Method and electronic device for detecting temperature rise anomalies

Abstract

Embodiments of the present disclosure relate to a method and an electronic device for detecting temperature rise anomaly. The method includes obtaining a plurality of actual temperatures of a plurality of temperature rise elements in a switching device and an ambient temperature. The method includes determining a plurality of actual temperature rises for the plurality of temperature rise elements based on the plurality of actual temperatures and the ambient temperature. The method includes obtaining a plurality of temperature rise relationships for the plurality of temperature rise elements. The method includes determining a plurality of predicted temperature rises for the plurality of temperature rise elements based on the plurality of actual temperature rises and the plurality of temperature rise relationships. The method further includes determining a temperature rise element of the plurality of temperature rise elements having a temperature rise anomaly based on the plurality of predicted temperature rises and a plurality of temperature rise threshold ranges for the plurality of temperature rise elements. In this way, it is possible to detect whether the temperature rise of the temperature rise element is abnormal without other sensing devices, thereby improving the reliability of the high switching device in a cost-effective manner.

Description

TECHNICAL FIELD

[0001] Exemplary embodiments of the present disclosure relate to the field of switching devices, and more particularly, to a method for detecting abnormal temperature rise, an electronic device, and a computer-readable storage medium. BACKGROUND

[0002] A switching device is an electrical device in a power system that can perform opening / closing, control, or protection functions during power generation, power transmission, power distribution, and power conversion. As the usage time of the switching device increases, the conductive connection part (e.g., a contact) in the main circuit of the switching device can increase its resistance due to mechanical vibration, wear, and manufacturing process defects, thereby causing the temperature of the contact to rise or even burn out the contact. This can cause a safety accident. In addition, insufficient field installation of the switching device and damage to components are also major factors that cause abnormal temperature rise in the switching device.

[0003] A conventional method of detecting such abnormal temperature rise is to use a portable infrared device to detect the temperature of the contact in the switching device via an observation window. Then, the detected temperature is compared with the temperature limit value of the connection part under the rated current to determine whether there is an abnormal temperature rise in the connection part of the switching device. However, such a detection method is not always accurate and is inefficient. Therefore, there is a need for an improved solution for temperature rise monitoring of a switching device. SUMMARY

[0004] Embodiments of the present disclosure provide a scheme for detecting abnormal temperature rise of a temperature rising element using temperature rise relationships of adjacent temperature rising elements in a switching device, aiming to at least overcome the problems existing in the prior art when detecting abnormal temperature rise.

[0005] A first aspect of the present disclosure relates to a method of detecting abnormal temperature rise. The method includes obtaining a plurality of actual temperatures of a plurality of temperature rising elements in a switching device and an ambient temperature. The method further includes determining a plurality of actual temperature rises for the plurality of temperature rising elements based on the plurality of actual temperatures and the ambient temperature. The method further includes obtaining a plurality of temperature rise relationships for the plurality of temperature rising elements, the temperature rise relationship indicating a relationship between a normal temperature rise of one temperature rising element of the plurality of temperature rising elements and a normal temperature rise of at least one other temperature rising element of the plurality of temperature rising elements associated with the one temperature rising element. The method further includes determining a plurality of predicted temperature rises for the plurality of temperature rising elements based on the plurality of actual temperature rises and the plurality of temperature rise relationships. The method further includes determining a temperature rising element of the plurality of temperature rising elements having abnormal temperature rise based on the plurality of predicted temperature rises.

[0006] There are multiple temperature-increasing elements in a switchgear. The temperature of each element in an electronic and electrical device that is higher than the ambient temperature is referred to as temperature rise. Therefore, the temperature rise of each temperature-increasing element can be obtained by acquiring the temperature of each element sensed by a temperature sensor in a cabinet in the switchgear and the temperature of the ambient environment of each element (e.g., the temperature in the cabinet). According to the arrangement in the switchgear, the temperature rise of a temperature-increasing element can be affected by other temperature-increasing elements that are close in position. Therefore, the temperature rise of temperature-increasing elements that are close in position or thermally coupled to each other is correlated. According to an embodiment of the present disclosure, based on the normal temperature rise relationship of each temperature-increasing element and other temperature-increasing elements associated therewith, a prediction of the temperature rise of the temperature-increasing element under the current temperature rise condition of the other temperature-increasing elements can be obtained. Then, based on the predicted temperature rise predicted for the temperature-increasing element, it can be determined whether the temperature rise of the temperature-increasing element is abnormal. In this way, without other sensing devices, it can be detected whether the temperature rise of the temperature-increasing element is abnormal, thereby improving the reliability of the high switchgear in a low-cost manner.

