Slide slot and graphite slide tray

Abstract

The application provides a wafer slot and a graphite wafer tray, and relates to the technical field of semiconductor chip manufacturing. The wafer slot comprises a bearing structure for bearing a wafer, a limiting structure connected with the bearing structure through a positioning structure, the limiting structure being used for limiting the wafer, a height adjusting structure between the bearing structure and the limiting structure, the height adjusting structure being configured to adjust the height of the limiting structure relative to the bearing structure by rotating the limiting structure relative to the bearing structure, and the positioning structure cooperating with the height adjusting structure to fix the bearing structure and the limiting structure. By adjusting the height of the limiting structure relative to the bearing structure, the surface of the wafer loaded into the wafer slot is basically at the same height as the surface of the wafer slot (i.e. the surface of the limiting structure), thereby meeting the requirement that the depth of the wafer slot matches wafers of different thicknesses, avoiding the inconsistency of the surface height of the wafer and the wafer slot, and improving the performance of the wafer and the product yield.

Description

Technical Field

[0001] This application relates to the field of semiconductor chip manufacturing technology, specifically to a wafer slot and a graphite wafer carrier. Background Technology

[0002] The slots in existing graphite wafer carriers are designed specifically for the wafers they support, and the depth of the slots is a fixed value determined by the thickness of the wafers they support. When the slots need to support wafers of other thicknesses, a mismatch occurs between the wafer thickness and the surface height of the slot, causing instability in the process and consequently affecting wafer performance and product yield. Summary of the Invention

[0003] In view of this, embodiments of this application provide a wafer groove and a graphite wafer carrier disk, which solves the problem that the depth of the wafer groove cannot be matched with wafers of different thicknesses.

[0004] An embodiment of this application provides a wafer slot, comprising: a support structure for supporting a wafer; a limiting structure connected to the support structure via a positioning structure, the limiting structure being used to limit the wafer position; a height adjustment structure located between the support structure and the limiting structure, the height adjustment structure being configured to adjust the height of the limiting structure relative to the support structure by rotating the relative angle between the limiting structure and the support structure; and a positioning structure cooperating with the height adjustment structure to fix the support structure and the limiting structure.

[0005] In one embodiment of this application, the height adjustment structure includes: at least one set of first protrusions disposed on the limiting structure; and at least one set of second protrusions disposed on the bearing structure and adapted to cooperate with the at least one set of first protrusions; wherein, as the relative angle between the limiting structure and the bearing structure is rotated, the first protrusions in the at least one set of first protrusions and the corresponding second protrusions in the at least one set of second protrusions abut each other to form a height difference of different heights.

[0006] In one embodiment of this application, the number of all second protrusions included in at least one group of second protrusions is an integer multiple of the number of all first protrusions included in at least one group of first protrusions, and all first protrusions have the same height; all second protrusions are arranged in an array, and the second protrusions in the same group have the same height, while the second protrusions in different groups have different heights.

[0007] In one embodiment of this application, the maximum height of the second protrusion is less than the sum of the minimum height of the second protrusion and the height of the first protrusion.

[0008] In one embodiment of this application, the number of all first protrusions included in at least one group of first protrusions is an integer multiple of the number of all second protrusions included in at least one group of second protrusions, and all second protrusions have the same height; all first protrusions are arranged in an array, and the first protrusions in the same group have the same height, while the first protrusions in different groups have different heights.

[0009] In one embodiment of this application, the maximum height of the first protrusion is less than the sum of the minimum height of the first protrusion and the height of the second protrusion.

[0010] In one embodiment of this application, the height adjustment structure includes: at least one set of first grooves disposed on the limiting structure; and at least one set of third protrusions disposed on the bearing structure and adapted to cooperate with the at least one set of first grooves; the number of all the first grooves included in the at least one set of first grooves is an integer multiple of the number of all the third protrusions included in the at least one set of third protrusions, and all the third protrusions have the same height; all the first grooves are arranged in an array, and the depth of the first grooves in the same group is the same, while the depth of the first grooves in different groups is different.

[0011] In one embodiment of this application, the height of the third protrusion is greater than the maximum depth of the first groove.

