A proximity inductive sensor resistant to ultra-low temperature and anti-interference and its manufacturing process

Abstract

The present invention discloses a proximity inductive sensor resistant to ultra-low temperature and interference and a manufacturing process thereof, and relates to the technical field of inductive sensors. Aiming at the problem that the existing proximity inductive sensors cannot operate under low temperature conditions of ‑50°C, and have poor anti-interference ability and stability, the following scheme is proposed, which includes an oscillation part, a signal processing part and an output part. The oscillation part includes: a detection coil, which is connected to an LC oscillation module, detects the detected object through an alternating magnetic field existing in itself, transmits the detection information to the LC oscillation module, and receives the oscillation returned by the LC oscillation module, so that the detected object generates eddy currents and absorbs the oscillation energy. The system and process of the present invention are simple to operate, and have strong anti-electromagnetic interference ability, can be used in low temperature environments, and the product has high stability in detecting target objects and output signals, and has a wide range of applications and fields.

Description

Technical Field

[0001] The present invention relates to the technical field of inductive sensors, and in particular to an ultra-low temperature resistant and anti-interference proximity inductive sensor and a manufacturing process thereof. Background Art

[0002] At present, in the industrial market, the working environment temperature of ordinary inductive sensors is -40℃-85℃. There are many basic structures, such as M12, M18, and M30. They can detect metal targets, but their working environment temperature cannot meet the low temperature condition of -50℃, and their anti-interference ability is average. Therefore, in order to solve such problems, we propose a proximity inductive sensor that is resistant to ultra-low temperature and interference and its manufacturing process. Summary of the invention

[0003] The invention provides an ultra-low temperature resistant and anti-interference proximity inductive sensor and a manufacturing process thereof, which solves the problems of the existing proximity inductive sensors that they cannot operate under low temperature conditions of -50°C and have poor anti-interference ability and stability.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] A proximity inductive sensor resistant to ultra-low temperature and interference, comprising an oscillating part, a signal processing part and an output part, wherein the oscillating part comprises:

[0006] The detection coil is connected to the LC oscillation module, detects the detected object through an alternating magnetic field, transmits the detection information to the LC oscillation module, and receives the oscillation returned by the LC oscillation module, so that the detected object generates eddy current and absorbs the oscillation energy;

[0007] The LC oscillation module is connected to the detection coil, the detection circuit, the temperature compensation network and the anti-interference module, and serves as an oscillation carrier to receive the detection information transmitted by the detection coil, and then generates oscillation according to the detection information, and transmits the oscillation back to the detection coil, and transmits the oscillation information to the detection circuit;

[0008] A temperature compensation network, connected to the LC oscillation module, for providing temperature compensation for the LC oscillation module;

[0009] An anti-interference module, which is connected to the LC oscillation module and is used to provide signal anti-interference for the LC oscillation module;

[0010] A detection circuit, which is connected to the LC oscillation module and the signal amplification and processing module, is used to receive the oscillation information transmitted by the LC oscillation module, detect and filter the oscillation information, and transmit the information data to the signal amplification and processing module;

[0011] The signal processing part includes:

[0012] A signal amplification and processing module, which is connected to the detection circuit, the shaping circuit and the short-circuit protection module, and is used to receive the oscillation data signal transmitted by the detection circuit, then amplify and process the received signal, and transmit the amplified and processed signal to the shaping circuit;

[0013] A short circuit protection module, which is connected to the signal amplification and processing module and is used to perform short circuit protection on the signal amplification and processing module;

[0014] A shaping circuit, which is connected to the signal amplification and processing module and the signal judgment and output module, is used to receive the amplified and processed signal transmitted by the signal amplification and processing module, then shapes the signal, and transmits the shaped signal to the signal judgment and output module;

[0015] The output part includes:

[0016] A signal judgment and output module, which is connected to the anti-interference module and the output protection module, is used to receive the shaped signal transmitted by the shaping circuit, then judge the signal, and output the judged signal;

[0017] An anti-interference module, which is connected to the signal judgment and output module and is used to provide anti-interference for the signal judgment and output module;

[0018] The output protection module and the signal judgment and output module are used to provide output protection for the signal judgment and output module.

[0019] Preferably, the detection coil is a sensing sensitive element, and the detection coil is close to the detected object to sense the detected object.

[0020] Preferably, the anti-interference modules of the oscillation part and the output part are two independent modules, the anti-interference module and the temperature compensation module act on the LC oscillation module, and the anti-interference module and the output protection module act on the signal judgment and output module.

[0021] Preferably, when a metal object approaches the detection coil, the metal object generates eddy currents and absorbs oscillation energy, causing the oscillation to weaken until it stops. The two states of oscillation and stop are converted into switching signal outputs by the detection circuit, thereby utilizing eddy currents to sense the approach of the object and utilizing the sensitive characteristics of the displacement sensor to the approaching object to achieve the purpose of identifying the approaching object and outputting a switching signal.

