A winding inductance heat transfer encapsulation structure and method

Abstract

The application discloses a winding inductance heat transfer pouring structure and method, which comprises a substrate, a heat conduction column is vertically arranged on the upper end surface of the substrate, a winding inductance is sleeved on the heat conduction column and located at the bottom of the substrate, a pouring cavity is arranged between the winding inductance and the heat conduction column, a pressing plate is detachably connected to the top of the winding inductance, a plurality of pouring openings are formed in the pressing plate and communicated with the pouring cavity, the winding inductance comprises an inductance magnetic ring, a first insulating film wrapped on the inductance magnetic ring, a second insulating film wrapped on the first insulating film and an inductance winding wound on the inductance magnetic ring, the inductance winding is located between the first insulating film and the second insulating film, and a plurality of pouring holes are formed in the first insulating film and the second insulating film and communicated with the pouring cavity. The application improves the heat dissipation efficiency and heat transfer capacity of the winding inductance and effectively solves the problem of heat accumulation of the winding inductance.

Description

Technical Field

[0001] This invention belongs to the field of potting technology for wound components used in high-power power supplies, and specifically relates to a wound inductor heat transfer potting structure and method. Background Technology

[0002] Winded inductors are an important component of the isolated power conversion function in the new generation of high-power power supply products. They are also a core component for realizing the power filtering function. The production process, efficiency, and heat dissipation capacity after potting are important technical indicators for evaluating wound inductors.

[0003] In the development of new-generation high-power power supply products, some products require manual winding of inductors to achieve filtering functions due to design constraints such as functional requirements, selection specifications, and installation and fixing mechanical interfaces. The traditional inductor winding process mainly includes key production steps such as winding the magnetic ring with insulating film, winding the winding, and winding the outer insulating film around the winding. After the inductor is manufactured according to this process, since the inductor body has no external installation and interconnection mechanical interface, it is usually fixed by binding the inductor to the mounting base with cotton thread or by pressing the top mounting plate and bottom mounting base together. The inner and outer sides of the inductor are then coated and reinforced with a three-proof process.

[0004] During the inductor potting process, because the inductor and its mounting structure do not have a potting path reserved, the inductor needs to be repeatedly disassembled and reassembled to tighten the pressure plate structure before potting can be performed. This makes the potting production process cumbersome, inefficient, time-consuming, and labor-intensive. At the same time, the inner surface of the inductor cannot effectively contact the heat sink of the mounting base, and the internal gap of the winding cannot be effectively filled with thermally conductive potting material. This makes it difficult for the inductor to achieve a low thermal resistance heat dissipation path, resulting in a heat accumulation design defect that easily leads to thermal management problems such as low heat dissipation efficiency and heat transfer capacity of the inductor. Summary of the Invention

[0005] To address the problems existing in the prior art, this invention provides a heat transfer potting structure and method for wound inductors, which improves the heat dissipation efficiency and heat transfer capacity of wound inductors and effectively solves the problem of heat accumulation in wound inductors.

[0006] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution:

[0007] A wound inductor heat transfer potting structure includes a substrate. A heat-conducting pillar is vertically disposed on the upper surface of the substrate. A wound inductor with its bottom located on the substrate is sleeved on the heat-conducting pillar. A potting cavity is disposed between the wound inductor and the heat-conducting pillar. A pressure plate detachably connected to the heat-conducting pillar is disposed on the top of the wound inductor. The pressure plate has several potting openings communicating with the potting cavity. The wound inductor includes an inductor ring, a first insulating film covering the inductor ring, a second insulating film covering the first insulating film, and an inductor winding wound on the inductor ring. The inductor winding is located between the first insulating film and the second insulating film. Several potting holes communicating with the potting cavity are disposed on both the first insulating film and the second insulating film.

[0008] Furthermore, the substrate is provided with a winding inductor limiting ring, the winding inductor limiting ring is attached to the outside of the winding inductor, the substrate is provided with a potting compound stop groove around the outside of the winding inductor limiting ring, and the winding inductor limiting ring is provided with a plurality of potting compound guide grooves communicating with the potting compound stop grooves.

[0009] Furthermore, several potting compound drain grooves on the winding inductor limiting ring are evenly distributed around the central axis of the winding inductor.

[0010] Furthermore, the pressure plate is connected to the heat-conducting column by screws.