[0007] In some embodiments, determining the temperature-increasing element with the temperature rise abnormality comprises determining a plurality of temperature rise differences between the plurality of predicted temperature rises and the plurality of actual temperature rises, comparing each temperature rise difference in the plurality of temperature rise differences with a corresponding temperature rise threshold in the plurality of temperature rise thresholds, and in response to determining that a first temperature rise difference in the plurality of temperature rise values is greater than a first upper boundary of a first temperature rise threshold range in the plurality of temperature rise thresholds, determining a first temperature-increasing element corresponding to the first temperature rise difference to have the temperature rise abnormality. In such embodiments, by comparing the predicted temperature rise of each temperature-increasing element in the plurality of temperature-increasing elements with its actual temperature rise, a temperature rise difference for each temperature-increasing element can be obtained. Since the predicted temperature rise is related to the temperature rise of the associated other temperature-increasing elements, when the temperature rise difference of a temperature-increasing element is too large, it indicates that the temperature rise of the temperature-increasing element exceeds that of the associated other temperature-increasing elements. Thus, it is determined that the temperature rise of the temperature-increasing element is abnormal.

[0008] In some embodiments, determining the temperature-increasing element with the temperature rise abnormality further comprises, in response to determining that the first temperature rise difference in the plurality of temperature rise values is less than a first lower boundary of the first temperature rise threshold range, determining a second temperature-increasing element associated with the first temperature-increasing element to have the temperature rise abnormality. In such embodiments, correspondingly, when the temperature rise difference of a temperature-increasing element is too small, it indicates that the temperature rise of the associated other temperature-increasing elements exceeds that of the temperature-increasing element. Thus, it is determined that the temperature rise of at least one of the other temperature-increasing elements associated with the temperature-increasing element is abnormal.

[0009] In some embodiments, the method further comprises: determining at least one adjacent element adjacent to the first heating element among the plurality of heating elements; obtaining normal temperature rises of the first heating element and the at least one adjacent element under normal working conditions; and determining a linear relationship between the first heating element and the at least one adjacent element based on the obtained normal temperature rises as the temperature rise relationship. In such embodiments, the adjacent element adjacent to the first heating element is usually an element that is thermally coupled to the first heating element. Therefore, the temperature rise of the first heating element can be predicted through the relationship between the first heating element and the adjacent element.

[0010] In some embodiments, determining the linear relationship comprises: creating a linear relationship formula of the temperature rise of the first heating element and the temperature rise of the at least one adjacent element; and determining parameters of the linear relationship formula based on the obtained normal temperature rises, wherein all the parameters in the linear relationship formula are greater than or equal to zero. In such embodiments, the temperature rise of the first heating element is a first order function of the temperature rise of the at least one adjacent element. With the obtained temperature rises of the heating elements under normal working conditions, each parameter in the linear relationship formula can be obtained, thereby obtaining the temperature rise relationship.

[0011] In some embodiments, the switching device comprises a plurality of switching devices arranged side by side, and wherein determining the at least one adjacent element comprises: determining whether the first heating element of a first device among the plurality of switching devices is thermally coupled to a heating element of a second device adjacent to the first device among the plurality of switching devices; and in response to determining that the second heating element of the second device is thermally coupled to the first heating element, determining the second heating element as the at least one adjacent element. In such embodiments, when the switching device is a switching device group composed of a plurality of switching devices, some heating elements in adjacent switching devices can be thermally coupled, i.e., their temperature rises are also associated, and therefore the relevant heating elements in adjacent switching devices are also regarded as adjacent elements. In this way, the temperature rise prediction accuracy in the case of a switching device group can be improved.

[0012] In some embodiments, the method further comprises: sending an indication signal indicating the heating element with abnormal temperature rise. In such embodiments, an alarm can be sent to the maintenance personnel in time to perform corresponding maintenance on the switching device.

[0013] In some embodiments, the plurality of heating elements comprises a busbar connection portion, an upper contact finger of a circuit breaker, a lower contact finger of the circuit breaker, and a cable connection portion. In such embodiments, the listed heating elements are associated, and the temperature rise relationship of each heating element can be determined to implement the detection scheme of the present disclosure.

[0014] A second aspect of the present disclosure relates to an electronic device comprising: at least one processor; and at least one memory including instructions stored thereon that, when executed by the at least one processor, cause the at least one processor to perform the method according to the first aspect of the present disclosure.

[0015] In some embodiments, the electronic device is deployed locally to the switchgear, or in the cloud. In such embodiments, the electronic device can be flexibly deployed as needed.

