A method and device for one-time forming a circuit board aluminum substrate target hole

Abstract

The application provides a circuit board aluminum substrate target hole one-time forming device, which comprises an equipment shell, a support frame, a moving rod, an equipment cover plate, a lifting device, a fixed body, a drill bit, a suction device and a supporting leg, wherein the supporting leg is fixed at the bottom of the equipment shell, the equipment shell is a hollow cuboid structure, long strip-shaped openings are formed in the lower part of the front of the equipment shell, the support frame is fixed at each long strip-shaped opening, the moving rod is slidably installed above the support frame, and the suction device is slidably installed on the moving rod. By improving the suction device in the equipment, the possibility of scratch of the aluminum substrate during conveying can be effectively reduced, so that the yield of products is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board manufacturing, in particular to a circuit board aluminum substrate target hole one-time forming manufacturing method and device. BACKGROUND

[0002] In the production and manufacturing process of aluminum substrate, it is mostly multi-layer aluminum substrate, at this time, target holes are needed for alignment, so that the alignment progress can meet the production needs, otherwise, the layers are misaligned, resulting in open circuit, affecting reliability. However, in the prior art, the aluminum substrate production process needs to be drilled twice, and the additional drilling process may face multiple transportation, which may increase the possibility of product scratches, thereby reducing the yield of the product. At the same time, in the process of drilling and conveying the aluminum substrate, the conveying method currently adopted is mostly by suction cup support, and the position adsorbed by the suction cup is one side of the aluminum substrate, which may easily cause the aluminum substrate to bend, thereby causing the aluminum substrate to deform. At the same time, the bending of one side during the supporting process may cause the height of one end of the aluminum substrate to be reduced, thereby causing scratches on the aluminum substrate during the conveying process, further affecting the yield of the product.

[0003] To solve the problems of twice drilling, twice conveying and product scratches and bending during equipment conveying in the prior art manufacturing method, the present application provides a technical solution. SUMMARY

[0004] A circuit board aluminum substrate target hole one-time forming manufacturing method, wherein the manufacturing method comprises:

[0005] Step 1: cutting, cutting a complete aluminum substrate into small aluminum substrates of equal size according to the size required by the equipment;

[0006] Step 2: outer dry film,

[0007] Step 3: outer layer acid etching, the components used for outer layer acid etching mainly include copper chloride, hydrochloric acid, sodium chloride and ammonium chloride;

[0008] Step 4: outer layer AOI;

[0009] Step 5: edge grinding, mechanically grinding the treated circuit board to polish and remove impurities and burrs on the surface and edges of the aluminum substrate;

[0010] Step 6: aluminum substrate target drilling, mechanical target drilling is performed by inputting PNL size and recognized target size, and the device used for the aluminum substrate target drilling is Jingyao SQZ series automatic target drilling machine;

[0011] Step 7: solder resist;

[0012] Step 8: gold plating;

[0013] Step 9: drilling holes;

[0014] Step 10: washing the plate (I), after drilling holes, the aluminum substrate is washed by high-pressure water to remove the residual aluminum chips after drilling;

[0015] Step 11: characters, using silk-screen method to attach label characters on the surface;

[0016] Step 12: laser code spraying;

[0017] Step 13: plate milling, using CNC machine to mill regular plate patterns on the circuit board according to the programmed procedures;

[0018] Step 14: washing the plate (II), washing the surface of the aluminum substrate after milling;

[0019] Step 15: electrical measurement;

[0020] Step 16: high-voltage test;

[0021] Step 17: FQC;

[0022] Step 18: FQA;

[0023] Step 19: packaging.

[0024] A circuit board aluminum substrate target hole one-time forming device, comprising: an equipment shell, a support frame, a moving rod, an equipment cover plate, a lifting device, a fixed body, a drill bit, a suction device, and a support leg, wherein: the support leg is fixed at the bottom of the equipment shell, the equipment shell is a hollow rectangular structure, long strip-shaped openings are opened in the lower part of the front of the equipment shell, a support frame is fixed at each long strip-shaped opening, a moving rod is slidably installed above the support frame, a suction device is slidably installed on the moving rod, a lifting device is fixed above the moving rod, a fixed body is fixed below the lifting device, a drill bit is installed below the fixed body, an equipment cover plate is installed above the lifting device, and the moving rod is installed inside the equipment and can move forward, backward, left, and right inside, which can facilitate the equipment to suck and fix the aluminum substrate, has high freedom, and can improve the punching efficiency.