[0011] Furthermore, a thermally conductive insulating film is provided between the bottom of the wound inductor and the substrate, and a thermally conductive insulating film is provided between the top of the wound inductor and the pressure plate.

[0012] Furthermore, a plurality of potting scale lines are provided along the height direction on the second insulating film located outside the inductive magnetic ring.

[0013] Furthermore, several of the potting openings on the pressure plate are evenly distributed around the central axis of the wound inductor.

[0014] Furthermore, the central axis of the heat-conducting column coincides with the central axis of the wound inductor.

[0015] A method for potting a wound inductor for heat transfer, using the aforementioned potting structure, involves injecting potting compound into the potting cavity through the potting opening on the pressure plate. The potting compound fills the potting cavity between the wound inductor and the heat-conducting pillar, and then fills the gap between the second insulating film, the inductor winding, and the first insulating film through the potting hole on the second insulating film. Finally, it fills the gap between the first insulating film and the inductor magnetic ring through the potting hole on the first insulating film.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects:

[0017] The present invention provides a heat transfer potting structure for wound inductors. During potting, a number of potting ports communicating with the potting cavity are opened on the pressure plate, and a number of potting holes communicating with the potting cavity are opened on the first and second insulating films of the wound inductor. A heat-conducting pillar is provided on the upper end surface of the substrate, that is, a potting path is provided. The wound inductor can be quickly potted with enhanced heat transfer without disassembling the pressure plate. The potting compound flows into the potting cavity through the potting port, filling the cavity between the wound inductor and the heat-conducting pillar. It then passes through potting holes on the second insulating film to fill the gaps between the second insulating film, the inductor winding, and the first insulating film. Finally, it passes through potting holes on the first insulating film to fill the gap between the first insulating film and the inductor magnetic ring. This achieves a low thermal resistance heat dissipation path design for the wound inductor. The heat generated by the wound inductor is transferred to the heat-conducting pillar through the potting compound, increasing the heat transfer area of ​​the wound inductor. Finally, the heat is conducted to the substrate and dissipated, improving the thermal design reliability and the process's resistance to mechanical environmental stresses. This enhances the inductor's conductive heat dissipation and thermal management capabilities. The entire potting operation simplifies the production process and procedures for wound inductor potting, improves production efficiency and cost-effectiveness, and meets the design requirements for enhanced heat transfer and thermodynamic reliability between the wound inductor and the heat sink of the mounting structure.

[0018] Furthermore, the present invention provides a winding inductor limiting ring on the substrate, which is attached to the outside of the winding inductor. A potting compound flow-stopping groove is formed around the outside of the winding inductor limiting ring on the substrate. Several potting compound guiding grooves communicating with the potting compound flow-stopping groove are formed on the winding inductor limiting ring. During the potting process, excess potting compound will flow into the potting compound flow-stopping groove structure in an orderly manner along the potting compound guiding groove. This effectively prevents the overflowing potting compound from flowing and solidifying in a disorderly manner, causing the position of the winding inductor to shift with the flow of the compound. This avoids assembly risks such as spatial interference with surrounding components, insufficient safety distance, obstruction of solder leads, and poor appearance.

[0019] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the specific embodiments of the present invention, the drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1This is an isometric view of a wound inductor heat transfer potting structure according to the present invention;

[0022] Figure 2 This is a top view of a wound inductor heat transfer potting structure according to the present invention;

[0023] Figure 3 This is a cross-sectional view (AA) of a wound inductor heat transfer potting structure according to the present invention;

[0024] Figure 4 This is a diagram of the external structure of the wound inductor in the heat transfer potting structure of the wound inductor of the present invention;

[0025] Figure 5 This is a diagram of the internal structure of the wound inductor in the heat transfer potting structure of the wound inductor of the present invention;

[0026] Figure 6 This is a diagram showing the dimensions of the wound inductor forming process in a wound inductor heat transfer potting structure according to the present invention.

[0027] Figure 7 This is a schematic diagram of the heat dissipation path of the wound inductor thermal resistance in a wound inductor heat transfer potting structure of the present invention.

[0028] Figure 8 The temperature measurement results of test product 1 in the example are shown.

