Testing device and testing method thereof

Abstract

The present invention provides a testing device and a testing method thereof, comprising: a rack, a material tube for loading semiconductor circuits, a loading mechanism, a track, a withstand voltage test module, a marking visual inspection module, an electrical parameter and thermal resistance test module, an appearance inspection module, and a loading mechanism, respectively arranged on the rack. The loading mechanism and the loading mechanism are arranged opposite each other, and the withstand voltage test module, the marking visual inspection module, the electrical parameter and thermal resistance test module, and the appearance inspection module are respectively arranged corresponding to the track. The loading mechanism and the loading mechanism are arranged opposite each other, and the loading mechanism is used to place the material tube. The track is used to transfer the material tube from the loading mechanism to the loading mechanism. The withstand voltage test module, the marking visual inspection module, the electrical parameter and thermal resistance test module, and the appearance inspection module are respectively used to inspect the products in the material tube passing through. The present invention has high testing accuracy, high efficiency, and high reliability.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor testing technology, and in particular to a testing device and a testing method thereof. Background Art

[0002] The semiconductor circuit IPM (Intelligent Power Module) not only integrates power switching devices and driver circuits but also features built-in fault detection circuits for overvoltage, overcurrent, and overheating, sending detection signals to the CPU or DSP for interrupt processing. It is constructed with a high-speed, low-power die, optimized gate-level driver circuits, and fast protection circuits. Even in the event of a load accident or improper use, the IPM itself is protected from damage. IPMs typically use IGBTs as power switching elements and feature an integrated current sensor and driver circuit.

[0003] Existing IPM semiconductor circuit IC drive control circuits, IPM sampling and amplification circuits, and PFC current protection circuits, along with low-voltage control circuits and inverter circuits composed of high-voltage power devices, are laid out on the same board. Currently, only semiconductor circuit electrical parameter testing can be implemented in online production, and this testing only includes electrical parameter testing, not thermal resistance testing. Thermal resistance testing, on the other hand, is only available offline and cannot be automated online. Combining electrical parameters with thermal resistance testing for online testing is becoming an industry trend.

[0004] Therefore, the above-mentioned existing semiconductor circuits have poor testing accuracy, low testing efficiency, poor reliability and a small scope of application. Summary of the Invention

[0005] In view of the deficiencies of the above related technologies, the present invention provides a testing device and a testing method thereof with high testing accuracy, high efficiency and high reliability.

[0006] To solve the above technical problems, in a first aspect, an embodiment of the present invention provides a testing device, comprising: a rack, a material tube for loading semiconductor circuits, a loading mechanism respectively arranged on the rack, a track, a withstand voltage test module, a marking and visual inspection module, an electrical parameter and thermal resistance test module, an appearance inspection module, and a unloading mechanism, wherein the loading mechanism is arranged opposite to the unloading mechanism, and the withstand voltage test module, the marking and visual inspection module, the electrical parameter and thermal resistance test module, and the appearance inspection module are respectively arranged corresponding to the track;

[0007] The loading mechanism is arranged opposite to the unloading mechanism. The loading mechanism is used to place the material pipe. The track is used to transfer the material pipe from the loading mechanism to the unloading mechanism. The pressure test module, the marking visual inspection module, the electrical parameter and thermal resistance test module and the appearance inspection module are respectively used to inspect the passing material pipe.

[0008] Preferably, the feeding mechanism comprises an upper collecting area and a feeding area, and the feeding area corresponds to the inlet end of the track.

[0009] Preferably, the unloading mechanism includes a lower collection area and a unloading area, and the unloading area corresponds to the outlet end of the track.

[0010] Preferably, when a single material tube moves to the entrance end aligned with the track, the material tube tilts upward by 30°-70°, and the semiconductor circuit slides out of the material tube onto the track under the action of gravity, until all the semiconductor circuits in the material tube slide out and the material tube returns to its original horizontal position.