[0012] In one embodiment of this application, the positioning structure includes: a set of second grooves formed on the limiting structure; a plurality of third grooves formed on the bearing structure and adapted to the set of second grooves; and a pin structure inserted into a set of third grooves among the set of second grooves and the plurality of third grooves for fixing the limiting structure and the bearing structure.

[0013] In one embodiment of this application, the number of all third grooves included in multiple sets of third grooves is an integer multiple of the number of all second grooves included in a set of second grooves.

[0014] In one embodiment of this application, the height of the first protrusion in the superposition direction of the limiting structure and the bearing structure is less than the height of the bearing disk.

[0015] In one embodiment of this application, the limiting structure includes an annular structure disposed corresponding to the edge of the bearing structure.

[0016] According to another aspect of this application, embodiments of this application provide a graphite substrate disk including the substrate groove as described in any of the above embodiments.

[0017] This application provides a wafer slot and a graphite wafer carrier. The wafer slot is provided with a support structure and a limiting structure. By setting a height adjustment structure between the support structure and the limiting structure, the height adjustment structure can adjust the height of the limiting structure relative to the support structure during the rotation of the relative angle between the limiting structure and the support structure. The positioning structure works in conjunction with the height adjustment structure to fix the support structure and the limiting structure, ensuring that the surface of the wafer loaded into the wafer slot is basically at the same height as the surface of the wafer slot (i.e., the surface of the limiting structure). This satisfies the requirement that the depth of the wafer slot matches wafers of different thicknesses, avoids instability in the process caused by inconsistent surface heights between the wafer and the wafer slot, and improves wafer performance and product yield. Attached Figure Description

[0018] Figure 1 The diagram shown is a schematic representation of a slot structure according to an embodiment of this application.

[0019] Figure 2 (a) shows a schematic diagram of a limiting structure provided in an embodiment of this application;

[0020] Figure 2 (b) is a schematic diagram of the load-bearing structure provided in an embodiment of this application;

[0021] Figure 3 (a) shows a schematic diagram of a limiting structure provided in another embodiment of this application;

[0022] Figure 3 (b) is a schematic diagram of the load-bearing structure provided in another embodiment of this application;

[0023] Figure 4 (a) shows a schematic diagram of a limiting structure provided in another embodiment of this application;

[0024] Figure 4 (b) is a schematic diagram of the load-bearing structure provided in another embodiment of this application;

[0025] Figure 5 (a) shows a schematic diagram of a limiting structure provided in another embodiment of this application;

[0026] Figure 5 (b) is a schematic diagram of the load-bearing structure provided in another embodiment of this application;

[0027] Figure 6 The image shown is a front view of a slot provided in another embodiment of this application;

[0028] Figure 7 The image shown is an embodiment provided by this application. Figure 1 Enlarged view of section A in the middle;

[0029] Figure 8 The image shown is a top view of a slot provided in another embodiment of this application. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0031] Figure 1 The diagram shown is a structural schematic of a slot provided in an embodiment of this application. Figure 1 As shown, the wafer slot 1 includes a support structure 2, a height adjustment structure 3, a limiting structure 4, and a positioning structure 5. The support structure 2 supports the wafer. The limiting structure 4 is connected to the support structure 2 via the positioning structure 5, and is used to limit the wafer's position. The height adjustment structure 3 is located between the support structure 2 and the limiting structure 4. The height adjustment structure 3 is configured to adjust the height of the limiting structure 4 relative to the support structure 2 by rotating the relative angle between the limiting structure 4 and the support structure 2. The positioning structure 5 cooperates with the height adjustment structure 3 to fix the support structure 2 and the limiting structure 4.

