A mixed reality based flash memory card circuit assisted repair system and method

Abstract

This invention relates to a mixed reality-based flash memory card circuit-assisted repair system and method. In the system, the probe light of an optical coherence tomography (OCT) device is focused onto a flash memory card sample to obtain sample probe spectral data. An image conversion module performs image processing based on the sample probe spectral data to obtain a projected image of the flash memory card circuit. A projection device projects the projected image of the flash memory card circuit onto the surface of the flash memory card to assist in the inspection of the internal circuitry. Applying this invention allows for the rapid and non-destructive acquisition of the internal circuitry of a flash memory card and the projection of the circuit image onto the flash memory card surface for comparison during circuit inspection and repair.

Description

Technical Field

[0001] This invention relates to the field of electronic product testing and evidence collection technology, and in particular to a flash memory card circuit-assisted repair system and method based on mixed reality. Background Technology

[0002] Flash memory cards typically include integrated FLASH storage devices such as micro-SD cards. Because flash memory card manufacturing technology is highly mature, the silkscreen markings on the surface of flash memory cards can be ground off and re-engraved. Furthermore, the market lacks effective regulation, allowing unscrupulous manufacturers to counterfeit cards by removing or even imitating the silkscreen markings of major manufacturers. This renders the surface silkscreen markings, which could have been used to identify the model, useless; it's impossible to determine the model solely by the external markings. Therefore, the industry uses the circuitry characteristics beneath the insulating layer of the flash memory card as the sole criterion for model identification. In forensic science electronic data forensics, it is also necessary to obtain the circuitry characteristics beneath the insulating layer of the flash memory card to extract and recover stored data.

[0003] Because the internal circuitry of a flash memory card is protected by a surface insulating layer, its features cannot be directly observed from the outside. Currently, the most common method is to polish the surface insulating layer until the underlying circuitry is exposed for analysis. However, this method of removing the insulating layer through polishing is destructive and can easily cause secondary damage, even destroying the storage device. Furthermore, since the PCB board is covered with copper, exposure to air without timely processing can easily lead to oxidization of the PCB circuitry, severely impacting subsequent work. Additionally, because circuit features can only be seen after removing the insulating layer, it poses a significant challenge in finding and collecting more products of the same model.

[0004] Optical coherence tomography (OCT) is a non-invasive, high-resolution, real-time optical imaging technique that has emerged in recent years, possessing the capability of cross-sectional tomographic imaging. OCT technology is widely used in biomedical imaging due to its non-invasive, real-time, micron-level high resolution and high penetration depth (1-2 mm), and it plays an increasingly important role in many biomedical fields such as ophthalmology, neuroscience, cardiology, and gastroenterology. The principle of OCT technology is similar to ultrasound tomography; through methods such as coherence gating, and computer digital signal and image processing techniques, it can obtain fine structural tomographic images of the measured sample with micron-level resolution in a non-invasive and non-contact manner. In recent years, OCT technology has also shown its potential in forensic fields, such as counterfeit currency detection, latent fingerprint detection, and automotive paint identification. Summary of the Invention

[0005] To address the aforementioned problems, the purpose of this invention is to provide a mixed reality-based flash memory card circuit-assisted repair system and method, which allows for direct and rapid observation of the internal circuit structure of a flash memory card without damage, thereby assisting in the repair of the flash memory card circuit and the extraction and recovery of data.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] This invention provides a mixed reality-based flash memory card circuit-assisted repair system, comprising an optical coherence tomography (OCT) device, an image conversion module, and a projection device, wherein...

[0008] Optical coherence tomography equipment is used to scan flash memory card samples with emitted probe light to obtain sample probe spectral data;

[0009] The image conversion module is used to perform image processing based on the sample detection spectral data to obtain the projected image of the flash memory card circuit.

[0010] A projection device used to project images of the flash memory card circuitry onto the surface of the flash memory card to assist in inspecting the internal circuitry of the flash memory card.