[0016] A third aspect of the present disclosure relates to a computer-readable storage medium having stored thereon instructions that, when executed by at least one processor, cause the at least one processor to perform the method according to the first aspect of the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0017] The above and other objects, features and advantages of the embodiments of the present disclosure will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0018] Figure 1 A schematic diagram of an example system according to some embodiments of the present disclosure is shown;

[0019] Figure 2 A flowchart of an example method of detecting temperature rise abnormality according to embodiments of the present disclosure is shown;

[0020] Figure 3 A flowchart of an example method of determining temperature rise relationship according to embodiments of the present disclosure is shown;

[0021] Figure 4 A flowchart of an example method of determining the temperature rise abnormality of the temperature rise element according to embodiments of the present disclosure is shown;

[0022] Figure 5 A schematic diagram of a switchgear group according to embodiments of the present disclosure is shown;

[0023] Figure 6 Training results of temperature rise of a contact finger on a circuit breaker according to embodiments of the present disclosure are shown;

[0024] Figure 7 Prediction results of a contact finger on a circuit breaker in the case of normal temperature rise according to embodiments of the present disclosure are shown;

[0025] Figure 8 Prediction results of a contact finger on a circuit breaker in the case of temperature rise abnormality according to embodiments of the present disclosure are shown; and

[0026] Figure 9 A schematic block diagram of an example device that can be used to implement embodiments of the present disclosure is shown. Detailed Implementation

[0027] The principles of this disclosure will now be described with reference to various exemplary embodiments shown in the accompanying drawings. It should be understood that the description of these embodiments is merely intended to enable those skilled in the art to better understand and further implement this disclosure, and is not intended to limit the scope of this disclosure in any way. It should be noted that similar or identical reference numerals may be used in the figures where feasible, and similar or identical reference numerals may denote similar or identical functions. Those skilled in the art will readily recognize that alternative embodiments of the structures and methods described herein may be employed without departing from the principles of this disclosure as described herein.

[0028] As used herein, the term "comprising" and its variations shall be interpreted as an open-ended term meaning "including but not limited to". The term "based on" shall be interpreted as "based on at least a portion". The terms "one embodiment" and "embodiment" shall be understood as "at least one embodiment". The term "another embodiment" shall be understood as "at least one other embodiment". The terms "first", "second", etc., may refer to different or the same objects. Other explicit and implicit definitions may be included below. Unless the context clearly indicates otherwise, the definitions of terms are consistent throughout the specification.

[0029] As mentioned above, conventional methods for detecting abnormal temperature rises are not always accurate and are inefficient. Furthermore, conventional online temperature monitoring systems primarily focus on temperature collection rather than effective abnormal temperature rise detection. According to embodiments of this disclosure, a scheme is proposed that utilizes the relationship between various heating elements in a switching device to make predictions, and determines the temperature rise state by comparing the predicted temperature rise with the corresponding temperature rise threshold. The abnormal temperature rise detection method is adaptable to different operating conditions and settings of the switching device. As will be described in detail in the following paragraphs, the above ideas can be implemented in various ways.

[0030] Figure 1 A schematic diagram of an example system 100 according to some embodiments of the present disclosure is shown. Figure 1As shown, the example system 100 includes a switchgear 110. The switchgear 110 generally includes a busbar connection 111, an upper circuit breaker contact 112, a lower circuit breaker contact 113, and a cable connection 114. During operation of the switchgear 100, the temperature of the busbar connection 111, the upper circuit breaker contact 112, the lower circuit breaker contact 113, and the cable connection 114 can increase, which can adversely affect the normal function of the switchgear 100. In the context of the present disclosure, each of the busbar connection 111, the upper circuit breaker contact 112, the lower circuit breaker contact 113, and the cable connection 114 can be referred to as a temperature-increasing element of the switchgear 110. It should be understood that the present disclosure focuses on temperature rise prediction of the temperature-increasing elements, and thus a detailed introduction of other structures or operations of the switchgear 100 is omitted.

[0031] The example system 100 further includes temperature sensing devices located near the temperature-increasing elements in the switchgear 110, respectively, including a temperature sensor 120-1 for measuring the temperature of the busbar connection 111, a temperature sensor 120-2 for measuring the temperature of the upper circuit breaker contact 112, a temperature sensor 120-3 for measuring the temperature of the lower circuit breaker contact 113, and a temperature sensor 120-4 for measuring the temperature of the cable connection 114 (collectively referred to as the temperature sensors 120).

