Electronic component

Abstract

Provided is an electronic component that ensures sufficient area as a notch area and improves design freedom. When a first magnetic body substrate (20) is viewed in a third positive direction, an outer edge of the first magnetic body substrate (20) includes a linear edge (S1). In addition, a notch (21A) is recessed inward from the edge (S1). When the first magnetic body substrate (20) is viewed in the third positive direction, a direction along the edge (S1) is taken as a first direction, and a direction perpendicular to the first direction is taken as a second direction. In this case, a maximum dimension of the notch (21A) in the first direction is different from a maximum dimension of the notch (21A) in the second direction.

Description

Technical Field

[0001] This invention relates to electronic components. Background Technology

[0002] The electronic component described in Patent Document 1 includes a magnetic substrate and a laminate. The magnetic substrate is a generally rectangular parallelepiped having a first main surface and a second main surface parallel to the first main surface. The magnetic substrate has multiple notches connecting the first main surface and the second main surface. Each notch is located at one of the four corners of the magnetic substrate. The laminate is located on the first main surface of the magnetic substrate. The laminate is composed of multiple insulating layers stacked on top of each other.

[0003] In addition, the electronic component includes multiple coils, multiple lead wires, multiple connectors, and multiple external electrodes. Each coil extends inside the laminate. Each lead wire is connected to the end of each coil. Each lead wire is partially exposed into a notch. Each connector is present on the inner surface of each notch. One end of each connector is connected to each lead wire. Each external electrode is present on the second main surface of the magnetic substrate. Each external electrode is connected to each connector. That is, the external electrodes are connected to the coils via connectors and lead wires.

[0004] Patent Document 1: Japanese Patent No. 5673837

[0005] In the electronic component described in Patent Document 1, from the viewpoint of connecting the external electrode to the lead wire via the connecting portion, it is preferable to ensure that the area of ​​the notch is large enough when viewed in a direction perpendicular to the first main surface of the magnetic substrate. However, since it is necessary to avoid electrical interference between the external electrodes, it is difficult to simply increase the size of the notch. Summary of the Invention

[0006] To address the aforementioned issues, the present invention provides an electronic component comprising: a magnetic substrate having a first main surface and a second main surface parallel to the first main surface, and having a plurality of notches connecting the first main surface and the second main surface; a laminate composed of a plurality of insulating layers laminated on the first main surface; a plurality of coils extending inside the laminate; lead wires connected to the ends of the coils and partially exposed to the interior of the notches; a connector existing on the inner surface of the notches and connected to the lead wires; and an external electrode existing on the upper... On the second main surface and connected to the connecting body, when the magnetic substrate is viewed in a direction perpendicular to the first main surface, the outer edge of the magnetic substrate includes a straight first side, and at least one of the plurality of notches is recessed inward from the first side. When the magnetic substrate is viewed in a direction perpendicular to the first main surface, if the direction along the first side is taken as the first direction and the direction perpendicular to the first direction is taken as the second direction, the maximum size of the notch in the first direction is different from the maximum size of the notch in the second direction.

[0007] Based on the above structure, the maximum size of the notch in the first direction is intentionally made different from the maximum size in the second direction. Therefore, it is possible to design a notch with sufficient area when viewed from a direction perpendicular to the first main surface of the magnetic substrate, and to suppress electrical interference between the external electrodes.

[0008] It ensures sufficient area for the gap and increases design freedom. Attached Figure Description

[0009] Figure 1 This is a perspective view of the electronic component according to the first embodiment.

[0010] Figure 2 This is a perspective view of the electronic component according to the first embodiment.

[0011] Figure 3 This is an exploded perspective view of the electronic components according to the first embodiment.

[0012] Figure 4 This is a bottom view of the electronic component according to the first embodiment.

[0013] Figure 5 This is a perspective view of the electronic components according to the second embodiment.

[0014] Figure 6 This is a bottom view of the electronic components according to the second embodiment.

[0015] Figure 7 This is a bottom view of the electronic component according to the third embodiment.

[0016] Figure 8 This is a bottom view of the stack of electronic components according to the third embodiment.

[0017] Figure 9 This is a bottom view of the electronic component in the modified example.

[0018] Figure 10 This is a bottom view of the electronic component in the modified example.

[0019] Figure 11 This is a bottom view of the electronic component in the modified example.

[0020] Figure 12 This is a bottom view of the electronic component in the modified example.

[0021] Explanation of reference numerals in the attached figures

[0022] 10, 110, 210, 310, 410, 510, 610... Electronic components; 20... First magnetic substrate; 21, 121, 221, 321, 421, 521, 621... Notches; 30... Laminates; 40... Second magnetic substrate; 51... First adhesive layer; 52... Second adhesive layer; 61... First coil; 62... Second coil; 70A... First lead wiring; 70B... Second lead wiring; 70C... Third lead wiring; 70D... Fourth lead wiring; 81... First insulating layer; 82... Second insulating layer; 83... Third insulating layer; 84... Fourth insulating layer; 85... Fifth insulating layer; 91, 91A~91F... Connectors; 92A~92F... External electrodes. Detailed Implementation

[0023] <First Embodiment>

[0024] The first embodiment of the electronic component will now be described. Note that structural elements may be shown enlarged for ease of understanding in the accompanying drawings. The dimensional ratios of structural elements may differ from their actual dimensions or from those in other drawings.

[0025] (Regarding the overall structure)

[0026] like Figure 1 As shown, the electronic component 10 includes a first magnetic substrate 20, a laminate 30, and a second magnetic substrate 40.

[0027] like Figure 3 As shown, the first magnetic substrate 20 is generally rectangular. The first magnetic substrate 20 has a first main surface MF1. The first main surface MF1 is the surface with the largest area among the planes constituting the outer surface of the first magnetic substrate 20. Furthermore, as... Figure 2As shown, the first magnetic substrate 20 has a second main surface MF2. The second main surface MF2 is parallel to the first main surface MF1.

[0028] When the first magnetic substrate 20 is viewed in a direction perpendicular to the first main surface MF1, the first magnetic substrate 20 is generally rectangular with its four corners cut off, and has four straight sides. In the following description, as... Figure 3 As shown, when viewing the first magnetic substrate 20 in a direction perpendicular to the first main surface MF1, the axis parallel to one of the four sides is designated as the first axis X. Furthermore, when viewing the first magnetic substrate 20 in a direction perpendicular to the first main surface MF1, the axis perpendicular to the first axis X is designated as the second axis Y. And, the axis perpendicular to the first main surface MF1 is designated as the third axis Z. Moreover, one direction parallel to the first axis X is designated as the first positive direction X1, and the direction opposite to the first positive direction X1 along the first axis X is designated as the first negative direction X2. Similarly, one direction along the second axis Y is designated as the second positive direction Y1, and the direction opposite to the second positive direction Y1 along the second axis Y is designated as the second negative direction Y2. And, the direction in which the first main surface MF1 faces along the third axis Z is designated as the third positive direction Z1, and the direction opposite to the third positive direction Z1 is designated as the third negative direction Z2.

