 causes the substrate W to rotate around the substrate rotation axis A1.

[0092] The rotating shaft 14 extends vertically downward from the center of the rotating base 11. The nozzle 344 is provided, for example, inside the rotating shaft 14.

[0093] The rotary motor 15 rotates the rotation shaft 14, which in turn causes the rotating base 11 to rotate around the substrate rotation axis A1, for example, in a counterclockwise direction RDr when viewed vertically downwards. With the substrate W attached to the rotating base 11, the rotary motor 15 rotates the rotation shaft 14, thereby causing the substrate W and the rotating base 11 to rotate together around the substrate rotation axis A1.

[0094] Nozzle 341 is connected to pipe 351. Nozzle 342 is connected to pipe 352. Nozzle 343 is connected to pipe 353. Nozzle 344 is connected to pipe 354. Pipes 351, 352, 353, and 354 constitute pipe assembly 35 (see reference). Figure 1 ).

[0095] Valve 361 is inserted into pipe 351. Valve 362 is inserted into pipe 352. Valve 363 is inserted into pipe 353. Valve 364 is inserted into pipe 354. Valves 361, 362, 363, and 364 are housed in the processing liquid supply unit 28. One processing liquid supply unit 28 is responsible for the three processing units 21 constituting one tower 21t. Thus, each processing liquid supply unit 28 houses three sets of valves 361, 362, 363, and 364 respectively.

[0096] Pipe 351 is connected to reservoir 261 via valve 361. Pipe 352 is connected to reservoir 262 via valve 362. Pipe 353 is connected to reservoir 263 via valve 363. Pipe 354 is connected to reservoir 264 via valve 364.

[0097] If valve 361 is open, the DHF treatment fluid supplied from pipe 351 to nozzle 341 is sprayed downwards from nozzle 341. If valve 361 is closed, the spraying of DHF treatment fluid from nozzle 341 stops.

[0098] If valve 362 is open, the treatment fluid SC1 supplied from pipe 352 to nozzle 342 is sprayed downwards from nozzle 342. If valve 362 is closed, the spraying of treatment fluid SC1 from nozzle 342 stops.

[0099] If valve 363 is open, the IPA treatment fluid supplied from pipe 353 to nozzle 343 is sprayed downwards from nozzle 343. If valve 363 is closed, the spraying of IPA treatment fluid from nozzle 343 stops.

[0100] If valve 364 is open, the DHF treatment fluid supplied from pipe 354 to nozzle 344 is sprayed upwards from nozzle 344. If valve 364 is closed, the spraying of DHF treatment fluid from nozzle 344 stops.

[0101] The processing unit 21 includes nozzle moving devices 371, 372, and 373. Nozzle moving device 371 moves nozzle 341, nozzle moving device 372 moves nozzle 342, and nozzle moving device 373 moves nozzle 343.

[0102] For example, nozzle 341 functions as a scanning nozzle that ejects DHF while moving the landing position of the DHF solution between the center and the periphery of the upper surface Wu. Nozzle 341 can also eject DHF solution even when the landing position in the upper surface Wu is fixed.

[0103] For example, nozzle 342 functions as a scanning nozzle that ejects the processing liquid SC1 while moving the landing position of the processing liquid SC1 between the center and the periphery of the upper surface Wu. Nozzle 342 can also eject the processing liquid SC1 when the landing position in the upper surface Wu is fixed.

[0104] For example, nozzle 343 functions as a scanning nozzle that ejects the processing liquid IPA while moving the landing position of the processing liquid IPA between the center and the periphery in the upper surface Wu. Nozzle 343 can also eject the processing liquid IPA when the landing position in the upper surface Wu is fixed.

[0105] The processing unit 21 includes a lower surface nozzle 44, a purge pipe 45, and a purge valve 46. The lower surface nozzle 44 sprays gas, such as nitrogen, toward the periphery of the lower surface Wb. The purge pipe 45 is connected to the lower surface nozzle 44. The purge valve 46 is inserted into the purge pipe 45. For example, nitrogen is supplied to the purge pipe 45 by a gas supply device (not shown) provided in a factory where the substrate processing system 1 is installed.

[0106] The lower surface nozzle 44 sprays nitrogen gas onto the lower surface Wb, which helps to prevent the treatment liquids DHF, SC1, and IPA sprayed onto the upper surface Wu from flowing onto the lower surface Wb.

[0107] Processing unit 21 may include a thickness gauge. The thickness gauge measures a specified film thickness in the upper surface Wu. The thickness gauge may be, for example, an optical interferometer. The thickness gauge may be moved above the substrate W via a structure similar to the nozzle moving device 371.

[0108] The processing unit 21 includes a protective lifting device 55 and a protective mechanism 7. The protective mechanism 7 is located outside the substrate W held by the rotating chuck 5 (away from the substrate rotation axis A1), limiting the range of the processing liquids DHF, SC1, and IPA from splashing off the substrate W. For example, the protective mechanism 7 includes protective devices 71, 72, 73, walls 74, 75, 76, and a bottom 77.

[0109] Wall 76 surrounds the rotary chuck 5. Wall 75 surrounds the rotary chuck 5 and wall 76. Wall 74 surrounds walls 75, 76 and the rotary chuck 5. Bottom 77 connects and fixes the vertically lower ends of walls 74, 75, and 76 to the outer periphery of the rotary chuck 5.

[0110] Protective device 71 is clamped by walls 74 and 75 and is movable in the vertical direction. Protective device 72 is clamped by walls 75 and 76 and is movable in the vertical direction. Protective device 73 is clamped by wall 76 and rotary chuck 5 and is movable in the vertical direction. Protective lifting device 55 has the function of moving protective devices 71, 72, and 73 in the vertical direction.

[0111] For example, the end of the protective device 71 on the substrate rotation axis A1 side extends vertically downward, and is closer to the substrate rotation axis A1 side than the end of the protective device 72 on the substrate rotation axis A1 side, and faces the end of the protective device 73 on the substrate rotation axis A1 side in the vertical direction.

[0112] In the pretreatment process, cup 70 receives treatment liquid DHF from nozzle 341, treatment liquid SC1 from nozzle 342, and treatment liquid IPA from nozzle 343. Nozzle moving devices 371, 372, and 373 move nozzles 341, 342, and 343 vertically upwards from cup 70, facilitating the spraying of treatment liquids DHF, SC1, and IPA from cup 70. Hereinafter, the spraying of treatment liquid DHF into cup 70 will also be described as the discharge of treatment liquid DHF. The same applies to treatment liquids SC1 and IPA.

[0113] Cups 70 can be provided for each of the treatment fluids DHF, SC1, and IPA. For example, when nozzles 341, 342, and 343 are not spraying treatment fluids DHF, SC1, and IPA onto the upward surface Wu respectively, they are separated from the rotating chuck 5 and standby in different positions when viewed from above. For example, cups 70 corresponding to treatment fluids DHF, SC1, and IPA are respectively positioned vertically below the respective standby positions of nozzles 341, 342, and 343.

[0114] <1-3. Structural Example of the Processing Fluid Supply Unit>

[0115] Figure 3 This is a schematic diagram illustrating the structure of the processing fluid supply unit 28. The processing fluid supply unit 28 includes piping 331, 332, 333, 334, pumps 81, 82, 83, 84, and valves 361, 362, 363, 364. Figure 3 The text also describes the three processing units 21 and storage tanks 261, 262, 263, and 264 included in the tower 21t, which is connected to the processing liquid supply unit 28 via the piping assembly 35.

[0116] Valves 361, 362, 363, and 364 are provided for each processing unit 21. Piping assembly 35 includes piping 351, 352, 353, and 354 for the three processing units 21, connecting the tower 21t to the processed liquid supply unit 28 (see also...). Figure 1 ).

