Filtering device

Abstract

The application belongs to the technical field of electrolytic copper foil and particularly relates to a filtering device for filtering copper foil electrolyte, which comprises a tank body, one end of the tank body being in communication with a liquid outlet of a foil production device, the other end being in communication with a dirty liquid tank for recovering electrolyte; a partition plate, which is arranged in the interior of the tank body and connected with the side wall of the tank body, and is provided with a through hole for the flow of copper foil electrolyte; and a deionization element, which is arranged in the tank body and on the partition plate, and has a cross-sectional area greater than that of the through hole, and can be in contact with the copper foil electrolyte entering the interior of the tank body to absorb impurity ions in the copper foil electrolyte. The deionization element in the filtering device filters and absorbs impurity ions in the copper foil electrolyte, thereby reducing the content of impurity ions in the copper foil electrolyte, ensuring the deposition rate of copper ions, reducing the power consumption of electrolytic copper foil, and ensuring the quality of the copper foil.

Description

Technical Field

[0001] This application belongs to the field of electrolytic copper foil technology, specifically relating to a filtration device. Background Technology

[0002] With the rapid development of electronic products, printed circuit boards (PCBs) are an indispensable part of electronic products as providers of electrical connections for electronic components. Copper foil is an important raw material for PCBs, and it accounts for 15% of the cost of PCB materials, making it a significant component.

[0003] The production of copper foil involves first dissolving copper in an electrolyte. Then, in the foil-forming equipment, the cathode roller continuously attracts copper ions from the electrolyte in the anode tank. These copper ions gain electrons in the electrolyte, becoming copper atoms that deposit on the surface of the rotating cathode roller to form copper foil. However, during the production of electrolytic copper foil, corrosion of raw materials (such as copper wire and sulfuric acid) or pipelines inevitably produces impurity ions such as iron and zinc. Excessively high concentrations of these impurity ions in the electrolyte negatively impact the quality of the copper foil. Summary of the Invention

[0004] The purpose of this application is to provide a filtration device that can effectively reduce the concentration of impurity ions in the electrolyte.

[0005] This application provides a filtration device for filtering copper foil electrolyte, comprising:

[0006] The tank has an inlet and an outlet. The inlet of the tank is connected to the liquid outlet of the foil production equipment, and the outlet of the tank is connected to the waste liquid tank for recovering electrolyte.

[0007] A partition is provided inside the tank, and the partition is provided with through holes for the copper foil electrolyte to flow through;

[0008] A deionizing element is disposed inside the tank and on the side of the partition near the inlet of the tank. The cross-sectional area of ​​the deionizing element is larger than the cross-sectional area of ​​the through hole. The deionizing element can contact the copper foil electrolyte entering the tank to absorb impurity ions in the copper foil electrolyte.

[0009] In one exemplary embodiment of this application, the tank body is provided with a plurality of partitions evenly spaced apart, and the deionizing element is disposed on the surface of the partition and located between adjacent partitions.

[0010] In one exemplary embodiment of this application, a plurality of deionizing elements are provided between adjacent partitions, and the deionizing elements cover the through holes.

[0011] In one exemplary embodiment of this application, a plurality of deionizing elements are provided between adjacent partitions, and the deionizing elements are staggered with the through holes.

[0012] In one exemplary embodiment of this application, the deionizing element is spherical, and the deionizing element is spherical and can roll on the partition under the action of the flow of the copper foil electrolyte.

[0013] In one exemplary embodiment of this application, the tank body has an opening on its side wall, and the partition plate overlaps the opening.

[0014] In one exemplary embodiment of this application, the can is cylindrical, and an annular opening is provided on the side wall of the can, the arc length of which is smaller than the circumference of the can.

[0015] In one exemplary embodiment of this application, the arc length of the opening is greater than 1 / 2 of the circumference of the tank and less than 3 / 4 of the circumference of the tank.

[0016] In one exemplary embodiment of this application, a plurality of through holes are arranged in an array along a first direction and a second direction on the partition, the first direction intersecting the second direction; and in the first direction, the ratio of the spacing between adjacent through holes to the opening width of the through holes ranges from 6 to 16.

[0017] In one exemplary embodiment of this application, the deionizing element comprises a chelating resin composed of a macroporous polystyrene crosslinked divinylbenzene network and sulfonic acid and phosphonic acid functional groups; or

[0018] The deionizing element comprises activated carbon and a chelating resin consisting of a macroporous polystyrene crosslinked divinylbenzene network and sulfonic acid and phosphonic acid functional groups.

[0019] The proposed solution has the following beneficial effects:

[0020] The present application includes a filtration device comprising a tank, a baffle plate, and a deionizing element. The tank is used to collect the copper foil electrolyte after electrolysis in the copper foil production equipment. The copper foil electrolyte entering the tank comes into contact with the deionizing element to absorb impurity ions in the copper foil electrolyte, thereby reducing the content of impurity ions in the copper foil electrolyte and improving the production quality of the copper foil.

