A fast-curing epoxy grouting liquid for low-viscosity water-containing plugging and a preparation method thereof

Abstract

The invention discloses a fast-curing epoxy grouting liquid for low-viscosity water-containing plugging. The fast-curing epoxy grouting liquid comprises a component A, wherein raw materials of the component A comprise A1, A2, A3 and A4; the A1 is one of bisphenol A epoxy resin E51, bisphenol A epoxy resin 128 or bisphenol A epoxy resin 828, and the added mass fraction of A1 is 50-60% of the component A; the A2 is one of cyclohexanediol diglycidyl ether or resorcinol diglycidyl ether, and the added mass fraction of A2 is 15-20% of the component A; the A3 is one of C12-C14 alcohol glycidyl ether, cardanol glycidyl ether or 1,6-hexanediol diglycidyl ether, and the added mass fraction of A3 is 15-20% of the component A; the A4 is one of triphenyl phosphite or diphenyl phosphite, and the added mass fraction of A4 is 10-20% of the component A. The invention also discloses a method for preparing a fast-curing epoxy grouting liquid for plugging leaks with low viscosity and water, which comprises the steps of preparing component A and component B.

Description

Technical Field

[0001] The invention relates to the technical field of solidifying slurry, and in particular to a fast-curing epoxy grouting liquid for low-viscosity water-containing plugging and a preparation method thereof. Background Art

[0002] In actual application, low-viscosity polyurethane grouting materials were generally used for plugging leaks in the past. It has the advantages of fast curing speed and obvious emergency plugging effect. However, due to the reaction between isocyanate and water, the glue layer bubbles and shrinks greatly, which greatly increases the possibility of secondary leakage. Local governments in many places, including Shenzhen, have issued regulations that do not allow the use of polyurethane in subway tunnel plugging projects.

[0003] Therefore, epoxy resin has been used for plugging leaks in many projects. However, a common problem is that compared with polyurethane, epoxy grouting fluid cures slowly. There are many cases where water pressure squeezes out the grouting material due to slow curing, resulting in plugging failure.

[0004] Since the grouting fluid has high compressive strength, high hardness and low elongation after solidification, it is easy to crack when the formation cracks produce thermal expansion and contraction, resulting in secondary leakage; open water with water pressure is often seen in tunnel cracks, and the grouting fluid has poor water bonding strength, poor permeability, poor wet bonding ability and durability of the adhesive layer, which can easily lead to plugging failure; the mixed viscosity is high, and the effect of grouting on micro-cracks is poor.

[0005] The existing epoxy resin system with furfural acetone (cyclohexanone) added has low mixed viscosity, good wettability, long operation time and high compressive strength. However, it is not suitable for use in the grouting and plugging industry because of its slow curing, high solvent content, high VOC emissions, high toxicity and low elongation. The epoxy reactive diluent system often has the defects of high mixed viscosity, slow curing, low elongation, low colloid strength, low reaction crosslinking degree at low temperature and poor bonding strength of the interface during construction with water. The epoxy acrylic hybrid system has low cost, poor compatibility, large shrinkage, easy cracking, low crosslinking degree at low temperature and poor bonding strength during construction with water. Summary of the invention

[0006] To solve the above problems, the present invention provides a fast-curing epoxy grouting liquid for low-viscosity water-containing plugging, comprising component A, wherein the raw materials of component A include A1, A2, A3 and A4; the A1 is one of bisphenol A epoxy resin E51, bisphenol A epoxy resin 128 or bisphenol A epoxy resin 828, and the added mass fraction of A1 is 50-60% of component A; the A2 is one of cyclohexanediol diglycidyl ether or resorcinol diglycidyl ether, and the added mass fraction of A2 is 15-20% of component A; the A3 is one of C12-C14 alcohol glycidyl ether, cardanol glycidyl ether or 1,6-hexanediol diglycidyl ether, and the added mass fraction of A3 is 15-20% of component A; the A4 is one of triphenyl phosphite or diphenyl phosphite, and the added mass fraction of A4 is 10-20% of component A.

[0007] Preferably, component B is also included, and the raw materials of component B include B1 and B2; B1 is a low-temperature curing agent, B1 contains 1 mol of primary hydroxyl groups and 1 mol of tertiary amine, and the added mass fraction of B1 is 24-75% of component B; B2 is a low-temperature and low-viscosity curing agent with a long-chain toughening group, 1 mol of the molecule contains 6-7 amino groups, and the added mass fraction of B2 is 24-75% of component B.