[0032] The example system 100 further includes a computing device 130-1 located locally to the switchgear 110, or a computing device 130-2 attached on or disposed in the switchgear 110, or a computing device 130-3 deployed in the cloud (collectively referred to as the computing devices 130). The computing device 130 is connected with the temperature sensors 120 and is capable of receiving the measured temperatures from the temperature sensors 120. The computing device 130 is capable of processing the measured data to detect the temperature rise of the plurality of temperature-increasing elements in the switchgear 110. The implementation of the scheme for detecting temperature rise abnormality according to the present disclosure will be described in detail below with reference to Figures 2 to 5

[0033] Figure 2 A flowchart of an example method 200 of detecting temperature rise abnormality according to an embodiment of the present disclosure is shown. The method 200 can be performed, for example, by the computing device 130 in Figure 1

[0034] As shown in Figure 2 At 202, the computing device 130 obtains a plurality of actual temperatures of a plurality of temperature-increasing elements in the switchgear 110 and an ambient temperature. For example as Figure 1 ​​As shown, the computing device 130 can obtain, from the plurality of temperature sensors 120 disposed in the switching device 110, the current actual temperatures of the plurality of heating elements sensed by the temperature sensors 120, and the ambient temperature in the switching device 110. The plurality of heating elements can include Figure 1 the busbar connection 111, the upper breaker contact finger 112, the lower breaker contact finger 113, and the cable connection 114 in the switching device 110.

[0035] At 204, the computing device 130 determines, based on the plurality of actual temperatures and the ambient temperature, a plurality of actual temperature rises for the plurality of heating elements. The computing device 130 calculates, for each heating element, the difference between the current actual temperature and the ambient temperature to obtain the temperature rise of each heating element.

[0036] At 206, the computing device 130 obtains a plurality of temperature rise relationships for the plurality of heating elements. Here, the temperature rise relationship indicates the relationship between the normal temperature rise of one heating element in the plurality of heating elements and the normal temperature rise of at least one other heating element in the plurality of heating elements that is associated with the one heating element. In some embodiments, the temperature rise relationship can be a function of the normal temperature rise of one heating element with respect to the normal temperature rise of the at least one other heating element that is associated with the one heating element. How the temperature rise relationship is obtained will be described in detail later with reference to Figure 3

[0037] At 208, the computing device 130 determines, based on the plurality of actual temperature rises and the plurality of temperature rise relationships, a plurality of predicted temperature rises for the plurality of heating elements. Since the temperature rise relationship indicates the normal temperature rise relationship of each heating element with its associated other heating elements, based on the obtained actual temperature rises, the predicted normal temperature rise of each heating element can be estimated.

[0038] At 210, the computing device 130 determines, based on the plurality of predicted temperature rises, a heating element in the plurality of heating elements that has an abnormal temperature rise. In some embodiments, the computing device 130 can determine the temperature rise status of a heating element by comparing the predicted temperature rise with the actual temperature rise, or a preset temperature rise threshold. In some embodiments, the computing device 130 can determine whether the temperature rise of a heating element is normal by the other heating elements that are associated with the heating element.

[0039] In this way, by estimating the normal temperature rise of a heating element through the temperature rise relationship between the plurality of heating elements, and synthesizing the obtained predicted temperature rise, it can be confirmed whether the temperature rise of a heating element is abnormal.

[0040] Figure 3 A flowchart illustrating an example method 300 of determining a temperature rise relationship according to an embodiment of the present disclosure is shown. The method 300 can be performed, for example, by the computing device 130 in the switching device 110. Figure 1

[0041] ​​At 302, the computing device 130 determines at least one adjacent element of the plurality of heating elements that is adjacent to the first heating element. It should be understood that the first heating element can be any one of the plurality of heating elements, which is referred to as the first heating element herein for ease of description. Adjacent elements indicate that there is no other heating element between two adjacent elements. In some embodiments, adjacent elements can also indicate that the heating elements are thermally coupled to each other in the working state. For example, when the first heating element is the upper contact finger 112 of the circuit breaker in FIG. 1, the adjacent elements can be the bus connection 111 and the lower contact finger 113 of the circuit breaker. In the working state, the lower contact finger 113 of the circuit breaker is coupled to the upper contact finger 112 of the circuit breaker. In the embodiment shown in FIG. 1, the only adjacent element of the bus connection 111 is the upper contact finger 112 of the circuit breaker. Figure 1 Figure 1

[0042] At 304, the computing device 130 obtains normal temperature rises of the first heating element and the at least one adjacent element in the normal working condition. In some embodiments, the computing device 130 can store the obtained temperature rise values when confirming that the temperature rise of the heating element is normal. In some embodiments, the computing device 130 can store a large number of normal temperature rise values as a training set.

