Liquid cooling plate device

Abstract

The present invention relates to the technical field of cooling devices, and discloses a liquid cooling plate device. The liquid cooling plate device includes a bottom plate, a cooling main body and a cover plate. The bottom plate is arranged above the component to be cooled; the cooling main body is arranged on the side of the bottom plate away from the component to be cooled. The cooling main body includes a frame, a cooling layer is arranged inside the frame, and a reflux layer is arranged above the cooling layer. The cooling layer is provided with a plurality of cooling channels radiating from the middle of the frame to the outside. The reflux layer is provided with reflux channels communicated with the cooling channels, and a liquid discharge channel communicated with a plurality of reflux channels is arranged on the periphery of the reflux layer; the cover plate is arranged on the side of the cooling main body away from the bottom plate. An inlet is arranged in the middle of the cover plate and communicated with the cooling channels, and a liquid discharge port communicated with the liquid discharge channel is also arranged on the cover plate. The present invention does not require a high-power pump set, saves the cooling cost, effectively improves the utilization rate of cooling water, is more targeted at cooling the component to be cooled with high central heat generation, and has a better cooling effect.

Description

Technical Field

[0001] The present invention relates to the technical field of cooling devices, and in particular to a liquid cooling plate device. Background Art

[0002] Currently, with the rapid development of the electronics industry, the thermal design power consumption and heat flux density of each heat-generating component of the server are continuously increasing, and the thermal design power consumption of a single electronic component can even reach 300W. Therefore, the cold plate, as an efficient heat dissipation method, is becoming more and more popular. Compared with air cooling, the cold plate has a larger specific heat capacity and a higher heat transfer coefficient.

[0003] In the prior art, the water in the cold plate usually flows from one side to the other side, so that a part of the water flow does not pass through the heat-generating area to exchange heat with it, and the utilization rate of the cooling water is low; in addition, during the entire flow process of the water in the cold plate, the pressure drop is generally very large, resulting in poor cooling effect. At the same time, a circulating water pump with a larger power is required to make it flow in the cold plate, which greatly increases the cooling cost.

[0004] Therefore, there is an urgent need for a liquid cooling plate device to solve the above problems. Summary of the Invention

[0005] Based on the above, the purpose of the present invention is to provide a liquid cooling plate device with high cooling efficiency and low cooling cost.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] A liquid cooling plate device, comprising:

[0008] A bottom plate, arranged above the component to be cooled;

[0009] A cooling main body, arranged on the side of the bottom plate away from the component to be cooled. The cooling main body includes a frame, a cooling layer is arranged inside the frame, and a return layer is arranged above the cooling layer. The cooling layer is provided with a plurality of cooling flow channels radiating from the middle of the frame to the outside. The return layer is provided with return flow channels communicating with the cooling flow channels, and a liquid discharge flow channel communicating with a plurality of the return flow channels is arranged on the periphery of the return layer;

[0010] A cover plate, arranged on the side of the cooling main body away from the bottom plate. An inlet is arranged in the middle of the cover plate and communicates with the cooling flow channels, and a liquid discharge port communicating with the liquid discharge flow channel is also arranged on the cover plate.

[0011] As a preferred solution of the liquid cooling plate device, a liquid inlet flow channel is further arranged in the middle of the cooling main body, and the liquid inlet flow channel is configured to communicate the inlet and the cooling flow channels.

[0012] As a preferred solution of a liquid cooling plate device, the cooling layer includes a plurality of partition structures radiating from the middle to the outside, and a cooling flow channel is formed between two adjacent partition structures. The partition structure is integrally formed with the frame.

[0013] As a preferred solution of a liquid cooling plate device, the partition structure includes partition ribs radiating from the middle to the outside and partition blades arranged on both sides of the partition ribs. One end of the partition blade far from the partition rib extends towards the middle of the frame, and a cooling position communicating with the cooling flow channel is formed between adjacent partition blades.

[0014] As a preferred solution of a liquid cooling plate device, the reflux layer is provided with guide vanes, a reflux flow channel is formed between adjacent guide vanes, the guide vanes are overlapped with the partition blades, and a liquid discharge flow channel is formed between the guide vane close to the frame and the frame.

[0015] As a preferred solution of a liquid cooling plate device, the height of the cooling layer is 3.5 - 4.5 times the height of the reflux layer.

[0016] As a preferred solution of a liquid cooling plate device, the width of the liquid discharge flow channel corresponding to the liquid discharge port is greater than the width of the liquid discharge flow channel far from the liquid discharge port.

[0017] As a preferred solution of a liquid cooling plate device, a quick-connect joint is provided at the liquid inlet and / or the liquid discharge port.