[0117] Pipe 331 is connected to storage tank 261, through which the DHF treatment fluid flows in and out of storage tank 261. Pump 81 is inserted into pipe 331. Pump 81 causes the DHF treatment fluid to flow in the direction of the arrow in pipe 331, thus circulating the DHF treatment fluid between pipe 331 and storage tank 261.

[0118] Pipe 332 is connected to reservoir 262, through which the treatment fluid SC1 flows in and out of reservoir 262. Pump 82 is inserted into pipe 332. Pump 82 causes the treatment fluid SC1 to flow in the direction of the arrow in pipe 332, thus circulating the treatment fluid SC1 between pipe 332 and reservoir 262.

[0119] Pipe 333 is connected to reservoir 263, through which the treatment fluid IPA flows in and out of reservoir 263. Pump 83 is inserted into pipe 333. Pump 83 causes the treatment fluid IPA to flow in the direction of the arrow in pipe 333, thus circulating the treatment fluid IPA between pipe 333 and reservoir 263.

[0120] Pipe 334 is connected to reservoir 264, through which the treatment fluid DHF flows in and out of reservoir 264. Pump 84 is inserted into pipe 334. Pump 84 causes the treatment fluid SC1 to flow in the direction of the arrow in pipe 334, thus circulating the treatment fluid DHF between pipe 334 and reservoir 264.

[0121] Hereinafter, the circulation of the above-mentioned treatment liquid DHF through pipes 331 and 334, the circulation of treatment liquid SC1 through pipe 332, and the circulation of treatment liquid IPA through pipe 333 are all referred to as "tower circulation".

[0122] Piping 351 of any processing unit 21 is also connected to piping 331. Piping 352 of any processing unit 21 is also connected to piping 332. Piping 353 of any processing unit 21 is also connected to piping 333. Piping 354 of any processing unit 21 is also connected to piping 334. Figure 3 In the diagram, the connections between pipes are shown by black dots. Pipes that cross each other without black dots are not connected to each other.

[0123] The DHF processing liquid from the tower circulation branch in pipe 331 is supplied to nozzle 341 via pipe 351 with an open valve 361. The SC1 processing liquid from the tower circulation branch in pipe 332 is supplied to nozzle 342 via pipe 352 with an open valve 362. The IPA processing liquid from the tower circulation branch in pipe 333 is supplied to nozzle 343 via pipe 353 with an open valve 363. The DHF processing liquid from the tower circulation branch in pipe 334 is supplied to nozzle 344 via pipe 354 with an open valve 364.

[0124] The presence or absence of tower circulation is independent of the opening and closing of valves 361, 362, 363, and 364. In processing unit 21, even if the temperature of piping 351, 352, 353, and 354 decreases, the temperature of the processed liquids DHF, SC1, and IPA undergoing tower circulation is properly maintained.

[0125] If valves 361, 362, 363, and 364 are closed, the treated fluid will stagnate in pipes 351, 352, 353, and 354, respectively. If this stagnation continues for an extended period, it will lead to deterioration of the treated fluid. For example, it may cause changes in the temperature, concentration, and composition of the treated fluid.

[0126] Whether pretreatment is required is determined based on the residence time of the treatment fluid in a particular nozzle. For example, even if either nozzle 341 or 344 is responsible for spraying the treatment fluid DHF, the determination of whether pretreatment is required is based on the time during which DHF is not sprayed from each nozzle 341 or 344. From this perspective, to avoid a complicated explanation, the following explanation will omit the spraying of DHF from nozzle 344.

[0127] <1-4. Structural Examples of Substrate Processing Systems>

[0128] Figure 4This is a diagram illustrating an example of the schematic structure of the substrate processing system 1. In addition to the substrate processing apparatus 20 and the transport apparatus 30 described above, the substrate processing system 1 also includes a host 10. The host 10, the substrate processing apparatus 20, and the transport apparatus 30 are connected in a communicative manner, for example, via a communication line 50. The communication line 50 may be, for example, one or both of wired and wireless lines.

[0129] Multiple substrate processing devices 20 can be set up. At this time, the host 10 undertakes the function of comprehensively managing multiple substrate processing devices 20.

[0130] <1-5. Example of host computer structure>

[0131] Figure 5 This is a block diagram illustrating an example of the electrical structure of the host 10. The host 10 is implemented, for example, by a computer, and has a communication unit 101, an input unit 102, an output unit 103, a storage unit 104, a control unit 105, and a driver 106 connected via a bus Bu1.

[0132] The communication unit 101 may function as a transmitting unit, for example, capable of transmitting signals to each substrate processing device 20 and transport device 30 via the communication line 50. The communication unit 101 may also function as a receiving unit, for example, capable of receiving signals from each substrate processing device 20 and transport device 30 via the communication line 50.

[0133] The input unit 102 can, for example, input signals corresponding to actions of the user using the host 10. The input unit 102 may include, for example, an operation unit, a microphone, and various sensors.

[0134] The output unit 103 may have the function of outputting various information. The output unit 103 may include, for example, a display unit and a speaker.

[0135] Storage unit 104, for example, has the function of storing various information. Storage unit 104 is composed of storage media such as hard disk and flash memory. Storage unit 104 stores, for example, program Pg1 and various information including information PP1 about the processing plan. Information PP1, for example, indicates the timing of performing multiple consecutive substrate processing of the substrate group. Storage unit 104 may include memory 105b, which will be described later.

[0136] The control unit 105 includes, for example, a computing processing unit 105a that operates as a processor and a memory 105b for temporary information storage. The computing processing unit 105a may be a central processing unit (CPU). The memory 105b may be a random access memory (RAM). In the computing processing unit 105a, for example, the functions of the host 10 are implemented by reading and executing the program Pg1 stored in the memory unit 104. Various information temporarily obtained through various information processing in the control unit 105 is appropriately stored, for example, in the memory 105b.

[0137] For example, the removable storage medium RM1 can be installed and removed relative to the drive 106. The drive 106, for example, performs data transfer between the storage medium RM1 and the control unit 105 while the storage medium RM1 is installed. For example, by installing the storage medium RM1 storing the program Pg1 in the drive 106, the program Pg1 is read from the storage medium RM1 and stored in the storage unit 104.

[0138] <1-6. Structural Example of the Main Control Unit>

[0139] Figure 6 This is a block diagram illustrating an example of the electrical structure of the main control unit 22. The main control unit 22 is implemented, for example, by a computer, and has a communication unit 221, an input unit 222, an output unit 223, a storage unit 224, a control unit 225, and a driver 226 connected via a bus Bu2.

[0140] The communication unit 221, for example, functions as a transmitter, capable of sending signals to the host 10 via the communication line 50. The communication unit 221 also functions as a receiver, capable of receiving signals from the host 10 via the communication line 50. The communication unit 221 can also transmit and receive signals with the liquid management control unit 24 via cables or other wiring.

[0141] For example, the input unit 222 can input signals corresponding to actions of the user using the board processing device 20. Similar to the input unit 102 described above, the input unit 222 may include, for example, an operation unit, a microphone, and various sensors.

[0142] The output unit 223 has the function of outputting various information, for example. Similar to the output unit 103 described above, the output unit 223 may include, for example, a display unit and a speaker.

[0143] Storage unit 224, for example, has the function of storing various types of information. Storage unit 224 can be constructed from storage media such as hard disks and flash memory. Storage unit 224 can, for example, store program Pg2 and various types of information Dt2. Storage unit 224 may include memory 225b, which will be described later.

[0144] Program Pg2 includes, for example, a flow recipe. The flow recipe includes a process recipe that determines the content of substrate processing and a preprocessing recipe that determines the content of preprocessing. The flow recipe provides common settings for multiple substrates W grouped together, such as multiple substrates W housed in the same carrier C.