[0043] At 306, the computing device 130 creates a linear relationship of the temperature rise of the first heating element and the temperature rise of the at least one adjacent element. Here, the temperature rise relationship between the heating elements is described by a linear relationship. For example, the following relationship can be established:

[0044] y = ω1X1+ ω2X2+... + ω n X n + ω0 (1),

[0045] where y is the temperature rise of the first heating element, X n is the temperature rise of the adjacent element of the first heating element, and ω n is the corresponding coefficient.

[0046] At 308, the computing device 130 determines the parameters of the linear relationship based on the obtained normal temperature rise. Here, the parameters in the linear relationship are limited to all being greater than or equal to zero. After creating the linear relationship (1), the computing device 110 can perform linear fitting using the obtained normal temperature rise values to determine each coefficient ω n . In some embodiments, the computing device 110 can use a linear regression algorithm to obtain the corresponding coefficients, i.e., the parameters of the prediction model, by using the correct temperature rise as a training set to the prediction model including the relationship of all heating elements.

[0047] ​​In this way, a linear relationship that characterizes the temperature rise relationship between the individual heating elements can be determined in a linear fitting manner. The linear relationship is relatively simple and reduces the computational intensity.

[0048] Figure 4 A flowchart illustrating an example method 400 of determining a heating element with a temperature rise anomaly according to embodiments of the present disclosure is shown. The method 400 can be performed, for example, by the computing device 130 in the system 100. Figure 1

[0049] At 402, the computing device 130 determines a plurality of temperature rise differences between the plurality of predicted temperature rises and the plurality of actual temperature rises. The computing device 130 computes, for each heating element, a temperature rise difference between its predicted temperature rise and the detected current actual temperature rise.

[0050] At 404, the computing device 130 compares each of the plurality of temperature rise differences to a respective temperature rise threshold range of the plurality of temperature rise threshold ranges for the plurality of heating elements. Each heating element is provided with a corresponding temperature rise threshold range. In some embodiments, the upper bound of the temperature rise threshold range can be a value greater than zero, such as 5°C or 10°C, and the lower bound of the temperature rise threshold range can be a value less than zero, such as -5°C or -10°C. In some embodiments, the numerical values of the upper and lower bounds of the temperature rise threshold range can be different. In some embodiments, the numerical values of the upper and lower bounds of the temperature rise threshold range can be the same but opposite in sign.

[0051] At 406, the computing device 130 determines whether the temperature rise difference is greater than the upper bound of the corresponding temperature rise threshold range. If the temperature rise difference is greater than the upper bound of the corresponding temperature rise threshold range, the method 400 proceeds to 408. At 408, the computing device 130 determines that the heating element has a temperature rise anomaly. If the temperature rise difference is not greater than the upper bound of the corresponding temperature rise threshold range, the method 400 proceeds to 410. At 410, the computing device 130 determines whether the temperature rise difference is less than the lower bound of the corresponding temperature rise threshold range. If the temperature rise difference is greater than the lower bound of the corresponding temperature rise threshold range, the method 400 proceeds to 412. At 412, the computing device 130 determines that a second heating element that is within a predetermined threshold distance from the first temperature rise difference has a temperature rise anomaly.

[0052] For example, in the case of the system 100, the computing device 130 can determine that the heating element 102 has a temperature rise anomaly. Figure 1 ​When the switchgear 110 is determined to have an abnormal temperature rise, the temperature rise difference of the busbar connection portion 111 is Delt1, the temperature rise difference of the upper breaker contact finger 112 is Delt2, the temperature rise difference of the lower breaker contact finger 113 is Delt3, and the temperature rise difference of the cable connection portion 114 is Delt4. The temperature rise threshold range for the busbar connection portion 111 is [-TH1, TH1], the temperature rise threshold range for the upper breaker contact finger 112 is [-TH2, TH2], the temperature rise threshold range for the lower breaker contact finger 113 is [-TH3, TH3], and the temperature rise threshold range for the cable connection portion 114 is [-TH4, TH4].