[0029] The dimension of the first magnetic substrate 20 along the second axis Y is larger than the dimension of the first magnetic substrate 20 along the first axis X. That is, the first main surface MF1 and the second main surface MF2 of the first magnetic substrate 20 are generally elongated rectangles along the second axis Y. The first magnetic substrate 20 is made of a magnetic material. The magnetic material is, for example, a sintered body of ferrite ceramic.

[0030] like Figure 3 As shown, the first magnetic substrate 20 includes four notches 21A to 21D connecting the first main surface MF1 and the second main surface MF2. When the first magnetic substrate 20 is viewed in the third positive direction Z1, each notch 21 exists at one of the four corners. In other words, the notches 21 are spaces existing at the four corners of the first magnetic substrate 20. Furthermore, the area of ​​each notch 21 when the first magnetic substrate 20 is viewed in the third positive direction Z1 is smaller the closer it is to the first main surface MF1 from the second main surface MF2. Hereinafter, without distinguishing between the four notches 21A to 21D, they will be referred to as notches 21.

[0031] When viewed from the center of the first magnetic substrate 20, notch 21A is located at an angle near the first positive direction X1 and near the second positive direction Y1. When viewed from the center of the first magnetic substrate 20, notch 21B is located at an angle near the first negative direction X2 and near the second positive direction Y1. When viewed from the center of the first magnetic substrate 20, notch 21C is located at an angle near the first negative direction X2 and near the second negative direction Y2. When viewed from the center of the first magnetic substrate 20, notch 21D is located at an angle near the first positive direction X1 and near the second negative direction Y2.

[0032] The electronic component 10 includes a first adhesive layer 51. The first adhesive layer 51 is composed of an organic adhesive such as polyimide resin. When the first adhesive layer 51 is viewed in the third negative direction Z2, the first adhesive layer 51 completely covers the first main surface MF1 of the first magnetic substrate 20.

[0033] like Figure 1 As shown, the laminate 30 is rectangular. (As...) Figure 3 As shown, the laminate 30 is laminated on the first main surface MF1 of the first magnetic substrate 20 through the first adhesive layer 51. Therefore, the laminate 30 is bonded to the first magnetic substrate 20 through the first adhesive layer 51.

[0034] like Figure 3 As shown, the laminate 30 has a first layer L1 to a fifth layer L5. The thickness of the first layer L1 to the fifth layer L5, i.e., the dimension along the third axis Z, is all approximately the same. In addition, the main surface of each layer is parallel to the first main surface MF1 of the first magnetic substrate 20.

[0035] The first layer L1 includes a first coil 61, five leads 71A to 71E, and a first insulating layer 81. When viewed from the center of the first layer L1, lead 71A is located at an angle near the first positive direction X1 and the second positive direction Y1. When viewed from the center of the first layer L1, lead 71B is located at an angle near the first negative direction X2 and the second positive direction Y1. When viewed from the center of the first layer L1, lead 71C is located at an angle near the first negative direction X2 and the second negative direction Y2. When viewed from the center of the first layer L1, lead 71D is located at an angle near the first positive direction X1 and the second negative direction Y2. When viewed from the center of the first layer L1, lead 71E is located near the second positive direction Y1 and at the center along the first axis X. Leads 71A to 71E are made of conductive materials such as copper or silver. In this embodiment, lead-out portions 71A to 71E are made of the same conductive material as the first coil 61.

[0036] When the first layer L1 is viewed in the third negative direction Z2, the first coil 61 extends in a spiral shape around the center of the first layer L1. The first end of the first coil 61 is connected to the lead-out portion 71A. The second end of the first coil 61 is connected to the lead-out portion 71E. When the first layer L1 is viewed in the third negative direction Z2, the first coil 61 is wound in a clockwise direction from the first end to the second end. The first coil 61 is made of a conductive material such as copper or silver. In this embodiment, the first coil 61 is made of the same conductive material as the leads-out portions 71A to 71E.

[0037] In the first layer L1, the portion excluding the first coil 61 and the leads 71A to 71E is the first insulating layer 81. The first insulating layer 81 is made of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the first insulating layer 81 is made of polyimide resin, which is the same material as the first adhesive layer 51.

[0038] The second layer L2 has five leads 72A to 72E and a second insulating layer 82.

[0039] When viewed from the center of the second layer L2, the lead-out portion 72A is located at the corner near the first positive direction X1 and near the second positive direction Y1. Therefore, the lead-out portion 72A is stacked on the surface of the lead-out portion 71A of the first layer L1 facing the third positive direction Z1.

[0040] When viewed from the center of the second layer L2, the lead-out portion 72B is located at an angle that is closer to the first negative direction X2 and closer to the second positive direction Y1. Therefore, the lead-out portion 72B is stacked on the surface of the lead-out portion 71B of the first layer L1 that faces the third positive direction Z1.

[0041] When viewed from the center of the second layer L2, the lead-out portion 72C is located at the corner near the first negative direction X2 and near the second negative direction Y2. Therefore, the lead-out portion 72C is stacked on the surface of the lead-out portion 71C of the first layer L1 facing the third positive direction Z1.

[0042] When viewed from the center of the second layer L2, the lead-out portion 72D is located at the corner near the first positive direction X1 and near the second negative direction Y2. Therefore, the lead-out portion 72D is stacked on the surface of the first layer L1 facing the lead-out portion 71D in the third positive direction Z1.

[0043] When viewed from the center of the second layer L2, the lead-out portion 72E is located on the side closest to the second positive direction Y1 and at the center along the direction of the first axis X. In other words, when viewed towards the third negative direction Z2, the lead-out portion 72E of the second layer L2 is located at the same position as the lead-out portion 71E of the first layer L1. Therefore, the lead-out portion 72E is stacked on the surface of the lead-out portion 71E of the first layer L1 facing the third positive direction Z1. The lead-out portions 72A to 72E are made of conductive materials such as copper and silver. In this embodiment, the lead-out portions 72A to 72E are made of the same conductive material as the first coil 61.

[0044] In the second layer L2, the portion excluding the leads 72A to 72E is the second insulating layer 82. The second insulating layer 82 is made of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the second insulating layer 82 is made of an insulator of the same material as the first insulating layer 81.

