A detection device for automatically positioning and adsorbing silicon wafers and a method for using the same

Abstract

The present invention discloses a detection device for automatically positioning and adsorbing silicon wafers, and relates to the technical field of silicon wafer processing equipment. The device comprises a workbench, wherein a detection truncated table is arranged on the workbench, and a plurality of bearing grooves for bearing silicon wafers are arranged in a circular array on the detection truncated table, and the detection truncated table is fixedly connected to the output end of a first motor arranged at the bottom of the workbench, wherein a gluing device and a detection device are also arranged on one side of the detection truncated table; the device also comprises a loading and conveying mechanism and a loading assembly, wherein the loading and conveying mechanism is arranged on one side of the workbench, and is used to convey the silicon wafers to the loading end on one side of the detection truncated table, and the loading assembly is used to adsorb the silicon wafers conveyed to the loading end and then transfer them to the bearing grooves; the device also comprises a unloading and conveying mechanism and a unloading assembly. The present invention contacts the side end of the silicon wafer by setting a clamping mechanism, and does not directly contact the surface of the silicon wafer, so that the glue on the surface of the silicon wafer will not be affected during the unloading process.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer processing equipment, and in particular to a detection device for automatically positioning and adsorbing silicon wafers and a method for using the same. Background Art

[0002] In the semiconductor industry, the general photolithography process involves cleaning and drying the silicon wafer surface, applying primer, photoresist, soft baking, alignment exposure, post-baking, developing, hard baking, etching, etc. Among them, the photolithography process is the process of spreading the photoresist on the silicon wafer surface and then transferring the pattern on the mask to the photoresist (i.e., the process of temporarily "copying" the device or circuit structure onto the silicon wafer).

[0003] During the process of gluing silicon wafers, uneven gluing is very likely to occur. In the prior art, it is usually necessary to inspect the silicon wafers after gluing. For the silicon wafers after gluing, the glue on the surface needs a certain amount of time to completely dry. Therefore, if a vacuum suction robot is used for direct adsorption, it is easy to affect the gluing effect of the silicon wafer. Summary of the invention

[0004] The purpose of the present invention is to provide a detection device and a method for automatically positioning and adsorbing a silicon wafer, so as to solve the following technical problems:

[0005] After the silicon wafer is coated with glue, it takes a certain amount of time for the glue on its surface to completely dry. Therefore, if a vacuum suction robot is used for direct adsorption, it will easily affect the glue coating effect of the silicon wafer.

[0006] The purpose of the present invention can be achieved by the following technical solutions:

[0007] A detection device for automatically positioning and adsorbing silicon wafers comprises a workbench, on which a detection truncated table is arranged, on which a plurality of groups of bearing slots for bearing silicon wafers are arranged in a circular array, and the detection truncated table is fixedly connected to an output end of a first motor arranged at the bottom of the workbench, wherein a gluing device and a detection device are also arranged on one side of the detection truncated table;

[0008] It also includes a loading and conveying mechanism and a loading assembly. The loading and conveying mechanism is arranged on one side of the workbench and is used to convey the silicon wafers to the loading end on one side of the detection truncated table. The loading assembly is used to absorb the silicon wafers conveyed to the loading end and then transfer them to the carrying tank;

[0009] It also includes a material unloading conveying mechanism and a material unloading assembly. The material unloading conveying mechanism is arranged on one side of the workbench. The material unloading conveying mechanism and the material loading conveying mechanism are arranged vertically and are used to convey the silicon wafers after inspection. The material unloading assembly is used to transfer the silicon wafers after inspection in the carrying tank to the material unloading conveying mechanism.

[0010] Preferably, a transfer bracket is arranged on one side of the detection truncated table, a U-shaped frame is arranged between the transfer brackets, a balance wheel is rotatably arranged inside the U-shaped frame, and the balance wheel is fixedly connected to the output end of the second motor arranged on the transfer bracket;

[0011] The end faces of the balance wheel are respectively provided with a first support rod fixedly connected to the loading assembly and a second support rod fixedly connected to the unloading assembly, and the first support rod and the second support rod are arranged vertically at an angle.

