High-speed laser precision processing device and processing method thereof

Abstract

The present invention belongs to the field of laser cutting, and discloses a high-speed laser precision processing device and a processing method thereof, which include a base, a detection unit and a chamfering unit. The detection unit and the chamfering unit are installed on the base. A workpiece to be processed is cut on the base. After the cutting is completed, the smoothness is detected by the detection unit, and then the chamfering is performed by the chamfering unit to complete the processing of the workpiece to be processed.

Description

Technical Field

[0001] The present invention belongs to the field of laser cutting, and in particular relates to a high-speed laser precision processing device and a processing method thereof. Background Art

[0002] With the continuous development of current science and technology, laser cutting uses a focused high-power density laser beam to irradiate the workpiece, causing the irradiated material to quickly melt, vaporize or reach the ignition point, and at the same time uses a high-speed airflow coaxial with the beam to blow away the molten material, thereby achieving the cutting of the workpiece. It is one of the thermal cutting methods for cutting workpieces.

[0003] It is divided into four categories: laser vaporization cutting, laser melting cutting, laser oxygen cutting and laser scribing and controlled fracture.

[0004] A device is proposed for cutting a workpiece using a high-speed laser, and for detecting the smoothness and chamfering of the cut workpiece. Summary of the invention

[0005] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a high-speed laser precision processing device and a processing method thereof, which solves the problem in the prior art that a workpiece needs to be cut and then inspected and chamfered after cutting.

[0006] The purpose of this disclosure can be achieved through the following technical solutions:

[0007] A high-speed laser precision processing device is characterized in that it includes a base, a detection unit and a chamfering unit, the detection unit and the chamfering unit are installed on the base, the workpiece to be processed is cut on the base, and after cutting is completed, the smoothness is detected by the detection unit, and then chamfering is performed by the chamfering unit to complete the processing of the workpiece to be processed.

[0008] The cutting of the workpiece is completed through the base, the base includes a laser cutting machine, the laser cutting machine is installed on a workbench, the workbench is provided with a plurality of rollers, and the plurality of rollers are rotatably installed on the action table. A separation baffle is provided on the workbench.

[0009] The principle and effect of the above technical solution are as follows:

[0010] During processing, the workpiece is passed through the laser cutting machine to be cut. After cutting, the workpiece is divided into two pieces which are separated by a separation baffle and can be transferred downward by rollers.

[0011] The nouns, conjunctions or adjectives involved in the above technical solution are explained as follows:

[0012] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0013] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0014] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0015] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0016] Beneficial effects of the present disclosure:

[0017] The smoothness of the cut surface of the workpiece after laser cutting is tested to eliminate possible poor cutting during the laser cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 is a schematic diagram of the overall structure of an embodiment of the present disclosure;

[0020] Figure 2 is a schematic diagram of a partial structure of an embodiment of the present disclosure;

[0021] Figure 3 is a schematic diagram of a partial structure of an embodiment of the present disclosure;

[0022] Figure 4 is a schematic diagram of a partial structure of an embodiment of the present disclosure;

[0023] Figure 5 is a schematic diagram of a partial structure of an embodiment of the present disclosure; DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0025] like Figure 1-5 As shown, the device is a high-speed laser precision processing device and a processing method thereof, including a base 1, a detection unit 2 and a chamfering unit 3, the detection unit 2 and the chamfering unit 3 are installed on the base 1, the workpiece to be processed is cut on the base 1, and after cutting is completed, the smoothness is detected by the detection unit 2, and then chamfering is performed by the chamfering unit 3 to complete the processing of the workpiece to be processed.

[0026] The cutting of the workpiece is completed through the base 1, which includes a laser cutting machine 11, which is installed on a workbench 12, and a plurality of rollers 13 are arranged on the workbench 12, and the plurality of rollers 13 are rotatably installed on the action table. A separation baffle 14 is arranged on the workbench 12.

[0027] During processing, the workpiece is passed through the laser cutting machine 11 to be cut. After the workpiece is cut, it is divided into two pieces which are separated by the separation baffle 14 and can be transported downwards through the roller 13 .

[0028] When the workpiece is cut, the smoothness of the cut surface is inspected. The inspection unit 2 includes a moving component 21 and a detection component 22. The moving component 21 and the detection component 22 are divided into two groups, which are respectively arranged on both sides of the separation baffle 14.