[0145] The control unit 225 includes, for example, a computing processing unit 225a that operates as a processor and a memory 225b for temporary information storage. The computing processing unit 225a may be a CPU, for example. The memory 225b may be RAM, for example. In the computing processing unit 225a, for example, the functions of the main control unit 22 are implemented by reading and executing the program Pg2 stored in the memory unit 224. Various information temporarily obtained through various information processing in the control unit 225 is appropriately stored, for example, in the memory 225b.

[0146] Drive 226 is a component that can be installed and removed, for example, from a removable storage medium RM2. Drive 226, for example, when the storage medium RM2 is installed, can perform data transfer between the storage medium RM2 and the control unit 225. For example, by installing the storage medium RM2 storing the program Pg2 in drive 226, the program Pg2 can be read from the storage medium RM2 and stored in the storage unit 224.

[0147] <1-7. Example of the structure of a liquid management control unit>

[0148] Figure 7 This is a block diagram illustrating an example of the electrical structure of the liquid management control unit 24. The liquid management control unit 24, similar to the main control unit 22 described above, is implemented via a computer or the like, and includes a communication unit 241, an input unit 242, an output unit 243, a storage unit 244, a control unit 245, and a driver 246 connected via a bus Bu3.

[0149] The communication unit 241 can transmit and receive signals with the main control unit 22, for example, via cables or other wiring.

[0150] The input unit 242 can, for example, input signals corresponding to actions of the user using the board processing device 20. Similar to the input unit 102 described above, the input unit 242 can include an operation unit, a microphone, and various sensors.

[0151] Output unit 243, for example, has the function of outputting various information. Like output unit 103 described above, output unit 243 may include a display unit and a speaker, etc.

[0152] Storage unit 244, for example, has the function of storing various types of information. Similar to storage unit 224 described above, storage unit 244 can be constructed from storage media such as a hard disk or flash memory. Storage unit 244 can, for example, store program Pg3 and various types of information Dt3. Storage unit 244 may include memory 245b, which will be described later.

[0153] Program Pg3 may include, for example, process procedures and pretreatment procedures. For example, program Pg3 may include the type of treatment liquid to be sprayed in each process procedure and the specified amount to be sprayed, and the type of treatment liquid to be sprayed in each pretreatment procedure and the specified amount to be sprayed.

[0154] The control unit 245 includes, for example, a computing processing unit 245a that operates as a processor and a memory 245b for temporary information storage. The computing processing unit 245a may be a CPU, for example. The memory 245b may be RAM, for example. In the computing processing unit 245a, for example, the functions of the liquid management control unit 24 are realized by reading and executing the program Pg3 stored in the memory unit 244. Various information temporarily obtained through various information processing in the control unit 245 is appropriately stored, for example, in the memory 245b.

[0155] Drive 246 is, for example, a removable portion of the storage medium RM3 that can be installed and removed. Drive 246, for example, when the storage medium RM3 is installed, is capable of transmitting data between the storage medium RM3 and the control unit 245. For example, by installing the storage medium RM3 containing the program Pg3 in drive 246, the program Pg3 can be read from the storage medium RM3 and stored in the storage unit 244.

[0156] <1-8. Processing using processing units>

[0157] <1-8-1. Overall Processing>

[0158] Figure 8 This is a diagram illustrating an example of processing using processing unit 21. Figure 8 This corresponds to multiple substrate processing of the same type and one pretreatment. Figure 8 Examples illustrate substrate processing and preprocessing performed on multiple substrates W grouped together, such as multiple substrates W housed in the same carrier C. Figure 8 The process illustrated in the example includes steps S1 to S6.

[0159] The main control unit 22 and the liquid management control unit 24 control the operation of each part, thereby realizing the substrate processing and preprocessing. Here, we will focus on the processing unit 21 in the substrate processing apparatus 20.

[0160] In step S1, the substrate W is moved into the processing unit 21. Specifically, the substrate W is moved into the chamber 4 by the central robot arm 92 and placed on the rotating base 11. The main control unit 22 holds the substrate W on the rotating base 11 in a generally horizontal position by a vacuum chuck.

[0161] After the substrate W is held on the rotating base 11, in step S2, a chemical treatment is performed on the upper surface Wu. This chemical treatment may be, for example, a cleaning process in which treatment solutions DHF and SC1 are sequentially sprayed onto the upper surface Wu (hereinafter referred to as "first cleaning process"). Alternatively, this chemical treatment may be, for example, a cleaning process in which treatment solution SC1 is sprayed onto the upper surface Wu (hereinafter referred to as "second cleaning process"). Alternatively, this chemical treatment may be, for example, a cleaning process in which treatment solutions DHF and IPA are sequentially sprayed onto the upper surface Wu (hereinafter referred to as "third cleaning process").

[0162] In the first cleaning process, rinsing can be performed from the time the treatment fluid DHF is sprayed until the time the treatment fluid SC1 is sprayed. Alternatively, rinsing can be performed after the spraying of treatment fluid SC1 in either or both of the first and second cleaning processes. In the third cleaning process, rinsing can be performed from the time the treatment fluid DHF is sprayed until the time the treatment fluid IPA is sprayed. Alternatively, rinsing can be performed after the spraying of treatment fluid IPA in the third cleaning process.

[0163] In these rinsing processes, for example, deionized water (hereinafter referred to as "deionized water DIW") is sprayed onto the upward surface Wu or onto both the upward surface Wu and the lower surface Wb. The nozzles used to spray the deionized water DIW may also serve as nozzles 341, 342, 343, and 344, or may be attached or independently installed. In this embodiment, for ease of explanation, the rinsing process is omitted from the description.

[0164] In this liquid treatment, the main control unit 22 controls the rotary motor 15 to rotate the rotating base 11 around the substrate rotation axis A1. This rotation causes the substrate W to rotate. During step S2, the rotation speed of the rotating base 11 can be changed, or the rotation can be stopped.

[0165] In step S2, during the first cleaning process, the main control unit 22 controls the nozzle moving devices 371 and 372 to move the nozzles 341 and 342 in a predetermined manner. The liquid management control unit 24 controls the valves 361 and 362 to spray predetermined amounts of treatment liquids DHF and SC1 from the nozzles 341 and 342 toward the upper surface Wu in this order.

[0166] During the first cleaning process, the main control unit 22 controls the nozzle moving device 373 to move the nozzle 343 to the standby position. During the first cleaning process, the liquid management control unit 24 closes the valve 363.

[0167] In step S2, during the second cleaning process, the main control unit 22 controls the nozzle moving device 372 to move the nozzle 342 in a predetermined manner. The liquid management control unit 24 controls the valve 362 to spray a predetermined amount of treatment liquid SC1 from the nozzle 342 toward the upper surface Wu.

[0168] During the second cleaning process, the main control unit 22 controls the nozzle moving devices 371 and 373, causing nozzles 341 and 343 to move to their respective standby positions. During the second cleaning process, the liquid management control unit 24 closes valves 361 and 363.

[0169] In step S2, during the third cleaning process, the main control unit 22 controls the nozzle moving devices 371 and 373 to move the nozzles 341 and 343 in a predetermined manner. The liquid management control unit 24 controls the valves 361 and 363 to spray predetermined amounts of treatment liquid DHF and IPA from the nozzles 341 and 343 toward the upper surface Wu in this order.

[0170] During the third cleaning process, the main control unit 22 controls the nozzle moving device 372 to move the nozzle 342 to the standby position. During the third cleaning process, the liquid management control unit 24 closes the valve 362.

[0171] During step S2, the main control unit 22 can control the purge valve 46 to spray nitrogen gas from the lower surface nozzle 44 to the lower surface Wb. This nitrogen gas reduces or suppresses the treatment liquids DHF and SC1 sprayed onto the upper surface Wu from flowing onto the lower surface Wb.

[0172] For example, in the first and third cleaning processes, DHF treatment fluid is sprayed onto the upper surface Wu and the lower surface Wb. At this time, the liquid management control unit 24 controls valves 361 and 364 to spray a predetermined amount of DHF treatment fluid from nozzles 341 and 344 toward the upper surface Wu and the lower surface Wb, respectively.