[0012] Preferably, the loading assembly comprises a first support fixedly connected to the first support rod, a first cylinder is arranged in the first support, and the first cylinder is fixedly connected to the first L-shaped positioning plate;

[0013] Wherein, the bottom of the first L-shaped positioning plate is connected to the negative pressure end through a pipeline, and the other end of the pipeline is connected to the vacuum equipment.

[0014] Preferably, the blanking assembly comprises a second support fixedly connected to the second support rod, a second cylinder is arranged in the second support, and the second cylinder is fixedly connected to the second L-shaped positioning plate;

[0015] Wherein, a clamping mechanism for fixing the silicon wafer is provided at the bottom of the second L-shaped positioning plate.

[0016] Preferably, the clamping mechanism includes a third motor arranged on the second L-shaped positioning plate, the output end of the third motor is fixedly connected to the turntable, a plurality of arc grooves are arranged on the turntable in a circumferential array, the arc grooves extend from the proximal end to the distal end of the turntable, a pin is movably embedded in the arc groove, the bottom end of the pin is fixedly connected to the clamping plate, and the other end of the pin is fixedly connected to a slide seat slidably arranged on the guide rod;

[0017] Among them, the second L-shaped positioning plate is arranged with multiple groups of limit plates towards the direction of the turntable, the guide rod is fixedly connected to the limit plate, and the guide rod is also provided with a reset spring fixedly connected to the slide seat.

[0018] Preferably, it further comprises a lifting assembly, which comprises a T-shaped through slot opened in the bearing slot, a T-shaped push rod slidably arranged in the T-shaped through slot, and the T-shaped push rod is connected to a lifting mechanism arranged at the bottom of the detection truncated table.

[0019] Preferably, the lifting mechanism comprises a rack plate fixedly connected to the T-shaped push rod, the rack plate is meshed with a first gear arranged at the bottom of the detection truncated table, and the first gear is fixedly mounted on the rotating shaft;

[0020] Among them, a bevel gear 1 is provided at the end of the rotating shaft, which is engaged with a bevel gear 2 which is rotatably arranged under the detection table. The bottom end of the bevel gear 2 is fixedly connected to the second gear. An arc-shaped rack for engaging with the second gear is arranged on the workbench, and the arc-shaped rack extends toward the rotation direction of the detection table. The end of the arc-shaped rack is located directly below the loading and unloading of the load-bearing groove.

[0021] Preferably, a reset rod is further provided on one side of the rack plate, a movable seat fixedly connected to the rack plate is slidably provided on the reset rod, and a telescopic spring fixedly connected to the movable seat is further provided on the reset rod; by providing the telescopic spring, the T-shaped push rod can be quickly reset.

[0022] A method for using a detection device for automatically positioning and adsorbing a silicon wafer comprises the following steps:

[0023] Step 1: Place the silicon wafers to be tested for gluing on the feeding conveyor mechanism in sequence for conveying;

[0024] Step 2: When transported to the loading end, the silicon wafer is transferred to the loading tank through the loading assembly;

[0025] Step 3, start the first motor, the first motor drives the detection round table to rotate, when the group of silicon wafers rotate to the gluing device, the detection round table stops, and the silicon wafers are glued by the gluing device;

[0026] Step 4: As the detection round table rotates, when the silicon wafer after the glue coating passes through the detection equipment, the silicon wafer after the glue coating is monitored by the detection equipment;

[0027] Step 5. After the inspection is completed, as the inspection table continues to rotate, the unloading assembly will clamp the silicon wafers in the carrying slot and transfer them to the unloading conveying mechanism. For silicon wafers that pass the inspection, the unloading conveying mechanism will start normally to transport the silicon wafers out. For silicon wafers that fail the inspection, the unloading conveying mechanism will reverse the transmission and transport the silicon wafers to the unloading end, where the staff will collect the unqualified silicon wafers.