[0053] When Delt2 > TH2 is determined, the computing device 130 can determine that the upper breaker contact finger 112 has an abnormal temperature rise. At this time, the magnitude of the temperature rise of the upper breaker contact finger 112 is significantly greater than the magnitudes of the temperature rises of the busbar connection portion 111 and the lower breaker contact finger 113 adjacent thereto. Therefore, due to the influence of the temperature rise of the upper breaker contact finger 112, the predicted temperature rises of the busbar connection portion 111 and the lower breaker contact finger 113 will be greater than their respective actual temperature rises, so that the temperature rise difference Delt1 of the busbar connection portion 111 and the temperature rise difference Delt3 of the lower breaker contact finger 113 are both less than the lower boundaries of their respective temperature rise threshold ranges. Based on similar reasons, the following table 1 can be obtained, which shows the comparison relationship between the temperature rise differences of all temperature rise elements and the corresponding threshold ranges when the temperature rise of the temperature rise element is abnormal.

[0054] Table 1: Comparison table of temperature rise abnormality and threshold range

[0055]

[0056] In addition, the comparison relationship under the condition that two temperature rise elements in the switchgear 110 have abnormal temperature rises is also shown in table 1. It can be seen that in most cases, the judgment method according to the present disclosure is applicable to the case where two temperature rise elements in the switchgear 110 are abnormal. In the case where the busbar connection portion 111 and the upper breaker contact finger 112 are abnormal, although the temperature rise difference of the two cannot be judged by itself, the temperature rise abnormality of the upper breaker contact finger 112 can be determined based on the temperature rise difference of the lower breaker contact finger 113. The upper breaker contact finger 112 and the lower breaker contact finger 113 are particularly concerned elements. Here, through the condition of the adjacent elements of the concerned element, it can be determined that the concerned element may have an abnormality. At this time, the concerned element is identified as abnormal to notify the maintenance personnel to check.

[0057] Therefore, although it is not possible to determine in some cases by the determination criteria of the element itself, it is possible to determine the temperature rise of the element by comprehensively considering the temperature rise difference of the element itself and the temperature rise difference of the adjacent element. Thus, in the case of multiple temperature rise element abnormalities, it is possible to prevent the abnormal state of the element of interest from being missed.

[0058] In some embodiments, when the operation and maintenance personnel eliminate an abnormality, the switchgear 110 can be detected again. Since there are fewer temperature rise abnormal elements, the determination certainty of the detection at this time will be improved, providing better guidance to the operation and maintenance personnel.

[0059] It should be understood that although there is uncertainty in the control relationship listed in Table 1, in actual field application, the determination method according to the embodiments of the present disclosure can cover more than 90% of the field conditions. Thus, by using the scheme of the present disclosure, surprising effects can be obtained at a lower cost.

[0060] In this way, based on the relationship between the temperature rise difference of each temperature rise element and the corresponding threshold range, the temperature rise state of each temperature rise element can be more accurately determined.

[0061] Figure 5 A schematic diagram of a switchgear group 500 according to an embodiment of the present disclosure is shown. The switchgear group 500 includes multiple switchgears, i.e., a first switchgear 510, a second switchgear 520, and a third switchgear 530. Here, the switchgears can be the same or different. The first switchgear 510 includes a busbar connection part 511, an upper breaker contact finger 512, a lower breaker contact finger 513, and a cable connection part 514. The second switchgear 520 includes a busbar connection part 521, an upper breaker contact finger 522, a lower breaker contact finger 523, and a cable connection part 524. The third switchgear 530 includes a busbar connection part 531, an upper breaker contact finger 532, a lower breaker contact finger 533, and a cable connection part 534. In the shown embodiment, the switchgear group 500 can be regarded as a whole, and when determining the adjacent element of a temperature rise element in a switchgear, it is necessary to determine whether there is a corresponding temperature rise element in the switchgear adjacent to the switchgear that can significantly affect the temperature rise element in the switchgear. When it is determined that there is such a temperature rise element, it is necessary to also consider the temperature rise element when creating the linear relationship (1). The correlation of the temperature rise elements in the switchgear group 500 is listed in Table 2.

[0062] Table 2 Correlation of temperature rise elements

[0063] Temperature increasing element Adjacent element 1 Adjacent element 2 Adjacent element 3 Busbar connection 521 Busbar connection 511 Busbar connection 531 Upper breaker contact 522 Upper breaker contact 522 Busbar connection 521 Lower breaker contact 523 Lower breaker contact 523 Upper breaker contact 522 Cable connection 524 Cable connection 524 Lower breaker contact 523 Busbar connection 511 Busbar connection 521 Upper breaker contact 512 Busbar connection 531 Busbar connection 521 Upper breaker contact 532

[0064] As Figure 5As shown, the busbar connection part 511 in the first switching device 510 is connected with the busbar connection part 521 in the second switching device 520, and the busbar connection part 521 in the second switching device 520 is connected with the busbar connection part 531 in the third switching device 530. Therefore, the busbar connection part 511 and the busbar connection part 521 are regarded as adjacent elements to each other, and the busbar connection part 521 and the busbar connection part 531 are regarded as adjacent elements to each other. Here, the correlations listed in Table 2 can be used as the basis for creating the linear relationship. In this way, the linear relationship established can be more comprehensive.