[0032] Specifically, the wafer slot 1 includes a main support portion and a side portion. The main support portion can be a cylindrical support structure 2, and the side portion is a limiting structure 4. The wafer slot 1 formed by the combination of the limiting structure 4 and the support structure 2 is disk-shaped, which facilitates the placement of wafers. The area of ​​the wafer slot 1 is larger than the area of ​​the wafer, ensuring that the wafer can be placed within the wafer slot 1. The support structure 2 and the limiting structure 4 are relatively positioned by a positioning structure 5, keeping them stable. When a wafer of a certain thickness is placed on the support structure 2, even if the wafer slot 1 is rotating at high speed, the support structure 2 and the limiting structure 4 can cooperate to limit the wafer, keeping it within the wafer slot 1 and preventing it from being thrown out. In addition, a height adjustment structure 3 is provided at the junction of the support structure 2 and the limiting structure 4 to adjust the height of the limiting structure 4, making the distance between the limiting structure 4 and the support structure 2 adjustable. When the relative angle between the rotation limiting structure 4 and the support structure 2 changes, the height adjustment structure 3 adjusts the height of the limiting structure 4 relative to the support structure 2, creating different height differences between them. This ensures that the surface of the wafer loaded into the wafer slot 1 is essentially at the same height as the surface of the wafer slot 1 (i.e., the surface of the limiting structure 4), thus meeting the requirement that the depth of the wafer slot 1 matches wafers of different thicknesses. The height adjustment structure 3 and the positioning structure 5 work together to ensure the stability of the process, improve wafer performance, and increase product yield.

[0033] For example, the height adjustment structure 3 can adjust the height to three ranges, including a first height, a second height, and a third height. The first height corresponds to a wafer of a first thickness, the second height corresponds to a wafer of a second thickness, and the third height corresponds to a wafer of a third thickness. When the supporting structure 2 remains stationary and the limiting structure 4 is rotated relative to it, a certain relative angle corresponds to a certain height. When the relative rotation angle is 120°, the height adjustment structure 3 corresponds to the first height, and a first height difference is formed between the supporting structure 2 and the limiting structure 4 to meet the requirement of placing a wafer of the first thickness in the wafer slot 1. Similarly, when the relative rotation angle is 240°, the height adjustment structure 3 corresponds to the second height, and a second height difference is formed between the supporting structure 2 and the limiting structure 4 to meet the requirement of placing a wafer of the second thickness in the wafer slot 1. When the relative rotation angle is 360°, the height adjustment structure 3 corresponds to the third height, and a third height difference is formed between the supporting structure 2 and the limiting structure 4 to meet the requirement of placing a wafer of the third thickness in the wafer slot 1. For each height formed by the supporting structure 2 and the limiting structure 4, the positioning structure 5 can position and fix the supporting structure 2 and the limiting structure 4. In other embodiments of this application, the height adjustment structure 3 can also adjust the height to multiple ranges, and this application does not impose specific limitations on this.

[0034] Figure 2(a) shows a schematic diagram of a limiting structure provided in an embodiment of this application. Figure 2 As shown in (a), the height adjustment structure 3 includes at least one set of first protrusions 30 disposed on the limiting structure 4. Figure 2 (b) shows a schematic diagram of a load-bearing structure provided in an embodiment of this application. Figure 2 As shown in (b), at least one set of second protrusions 31 are disposed on the bearing structure 2 and cooperate with at least one set of first protrusions 30. Wherein, with the relative angle between the rotation limiting structure 4 and the bearing structure 2, the first protrusions 30 in the at least one set of first protrusions 30 and the corresponding second protrusions 31 in the at least one set of second protrusions 31 abut against each other to form a height difference of different heights.

[0035] For example, such as Figure 2 As shown in (a), a set of first protrusions 30 is provided on the lower surface of the limiting structure 4, and the set of first protrusions 30 includes multiple first protrusions 30. The lower surface of the limiting structure 4 is the surface closest to the supporting structure 2. The shape of the first protrusions 30 can be a hemispherical protrusion, and the multiple first protrusions 30 can be arranged at equal intervals. Figure 2 As shown in (b), multiple sets of second protrusions 31 are provided on the upper surface of the bearing structure 2, and the multiple sets of second protrusions 31 include multiple second protrusions 31. The upper surface of the bearing structure 2 is the surface closest to the limiting structure 4. The shape of the second protrusions 31 can be cuboid, and the multiple second protrusions 31 can also be arranged at equal intervals. A set of first protrusions 30 all have the same height, and multiple sets of second protrusions 31 can form multiple heights, with one height corresponding to one set of second protrusions 31, and each set of second protrusions 31 corresponding to one set of first protrusions 30. As the relative angle between the limiting structure 4 and the bearing structure 2 rotates, the first protrusions 30 also rotate with the limiting structure 4. After each rotation of a certain angle, a set of first protrusions 30 can abut against the corresponding set of second protrusions 31, creating a certain height between the limiting structure 4 and the bearing structure 2, thus achieving the purpose of adjusting the height of the limiting structure 4 relative to the bearing structure 2.