[0028] Beneficial effects of the present invention:

[0029] (1) When the silicon wafer is unloaded, the clamping mechanism is arranged to contact the side end of the silicon wafer, but not to directly contact the surface of the silicon wafer, so that the glue on the surface of the silicon wafer will not be affected during the unloading process;

[0030] (2) During the loading and unloading process, the second motor drives the balance wheel to rotate back and forth, and drives the loading assembly to reciprocate between the loading conveyor mechanism and the loading slot through the first support rod. Synchronously, the unloading assembly is driven to reciprocate between the unloading conveyor mechanism and the loading slot through the second support rod, so that after the unloading assembly moves the silicon wafers that have been inspected out of the loading slot, the loading assembly moves the silicon wafers to be inspected for gluing back into the loading slot. The silicon wafer loading and unloading of the embodiment of the present invention can be carried out synchronously, which is more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The present invention will be further described below in conjunction with the accompanying drawings.

[0032] Figure 1The structure diagram of a detection device for automatically positioning and adsorbing a silicon wafer according to the present invention is shown in FIG. Figure 1 ;

[0033] Figure 2 The structure diagram of a detection device for automatically positioning and adsorbing a silicon wafer according to the present invention is shown in FIG. Figure 2 ;

[0034] Figure 3 The structure diagram of a detection device for automatically positioning and adsorbing a silicon wafer according to the present invention is shown in FIG. Figure 3 ;

[0035] Figure 4 It is a structural schematic diagram of a detection platform in a detection device for automatically positioning and adsorbing silicon wafers according to the present invention;

[0036] Figure 5 It is a structural schematic diagram of a lifting component in a detection device for automatically positioning and adsorbing a silicon wafer according to the present invention;

[0037] Figure 6 It is a structural schematic diagram of a loading component in a detection device for automatically positioning and adsorbing silicon wafers according to the present invention;

[0038] Figure 7 It is a structural schematic diagram of a material unloading component in a detection device for automatically positioning and adsorbing silicon wafers according to the present invention;

[0039] Figure 8 The present invention is a schematic structural diagram of a T-shaped ejector rod in a detection device for automatically positioning and adsorbing a silicon wafer.

[0040] In the figure: 1, workbench; 2, gluing equipment; 3, testing equipment; 4, testing round table; 5, feeding conveying mechanism; 6, transfer bracket; 7, feeding assembly; 8, unloading assembly; 9, unloading conveying mechanism; 101, arc rack; 401, first motor; 402, T-shaped through slot; 403, bearing slot; 404, T-shaped top rod; 405, rack plate; 406, first gear; 407, rotating shaft; 408, bevel gear one; 409, bevel gear two; 410, second gear; 411, telescopic spring; 412, reset rod; 601 , U-shaped frame; 602, second motor; 603, balance wheel; 701, first support rod; 702, first support; 703, first cylinder; 704, first L-shaped positioning plate; 705, pipeline; 706, negative pressure terminal; 801, second support rod; 802, second cylinder; 803, second support; 804, second L-shaped positioning plate; 805, third motor; 806, turntable; 807, arc groove; 808, clamping plate; 809, pin shaft; 810, slide seat; 811, guide rod; 812, limit plate; 813, reset spring. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] See also Figure 1-Figure 3 As shown, the present invention is a detection device for automatically positioning and adsorbing silicon wafers, comprising a workbench 1, on which a detection truncated table 4 is arranged, on which a plurality of groups of bearing slots 403 for bearing silicon wafers are arranged in a circular array, and the detection truncated table 4 is fixedly connected to the output end of a first motor 401 arranged at the bottom of the workbench 1, wherein a gluing device 2 and a detection device 3 are also arranged on one side of the detection truncated table 4, wherein the gluing device 2 is used to perform gluing treatment on the silicon wafers in the bearing slots 403, and the detection device 3 is used to detect the silicon wafers after gluing; in one embodiment of the present invention, the gluing device 2 and the detection device 3 are arranged in sequence at the rear end of the rotation direction of the detection truncated table 4, so that the silicon wafers in the bearing slots 403 can pass through the gluing device 2 and the detection device 3 in sequence;

[0043] It also includes a loading and conveying mechanism 5 and a loading assembly 7. The loading and conveying mechanism 5 is arranged on one side of the workbench 1 and is used to convey the silicon wafers to the loading end on one side of the detection truncated table 4. The loading assembly 7 is used to absorb the silicon wafers conveyed to the loading end and then transfer them to the carrying tank 403.