[0025] Preferably, the adsorption device comprises: a moving plate, a fixed frame, a driving device, a side plate, a moving side plate, a suction cup, and an air hole, the moving plate is slidingly installed on the moving rod, the two ends of the moving plate are respectively fixed with a side plate, the moving plate and the two side plates are combined into a "U" shape, three fixed frames are fixed at the middle position of the moving plate, a suction cup is fixed below the fixed frame, an air hole is formed above the suction cup, the driving device is slidingly installed at the position close to the moving plate of the side plate, a moving side plate is installed on the inner surface of each side plate, and three suction cups are fixed below the two moving side plates.

[0026] Preferably, the side plate is in a cuboid structure, and a track groove is formed in the side plate and penetrates one end of the side plate, so that the replacement of the large roller is facilitated, the replacement of the moving side plate is facilitated in time, and the product yield is ensured.

[0027] Preferably, the moving side plate comprises: a large roller, a connecting rod, a small roller, and a clamping groove, the moving side plate is in a cuboid structure, a clamping groove is formed at the middle position of the moving side plate, a small roller is installed in the clamping groove, one end of the small roller is rollingly connected to one end of the connecting rod, and the other end of the connecting rod is rollingly connected with a large roller.

[0028] Preferably, the side plate and the moving side plate are connected through the large roller, and the large roller is connected with the track groove in cooperation.

[0029] Preferably, the air hole is connected with a pneumatic device in the equipment, and the moving plate penetrates the moving rod and is internally provided with a driving device.

[0030] The above-mentioned scheme has the following beneficial effects:

[0031] 1. The manufacturing method is simple and convenient to operate, the number of targeting is reduced by using a CCD full-automatic targeting machine, the steps in the process are reduced, the production time is saved in product production, the production efficiency of products is improved, the number of targeting is reduced, the number of aluminum substrate carrying is reduced, the possibility of scratching the aluminum substrate during carrying is reduced, and the quality yield of products is improved.

[0032] 2. The adsorption device is provided, the three edges of the aluminum substrate can be simultaneously adsorbed due to the "U" shape of the adsorption device, the possibility of bending of the product aluminum substrate is reduced in the working process, and the yield of the product is ensured.

[0033] 3. The present application sets up the adsorption device, the adsorption device is higher than the workbench in whole, when the aluminum substrate is carried, the "U" shape structure can ensure that the aluminum substrate is not bent, so as to reduce the possibility of scratching, thereby improving the product quality.

[0034] 4. The present application sets up the adsorption device and the moving rod, when the equipment works, the normal equipment can move the front and back movement of the moving rod to adsorb the aluminum substrate to work, in the adsorption device, through the design of the side plate and the moving side plate roller, when the moving rod cannot work normally, the front and back of the moving side plate can be driven by the driving device to work, and the aluminum substrate can also be adsorbed, so as to ensure the good operation of the equipment, two sets of devices and two sets of protection can ensure the normal operation of the equipment when one fails, provide continuous power for production, ensure the needs of production, and also save time for equipment maintenance. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 The target hole setting diagram of the present application;

[0036] Figure 2 The structural schematic diagram of the present application;

[0037] Figure 3 The top view structural section view of the present application;

[0038] Figure 4 The adsorption device structural schematic diagram of the present application;

[0039] Figure 5 The adsorption device structural top view schematic diagram of the present application;

[0040] Figure 6 The moving side plate structural schematic diagram of the present application;

[0041] Figure 7 The moving side plate section view of the present application

[0042] Figure 8 The side plate section view of the present application;

[0043] In the figure: 1, equipment shell; 2, support frame; 3, moving rod; 4, equipment cover plate; 5, lifting device; 6, fixed body; 7, drill bit; 8, adsorption device; 81, moving plate; 82, fixed frame; 83, driving device; 84, side plate; 841, track groove; 85, moving side plate; 851, large roller; 852, connecting rod; 853, small roller; 854, clamping groove; 86, suction cup; 87, air hole; 9, supporting leg. DETAILED DESCRIPTION

[0044] The present application will be further clarified by the following description with reference to the accompanying drawings, but the protection scope of the present application is not limited to this.