[0173] During step S2, the main control unit 22 controls the protective lifting device 55 to change the relative position of the protective devices 71, 72, and 73 with respect to the substrate W in the vertical direction.

[0174] For example, when all the top plates of the protective devices 71, 72, and 73 are located above the upper surface Wu, and in the horizontal direction, the side of the protective device 71 faces the upper surface Wu, the treatment liquid sprayed onto and scattered from the upper surface Wu is guided to the bottom 77 between the wall 76 and the rotating chuck 5.

[0175] For example, when all the top plates of protective devices 71 and 72 are above the upper surface Wu, and the top plate of protective device 73 is below the lower surface Wb, in the horizontal direction, when the side of protective device 72 faces the upper surface Wu, the treatment liquid sprayed onto the upper surface Wu and scattered from the upper surface Wu is guided to the bottom 77 between walls 75 and 76.

[0176] For example, when the top plate of the protective device 71 is located above the upper surface Wu, and either the top plate of the protective devices 72 or 73 is located below the lower surface Wb, in the horizontal direction, when the side of the protective device 71 faces the upper surface Wu, the treatment liquid sprayed onto the upper surface Wu and scattered from the upper surface Wu is guided to the bottom 77 between the walls 74 and 75.

[0177] By appropriately combining the timing of the ejection of the processing liquid from nozzles 341, 342, and 343 with the relative vertical positions of protective devices 71, 72, and 73 relative to the substrate W, each type of processing liquid is guided to a different area. This guidance facilitates the recovery of each type of processing liquid.

[0178] Step S2 processes each substrate W. The substrate W that has been treated with the solution in step S2 is removed in step S3. Specifically, the main control unit 22 releases the vacuum chuck in the rotating base 11. The processed substrate W is unloaded from the rotating base 11 and removed from the chamber 4 by the central robot arm 92.

[0179] After executing step S3, step S4 is executed. In step S4, it is determined whether the next substrate W, which is the object of processing in processing unit 21, exists. For example, the main control unit 22 refers to the process flow program to determine whether there is a "next substrate" among the multiple substrates contained in a carrier C.

[0180] If the judgment result of step S4 is affirmative (there is a "next substrate W"), then return to step S1. If the judgment result of step S4 is negative (there is no "next substrate W"), then proceed to step S5.

[0181] In step S5, it is determined whether preprocessing is required. As described later, preprocessing is performed in principle in the process flow, but as an exception, it is omitted. The flowchart for determining whether preprocessing is required will be described later.

[0182] If the result of the judgment in step S5 is affirmative (i.e., it is determined that preprocessing is required), preprocessing is performed in step S6. If the result of the judgment in step S5 is negative (i.e., it is determined that preprocessing is not required) and after step S6 is executed, Figure 8 The processing shown has ended.

[0183] <1-8-2. An Example of a Flowchart>

[0184] Figure 9 The process flow is illustrated conceptually as a timing diagram. This process flow includes process flow groups J1, J2, and J3, and pre-processing flows Pr1, Pr2, and Pr3. Based on this process flow, processing is performed on multiple substrates W housed in the same carrier C; in this case, 25 substrates W are processed.

[0185] Processing program group J1 includes processing programs J1(1) to J1(25). Processing program group J2 includes processing programs J2(1) to J2(25). Processing program group J3 includes processing programs J3(1) to J3(25). The numbers enclosed in parentheses are any integers from 1 to 25, corresponding to 25 substrates W housed in the same carrier C. Hereinafter, substrate W(k) refers to the k-th substrate W (k = 1 to 25) housed in the same carrier C. The k-th substrate is the object of substrate processing based on processing programs J1(k), J2(k), and J3(k).

[0186] The process program specifies the following processing order: preprocessing program Pr1, process processing program J1(1), ... J1(25), preprocessing program Pr2, process processing program J2(1), ... J2(25), preprocessing program Pr3, process processing program J3(1), ... J3(25).

[0187] Figure 10 This is a timing diagram illustrating the contents of process program J1(k) over time. Process program J1(k) sets the contents of the first cleaning process performed on substrate W(k). Process program J1(k) includes infeed process program J10(k), ejection process programs J11(k), J12(k), and outfeed process program J14(k). Infeed process program J10(k), ejection process programs J11(k), J12(k), and outfeed process program J14(k) are performed in this order, executing the processes set according to their respective processes.

[0188] The loading process J10(k) sets the loading process for substrate W(k). Substrate W(k) is removed from carrier C according to loading process J10(k) and placed on rotary chuck 5. After substrate W(k) is placed on rotary chuck 5, the processing set according to ejection process J11(k) is executed.

[0189] The ejection process J11(k) sets the process of ejecting the processing liquid DHF onto the upper surface Wu of the substrate W(k). Hereinafter, the ejection of the processing liquid DHF is also referred to as ejection P(1).

[0190] After the ejection P(1) of the ejection processing program J11(k) is completed, the processing set according to the ejection processing program J12(k) is performed. The ejection processing program J12(k) sets the processing of the processing liquid SC1 ejected onto the upper surface Wu of the substrate W(k). Hereinafter, the ejection of the processing liquid SC1 is also referred to as ejection P(2).

[0191] After the ejection process P(2) of the ejection process J12(k) is completed, the process set according to the transfer process J14(k) is executed. The transfer process J14(k) is set to transfer the substrate W(k) out. According to the transfer process J14(k), the substrate W(k) is taken out from the rotary chuck 5 and transferred into the carrier C.

[0192] Figure 11 This is a timing diagram illustrating the contents of process program J2(k) over time. Process program J2(k) sets the contents of the second cleaning process performed on substrate W(k). Process program J2(k) includes infeed process program J20(k), ejection process program J22(k), and outfeed process program J24(k). Infeed process program J20(k), ejection process program J22(k), and outfeed process program J24(k) are performed in this order, executing the processes set according to their respective processes.

[0193] The loading process J20(k) sets the loading process for substrate W(k). Substrate W(k) is removed from carrier C according to loading process J20(k) and placed on rotary chuck 5. After substrate W(k) is placed on rotary chuck 5, the processing set according to ejection process J22(k) is executed.

[0194] The ejection process J22(k) sets the ejection P(2) to the upper surface Wu of the substrate W(k). Hereinafter, the ejection of the processing liquid DHF is also referred to as ejection P(2).

[0195] After the ejection process P(2) of the ejection process J22(k) is completed, the process set according to the transfer process J24(k) is executed. The transfer process J24(k) is set to transfer the substrate W(k) out. According to the transfer process J24(k), the substrate W(k) is taken out from the rotary chuck 5 and transferred into the carrier C.

[0196] Figure 12 This is a timing diagram illustrating the content of process program J3(k) over time. Process program J3(k) sets the content of the third cleaning process performed on substrate W(k). Process program J3(k) includes infeed process program J30(k), ejection process programs J31(k), J33(k), and ejection process program J34(k). Infeed process program J30(k), ejection process programs J31(k), J33(k), and ejection process program J34(k) are performed in this order, executing the processes set according to their respective processes.

[0197] The loading process J30(k) sets the loading process for substrate W(k). Substrate W(k) is removed from carrier C according to loading process J30(k) and placed on rotary chuck 5. After substrate W(k) is placed on rotary chuck 5, the processing set according to ejection process J31(k) is executed.

[0198] The ejection process J31(k) is set to eject (1) the upper surface Wu of the substrate W(k). After the ejection P(1) of the ejection process J31(k) is completed, the processing set according to the ejection process J33(k) is performed. The ejection process J33(k) is set to eject the processing liquid IPA onto the upper surface Wu of the substrate W(k). Hereinafter, the ejection of the processing liquid IPA is also referred to as ejection P(3).