[0036] Figure 3 (a) shows a schematic diagram of a limiting structure provided in another embodiment of this application. Figure 3 As shown in (a), the lower surface of the limiting structure 4 is provided with multiple sets of first protrusions 30, which include multiple first protrusions 30. Figure 3 (b) shows a schematic diagram of a load-bearing structure provided in another embodiment of this application. Figure 3As shown in (b), a set of second protrusions 31 is provided on the upper surface of the bearing structure 2. The set of second protrusions 31 includes multiple second protrusions 31. The height of the set of second protrusions 31 is the same. Multiple sets of first protrusions 30 can form multiple heights, with one height corresponding to one set of first protrusions 30. Each set of first protrusions 30 corresponds to one set of second protrusions 31. As the relative angle between the rotation limiting structure 4 and the bearing structure 2 changes, the first protrusions 30 also rotate with the limiting structure 4. After each rotation of a certain angle, a set of first protrusions 30 of the same height can abut against the second protrusions 31, so that a certain height is formed between the limiting structure 4 and the bearing structure 2, thereby adjusting the height of the limiting structure 4 relative to the bearing structure 2.

[0037] It should be understood that this application does not impose specific restrictions on the number, height, and shape of the first protrusion 30 and the second protrusion 31, as long as the first protrusion 30 and the corresponding second protrusion 31 abut against each other to form a height difference with varying heights as the relative angle between the rotation limiting structure 4 and the bearing structure 2 changes.

[0038] In one embodiment of this application, the number of all second protrusions 31 included in at least one group of second protrusions 31 is an integer multiple of the number of all first protrusions 30 included in at least one group of first protrusions 30, and all first protrusions 30 have the same height; all second protrusions 31 are arranged in an array, and the second protrusions 31 in the same group have the same height, while the second protrusions 31 in different groups have different heights.

[0039] For example, such as Figure 2 As shown in (a), the limiting structure 4 is provided with a set of first protrusions 30. The set of first protrusions 30 includes three first protrusions 30, all of the same height. The three first protrusions 30 are arranged at equal intervals on the lower surface of the limiting structure 4, and the angle between two adjacent first protrusions 30 and the center of the bearing structure 2 is 120°. Figure 2As shown in (b), the upper surface of the supporting structure 2 is provided with 12 second protrusions 31. Each group consists of three second protrusions 31 spaced apart, and the 12 second protrusions 31 are divided into four groups. Each group includes three second protrusions 31 of the same height. The heights of the groups differ, while the heights of the second protrusions 31 within the same group are identical. That is, the heights of the second protrusions 31 spaced apart are the same, while the heights of adjacent second protrusions 31 differ. The second protrusions 31 are arranged in an array, forming four groups of different heights. As the relative angle between the rotation limiting structure 4 and the supporting structure 2 changes, the three first protrusions 30 also rotate with the limiting structure 4. Every 30° rotation of the limiting structure 4, the three first protrusions 30 can abut against their corresponding group of second protrusions 31 of the same height, creating a certain height between the limiting structure 4 and the supporting structure 2. As the relative angle between the limiting structure 4 and the supporting structure 2 changes, different height differences are formed between the limiting structure 4 and the supporting structure 2, ensuring that the surface of the wafer loaded into the wafer slot 1 is basically at the same height as the surface of the wafer slot 1, thereby meeting the requirement that the depth of the wafer slot 1 matches wafers of different thicknesses.

[0040] In other embodiments, the number of second protrusions 31 can be two times, four times, or more than the number of first protrusions 30. This is as long as the number of second protrusions 31 is an integer multiple of the number of first protrusions 30.

[0041] In one embodiment of this application, the maximum height of the first protrusion 30 is less than the sum of the minimum height of the first protrusion 30 and the height of the second protrusion 31.