[0008] Preferably, component B also includes B3, B3 is 2,4,6-tris(dimethylaminomethyl)phenol, and the added mass fraction of B3 is 0.1-1% of component B.

[0009] Preferably, A2 is a mixture of cyclohexanediol diglycidyl ether and resorcinol diglycidyl ether.

[0010] Preferably, A3 is a mixture of 2-3 of C12-C14 alcohol glycidyl ether, cardanol glycidyl ether and 1,6-hexanediol diglycidyl ether.

[0011] Preferably, the A4 is a mixture of triphenyl phosphite and diphenyl phosphite.

[0012] The present invention also proposes a method for preparing a low-viscosity fast-curing epoxy grouting liquid for plugging leaks with water, comprising:

[0013] Step 1: Add 500-600 g of component A1, 150-200 g of component A2, 150-200 g of component A3 and 100-200 g of component A4 into a 1000 ml glass kettle equipped with a nitrogen tube, a condenser and a thermometer;

[0014] Step 2: Heat the glass kettle in the above step 1 to 50°C, mix and stir for 1 hour to obtain component A.

[0015] Preferably, the method further comprises the following steps:

[0016] Step 3: Add 240-750 g of component B1, 240-750 g of component B2 and 10 g of DMP30 to a new 1000 ml glass kettle equipped with a nitrogen tube, condenser and thermometer;

[0017] Step 4: Heat the glass kettle in the above step 3 to 50°C, mix and stir for 1 hour to obtain component B.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. Increase the curing speed of low-viscosity grouting fluid to 15-20 minutes, and the operation time is about 10 minutes.

[0020] 2. The cured product has good toughness, with an elongation of more than 35% and a tensile strength greater than 16MPa, effectively resisting deformation caused by stress.

[0021] 3. High wet bonding strength, good hydrophobicity, good durability, positive tensile bonding strength for concrete with water > 2.6Mpa., good durability.

[0022] 4. Reduce the mixed viscosity of the grouting liquid to about 200-250mpas, which has good permeability and wetting performance at the wet concrete interface, and can achieve grouting of small microcracks.

[0023] 5. Achieve rapid curing and bonding in low temperature (above -5°C) environment. DETAILED DESCRIPTION

[0024] The technical scheme of the present invention will be further described in detail below in conjunction with specific embodiments. The following embodiments are only exemplary to illustrate and explain the present invention, and should not be construed as limiting the scope of protection of the present invention. All technologies implemented based on the above content of the present invention are included in the scope that the present invention is intended to protect.

[0025] Unless otherwise specified, the raw materials and reagents used in the following examples are commercially available or can be prepared by known methods.

[0026] Embodiment 1:

[0027] (1) Add 500 g of 128 epoxy resin, 200 g of cyclohexanediol diglycidyl ether, 200 g of C12-14 alcohol glycidyl ether, and 100 g of triphenyl phosphite into a 1000 ml glass kettle equipped with a nitrogen tube, condenser, and thermometer.

[0028] (2) Heat the glass kettle to 50°C and stir for 1 hour to obtain component A.

[0029] (3) 240 g of curing agent of component B1, 750 g of curing agent of component B2, and 10 g of DMP30 were added sequentially into a 1000 ml glass kettle equipped with a nitrogen tube, a condenser, and a thermometer.

[0030] (4) Heat the glass kettle to 50°C and stir for 1 hour to obtain component B.

[0031] Embodiment: 2:

[0032] (1) Add 600 g of 128 epoxy resin, 150 g of cyclohexanediol diglycidyl ether, 150 g of C12-14 alcohol glycidyl ether, and 100 g of triphenyl phosphite into a 1000 ml glass kettle equipped with a nitrogen tube, condenser, and thermometer.

[0033] (2) Heat the glass kettle to 50°C and stir for 1 hour to obtain component A.

[0034] (3) 340 g of curing agent of component B1, 650 g of curing agent of component B2, and 10 g of DMP30 were added sequentially into a 1000 ml glass kettle equipped with a nitrogen tube, a condenser, and a thermometer.

[0035] (4) Heat the glass kettle to 50°C and stir for 1 hour to obtain component B.

[0036] Embodiment 3:

[0037] (1) Add 500 g of 128 epoxy resin, 150 g of cyclohexanediol diglycidyl ether, 150 g of C12-14 alcohol glycidyl ether, and 200 g of triphenyl phosphite into a 1000 ml glass kettle equipped with a nitrogen tube, condenser, and thermometer.