[0022] A manufacturing process of a proximity inductive sensor that is resistant to ultra-low temperature and interference, the manufacturing process steps are as follows:

[0023] S1. Add an anti-interference module to the oscillation part and the output part, and the anti-interference module passes the electromagnetic compatibility test, and the electromagnetic compatibility test includes but is not limited to surge and transient anti-interference tests;

[0024] S2. In terms of component selection, electronic components that can work normally in a low temperature environment of -60°C are selected to replace the components used in ordinary circuit boards;

[0025] S3, the coil soldering point and its surroundings are filled with silicone to ensure that the coil soldering point will not be affected by the glue;

[0026] S4. Before pouring glue, wrap the circuit board with raw tape to isolate the circuit board from the glue, so that there is no large-area contact between the components on the circuit board and the glue, and the circuit board will not be forcibly shifted by the glue during rapid temperature changes.

[0027] The beneficial effects of the present invention are:

[0028] 1. Use silicone injection to the coil welding point and its surroundings to ensure that the coil welding point will not be affected by the glue.

[0029] 2. Wrap the circuit board with raw tape before pouring glue so that the components on the circuit board do not have large-area contact with the glue and will not be forcibly displaced by the glue during rapid temperature changes.

[0030] 3. In terms of component selection, electronic components that can work normally in low-temperature environments are used to replace components used in ordinary circuit boards, and the layout and wiring of the circuit boards are optimized to facilitate the subsequent filling process and meet its application in complex electromagnetic environments. Low-temperature optimization and related process upgrades are carried out to meet the use requirements in a -60°C environment.

[0031] 4. Add independent anti-interference modules to the oscillation part and the output part to improve its anti-electromagnetic interference capability and optimize the stability of the product's detection target and output signal, so that it can be used in proximity switches of snow conveyors in ski resorts, conveyor track safety protection monitoring, in-place detection of the mechanical arm of snowplows in ski resorts, and in-place detection of military equipment in ultra-low temperature environments, expanding its scope and field of application.

[0032] In summary, the system and its process are simple to operate, have strong anti-electromagnetic interference capabilities, can be used in low-temperature environments, have high stability in product detection targets and output signals, and have a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0034] Figure 1It is a working principle diagram of the present invention. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by those skilled in the art belong to the protection scope of the present invention.

[0036] Reference Figure 1 , a proximity inductive sensor resistant to ultra-low temperature and anti-interference, comprising an oscillating part, a signal processing part and an output part, wherein the oscillating part comprises:

[0037] A detection coil is connected to the LC oscillation module. The detection coil is a sensing element. The detection coil is close to the detected object to sense the detected object. The detected object is detected through an alternating magnetic field existing in the detection coil, and the detection information is transmitted to the LC oscillation module. The detection coil also receives the oscillation returned by the LC oscillation module, so that the detected object generates eddy current and absorbs the oscillation energy.

[0038] The LC oscillation module is connected to the detection coil, the detection circuit, the temperature compensation network and the anti-interference module, and serves as an oscillation carrier to receive the detection information transmitted by the detection coil, and then generates oscillation according to the detection information, and transmits the oscillation back to the detection coil, and transmits the oscillation information to the detection circuit;

[0039] A temperature compensation network, connected to the LC oscillation module, for providing temperature compensation for the LC oscillation module;

[0040] An anti-interference module, which is connected to the LC oscillation module and is used to provide signal anti-interference for the LC oscillation module;

[0041] A detection circuit, which is connected to the LC oscillation module and the signal amplification and processing module, is used to receive the oscillation information transmitted by the LC oscillation module, detect and filter the oscillation information, and transmit the information data to the signal amplification and processing module;

[0042] The signal processing part includes:

[0043] A signal amplification and processing module, which is connected to the detection circuit, the shaping circuit and the short-circuit protection module, and is used to receive the oscillation data signal transmitted by the detection circuit, then amplify and process the received signal, and transmit the amplified and processed signal to the shaping circuit;

[0044] A short circuit protection module, which is connected to the signal amplification and processing module and is used to perform short circuit protection on the signal amplification and processing module;

[0045] A shaping circuit, which is connected to the signal amplification and processing module and the signal judgment and output module, is used to receive the amplified and processed signal transmitted by the signal amplification and processing module, then shapes the signal, and transmits the shaped signal to the signal judgment and output module;

[0046] The output part includes:

[0047] A signal judgment and output module, which is connected to the anti-interference module and the output protection module, is used to receive the shaped signal transmitted by the shaping circuit, then judge the signal, and output the judged signal;

[0048] An anti-interference module, which is connected to the signal judgment and output module and is used to provide anti-interference for the signal judgment and output module;

[0049] The output protection module and the signal judgment and output module are used to provide output protection for the signal judgment and output module.

[0050] The anti-interference modules of the oscillation part and the output part are two independent modules. The anti-interference module and the temperature compensation module act on the LC oscillation module, and the anti-interference module and the output protection module act on the signal judgment and output module.

[0051] When a metal object approaches the detection coil, the metal object generates eddy currents and absorbs the oscillation energy, causing the oscillation to weaken until it stops. The two states of oscillation and stop are converted into switch signal outputs by the detection circuit, thereby utilizing the eddy current to sense the approach of the object and utilizing the sensitive characteristics of the displacement sensor to the approaching object to achieve the purpose of identifying the approaching object and outputting a switch signal.