[0042] Specifically, such as Figure 3 As shown in (a) and 3(b), the limiting structure 4 is provided with multiple sets of first protrusions 30, and the heights of the first protrusions 30 in different sets are different, while the heights of the first protrusions 30 in the same set are the same. The supporting structure 2 is provided with a set of second protrusions 31 of the same height. The superposition direction of the limiting structure 4 and the supporting structure 2 is vertical. In the vertical direction, the maximum height of the first protrusion 30 is less than the sum of the minimum height of the first protrusion 30 and the height of the second protrusion 31. When the second protrusions 31 of the same height on the supporting structure 2 abut against the first protrusion 30 of the minimum height on the limiting structure 4, a height difference is formed between the supporting structure 2 and the limiting structure 4. The maximum height of the first protrusions 30 on the limiting structure 4 is lower than the height difference, so the first protrusion 30 of the maximum height will not prevent the first protrusions 30 of other heights from abutting against the second protrusion 31. This ensures that the first protrusions 30 of each set of heights on the limiting structure 4 can abut against the second protrusions 31 on the supporting structure 2, thereby achieving the purpose of adjusting the height of the limiting structure 4 relative to the supporting structure 2.

[0043] In one embodiment of this application, the number of all first protrusions 30 included in at least one group of first protrusions 30 is an integer multiple of the number of all second protrusions 31 included in at least one group of second protrusions 31, and all second protrusions 31 have the same height; all first protrusions 30 are arranged in an array, and the height of first protrusions 30 in the same group is the same, while the height of first protrusions 30 in different groups is different.

[0044] For example, such as Figure 3 As shown in (a), the limiting structure 4 is provided with 12 first protrusions 30, arranged in groups of three, with the 12 first protrusions 30 divided into four groups. Each group includes three first protrusions 30 of the same height. The heights of the groups of first protrusions 30 differ, while the heights of the first protrusions 30 within the same group are all the same. That is, the heights of the first protrusions 30 are the same every three, while the heights of adjacent first protrusions 30 differ. The first protrusions 30 are arranged in an array, forming four groups of different heights. Figure 3 As shown in (b), a set of second protrusions 31 is provided on the support structure 2. The set of second protrusions 31 includes three second protrusions 31, which are equally spaced on the upper surface of the support structure 2. The included angle between two adjacent second protrusions 31 and the center of the support structure 2 is 120°. As the relative angle between the rotation limiting structure 4 and the support structure 2 changes, for every 30° rotation of the limiting structure 4, the three second protrusions 31 can abut against their corresponding set of first protrusions 30, so that a certain height is formed between the limiting structure 4 and the support structure 2. This achieves the purpose of adjusting the depth of the wafer slot 1, ensuring that the surface of the wafer loaded into the wafer slot 1 is basically at the same height as the surface of the wafer slot 1, thereby meeting the requirement that the depth of the wafer slot 1 matches wafers of different thicknesses.

[0045] Figure 4 (a) shows a schematic diagram of the limiting structure provided in another embodiment of this application. Figure 4 (b) shows a schematic diagram of a load-bearing structure provided in another embodiment of this application. Figure 4 As shown in (a) and 4(b), the height adjustment structure includes: at least one set of first grooves 6 disposed on the limiting structure 4; and at least one set of third protrusions 32 disposed on the bearing structure 2 and adapted to cooperate with at least one set of first grooves 6; the number of all first grooves 6 included in at least one set of first grooves 6 is an integer multiple of the number of all third protrusions 32 included in at least one set of third protrusions 32, and all third protrusions 32 have the same height; all first grooves 6 are arranged in an array, and the depth of the first grooves 6 in the same group is the same, while the depth of the first grooves 6 in different groups is different.

[0046] Specifically, as the relative angle between the rotation limiting structure 4 and the supporting structure 2 changes, at least one set of first grooves 6 also rotates with the limiting structure 4. One set of first grooves 6 with the same depth can abut against the third protrusion 32, creating a certain height between the limiting structure 4 and the supporting structure 2. As the relative angle between the limiting structure 4 and the supporting structure 2 changes, different height differences are formed between the limiting structure 4 and the supporting structure 2, ensuring that the surface of the wafer loaded into the wafer slot 1 is basically at the same height as the surface of the wafer slot 1, thereby meeting the requirement that the depth of the wafer slot 1 matches wafers of different thicknesses.

[0047] In one embodiment of this application, the height of the third protrusion 32 is greater than the maximum depth of the first groove 6.