[0021] Furthermore, the presence of impurity ions in the copper foil electrolyte affects the copper ion deposition rate, increasing the energy consumption of copper foil electrolysis. Therefore, by using a deionizing device to absorb impurity ions in the copper foil electrolyte, the deposition efficiency of copper ions during copper foil electrolysis is ensured, thereby reducing the energy consumption of copper foil electrolysis.

[0022] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0025] Figure 1 This paper shows a schematic diagram of the structure of the cathode roller placed inside the anode tank according to Embodiment 1 of this application;

[0026] Figure 2 This paper shows a schematic diagram of the connection structure between the filtration device, foil production equipment, and wastewater tank provided in Embodiment 1 of this application;

[0027] Figure 3 This shows a schematic diagram of the structure of the deionizer provided in Embodiment 1 of this application, which is disposed on the partition plate;

[0028] Figure 4 This paper shows a schematic diagram of the structure provided in Embodiment 1 of this application, showing the separation of the partition from the tank body;

[0029] Figure 5 This paper shows a schematic diagram of the structure provided in Embodiment 1 of this application, in which the mounting position is fixed to the inner side wall of the tank.

[0030] Figure 6 This illustration shows a schematic diagram of the partition with square through holes provided in Embodiment 1 of this application;

[0031] Figure 7 This paper shows a schematic diagram of the partition with a circular through hole provided in Embodiment 1 of this application;

[0032] Figure 8 This illustration shows a schematic diagram of the partition provided in Embodiment 2 of this application, which features a square through hole on one side.

[0033] Figure 9 This illustration shows a schematic diagram of the partition provided in Embodiment 2 of this application, which features a circular through hole on one side.

[0034] Figure 10 This paper shows a schematic diagram of the structure connecting the sedimentation device, the filtration device, and the sludge tank provided in Embodiment 3 of this application;

[0035] Figure 11 This paper shows a schematic diagram of the connection between the circulation pipe and the inlet and outlet pipes provided in Embodiment 4 of this application;

[0036] Figure 12 A schematic diagram of the structure of the pressure boosting component and one-way valve provided in Embodiment 4 of this application, which are installed on the circulation pipeline, is shown.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1. Foil production equipment; 10. Anode tank; 11. Cathode roller; 2. Filtering device; 20. Tank; 201. Opening; 202. Mounting position; 21. Partition; 211. Through hole; 212. Filtering section; 213. Picking section; 22. Deionization component; 3. Inlet pipe; 4. Outlet pipe; 5. Sludge tank; 6. Settling device; 61. Settling shell; 62. Sludge suction component; 7. Circulation pipe; 7a. Pressure boosting component; 7b. Check valve. Detailed Implementation

[0039] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0040] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0041] In this application, unless otherwise expressly specified and limited, the terms "assembly," "connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0042] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0043] Example 1

[0044] Working principle of foil production equipment 1: The anode tank 10 is connected to the positive terminal of the power supply, and the cathode roller 11 is connected to the negative terminal of the power supply. Copper foil electrolyte (copper sulfate electrolyte) is injected into the anode tank 10. The cathode roller 11 is placed inside the anode tank 10 and comes into contact with the copper foil electrolyte. Figure 1 As shown, under the action of direct current, an electric field is formed between the positive and negative electrodes. Under the action of the electric field, copper ions in the copper foil electrolyte gradually migrate to and deposit on the surface of the cathode roller 11. Then, the copper on the cathode roller 11 is peeled off by a winding device, and the peeled copper is wound onto the winding shaft. In this way, copper ions in the copper foil electrolyte continuously deposit onto the cathode roller 11 under the action of the electric field, are continuously peeled off and wound onto the winding shaft, so as to realize the production of the original foil.

[0045] During the production of copper foil, the electrolyte contains various impurity ions, such as metallic impurity ions, iron and zinc ions, or non-metallic impurity ions, such as arsenic ions.

[0046] Among the various impurity ions present in copper foil electrolytes, iron ions are the most prevalent. Since iron ions have a higher oxidizing power than copper ions, they significantly affect the efficiency of copper ion deposition onto the cathode roller 11 during copper foil electrolysis, increasing the energy consumption of the copper foil. Furthermore, because iron ions are difficult to remove from copper sulfate electrolytes, they continuously circulate within the electrolyte, leading to a sustained increase in concentration. In severe cases, this can affect the reduction process of copper ions in the electrolytic copper foil (i.e., the formation of copper foil on the cathode roller 11), thereby influencing the preferred orientation of the crystal form during electrocrystallization, resulting in unstable physical properties of the copper foil and ultimately affecting its quality.

[0047] Therefore, to ensure the quality of copper foil and reduce its energy consumption, this application provides a filtration device 2 for filtering and absorbing iron ions in the copper foil electrolyte, thus ensuring the purity of copper ions in the electrolyte. (See also...) Figure 2 and Figure 3 As shown.