[0029] The moving assembly 21 includes a card plate 211, and the card plate 211 is installed on the telescopic rod of the telescopic cylinder 212, and the telescopic cylinder 212 is installed on the moving frame 213, and the moving frame 213 is penetrated by a first threaded rod 214, and the moving frame 213 is threadedly connected with the first threaded rod 214, and one end of the threaded rod is rotatably connected to the workbench 12, and the other end is fixedly connected to the output shaft of the first motor 215, and the first motor 215 is installed on the workbench 12. The moving frame 213 is also penetrated by a first limiting rod 216, and the first limiting rod 216 is fixedly installed on the workbench 12.

[0030] The detection assembly 22, each group of detection assembly 22 includes a plurality of detection wheels 221, each of which is rotatably connected to each other by a rotating shaft 222, and a connecting frame 223 is hinged at both ends of the rotating shaft 222, and the two connecting frames 223 on the one rotating shaft 222 are hinged to a first connecting rod 224, and the first connecting rod 224 is connected to a second connecting rod 225 in the middle, and the second connecting rod 225 is hinged at one end away from the first connecting rod 224 to the end of a third connecting rod 226, and the other end of the third connecting rod 226 is hinged to another second connecting rod 225, and the middle of the third connecting rod 226 is rotatably connected to the separation baffle 14 through a fixed shaft 227, and the ends of the connecting frame 223 and the third connecting rod 226 are both provided with a spring, and the other end of the spring is connected to a pressure sensor. The detection assembly 22 is installed inside the separation baffle 14.

[0031] In actual use, when the workpiece is cut, the telescopic cylinder 212 is started, the telescopic rod of the telescopic cylinder 212 is extended, and the workpiece is attached to the separation baffle 14 through the clamping plate 211. The first motor 215 is started, and the first motor 215 drives the first threaded rod 214 to rotate, so that the movable frame 213 threadedly connected to the threaded rod moves, thereby moving the workpiece to fit the separation baffle 14 through the clamping plate 211 to perform smoothness detection.

[0032] When the workpiece moves over the detection component 22, the detection wheel 221 rotates, the springs on the connecting frame 223 and the third connecting rod 226 are deformed, and the pressure sensors connected to the springs are subjected to pressure. If the cross-section of the workpiece is smooth, the pressures on all pressure sensors remain consistent. If the surface of the workpiece is not smooth, the detection wheel 221 at the rough position will move abnormally during the process of the workpiece passing through the detection component 22, causing the connecting frame 223 to rotate. When the rough area is large, the third connecting rod 226 will also rotate, causing the spring at the rough position to deform abnormally different from other springs. The pressure sensor is subjected to abnormal pressure, thereby detecting the smoothness of the cut surface of the workpiece, and can roughly detect the position and size range of the rough area.

[0033] When the workpiece is finished being inspected, it is necessary to chamfer the cut surface of the workpiece, and a chamfering unit 3 is provided. The chamfering unit 3 is divided into two groups, which are respectively provided on both sides of the separation baffle 14. The chamfering unit 3 includes a chamfering machine 31, which is installed on a rotating shaft 311, which is hinged on a chamfering frame 312, which is connected to the output shaft of a second motor 313 and driven by the second motor 313, which is installed on the chamfering frame 312, which is penetrated by a second threaded rod 314 and a second limiting rod 315, which are fixedly connected to a fixing frame 316 at both ends, and one end of the second threaded rod 314 is rotatably connected to the fixing frame 316, and the other end is fixedly connected to the output shaft of a third motor 317, which is installed on the fixing frame 316. The fixing frame 316 is installed on the top of the separation baffle 14.

[0034] In order to make the workpiece chamfering better, it is necessary to make the workpiece no longer fit the separation baffle 14, and a clamping block 32 is set above the separation baffle 14, and the clamping block 32 passes through a third threaded rod 321 and a third limiting rod 322, one end of the third threaded rod 321 is rotatably connected to the separation baffle 14, and the other end is connected to the output shaft of the fourth motor 323, and the fourth motor 323 is installed on the workbench 12, and one end of the third limiting rod 322 is fixedly connected to the separation baffle 14, and the other end is fixedly connected to the workbench 12.

[0035] When the workpiece passes the smoothness test, the moving assembly 21 moves the workpiece to the bottom of the chamfering machine 31, the fourth motor 323 starts, drives the clamping block 32 to clamp the workpiece, the telescopic rod of the telescopic cylinder 212 shortens, and the clamping block 32 cooperates with the clamping plate 211 to move the workpiece away from the separation baffle 14 to a position suitable for chamfering. The chamfering machine 31 starts and starts chamfering. Before chamfering, the second motor 313 starts to control the rotation of the rotating shaft 311 to control the angle of the chamfering machine 31. When chamfering starts, the third motor 317 starts to control the movement of the chamfering machine 31 to perform chamfering. After chamfering is completed, the clamping block 32 retreats, and the moving assembly 21 moves the workpiece out of the device.