[0011] Preferably, the voltage resistance test module, the marking visual inspection module, the electrical parameter and thermal resistance test module and the appearance inspection module are arranged side by side.

[0012] Preferably, the voltage resistance test module, the marking visual inspection module, the electrical parameter and thermal resistance test module and the appearance inspection module are sequentially arranged on one side of the track.

[0013] Preferably, the electrical parameter and thermal resistance test module includes a circuit board, an electrical parameter test circuit and a transient thermal resistance test circuit arranged on the circuit board.

[0014] Preferably, the transient thermal resistance test circuit includes a heating voltage source, a heating constant current source, a test current part and an electronic switch, and the heating constant current source is connected to the test current part in parallel and then connected to the electronic switch.

[0015] In a second aspect, an embodiment of the present invention further provides a testing method for a testing device, the testing method comprising the following steps:

[0016] S1. Loading: Products from the previous process are transported to the entrance of the loading mechanism via an automated track;

[0017] S2. Pressure test: testing the pressure resistance of the product through the pressure test module on one end of the track;

[0018] S3. Labeling visual inspection: using a labeling visual inspection module to check whether the label of the product is clear and correct;

[0019] S4, electrical parameter and thermal resistance test: Use the electrical parameter and thermal resistance test module to detect whether the various parameters of the product are within the preset index range;

[0020] S5. Product appearance inspection: Use the appearance inspection module to inspect whether the product has any defects in appearance and whether the pins are offset or damaged;

[0021] S6. Unloading: The unloading mechanism directly transports the qualified products after the S1-S5 inspection to the packaging area for packaging and storage, and the defective products are output to the defective product packaging area for analysis.

[0022] Compared with the related art, the present invention comprises a material tube, a loading mechanism, a track, a voltage test module, a marking visual inspection module, an electrical parameter and thermal resistance test module, an appearance inspection module and a unloading mechanism for loading semiconductor circuits. The loading mechanism is arranged relative to the unloading mechanism, and the voltage test module, the marking visual inspection module, the electrical parameter and thermal resistance test module and the appearance inspection module are respectively arranged corresponding to the track; the loading mechanism is arranged relative to the unloading mechanism, the loading mechanism is used to place the material tube, and the track is used to transfer the material tube from the loading mechanism to the unloading mechanism, and the voltage test module, the marking visual inspection module, the electrical parameter and thermal resistance test module and the appearance inspection module are respectively used to inspect the material tube passing through. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be described in detail below with reference to the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description made with reference to the following drawings. In the accompanying drawings:

[0024] Figure 1 It is a structural schematic diagram of the testing equipment of the present invention;

[0025] Figure 2 A top view of the test device of the present invention;

[0026] Figure 3 Schematic diagram of the three-dimensional structure of the electrical parameter and thermal resistance test module of the present invention;

[0027] Figure 4 A top view of the electrical parameter and thermal resistance test module of the present invention;

[0028] Figure 5 A circuit diagram of a semiconductor circuit of the present invention;

[0029] Figure 6 is a circuit diagram of a transient thermal resistance test circuit of the present invention;

[0030] Figure 7 for Figure 5 A partial enlarged view of

[0031] Figure 8 for Figure 5 A partial enlarged view of

[0032] Figure 9 The figure is a flow chart of the testing method of the testing device of the present invention.

[0033] In the figure, 1. loading mechanism, 2. track, 3. withstand voltage test module, 4. marking visual inspection module, 5. electrical parameter and thermal resistance test module, 6. appearance inspection module, 7. unloading mechanism, 8. rack, 9. upper collection area, 10. loading area, 11. lower collection area, 12. unloading area, 13. semiconductor circuit, 14. electrical parameter test circuit, 15. transient thermal resistance test circuit, 16. control part, 17. power supply, 18. circuit board, 19. heating voltage source, 20. heating constant current source, 21. test current part, 22. electronic switch. DETAILED DESCRIPTION

[0034] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0035] The specific embodiments and examples described herein are specific embodiments of the present invention and are intended to illustrate the concepts of the present invention. They are illustrative and exemplary only and should not be construed as limiting the embodiments and scope of the present invention. In addition to the examples described herein, those skilled in the art may also employ other obvious technical solutions based on the claims and disclosure of this application. Such solutions, including any obvious substitutions and modifications of the embodiments described herein, are within the scope of protection of the present invention.