[0048] It should be noted that the filter device 2 can be used to remove iron ions from the copper foil electrolyte, or to reduce the amount of iron ions in the copper foil electrolyte.

[0049] In addition, the filter device 2 can also remove other impurity ions in the copper foil electrolyte, and the specific design can be customized according to different embodiments.

[0050] Further, see Figure 3 As shown, the filtration device 2 includes a tank 20, a partition 21, and a deionizing element 22.

[0051] The tank 20 includes an inlet and an outlet. The inlet of the tank 20 can be used to receive copper foil electrolyte in the anode tank 10 of the foil production equipment 1, or it can be used to receive copper foil electrolyte with a high iron ion concentration.

[0052] Understandably, when the inlet of tank 20 receives the copper foil electrolyte from the anode tank 10 of the foil-making equipment 1, its filtration device 2 filters the copper foil electrolyte for iron ions after each copper foil production cycle. This effectively reduces the iron ion content in the copper foil electrolyte, ensuring copper foil quality and reducing energy consumption. Furthermore, tank 20 can also receive copper foil electrolyte with a high iron ion concentration, which may be stored after one or more copper foil production cycles. During the next copper foil production cycle, the iron ion content in the copper foil electrolyte is tested. If the iron ion content is higher than the normal production level, the copper foil electrolyte is sent to filtration device 2 for filtration to reduce the iron ion content before being transported to the anode tank 10 of the foil-making equipment 1 for electrolysis. This method, compared to filtering the electrolyte after each copper foil production cycle, results in lower production costs and saves time.

[0053] In this embodiment of the application, in order to better reduce the iron ion content in the copper foil electrolyte, the copper foil electrolyte is transported to the filter device 2 for filtration and absorption after each copper foil production.

[0054] In order to facilitate the diversion of copper foil electrolyte in the anode tank 10 to the tank 20, an outlet is provided at the bottom of the anode tank 10, and the outlet is connected to the tank 20 through the inlet pipe 3; that is, the inlet of the tank 20 is connected to the outlet of the foil production equipment 1.

[0055] It should be noted that the liquid inlet pipe 3 can be connected to the liquid outlet and the liquid inlet of the tank 20 by means of threads or snaps, so as to facilitate the installation and disassembly of the liquid inlet pipe 3 with the anode tank 10 and the tank 20.

[0056] Furthermore, the end of the tank 20 furthest from the anode tank 10 is connected to a wastewater tank 5 for recovering copper foil electrolyte via an outlet pipe 4. The copper foil electrolyte, with its iron ion content reduced, is then transported to the wastewater tank 5 for storage. In other words, the outlet of the tank 20 is connected to the wastewater tank 5 for recovering electrolyte. The wastewater tank 5 can be connected to a copper dissolving tank to introduce the filtered copper foil electrolyte into the dissolving tank. Pre-treated copper material is added to the dissolving tank, and oxygen is introduced into the sulfuric acid aqueous solution. After a series of oxidation reactions, a copper sulfate solution (copper foil electrolyte) is formed again. This solution is then transported back to the anode tank 10 for electrolysis to produce copper foil. The electrolyzed copper foil electrolyte is then transported back to the tank 20 for filtration and absorption of impurity ions, and then recovered to the wastewater tank 5. This cycle is repeated to reduce the concentration of iron ions in the copper foil electrolyte and ensure the quality of the copper foil.

[0057] It is worth mentioning that the copper material is generally selected from bare copper wire, copper rod, copper granules, etc., to ensure the purity of the copper foil electrolyte, thereby ensuring the quality of the copper foil.

[0058] It is understandable that the baffle 21 and the deionizing element 22 can both be installed inside the tank 20 to filter the copper foil electrolyte entering the tank 20, reduce the concentration of iron ions in the copper foil electrolyte, ensure the quality of the copper foil, and reduce power consumption.

[0059] In this embodiment, the partition 21 is connected to the side wall of the tank 20. The partition 21 is provided with multiple through holes 211 for the copper foil electrolyte to flow through. The spacing and size of the multiple through holes 211 are the same to ensure that the flow rate, speed and time of the copper foil electrolyte flowing out of the partition 21 are the same.

[0060] In addition, the deionizing element 22 is located on the side of the partition 21 near the inlet of the tank 20.

[0061] For example, the deionizing element 22 is disposed on the surface of the partition 21, and in order to prevent the deionizing element 22 from falling out of the through hole 211, the cross-sectional area of ​​the deionizing element 22 should be larger than the cross-sectional area of ​​the through hole 211.

[0062] In this way, by guiding the electrolyzed copper foil electrolyte into the tank 20, the copper foil electrolyte entering the tank 20 comes into full contact with the deionizing unit 22, absorbing iron ions in the copper foil electrolyte, thereby reducing the iron ion content in the copper foil electrolyte, ensuring the copper ion deposition rate in the copper foil electrolyte, ensuring the stability of the physical properties of the copper foil, and thus ensuring the quality of the copper foil. In addition, reducing the concentration of iron ions in the copper foil electrolyte makes it easier for copper ions to accumulate on the cathode roller 11, thereby reducing the energy consumption of electrolyzing copper foil.