[0029] In the diagram: 1-substrate; 2-heat-conducting pillar; 3-wound inductor; 301-inductor magnetic ring; 302-first insulating film; 303-second insulating film; 304-inductor winding; 305-potting hole; 306-lead wire; 4-pressure plate; 5-potting port; 6-wound inductor limiting ring; 7-potting compound flow-stop groove; 8-potting compound flow-draining groove; 9-screw; 10-thermal-conducting insulating film; 11-potting scale line. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] This invention provides a wound inductor heat transfer potting structure, aiming to achieve a low-cost, fast, efficient, and enhanced heat transfer potting structure design for wound inductors used in high-power power supplies, and solve the problems of rapid potting and enhanced heat transfer of wound inductors without disassembly during the development of high-power power supplies.

[0032] As a specific embodiment of the present invention, such as Figures 1 to 5As shown, a wound inductor heat transfer potting structure includes a substrate 1. A heat-conducting pillar 2 is vertically arranged on the upper surface of the substrate 1. A wound inductor 3 with its bottom located on the substrate 1 is sleeved on the heat-conducting pillar 2. A potting cavity is provided between the wound inductor 3 and the heat-conducting pillar 2. A pressure plate 4, detachably connected to the heat-conducting pillar 2, is provided on the top of the wound inductor 3. The pressure plate 4 has several potting openings 5 ​​communicating with the potting cavity. The wound inductor 3 includes an inductor ring 301, a first insulating film 302 covering the inductor ring 301, a second insulating film 303 covering the first insulating film 302, and an inductor winding 304 wound on the inductor ring 301. The inductor winding 304 is located between the first insulating film 302 and the second insulating film 303. Several potting holes 305 communicating with the potting cavity are provided on both the first insulating film 302 and the second insulating film 303. Of course, the wound inductor 3 also includes leads 306 for providing external connections, which are connected to the inductor ring 301.

[0033] During potting, potting compound is poured into the potting cavity through the potting port 5 on the pressure plate 4. The potting compound fills the potting cavity between the wound inductor 3 and the heat-conducting pillar 2, and then fills the gap between the second insulating film 303, the inductor winding 304 and the first insulating film 302 through the potting hole 305 on the second insulating film 303. Finally, it fills the gap between the first insulating film 302 and the inductor magnetic ring 301 through the potting hole 305 on the first insulating film 302.

[0034] Preferably, a thermally conductive insulating film 10 is disposed between the bottom of the wound inductor 3 and the substrate 1, and a thermally conductive insulating film 10 is disposed between the top of the wound inductor 3 and the pressure plate 4. In this embodiment, the thermally conductive insulating film 10 is provided in 3 layers.

[0035] Preferably, the pressure plate 4 and the heat-conducting column 2 are connected by screws 9. Specifically, a threaded hole is provided on the top of the heat-conducting column 2, and a through hole is provided at the center of the top of the pressure plate 4. After the screws 9 are passed through the through hole, they are screwed into the threaded hole to realize the connection between the pressure plate 4 and the heat-conducting column 2. The installation and disassembly are convenient and quick.

[0036] Preferably, a plurality of filling ports 5 on the pressure plate 4 are evenly distributed around the central axis of the wound inductor 3, and the central axis of the heat-conducting column 2 coincides with the central axis of the wound inductor 3.

[0037] In this embodiment, the heat-conducting pillar 2 and the substrate 1 are integrally molded, and the pressure plate 4 is an annular pressure plate that matches the top cross section of the wound inductor 3.

[0038] Based on the above embodiments, as a more preferred embodiment, a wound inductor limiting ring 6 is further provided on the substrate 1. The wound inductor limiting ring 6 is attached to the outer side of the wound inductor 3. A potting compound flow-stopping groove 7 is formed around the outer side of the wound inductor limiting ring 6 on the substrate 1, and a plurality of potting compound drainage grooves 8 are formed on the wound inductor limiting ring 6, which communicate with the potting compound flow-stopping grooves 7. Preferably, the plurality of potting compound flow-stopping grooves 7 on the wound inductor limiting ring 6 are evenly distributed around the central axis of the wound inductor 3.

[0039] Specifically, the winding inductor 3 is limited by the winding inductor limiting ring 6. The potting compound drainage groove 8 on the winding inductor limiting ring 6 and the potting compound anti-flow groove 7 on the substrate 1 effectively prevent the overflowing potting compound from flowing and solidifying disorderly, causing the winding inductor to shift with the flow of the compound. This avoids assembly risks such as spatial interference with surrounding components, insufficient safety distance, obstruction of solder leads, and poor appearance.