[0199] After the ejection process P(3) of the ejection process J33(k) is completed, the process set according to the transfer process J34(k) is executed. The transfer process J34(k) is set to transfer the substrate W(k) out. According to the transfer process J34(k), the substrate W(k) is taken out from the rotary chuck 5 and transferred into the carrier C.

[0200] Figure 8 The step S1 shown is equivalent to loading the processing programs J10(1)~J10(25), J20(1)~J20(25), and J30(1)~J30(25). Figure 8 The step S2 shown is equivalent to the ejection processing program J11(1)~J11(25), J12(1)~J12(25), J22(1)~J22(25), J31(1)~J31(25), J33(1)~J33(25). Figure 8The step S3 shown is equivalent to bringing out the processing programs J14(1)~J14(25), J24(1)~J24(25), and J34(1)~J34(25).

[0201] For example, as described later, if the case of omitting preprocessing is not considered, then it is possible to consider starting from... Figure 8 Step S5 is removed from the flowchart. At this point, for example, step S1 is executed according to the input processing program J10(k), step S2 is executed according to the output processing programs J11(k) and J12(k), and step S3 is executed according to the output processing program J14(k). If k < 25, then step S1 is executed again via step S4. If k = 25, then step S6 is executed via step S4 and according to the preprocessing program Pr2.

[0202] Alternatively, step S1 is executed according to the input processing program J20(k), step S2 is executed according to the output processing program J22(k), and step S3 is executed according to the output processing program J24(k). If k < 25, then step S1 is executed again via step S4. If k = 25, then step S6 is executed via step S4 and according to the preprocessing program Pr3.

[0203] Pre-processing program Pr1 sets up preparatory actions for ejection P(1) and P(2) performed in process processing program group J1. Pre-processing program Pr2 sets up preparatory actions for ejection P(2) performed in process processing program group J2. Pre-processing program Pr3 sets up preparatory actions for ejection P(1) and P(3) performed in process processing program group J3. These preparatory actions are equivalent to the pre-actions described above.

[0204] Figure 13 This is a timing diagram illustrating the contents of the pretreatment program Pr1 over time. Pretreatment program Pr1 corresponds to the pretreatment of the treatment fluids DHF and SC1. Pretreatment program Pr1 includes ejection processing programs Pr11 and Pr12, which are used in this order. Ejection processing program Pr11 sets the ejection P(1) to the cup 70. Ejection processing program Pr12 sets the ejection P(2) to the cup 70.

[0205] The pretreatment program Pr2 is equivalent to the pretreatment of the treatment fluid SC1. The pretreatment program Pr2 is set to spray P(2) into the cup 70.

[0206] Figure 14This is a timing diagram illustrating the contents of the pretreatment program Pr3 over time. Pretreatment program Pr3 is equivalent to the pretreatment of the processing fluids DHF and IPA. Pretreatment program Pr3 includes ejection processing programs Pr31 and Pr33, which are used in this order. Ejection processing program Pr31 sets the ejection P(1) to the cup 70. Ejection processing program Pr33 sets the ejection P(3) to the cup 70.

[0207] Regarding the input processing programs J10(k), J20(k), J30(k), output processing programs J11(k), J12(k), J22(k), J31(k), J33(k), Pr11, Pr12, Pr31, Pr33, output processing programs J14(k), J24(k), J34(k) and any processing set according to the preprocessing program Pr2, the execution time required for each of these processes is preset in their respective processing programs.

[0208] <1-8-3. Determining whether preprocessing is required>

[0209] In this embodiment, if the time during which the processing liquid, which is the object of pretreatment, is not sprayed is shorter than a predetermined threshold, it is determined that the pretreatment is unnecessary. This reduces the time required for substrate processing, which helps to simplify the substrate processing method.

[0210] The following will first explain the process of determining whether preprocessing is required based on the preprocessing program Pr2, and then explain the process of determining whether preprocessing is required based on the preprocessing program Pr3.

[0211] Figure 15 A portion of the process flow, from ejection process J11(24) to ejection process J22(1), is shown as a timing diagram. Time t11e(k) is the end time of substrate processing set according to ejection process J11(k), more specifically, the end time of ejection P(1) onto the upper surface Wu of substrate W(k). Time t12s(k) is the start time of substrate processing set according to ejection process J12(k), more specifically, the start time of ejection P(2) onto the upper surface Wu of substrate W(k).

[0212] exist Figure 15 For ease of explanation, times t11e(k) and t12s(k) are shown as the same time, but to be precise, time t11e(k) is before time t12s(k).

[0213] Time t12e(k) is the time when the substrate processing ends as set according to the ejection processing program J12(k), and more specifically, it is the time when the ejection P(2) to the upper surface Wu of the substrate W(k) ends. Time t10(k) is the time when the processing begins as set according to the loading processing program J10(k), and more specifically, it is the time when the substrate W(k) is loaded.

[0214] Figure 16 This is a flowchart illustrating a routine for determining whether preprocessing is required. In the diagram and below, this routine is simply referred to as the "Preprocessing Determination Routine." The preprocessing determination routine is implemented by controlling the actions of each component through the main control unit 22 and the liquid management control unit 24.

[0215] The result of the preprocessing judgment routine is used for Figure 8 The result of step S5 is shown. The preprocessing determination routine does not replace step S5, nor does it show the details of step S5.

[0216] In the preprocessing determination routine, step S51 is the process of determining whether ejection P(j) has started. Here, parameter j can be either 1 or 2, and a preprocessing determination routine is applied for each parameter j.

[0217] For the ejection processing programs Pr11 and Pr31, which are configured to pre-treat the processing fluid DHF, a first pre-treatment determination routine is executed; for the ejection processing program Pr12, which is configured to pre-treat the processing fluid SC1, a second pre-treatment determination routine is executed.

[0218] If the result of step S51 is negative, then step S55 is executed. Step S55 will be described later.

[0219] If the judgment result of step S51 is positive, then step S52 is executed. Step S52 is the process of ending the counting of the count value M(j) and resetting the count value M(j).

[0220] The count value M(j) generally represents the count values ​​M(1) and M(2). The count value M(j) is the value that increases based on the count in the j-th preprocessing decision routine. The count value M(j) represents the time after the ejection P(j) ends.

[0221] Reference Figure 15 It can be seen that time t12s(24) is the time when ejection P(2) starts according to the ejection processing program J12(24). At time t12s(24), the judgment in step S51 is affirmative, and the count value M(2) is reset in step S52.

[0222] exist Figure 15In the middle, the square on the dashed line C2 indicates the time point when the count of the count value M(2) in the second preprocessing judgment routine ends and the count value M(2) is reset (the time point of executing step S52).

[0223] After executing step S52, step S53 is executed. Step S53 is the process of determining whether the ejection of P(j) has ended. If the result of step S53 is negative, step S53 is executed repeatedly. If the result of step S53 is positive, step S54 is executed. Step S54 is the process of starting the counting of the count value M(j).

[0224] Reference Figure 15 It can be seen that time t12e(24) is the time when ejection P(2) ends, as set by ejection processing program J12(24). At time t12e(24), the judgment in step S53 is affirmative, and the counting of count value M(2) begins in step S54.

[0225] exist Figure 15 In the middle, the black dot on the dashed line C2 indicates the time point at which the count of the count value M(2) in the second preprocessing judgment routine starts (the time point at which step S54 is executed).

[0226] Time t11e(24) is the time when ejection P(1) ends, as set by ejection processing program J11(24). Before time t11e(24), ejection P(1) is executed. In the first preprocessing determination routine, step S52 is executed before time t11e(24). At time t11e(24), if the determination in step S53 is affirmative, the counting of count value M(1) begins in step S54.

[0227] The black dot on the dashed line C1 indicates the time point at which the count of the count value M(1) in the first preprocessing determination routine begins (the time point at which step S54 is executed).