[0011] Preferably, the image conversion module includes a data processing module and an image processing module, wherein:

[0012] The data processing module is used to convert the sample detection spectral data into an image of the internal circuitry beneath the insulating layer of the flash memory card;

[0013] The image processing module is used to perform field curvature compensation, light intensity correction, and splicing and fusion on the internal circuit image of the flash memory card, and then convert it into a projection image of the flash memory card circuit.

[0014] Preferably, the optical coherence tomography device includes a superluminescent diode light source (1), a circulator (2), a coupler (3), a first polarization controller (4-1), a second polarization controller (4-2), a first collimator (5-1), a second collimator (5-2), a plane mirror (6), an indicator light (7), a spectrometer (8), and a two-dimensional galvanometer scanning unit (10). The light emitted by the superluminescent diode light source (1) enters the circulator (2) through the first port (2-1) and is then output to the coupler (3) through the second port (2-2). The coupler (3) splits the light emitted by the superluminescent diode light source (1) into a probe light and a reference light.

[0015] The reference light passes through the second polarization controller (4-2) and the second collimator (5-2) and then shines on the plane mirror (6) before returning to the coupler (3) along the original path;

[0016] The probe light is irradiated by the first polarization controller (4-1) and the first collimator (5-1) to the two-dimensional galvanometer scanning unit (10). The two-dimensional galvanometer scanning unit (10) adjusts the internal galvanometer to control the probe light to scan the flash memory card sample. After being reflected by the surface of the flash memory card sample, the light returns to the coupler (3) along the original path. On the one hand, it enters the indicator light (7) to emit visible light during the scanning process to indicate the current scanning position. On the other hand, it interferes with the reference light returning from the plane mirror (6) to form interference light. The interference light is output to the third port (2-3) in the circulator (2) and enters the spectrometer (8). The spectrometer (8) collects the sample probe spectral data from the interference light.

[0017] Preferably, the two-dimensional galvanometer scanning unit (10) and the spectrometer (8) are synchronously controlled.

[0018] Preferably, the system further includes a microscopic observation device (14) and a beam splitter (11), the microscopic observation device (14) including an objective lens (12) and an eyepiece (15), and the beam splitter (11) is placed between the eyepiece (15) and the objective lens (12);

[0019] The probe light output horizontally by the two-dimensional galvanometer scanning unit (10) enters the beam splitter (11) and is converted into probe light vertically. After being focused by the objective lens (12), the flash memory card sample is scanned.

[0020] The projection device is placed on the microscopic observation device (14), and the projection light path and the observation light path are a common light path. The eyepiece (15) is used to observe the scanning light spot and the flash memory card circuit projection image projected by the projection device.

[0021] Preferably, the system further includes a flash card limiting component (16) for fixing the flash card and adjusting its position;

[0022] When the position of the scanning spot of the fixed probe light is fixed, the flash card limiting component (16) and the spectrometer (8) are synchronously controlled. The flash card limiting component (16) drives the flash card to move through spatial displacement to achieve regional scanning.

[0023] Preferably, the system further includes a scanning robotic arm for carrying the two-dimensional galvanometer scanning unit (10), beam splitter (11), and objective lens (12). The robotic arm drives the two-dimensional galvanometer scanning unit (10), beam splitter (11), and objective lens (12) to move as a whole, thereby realizing the scanning of the flash memory card in different areas.

[0024] Another aspect of the present invention provides a flash memory card circuit auxiliary repair method based on the system, the method comprising:

[0025] The probe light of an optical coherence tomography (OCT) device was used to scan the flash memory card to obtain the probe spectral data of the flash memory card sample.

[0026] Image processing is performed based on the sample detection spectral data to obtain a projected image of the flash memory card circuit under the insulating layer of the flash memory card.

[0027] The flash memory card circuit image is projected onto the surface of the flash memory card in proportion, so that the projected image of the flash memory card circuit is completely superimposed on the surface of the flash memory card, in order to assist in the inspection of the internal circuit of the flash memory card storage device.

[0028] Preferably, the step of obtaining the flash memory card circuit projection image by image processing based on the sample detection spectral data includes:

[0029] The spectral data of the flash memory card sample is converted into an image of the internal circuitry beneath the insulating layer of the flash memory card.