[0036] Example 1

[0037] Please refer to Figures 1-8 As shown, the present invention provides a testing device, including: a rack 8, a material tube for loading semiconductor circuits (not shown in the figure), a loading mechanism 1, a track 2, a voltage test module 3, a marking visual inspection module 4, an electrical parameter and thermal resistance test module 5, an appearance inspection module 6 and a unloading mechanism 7 respectively arranged on the rack 8, the loading mechanism 1 is arranged opposite to the unloading mechanism 7, the voltage test module 3, the marking visual inspection module 4, the electrical parameter and thermal resistance test module 5 and the appearance inspection module 6 are respectively arranged corresponding to the track 2; the loading mechanism 1 is arranged opposite to the unloading mechanism 7, the loading mechanism 1 is used to place the material tube, the track 2 is used to transfer the material tube from the loading mechanism 1 to the unloading mechanism 7, the voltage test module 3, the marking visual inspection module 4, the electrical parameter and thermal resistance test module 5 and the appearance inspection module 6 are respectively used to inspect the products passing through the material tube.

[0038] Specifically, the frame 8 is used to support and fix the feeding mechanism 1, the track 2, the voltage test module 3, the marking visual inspection module 4, the electrical parameter and thermal resistance test module 5, the appearance inspection module 6 and the unloading mechanism 7. The product loaded in the material tube is now placed on the feeding mechanism 1. Through mechanical automatic movement, the single material tube filled with products in the feeding mechanism 1 will be moved to the left to align with the entrance of the track 2. The product will be moved to the top of the track 2, and the product will be moved to the unloading mechanism 7 through the track 2. In the process of the product moving from the feeding mechanism 1 to the unloading mechanism 7, the voltage test module 3 on one side of the track 2, the marking visual inspection module 4, the electrical parameter and thermal resistance test module 5 and the appearance inspection module 6 respectively perform voltage test, marking visual inspection, electrical parameter and thermal resistance test and appearance inspection on the product in the material tube. The whole process completes the automated testing of the product with good test effect and high test efficiency. In this way, the transient thermal resistance test is also integrated into the test program on the basis of the electrical parameter test, making the entire product test more comprehensive and efficient, thereby improving the reliability of the product.

[0039] In this embodiment, the loading mechanism 1 includes an upper collection area 9 and a loading area 10. The loading area 10 corresponds to the entrance of the track 2. The upper collection area 9 is used to collect empty tubes, and the loading area 10 is used to place tubes filled with products, so that the tubes can slide the products inside onto the track 2 under the action of gravity. The products are transported via the track 2 to facilitate testing by the withstand voltage test module 3, the marking visual inspection module 4, the electrical parameter and thermal resistance test module 5, and the appearance inspection module 6.

[0040] In this embodiment, the unloading mechanism 7 includes a lower collection area 11 and a unloading area 12. The unloading area 12 corresponds to the outlet end of the track 2. It is convenient for unloading the products after testing. The lower collection area 11 collects the qualified products and separates the unqualified products, thereby achieving the effect of automated testing.

[0041] In this embodiment, when a single material tube moves to align with the entrance end of the track 2, the material tube tilts upward by 30°-70°, and the semiconductor circuit slides out of the material tube onto the track 2 under the action of gravity. The material tube returns to its original horizontal position until all the semiconductor circuits in the material tube slide out.