[0018] As a preferred solution of a liquid cooling plate device, an installation groove is provided on the bottom plate, and the cooling main body is arranged in the installation groove.

[0019] As a preferred solution of a liquid cooling plate device, between the cover plate and the cooling main body; and / or, the bottom plate and the cooling main body are welded.

[0020] As a preferred solution of a liquid cooling plate device, installation holes are provided in the circumferential direction of the bottom plate, installation components are arranged in the installation holes, and the installation components can be connected to the component to be cooled.

[0021] The beneficial effects of the present invention are as follows:

[0022] The present invention cools a component to be cooled below a bottom plate by providing a cooling body between the bottom plate and a cover plate. By arranging a cooling layer and a reflux layer distributed vertically within the frame of the cooling body, the coolant entering the cooling body through the liquid inlet of the cover plate can flow to the cooling layer by gravity to cool the component to be cooled, eliminating the need for a high-power pump set and saving cooling costs. Since the reflux layer is arranged above the cooling layer, the cooling water at the lower part can be fully utilized, effectively improving the utilization rate of the cooling water. Additionally, by arranging the liquid inlet in the middle of the frame and the liquid discharge channel and the liquid discharge port on the outside of the frame, the cooling water can first cool the middle part, making the cooling more targeted for the component to be cooled with high heat generation in the center and achieving a better cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments of the present invention. Obviously, the following-described drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings.

[0024] Figure 1 is a schematic diagram of a liquid cooling plate device provided by a specific embodiment of the present invention;

[0025] Figure 2 is a cross-sectional view of a liquid cooling plate device provided by a specific embodiment of the present invention;

[0026] Figure 3 is a top view of the cooling body of a liquid cooling plate device provided by a specific embodiment of the present invention;

[0027] Figure 4 is a bottom view of the cooling body of a liquid cooling plate device provided by a specific embodiment of the present invention;

[0028] Figure 5 is a schematic diagram of the bottom plate of a liquid cooling plate device provided by a specific embodiment of the present invention.

[0029] In the figure:

[0030] 1. Bottom plate; 11. Installation groove; 12. Installation hole; 13. Installation component;

[0031] 2. Cooling body; 21. Frame; 211. Cooling layer; 212. Reflux layer; 213. Cooling flow channel; 214. Reflux flow channel; 215. Liquid discharge flow channel; 216. Liquid inlet flow channel; 217. Cooling position; 22. Partition structure; 221. Partition rib; 222. Partition blade; 23. Guide blade;

[0032] 3. Cover plate; 31. Quick-connect fitting. Detailed implementation manner

[0033] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation to the present invention.

[0034] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0035] Unless otherwise clearly specified and defined, the terms "installation", "connection", "connection", "fixation" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0036] The technical solution of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation manners.

[0037] As Figures 1-5 shown, this embodiment provides a liquid cooling plate device, which includes a bottom plate 1, a cooling main body 2 and a cover plate 3. The bottom plate 1 is arranged above the component to be cooled; the cooling main body 2 is arranged on the side of the bottom plate 1 away from the component to be cooled. The cooling main body 2 includes a frame 21. A cooling layer 211 and a return layer 212 arranged above the cooling layer 211 are arranged inside the frame 21. The cooling layer 211 is provided with a plurality of cooling channels 213 radiating from the middle of the frame 21 to the outside. The return layer 212 is provided with a return channel 214 communicating with the cooling channels 213. A liquid discharge channel 215 communicating with a plurality of return channels 214 is arranged on the periphery of the return layer 212; the cover plate 3 is arranged on the side of the cooling main body 2 away from the bottom plate 1. An inlet communicating with the cooling channels 213 is arranged in the middle of the cover plate 3, and a liquid discharge port communicating with the liquid discharge channel 215 is also arranged on the cover plate 3.

[0038] By arranging a cooling main body 2 between a bottom plate 1 and a cover plate 3, it is used to cool the component to be cooled below the bottom plate 1; by arranging a cooling layer 211 and a return flow layer 212 which are distributed up and down in the frame 21 of the cooling main body 2, the cooling liquid entering the cooling main body 2 through the liquid inlet of the cover plate 3 can flow to the cooling layer 211 by gravity to cool the component to be cooled, without the need for a high-power pump set, saving the cooling cost; since the return flow layer 212 is arranged above the cooling layer 211, the cooling water at the lower part can be fully utilized, effectively improving the utilization rate of the cooling water. In addition, by arranging the liquid inlet in the middle of the frame 21 and arranging the liquid discharge channel and the liquid discharge port on the outer side of the frame 21, the cooling water can first cool the middle part, making the cooling of the component to be cooled with high heat generation in the center more targeted and the cooling effect better.