[0045] The third layer L3 includes a second coil 62, six leads 73A to 73F, and a third insulating layer 83. When viewed from the center of the third layer L3, the lead 73A is located at an angle near the first positive direction X1 and near the second positive direction Y1. Therefore, the lead 73A is stacked on the surface of the lead 72A of the second layer L2 facing the third positive direction Z1.

[0046] When viewed from the center of the third layer L3, the lead-out portion 73B is located at the corner near the first negative direction X2 and near the second positive direction Y1. Therefore, the lead-out portion 73B is stacked on the surface of the lead-out portion 72B of the second layer L2 facing the third positive direction Z1.

[0047] When viewed from the center of the third layer L3, the lead-out portion 73C is located at the corner near the first negative direction X2 and near the second negative direction Y2. Therefore, the lead-out portion 73C is stacked on the surface of the lead-out portion 72C of the second layer L2 facing the third positive direction Z1.

[0048] When viewed from the center of the third layer L3, the lead-out portion 73D is located at the corner closest to the first positive direction X1 and closest to the second negative direction Y2. Therefore, the lead-out portion 73D is stacked on the surface of the lead-out portion 72D of the second layer L2 facing the third positive direction Z1.

[0049] When viewed from the center of the third layer L3, the lead-out portion 73E is located on the side closest to the second positive direction Y1 and at the center along the first axis X. In other words, when viewed towards the third negative direction Z2, the lead-out portion 73E of the third layer L3 is located at the same position as the lead-out portion 72E of the second layer L2. Therefore, the lead-out portion 73E is stacked on the surface of the lead-out portion 72E of the second layer L2 facing the third positive direction Z1.

[0050] When viewed from the center of the third layer L3, the lead-out portion 73F is located on the side near the second negative direction Y2 and at the center along the direction of the first axis X. Lead-out portions 73A to 73F are made of conductive materials such as copper and silver. In this embodiment, lead-out portions 73A to 73F are made of the same conductive material as the first coil 61.

[0051] When viewing the third layer L3 in the third negative direction Z2, the second coil 62 extends in a spiral shape with the center of the third layer L3 as the center. The first end of the second coil 62 is connected to the lead-out portion 73D. The second end of the second coil 62 is connected to the lead-out portion 73F. When viewing the third layer L3 in the third negative direction Z2, the second coil 62 is wound in a clockwise direction from the first end to the second end. Furthermore, when viewed from the first coil 61, the second coil 62 is located on the third positive direction Z1 side. Thus, the second coil 62 and the first coil 61 together constitute a common-mode choke. The second coil 62 is made of a conductive material such as copper or silver. In this embodiment, the second coil 62 is made of the same conductive material as the first coil 61.

[0052] In the third layer L3, the portion excluding the second coil 62 and the leads 73A-73F is the third insulating layer 83. The third insulating layer 83 is made of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the third insulating layer 83 is made of an insulator of the same material as the first insulating layer 81.

[0053] The fourth layer L4 includes lead-out sections 74B, 74C, 74E, and 74F, and a fourth insulating layer 84.

[0054] When viewed from the center of the 4th layer L4, the lead-out portion 74B is located at the corner near the first negative direction X2 and near the second positive direction Y1. Therefore, the lead-out portion 74B is stacked on the surface of the lead-out portion 73B of the 3rd layer L3 facing the third positive direction Z1.

[0055] When viewed from the center of the 4th layer L4, the lead-out portion 74C is located at the corner near the first negative direction X2 and near the second negative direction Y2. Therefore, the lead-out portion 74C is stacked on the surface of the lead-out portion 73C of the 3rd layer L3 facing the third positive direction Z1.

[0056] When viewed from the center of the fourth layer L4, the lead-out portion 74E is located on the side closest to the second positive direction Y1 and at the center along the first axis X. In other words, when viewed towards the third negative direction Z2, the lead-out portion 74E of the fourth layer L4 is located at the same position as the lead-out portion 73E of the third layer L3. Therefore, the lead-out portion 74E is stacked on the surface of the lead-out portion 73E of the third layer L3 facing the third positive direction Z1.

[0057] When viewed from the center of the fourth layer L4, the lead-out portion 74F is located on the side facing the second negative direction Y2 and at the center along the first axis X. In other words, when viewing the stack 30 towards the third negative direction Z2, the lead-out portion 74F of the fourth layer L4 is located at the same position as the lead-out portion 73F of the third layer L3. Therefore, the lead-out portion 74F is stacked on the surface of the lead-out portion 73F of the third layer L3 facing the third positive direction Z1. The lead-out portions 74B to 74F are made of conductive materials such as copper and silver. In this embodiment, the lead-out portions 74B to 74F are made of the same conductive material as the first coil 61.

[0058] In the fourth layer L4, the portion excluding leads 74B to 74F is the fourth insulating layer 84. The fourth insulating layer 84 is made of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the fourth insulating layer 84 is made of an insulator of the same material as the first insulating layer 81.

[0059] The fifth layer L5 has lead-out portion 75B, lead-out portion 75C, and a fifth insulating layer 85.

[0060] When observing the fifth layer L5 in the third negative direction Z2, the lead-out portion 75B extends from the portion that overlaps with the lead-out portion 74B of the fourth layer L4 to the portion that overlaps with the lead-out portion 74E of the fourth layer L4.

[0061] When observing the fifth layer L5 in the third negative direction Z2, the lead-out portion 75C extends from the portion that overlaps with the lead-out portion 74C of the fourth layer L4 to the portion that overlaps with the lead-out portion 74F of the fourth layer L4.

[0062] In the fifth layer L5, the portion excluding the leads 75B and 75C is the fifth insulating layer 85. The fifth insulating layer 85 is made of a non-magnetic insulator such as glass, resin, or alumina. In this embodiment, the fifth insulating layer 85 is made of an insulator of the same material as the first insulating layer 81.

[0063] By stacking the first layer L1 to the fifth layer L5, a laminate 30 consisting of multiple first insulating layers 81 to fifth insulating layers 85 is formed. In addition, the first coil 61 and the second coil 62 extend inside the laminate 30.

[0064] Furthermore, the first lead wire 70A is formed by the aforementioned lead-out portions 71A, 72A, and 73A. The first lead wire 70A is connected to the first end of the first coil 61. Moreover, the lead-out portion 71A of the first lead wire 70A is exposed to the outside of the laminate 30 and the first adhesive layer 51 in the third negative direction Z2.