[0030] Field curvature compensation and light intensity correction are performed on the internal circuit image of the flash memory card to convert it into a projected image of the flash memory card circuit.

[0031] Preferably, the method further includes:

[0032] For flash memory cards whose size exceeds the scanning range, multiple scans are performed in different regions. While maintaining the same resolution, an automatic stitching algorithm is used to stitch and fuse the multiple regional images to obtain a complete image, including feature extraction, feature matching, image matching, and fusion.

[0033] Feature extraction refers to extracting feature points from each sub-region image. These feature points include PCB circuit traces and vias within the flash memory card sample. The via identification method is as follows: XY slice imaging is performed in the area below the PCB circuit layer of the flash memory card. After filtering and binarization, the location of the via is obtained, and the extracted via location is marked in the PCB circuit structure image.

[0034] Feature matching: Feature points in each circuit image of the flash memory card sample are detected and matched by finding extrema in scale and space;

[0035] Image matching: Identifying and aligning pixels with the same feature points in two images;

[0036] Merge: After alignment, merge two images into one image.

[0037] The present invention has the following advantages due to the adoption of the above technical solutions:

[0038] Compared with traditional methods of direct observation using a microscope, the technical solution of this invention allows for rapid and direct observation of the topology of the leads on the PCB board without the need for destructive pre-polishing of flash memory storage devices such as Micro-SD cards. This avoids secondary damage to the flash memory card, which could prevent reverse engineering or data extraction from the flash memory card. Attached Figure Description

[0039] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts. In the drawings:

[0040] Figure 1 This is a schematic diagram of the in-situ projection method of the flash memory card circuit-assisted repair system based on mixed reality according to an embodiment of the present invention;

[0041] Figure 2 This is a schematic diagram of the remote projection method of the flash memory card circuit assisted repair system based on mixed reality according to an embodiment of the present invention;

[0042] Figure 3 This is a schematic diagram of the specific structure of the flash memory card circuit-assisted repair system based on mixed reality according to an embodiment of the present invention;

[0043] Figure 4 This is a schematic diagram of the process for performing field curvature compensation on the internal circuit image of a flash memory card according to an embodiment of the present invention;

[0044] Figure 5 This is a schematic diagram of light intensity correction for a flash memory card circuit image according to an embodiment of the present invention;

[0045] Figure 6 This is a schematic diagram of the final flash memory card circuit projection image in an embodiment of the present invention. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention are within the scope of protection of the present invention.

[0047] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0048] An embodiment of the present invention provides a mixed reality-based flash memory card circuit-assisted repair system, including an optical coherence tomography (OCT) device, an image conversion module, and a projection device. The OCT device is used to scan a flash memory card sample with emitted probe light to obtain sample probe spectral data. The image conversion module is used to perform image processing based on the sample probe spectral data to obtain a projected image of the internal circuit of the flash memory card. The projection device is used to project the projected image of the flash memory card circuit onto the surface of the flash memory card to assist in inspecting the internal circuit of the flash memory card.

[0049] Correspondingly, other embodiments of the present invention also provide a method for assisting in the repair of flash memory card circuits based on mixed reality.

[0050] Example 1

[0051] like Figure 1 As shown, a mixed reality-based flash memory card circuit-assisted repair system includes an optical coherence tomography (OCT) device, an image conversion module, and a projection device. The OCT device scans the flash memory card sample with emitted probe light to obtain sample probe spectral data. The image conversion module processes the sample probe spectral data to obtain a projected image of the internal circuitry of the flash memory card. The projection device projects the projected image of the internal circuitry onto the surface of the flash memory card to assist in inspecting its internal circuitry.

[0052] The detection light emitted by the OCT device can be focused by the objective lens to scan the flash memory card sample. The detection light reflected by the sample returns along the original path and forms interference light with the reference light. The detection spectrum data of the flash memory card sample is obtained by collecting the interference spectrum.