[0038] (2) Heat the glass kettle to 50°C and stir for 1 hour to obtain component A.

[0039] (3) 750 g of curing agent of component B1, 240 g of curing agent of component B2, and 10 g of DMP30 were added sequentially into a 1000 ml glass kettle equipped with a nitrogen tube, a condenser, and a thermometer.

[0040] (4) Heat the glass kettle to 50°C and stir for 1 hour to obtain component B.

[0041] Embodiment 4:

[0042] (1) Add 500 g of 128 epoxy resin, 150 g of cyclohexanediol diglycidol, 150 g of C12-14 alcohol glycidyl ether, and 200 g of triphenyl phosphite into a 1000 ml glass kettle equipped with a nitrogen tube, condenser, and thermometer.

[0043] (2) Heat the glass kettle to 50°C and stir for 1 hour to obtain component A.

[0044] (3) Add 500 g of curing agent of component B1, 490 g of curing agent of component B2, and 10 g of DMP30 in sequence into a 1000 ml glass kettle equipped with a nitrogen tube, a condenser, and a thermometer.

[0045] (4) Heat the glass kettle to 50°C and stir for 1 hour to obtain component B.

[0046] Embodiment 5:

[0047] (1) Add 500 g of 128 epoxy resin, 200 g of cyclohexanediol diglycidyl ether, 200 g of 1,6-hexanediol diglycidyl ether, and 100 g of diphenyl phosphite into a 1000 ml glass kettle equipped with a nitrogen tube, condenser, and thermometer.

[0048] (2) Heat the glass kettle to 50°C and stir for 1 hour to obtain component A.

[0049] (3) 250 g of curing agent of component B1, 740 g of curing agent of component B2, and 10 g of DMP30 were added sequentially into a 1000 ml glass kettle equipped with a nitrogen tube, a condenser, and a thermometer.

[0050] (4) Heat the glass kettle to 50°C and stir for 1 hour to obtain component B.

[0051] Embodiment 6:

[0052] (1) Add 500 g of 128 epoxy resin, 200 g of isophenyl diglycidyl ether, 200 g of nonylphenol glycidyl ether, and 100 g of diphenyl phosphite into a 1000 ml glass kettle equipped with a nitrogen tube, a condenser, and a thermometer.

[0053] (2) Heat the glass kettle to 50°C and stir for 1 hour to obtain component A.

[0054] (3) Add 500 g of curing agent of component B1, 490 g of curing agent of component B2, and 10 g of DMP30 in sequence into a 1000 ml glass kettle equipped with a nitrogen tube, a condenser, and a thermometer.

[0055] (4) Heat the glass kettle to 50°C and mix and stir for 1 hour to obtain component B.

[0056] In the above 6 embodiments, the low temperature curing agent used in component B1 is low temperature fast curing agent MH-2805 produced by Changsha Xindehang Chemical Co., Ltd. (for details, please refer to the website:

[0057] http: / / www.csdehang.com / m / chanpinzhongxin / fqw / 1050101.html), the low temperature and low viscosity curing agent used in component B2 is Changsha Xindehang Chemical Co., Ltd.'s low temperature carbon fiber glue carbon plate glue curing agent MH-222 (for details, please see the website:

[0058] http: / / www.csdehang.com / m / chanpinzhongxin / jkg / d58d601d-4fc2-4ba5-b9ea-bb d0e5fdce3b.html).

[0059] The following table is a performance comparison table of the above six embodiments:

[0060]

[0061] A2 is a bifunctional epoxy reactive diluent with a benzene ring or an aliphatic ring, which not only dilutes the epoxy resin, but also increases the hardness and strength of the cured product.

[0062] A3 is a long-chain active diluent, which not only has a dilution effect but also improves toughness and elongation.

[0063] A4 is a special epoxy reactive diluent, which can dilute epoxy resin. At the same time, 1 mol of A4 reacts with 2-3 mol of hydroxyl groups to precipitate phenol. In the process of epoxy resin reacting with amine curing agent, a large number of secondary hydroxyl groups are generated. Some of the secondary hydroxyl groups react with A4 to link the molecular segments of different epoxy groups, increase the colloid strength and molecular weight, and improve the tear strength of the cured product. The phenol produced by the reaction can be used as an accelerator for the reaction of epoxy with amine curing agent to accelerate the curing reaction of the whole system. A4 is acidic. After mixing with the curing agent, the acid-base neutralization salt quickly generates a large amount of heat, which accelerates the curing reaction. A1, A2, A3, and A4 all have good hydrophobicity.