[0044] The present invention also includes a material unloading conveying mechanism 9 and a material unloading assembly 8. The material unloading conveying mechanism 9 is arranged on one side of the workbench 1. The material unloading conveying mechanism 9 and the material loading conveying mechanism 5 are arranged vertically at 90 degrees to convey the silicon wafers after inspection. The material unloading assembly 8 is used to transfer the silicon wafers after inspection in the bearing groove 403 to the material unloading conveying mechanism 9. In one embodiment of the present invention, the silicon wafers to be inspected for gluing are first placed on the material loading conveying mechanism 5 in sequence for transportation. When the silicon wafers are transported to the loading end, the silicon wafers are transported to the bearing groove 403 by the material loading assembly 7, and the first motor 401 is started. The first motor 401 drives the detection round table 4 to rotate. When the silicon wafers are When it rotates to the gluing device 2, the detection round table 4 stops rotating, and the silicon wafer is subjected to gluing by the gluing device 2. As the detection round table 4 rotates, when the silicon wafer after gluing passes the detection device 3, the silicon wafer after gluing is monitored by the detection device 3. After the detection is completed, as the detection round table 4 continues to rotate, the unloading component 8 clamps the silicon wafer in the bearing groove 403 and transfers it to the unloading conveying mechanism 9. For the silicon wafers that pass the inspection, the unloading conveying mechanism 9 starts normally to convey the silicon wafers out. For the silicon wafers that fail the inspection, the unloading conveying mechanism 9 reverses the transmission and conveys the silicon wafers to the unloading end, and the staff collects the unqualified silicon wafers in a unified manner.

[0045] See also Figure 4 A transfer bracket 6 is arranged on one side of the detection truncated table 4, a U-shaped frame 601 is arranged between the transfer brackets 6, a balance wheel 603 is rotatably arranged in the U-shaped frame 601, and the balance wheel 603 is fixedly connected to the output end of the second motor 602 arranged on the transfer bracket 6;

[0046] The end surface of the balance wheel 603 is respectively provided with a first support rod 701 fixedly connected to the loading assembly 7 and a second support rod 801 fixedly connected to the unloading assembly 8, and the first support rod 701 and the second support rod 801 are arranged vertically at 90 degrees; specifically, during the loading and unloading process, the second motor 602 is started, and the second motor 602 drives the loading assembly 7 to reciprocate between the loading conveying mechanism 5 and the bearing groove 403 through the first support rod 701 in the process of driving the balance wheel 603 to rotate back and forth, and synchronously, the unloading assembly 8 is driven to reciprocate between the unloading conveying mechanism 9 and the bearing groove 403 through the second support rod 801, so that after the unloading assembly 8 moves the silicon wafers after inspection in the bearing groove 403 out, the loading assembly 7 moves the silicon wafers to be glued and inspected into the bearing groove 403 again. The silicon wafer loading and unloading of the embodiment of the present invention can be carried out synchronously, which is more efficient;

[0047] See also Figure 5 The feeding assembly 7 includes a first support 702 fixedly connected to the first support rod 701, a first cylinder 703 is provided in the first support 702, and the first cylinder 703 is fixedly connected to the first L-shaped positioning plate 704;

[0048] The bottom of the first L-shaped positioning plate 704 is connected to the negative pressure terminal 706 through the pipe 705, and the other end of the pipe 705 is connected to the vacuum device; in the process of transferring the silicon wafer from the feeding conveying mechanism 5 to the bearing tank 403, the first L-shaped positioning plate 704 is driven downward by the first cylinder 703 to make the negative pressure terminal 706 fit closely with the silicon wafer, and the vacuum device is started. The vacuum device generates vacuum negative pressure at the negative pressure terminal 706 through the pipe 705, and then the silicon wafer can be adsorbed and fixed. The second motor 602 transfers the first support rod 701 to the bearing tank 403 through the pendulum 603, and the vacuum device is turned off, so that the silicon wafer is separated from the negative pressure terminal 706 and falls into the bearing tank 403;

[0049] See also Figure 6 The blanking assembly 8 includes a second support 803 fixedly connected to the second support rod 801, a second cylinder 802 is disposed in the second support 803, and the second cylinder 802 is fixedly connected to the second L-shaped positioning plate 804;