[0063] It is worth mentioning that the baffle 21 installed inside the tank 20 can reduce the flow rate of the copper foil electrolyte in the tank 20, prolong the contact time and contact area between the copper foil electrolyte and the deionizing unit 22, so that the copper foil electrolyte and the deionizing unit 22 can be in full contact, and the concentration of iron ions in the copper foil electrolyte can be reduced better.

[0064] In addition, in some other embodiments, the deionizing element 22 may also be disposed in the inlet pipe 3 and / or the outlet pipe 4, so that the copper foil electrolyte flowing through the inlet pipe 3 and the outlet pipe 4 can come into contact with the deionizing element 22, thereby reducing the iron ion content.

[0065] Furthermore, see Figure 2 and Figure 3 As shown, in order to better reduce the concentration of iron ions in the copper foil electrolyte, the tank 20 is equipped with multiple evenly spaced baffles 21, and deionizing elements 22 are provided between adjacent baffles 21.

[0066] Optionally, the axis of the tank 20 is perpendicular to the plane of the partition 21, such as... Figure 2 and Figure 3 As shown, placing the partition 21 flat inside the tank 20 slows down the flow rate of the copper foil electrolyte within the tank 20, ensuring sufficient contact between the copper foil electrolyte and the deionizing element 22, thereby better reducing the iron ion content in the copper foil electrolyte. The partition 21 can have a structure with the same cross-sectional shape as the tank 20, such as a square, circular, or elliptical shape. Three or four partitions 21 are spaced apart along the axial direction of the tank 20, with equal spacing between adjacent partitions 21. Each adjacent partition 21 is separated by the deionizing element 22, ensuring that the copper foil electrolyte is filtered and absorbed once by the deionizing element 22 as it flows through each partition 21.

[0067] This ensures that the iron ion content in the final copper foil electrolyte flowing out of tank 20 is minimized, guaranteeing a low iron ion content in the reused copper foil electrolyte and thus ensuring the quality of the copper foil. In addition, it also prevents iron ions from continuously circulating in the copper foil electrolyte, reducing the energy consumption of electrolytic copper foil and ensuring the stability of the physical properties of the copper foil.

[0068] It should be noted that when one or two partitions 21 are used, the number of partitions 21 is reduced, and the number of deionizing elements 22 set on the partitions 21 is also reduced accordingly. This results in a poorer absorption effect of iron ions in the copper foil electrolyte, which in turn affects the production quality of subsequent copper foils. In addition, when five or more partitions 21 are used, the copper foil electrolyte stays in the partitions 21 and deionizing elements 22 for too long due to the increased number of partitions 21. This causes the deionizing elements 22 to absorb copper ions in the copper foil electrolyte, affecting the production of subsequent copper foils. Furthermore, too many partitions 21 will affect the flow rate of the copper foil electrolyte into the wastewater tank 5, resulting in insufficient copper foil electrolyte storage in the wastewater tank 5, which affects the storage and use of the copper foil electrolyte.

[0069] It is understood that the upper surface of the partition 21, located at the highest level of the tank 20, may or may not have a deionizing element 22, depending on the specific design of different embodiments. When the upper surface of the partition 21 at the highest level inside the tank 20 has a deionizing element 22, see [reference needed]. Figure 3 As shown, it can perform primary filtration of the copper foil electrolyte entering the tank 20. Compared with the structure in which the deionizing element 22 is not provided on the surface of the top partition 21, the concentration of iron ions in the filtered copper foil electrolyte is lower, and the quality of the produced copper foil is better.

[0070] Furthermore, the spacing between adjacent partitions 21 can be equal to or greater than the height of the deionizer 22. In this embodiment, the spacing between adjacent partitions 21 is greater than the height of the deionizer 22, which facilitates the smooth flow of the copper foil electrolyte and allows for better contact between the copper foil electrolyte and the deionizer 22, resulting in better absorption of iron ions from the copper foil electrolyte.

[0071] It is worth mentioning that the partition 21 can also be in other shapes, as long as it can support the deionizer 22 and filter the copper foil electrolyte.

[0072] In some embodiments, the partition 21 is configured as a concave conical or U-shaped structure. When it adopts a conical structure, through holes 211 are formed on the sidewalls of the cone, and the concave bottom is used to store the deionizer 22. This allows for the filtration and absorption of the copper foil electrolyte entering the tank 20. Compared to a flat structure, it has a better drainage effect, concentrating the drainage at the axis of the tank 20, and the deionizer 22 has a better absorption effect on iron ions in the copper foil electrolyte. The concave partition 21 occupies less space than a flat partition 21, making it easier to design more partition 21 structures. When a U-shaped structure is adopted, the outer wall of the partition 21 can be attached to the inner wall of the tank 20, and the top and bottom ends of the partition 21 are connected to the bottom and top ends of the adjacent partition 21, respectively, so as to ensure that the copper foil electrolyte does not come into contact with the inner wall of the tank 20, but only with the partition 21, thus avoiding the reaction between the inner wall and the copper foil electrolyte, ensuring the purity of the copper foil electrolyte, and thus ensuring the quality of the copper foil.