[0045] A circuit board aluminum substrate target hole one-time forming manufacturing method, wherein the manufacturing method comprises:

[0046] Step 1: cutting, cutting a complete aluminum substrate to the required size of the equipment, cutting into small aluminum substrates of equal size;

[0047] Step 2: outer dry film,

[0048] Step 3: outer layer acid etching, the main components used in outer layer acid etching are copper chloride, hydrochloric acid, sodium chloride and ammonium chloride;

[0049] Step 4: outer layer AOI;

[0050] Step 5: edge grinding, mechanically grinding the treated circuit board to polish and remove impurities and burrs on the surface and edge of the aluminum substrate;

[0051] Step 6: aluminum base targeting, mechanical drilling is performed by inputting PNL size and identified target size, and the device used in the aluminum base targeting is Jingyao SQZ series automatic targeting machine;

[0052] Step 7: resist;

[0053] Step 8: gold plating;

[0054] Step 9: drilling;

[0055] Step 10: washing plate (I), after drilling, the aluminum substrate is washed by high pressure water to clean and flush the residual aluminum chips after drilling;

[0056] Step 11: character, using silk screen method to attach label character mark on the surface;

[0057] Step 12: laser code spraying;

[0058] Step 13: plate, using numerical control machine to mill regular plate pattern on the circuit board according to the realized program;

[0059] Step 14: washing plate (II), cleaning the surface of the aluminum substrate after milling;

[0060] Step 15: electrical measurement;

[0061] Step 16: high voltage test;

[0062] Step 17: FQC;

[0063] Step 18: FQA;

[0064] Step 19: packaging.

[0065] A kind of circuit board aluminum substrate target hole one-time forming device, including: equipment shell 1, support frame 2, moving rod 3, equipment cover plate 4, lifting device 5, fixed body 6, drill bit 7, adsorption device 8, support leg 9, wherein: the support leg 9 is fixed at the bottom of the equipment shell 1, the equipment shell 1 is hollow rectangular structure, the lower portion of the front of the equipment shell 1 is provided with long strip-shaped opening, each long strip-shaped opening is fixed with support frame 2, the moving rod 3 is slidably installed on the support frame 2, the adsorption device 8 is slidably installed on the moving rod 3, the lifting device 5 is fixed on the moving rod 3, the fixed body 6 is fixed below the lifting device 5, the drill bit 7 is installed below the fixed body 6, and the equipment cover plate 4 is installed above the lifting device 5.

[0066] Specifically, the adsorption device 8 includes: moving plate 81, fixed frame 82, drive device 83, side plate 84, moving side plate 85, suction cup 86, air hole 87, the moving plate 81 is slidably installed on the moving rod 3, the two ends of the moving plate 81 are respectively fixed with side plate 84, the moving plate 81 and the two side plates 84 are combined into a "U" shape, three fixed frames 82 are fixed at the middle position of the moving plate 81, the suction cup 86 is fixed below the fixed frame, the air hole 87 is formed above the suction cup 86, the drive device 83 is slidably installed on the side plate 84 close to the moving plate 81, the inner surface of each side plate 84 is provided with moving side plate 85, and the lower portion of the two moving side plates 85 is fixed with three suction cups 86.

[0067] Specifically, the side plate 84 is a rectangular structure, the track groove 841 is formed in the side plate, and the track groove 841 penetrates one end of the side plate 84.

[0068] Specifically, the moving side plate 85 includes: large roller 851, connecting rod 852, small roller 853, clamping groove 854, the moving side plate 85 is a rectangular structure, the clamping groove 854 is formed at the middle position of the moving side plate 85, the small roller 853 is installed in the clamping groove, one end of the small roller 853 is rotatably connected to one end of the connecting rod 852, and the other end of the connecting rod 852 is rotatably connected with the large roller 851.

[0069] Specifically, the side plate 84 and the moving side plate 85 are connected through the large roller 851, and the large roller 851 is connected with the track groove 841.

[0070] Specifically, the air hole 87 is connected with the pneumatic device in the equipment, the moving plate 81 passes through the moving rod 3 and is provided with a built-in drive device in the interior.