[0065] Figure 6 A training result 600 of the temperature rise of the breaker upper contact finger according to an embodiment of the present disclosure is shown. Figure 6 The solid line of (a) represents the actual temperature rise of the breaker upper contact finger. Figure 6 The dashed line of (a) represents the predicted temperature rise of the breaker upper contact finger. Figure 6 The plus symbol of (b) represents the temperature rise difference of the breaker upper contact finger, i.e. the difference between the predicted temperature rise and the actual temperature rise. It can be seen in the training result that the predicted temperature rise obtained with the training data as the actual temperature rise is very small, and thus the temperature rise difference obtained is between about -0.1°C and 1.5°C.

[0066] Figure 7 A prediction result 700 of the breaker upper contact finger in the case of normal temperature rise according to an embodiment of the present disclosure is shown. Figure 7 The solid line of (a) represents the actual temperature rise of the breaker upper contact finger. Figure 7 The dashed line of (a) represents the predicted temperature rise of the breaker upper contact finger. Figure 7 The plus symbol of (b) represents the temperature rise difference of the breaker upper contact finger. It can be seen in the prediction result that in the case of normal temperature rise of the breaker upper contact finger, the actual temperature rise and the predicted temperature rise are very small, and thus the temperature rise difference obtained is between about -1.5°C and 1.5°C.

[0067] Figure 8 A prediction result 800 of the breaker upper contact finger in the case of abnormal temperature rise according to an embodiment of the present disclosure is shown. Figure 8 The solid line of (a) represents the actual temperature rise of the breaker upper contact finger. Figure 8 The dashed line of (a) represents the predicted temperature rise of the breaker upper contact finger. Figure 8 The plus symbol of (b) represents the temperature rise difference of the breaker upper contact finger. It can be seen in the prediction result that the actual temperature rise and the predicted temperature rise are relatively large, between about 0°C and 8°C, and thus it can be judged that the temperature rise of the breaker upper contact finger is abnormal.

[0068] Figure 9 A schematic block diagram of an example device 900 that can be used to implement embodiments of the present disclosure is shown. As Figure 4As shown, the device 900 includes a central processing unit (CPU) 901 as a processor which can perform various appropriate actions and processes according to computer program instructions stored in a read only memory (ROM) 902 or loaded into a random access memory (RAM) 903 from a storage unit 908. For example, the instructions which cause the device 900 to perform the method of detecting a line state of an electrical device according to embodiments of the present disclosure, when executed by the processor, are stored in the ROM 902, the RAM 903, or the storage unit 908 as a memory. In the RAM 903, various programs and data required for the operation of the device 900 can also be stored. The CPU 901, the ROM 902, and the RAM 903 are connected to each other through a bus 904. An input / output (I / O) interface 905 is also connected to the bus 904.

[0069] A plurality of components in the device 900 are connected to the I / O interface 905, including: the input unit 706; an output unit 907, such as various types of displays, speakers, and the like; the storage unit 908, such as a magnetic disk and the like; and a communication unit 909, such as a network card, a modem, a wireless communication transceiver, and the like. The communication unit 909 allows the device 900 to exchange information / data with other devices through a computer network, such as the Internet, and / or various telecommunication networks.

[0070] The processing unit 901 performs the various methods and processes described above, such as the methods 200 or 300. For example, in some embodiments, the methods 200, 300, and 400 can be implemented as a computer software program tangibly embodied in a machine readable medium, such as the storage unit 908. In some embodiments, part or all of the computer program can be loaded and / or installed on the device 900 via the ROM 902 and / or the communication unit 909. When the computer program is loaded into the RAM 903 and executed by the CPU 901, one or more steps of the method 200 described above can be performed. Alternatively, in other embodiments, the CPU 901 can be configured to perform the methods 200, 300, and 400 by any other appropriate means, such as by means of firmware.

[0071] The functionality described herein above can be performed, at least in part, by one or more hardware logic components. For example, and without limitation, example types of hardware logic components that can be used include Field-programmable Gate Arrays (FPGAs), Application-specific Integrated Circuits (ASICs), Application-specific Standard Products (ASSPs), System-on-a-chip systems (SOCs), Complex Programmable Logic Devices (CPLDs), etc.