[0073] In some alternative embodiments, the partition 21 may also be inserted into the tank 20 at a certain angle to the axis of the tank 20, so that the partition 21 is tilted inside the tank 20. This can increase the flow rate of the copper foil electrolyte on the partition 21, thereby preventing the copper ions in the copper foil electrolyte from reacting with the deionizing unit 22. When the deionizing unit 22 is removed, there is no need to tilt the tank 20. The tilt of the partition 21 can be used to move the deionizing unit 22 to the lower part of the partition 21.

[0074] In this embodiment, the flat partition 21 can be fixedly installed on the inner side wall of the tank 20, or it can be detachably fixed on the inner side wall of the tank 20, or it can be inserted into the side wall of the tank 20 by means of plug-in connection.

[0075] Among them, see Figure 2 and Figure 4 As shown, an opening 201 is provided on the outer side wall of the tank 20. The height of the opening 201 is slightly greater than the height of the partition 21. The partition 21 can be inserted into the tank 20 through the opening 201 perpendicular to the axis of the tank 20. The partition 21 abuts against the upper and lower sides of the side wall at the opening 201. The side wall of the tank 20 abuts against the partition 21 to apply a supporting force to the partition 21, fixing the partition 21 inside the tank 20 and preventing the partition 21 from sliding inside the tank 20.

[0076] Among them, see Figure 5As shown, the inner wall of the tank 20 may also be provided with a mounting position 202 for inserting the partition 21. This mounting position 202 corresponds to and is located on the opposite side of the opening 201, used to fix the position of the partition 21 on the inner wall of the tank 20, preventing the partition 21 from slipping off. The mounting position 202 can be formed by two parallel baffles, with the distance between the two baffles greater than the height of the partition 21, to facilitate the installation of the partition 21 and prevent it from slipping off inside the tank 20. Thus, by inserting the partition 21 inside the tank 20, the method of fixing, installing, and removing the partition 21 is simpler.

[0077] In addition, see Figure 3 , Figure 4 and Figure 6 As shown, the partition 21 includes a filter section 212 and a take-up section 213. When the partition 21 is placed inside the tank 20, the filter section 212 is located inside the tank 20, and the take-up section 213 protrudes from one or both sides of the filter section 212. When the partition 21 is placed inside the tank 20, the take-up section 213 is located outside the tank 20, so as to make it easier to take up the partition 21. The insertion method is more conducive to assembling the deionizing component 22 onto the partition 21.

[0078] Furthermore, the tank 20 can be a cylindrical, cuboid, or elliptical cylinder structure.

[0079] An alternative embodiment, see Figure 2 and Figure 3 As shown, the tank 20 adopts a cylindrical structure with a volume of 100 liters, maximizing the usable area to remove iron from more electrolyte. Furthermore, the cylindrical structure occupies less space, facilitating control of the flow rate and time of the copper foil electrolyte. When the baffle 21 is placed inside the tank 20, the frictional resistance from the inner wall of the tank 20 is reduced, making it easier to place the baffle 21 inside the tank 20. When the tank 20 adopts a cylindrical structure, an annular opening 201 is provided on the side wall of the tank 20. The arc length of the opening 201 is smaller than the circumference of the tank 20 to ensure the normal operation of the tank 20.

[0080] It should be noted that, see Figure 4 As shown, when the partition 21 is fixed inside the tank 20 through the arc-shaped opening 201, the partition 21 is seamlessly connected to the upper and lower sides of the side wall of the tank 20 to prevent leakage of copper foil electrolyte, protect other devices, and avoid safety accidents.

[0081] Furthermore, the arc length of the opening 201 is greater than 1 / 2 and less than 3 / 4 of the circumference of the tank 20. This ensures that the partition 21 can be smoothly inserted into the tank 20 and also ensures the normal operation of the tank 20. For example, the arc length of the opening 201 is 5 / 8 or 11 / 16 of the circumference of the tank 20.

[0082] Optionally, the arc-shaped opening 201 can have an arc length of 500 mm and a height of 30 mm to facilitate the removal or insertion of the partition 21.

[0083] To ensure efficient absorption of iron ions in the copper foil electrolyte, multiple deionizing elements 22 are used between adjacent partitions 21 to finely filter the flowing copper foil electrolyte. When multiple deionizing elements 22 are located on the partition 21, the positions of the multiple deionizing elements 22 and the through holes 211 can be implemented as follows.