[0228] After starting the count in step S54, step S55 is executed. Step S55 is the process of determining whether the count value M(j) is less than a predetermined value M0(j). The predetermined value M0(j) is equivalent to the duration during which the state of not ejecting P(j) is allowed to continue. If the state of not ejecting P(j) is shorter than the time equivalent to the predetermined value M0(j), then no preprocessing is required for ejecting P(j).

[0229] If the judgment result in step S55 is negative, and the count value M(j) is above the predetermined value M0(j), then steps S50 and S59 are executed. Step S50 is the process of ending the counting of the count value M(j) and resetting the count value M(j). In step S59, it is determined that preprocessing is required. After executing steps S50 and S59, the preprocessing determination routine ends.

[0230] If the judgment result in step S55 is positive, the count value M(j) is less than the predetermined value M0(j), and step S56 is executed. In step S56, it is determined whether the substrate We has been moved into the chamber 4. The substrate We is the substrate W housed in the same carrier C and subjected to substrate processing according to the last process processing program in the same process processing program group. Among them, the same carrier C houses 25 substrates W, so substrate We refers to substrate W (25).

[0231] Before time t10(25), the judgment result of step S56 is negative, and no judgment is made on whether to perform preprocessing, and step S51 is executed again.

[0232] When step S56 is executed after time t10(25), if the judgment result is positive, step S57 is executed.

[0233] Step S57 estimates the time until the next ejection of P(j) occurs after the ejection of P(j) onto the substrate We is completed, and determines whether preprocessing should be performed based on this time and a time equivalent to a predetermined value M0(j). Specifically, it determines whether the count value M(j) is less than the value (M0(j) - R(j)).

[0234] In the second preprocessing determination routine, refer to Figure 15 Explanation of step S57. According to the process flow, after time t10 (25), the processing set by the loading process J10 (25), the ejection process J11 (25), J12 (25), the ejection process J14 (25), the preprocessing process Pr2, and the loading process J20 (1) are executed respectively. After that, the ejection P (2) based on the ejection process J22 (1) is executed.

[0235] After time t12e(25), before the time corresponding to the specified value M0(2) has elapsed, it is assumed that the processing corresponding to the outgoing processing program J14(25) and the incoming processing program J20(1) will be executed respectively. At this time, it is assumed that no preprocessing based on the preprocessing program Pr2 is required.

[0236] The count value M(2) is reset at time t12e(24). The count value M(2) at time t10(25) is equivalent to the time for performing the process set according to the outgoing process J14(25). It is assumed that this time is equal to the time from the end of ejection P(2) at time t12e(25) to the end of the outgoing of substrate We by the outgoing process J14(25).

[0237] If the result of adding the count value M(2) at time t10(25) to the count value that is equivalent to the time required for processing according to the input processing program J20(1) is less than the specified value M0(2), then it is assumed that no preprocessing based on the preprocessing program Pr2 is required.

[0238] The value R(2) is a count value equivalent to the processing time required according to the loading process program J20(1). When the substrate We is loaded into the chamber 4 and the judgment result in step S56 is affirmative, if the count value M(2) is less than the value (M0(2)-R(2)), then the judgment result in step S57 is affirmative. At this time, it is determined that the preprocessing in step S58 is not required, specifically, it is determined that the preprocessing set according to the preprocessing program Pr2 is not required.

[0239] If the count value M(2) is above the value (M0(2)-R(2)), then after time t12e(25), the processing corresponding to the outgoing processing program J14(25) and the incoming processing program J20(1) are executed respectively, assuming that the time corresponding to the specified value M0(2) has elapsed. At this time, the judgment result in step S57 is negative, and it is determined that no preprocessing is required in step S59. Specifically, it is determined that no preprocessing is required according to the preprocessing program Pr2.

[0240] Figure 17 This is a timing diagram showing the substrate processing during step S59 of the second pre-processing determination routine, using process procedures and pre-processing procedures. Figure 8 In step S5, if the judgment result is positive, the preprocessing corresponding to step S6 and set according to the preprocessing program Pr2 is executed. This preprocessing starts at time t2s and ends at time t2e.

[0241] Subsequently, corresponding to process program group J2, it is executed again. Figure 8 The flowchart corresponds to step S5, where the preprocessing determination routine is re-executed.

[0242] Time t22s(k) is the start time of substrate processing set according to the ejection processing program J22(k), more specifically, it is the start time of ejection P(2) onto the upper surface Wu of substrate W(k). Time t22e(k) is the end time of substrate processing set according to the ejection processing program J22(k), more specifically, it is the end time of ejection P(2) onto the upper surface Wu of substrate W(k).

[0243] Time t20(25) is the time when the processing set according to the loading process J20(25) is executed, specifically, the time when the substrate W(25) (also referred to as substrate We) is loaded.

[0244] Figure 18 This is a timing diagram showing the substrate processing during step S58 of the second pre-processing determination routine, using process procedures and pre-processing procedures. Figure 8 In step S5, if the judgment result is negative, step S6 is not executed. After the substrate We is removed based on the removal process J14(25), the corresponding process process group J2 is executed again. Figure 8 The flowchart.

[0245] Time tr31s is the start time of ejection P(1) set according to ejection processing program Pr31. Time tr31e is the end time of ejection P(1) set according to ejection processing program Pr31. Time tr33s is the start time of ejection P(3) set according to ejection processing program Pr33. Time tr33e is the end time of ejection P(3) set according to ejection processing program Pr33. Figure 18 For ease of explanation, it is shown that times tr31e and tr33s are the same time, but to be precise, time tr31e is before time tr33s.

[0246] Time t31s(k) is the start time of ejection P(1) set according to ejection processing program J31(k). Time t31e is the end time of ejection P(1) set according to ejection processing program J31(k). Time t33s(k) is the start time of ejection P(1) set according to ejection processing program J33(k). Figure 18 For ease of explanation, it is shown that time t31e(k) and t33s(k) are the same time, but to be precise, time t31e is before time t33s.

[0247] Reference Figure 15 In the first preprocessing determination routine, at time t11e(24), the counting of the count value M(1) begins (refer to...). Figure 16 In step S54), when time t10 (25) is reached, the judgment in step S57 is performed.

[0248] Reference Figure 9 , Figure 11 , Figure 12 as well as Figure 17 If the preprocessing set according to the preprocessing program Pr3 is excluded, then after the ejection P(1) based on the ejection processing program J11(25) ends, until the ejection P(1) based on the ejection processing program J31(1) begins, the ejection P(1) will not be executed. During this period, the processing set according to the ejection processing program J12(25), the transfer processing program J14(25), the preprocessing program Pr2, the process processing program group J2, and the transfer processing program J30(1) will be executed (hereinafter temporarily referred to as the "first intermediate processing group").

[0249] During the execution of the first intermediate processing group, ejection P(1) does not start, so step S52 is not executed, and steps S51, S55, and S56 are executed repeatedly, and the count value M(1) continues to increase.

[0250] Based on whether the execution time of the first intermediate processing group is longer than the duration of the state where no ejection P(1) is allowed (which is equivalent to the specified value M0(1)), it is determined whether preprocessing is required according to the preprocessing program Pr3.

[0251] At time t11e(24), after the count of count value M(1) begins (refer to...) Figure 15 (The black dot in the dashed line C1), at time t10(25), the judgment result of step S56 is positive, and step S57 is executed.

[0252] Reference Figure 17 as well as Figure 18 If the sum of the count value M(1) at time t10(25) and the count value corresponding to the time of execution of the processing (hereinafter referred to as the "second intermediate processing group") set according to process program J1(25), pretreatment program Pr2, process program group J2, and loading processing program J30(1) is less than the specified value M0(1), then pretreatment of the processing liquid DHF is not required. From this point of view, the count value corresponding to the total time of execution of the second intermediate processing group is taken as the value R(1).

[0253] If the judgment result of step S57 is affirmative, the process proceeds to step S58, where it is determined that the preprocessing set in preprocessing program Pr3 according to ejection processing program Pr31 is not required. If the judgment result of step S57 is negative, the process proceeds to step S59, where it is determined that the preprocessing set according to preprocessing program Pr3 is required.