[0053] The image conversion module includes a data processing module and an image processing module. The data processing module converts the sample detection spectral data into an image of the internal circuitry of the flash memory card. The image processing module performs field curvature compensation and light intensity correction on the internal circuitry image of the flash memory card, converting it into a projected image of the flash memory card circuitry. For flash memory cards whose size exceeds the scanning range, multiple scans are performed in different regions. After field curvature compensation and light intensity correction, the images from each region are stitched together and fused before being converted into a projected image of the flash memory card circuitry. The image conversion module then sends the projected image of the flash memory card circuitry to the projection device.

[0054] The projection device projects the flash memory card circuit image onto the flash memory card sample, adjusting the size and position of the projected image so that it proportionally overlaps with the flash memory card sample. The system shown in Example 1 is suitable for in-situ detection and in-situ image projection.

[0055] Example 2

[0056] like Figure 2 As shown, an implementation method is given where an OCT inspection is performed to obtain a projected image, followed by projection repair at another location. This avoids dust contamination of the OCT inspection equipment and optical components in the optical path during repair and polishing. After acquiring the projected image, the projection equipment projects an image of the internal circuitry of the flash memory card onto the surface of the flash memory card at another location, aiding in the inspection of the card's internal circuitry.

[0057] Other specific implementation details of the system shown in Example 2 are as described in the specific implementation of Example 1.

[0058] Example 3

[0059] like Figure 3 As shown, specific structural and operational embodiments of the OCT device, image conversion module, and projection device involved in Embodiments 1 and 2 are presented.

[0060] exist Figure 3 The OCT device includes a superluminescent diode (SLD) light source 1, a circulator 2, a coupler 3, a first polarization controller 4-1, a second polarization controller 4-2, a first collimator 5-1, a second collimator 5-2, a plane mirror 6, an indicator light 7, and a spectrometer 8. The emitted light from the SLD light source 1 enters the circulator 2 through the first port 2-1 and then exits through the second port 2-2 of the circulator 2. The incident end of the coupler 3 receives the emitted light from the SLD light source 1 from the second port 2-2 of the circulator 2, and the beam splitting end of the coupler 3 splits the emitted light into two beams, one as a reference beam and the other as a probe beam.

[0061] A reference beam is split off from the beam splitter of the coupler 3. The reference beam passes through the polarization controller 4-2 and the collimator 5-2 and is then irradiated onto the plane mirror 6. It then returns to the coupler 3 via the beam splitter. The returned reference beam interferes with the probe beam returning along the probe path.

[0062] The probe light split from coupler 3 is collimated into a horizontal direction after passing through polarization controller 4-1 and collimator 5-1. This horizontal probe light illuminates the two-dimensional galvanometer scanning unit 10, which changes its path before it enters the beam splitter 11. The beam splitter 11 deflects the probe light from the horizontal direction to the vertical direction. The vertical probe light is then focused by objective lens 12 and illuminates the surface of the flash memory card sample. After reflection from the surface of the flash memory card sample, the probe light returns along its original path to coupler 3, where it interferes with the reference light returning from plane mirror 6 along its original path, forming interference light. The interference light is output from coupler 3 to circulator 2 and then enters spectrometer 8 through third port 2-3. Spectrometer 8 collects interference spectral data from the first interference light path.

[0063] In Examples 1 and 2, the image conversion modules are configured in computer 9. Computer 9 performs image data processing on the interference spectral data to obtain a projected image. Computer 9 sends the obtained projected image to projection device 13, which projects the image onto the surface of the flash memory card sample. The size of the projected image can be adjusted by objective lens 12 to achieve proportional matching between the flash memory card sample and the projected image.

[0064] In computer 9, the image conversion module includes a data processing module and an image processing module, wherein: the data processing module converts the sample detection spectral data into an image of the internal circuit of the flash memory card; the image processing module performs field curvature compensation and light intensity correction on the image of the internal circuit of the flash memory card and converts it into a projection image of the flash memory card circuit.

[0065] To achieve more accurate focused scanning and projected image matching, a microscopic observation device 14 can be further configured, which includes an objective lens 12 and an eyepiece 15. The projection device 13 can be placed between the two eyepieces. The flash memory card sample can be placed on the flash memory card limiting component 16.