[0036] During actual use, the workpiece is passed through the laser cutting machine 11 to be cut. After cutting, the workpiece is divided into two pieces and separated by the separation baffle 14, and can be transported downward by the roller 13. The telescopic cylinder 212 is started, and the telescopic rod of the telescopic cylinder 212 is extended. The workpiece is attached to the separation baffle 14 through the clamping plate 211. The first motor 215 is started, and the first motor 215 drives the first threaded rod 214 to rotate, so that the movable frame 213 threadedly connected to the threaded rod moves, thereby making the workpiece attached to the separation baffle 14 through the clamping plate 211 to carry out smoothness detection.

[0037] When the workpiece moves over the detection component 22, the detection wheel 221 rotates, the springs on the connecting frame 223 and the third connecting rod 226 are deformed, and the pressure sensors connected to the springs are subjected to pressure. If the cross-section of the workpiece is smooth, the pressures on all pressure sensors remain consistent. If the surface of the workpiece is not smooth, the detection wheel 221 at the rough position will move abnormally during the process of the workpiece passing through the detection component 22, causing the connecting frame 223 to rotate. When the rough area is large, the third connecting rod 226 will also rotate, causing the spring at the rough position to deform abnormally different from other springs. The pressure sensor is subjected to abnormal pressure, thereby detecting the smoothness of the cut surface of the workpiece, and can roughly detect the position and size range of the rough area.

[0038] When the workpiece passes the smoothness test, the moving assembly 21 moves the workpiece to the bottom of the chamfering machine 31, the fourth motor 323 starts, drives the clamping block 32 to clamp the workpiece, the telescopic rod of the telescopic cylinder 212 shortens, and the clamping block 32 cooperates with the clamping plate 211 to move the workpiece away from the separation baffle 14 to a position suitable for chamfering. The chamfering machine 31 starts and starts chamfering. Before chamfering, the second motor 313 starts to control the rotation of the rotating shaft 311 to control the angle of the chamfering machine 31. When chamfering starts, the third motor 317 starts to control the movement of the chamfering machine 31 to perform chamfering. After chamfering is completed, the clamping block 32 retreats, and the moving assembly 21 moves the workpiece out of the device.

[0039] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0040] The above shows and describes the basic principles, main features and advantages of the present disclosure. Those skilled in the art should understand that the present disclosure is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present disclosure. Without departing from the spirit and scope of the present disclosure, the present disclosure may have various changes and improvements, and these changes and improvements fall within the scope of the present disclosure to be protected.

Claims

1. A high-speed laser precision processing device, characterized in that: The invention comprises a base (1), a detection unit (2) and a chamfering unit (3), wherein the detection unit (2) and the chamfering unit (3) are mounted on the base (1), and the workpiece to be processed is cut on the base (1). After the cutting is completed, the smoothness is detected by the detection unit (2), and then the chamfering is performed by the chamfering unit (3), thereby completing the processing of the workpiece to be processed; The base (1) comprises a laser cutting machine (11), the laser cutting machine (11) is mounted on a workbench (12), a plurality of rollers (13) are arranged on the workbench (12), and the plurality of rollers (13) are rotatably mounted on the workbench (12); a separation baffle (14) is arranged on the workbench (12); The detection unit (2) comprises a moving component (21) and a detection component (22); the moving component (21) and the detection component (22) are divided into two groups, which are respectively arranged on both sides of the separation baffle (14); The moving assembly (21) comprises a card plate (211), the card plate (211) is mounted on the telescopic rod of the telescopic cylinder (212), the telescopic cylinder (212) is mounted on a moving frame (213), a first threaded rod (214) runs through the moving frame (213), the moving frame (213) is threadedly connected to the first threaded rod (214), one end of the first threaded rod (214) is rotatably connected to the workbench (12), and the other end is fixedly connected to the output shaft of the first motor (215), and the first motor (215) is mounted on the workbench (12); a first limiting rod (216) also runs through the moving frame (213), and the first limiting rod (216) is fixedly mounted on the workbench (12); Each detection assembly (22) includes a plurality of detection rotating wheels (221), and each two detection rotating wheels (221) are rotatably connected via a rotating shaft (222). A connecting frame (223) is hinged at each end of the rotating shaft (222). The two connecting frames (223) on one rotating shaft (222) are hinged together with a first connecting rod (224). The first connecting rod (224) is hinged in the middle to a second connecting rod (225), and the second connecting rod (225) is away from the first connecting rod (22 4) is hinged at one end of a third connecting rod (226), the other end of the third connecting rod (226) is hinged to another second connecting rod (225), the middle of the third connecting rod (226) is rotatably connected to the separation baffle (14) through a fixed shaft (227), the ends of the connecting frame (223) and the third connecting rod (226) are both provided with a spring, the other end of the spring is connected to a pressure sensor; the detection component (22) is installed inside the separation baffle (14).