[0084] In one alternative embodiment, the deionizing element 22 corresponds to the through hole 211, and the deionizing element 22 completely covers the through hole 211; in this way, the copper foil electrolyte on each layer of partition 21 needs to pass through the deionizing element 22 before flowing into the through hole 211 and then falling onto the next layer of partition 21, which can better filter the copper foil electrolyte and better reduce the iron ion content in the copper foil electrolyte.

[0085] In another alternative embodiment, the deionizer 22 and the through-hole 211 are staggered, meaning the deionizer 22 is located in the gap between adjacent through-holes 211. The deionizer 22 may or may not overlap with the through-hole 211. It is understood that when the deionizer 22 overlaps with the through-hole 211, it can better filter and absorb the copper foil electrolyte, resulting in a better reduction of iron ion content compared to when the deionizer 22 does not overlap with the through-hole 211.

[0086] Furthermore, the deionizing element 22 can adopt a square, circular, or elliptical structure, which can be designed according to different needs.

[0087] In this embodiment, the deionizing element 22 adopts a spherical structure, which can roll on the partition 21 under the flow of the copper foil electrolyte, such as... Figure 2 As shown. In this way, the deionizing element 22 can increase the contact area with the copper foil electrolyte during the rolling process, thereby better absorbing iron ions, ensuring the quality of the copper foil and reducing power consumption.

[0088] In addition, see Figure 6 and Figure 7 As shown, the through hole 211 on the partition 21 can be a round hole or a square hole.

[0089] An alternative embodiment, see Figure 3 and Figure 7 As shown, when the through-hole 211 adopts a circular hole structure, when the deionizing element 22 completely covers the through-hole 211, the deionizing element 22 and the through-hole 211 are set without gaps. The copper foil electrolyte needs to completely pass through the deionizing element 22 before it can fall from the through-hole 211 of the partition plate 21. In this way, using a circular hole can ensure complete filtration and absorption of the copper foil electrolyte, effectively reducing the iron ion content.

[0090] Another alternative embodiment, see Figure 3 and Figure 6 As shown, to ensure that the copper foil electrolyte flows more smoothly from the top partition 21 to the bottom partition 21, the partition 21 adopts a square hole structure. This is because it ensures that when the deionizing unit 22 adopts a spherical structure, it will not completely block the through hole 211, thus ensuring the normal flow rate of the copper foil electrolyte and ensuring that there is enough copper foil electrolyte in the waste liquid tank 5 to guarantee copper foil production.

[0091] It should be noted that the number of deionizers 22 in each partition 21 can be the same or different; for example, the uppermost layer has the most deionizers 22, which perform fine filtration of the copper foil electrolyte, and the number of deionizers 22 gradually decreases from the inlet to the outlet, thus gradually filtering the copper foil electrolyte. In this way, since the uppermost layer uses a larger number of deionizers 22, it has the best absorption of iron ions in the copper foil electrolyte; in addition, the gradual decrease in the number of deionizers 22 from the inlet to the outlet can reduce the input cost of the deionizers 22.

[0092] Of course, the number of deionizing elements 22 on each partition 21 is the same, which can better and more uniformly reduce the iron ion content in the copper foil electrolyte.

[0093] In addition, the sum of the areas formed by the multiple deionizing elements 22 laid flat on each layer of partition 21 is equal to or greater than the sum of the areas of the through holes 211, so as to ensure that the copper foil electrolyte can completely pass through the deionizing elements 22 and then flow from the previous partition 21 into the next partition 21 for filtration and absorption, so as to better absorb and filter iron ions.

[0094] Furthermore, to ensure the absorption of iron ions in the copper foil electrolyte, the deionizing element 22 can be a chelating resin composed of a macroporous polystyrene cross-linked divinylbenzene network and sulfonic acid and phosphonic acid functional groups. The principle of chelating resin adsorbing iron ions is that iron ions in the copper foil electrolyte bind better to sulfonic acid and monophosphate functional groups than other metal ions.

[0095] Of course, the deionizing element 22 can also be a mixture of activated carbon and a chelating resin composed of a macroporous polystyrene crosslinked divinylbenzene network with sulfonic acid and phosphonic acid functional groups. Adding this activated carbon can remove other impurities from the copper foil electrolyte, such as oil stains. Thus, by using a mixed structure of activated carbon and chelating resin, not only can the iron ion content in the copper foil electrolyte be reduced, but other impurities can also be removed, ensuring the quality of the copper foil.

[0096] Considering the diameter of the chelating resin and the through-hole 211, the diameter of the chelating resin is 0.315-1.25 mm, for example, 0.315 mm, 0.32 mm, 0.5 mm, 1 mm, 1.2 mm, or 1.25 mm. The through-hole 211 is a square hole with a side length of 0.25-0.3 mm, such as 0.25 mm, 0.26 mm, 0.27 mm, 0.28 mm, or 0.3 mm. This ensures that when the chelating resin slides into the through-hole 211, a gap remains between the chelating resin and the through-hole 211. This avoids both the problem of slow copper foil electrolyte flow caused by the chelating resin being located at the through-hole 211 and the problem of pipe blockage caused by the chelating resin falling into the through-hole 211.