[0066] To achieve scanning of the flash memory card sample and obtain three-dimensional imaging results, the probe light is converted into a horizontal beam after passing through the collimator 5-1. The horizontal probe light is output to the beam splitter 11 through the two-dimensional galvanometer scanning unit 10 and converted into a vertical beam. The vertical probe light is focused on the flash memory card sample being scanned by the objective lens 12 shared with the microscopic observation device 14.

[0067] During the scanning process, the two-dimensional galvanometer scanning unit 10 and the spectrometer 8 are synchronously controlled. Under the condition that the sampling theorem is satisfied, by adjusting the voltage applied to the two-dimensional galvanometer in the two-dimensional galvanometer scanning unit 10, the position of the horizontal beam can be changed, thereby changing the position of the vertical beam, and finally the scanning position can be adjusted to achieve regional scanning.

[0068] To facilitate observation of the scanning range of the probe light on the flash memory card sample, which is invisible to the naked eye, visible light is emitted by indicator light 7. As the scanning position changes, the position of the indicator light spot also moves synchronously, thus allowing observation of the scanning range of the probe light on the flash memory card sample.

[0069] The interference light formed by the reflected probe light and reference light through the coupler 3 will be emitted from the third port 2-3 of the circulator 2, and will be detected and collected by a wavenumber linear spectrometer 8. The CMOS detector at the end of the spectrometer 8 will convert the interference light signal into an electrical signal to obtain the detection spectrum data, and transmit the detection spectrum data to the computer 9 for data post-processing.

[0070] The computer 9 includes a data processing module and an image processing module. The data processing module converts the spectral data of the flash memory card sample detection into an image of the internal circuit of the flash memory card. The image processing module performs field curvature compensation, light intensity correction, and splicing and fusion on the image of the internal circuit of the flash memory card, and then converts it into a projection image of the flash memory card circuit.

[0071] The data processing module converts the probe spectral data into a circuit image. After acquiring the probe spectral data, it performs a Fourier transform on the raw spectral data of each probe point to obtain the spatial position signal A-line of that point. By performing a horizontal XY two-dimensional scan of the probe points, a circuit image containing three-dimensional spatial information can be obtained inside the flash memory card.

[0072] The image processing module performs field curvature compensation, light intensity correction, and stitching fusion on the flash memory card circuit image, converting it into a projected image of the flash memory card circuit. Since most objective lens designs suffer from field curvature issues—meaning the focal point of the beam does not coincide with the ideal point—this manifests in OCT scan images as a curved surface on a flat plane, leading to image distortion. Furthermore, images obtained by directly slicing along the horizontal XY direction will not originate from the same depth.

[0073] like Figure 4 As shown, field curvature compensation is performed on the flash memory card circuit image, and the upper surface boundary of the sample is extracted according to formula (1).

[0074]

[0075] Then, surface fitting is performed on the extracted surface, and after compensation based on the fitted surface, slicing is performed along the XY horizontal direction to obtain a view image of the PCB circuit layout under the insulating layer of the flash memory card.

[0076] Besides field curvature issues, flawed objective lens design can also cause uneven light intensity distribution, resulting in abrupt changes in brightness in the image. Figure 5The diagram shows a comparison of light intensity correction for flash memory card circuit images. To compensate for light intensity distribution, a simple and effective method is to use a plane mirror for imaging, and then use its light intensity distribution to correct the images of other samples.

[0077] For flash memory cards, images can be scanned in regions and then stitched together to obtain a complete image of the internal circuitry. After field curvature compensation and light intensity correction, considering the varying sizes of flash memory cards, those exceeding the scanning range of the probe light cannot be imaged in a single scan. Therefore, to obtain a complete image of the internal circuitry while maintaining resolution, a method of regional scanning and then automatic stitching algorithms is used. For example, algorithms based on feature fusion technology have been widely used in the field of computer vision for panoramic images. Their main processes include feature extraction, feature matching, image matching, and fusion. During image stitching and fusion, feature points of the internal circuitry image of each region are detected by finding scale and spatial extrema for feature matching, and then the transformation matrix between adjacent images is determined. Figure 6 As shown, a projected image of the final internal circuitry of the flash memory card is presented.