[0048] Specifically, the limiting structure 4 is provided with multiple sets of first grooves 6, and the depths of the first grooves 6 in different sets are different, while the depths of the first grooves 6 in the same set are the same. The bearing structure 2 is provided with multiple sets of third protrusions 32 of the same height. That is, the heights of the third protrusions 32 on the bearing structure 2 are uniformly distributed. The depths of the first grooves 6 on the limiting structure 4 are periodically distributed. In the vertical direction, the height of the third protrusion 32 is greater than the maximum depth of the first groove 6, thereby ensuring that the third protrusion 32 can abut against the first grooves 6 of different depths, so as to adjust the height of the limiting structure 4 relative to the bearing structure 2.

[0049] Figure 5 (a) shows a schematic diagram of the limiting structure provided in another embodiment of this application. Figure 5 (b) shows a schematic diagram of the load-bearing structure provided in another embodiment of this application. Figure 6 The image shown is a front view of a slot provided in another embodiment of this application. Figure 5 (a), 5(b) and Figure 6 As shown, the positioning structure 5 includes: a set of second grooves 50 formed on the limiting structure 4; multiple sets of third grooves 51 formed on the bearing structure 2 and adapted to the set of second grooves 50; and a pin structure 53. The pin structure 53 is inserted into one set of third grooves 51 among the set of second grooves 50 and multiple sets of third grooves 51 to fix the limiting structure 4 and the bearing structure 2.

[0050] Specifically, each of the sets of second grooves 50 and multiple sets of third grooves 51 is compatible. During the rotation of the relative angle between the limiting structure 4 and the bearing structure 2, each time the limiting structure 4 rotates by a certain angle, a set of first protrusions 30 and a set of second protrusions 31 abut against each other, forming a certain height difference. At this time, the second grooves 50 and third grooves 51 correspondingly form a space to accommodate the pin structure 53. The shape and size of the pin structure 53 match those of the second grooves 50 and the third grooves 51. When the first protrusions 30 and the second protrusions 31 abut against each other to form a height difference, the pin structure 53 is inserted into the space formed by the matching set of second grooves 50 and multiple sets of third grooves 51, locking and fixing the limiting structure 4 and the bearing structure 2, making the connection between the limiting structure 4 and the bearing structure 2 more stable and less prone to loosening under external forces, vibrations, etc.

[0051] It should be understood that the second groove 50 and the third groove 51 can also be configured as multiple sets. This application does not impose a specific limitation on the number of sets of the second groove 50 and the third groove 51, as long as the second groove 50 and the third groove 51 are compatible.

[0052] It should be understood that the pin structure 53 can be a cylindrical fastening pin or a "T"-shaped fastening pin. This application does not limit the specific shape of the pin structure 53, as long as it can fix the limiting structure 4 and the load-bearing structure 2.

[0053] In other embodiments, the material of the pin structure 53 may include graphite, silicon carbide, quartz, or a combination of one or more of various ceramic materials. This application does not limit the specific material of the pin structure 53, as long as it can securely fix the limiting structure 4 and the load-bearing structure 2.

[0054] In one embodiment of this application, the number of all third grooves 51 included in the plurality of third grooves 51 is an integer multiple of the number of all second grooves 50 included in a group of second grooves 50.

[0055] For example, such as Figure 5 As shown in (a), the limiting structure 4 is provided with a set of second grooves 50, the number of which is 3, and the included angle between adjacent second grooves 50 and the center of the bearing structure 2 is 120°. Figure 5As shown in (b), the supporting structure 2 is provided with four sets of third grooves 51, with three third grooves 51 spaced apart in each set, and each set containing three third grooves 51. Each set of second grooves 50 is matched with each set of third grooves 51. During the rotation of the relative angle between the limiting structure 4 and the supporting structure 2, each set of second grooves 50 rotates a certain angle accordingly. When a set of first protrusions 30 and a set of second protrusions 31 abut against each other, forming a certain height difference, the second grooves 50 on the limiting structure 4 will correspond to one of the sets of third grooves 51 on the supporting structure 2 to form a receiving space to accommodate the pin structure 53. By setting the number of all third grooves 51 to an integer multiple of the number of all second grooves 50, when the relative angle between the limiting structure 4 and the supporting structure 2 is rotated, the second grooves 50 will always correspond to the third grooves 51, and simultaneously cooperate with the pin structure 53, facilitating the positioning of the limiting structure 4 and the supporting structure 2.