[0097] It should be noted that the through hole 211 can also be an elliptical hole or a triangular hole, as long as the chelating resin does not fall from the through hole 211 and cause pipe blockage, and is not blocked by the chelating resin.

[0098] It is worth mentioning that regarding the assembly of the chelating resin, when one layer of partition 21 is inserted into the tank 20, chelating resin is added to the partition 21 through the material port at the top of the tank 20, so that the chelating resin is spread evenly on the surface of the partition 21. Then, another layer of partition 21 is inserted into the tank 20 and filled with chelating resin; and so on, until the last layer of partition 21 is spread evenly, and then another layer of chelating resin is filled to complete the assembly of the chelating resin. In this way, the insertion method is more conducive to the assembly of the chelating resin, that is, completing one insertion of partition 21 completes one filling of chelating resin. Of course, chelating resin can also be filled after all partitions 21 have been inserted. In this case, a material port for adding chelating resin can be opened on the side wall of the tank 20, and chelating resin can be added between the two layers of partition 21 through the material port. In addition, other methods can also be used to add chelating resin, depending on the design of different embodiments.

[0099] Understandably, adding chelating resin by opening a material inlet on the side wall of tank 20 is more convenient and safer than adding chelating resin at the top of tank 20.

[0100] Furthermore, see Figure 6 or Figure 7As shown, the partition 21 has multiple through holes 211 arranged in an array along a first direction X and a second direction Y. In both directions X and Y, the spacing D1 between adjacent through holes 211 is 2-4 mm, for example, 2 mm, 2.1 mm, 3 mm, 3.9 mm, or 4 mm. In the first direction X, the ratio of the spacing D1 between adjacent through holes 211 to the opening width D2 of the through hole 211 ranges from 6 to 16; for example, the ratio can be 7, 8, 13, or 16. Thus, by controlling the spacing D1 between adjacent through holes 211 and controlling the opening width D2 of the through holes 211, the flow rate and flow time of the copper foil electrolyte in each partition 21 can be controlled, thereby reducing the binding of copper ions with the chelating resin in the copper foil electrolyte.

[0101] Understandably, when the ratio of the distance D1 between adjacent through holes 211 to the opening width D2 of the through hole 211 is equal to 16, the larger the distance D1 between adjacent through holes 211 and the smaller the opening width D2 of the through hole 211, the slower the flow rate of the copper foil electrolyte in each partition 21 and the longest the flow time, ensuring that the copper foil electrolyte and the deionizing element 22 are in full contact. When the ratio of the distance D1 between adjacent through holes 211 to the opening width D2 of the through hole 211 is less than 6, the distance D1 between adjacent through holes 211 is the smallest and the opening width D2 of the through hole 211 is the largest, the fastest the flow rate of the copper foil electrolyte in each partition 21 and the shortest the flow time, avoiding the reaction between the deionizing element 22 and other ions in the copper foil electrolyte.

[0102] Furthermore, the opening width D2 of the through holes 211 of each partition 21 and the spacing D1 between adjacent through holes 211 can be designed according to different embodiments. Different ratios can be selected based on the flow rate and flow time of the copper foil electrolyte to ensure the absorption of iron ions in the copper foil electrolyte and reduce the iron ion content. In addition, it can also prevent the chelating resin from combining with copper ions in the copper foil electrolyte. Because the time required for copper ions in the copper foil electrolyte to combine with the chelating resin is longer than the time required for iron ions to combine with the chelating resin, controlling the flow time and flow rate of the copper foil electrolyte between the partition 21 and the chelating resin can avoid the problem of the chelating resin combining with copper ions.

[0103] Furthermore, when the ratio of the spacing D1 between adjacent through holes 211 to the opening width D2 of the through hole 211 is less than 6, it indicates that the spacing D1 between adjacent through holes 211 is very small, or the opening width D2 of the through hole 211 is very large. Thus, since the size of the deionizer 22 is fixed, whether the spacing D1 between adjacent through holes 211 is very small or the opening width D2 of the through hole 211 is very large, the residence time of the copper foil electrolyte on the separator 21 will decrease, resulting in an increase in the flow rate and velocity of the copper foil electrolyte on the separator 21, and a decrease in the filtration effect of the deionizer 22. Correspondingly, when the ratio of the spacing D1 between adjacent through holes 211 to the opening width D2 of the through hole 211 is greater than 16, it indicates that the spacing D1 between adjacent through holes 211 is very large, or the opening width D2 of the through hole 211 is very small. Since the size of the deionizer 22 is fixed, whether the distance D1 between adjacent through holes 211 increases or the opening width D2 of through holes 211 decreases, it will affect the residence time of the copper foil electrolyte on the separator 21, causing the copper foil electrolyte to accumulate on the separator 21. This will cause the deionizer 22 to absorb copper ions from the copper foil electrolyte, and will also affect the flow rate of the copper foil electrolyte flowing into the wastewater tank 5, thus affecting the subsequent production of copper foil.