[0078] Feature points in the internal circuitry images of flash memory card samples include PCB circuit traces and vias. The size of vias is typically on the micrometer scale, making them difficult to distinguish even with a microscope and easily overlooked. The via identification method involves performing XY slice imaging on the area below the PCB circuit layer of the flash memory card, followed by filtering and binarization to obtain the via locations. These extracted via locations are then marked on the PCB circuit structure image.

[0079] exist Figure 3 In the system diagram shown, the detection optical path of the OCT device and the microscopic observation optical path of the microscopic observation device 14 share a common optical path through the objective lens 12, ensuring that the fields of view of the two systems are matched. The projection device 13 is also placed between the eyepieces 15 of the microscopic observation device 14, so that the projection optical path and the microscopic observation optical path share a common optical path.

[0080] The entire probe light scanning process can be performed simultaneously with observation through the microscope's eyepiece. After the scan is complete and the OCT 3D data is processed on the computer to obtain the required cross-section, the projected image of the flash memory card circuit is transmitted to the micro-projector via a wireless device, data network, or storage medium. The micro-projector, acting as a projection device 13, projects the received circuit image onto the surface of the flash memory card, which is fixed by the limiting component 16. The micro-projector can perform fine focusing using its built-in magnification system.

[0081] The image of the internal circuitry beneath the insulating layer obtained by this system will be projected in reverse onto the surface of an unpolished flash memory card in reality. This will help inspect the internal structure of the card. By observing the circuitry in the projected image through a microscope, the location of the fault can be determined and addressed. For example, key circuits and areas can be identified and precisely polished in sections, saving manpower and avoiding unnecessary damage.

[0082] Applying this invention allows for the completion of tasks such as wire bonding and data extraction before the substrate oxidizes, after a processing plan has been formulated and the necessary materials have been prepared. This effectively improves work efficiency and results. At the same time, by non-destructively examining circuit features, this provides an excellent solution for collecting and classifying integrated packaged FLASH storage devices of the same model in electronic forensics cases and scientific research.

[0083] Example 4

[0084] The above embodiments 1-3 provide a flash memory card circuit-assisted repair system based on mixed reality. This embodiment provides a flash memory card circuit-assisted repair method, which includes:

[0085] The surface of the flash memory card was scanned using the probe light of an optical coherence tomography (OCT) device to obtain the probe spectral data of the flash memory card sample;

[0086] Image processing is performed based on the sample's spectral data to obtain a projected image of the internal circuitry of the flash memory card;

[0087] The internal circuitry of the flash memory card is projected onto the surface of the flash memory card in a proportional manner, so that the projected image of the internal circuitry of the flash memory card is completely superimposed on the surface of the flash memory card, which is used to assist in inspecting the internal circuitry of the flash memory card storage device.

[0088] Image processing is performed on the sample detection spectral data to obtain a flash memory card circuit projection image. Specifically, this includes: converting the flash memory card sample detection spectral data into an image of the internal circuit under the insulating layer of the flash memory card; and performing field curvature compensation and light intensity correction on the internal circuit image of the flash memory card to convert it into a flash memory card circuit projection image.

[0089] The method for field curvature compensation of the internal circuit image of the flash memory card is as follows: smoothing is performed using a two-dimensional Gaussian filter, the upper surface boundary of the flash memory card sample is extracted, the extracted upper surface boundary is fitted with a surface, compensation is performed based on the fitted surface, and slicing is performed along the XY horizontal direction to obtain a view image of the PCB circuit routing under the insulating layer of the flash memory card.

[0090] The method for light intensity correction of the internal circuit image of the flash memory card is as follows: using a plane mirror as the object of probe light scanning, optical coherence tomography is performed on the plane mirror, and the spatial distribution of light intensity of the plane mirror image is used to correct the signal intensity of the internal circuit image of the flash memory card.