[0056] Figure 7 The image shown is an embodiment provided by this application. Figure 1 A magnified view of part A in the middle. (Combined with...) Figure 1 and Figure 7 As shown, the support structure 2 includes a support disk 20 and a support base 21 connected to the support disk 20. The support disk 20 is used to support the wafer; the support base 21 is used to support the support disk 20.

[0057] Specifically, the carrier disk 20 is a disc with a certain height, fixed on the carrier base 21. A wafer is placed on the upper surface of the carrier disk 20, and a third groove 51 is provided at the edge of the carrier disk 20. The carrier base 21 is cylindrical, and its area is larger than that of the carrier disk 20. A second protrusion 31 is fixedly installed on the carrier base 21. The carrier disk 20 and the carrier base 21 cooperate to form the carrier structure 2, facilitating the placement of the wafer.

[0058] It should be understood that the connection between the bearing plate 20 and the bearing base 21 can be welded or threaded. This application does not limit the specific connection form between the bearing plate 20 and the bearing base 21, as long as a fixed connection between the bearing plate 20 and the bearing base 21 is achieved.

[0059] In one embodiment of this application, as Figure 7 As shown, the maximum height of the second protrusion 31 is less than the sum of the minimum height of the second protrusion 31 and the height d of the first protrusion 30.

[0060] Specifically, in combination Figure 1 and Figure 7As shown, the limiting structure 4 has a set of first protrusions 30 of the same height, and the supporting structure 2 has multiple sets of second protrusions 31, with different heights for different sets of second protrusions 31, and the same height for second protrusions 31 within the same set. The superposition direction of the limiting structure 4 and the supporting structure 2 is vertical. In the vertical direction, the maximum height of the second protrusion 31 is less than the sum of the minimum height of the second protrusion 31 and the height d of the first protrusion 30. When the second protrusion 31 of the minimum height on the supporting structure 2 abuts against the first protrusions 30 of the same height on the limiting structure 4, a height difference is formed between the supporting structure 2 and the limiting structure 4. The maximum height of the second protrusion 31 on the supporting structure 2 is lower than the height difference, so the second protrusion 31 of the maximum height will not prevent the second protrusions 31 of other heights from abutting against the first protrusions 30, ensuring that each set of second protrusions 31 of height on the supporting structure 2 can abut against the first protrusions 30 on the limiting structure 4, thereby achieving the purpose of adjusting the height of the limiting structure 4 relative to the supporting structure 2.

[0061] In another embodiment of this application, the second groove 50 is disposed on the limiting structure 4 near the first protrusion 30, and the third groove 51 is disposed on the bearing structure 2 near the second protrusion 31.

[0062] Combination Figure 1 and Figure 7 As shown, the lower surface of the limiting structure 4 is provided with multiple first protrusions 30, and multiple second grooves 50 are provided through the limiting structure 4, each second groove 50 being located close to a first protrusion 30. The upper surface of the bearing structure 2 is provided with multiple second protrusions 31, and multiple third grooves 51 are provided on the bearing structure 2, each third groove 51 being located close to a second protrusion 31. As the relative angle between the limiting structure 4 and the bearing structure 2 is rotated, the first protrusions 30 and the second protrusions 31 abut against each other to form a height difference. The pin structure 53 is inserted into the second groove 50 near the first protrusion 30 and its corresponding third groove 51, realizing the relative positioning of the limiting structure 4 and the bearing structure 2, ensuring the stability of the wafer slot 1 during the process, and further improving the performance of the wafer and the product yield.

[0063] Figure 8 The image shown is a top view of a slot provided in another embodiment of this application. As... Figure 8 As shown, the limiting structure 4 includes an annular structure that corresponds to the edge of the bearing structure 2.

[0064] Specifically, such as Figure 1 and Figure 8As shown, the limiting structure 4 is an annular structure, located above the supporting structure 2 and correspondingly positioned along the edge of the supporting structure 2. The supporting structure 2 and the limiting structure 4 are vertically aligned to form a disc-shaped wafer groove 1. The center of the wafer groove 1 is used to support the wafer, and the annular structure at the edge is used to limit the wafer's position. Once the limiting structure 4 and the supporting structure 2 are fixed, it ensures that the wafer groove 1 supports the wafer while preventing it from slipping out during rotation, increasing the stability of the process and further improving wafer performance and product yield.