[0039] As an optional solution of the liquid cooling plate device, a liquid inlet flow channel 216 is further arranged in the middle of the cooling main body 2, and the liquid inlet flow channel 216 is configured to be able to communicate with the liquid inlet and the cooling flow channel 213. By arranging the liquid inlet flow channel 216, the flow between the liquid inlet and the return flow layer 212 can be effectively avoided, so that the cooling water passing through the liquid inlet can directly enter the cooling layer 211, diffuse through the cooling flow channel 213, and finally flow out of the liquid discharge port of the cover plate 3 through the return flow layer 212.

[0040] Specifically, the cooling layer 211 includes a plurality of partition structures 22 radiating from the middle to the outside, and a cooling flow channel 213 is formed between two adjacent partition structures 22. By arranging the partition structures 22 to radiate from the middle to the outside, the formed cooling flow channel 213 also radiates from the middle to the outside, which is beneficial to accelerating the diffusion speed of the cooling water, thereby achieving the effect of reducing the flow resistance.

[0041] Furthermore, the partition structure 22 includes partition ribs 221 radiating from the middle to the outside and partition vanes 222 arranged on both sides of the partition ribs 221. One end of the partition vane 222 far from the partition rib 221 extends towards the middle of the frame 21. When the cooling water enters the cooling flow channel 213 of the cooling layer 211 through the liquid inlet flow channel 216, it can sequentially enter between a plurality of partition vanes 222, effectively improving the flow efficiency of the cooling water. A cooling position 217 communicating with the cooling flow channel 213 is formed between two adjacent partition vanes 222. By arranging the cooling position 217, it can ensure that the cooling water exchanges heat fully with the component to be cooled; at the same time, the cooling position 217 is beneficial to improving the diffusion speed of the cooling water from the middle to the outside, thereby reducing the flow resistance.

[0042] It should be noted that the cooling water in the cooling position 217 will gradually accumulate until its height reaches the reflux layer 212. The cooling water in the cooling position 217 will form convection. The cooling water with a higher temperature has a smaller density and generates an upward force, so it will be located in the upper part. On the one hand, it promotes the circulation of the cooling water in the cooling position 217, and on the other hand, it can also make the cooling water with a higher temperature be refluxed first, so that the cooling water that just enters the cooling position 217 can fully exchange heat with the part to be cooled, improving the utilization rate of the cooling water.

[0043] Further, quick connectors 31 are provided at the liquid inlet and / or the liquid outlet, so as to facilitate the entry or exit of the cooling water from the liquid cooling plate device, and at the same time, the installation and disassembly are more convenient. Exemplarily, the quick connectors 31 at the liquid inlet and the liquid outlet adopt a nut plus pagoda type design, which is beneficial to minimizing the possibility of leakage.

[0044] In this embodiment, the height of the cooling layer 211 is 3.5 - 4.5 times the height of the reflux layer 212 to ensure that there is enough cooling water to exchange heat with the part to be cooled and ensure the heat exchange effect.

[0045] As an alternative solution of the liquid cooling plate device, guide vanes 23 are provided in the reflux layer 212, and a reflux channel 214 is formed between adjacent guide vanes 23. The guide vanes 23 and the partition vanes 222 are overlapped, so that the cooling water in the cooling position 217 can directly enter between adjacent guide vanes 23 after rising. The guide vanes not only surround the reflux channel 214, but also provide a guiding effect for the refluxing cooling water, so that the refluxing cooling water can flow to the liquid discharge channel 215 near the frame 21 as soon as possible.

[0046] Further, a liquid discharge channel 215 is formed between the guide vane 23 near the frame 21 and the frame 21. The liquid discharge channel 215 is communicated with the reflux channel 214. After the cooling water in the reflux channel 214 flows into the liquid discharge channel 215, it is finally discharged through the liquid outlet of the cover plate 3.

[0047] Preferably, the width of the liquid discharge channel 215 corresponding to the liquid outlet is greater than the width of the liquid discharge channel 215 far from the liquid outlet. Such a setting can be more beneficial to the discharge of the cooling water from the liquid cooling plate device.

[0048] In this embodiment, the partition structure 22 and the frame 21 are integrally formed, which is convenient for the processing of the partition structure 22. At the same time, the guide vanes 23 are also integrally formed with the partition structure 22. The overall thickness of the partition structure 22 and the guide vanes 23 is larger, and thus the strength is better. It can be used as the skeleton of the liquid cooling plate device, making the reliability of the liquid cooling plate higher.