[0091] For flash memory cards whose size exceeds the scanning range, multiple regional scans are performed. While maintaining the same resolution, an automatic stitching algorithm is used to stitch and fuse the multiple regional images to obtain a complete image. Specifically, this includes feature extraction, feature matching, image matching, and fusion. Feature extraction refers to extracting feature points from each regional image. These feature points include PCB circuit traces and vias within the flash memory card sample. The via identification method is as follows: XY slice imaging is performed in the area below the PCB circuit layer of the flash memory card. After filtering and binarization, the location of the via is obtained, and the extracted via locations are marked in the PCB circuit structure image.

[0092] Feature matching: Feature points in each circuit image of the flash memory card sample are detected and matched by finding extrema in scale and space;

[0093] Image matching: Identifying and aligning pixels with the same feature points in two images;

[0094] Merge: After alignment, merge two images into one image.

[0095] The specific methods of scanning the surface of a flash memory card using the probe light of an optical coherence tomography device include any one or a combination of the following scanning methods:

[0096] Keeping the flash memory card in one position, scan the flash memory card by moving the focus position of the probe light; or keep the focus position of the probe light in one position, scan the flash memory card by moving the flash memory card sample.

[0097] The method for stitching and fusing images of the internal circuitry of a flash memory card is as follows: If the scanning range of the probe light can cover the entire surface of the flash memory card, no stitching and fusion is required. If the scanning range of the probe light cannot cover the entire card surface, the flash memory card is scanned multiple times in sections, and an automatic algorithm is used to stitch the images together to obtain a large-area complete image while maintaining the same resolution. Flash memory cards whose size exceeds the scanning range require stitching and fusion, while flash memory cards whose size is smaller than the scanning range do not require stitching; a single scan can cover the entire card. Whether or not image stitching is performed depends primarily on whether the system's scanning range can cover the entire card surface.

[0098] The process described in this embodiment is relatively simple. For relevant details, please refer to the description in Embodiment 1. The system provided in this embodiment is merely illustrative.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A flash memory card circuit-assisted repair system based on mixed reality, characterized in that, This includes optical coherence tomography (OCT) equipment, an image conversion module, and a projection device, among which... Optical coherence tomography equipment is used to scan flash memory card samples with emitted probe light to obtain sample probe spectral data; The image conversion module is used to perform image processing based on the sample detection spectral data to obtain the projected image of the flash memory card circuit. A projection device is used to project a flash memory card circuit image onto the surface of the flash memory card to assist in inspecting the internal circuitry of the flash memory card; the projection device projects the flash memory card circuit image onto a flash memory card sample, and adjusts the size and position of the projected image so that the projected image and the flash memory card sample are proportionally overlapped. The image conversion module includes a data processing module and an image processing module, wherein: The data processing module is used to convert the sample detection spectral data into an image of the internal circuitry beneath the insulating layer of the flash memory card; The image processing module is used to perform field curvature compensation, light intensity correction, and splicing and fusion on the internal circuit image of the flash memory card, and then convert it into a projection image of the flash memory card circuit. The field curvature compensation is performed by extracting the upper surface boundary of the flash memory card sample, fitting the extracted upper surface boundary to a surface, and then compensating based on the fitted surface. The light intensity correction is performed by using the light intensity spatial distribution of the plane mirror imaging to correct the light intensity of the internal circuit image of the flash memory card. The optical coherence tomography device includes a superluminescent diode light source (1), a circulator (2), a coupler (3), a first polarization controller (4-1), a second polarization controller (4-2), a first collimator (5-1), a second collimator (5-2), a plane mirror (6), an indicator light (7), a spectrometer (8), and a two-dimensional galvanometer scanning unit (10). The light emitted by the superluminescent diode light source (1) enters the circulator (2) through the first port (2-1) and is then output to the coupler (3) through the second port (2-2). The coupler (3) splits the light emitted by the superluminescent diode light source (1) into a probe light and a reference light. The reference light passes through the second polarization controller (4-2) and the second collimator (5-2) and then shines on the plane mirror (6) before returning to the coupler (3) along the original path. The probe light is irradiated by the first polarization controller (4-1) and the first collimator (5-1) to the two-dimensional galvanometer scanning unit (10). The two-dimensional galvanometer scanning unit (10) adjusts the internal galvanometer to control the probe light to scan the flash memory card sample. After being reflected by the surface of the flash memory card sample, the light returns to the coupler (3) along the original path. On the one hand, it enters the indicator light (7) to emit visible light during the scanning process to indicate the current scanning position. On the other hand, it interferes with the reference light returning from the plane mirror (6) to form interference light. The interference light is output to the third port (2-3) in the circulator (2) and enters the spectrometer (8). The spectrometer (8) collects the sample probe spectral data from the interference light.