[0254] Specifically, the determination of whether preprocessing is needed in the second preprocessing decision routine is not based on the overall preprocessing set by preprocessor Pr3. Therefore, Figure 8 If the judgment result of step S5 is positive, proceed to step S6. The preprocessing performed in step S6 is the ejection P(3) set according to the ejection processing program Pr33. This can be regarded as a reduction in preprocessing. Figure 19 The timing diagram in the diagram shows the substrate processing without the ejection process Pr31, using the process flow and preprocessing flow.

[0255] In this case, compared with the case where the determination result of step S57 in the second preprocessing determination routine is negative, the time required for substrate processing is shortened, which helps to simplify the substrate processing method.

[0256] <1-8-4. When to determine whether preprocessing is necessary>

[0257] For any processing program included in the process flow program, the execution time required for each processing program is also preset according to the settings of each processing program. Therefore, it is possible to determine whether to preprocess at the beginning of the substrate processing based on the process flow program. Based on the result of this determination, it is possible to prevent the preprocessing from being performed (e.g., the preprocessing is not performed as set according to the preprocessing program Pr2) or to partially prevent the preprocessing from being performed (reduction of preprocessing: e.g., the ejection P(1) is not performed as set according to the ejection processing program Pr31).

[0258] However, it is also assumed that the processing procedure changes during the execution of the flow processing program. Furthermore, it is also assumed that due to the processing status of the multiple processing units 21, processing may be performed at a time different from that set in the flow processing program. Under such assumptions, the initial determination of whether preprocessing is necessary based on the substrate processing of this flow processing program may become inappropriate.

[0259] In the example above, during the first cleaning process, the timing of the insertion of the substrate We into the chamber 4, specifically the count value at time t10 (25), is used to determine whether pre-processing is required. Under the assumptions described above, determining whether pre-processing is required at such a timing also helps to properly determine whether pre-processing is necessary.

[0260] <2. General Instructions>

[0261] If the above embodiments are described in general terms, the following can be described. In the substrate processing method with a pre-set process program in this disclosure, a pre-set process program is provided. The process program includes a first process program, a second process program, and a pre-processing program.

[0262] In the implementation method, refer to Figure 9 Examples of process processes J1(1) to J1(25) are shown as the first process process.

[0263] Examples of second process procedures include process procedures J2(1) to J2(25), and examples of pretreatment procedures include pretreatment procedure Pr2. Alternatively, examples of second process procedures include process procedures J3(1) to J3(25), and examples of pretreatment procedures include pretreatment procedure Pr3.

[0264] The first process program sets the content of the first process performed on the substrate. In the embodiment, refer to... Figure 10The process program J1(k) sets the ejection processes P(1) and P(2) to be performed on the substrate W(k). More specifically, the process program J1(k) includes ejection process programs J11(k) and J12(k), which respectively set the ejection processes P(1) and P(2) to be performed on the substrate W(k). The first process includes ejecting the processing liquid DHF onto the substrate W(k) using P(1). The first process includes ejecting the processing liquid SC1 onto the substrate W(k) using P(2).

[0265] The second process program sets the content of the second process performed on the substrate after the first process. The preprocessing program sets the content of the preparatory actions for the second process program.

[0266] In the implementation method, refer to Figure 11 The process program J2(k) sets the ejection P(2) performed on the substrate W(k). More specifically, the process program J2(k) includes an ejection process program J22(k), which sets the ejection P(2) performed on the substrate W(k). The second process includes the ejection P(2) of the processing liquid SC1 applied to the substrate W(k). The pre-processing program Pr2 sets the preparatory actions for the process program J2(k). These preparatory actions include the discharge of the processing liquid SC1.

[0267] In the implementation method, refer to Figure 12 The process program J3(k) sets the ejection P(1) and P(3) to be performed on the substrate W(k). More specifically, the process program J3(k) includes ejection processes J31(k) and J33(k), which respectively set the ejection P(1) and P(3) to be performed on the substrate W(k).

[0268] The second process includes ejecting the processing liquid DHF onto the substrate W (P(1)). The second process includes ejecting the processing liquid IPA onto the substrate W (P(3)). The pre-processing program Pr3 sets the preparatory actions for the process processing program group J3. The pre-processing program Pr3 includes the ejection processing program Pr31, and the preparatory actions set according to the ejection processing program Pr31 include the discharge of the processing liquid DHF. The pre-processing program Pr3 includes the ejection processing program Pr33, and the preparatory actions set according to the ejection processing program Pr33 include the discharge of the processing liquid IPA.

[0269] Both the first and second processes include spraying a first liquid onto the substrate W. Here, it can be assumed that the processing liquid SC1 is the first liquid, and the first process is set according to the spraying processing programs J12(1) to J12(25), the preparatory action is set according to the spraying processing program Pr12, and the second process is set according to the spraying processing programs J22(1) to J22(25). Alternatively, it can be assumed that the processing liquid DHF is the first liquid, and the first process is set according to the spraying processing programs J11(1) to J11(25), the preparatory action is set according to the spraying processing program Pr31, and the second process is set according to the spraying processing programs J31(1) to J31(25).

[0270] If the time from the end of the first processing to the start of the second processing is shorter than the first threshold, the preparatory action time is reduced and the second processing is executed. Assuming that the processing liquid SC1 is the first liquid, the first processing ends with the end of the spraying processing program J12 (25), and the second processing begins with the start of the spraying processing program J22 (1). Assume that the duration of the state that allows no spraying P (2) is taken as the first threshold. If the time from time t12e (25) to time t22s (1) is shorter than the first threshold, the preparatory action set according to the preprocessing program Pr2 is omitted. The specified value M0 (2) is the count value equivalent to the first threshold.

[0271] Assuming that the treatment solution SC1 is used as the first solution, the preparation time is essentially reduced to zero.

[0272] Assuming that the processing fluid DHF is used as the first liquid, the first processing ends with the end of the ejection processing program J11 (25), and the second processing begins with the start of the ejection processing program J31 (1). It is assumed that the duration of the state where ejection P (1) is not performed is used as the first threshold. If the time from time t11e (25) to time t31s (1) is shorter than the first threshold, the pre-action set in the pre-processing program Pr3 according to the ejection processing program Pr31 is omitted. The specified value M0 (1) is the count value equivalent to the first threshold.

[0273] Assuming that the treatment fluid DHF is used as the first liquid, the preparation time is reduced only by the time required for the pre-action as set according to the spray treatment program Pr31.

[0274] The substrate processing method includes a step of performing a first process (e.g., the first process is set by the process program group J1) and a step of determining whether the time from the end of the first process to the start of the second process is shorter than a first threshold (this determination is achieved, for example, through steps S55, S56, S57, S58, S59 and step S5). The substrate processing method also includes the following step: if the result of the determination is positive, then reducing the pre-action time and performing the second process.

[0275] If we consider the treatment fluid SC1, the second treatment includes spraying P(2). At this time, we determine whether pretreatment set according to the pretreatment program Pr2 is required. If the result of the above determination is affirmative, the pretreatment is omitted. This omission can greatly reduce the time required for pretreatment.

[0276] If the processing fluid DHF is considered, the second processing includes ejection P(1). At this time, it is determined whether pretreatment set according to the ejection processing program Pr31 is required. If the result of the above determination is affirmative, the pretreatment is omitted. This omission can reduce the time required for pretreatment set according to the pretreatment program Pr3.

[0277] However, assuming that the treatment fluid SC1 is used as the first solution, in this embodiment, the time from time t12e(25) to time t22s(1) is estimated at time t10(25), and therefore the value R(2) explained in step S57 is used. When the treatment fluid DHF is assumed, in this embodiment, the time from time t11e(25) to time t31s(1) is estimated at time t10(25), and therefore the value R(1) explained in step S57 is used.