[0065] It should be understood that the limiting structure 4 can be a graphite ring or a ring structure of other materials. This application does not impose specific restrictions on the material of the limiting structure 4, as long as it is a ring structure corresponding to the edge of the load-bearing structure 2.

[0066] Embodiments of this application provide a graphite wafer carrier disk, including wafer slots 1 as described in any of the above embodiments. The graphite wafer carrier disk includes one or more wafer slots 1 for carrying wafers. The height of the wafer slot 1 is adjusted according to the thickness of the wafer it is intended to carry, to accommodate wafers of different thicknesses, further improving the applicability of the graphite wafer carrier disk.

[0067] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, the features that define "first" and "second" may explicitly or implicitly include at least one of those features.

[0068] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A sheet slot, characterized by, include: Support structure, used to support wafers; A limiting structure is connected to the supporting structure via a positioning structure, and the limiting structure is used to limit the position of the wafer. A height adjustment structure located between the support structure and the limiting structure is configured to adjust the height of the limiting structure relative to the support structure by rotating the relative angle between the limiting structure and the support structure, so that the surface of the wafer in the wafer slot is at the same height as the upper surface of the limiting structure; as well as The positioning structure, in conjunction with the height adjustment structure, is used to fix the load-bearing structure and the limiting structure.

2. The sheet tank according to claim 1, characterized by The height adjustment structure includes: At least one set of first protrusions disposed on the limiting structure; and At least one set of second protrusions disposed on the bearing structure and adapted to cooperate with the at least one set of first protrusions; As the relative angle between the limiting structure and the bearing structure is rotated, the first protrusion in the at least one set of first protrusions and the corresponding second protrusion in the at least one set of second protrusions abut each other to form a height difference of different heights.

3. The sheet tank according to claim 2, characterized by The number of all second protrusions included in the at least one group of second protrusions is an integer multiple of the number of all first protrusions included in the at least one group of first protrusions, and all the first protrusions have the same height; all the second protrusions are arranged in an array, and the second protrusions in the same group have the same height, while the second protrusions in different groups have different heights.

4. The sheet tank according to claim 3, characterized by The maximum height of the second protrusion is less than the sum of the minimum height of the second protrusion and the height of the first protrusion.

5. The sheet tank according to claim 2, wherein The number of all first protrusions included in the at least one group of first protrusions is an integer multiple of the number of all second protrusions included in the at least one group of second protrusions, and all the second protrusions have the same height; all the first protrusions are arranged in an array, and the first protrusions in the same group have the same height, while the first protrusions in different groups have different heights.

6. The sheet tank according to claim 5, characterized by The maximum height of the first protrusion is less than the sum of the minimum height of the first protrusion and the height of the second protrusion.

7. The sheet tank according to claim 1, wherein The height adjustment structure includes: at least one set of first grooves disposed on the limiting structure; and At least one set of third protrusions disposed on the bearing structure and adapted to mate with the at least one set of first grooves; the number of all first grooves included in the at least one set of first grooves is an integer multiple of the number of all third protrusions included in the at least one set of third protrusions, and all third protrusions have the same height; all first grooves are arranged in an array, and the depth of the first grooves in the same group is the same, while the depth of the first grooves in different groups is different.

8. The sheet tank according to claim 7, characterized by The height of the third protrusion is greater than the maximum depth of the first groove.

9. The sheet tank according to any one of claims 1 to 8, characterized by The positioning structure includes: A set of second grooves formed on the limiting structure; Multiple sets of third grooves adapted to the first set of second grooves are formed on the bearing structure; and A pin structure is inserted into one of the set of second grooves and the set of multiple sets of third grooves to fix the limiting structure and the bearing structure.

10. The sheet tank according to claim 9, characterized by The number of all third grooves included in the plurality of groups of third grooves is an integer multiple of the number of all second grooves included in the group of second grooves.

11. The sheet tank according to any one of claims 1 to 8, characterized by The limiting structure comprises a ring structure arranged corresponding to the edge of the bearing structure.

12. A graphite slide cassette characterized by, A sheet tank comprising the sheet tank according to any one of claims 1 to 11.

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