[0065] The second lead wire 70B is formed by the aforementioned lead-out portions 71E, 72E, 73E, 74E, 75B, 74B, 73B, 72B, and 71B. The second lead wire 70B is connected to the second end of the first coil 61. Furthermore, the lead-out portion 71B of the second lead wire 70B is exposed to the outside of the laminate 30 and the first adhesive layer 51 in the third negative direction Z2.

[0066] The fourth lead wire 70D is formed by the aforementioned lead-out portions 71D, 72D, and 73D. The fourth lead wire 70D is connected to the first end of the second coil 62. Furthermore, the lead-out portion 71D of the fourth lead wire 70D is exposed to the outside of the laminate 30 and the first adhesive layer 51 in the third negative direction Z2.

[0067] The third lead wire 70C is formed by the aforementioned lead-out portions 73F, 74F, 75C, 74C, 73C, 72C, and 71C. The third lead wire 70C is connected to the second end of the second coil 62. Furthermore, the lead-out portion 71C of the third lead wire 70C is exposed to the outside of the laminate 30 and the first adhesive layer 51 in the third negative direction Z2.

[0068] The electronic component 10 includes a second adhesive layer 52. The second adhesive layer 52 is composed of an organic adhesive such as polyimide resin. When the second adhesive layer 52 is viewed in the third negative direction Z2, the second adhesive layer 52 completely covers the surface of the laminate 30 facing the third positive direction Z1.

[0069] The second magnetic substrate 40 is rectangular parallelepiped. The second magnetic substrate 40 is made of a magnetic material. The magnetic material is, for example, a sintered ferrite ceramic. In this embodiment, the second magnetic substrate 40 is made of the same magnetic material as the first magnetic substrate 20.

[0070] The electronic component 10 has four connectors 91A to 91D and four external electrodes 92A to 92D.

[0071] Connector 91A is located on the inner surface of notch 21A. Connector 91A is present throughout the entire inner surface of notch 21A. Connector 91B is located on the inner surface of notch 21B. Connector 91B is present throughout the entire inner surface of notch 21B. Connector 91C is located on the inner surface of notch 21C. Connector 91C is present throughout the entire inner surface of notch 21C. Connector 91D is located on the inner surface of notch 21D. Connector 91D is present throughout the entire inner surface of notch 21D. These connectors 91A to 91D are made of a conductive material with copper as the main component. Furthermore, hereinafter, without distinguishing between multiple connectors 91A to 91D, they are referred to as connector 91.

[0072] Connector 91A is present throughout the entire inner surface of notch 21A, thereby connecting the first lead wire 70A exposed to the outside of laminate 30 and first adhesive layer 51 to connector 91A. Similarly, connector 91B is present throughout the entire inner surface of notch 21B, thereby connecting the second lead wire 70B exposed to the outside of laminate 30 and first adhesive layer 51 to connector 91B. Connector 91C is present throughout the entire inner surface of notch 21C, thereby connecting the third lead wire 70C exposed to the outside of laminate 30 and first adhesive layer 51 to connector 91C. Connector 91D is present throughout the entire inner surface of notch 21D, thereby connecting the fourth lead wire 70D exposed to the outside of laminate 30 and first adhesive layer 51 to connector 91D.

[0073] External electrode 92A is located on the second main surface MF2 and is connected to connector 91A. External electrode 92B is located on the second main surface MF2 and is connected to connector 91B. External electrode 92C is located on the second main surface MF2 and is connected to connector 91C. External electrode 92D is located on the second main surface MF2 and is connected to connector 91D. External electrodes 92A to 92D are not interconnected.

[0074] Thus, external electrode 92A is connected to the first coil 61 via connector 91A and first lead wire 70A. External electrode 92B is connected to the first coil 61 via connector 91B and second lead wire 70B. External electrode 92C is connected to the second coil 62 via connector 91C and third lead wire 70C. External electrode 92D is connected to the second coil 62 via connector 91D and fourth lead wire 70D.

[0075] The external electrodes 92A to 92D are made of a conductor with copper as the main component. In this embodiment, the external electrodes 92A to 92D are made of the same conductor material as the connectors 91A to 91D.

[0076] (Regarding the dimensional relationship of the notch)

[0077] like Figure 4 As shown, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the outer edge of the first magnetic substrate 20 includes four straight edges S1 to S4.

[0078] Edge S1 is a straight edge extending along the second axis Y. When viewed from the center of the first magnetic substrate 20, edge S1 is located on the first positive direction X1 side. Edge S2 is a straight edge extending along the second axis Y. When viewed from the center of the first magnetic substrate 20, edge S2 is located on the first negative direction X2 side. Edge S3 is a straight edge extending along the first axis X. When viewed from the center of the first magnetic substrate 20, it is located on the second positive direction Y1 side. Edge S3 is adjacent to edge S1 across notch 21A. Edge S3 is also adjacent to edge S2 across notch 21B. Edge S4 is a straight edge extending along the first axis X. When viewed from the center of the first magnetic substrate 20, edge S4 is located on the second negative direction Y2 side. Edge S4 is adjacent to edge S2 across notch 21C. Edge S4 is also adjacent to edge S1 across notch 21D. In addition, "adjacent" does not require a direct connection, and also includes cases where they are adjacent but separated by gap 21, as described above.

[0079] Here, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the notch 21A is recessed inward from edges S1 and S3. That is, the notch 21A is recessed from edge S1 towards the first negative direction X2, and from edge S3 towards the second negative direction Y2. When the first magnetic substrate 20 is viewed in the third positive direction Z1, the notch 21B is recessed inward from edges S2 and S3. That is, the notch 21B is recessed from edge S2 towards the first positive direction X1 and from edge S3 towards the second negative direction Y2. When the first magnetic substrate 20 is viewed in the third positive direction Z1, the notch 21C is recessed inward from edges S2 and S4. That is, the notch 21C is recessed from edge S2 towards the first positive direction X1 and from edge S4 towards the second positive direction Y1. When the first magnetic substrate 20 is viewed in the third positive direction Z1, the notch 21D is recessed inward from both sides S1 and S4. That is, the notch 21D is recessed from side S1 towards the first negative direction X2 and from side S4 towards the second positive direction Y1. Furthermore, Figure 4 In the diagram, the outline of each notch 21 on the second main surface MF2 is represented by a solid line. The same applies below in the bottom view of the electronic component.