2. The flash memory card circuit-assisted repair system based on mixed reality according to claim 1, characterized in that, The two-dimensional galvanometer scanning unit (10) and the spectrometer (8) are synchronously controlled.

3. The flash memory card circuit-assisted repair system based on mixed reality according to claim 1, characterized in that, The system also includes a microscopic observation device (14) and a beam splitter (11), the microscopic observation device (14) including an objective lens (12) and an eyepiece (15), the beam splitter (11) being positioned between the eyepiece (15) and the objective lens (12); The probe light output horizontally by the two-dimensional galvanometer scanning unit (10) enters the beam splitter (11) and is converted into the probe light vertically. After being focused by the objective lens (12), the flash memory card sample is scanned. The projection device is placed on the microscopic observation device (14), and the projection light path and the observation light path are a common light path. The eyepiece (15) is used to observe the scanning light spot and the flash memory card circuit projection image projected by the projection device.

4. The flash memory card circuit-assisted repair system based on mixed reality according to claim 1, characterized in that, The system also includes a flash card limiting component (16) for fixing the flash card and adjusting its position; When the position of the scanning spot of the fixed probe light is fixed, the flash card limiting component (16) and the spectrometer (8) are synchronously controlled. The flash card limiting component (16) drives the flash card to move through spatial displacement to achieve regional scanning.

5. The flash memory card circuit-assisted repair system based on mixed reality according to claim 4, characterized in that, The system also includes a scanning robotic arm, which carries the two-dimensional galvanometer scanning unit (10), beam splitter (11), and objective lens (12). The robotic arm drives the two-dimensional galvanometer scanning unit (10), beam splitter (11), and objective lens (12) to move as a whole, thereby realizing the scanning of the flash memory card in different areas.

6. A method for assisted repair of flash memory card circuitry based on the system described in any one of claims 1 to 5, characterized in that, The method includes: The probe light of an optical coherence tomography (OCT) device was used to scan the flash memory card to obtain the probe spectral data of the flash memory card sample. Image processing is performed based on the sample detection spectral data to obtain a projected image of the flash memory card circuit under the insulating layer of the flash memory card. The flash memory card circuit image is projected onto the surface of the flash memory card in proportion, so that the projected image of the flash memory card circuit is completely superimposed on the surface of the flash memory card, in order to assist in inspecting the internal circuit of the flash memory card storage device.

7. The flash memory card circuit auxiliary repair method according to claim 6, characterized in that, The step of obtaining a flash memory card circuit projection image through image processing based on sample detection spectral data includes: The spectral data of the flash memory card sample is converted into an image of the internal circuitry beneath the insulating layer of the flash memory card. Field curvature compensation and light intensity correction are performed on the internal circuit image of the flash memory card to convert it into a projected image of the flash memory card circuit.

8. The flash memory card circuit auxiliary repair method according to claim 6, characterized in that, The method further includes: For flash memory cards whose size exceeds the scanning range, multiple scans are performed in different regions. While maintaining the same resolution, an automatic stitching algorithm is used to stitch and fuse the multiple regional images to obtain a complete image, including feature extraction, feature matching, image matching, and fusion. Feature extraction refers to extracting feature points from each sub-region image. These feature points include PCB circuit traces and vias within the flash memory card sample. The via identification method is as follows: XY slice imaging is performed in the area below the PCB circuit layer of the flash memory card. After filtering and binarization, the location of the via is obtained, and the extracted via location is marked in the PCB circuit structure image. Feature matching: Feature points in each circuit image of the flash memory card sample are detected and matched by finding extrema in scale and space; Image matching: Identifying and aligning pixels with the same feature points in two images; Merge: After alignment, merge two images into one image.

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