2. A high-speed laser precision processing device according to claim 1, characterized in that: The chamfering unit (3) is divided into two groups, which are respectively arranged on both sides of the separation baffle (14). The chamfering unit (3) comprises a chamfering machine (31). The chamfering machine (31) is installed on a rotating shaft (311). The rotating shaft (311) is hinged on a chamfering frame (312). The rotating shaft (311) is connected to the output shaft of a second motor (313) and is driven by the second motor (313). The second motor (313) is installed on the chamfering frame (312). The angle bracket (312) is penetrated by a second threaded rod (314) and a second limiting rod (315); both ends of the second limiting rod (315) are fixedly connected to a fixing bracket (316); one end of the second threaded rod (314) is rotatably connected to the fixing bracket (316), and the other end is fixedly connected to an output shaft of a third motor (317); the third motor (317) is mounted on the fixing bracket (316); and the fixing bracket (316) is mounted on the top of the separation baffle (14).

3. A high-speed laser precision processing device according to claim 2, characterized in that: A clamping block (32) is arranged above the separation baffle (14); a third threaded rod (321) and a third limiting rod (322) are passed through the clamping block (32); one end of the third threaded rod (321) is rotatably connected to the separation baffle (14), and the other end is connected to the output shaft of a fourth motor (323); the fourth motor (323) is mounted on the workbench (12); one end of the third limiting rod (322) is fixedly connected to the separation baffle (14), and the other end is fixedly connected to the workbench (12).

4. A high-speed laser precision processing device according to claim 3, characterized in that: The equipment processes the workpiece, and the process is: The workpiece is cut by a laser cutting machine (11). The cut workpiece is divided into two pieces and separated by a separation baffle (14). The workpiece is transported downward by a roller (13). The telescopic cylinder (212) is started, and the telescopic rod of the telescopic cylinder (212) is extended. The workpiece is made to fit on the separation baffle (14) through the clamping plate (211). The first motor (215) is started, and the first motor (215) drives the first threaded rod (214) to rotate, so that the moving frame (213) threadedly connected to the first threaded rod (214) moves, thereby moving the workpiece to fit on the separation baffle (14) through the clamping plate (211) to perform a smoothness test. When the workpiece moves over the detection assembly (22), the detection wheel (221) rotates, the springs on the connecting frame (223) and the third connecting rod (226) are deformed, and the pressure sensors connected to the springs are subjected to pressure. If the cut surface of the workpiece is smooth, the pressures applied to all the pressure sensors remain consistent. If the surface of the workpiece is not smooth, the detection wheel (221) at the not smooth position will move abnormally during the process of the workpiece passing through the detection assembly (22), causing the connecting frame (223) to rotate. When the not smooth area is large, the third connecting rod (226) will also rotate, causing the spring at the not smooth position to deform abnormally from other springs, and the pressure sensor will be subjected to abnormal pressure, thereby detecting the smoothness of the cut surface of the workpiece, and being able to roughly detect the position and size range of the not smooth area. When the workpiece passes the smoothness test, the moving assembly (21) moves the workpiece to below the chamfering machine (31), the fourth motor (323) starts, drives the clamping block (32) to clamp the workpiece, the telescopic rod of the telescopic cylinder (212) shortens, the clamping block (32) cooperates with the clamping plate (211) to move the workpiece away from the separation baffle (14) to a position suitable for chamfering, and the chamfering machine (31) starts to start chamfering; before chamfering, the second motor (313) starts to control the rotation of the rotating shaft (311) to control the angle of the chamfering machine (31); when chamfering starts, the third motor (317) starts to control the movement of the chamfering machine (31) to perform chamfering; when chamfering is completed, the clamping block (32) retreats, and the moving assembly (21) moves the workpiece out of the device.

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