[0104] It is worth mentioning that the tank 20 can be made of a material that does not readily react with the copper foil electrolyte, such as stainless steel. The partition 21 can also be made of a material that does not readily react with the copper foil electrolyte, such as titanium. This is to prevent the tank 20 and partition 21 from reacting with the copper foil electrolyte, ensuring the binding of the chelating resin with iron ions.

[0105] In addition, after the iron ions in the copper foil electrolyte are filtered and absorbed by the filter device 2, the iron ion removal rate can reach 67-85%, which effectively reduces the iron ion content, ensures the deposition efficiency of the copper foil on the cathode roller 11, and thus ensures the quality of the copper foil and reduces the power consumption of the copper foil.

[0106] The removal rate of iron ions in the copper foil electrolyte is determined by the different flow rates and flow times of the electrolyte, as well as the different contact areas and contact times between the chelating resin and the electrolyte. For example, it can be 67%, 70%, 73%, 76%, 80%, 85%, etc.

[0107] Example 2

[0108] See Figure 8 or Figure 9As shown, the difference between Embodiment 2 and Embodiment 1 is that the partition 21 in this embodiment includes a through portion and a blocking portion. The through portion has a through hole 211, while the blocking portion does not have a through hole 211. By having a through hole 211 in one part and not in the other, the residence time of the copper foil electrolyte in the partition 21 can be better controlled, ensuring the absorption and filtration of iron ions or other impurity ions in the copper foil electrolyte, thereby guaranteeing the quality of the copper foil. Furthermore, the absence of a through hole 211 in the blocking portion can also reduce the impact force of the copper foil electrolyte, providing better protection for the through portion.

[0109] Example 3

[0110] See Figure 10 As shown, the difference between this embodiment 2 and embodiments 1 and 2 is that a settling device 6 is added between the tank 20 and the waste liquid tank 5. The settling device 6 includes an inlet end and an outlet end. The inlet end is connected to the outlet of the tank 20, and the outlet end is connected to the waste liquid tank 5. It is used to settling and filtering the copper foil electrolyte after filtration in the tank 20 to remove the deionized component 22 mixed in the copper foil electrolyte, so as to avoid subsequent copper foil production.

[0111] The settling device 6 includes a settling shell 61 and multiple suction components 62 stacked within the settling shell 61. The suction components 62 can use activated carbon or a mixture of activated carbon and other filter media to filter and absorb the copper foil electrolyte, thereby removing oil or other impurities from the copper foil electrolyte to ensure the purity of the copper foil electrolyte and thus the quality of the copper foil.

[0112] It is understandable that multiple suction components 62 are piled up inside the settling shell 61, and there are gaps between the multiple suction components 62. The copper foil electrolyte can flow out of the settling shell 61 through the gaps between the multiple suction components 62. The deionizing component 22 is larger than the gap between adjacent suction components 62, so that the deionizing component 22 is filtered and carried inside the settling shell 61.

[0113] Example 4

[0114] The difference between Example 4 and Examples 1, 2, and 3 is that, see [link to example]. Figure 11 and Figure 12 As shown, Embodiment 4 of this application provides a circulation system, which includes an inlet pipe 3, an outlet pipe 4, a circulation pipe 7, and a filter device 2 as described in Embodiment 1. One end of the circulation pipe 7 is connected to the inlet pipe 3, and the other end of the circulation pipe 7 is connected to the outlet pipe 4, so as to circulate the copper foil electrolyte through the filter device 2 to perform circulating filtration of the copper foil electrolyte, so as to better remove iron ions or impurity particles in the copper foil electrolyte, better ensure the purity of the copper foil electrolyte, and thus better ensure the quality of the copper foil.

[0115] It should be noted that, in order to ensure that the copper foil electrolyte can smoothly enter the filter device 2, a pressure boosting component 7a, such as an air pump, is provided on the circulation pipe 7. In this way, the pressure of the copper foil electrolyte is increased by the pressure boosting component 7a, so that it can smoothly enter the filter device 2.

[0116] In addition, to prevent the copper foil electrolyte from flowing back, a one-way valve 7b is installed on the circulation pipe 7.

[0117] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0118] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A filter device for filtering a copper foil electrolyte, characterized by, The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device.

2. The filter device of claim 1, wherein, The application relates to a copper foil electrolyte purification device.

3. The filter device of claim 2, wherein, The application relates to a copper foil electrolyte purification device.

4. The filter device of claim 2, wherein, The application relates to a copper foil electrolyte purification device.

5. The filter device of claim 2, wherein, The application relates to a copper foil electrolyte purification device.

6. The filter device of claim 5, wherein, The application relates to a copper foil electrolyte purification device.

7. The filter device of claim 6, wherein, The application relates to a copper foil electrolyte purification device.

8. The filter device of claim 1, wherein, The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. The application relates to a copper foil electrolyte purification device. 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