[0080] Furthermore, when viewing the first magnetic substrate 20 in the third positive direction Z1, the maximum dimension of the notch 21A in the direction perpendicular to the direction along edge S1, i.e., along the first axis X, is taken as the first dimension M1. Additionally, when viewing the first magnetic substrate 20 in the third positive direction Z1, the maximum dimension of the notch 21A in the direction along edge S1, i.e., along the second axis Y, is taken as the second dimension M2. In this case, the first dimension M1 and the second dimension M2 are different. Specifically, the second dimension M2 is larger than the first dimension M1. In this situation, when edge S1 is taken as the first edge, the first direction is along the second axis Y, the second edge is edge S3, and the second direction is along the first axis X. Furthermore, each dimension of the notch 21 is a dimension on the same plane as the second main surface MF2. Therefore, in this embodiment, when viewing the first magnetic substrate 20 in the third positive direction Z1, each dimension of the notch 21 becomes a dimension on the outer edge of the first magnetic substrate 20. Specifically, taking the intersection point of the extension lines of edge S1 in the second positive direction Y1 and edge S3 in the first positive direction X1 as a reference, the distance from that intersection point to edge S1 is taken as the second dimension M2. Furthermore, the distance from that intersection point to edge S3 is taken as the first dimension M1.

[0081] Furthermore, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum size of the notch 21B along the direction of the edge S1, i.e., along the direction of the second axis Y, is greater than the maximum size of the notch 21B in the direction perpendicular to the direction along the edge S1, i.e., along the direction of the first axis X.

[0082] Furthermore, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum size of the notch 21C along the direction of the edge S1, i.e., along the direction of the second axis Y, is greater than the maximum size of the notch 21C in the direction perpendicular to the direction along the edge S1, i.e., along the direction of the first axis X.

[0083] Furthermore, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum size of the notch 21D along the direction of the edge S1, i.e., along the direction of the second axis Y, is greater than the maximum size of the notch 21D in the direction perpendicular to the direction along the edge S1, i.e., along the direction of the first axis X.

[0084] When the first magnetic substrate 20 is viewed towards the third positive direction Z1, the second dimension M2 is equal to the maximum dimension of notches 21B to 21D along the second axis Y. Furthermore, when the first magnetic substrate 20 is viewed towards the third positive direction Z1, the first dimension M1 is equal to the maximum dimension of notches 21B to 21D along the first axis X. Additionally, when the first magnetic substrate 20 is viewed towards the third positive direction Z1, the shape of notch 21A is one-quarter of an ellipse cut through its major and minor axes. The shape of notch 21A becomes the same as that of notches 21B to 21D. Therefore, when the first magnetic substrate 20 is viewed towards the third positive direction Z1, the areas of all notches 21 are equal.

[0085] Additionally, at edge S1, there are two gaps, gap 21A and gap 21D. At edge S3, there are two gaps, gap 21A and gap 21B.

[0086] Here, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the first magnetic substrate 20 is generally a rectangle that is longer along the second axis Y. Therefore, the dimension of the first magnetic substrate 20 along the direction of edge S1 is larger than the dimension of the first magnetic substrate 20 along the direction of edge S3. The dimension of the first magnetic substrate 20 along the direction of edge S1 is the maximum dimension of the first magnetic substrate 20 along the second axis Y. In addition, the dimension of the first magnetic substrate 20 along the direction of edge S3 is the maximum dimension of the first magnetic substrate 20 along the first axis X. Moreover, the value obtained by dividing the dimension of the first magnetic substrate 20 along the direction of edge S1 by the number of gaps 21 present on edge S1 (i.e., 2) by subtracting 1 is used as the first side spacing P1. In addition, the value obtained by dividing the dimension of the first magnetic substrate 20 along the direction of edge S3 by the number of gaps 21 present on edge S3 (i.e., 2) by subtracting 1 is used as the second side spacing P2. In this case, the spacing P1 of the first side is greater than the spacing P2 of the second side. In other words, the spacing between the gaps 21 existing on side S1 is greater than the spacing between the gaps 21 existing on side S3.

[0087] As described above, the number of gaps 21 present at edge S1 is the same as the number of gaps 21 present at edge S3. Here, when viewing the first magnetic substrate 20 in the third positive direction Z1, the shortest distance between two adjacent gaps 21 at the outer edge of the first magnetic substrate 20 is taken as the gap distance. In this case, the gap distance D1 along the direction of edge S1 is equal to the gap distance D2 along the direction of edge S3.

[0088] (Regarding the function and effects of the first embodiment)

[0089] Assuming that when viewing the first magnetic substrate 20 in the third positive direction Z1, the maximum size of the notch 21A along the direction of edge S1 (i.e., along the second axis Y) is equal to the maximum size of the notch 21A in the direction perpendicular to the direction along edge S1 (i.e., along the first axis X). In this case, simply increasing the area of ​​the notch 21 would result in a shorter distance between the notches 21 along the first axis X. On the other hand, if the distance between the notches 21 along the first axis X is ensured, it would be difficult to ensure the area of ​​the notch 21.

[0090] (1-1) According to the first embodiment described above, the second dimension M2 is larger than the first dimension M1. In this way, the dimensions of the gaps 21 are different, so the distance between the gaps 21 along the direction of the first axis X can be ensured, and the area of ​​the gaps 21 can be ensured.

[0091] Thus, according to the first embodiment described above, the second dimension M2 is intentionally made different from the first dimension M1. Therefore, it is possible to design a design that ensures sufficient area for the area of ​​the notch 21 when viewing the first magnetic substrate 20 in the third positive direction Z1, and to suppress electrical interference from external electrodes 92A to 92D, etc.

[0092] (1-2) According to the first embodiment described above, the first side spacing P1 is greater than the second side spacing P2. Specifically, the notch 21 is designed to be longer in the extension direction of the side S1 with the larger spacing, i.e., along the second axis Y. Therefore, the size of the notch 21 in the extension direction of the side S3 with the smaller spacing, i.e., along the first axis X, can be made smaller, thus easily ensuring the distance between the notches 21 along the first axis X. As a result, electrical interference from the external electrodes 92A to 92D is easily suppressed.

[0093] (1-3) According to the first embodiment described above, the gap distance D1 along the first axis X is equal to the gap distance D2 along the second axis Y. Therefore, electrical interference from external electrodes 92A to 92D can be prevented to the same extent in both directions. In addition, the range of the opening gaps on the second main surface MF2 is the same in both directions, so when the electronic component 10 is mounted on the substrate, the electronic component 10 is less likely to tilt, and the posture of the electronic component 10 is stable.

[0094] (1-4) According to the first embodiment described above, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the areas of all the notches 21 are equal. Therefore, when the electronic component 10 is mounted on the substrate, approximately the same amount of solder is attached to the four corners of the first magnetic substrate 20. As a result, it is possible to suppress the situation where the electronic component 10 is mounted on the substrate at an angle due to differences in the amount of solder.