[0042] In this embodiment, the withstand voltage test module 3 , the marking visual inspection module 4 , the electrical parameter and thermal resistance test module 5 , and the appearance inspection module 6 are arranged side by side, which is convenient for installation and for detecting products passing on the track 2 .

[0043] In this embodiment, the withstand voltage test module 3, the marking visual inspection module 4, the electrical parameter and thermal resistance test module 5, and the appearance inspection module 6 are sequentially arranged on one side of the track 2. This allows for sequential inspection of withstand voltage performance, marking visual inspection, electrical parameter and thermal resistance performance, and appearance.

[0044] In this embodiment, the electrical parameter and thermal resistance testing module 5 includes a circuit board 18 , an electrical parameter testing circuit and a transient thermal resistance testing circuit 15 provided on the circuit board 18 .

[0045] The electrical parameter test circuit 14 is composed of static parameters and dynamic parameters, wherein the static parameters are composed of the PFC part, the inverter part, and the control part 16; the dynamic parameters are composed of the PFC part, the inverter part, and the control part 16.

[0046] Specifically, the circuit is provided with multiple pins, including 1, the collector of the PFC IGBT; (VB3) 4, the W-phase high-side floating power supply 17 for the driver IC; (W, VS3) 5, the W-phase output, the W-phase high-side floating power ground for the driver IC; (VB2) 8, the V-phase high-side floating power supply 17 for the driver IC; (V, VS2) 9, the V-phase output, the V-phase high-side floating power ground for the driver IC; (VB1) 12, the U-phase high-side floating power supply 17 for the driver IC; (U, VS1) 13, the U-phase output, the U-phase high-side floating power ground for the driver IC; (VCC1) 16, the output of the PFC rectifier diode; (VCC2) 17, the bus voltage input; (-VCC) 20, the emitter of the PFC IGBT; (W-) 21, the emitter of the W-phase lower-bridge IGBT; (V-) 22, the emitter of the V-phase lower-bridge IGBT; and (U-) 23, the emitter of the U-phase lower-bridge IGBT. (HIN1) 24, U-phase upper bridge drive signal input. (HIN2) 25, V-phase upper bridge drive signal input. (HIN3) 26, W-phase upper bridge drive signal input. (LIN1) 27, U-phase lower bridge drive signal input. (LIN2) 28, V-phase lower bridge drive signal input. (LIN3) 29, W-phase lower bridge drive signal input. (PFCIN) 30, PFC drive signal input. (FLT / EN) 31, FAULT output and enable input multiplexed terminal, NTC output terminal. (PFCTRIP) 32, PFC section overcurrent protection voltage sampling terminal. (ITRIP) 33, inverter section overcurrent protection voltage sampling terminal. (VDD) 34, driver IC power supply 17. (VSS) 35, driver IC power supply ground.

[0047] In this embodiment, the transient thermal resistance test circuit 15 includes a heating voltage source 19, a heating constant current source 20, a test current part 21 and an electronic switch 22. The heating constant current source 20 is connected to the test current part 21 in parallel and then connected to the electronic switch 22.

[0048] Specifically, the heating voltage source 19 should maintain an error of ±2% throughout the heating cycle. The heating constant current source 20 should maintain an error of ±2% throughout the heating cycle. The test current portion 21 should be small enough to ensure that the chip does not overheat under this current, generally no more than 2% of the heating current. The electronic switch 22 should have a short switching time of within a few microseconds to prevent the device under test from cooling during the switching period.

[0049] Transient thermal resistance test circuit 15, consisting of an inverter part and a PFC part, each power device (transistor IGBT) wiring reference Figure 5-Figure 8 , test conditions:

[0050] 1) Heating current: Before the conditions are determined, the limiting current of the sample is selected first. After the heating power and heating voltage are determined in subsequent steps, the heating current can be obtained in reverse.

[0051] 2) Heating voltage: The heating voltage is determined by the ratio of the sample's limiting power to its limiting current.