[0040] Based on the above embodiments, as a more preferred embodiment, in order to ensure that the potting compound is fully filled and solidified within the potting structure during the entire potting process, the potting process is completed in layers. Therefore, a plurality of potting scale lines 11 are provided along the height direction on the second insulating film 303 located outside the inductor magnetic ring 301. The potting is completed in multiple stages using the provided potting scale lines 11 as references. In this embodiment, the height of adjacent potting scale lines 11 is 10mm.

[0041] The heat transfer potting structure for wound inductors provided by this invention has excellent advantages in assembly guidance and limiting, directional drainage and cessation, and enhanced heat transfer. It utilizes a pre-reserved potting path, a limiting installation structure, a heat-conducting pillar structure for enhanced heat transfer, a directional drainage groove structure for the potting compound, and a cessation groove structure for the potting compound to achieve rapid installation and efficient potting of the wound inductor. The heat-conducting pillar structure creates a low thermal resistance heat dissipation path between the wound inductor and the mounting base plate, solving the problem of rapid, non-disassembly potting and enhanced heat transfer for wound inductors during the development of high-power power supplies. This invention allows for direct potting after the pressure plate and heat-conducting pillars are secured in one step, effectively simplifying the potting operation process, saving potting production time and costs, improving potting efficiency and cost-effectiveness, and quickly achieving non-disassembly potting of wound inductors. This further improves the thermal management capabilities of wound inductors, enhances the thermal design reliability and mechanical environmental adaptability of wound inductors, and achieves a low thermal resistance heat dissipation path design and enhanced heat transfer for the wound inductor.

[0042] The present invention will now be explained in more detail.

[0043] Before potting, a thermally conductive adhesive that is non-volatile, easy to solidify after filling, has moderate viscosity, strong adhesion, and good thermal conductivity and insulation properties is selected as the potting compound. The potting compound is then subjected to vacuum degassing in a vacuum potting machine until no air bubbles larger than 1mm in diameter are present inside. This ensures sufficient internal contact of the potting compound and minimizes the adverse effects of air bubbles on its heat dissipation capacity, meeting the engineering application requirements of the potting compound in a vacuum thermal environment. After vacuum degassing, the potting compound is preheated and kept at a vacuum temperature of 23℃±5℃ for subsequent inductor winding potting.

[0044] like Figure 6 As shown, the heat transfer potting structure of the wound inductor involved in this invention is designed based on the molding dimensions such as the outer diameter D, inner diameter d, and height H of the wound inductor. The wound inductor limiting ring 6 and the heat-conducting pillar 2 are used together to achieve rapid assembly guidance and limiting of the wound inductor 3 itself, preventing disordered displacement of the wound inductor 3 during the potting process. The potting compound drainage channel 8 is used to achieve orderly and directional diversion of excess potting compound, and the potting compound stop channel 7 is used to receive excess potting compound flowing out along the potting compound drainage channel 8.

[0045] When assembling the wound inductor heat transfer potting structure, three layers of thermally conductive insulating film 10, the wound inductor 3, the three layers of thermally conductive insulating film 10, the pressure plate 4, and the screw 9 are sequentially placed axially between the wound inductor limiting ring 6 and the heat-conducting pillar 2. This allows for the insulating installation and fixation of the wound inductor 3 under appropriate torque, achieving reliable insulation between the substrate 1, the heat-conducting pillar 2, the wound inductor 3, and the annular pressure plate 7, ensuring the required overlap resistance. After the electrical performance and function of the wound inductor 3 are debugged, the entire wound inductor heat transfer potting structure can be placed in a vacuum potting machine for potting.

[0046] Before potting, a vacuum potting machine is used to perform a 5-10 minute vacuum degassing process on the wound inductor heat transfer potting structure to reduce the adverse effects of air on the heat conduction capacity of the potting compound. Throughout the potting process, to ensure that the potting compound is fully filled and solidified within the potting structure, the entire potting process is completed in layers.