[0050] Among them, a clamping mechanism for fixing the silicon wafer is provided at the bottom of the second L-shaped positioning plate 804; in the process of transferring the silicon wafer from the bearing slot 403 to the unloading conveying mechanism 9, the side end of the silicon wafer is first clamped and fixed by the clamping mechanism, and then the second motor 602 transfers the second support rod 801 to the unloading conveying mechanism 9 through the pendulum 603, and then the silicon wafer is placed on the unloading conveying mechanism 9. In one embodiment of the present invention, when unloading, the clamping mechanism is set to contact the side end of the silicon wafer, and not to directly contact the surface of the silicon wafer, so that the glue on the surface of the silicon wafer will not be affected during the unloading process;

[0051] The clamping mechanism includes a third motor 805 arranged on the second L-shaped positioning plate 804, the output end of the third motor 805 is fixedly connected to the turntable 806, a plurality of arc grooves 807 are arranged in a circumferential array on the turntable 806, the arc groove 807 extends from the proximal end to the distal end of the turntable 806, a pin 809 is movably embedded in the arc groove 807, the bottom end of the pin 809 is fixedly connected to the clamping plate 808, and the other end of the pin 809 is fixedly connected to a slide seat 810 slidably arranged on the guide rod 811;

[0052] Among them, the second L-shaped positioning plate 804 is provided with multiple groups of limit plates 812 toward the direction of the turntable 806, the guide rod 811 is fixedly connected to the limit plate 812, and the guide rod 811 is also provided with a return spring 813 fixedly connected to the slide seat 810; when clamping the silicon wafer, first, the clamping plate 808 is driven to be located at the peripheral side of the silicon wafer, and the third motor 805 is started. The third motor 805 drives the turntable 806 to rotate during the rotation process. During the rotation of the turntable 806, the pin shaft 809 moves from the distal end to the proximal end in the arc groove 807, and then the silicon wafer is clamped and fixed by the clamping plate 808. At this time, the return spring 813 contracts to generate elastic force. When disassembling the silicon wafer, the third motor 805 can be rotated in the opposite direction;

[0053] See also Figure 7 , and also includes a lifting component, which includes a T-shaped through slot 402 opened in the bearing slot 403, a T-shaped push rod 404 is slidably arranged in the T-shaped through slot 402, and the T-shaped push rod 404 is connected to the lifting mechanism arranged at the bottom of the detection round table 4; specifically, in the process of loading and unloading, in order to facilitate the clamping plate 808 to fit the side of the silicon wafer, when the bearing slot 403 is rotated to the loading and unloading position, the T-shaped push rod 404 is lifted up by the lifting mechanism, and then the silicon wafer is lifted to a height difference with the detection round table 4, so that the clamping plate 808 is fitted and fixed to the outer end surface of the silicon wafer;

[0054] See also Figure 8 The lifting mechanism includes a rack plate 405 fixedly connected to the T-shaped top rod 404, the rack plate 405 is meshed with a first gear 406 arranged at the bottom of the detection round table 4, and the first gear 406 is fixedly mounted on the rotating shaft 407;

[0055] Among them, a bevel gear 1 408 is provided at the end of the rotating shaft 407, and the bevel gear 1 408 is meshed with a bevel gear 2 409 rotatably arranged below the detection truncated table 4, and the bottom end of the bevel gear 2 409 is fixedly connected to the second gear 410, and an arc-shaped rack 101 for meshing with the second gear 410 is arranged on the workbench 1, and the arc-shaped rack 101 extends toward the rotation direction of the detection truncated table 4, and the end of the arc-shaped rack 101 is located directly below the loading and unloading of the load-bearing slot 403; in one embodiment of the present invention, as the detection truncated table 4 rotates, when the load-bearing slot 403 is about to rotate to the upper At the unloading end, the second gear 410 drives the second bevel gear 409 to rotate by meshing with the arc-shaped rack 101, and the second bevel gear 409 drives the first gear 406 to rotate by meshing with the bevel gear 1 408. The first gear 406 drives the T-shaped push rod 404 to move up and down by meshing with the rack plate 405, thereby lifting the silicon wafer. When the unloading and loading are completed, as the detection table 4 continues to rotate, due to the length limitation of the arc-shaped rack 101, the subsequent second gear 410 does not mesh with the arc-shaped rack 101, thereby causing the rack plate 405 to move down, driving the T-shaped push rod 404 to reset;

[0056] Furthermore, a reset rod 412 is provided on one side of the rack plate 405, and a movable seat fixedly connected to the rack plate 405 is slidably provided on the reset rod 412, and a telescopic spring 411 fixedly connected to the movable seat is also provided on the reset rod 412; by providing the telescopic spring 411, the T-shaped top rod 404 can be quickly reset.