[0072] Program code for carrying out methods of the present disclosure can be written in any combination of one or more programming languages. The program code can be provided to a processor or controller of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the program code, when executed by the processor or controller, causes the machine to perform the functions / acts specified in the flowcharts and / or block diagrams. The program code can be executed entirely on a machine, partially on a machine, partially on a machine and partially on a remote machine or entirely on a remote machine or server.

[0073] In the context of the present disclosure, a machine-readable medium can be a tangible medium that contains or stores program code for use by or in connection with an instruction execution system, apparatus, or device. The machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples of the machine-readable storage medium would include one or more lines of a system, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0074] Further, while operations are depicted in a particular order, this should not be understood as requiring such an order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing can be advantageous. Likewise, while several specific implementation details have been discussed, such details should not be construed as limiting the scope of the disclosure. Certain features that are described in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features that are described in the context of a single embodiment can also be implemented in subcombination or as separate embodiments, apart from the other features described.

[0075] Although the subject matter has been described in language specific to structural features and / or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.

Claims

1. A method for detecting abnormal temperature rise, comprising: Obtain multiple actual temperatures and ambient temperatures of multiple heating elements in the switching equipment; Based on the multiple actual temperatures and the ambient temperature, multiple actual temperature rises are determined for the multiple heating elements; Obtain multiple temperature rise relationships for the plurality of heating elements, wherein the temperature rise relationship indicates the relationship between the normal temperature rise of one of the plurality of heating elements and the normal temperature rise of at least one other heating element associated with the one heating element. Based on the multiple actual temperature rises and the multiple temperature rise relationships, multiple predicted temperature rises are determined for the multiple heating elements; as well as Based on the multiple predicted temperature rises, the heating element with abnormal temperature rise among the multiple heating elements is identified.

2. The method of claim 1, wherein the heating element for determining the abnormal temperature rise comprises: Determine multiple temperature rise differences between the multiple predicted temperature rises and the multiple actual temperature rises; Each of the plurality of temperature rise differences is compared with a corresponding temperature rise threshold range among a plurality of temperature rise threshold ranges for the plurality of heating elements; as well as In response to determining that a first temperature rise difference among the plurality of temperature rise differences is greater than a first upper boundary of the first temperature rise threshold range among the plurality of temperature rise threshold ranges, the first heating element corresponding to the first temperature rise difference is determined to be abnormally heated.

3. The method according to claim 2, wherein the heating element for determining the abnormal temperature rise further comprises: In response to determining that a first temperature rise difference among the plurality of temperature rise differences is less than a first lower boundary of the first temperature rise threshold range, a second temperature rise element associated with the first temperature rise element is determined to be a temperature rise anomaly.

4. The method according to claim 1, further comprising: Identify at least one adjacent element among the plurality of heating elements that is adjacent to the first heating element; Obtain the normal temperature rise of the first heating element and the at least one adjacent element under normal operating conditions; as well as Based on the obtained normal temperature rise, a linear relationship between the first heating element and the at least one adjacent element is determined as the temperature rise relationship.

5. The method of claim 4, wherein determining the linear relationship comprises: Establish a linear relationship between the temperature rise of the first heating element and the temperature rise of the at least one adjacent element; as well as Based on the obtained normal temperature rise, the parameters of the linear relationship are determined, wherein all parameters in the linear relationship are greater than or equal to zero.

6. The method of claim 4, wherein the switching devices comprise a plurality of switching devices arranged side by side, and Determining the at least one adjacent element includes: Determine whether the first heating element of the first device in the plurality of switching devices is thermally coupled to the heating element of the second device adjacent to the first device in the plurality of switching devices; as well as In response to determining that the second heating element in the second device is thermally coupled to the first heating element, the second heating element is identified as the at least one adjacent element.

7. The method according to claim 5, further comprising: Send an indication signal indicating that the heating element is experiencing an abnormal temperature rise.

8. The method according to claim 1, wherein the plurality of heating elements includes a busbar connection portion, a circuit breaker upper contact finger, a circuit breaker lower contact finger, and a cable connection portion.

9. An electronic device, comprising: At least one processor; as well as At least one memory, including instructions stored thereon, which, when executed by the at least one processor, cause the at least one processor to perform the method according to any one of claims 1 to 8.

10. The electronic device of claim 9, wherein the electronic device is deployed locally on the switching device or deployed in the cloud.

11. A computer-readable storage medium having instructions stored thereon, the instructions causing the at least one processor, when executed by the at least one processor, to perform the method according to any one of claims 1 to 8.

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