[0047] The height of the first potting compound filling does not exceed the lowest potting scale line 11. In this embodiment, the height of the lowest potting scale line 11 is 10mm. Because the pressure plate 4 has a pre-reserved potting opening 5 and the first insulating film 302 and the second insulating film 303 have pre-reserved potting holes 305, the preheated liquid potting compound can be injected along the potting opening 5 on the pressure plate 4 at a certain speed and pressure during the potting process. As the potting process proceeds, the flowing potting compound first fully fills the axial space (i.e., the potting cavity) between the enhanced heat transfer column 2 and the inner ring of the wound inductor 3. Then, through the radial potting holes 305 of the second insulating film 303, it sequentially and fully fills the gaps between the second insulating film 303 and the inductor winding 304 and the first insulating film 302, as well as the gaps between the inductor winding 304 and the inductor magnetic ring 301 and the first insulating film 302, thereby achieving the first non-disassembly, rapid, and efficient potting process of the wound inductor 3. After potting, the inductor ring 301, inductor winding 304, first insulating film 302, and second insulating film 303 are all in full contact with the potting compound, effectively increasing the heat dissipation area and heat transfer path inside the wound inductor 3 and between the wound inductor 3 and the heat-conducting pillar 2, thereby improving its thermal design reliability and process-strengthened mechanical environmental adaptability. The wound inductor heat transfer potting structure is then subjected to a 5-10 minute vacuum degassing process using a vacuum potting machine. The entire potting structure is then removed and placed in an oven at 50℃±5℃ for 4-6 hours to allow the potting compound to fully fill and solidify. During the first potting process, excess potting compound flows in an orderly and directional manner into the potting compound stop groove 7 through the potting compound drainage groove 8 along the outer side of the wound inductor 3 and the gap between the bottom of the wound inductor 3 and the thermally conductive insulating film 10. This effectively avoids adverse effects such as repeated potting, obstruction of solder joints and leads, and poor appearance of the potting compound on the components around the wound inductor.

[0048] Let the top surface of the encapsulated material after the first potting be designated as surface A. Repeating the above steps layer by layer, the axial space enhanced heat transfer potting process, bounded by surface A, the inner ring of the wound inductor, and pressure plate 4, is completed, thus achieving enhanced heat transfer potting inside the wound inductor 3. This effectively increases the heat dissipation area between the wound inductor 3 and the heat-conducting pillar 2, improving its thermal design and thermal management capabilities. The low thermal resistance heat dissipation path of the wound inductor 3 is as follows: Figure 7 As shown, the heat generated by the wound inductor 3 can be gradually transferred to the substrate heat sink of the wound inductor heat transfer potting structure through this heat dissipation path, realizing low-cost, fast and efficient heat transfer potting treatment of the wound inductor.

[0049] According to the heat transfer potting structure of wound inductors described in this invention, a reinforced heat transfer potting structure design and three-proof potting implementation for multiple wound inductors inside a high-power power supply product were completed using a selected thermally conductive adhesive (thermal conductivity: 3W / mK), defined as test product 1. To compare and verify the effectiveness of this design method in enhancing heat transfer, another group of products was processed using conventional methods, defined as test product 2. Then, both groups of products were placed in a vacuum chamber for a 50°C comparative thermal vacuum test. The temperature test results showed that:

[0050] 1) Under the same temperature conditions, the temperature data of product 1 gradually converged and stabilized after 120 minutes, as shown in the following results. Figure 8 As shown, the temperature of its inductor ring is 94℃, the temperature of the heat sink structure is 50℃, and the thermal resistance of the heat dissipation path is 2.9℃ / W. The temperature of product 2 continued to rise, and after 120 minutes, the temperature of the inductor ring ranged from 175℃ to 200℃.

[0051] 2) The temperature consistency of the wound inductor heat transfer potting structure in product 1 is good, the isothermal performance is significantly better, and the heat transfer is enhanced. It meets the engineering application requirements of the product in a thermal vacuum environment, indicating that the design method is effective, reasonable and feasible, and can effectively realize the design and implementation of a low-cost, fast and efficient heat transfer potting structure for wound inductors.