[0057] Example 2

[0058] A method for using a detection device for automatically positioning and adsorbing a silicon wafer comprises the following steps:

[0059] Step 1: Place the silicon wafers to be tested for gluing on the feeding conveying mechanism 5 in sequence for conveying;

[0060] Step 2: When transported to the loading end, the silicon wafer is transferred to the loading tank 403 through the loading assembly 7;

[0061] Step 3, start the first motor 401, the first motor 401 drives the detection round table 4 to rotate, when the group of silicon wafers rotate to the gluing device 2, the detection round table 4 stops rotating, and the silicon wafers are glued by the gluing device 2;

[0062] Step 4: As the detection truncated table 4 rotates, when the silicon wafer after the glue coating passes through the detection device 3, the detection device 3 monitors the silicon wafer after the glue coating;

[0063] Step 5. After the inspection is completed, as the inspection table 4 continues to rotate, the unloading assembly 8 clamps the silicon wafers in the carrying slot 403 and transfers them to the unloading conveying mechanism 9. For silicon wafers that pass the inspection, the unloading conveying mechanism 9 starts normally to convey the silicon wafers out. For silicon wafers that fail the inspection, the unloading conveying mechanism 9 drives in reverse and conveys the silicon wafers to the unloading end, and the staff collects the unqualified silicon wafers in a unified manner.