[0052] 3) Test current: two conditions must be met: a) The test current should be small enough to ensure no noticeable heating of the chip. Generally, it should not exceed 2% of the heating current. b) The test current should exceed the current value corresponding to the inflection point in the IV characteristic curve, typically 10mA.

[0053] 4) Test sequence, a) Apply test current and measure thermistor parameter voltage VBE before heating ( Figure 1 b) Read the reference point temperature; c) Apply heating voltage and current to begin heating the device. Test the heating voltage and current near the end of the heating pulse; d) After the heating pulse ends, delay for a certain period and measure the thermal parameters twice.

[0054] In this embodiment, the test device further includes a semiconductor circuit 13, a control unit 16, and a power supply 17. The test product of the semiconductor circuit 13 is internally composed of a PFC circuit, an inverter circuit, and a control circuit.

[0055] The control part 16 is used for electrical parameter test control, and the power supply 17 has a DC bus voltage of 300V-400V.

[0056] Semiconductor circuit 13 includes an IC chip, multiple IGBTs (1, 2, 3, 4, 5, 6) connected to the IC chip, resistors R (1, 2, 3, 4, 5, 6) connected to the multiple IGBTs, and multiple diodes D (1, 2, 3, 4, 5, 6) connected in parallel to the multiple IGBTs. ICBT4 is connected to heating voltage source 19 and electronic switch 22 of thermal resistance test circuit 15, and the test current is connected to R4.

[0057] The semiconductor circuit further includes an IGBT 7 connected to the IC chip, an R7 connected to the IGBT 7 , a diode D7 connected in parallel with the IGBT 7 , and a diode D8 connected in series with one end of the IGBT 7 .

[0058] Example 2

[0059] like Figure 9 As shown, an embodiment of the present invention further provides a testing method for a testing device, the testing method comprising the following steps:

[0060] S1. Loading: Products from the previous process are transported to the entrance of the loading mechanism 1 via the automated track 2.

[0061] S2, pressure test: the pressure resistance performance of the product is tested by the pressure test module 3 on one end of the track 2.

[0062] S3. Labeling visual inspection: The labeling visual inspection module 4 is used to inspect whether the label of the product is clear and correct.

[0063] S4, electrical parameter and thermal resistance test: The electrical parameter and thermal resistance test module 5 is used to detect whether the various parameters of the product are within the preset index range.

[0064] S5. Product appearance inspection: The appearance inspection module 6 is used to inspect whether the product has any defects in appearance and whether the pins are offset or damaged.

[0065] S6. Unloading: The qualified products after the S1-S5 inspection are directly transported to the packaging area for packaging and storage through the unloading mechanism 7, and the defective products are output to the defective product packaging area for analysis.

[0066] Specifically, the products in the material tube are first placed in the loading area 10. Through mechanical automatic movement, the single material tube filled with products in the loading area 10 will be moved to the left to align with the entrance of the track 2. At this time, the single material tube will tilt upward at an angle of 30-70 degrees. The products inside will slide out of the material tube and onto the track 2 under the action of gravity. After all the products in the material tube have slid out, the material tube will return to its original horizontal position. At this time, the empty material tube will move to the left to the upper collection area 9 of the empty material tube. At the same time, the single material tube filled with products in the loading area 10 will also move to the left to align with the track 2. This cycle completes the automatic loading. The product is transported on track 2 and first arrives at the withstand voltage test module 3 (because the withstand voltage test is a destructive test, in order to ensure the quality of the product, the withstand voltage test is placed in the first inspection process); after the withstand voltage test, it arrives at the marking visual inspection module 4. The marking visual inspection has two main purposes: the first is to detect whether the above mark is complete and clear, and the second is to upload the identified mark to the computer for statistics to ensure that the subsequent electrical parameter and thermal resistance test results correspond to the mark one by one for subsequent query; after the marking visual inspection is completed, the electrical parameter and thermal resistance test module 5 is carried out. This test will pass the test box ( Figure 3-4 As shown); After the electrical parameter and thermal resistance tests are completed, the product appearance inspection module 6 is carried out. This inspection process mainly detects whether the product appearance resin is complete and whether the pins are defective or bent (of course, defective pins will be screened once in the electrical parameter and thermal resistance test stage, because if the pins are defective or bent, it will lead to poor electrical parameter and thermal resistance test results); After the electrical parameter and thermal resistance tests are completed, the track 2 will transport the product to the unloading area 12. If the test results are qualified, the product will go to the material tube of the lower collection area 11. If the test results are unqualified, the product will go to the material tube of the unloading area 12. Finally, the qualified products are packed and stored, and the unqualified products are analyzed. The whole process completes the automated testing of the product. It can realize multiple online testing functions, automatic loading and unloading, automatic testing, and automatic differentiation of defective products. By integrating the transient thermal resistance test into the test program on the basis of electrical parameter testing, the entire product test is more comprehensive and efficient, and the reliability of the product is improved.