[0071] Working principle:

[0072] A kind of circuit board aluminum substrate target hole one forming device, comprising: equipment shell 1, support frame 2, moving rod 3, equipment cover plate 4, lifting device 5, fixed body 6, drill bit 7, adsorption device 8, support leg 9, when needing to carry out aluminum substrate targeting, operator transports the aluminum substrate that has been edge finished to aluminum base targeting link, worker places aluminum base on the left support frame 2 of equipment, subsequently input setting program in equipment computer, carries out full-automatic targeting by equipment specific program, after program input, the moving plate 81 in moving rod 3 and adsorption device 8 cooperate, move front and back and left and right, first adsorption device 8 moves to the left side of equipment, step is completed, and moving rod 3 moves to the direction of support frame 2, and suction cup 86 in adsorption device 8 is stretched to support frame 2 position, after step is completed, suction cup 86 will be stretched downwards, and suction cup 86 is close to aluminum base, while the air hole 87 on the upper portion of suction cup 86 will inhale under the action of equipment, further increase the suction of suction cup 86 to aluminum base, nine suction cups 86 are absorbed to aluminum base, and moving rod 3 is withdrawn, adsorption device 8 moves to drill bit, and carries out the drilling of different position target hole under the setting parameter;

[0073] If equipment is operated for a long time, when moving rod 3 fails to move, the moving side plate 85 in adsorption device 8 can also be stretched to support frame 3, and the six suction cups of moving side plate can also work normally, can also normally operate while the moving rod of equipment fails, ensure production, gain time for equipment maintenance, so as to achieve the failure without blocking production.

[0074] The embodiments of the present application disclose the preferred embodiments, but are not limited to this, and the ordinary skilled in the art can easily understand the spirit of the present application according to the above embodiments, and make different inferences and changes, as long as not deviating from the spirit of the present application, all are within the protection scope of the present application.

Claims

1. A one-step forming apparatus for circuit board aluminum substrate target holes, comprising: The utility model provides a device shell (1), support frame (2), moving rod (3), device cover plate (4), lifting device (5), fixed body (6), drill bit (7), adsorption device (8), support leg (9), its characterized in be: support leg (9) is fixed in the bottom of device shell (1), device shell (1) is hollow cuboid structure, the lower part of the front of device shell (1) is opened long strip shape, and each long strip shape is fixed with support frame (2), support frame (2) is slidably installed with moving rod (3) above, adsorption device (8) is slidably installed with moving rod (3) on, lifting device (5) is fixed with fixed body (6) below, drill bit (7) is installed with fixed body (6) below, device cover plate (4) is installed with lifting device (5) above adsorption device (8) includes: moving plate (81), fixed frame (82), drive arrangement (83), side plate (84), mobile side plate (85), sucking disc (86), air hole (87), moving plate (81) is slidably installed on moving rod (3), both ends of moving plate (81) are fixed with side plate (84) respectively, moving plate (81) and both side plates (84) are combined into " U ” type, the middle position of moving plate (81) is fixed with three fixed frames (82), the below of fixed frame is fixed with sucking disc (86), the above of sucking disc (86) is provided with air hole (87), drive arrangement (83) is slidably installed with the position of side plate (84) close to moving plate (81), the inner surface of each side plate (84) is installed with mobile side plate (85), and the below of two mobile side plates (85) is fixed with three sucking discs (86).

2. The apparatus for one-time forming a hole in an aluminum substrate target of a circuit board according to claim 1, characterized in that: The side plate (84) is a cuboid structure, and a track groove (841) is formed in the side plate.

3. A circuit board aluminum substrate target hole one-time forming device according to claim 1, characterized in that: The mobile side plate (85) includes a large roller (851), a connecting rod (852), a small roller (853), and a clamping groove (854).

4. A circuit board aluminum substrate target hole one-time forming device according to claim 2, characterized in that: The side plate (84) and the mobile side plate (85) are connected through the large roller (851), and the track groove (841) is connected with the large roller (851).

5. A circuit board aluminum substrate target hole one-time forming device according to claim 1, characterized in that: The air hole (87) is connected with a pneumatic device in the device, and the moving plate (81) passes through the moving rod (3) and is internally provided with a driving device.

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