[0052] The heat transfer potting structure for wound inductors of this invention includes a limiting installation structure and a reinforced heat transfer and heat conduction pillar structure. This allows for efficient and rapid limiting and guiding assembly of the wound inductor, thereby achieving secure installation under axial pressure and significantly improving assembly efficiency. Furthermore, the heat transfer potting structure includes a potting compound directional drainage groove and a potting compound anti-flow groove structure, which effectively directionally guides and accommodates excess potting compound, preventing adverse effects such as the compound obstructing solder pads and leads, and causing poor appearance on other components. The heat transfer potting structure of this invention features a pre-reserved potting path, allowing the thermally conductive adhesive to fully fill the gap between the wound inductor and the potting structure without disassembling the pressure plate. This makes the entire potting operation simple, reliable, low-cost, quick, and convenient, effectively simplifying the potting process between the wound inductor and the heat sink of the mounting structure. It reduces product development and production costs, improves potting efficiency and cost-effectiveness, and effectively achieves a low thermal resistance heat dissipation path design between the wound inductor and the potting structure, enhancing the thermal design reliability and process reinforcement adaptability to mechanical environments. The entire design scheme of this invention is reasonable and feasible, with a simple and reliable structure, and is easy to implement in product development. It fully leverages the advantages of the pre-reserved potting path, the inductor limiting mounting structure, and the directional structure of the enhanced heat transfer pillars in the process of strengthening heat transfer in the wound inductor.

[0053] Finally, it should be noted that the above-described embodiments are merely specific implementations of the present invention, used to illustrate the technical solutions of the present invention, and not to limit it. The scope of protection of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments within the technical scope disclosed in the present invention, or make equivalent substitutions for some of the technical features; and these modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A wound inductor heat transfer potting structure, characterized in that, The system includes a substrate (1), on which a heat-conducting pillar (2) is vertically disposed on the upper surface. A wound inductor (3) with its bottom located on the substrate (1) is sleeved on the heat-conducting pillar (2). A potting cavity is disposed between the wound inductor (3) and the heat-conducting pillar (2). A pressure plate (4) is disposed on the top of the wound inductor (3) and is detachably connected to the heat-conducting pillar (2). The pressure plate (4) has several potting openings (5) communicating with the potting cavity. The wound inductor (3) includes an inductor magnetic ring (301). The inductor includes a first insulating film (302) covering the inductor ring (301), a second insulating film (303) covering the first insulating film (302), and an inductor winding (304) wound on the inductor ring (301). The inductor winding (304) is located between the first insulating film (302) and the second insulating film (303). Both the first insulating film (302) and the second insulating film (303) have a plurality of potting holes (305) communicating with the potting cavity. A winding inductor limiting ring (6) is provided on the substrate (1). The winding inductor limiting ring (6) is attached to the outside of the winding inductor (3). A potting compound stop groove (7) is provided around the outside of the winding inductor limiting ring (6) on the substrate (1). A plurality of potting compound guide grooves (8) communicating with the potting compound stop groove (7) are provided on the winding inductor limiting ring (6). A thermally conductive insulating film (10) is provided between the bottom of the wound inductor (3) and the substrate (1), and a thermally conductive insulating film (10) is provided between the top of the wound inductor (3) and the pressure plate (4).

2. The wound inductor heat transfer potting structure according to claim 1, characterized in that, The potting compound drain grooves (7) on the winding inductor limiting ring (6) are evenly distributed around the central axis of the winding inductor (3).

3. The wound inductor heat transfer potting structure according to claim 1, characterized in that, The pressure plate (4) is connected to the heat-conducting column (2) by screws (9).

4. The wound inductor heat transfer potting structure according to claim 1, characterized in that, A plurality of potting scale lines (11) are provided along the height direction on the second insulating film (303) located outside the inductive magnetic ring (301).

5. The wound inductor heat transfer potting structure according to claim 1, characterized in that, The filling ports (5) on the pressure plate (4) are evenly distributed around the central axis of the wound inductor (3).

6. The wound inductor heat transfer potting structure according to claim 1, characterized in that, The central axis of the heat-conducting column (2) coincides with the central axis of the wound inductor (3).

7. A method for potting and sealing wound inductors for heat transfer, characterized in that, Using the potting structure described in any one of claims 1 to 6, potting compound is injected into the potting cavity through the potting port (5) opened on the pressure plate (4). The potting compound fills the potting cavity between the wound inductor (3) and the heat-conducting column (2), and fills the gap between the second insulating film (303), the inductor winding (304) and the first insulating film (302) after passing through the potting hole (305) on the second insulating film (303). It also fills the gap between the first insulating film (302) and the inductor magnetic ring (301) after passing through the potting hole (305) on the first insulating film (302).

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