[0278] In other words, the process includes N first processes corresponding to N substrates W(1) to W(N) (N is an integer greater than 2: in the embodiment, it is an integer 25). At the point when the first process for substrates W(1) to W(N-1) ends and the first process for substrate W(N) begins, it is determined whether the time from the end of the first process to the start of the second process is shorter than a first threshold.

[0279] <3. Transformation>

[0280] <3-1. First Variation>

[0281] Even if the time from the end of the spraying of the first liquid in the first treatment to the start of the spraying of the first liquid in the second treatment exceeds the first threshold, if the time is small, the degree of degradation of the first liquid is considered low. Hereinafter, a second threshold, which is longer than the first threshold, will be introduced for explanation.

[0282] As can be seen from the implementation method, if the time from time t12e(25) to time t22s(1) is estimated to be longer than the time during which the state of not ejecting P(2) is allowed to last longer than time δ2 (>0), then if time δ2 is small, the deterioration of the treatment fluid SC1 is considered to be small. Therefore, the second threshold can be set to be larger than the first threshold for ejecting P(2) to reduce the pre-action time set according to the ejection processing program Pr12.

[0283] Alternatively, if the time from time t11e(25) to time t31s(1) is estimated to be longer than the time during which the state of not ejecting P(1) is allowed to last longer than time δ1 (>0), then if time δ1 is small, the degradation of the DHF in the treatment fluid is considered small. Therefore, the second threshold can be set to be larger than the first threshold for ejecting P(1), thereby reducing the pre-action time set according to the ejection treatment program Pr31.

[0284] This reduction in pre-action time helps to shorten the time required for substrate processing. For example, during step S6, the actions of each part are controlled by the main control unit 22 and the liquid management control unit 24, thereby achieving this reduction in pre-action time.

[0285] <3-2. Second Variation>

[0286] If the time between the end of the spraying of the first liquid in the first treatment and the start of the spraying of the first liquid in the second treatment exceeds a first threshold, and the time is large, then the degradation of the first liquid is considered to be large. The following explanation uses a third threshold, which is longer than the second threshold.

[0287] Given that the time from time t12e(25) to time t22s(1) is significantly longer than the duration of the state in which ejection P(3) is not allowed, it is assumed that the deterioration of the treatment fluid SC1 is also significant. Therefore, the third threshold can be set to be larger than the second threshold for ejection P(2), and the pre-action time set according to the ejection treatment program Pr12 can be increased.

[0288] Alternatively, if the time from time t11e(25) to time t31s(1) is estimated to be significantly longer than the duration of the state in which ejection P(1) is not allowed, the deterioration of the processing fluid DHF will also be significant. Therefore, the third threshold can be set to be larger than the second threshold for ejection P(1), and the pre-action time set according to the ejection processing program Pr31 can be increased.

[0289] Increasing the pre-action time helps to slightly reduce the impact of the first solution's deterioration on the second treatment. For example, during step S6, this pre-action time is increased by controlling the actions of each part according to the main control unit 22 and the liquid management control unit 24.

[0290] <3-3. The Third Variation>

[0291] After the first liquid is sprayed out, it will not start spraying out again. After a time longer than the fourth threshold, the first liquid can be discharged. The fourth threshold is longer than the first threshold.

[0292] For example, if P(2) does not start spraying again after the spraying process J12(25) ends, even after a time longer than the fourth threshold, then the treatment liquid SC1 is discharged.

[0293] For example, if P(1) does not start spraying again after the spraying process J11(25) ends, even after a time longer than the fourth threshold, then the treatment fluid DHF is discharged.

[0294] For example, if P(3) does not start spraying again after a time longer than the fourth threshold has elapsed since the end of the spraying process J33(25), then the treatment liquid IPA is discharged.

[0295] The discharge of the third-stage treatment fluid improves the effectiveness of reducing the impact of solution degradation on subsequent treatments.

[0296] The embodiments and modifications disclosed herein are merely examples, and the substrate processing method is not limited to the above. For example, all or part of the embodiments and modifications can be appropriately combined.

Claims

1. A substrate processing method, which is provided with a flow processing program in advance, the flow processing program including: a first process processing program which sets contents of a first processing performed on a substrate, a second process processing program which sets contents of a second processing performed on the substrate after the first processing, and a pre-processing program which sets contents of a preliminary action with respect to the second process processing program; the substrate processing method characterized in that: the first processing includes ejection of a first chemical liquid to the substrate, the second processing includes ejection of the first chemical liquid to the substrate, the preliminary action includes discharge of the first chemical liquid, the substrate processing method has the following steps: performing the first processing, judging whether a time from an end of the first processing to a start of the second processing is shorter than a first threshold, and if the result of the judgment is affirmative, reducing a time of the preliminary action and performing the second processing; and if a time from an end of the ejection of the first chemical liquid in the first processing to a start of the ejection of the first chemical liquid in the second processing is shorter than a second threshold and longer than a first threshold, the second threshold is longer than the first threshold.

2. The substrate processing method according to claim 1, characterized in that: if the time from the end of the ejection of the first chemical liquid in the first processing to the start of the ejection of the first chemical liquid in the second processing is longer than a third threshold, the third threshold is longer than the second threshold.

3. A substrate processing method, which is provided with a flow processing program in advance, the flow processing program including: a first process processing program which sets contents of a first processing performed on a substrate, a second process processing program which sets contents of a second processing performed on the substrate after the first processing, and a pre-processing program which sets contents of a preliminary action with respect to the second process processing program; the substrate processing method characterized in that: the first processing includes ejection of a first chemical liquid to the substrate, the second processing includes ejection of the first chemical liquid to the substrate, the preliminary action includes discharge of the first chemical liquid, the substrate processing method has the following steps: performing the first processing, judging whether a time from an end of the first processing to a start of the second processing is shorter than a first threshold, and if the result of the judgment is affirmative, reducing a time of the preliminary action and performing the second processing; and if the ejection of the first chemical liquid is not started again after the end of the ejection of the first chemical liquid and a time elapses which is longer than a fourth threshold, the fourth threshold is longer than the first threshold, the discharge of the first chemical liquid is performed.

4. A substrate processing method, which is provided with a flow processing program in advance, the flow processing program including: a first process processing program which sets contents of a first processing performed on a substrate, a second process processing program which sets contents of a second processing performed on the substrate after the first processing, and a pre-processing program which sets contents of a preliminary action with respect to the second process processing program; the substrate processing method characterized in that: the first processing includes ejection of a first chemical liquid to the substrate, the second processing includes ejection of the first chemical liquid to the substrate, the preliminary action includes discharge of the first chemical liquid, the substrate processing method has the following steps: performing the first processing, judging whether a time from an end of the first processing to a start of the second processing is shorter than a first threshold, and if the result of the judgment is affirmative, reducing a time of the preliminary action and performing the second processing; and if the ejection of the first chemical liquid is not started again after the end of the ejection of the first chemical liquid and a time elapses which is longer than a fourth threshold, the fourth threshold is longer than the first threshold, the discharge of the first chemical liquid is performed. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ a pre-process program that sets contents of a preliminary operation with respect to the second process program; The substrate processing method is characterized by The first processing includes ejection of a first chemical liquid to the substrate, The second processing includes ejection of the first chemical liquid to the substrate, The preliminary operation includes discharge of the first chemical liquid, The substrate processing method has the following steps: performing the first processing, determining whether a time from the end of the first processing to the start of the second processing is shorter than a first threshold, and if the result of the determination is positive, reducing a time of the preliminary operation and performing the second processing; The flow process program includes N first processing corresponding to N substrates, respectively, N being an integer of 2 or more, At a time point when the first processing on the first to (N-1)th substrates ends and the first processing on the Nth substrate starts, it is determined whether a time from the end of the Nth first processing to the start of the second processing is shorter than the first threshold.

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