[0049] Exemplarily, the cooling body 2 is made of aluminum or copper to ensure higher heat exchange efficiency. The above-mentioned one-piece molding can be achieved by aluminum extrusion molding. During processing, the liquid discharge channel 215 can be machined by a milling machine, and for the liquid discharge channel 215 corresponding to the liquid discharge port, a pair of guide vanes 23 can be milled off more, so that its width is greater than the width of the liquid discharge channel 215 away from the liquid discharge port.

[0050] Correspondingly, welding is performed between the cover plate 3 and the cooling body 2; and / or between the bottom plate 1 and the cooling body 2. The welded connection is firm and can effectively avoid leakage of cooling water.

[0051] Furthermore, an installation groove 11 is provided on the bottom plate 1, and the cooling body 2 is disposed in the installation groove 11. The provision of the installation groove 11 is conducive to the positioning between the cooling body 2 and the bottom plate 1, and is also conducive to the sealing of the frame 21.

[0052] Optionally, to realize the installation of the liquid cooling plate device, installation holes 12 are provided in the circumferential direction of the bottom plate 1, and an installation component 13 is provided in the installation holes 12. The installation component 13 can be connected to the component to be cooled. During installation, the middle part of the liquid cooling plate device can be set facing the position where the component to be cooled generates the most serious heat, so as to improve the cooling effect; at the same time, the cooling plate device also has advantages such as small pressure drop and more reliable structure.

[0053] The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. The content of this specification should not be construed as a limitation to the present invention.

Claims

1. Liquid cooling plate device, characterized in that, Comprising: A bottom plate (1), disposed above the component to be cooled; A cooling main body (2), disposed on the side of the bottom plate (1) away from the component to be cooled. The cooling main body (2) includes a frame (21). Inside the frame (21), a cooling layer (211) and a reflux layer (212) disposed above the cooling layer (211) are provided. The cooling layer (211) is provided with a plurality of cooling channels (213) radiating from the middle of the frame (21) to the outside. The reflux layer (212) is provided with reflux channels (214) communicating with the cooling channels (213). A liquid discharge channel (215) communicating with a plurality of the reflux channels (214) is provided on the circumferential side of the reflux layer (212); A cover plate (3), disposed on the side of the cooling main body (2) away from the bottom plate (1). An inlet is provided in the middle of the cover plate (3) and communicates with the cooling channels (213). A liquid discharge port communicating with the liquid discharge channel (215) is further provided on the cover plate (3); The cooling layer (211) includes a plurality of partition structures (22) radiating from the middle to the outside. The cooling channels (213) are formed between adjacent two of the partition structures (22). The partition structures are integrally formed with the frame (21); The partition structure (22) includes partition ribs (221) radiating from the middle to the outside and partition vanes (222) disposed on both sides of the partition ribs (221). One end of the partition vane (222) away from the partition rib (221) extends towards the middle of the frame (21). Cooling positions (217) communicating with the cooling channels (213) are formed between adjacent partition vanes (222).

2. The liquid cooling plate device according to claim 1, wherein An inlet channel (216) is further provided in the middle of the cooling main body (2). The inlet channel (216) is configured to be able to communicate the inlet and the cooling channels (213).

3. The liquid cooling plate device according to claim 1, characterized in that The reflux layer (212) is provided with guide vanes (23). The reflux channels (214) are formed between adjacent guide vanes (23). The guide vanes (23) are overlapped with the partition vanes (222). The liquid discharge channel (215) is formed between the guide vane (23) close to the frame (21) and the frame (21).

4. The liquid cooling plate device according to claim 1, wherein The height of the cooling layer (211) is 3.5 - 4.5 times the height of the reflux layer (212).

5. The liquid cooling plate device according to claim 1, wherein The width of the liquid discharge channel (215) corresponding to the liquid discharge port is greater than the width of the liquid discharge channel (215) away from the liquid discharge port.

6. The liquid cooling plate device according to claim 1, characterized in that Quick connectors (31) are provided at the inlet and / or the liquid discharge port.

7. The liquid cooling plate device according to claim 1, characterized in that An installation groove (11) is provided on the bottom plate (1). The cooling main body (2) is disposed in the installation groove (11).

8. The liquid cooling plate device according to claim 1, wherein, Welding is performed between the cover plate (3) and the cooling main body (2); and / or, between the bottom plate (1) and the cooling main body (2).

9. The liquid cooling plate device according to claim 1, wherein, Installation holes (12) are provided on the circumference of the bottom plate (1). Installation components (13) are provided in the installation holes (12). The installation components (13) can be connected to the component to be cooled.

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