[0095] (1-5) According to the first embodiment described above, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the shape of the notch 21 becomes a shape formed by cutting out a portion of an ellipse. Assuming that the notch 21 does not need to be machined at the corners compared to the case where the shape of the notch 21 is a quadrilateral shape, the notch 21 can be formed simply.

[0096] <Second Implementation>

[0097] Hereinafter, a second embodiment of the electronic component will be described with reference to the accompanying drawings. The main difference between the electronic component 10 of the first embodiment and the electronic component 110 of the second embodiment is the number of notches 121. Furthermore, the following description will focus on the differences from the electronic component 10 of the first embodiment, simplifying or omitting descriptions of similarities.

[0098] like Figure 5 As shown, the electronic component 110 includes six external electrodes 92A-92F and six connectors 91A-91F. This is because, although details are omitted, the electronic component 110 includes three coils. Although not shown in the diagram, each coil extends inside the laminate 30. Furthermore, portions of the lead wires connected to both ends of each coil are connected to the connectors 91A-91F. Moreover, as... Figure 6 As shown, the six notches 121 are located at positions corresponding to the connectors 91A to 91F.

[0099] (Regarding the gap)

[0100] like Figure 6 As shown, the first magnetic substrate 20 has six notches 121A to 121F. When the first magnetic substrate 20 is viewed in the third positive direction Z1, each notch 121 is present at one of the four corners and the middle of the long side. Hereinafter, without distinguishing between the six notches 121A to 121F, they will be referred to as notches 121.

[0101] When viewed from the center of the first magnetic substrate 20, notch 121A is located at an angle near the first positive direction X1 and near the second positive direction Y1. When viewed from the center of the first magnetic substrate 20, notch 121B is located at an angle near the first negative direction X2 and near the second positive direction Y1. When viewed from the center of the first magnetic substrate 20, notch 121C is located at an angle near the first negative direction X2 and near the second negative direction Y2. When viewed from the center of the first magnetic substrate 20, notch 121D is located at an angle near the first positive direction X1 and near the second negative direction Y2.

[0102] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the notch 121E is located at the center of the edge S1 along the second axis Y. Therefore, the notch 121E exists only on the edge S1 and is recessed inward from the edge S1. That is, the notch 121E is recessed from the edge S1 towards the first negative direction X2.

[0103] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the notch 121F is located at the center of the edge S2 along the second axis Y. Therefore, the notch 121F exists only on the edge S2 and is recessed inward from the edge S2. That is, the notch 121F is recessed from the edge S2 towards the first positive direction X1.

[0104] Furthermore, when viewing the first magnetic substrate 20 in the third positive direction Z1, the maximum dimension of the notch 121A in the direction perpendicular to edge S1, i.e., along the first axis X, is taken as the first dimension M11. Additionally, when viewing the first magnetic substrate 20 in the third positive direction Z1, the maximum dimension of the notch 121A in the direction along edge S1, i.e., along the second axis Y, is taken as the second dimension M12. In this case, the first dimension M11 and the second dimension M12 are different. Specifically, the first dimension M11 is larger than the second dimension M12. In this situation, when edge S3 is taken as the first edge, the first direction is along the first axis X, the second edge is edge S1, and the second direction is along the second axis Y.

[0105] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum size of the notch 121B along the direction of the edge S3, i.e. along the first axis X, is greater than the maximum size of the notch 121B in the direction perpendicular to the direction along the edge S3, i.e. along the second axis Y.

[0106] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum size of the notch 121C along the direction of the edge S3, i.e. along the first axis X, is greater than the maximum size of the notch 121C in the direction perpendicular to the direction along the edge S3, i.e. along the second axis Y.

[0107] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum size of the notch 121D along the direction of the edge S3, i.e. along the first axis X, is greater than the maximum size of the notch 121D in the direction perpendicular to the direction along the edge S3, i.e. along the second axis Y.

[0108] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum size of the notch 121E along the direction of the edge S3, that is, along the direction of the first axis X, is greater than the maximum size of the notch 121E in the direction perpendicular to the direction along the edge S3, that is, along the direction of the second axis Y.

[0109] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum size of the notch 121F along the direction of the edge S3, i.e. along the first axis X, is greater than the maximum size of the notch 121F in the direction perpendicular to the direction along the edge S3, i.e. along the second axis Y.

[0110] The shapes of notches 121E and 121F become half the shape of the ellipse obtained by cutting the ellipse through the minor axis.

[0111] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the second dimension M12 is equal to the maximum dimension of the notches 121B to 121F along the second axis Y. Furthermore, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the first dimension M11 is equal to the maximum dimension of the notches 121B to 121F along the first axis X. Therefore, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the areas of all notches 121 are equal.

[0112] Additionally, edge S1 contains three gaps: 121A, 121D, and 121E. Edge S3 contains two gaps: 121A and 121B.

[0113] Here, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the first magnetic substrate 20 is generally a rectangle that is longer in the direction along the second axis Y. Therefore, the dimension of the first magnetic substrate 20 along the direction of edge S1 is larger than the dimension of the first magnetic substrate 20 along the direction of edge S3. The dimension of the first magnetic substrate 20 along the direction of edge S1 is the maximum dimension of the first magnetic substrate 20 along the second axis Y. In addition, the dimension of the first magnetic substrate 20 along the direction of edge S3 is the maximum dimension of the first magnetic substrate 20 along the first axis X. Moreover, the value obtained by dividing the dimension of the first magnetic substrate 20 along the direction of edge S3 by the number of gaps 121 present on edge S3, i.e., 2 minus 1, is taken as the first side spacing P11. The value obtained by dividing the dimension of the first magnetic substrate 20 along the direction of edge S1 by the number of gaps 121 present on edge S1, i.e., 3 minus 1, is taken as the second side spacing P12. In this case, the spacing P11 of the first side is greater than the spacing P12 of the second side. In other words, the spacing between the gaps 121 existing on edge S3 is greater than the spacing between the gaps 121 existing on edge S1.

[0114] (Effects of the second implementation method)

[0115] According to the second embodiment described above, in addition to the effects of (1-1), (1-2), (1-4), and (1-5) of the first embodiment, the following effects are also achieved.

[0116] (2-1) According to the second embodiment described above, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the notch 121E is located at the center of the side S1 along the second axis Y. When the first magnetic substrate 20 is viewed in the third positive direction Z1, the notch 121F is located at the center of the side S2 along the second axis Y. In this case, regardless of the dimensions of the first magnetic substrate 20 in the direction along the first axis X and the direction along the second axis Y, the length dimension of the notch 121 can be designed based on the spacing between the notches 121 present in the side S1 and the spacing between the notches 121 present in the side S3.