[0067] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be encompassed within the scope of the claims.

Claims

1. A testing device, characterized in that: include: A rack, a material tube for loading semiconductor circuits, a loading mechanism, a track, a withstand voltage test module, a marking visual inspection module, an electrical parameter and thermal resistance test module, an appearance inspection module, and a unloading mechanism respectively arranged on the rack, wherein the loading mechanism is arranged opposite to the unloading mechanism, and the withstand voltage test module, the marking visual inspection module, the electrical parameter and thermal resistance test module, and the appearance inspection module are respectively arranged corresponding to the tracks; The loading mechanism is arranged opposite to the unloading mechanism. The loading mechanism is used to place the material tube. The track is used to transfer the material tube from the loading mechanism to the unloading mechanism. The pressure test module, the marking visual inspection module, the electrical parameter and thermal resistance test module, and the appearance inspection module are respectively used to inspect the passing material tube. When a single material tube moves to align with the entrance end of the track, the material tube tilts upward by 30°-70°, and the semiconductor circuit slides out of the material tube onto the track under the action of gravity. After all the semiconductor circuits in the material tube slide out, the material tube returns to its original horizontal position. The withstand voltage test module, the marking visual inspection module, the electrical parameter and thermal resistance test module, and the appearance inspection module are arranged side by side; the withstand voltage test module, the marking visual inspection module, the electrical parameter and thermal resistance test module, and the appearance inspection module are arranged in sequence on one side of the track; The electrical parameter and thermal resistance test module includes a circuit board, an electrical parameter test circuit and a transient thermal resistance test circuit arranged on the circuit board; the transient thermal resistance test circuit includes a heating voltage source, a heating constant current source, a test current part and an electronic switch, and the heating constant current source is connected to the test current part in parallel and then connected to the electronic switch.

2. The test device according to claim 1, wherein The feeding mechanism includes an upper collecting area and a feeding area, and the feeding area corresponds to the inlet end of the track.

3. The testing device according to claim 1, wherein The material discharge mechanism includes a lower collection area and a material discharge area, and the material discharge area corresponds to the outlet end of the track.

4. A testing method for a testing device according to any one of claims 1 to 3, characterized in that: The test method comprises the following steps: S1. Loading: Products from the previous process are transported to the entrance of the loading mechanism via an automated track; S2. Pressure test: testing the pressure resistance of the product through the pressure test module on one end of the track; S3. Labeling visual inspection: using a labeling visual inspection module to check whether the label of the product is clear and correct; S4, electrical parameter and thermal resistance test: Use the electrical parameter and thermal resistance test module to detect whether the various parameters of the product are within the preset index range; S5. Product appearance inspection: Use the appearance inspection module to inspect whether the product has any defects in appearance and whether the pins are offset or damaged; S6. Unloading: The unloading mechanism directly transports the qualified products after the S1-S5 inspection to the packaging area for packaging and storage, and the defective products are output to the defective product packaging area for analysis.

Images