[0064] B1 and B2 can be constructed with water. B1 is the new Dehang low-temperature curing agent MH2805, which has the characteristics of fast low-temperature curing speed and high underwater bonding strength. 1 mol of MH2805 curing agent contains 1 mol of primary hydroxyl and 1 mol of tertiary amine in its molecular structure. After mixing with agent A, B1 can quickly react with A4 to release heat, thereby initiating the reaction of tertiary amine and epoxy in the molecule, quickly increasing the reaction temperature of the curing system and accelerating the curing speed. The HLB value of the curing agent is between 7-9, which can effectively wet the substrate with water and increase permeability.

[0065] B2 is Xindehang's multi-amino structure toughening curing agent MH222, which has a long-chain toughening group and contains 6-7 amino groups in 1 mol of the molecule. It has low viscosity, high structural strength of the cured product, high elongation, and strong hydrophobicity.

[0066] B3 is a tertiary amine, which further accelerates the heat release of the system and speeds up the reaction.

[0067] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. A fast-curing epoxy grouting liquid for low-viscosity water-filled plugging, characterized in that: The invention comprises component A, wherein the raw materials of component A comprise A1, A2, A3 and A4; wherein A1 is one of bisphenol A epoxy resin E51, bisphenol A epoxy resin 128 or bisphenol A epoxy resin 828, and the added mass fraction of A1 is 50-60% of component A; wherein A2 is one of cyclohexanediol diglycidyl ether or resorcinol diglycidyl ether, and the added mass fraction of A2 is 15-20% of component A; wherein A3 is one of C12-C14 alcohol glycidyl ether, cardanol glycidyl ether or 1,6-hexanediol diglycidyl ether, The added mass fraction of A3 is 15-20% of component A; the A4 is one of triphenyl phosphite or diphenyl phosphite, and the added mass fraction of A4 is 10-20% of component A; component B is also included, and the raw materials of component B include B1 and B2; B1 is a low-temperature curing agent, B1 contains 1 mol of primary hydroxyl group and 1 mol of tertiary amine, and the added mass fraction of B1 is 24-75% of component B; B2 is a low-temperature and low-viscosity curing agent with a long-chain toughening group, and 1 mol of the molecule contains 6-7 amino groups, and the added mass fraction of B2 is 24-75% of component B.

2. A low-viscosity, water-containing, fast-curing epoxy grouting liquid for plugging leaks according to claim 1, characterized in that: The B component also includes B3, B3 is 2,4,6-tris(dimethylaminomethyl)phenol, and the added mass fraction of B3 is 0.1-1% of the B component.

3. A fast-curing epoxy grouting liquid for plugging leaks with low viscosity and water according to claim 1, characterized in that: The A2 is a mixture of cyclohexanediol diglycidyl ether and resorcinol diglycidyl ether.

4. A fast-curing epoxy grouting liquid for plugging leaks with low viscosity and water according to claim 1, characterized in that: The A3 is a mixture of 2-3 of C12-C14 alcohol glycidyl ether, cardanol glycidyl ether and 1,6-hexanediol diglycidyl ether.

5. A low-viscosity, water-containing, fast-curing epoxy grouting liquid for plugging leaks according to claim 1, characterized in that: The A4 is a mixture of triphenyl phosphite and diphenyl phosphite.

6. A method for preparing a low-viscosity fast-curing epoxy grouting liquid for plugging leaks with water according to any one of claims 1 to 5, characterized in that: Step 1: Add 500-600 g of component A1, 150-200 g of component A2, 150-200 g of component A3 and 100-200 g of component A4 into a 1000 ml glass kettle equipped with a nitrogen tube, a condenser and a thermometer; Step 2: Heat the glass kettle in the above step 1 to 50°C, mix and stir for 1 hour to obtain component A.

7. The method for preparing a fast-curing epoxy grouting liquid for plugging leaks with low viscosity and water according to claim 6, characterized in that: The following steps are also included: Step 3: Add 240-750 g of component B1, 240-750 g of component B2 and 10 g of DMP30 to a new 1000 ml glass kettle equipped with a nitrogen tube, condenser and thermometer; Step 4: Heat the glass kettle in the above step 3 to 50°C, mix and stir for 1 hour to obtain component B.

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