[0117] <Third Implementation>

[0118] Hereinafter, a third embodiment of the electronic component will be described with reference to the accompanying drawings. The main difference between the electronic component 110 of the second embodiment and the electronic component 210 of the third embodiment is the shape of the notch 221. Furthermore, the following description will focus on the differences from the electronic component 110 of the second embodiment; for similarities, descriptions will be simplified or omitted.

[0119] (Regarding the gap)

[0120] like Figure 7 As shown, the first magnetic substrate 20 has six notches 221A to 221F. When the first magnetic substrate 20 is viewed in the third positive direction Z1, each notch 221 is present at one of the four corners and the middle of the long side. The positions of each notch 221 are the same as those of the notch 121 in the second embodiment. Hereinafter, without distinguishing between the six notches 221A to 221F, they will be referred to as notches 221.

[0121] When the first magnetic substrate 20 is viewed in the third positive direction Z1, notches 221A to 221D exist at the four corners. Notches 221A to 221D are formed by dividing a perfect circle into four parts along the circumference.

[0122] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum dimension of the notch 221A in the direction perpendicular to the direction along edge S1, i.e., along the first axis X, is defined as the first dimension M21. Furthermore, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum dimension of the notch 221A in the direction along edge S1, i.e., along the second axis Y, is defined as the second dimension M22. At this time, the first dimension M21 and the second dimension M22 are equal. Additionally, the notch 221A is an end notch located at the ends of edges S1 and S3.

[0123] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum size of the notch 221B along the direction of edge S1, i.e., along the direction of the second axis Y, is equal to the maximum size of the notch 221B in the direction perpendicular to the direction along edge S1, i.e., along the first axis X. In addition, the notch 221B is an end notch located at the ends of edges S2 and S3.

[0124] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum size of the notch 221C along the direction of edge S1, i.e., along the direction of the second axis Y, is equal to the maximum size of the notch 221C in the direction perpendicular to the direction along edge S1, i.e., along the first axis X. In addition, the notch 221C is an end notch located at the ends of edges S2 and S4.

[0125] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum size of the notch 221D along the direction of edge S1, i.e., along the direction of the second axis Y, is equal to the maximum size of the notch 221D in the direction perpendicular to the direction along edge S1, i.e., along the first axis X. In addition, the notch 221D is an end notch located at the ends of edge S1 and edge S4.

[0126] When viewing the first magnetic substrate 20 in the third positive direction Z1, the maximum dimension of the notch 221E in the direction perpendicular to the direction along edge S1, i.e., along the first axis X, is defined as the third dimension M23. Furthermore, when viewing the first magnetic substrate 20 in the third positive direction Z1, the maximum dimension of the notch 221E in the direction along edge S1, i.e., along the second axis Y, is defined as the fourth dimension M24. In this case, the third dimension M23 is smaller than the fourth dimension M24. Additionally, the notch 221E is a mid-notch located in the middle of edge S1.

[0127] When the first magnetic substrate 20 is viewed in the third positive direction Z1, the maximum dimension of the notch 221F in the direction perpendicular to the direction along edge S1, i.e., along the first axis X, is smaller than the maximum dimension of the notch 221F in the direction along edge S1, i.e., along the second axis Y. Furthermore, the notch 221F is a mid-notch located in the middle of edge S2. When the first magnetic substrate 20 is viewed in the third positive direction Z1, the third dimension M23 is equal to the maximum dimension of the notch 221F in the direction perpendicular to the direction along edge S1, i.e., along the first axis X. When the first magnetic substrate 20 is viewed in the third positive direction Z1, the fourth dimension M24 is equal to the maximum dimension of the notch 221F in the direction along edge S1, i.e., along the second axis Y.

[0128] (Regarding the function and effects of the third embodiment)

[0129] like Figure 8 As shown, when viewing the laminate 30 in the third positive direction Z1, the coil 361 extends inside the laminate 30. Here, a lead-out portion 371 is provided at the location of the laminate 30 corresponding to the notch 221, thus limiting the range of the coil 361. In this respect, if we assume that the dimension of the notch 221E, which is the central notch, is excessively large in the direction along the first axis X, then when viewing the laminate 30 in the third positive direction Z1, the area where the notch 221E overlaps with the coil 361 becomes larger. As a result, the range of the coil 361 becomes smaller.

[0130] (Effects of the third embodiment)

[0131] According to the third embodiment described above, in addition to the effects of (1-1) of the first embodiment, the following effects are also achieved.

[0132] (3-1) According to the third embodiment described above, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the distance between the coil 361 and the notches 221E and 221F, which are central notches, can be increased. Furthermore, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the overlap range between the coil 361 and the central notches can be reduced. Therefore, electrical interference between the lead-out portion 371 provided in the notch 221 and the coil 361 can be suppressed.

[0133] <Other Implementation Methods>

[0134] The above embodiments can be modified as follows. The above embodiments and the following modifications can be combined and implemented within the scope of technical inconsistency.

[0135] • When the first magnetic substrate 20 is viewed in the third positive direction Z1, the first magnetic substrate 20 can also be square. That is, the maximum dimension of the first magnetic substrate 20 along the first axis X can also be equal to the maximum dimension of the first magnetic substrate 20 along the second axis Y.

[0136] The shape of the notch in the first magnetic substrate 20 is not limited to the examples of the above embodiments. For example, in Figure 9 In the modified electronic component 310 shown, the shape of each notch 321 is different from that of the electronic component 10 in the first embodiment. Specifically, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the notches 321A to 321D are rectangular. Figure 10 In the modified electronic component 410 shown, the shape of each notch 421 is different from that of the electronic component 10 in the first embodiment. Specifically, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the notches 421A to 421D are triangular in shape.

[0137] In addition, Figure 11 In the modified electronic component 510 shown, the shape of each notch 521 is different from that of the electronic component 110 in the second embodiment. Specifically, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the notches 521A to 521F are rectangular. Figure 12 In the modified electronic component 610 shown, the shape of each notch 621 is different from that of the electronic component 110 in the second embodiment. Specifically, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the shapes of notches 621A to 621F become triangular. In this way, the shape of the notches can be appropriately changed. Furthermore, the shape of some of the notches may be different from that of the other notches.

[0138] In each of the above embodiments, when the first magnetic substrate 20 is viewed in the third positive direction Z1, the area of ​​each notch may be different. For example, the area of ​​each notch may be appropriately changed according to the position of the notch.