[0052] A manufacturing process of a proximity inductive sensor that is resistant to ultra-low temperature and interference, the manufacturing process steps are as follows:

[0053] S1. Add an anti-interference module to the oscillation part and the output part, and the anti-interference module passes the electromagnetic compatibility test, and the electromagnetic compatibility test includes but is not limited to surge and transient anti-interference tests;

[0054] S2. In terms of component selection, electronic components that can work normally in a low temperature environment of -60°C are selected to replace the components used in ordinary circuit boards;

[0055] S3, the coil soldering point and its surroundings are filled with silicone to ensure that the coil soldering point will not be affected by the glue;

[0056] S4. Before pouring glue, wrap the circuit board with raw tape to isolate the circuit board from the glue, so that there is no large-area contact between the components on the circuit board and the glue, and the circuit board will not be forcibly shifted by the glue during rapid temperature changes.

[0057] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A proximity inductive sensor resistant to ultra-low temperature and interference, comprising an oscillating part, a signal processing part and an output part, characterized in that: The oscillating part comprises: The detection coil is connected to the LC oscillation module, detects the detected object through an alternating magnetic field, transmits the detection information to the LC oscillation module, and receives the oscillation returned by the LC oscillation module, so that the detected object generates eddy current and absorbs the oscillation energy; The LC oscillation module is connected to the detection coil, the detection circuit, the temperature compensation network and the anti-interference module, and serves as an oscillation carrier to receive the detection information transmitted by the detection coil, and then generates oscillation according to the detection information, and transmits the oscillation back to the detection coil, and transmits the oscillation information to the detection circuit; A temperature compensation network, connected to the LC oscillation module, for providing temperature compensation for the LC oscillation module; An anti-interference module, which is connected to the LC oscillation module and is used to provide signal anti-interference for the LC oscillation module; A detection circuit, which is connected to the LC oscillation module and the signal amplification and processing module, is used to receive the oscillation information transmitted by the LC oscillation module, detect and filter the oscillation information, and transmit the information data to the signal amplification and processing module; The signal processing part includes: A signal amplification and processing module, which is connected to the detection circuit, the shaping circuit and the short-circuit protection module, and is used to receive the oscillation data signal transmitted by the detection circuit, then amplify and process the received signal, and transmit the amplified and processed signal to the shaping circuit; A short circuit protection module, which is connected to the signal amplification and processing module and is used to perform short circuit protection on the signal amplification and processing module; A shaping circuit, which is connected to the signal amplification and processing module and the signal judgment and output module, is used to receive the amplified and processed signal transmitted by the signal amplification and processing module, then shapes the signal, and transmits the shaped signal to the signal judgment and output module; The output part includes: A signal judgment and output module, which is connected to the anti-interference module and the output protection module, is used to receive the shaped signal transmitted by the shaping circuit, then judge the signal, and output the judged signal; An anti-interference module, which is connected to the signal judgment and output module and is used to provide anti-interference for the signal judgment and output module; An output protection module, which together with the signal judgment and output module, is used to provide output protection for the signal judgment and output module; The anti-interference modules of the oscillation part and the output part are two independent modules. The anti-interference module and the temperature compensation module act on the LC oscillation module, and the anti-interference module and the output protection module act on the signal judgment and output module.

2. The ultra-low temperature resistant and anti-interference proximity inductive sensor according to claim 1, characterized in that: The detection coil is a sensing sensitive element, and the detection coil is close to the detected object to sense the detected object.

3. The ultra-low temperature resistant and anti-interference proximity inductive sensor according to claim 1, characterized in that: When a metal object approaches the detection coil, the metal object generates eddy currents and absorbs the oscillation energy, causing the oscillation to weaken until it stops. The two states of oscillation and stop are converted into switch signal outputs by the detection circuit, thereby utilizing the eddy current to sense the approach of the object and utilizing the sensitive characteristics of the displacement sensor to the approaching object to achieve the purpose of identifying the approaching object and outputting a switch signal.

4. A manufacturing process for the ultra-low temperature resistant and anti-interference proximity inductive sensor according to any one of claims 1 to 3, characterized in that: The manufacturing process steps are as follows: S1. Add an anti-interference module to the oscillation part and the output part, and the anti-interference module passes the electromagnetic compatibility test; S2. In terms of component selection, electronic components that can work normally in low temperature environments should be selected to replace components used in ordinary circuit boards; S3, the coil soldering point and its surroundings are filled with silicone to ensure that the coil soldering point will not be affected by the glue; S4. Wrap the circuit board before pouring glue so that there is no large-area contact between the components on the circuit board and the glue, and the circuit board will not be forcibly shifted by the glue during rapid temperature changes.

5. The manufacturing process according to claim 4, characterized in that: The electromagnetic compatibility test in S1 includes surge and transient anti-interference tests.

6. The manufacturing process according to claim 4, characterized in that: The low temperature is -60°C.

7. The manufacturing process according to claim 4, characterized in that: The wrapping treatment is to wrap raw tape on the circuit board to isolate the circuit board from the glue.

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