[0064] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, and a specific direction structure and operation, and therefore, cannot be understood as a limitation on the present invention. In addition, "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0065] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0066] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A detection device for automatically positioning and adsorbing a silicon wafer, comprising a workbench (1), characterized in that: The workbench (1) is provided with a detection truncated table (4), on which a plurality of groups of bearing grooves (403) for bearing silicon wafers are arranged in a circular array, and the detection truncated table (4) is fixedly connected to the output end of a first motor (401) arranged at the bottom of the workbench (1), wherein a gluing device (2) and a detection device (3) are also arranged on one side of the detection truncated table (4); It also includes a loading and conveying mechanism (5) and a loading assembly (7), wherein the loading and conveying mechanism (5) is arranged on one side of the workbench (1) and is used to convey the silicon wafers to the loading end on one side of the detection truncated table (4), and the loading assembly (7) is used to absorb the silicon wafers conveyed to the loading end and then transfer them to the carrying groove (403); It also includes a material unloading conveying mechanism (9) and a material unloading assembly (8), wherein the material unloading conveying mechanism (9) is arranged on one side of the workbench (1), the material unloading conveying mechanism (9) is arranged vertically at (90) degrees to the material loading conveying mechanism (5), and is used to convey the silicon wafers after inspection, and the material unloading assembly (8) is used to transfer the silicon wafers after inspection in the carrying groove (403) to the material unloading conveying mechanism (9); A transfer bracket (6) is arranged on one side of the detection truncated table (4), a U-shaped frame (601) is arranged between the transfer brackets (6), a balance wheel (603) is rotatably arranged inside the U-shaped frame (601), and the balance wheel (603) is fixedly connected to the output end of a second motor (602) arranged on the transfer bracket (6); The end surface of the balance wheel (603) is respectively provided with a first support rod (701) fixedly connected to the loading assembly (7) and a second support rod (801) fixedly connected to the unloading assembly (8), and the first support rod (701) and the second support rod (801) are arranged vertically at (90) degrees; The loading assembly (7) comprises a first support (702) fixedly connected to the first support rod (701), a first cylinder (703) is arranged in the first support (702), and the first cylinder (703) is fixedly connected to the first L-shaped positioning plate (704); The bottom of the first L-shaped positioning plate (704) is connected to the negative pressure terminal (706) via a pipe (705), and the other end of the pipe (705) is connected to the vacuum equipment; The blanking assembly (8) comprises a second support (803) fixedly connected to the second support rod (801), a second cylinder (802) is arranged in the second support (803), and the second cylinder (802) is fixedly connected to the second L-shaped positioning plate (804); Wherein, a clamping mechanism for fixing the silicon wafer is provided at the bottom of the second L-shaped positioning plate (804); The clamping mechanism comprises a third motor (805) arranged on the second L-shaped positioning plate (804), the output end of the third motor (805) is fixedly connected to the rotating disk (806), a plurality of arc grooves (807) are arranged in a circumferential array on the rotating disk (806), the arc grooves (807) extend from the proximal end to the distal end of the rotating disk (806), a pin shaft (809) is movably embedded in the arc groove (807), the bottom end of the pin shaft (809) is fixedly connected to the clamping plate (808), and the other end of the pin shaft (809) is fixedly connected to a sliding seat (810) slidably arranged on the guide rod (811); Wherein, a plurality of groups of limit plates (812) are arranged on the second L-shaped positioning plate (804) in the direction of the rotating disk (806), the guide rod (811) is fixedly connected to the limit plates (812), and the guide rod (811) is also provided with a return spring (813) fixedly connected to the slide seat (810); It also includes a lifting assembly, which includes a T-shaped through slot (402) opened in the bearing slot (403), a T-shaped push rod (404) slidably arranged in the T-shaped through slot (402), and the T-shaped push rod (404) is connected to a lifting mechanism arranged at the bottom of the detection truncated table (4); The lifting mechanism comprises a rack plate (405) fixedly connected to the T-shaped top rod (404), the rack plate (405) meshing with a first gear (406) arranged at the bottom of the detection truncated table (4), and the first gear (406) is fixedly mounted on the rotating shaft (407); A bevel gear 1 (408) is provided at the end of the rotating shaft (407), and the bevel gear 1 (408) is meshed with a bevel gear 2 (409) rotatably arranged below the detection truncated platform (4). The bottom end of the bevel gear 2 (409) is fixedly connected to a second gear (410). An arc-shaped rack (101) for meshing with the second gear (410) is arranged on the workbench (1), and the arc-shaped rack (101) extends in the direction of rotation of the detection truncated platform (4). The end of the arc-shaped rack (101) is located directly below the loading and unloading of the load-bearing groove (403).

2. The detection device for automatically positioning and adsorbing a silicon wafer according to claim 1, characterized in that: A reset rod (412) is also provided on one side of the rack plate (405); a movable seat fixedly connected to the rack plate (405) is slidably provided on the reset rod (412); and a telescopic spring (411) fixedly connected to the movable seat is also provided on the reset rod (412); the telescopic spring (411) is provided to facilitate rapid reset of the T-shaped push rod (404).

3. The method for using the detection device for automatically positioning and adsorbing a silicon wafer according to claim 1, characterized in that: The steps include: Step 1: placing the silicon wafers to be tested for gluing on the material feeding and conveying mechanism (5) in sequence for conveying; Step 2: When transported to the loading end, the silicon wafer is transferred to the carrying tank (403) through the loading assembly (7); Step 3: starting the first motor (401), the first motor (401) drives the detection truncated table (4) to rotate, when the group of silicon wafers rotates to the gluing device (2), the detection truncated table (4) stops rotating, and the silicon wafers are subjected to gluing treatment by the gluing device (2); Step 4: As the detection truncated table (4) rotates, when the silicon wafer after the glue coating passes through the detection device (3), the silicon wafer after the glue coating is monitored by the detection device (3); Step 5. After the inspection is completed, as the inspection table (4) continues to rotate, the unloading assembly (8) clamps the silicon wafers in the carrying groove (403) and transfers them to the unloading conveying mechanism (9). For silicon wafers that pass the inspection, the unloading conveying mechanism (9) starts normally to convey the silicon wafers out. For silicon wafers that fail the inspection, the unloading conveying mechanism (9) drives in the reverse direction to convey the silicon wafers to the unloading end, and the staff collects the unqualified silicon wafers in a unified manner.

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