[0139] In each of the above embodiments, the maximum dimension of each notch along the first axis X and the maximum dimension along the second axis Y can be different from each other. For example, in the first embodiment, the first dimension M1 can also be larger than the second dimension M2.

[0140] In the second embodiment described above, when N and M are natural numbers greater than or equal to 2, there are N gaps 121 on the first side S3 and M gaps on the second side S1. Furthermore, the value obtained by dividing the dimension of the first magnetic substrate 20 along the direction of side S3 by N-1 is greater than the value obtained by dividing the dimension of the first magnetic substrate 20 along the direction of side S1 by M-1. In this case, it is preferable that the first dimension M11 is greater than the second dimension M12. Accordingly, similar to the second embodiment, the dimensions of the gaps 121 in the extending direction of the side S1 with small spacing can be made relatively small, thus easily ensuring the distance between the gaps 121 along the direction of side S1.

[0141] In the above embodiments, regardless of the spacing between the gaps on the first side and the gaps on the second side, the maximum dimension of the gap along the first axis X is different from the maximum dimension along the second axis Y. For example, in the second embodiment, the dimension of the gap 121 along the direction of edge S3 may also be smaller than the dimension of the gap 121 along the direction of edge S1.

[0142] • In the first embodiment described above, the gap distance D1 and the gap distance D2 may also be different. For example, if the area of ​​the second main surface MF2 of the first magnetic substrate 20 can be ensured to be large as a whole, then even if the gap distance D1 or the gap distance D2 becomes small, the tilting of the posture when mounting the electronic component 10 onto the substrate can be suppressed.

[0143] The structure of the laminate 30 can be appropriately modified. For example, in the first embodiment, it can be appropriately modified according to the extension method of the first coil 61, its number, the extension method of the first lead wire 70A, etc. The laminate 30 can be composed of at least a plurality of insulating layers.

[0144] • The second magnetic substrate 40 can also be omitted, or it can be a resin containing magnetic powder instead of a sintered body.

[0145] • The first adhesive layer 51 and the second adhesive layer 52 may also be omitted. In this case, the first magnetic substrate 20 and the laminate 30, and the second magnetic substrate 40 and the laminate 30 may also be connected by means of crimping or the like.

[0146] Each connector 91 can also completely cover the portion of the lead-out wiring exposed to the outside of the laminate 30. For example, in Figures 9-12 In the modified example of the electronic component shown, each connector 91 completely covers the surface of the lead-out portion facing the third negative direction Z2.

Claims

1. An electronic component, characterized in that, have: A magnetic substrate having a first main surface and a second main surface parallel to the first main surface, and having a plurality of notches connecting the first main surface and the second main surface; A laminate consisting of multiple insulating layers stacked on the first main surface; Multiple coils extending inside the laminate; Lead-out wiring is connected to the end of the coil and partially exposed into the interior of the notch; A connector, existing on the inner surface of the notch, and connected to the lead-out wiring; and An external electrode is located on the second main surface and is connected to the connector. When the magnetic substrate is viewed in a direction perpendicular to the first main surface, the outer edge of the magnetic substrate includes a straight first side, and at least one of the plurality of notches is recessed inward from the first side. When viewing the magnetic substrate in a direction perpendicular to the first main surface, taking the direction along the first side as the first direction and the direction perpendicular to the first direction as the second direction, the maximum size of the notch in the first direction is different from the maximum size of the notch in the second direction. The maximum dimension of the magnetic substrate in the first direction is greater than the maximum dimension of the magnetic substrate in the second direction. When the magnetic substrate is viewed in a direction perpendicular to the first main surface, the outer edge of the magnetic substrate includes a second side adjacent to the first side and along the second direction. The number of gaps on the first side is multiple, and the number of gaps on the second side is the same as the number of gaps on the first side. When the shortest distance between two adjacent gaps is taken as the gap distance, The distance between the gaps in the first direction is equal to the distance between the gaps in the second direction.

2. The electronic component according to claim 1, characterized in that, The plurality of notches have: end notches located at the ends of the first side and middle notches located in the middle of the first side. When viewing the magnetic substrate in a direction perpendicular to the first main surface... The maximum dimension of the central notch in the second direction is smaller than the maximum dimension of the central notch in the first direction present on the first side.

3. An electronic component, characterized in that, have: A magnetic substrate having a first main surface and a second main surface parallel to the first main surface, and having a plurality of notches connecting the first main surface and the second main surface; A laminate consisting of multiple insulating layers stacked on the first main surface; Multiple coils extending inside the laminate; Lead-out wiring is connected to the end of the coil and partially exposed into the interior of the notch; A connector, existing on the inner surface of the notch, and connected to the lead-out wiring; and An external electrode is located on the second main surface and is connected to the connector. When the magnetic substrate is viewed in a direction perpendicular to the first main surface, the outer edge of the magnetic substrate includes a straight first side, and at least one of the plurality of notches is recessed inward from the first side. When viewing the magnetic substrate in a direction perpendicular to the first main surface, taking the direction along the first side as the first direction and the direction perpendicular to the first direction as the second direction, the maximum size of the notch in the first direction is different from the maximum size of the notch in the second direction. The plurality of notches have: end notches located at the ends of the first side and middle notches located in the middle of the first side. When viewing the magnetic substrate in a direction perpendicular to the first main surface... The maximum dimension of the middle notch in the second direction is smaller than the maximum dimension of the end notch in the second direction present on the first side.

4. The electronic component according to claim 1 or 3, characterized in that, When the magnetic substrate is viewed in a direction perpendicular to the first main surface, the outer edge of the magnetic substrate includes a second side adjacent to the first side and along the second direction. When N and M are natural numbers greater than 2. There are N gaps on the first side and M gaps on the second side. The value obtained by dividing the maximum dimension of the magnetic substrate in the first direction by N-1 is greater than the value obtained by dividing the maximum dimension of the magnetic substrate in the second direction by M-1. The maximum dimension of the notch in the first direction is greater than the maximum dimension of the notch in the second direction.

5. The electronic component according to claim 3, characterized in that, When viewing the magnetic substrate in a direction perpendicular to the first main surface... The maximum dimension of the central notch in the second direction is smaller than the maximum dimension of the central notch in the first direction present on the first side.

6. The electronic component according to claim 1 or 3, characterized in that, When viewing the magnetic substrate in a direction perpendicular to the first main surface... All of the aforementioned gaps have the same area.

7. The electronic component according to claim 1 or 3, characterized in that, When viewing the magnetic substrate in a direction perpendicular to the first main surface... The notch is formed by cutting out a portion of the ellipse.

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