A semiconductor chip packaging box with a protective device

Abstract

The present invention relates to the field of semiconductor chip technology, and discloses a semiconductor chip packaging box with a protective device, comprising a box body, the inner wall of the left side of the box body is rotatably connected to a revolving door, the inner wall of the box body is slidably connected to a plurality of clamps, the surface of the clamps clamps a chip body, the inner wall of the clamps is threadedly connected to a bidirectional screw, the top of the bidirectional screw is fixedly connected to a pulley group, the inner wall of the clamps close to the chip body is installed with a rubber plate, the surface of the bidirectional screw is rotatably connected to the inner wall of the box body, and the surface of the bidirectional screw is provided with multiple sections of bidirectional threads. According to the present invention, through the coordinated operation of the box body, the revolving door, the clamps, the rubber plates, the chip body, the bidirectional screw, and the pulley group, the gathered clamps clamp the semiconductor, and can be fixed and limited to prevent collision between the semiconductors during transportation and thus damage.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chips, in particular to a semiconductor chip packaging box with a protective device. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. Semiconductor chips are mounted on material boards and placed in packaging boxes for storage during transportation or storage.

[0003] In the existing packaging box, multiple semiconductor chips are placed in a dispersed manner. During transportation, the packaging box will shake, which will cause the semiconductor chips inside to shift, and then cause collisions between the semiconductor chips, causing the pins or the semiconductor chips themselves to deform, resulting in damage to the semiconductor chips. Therefore, a semiconductor chip packaging box with a protective device is proposed to solve the above-mentioned problems. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a semiconductor chip packaging box with a protective device in view of the deficiencies in the above-mentioned prior art.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is: a semiconductor chip packaging box with a protective device, comprising a box body, the inner wall of the left side of the box body is rotatably connected with a revolving door, the inner wall of the box body is slidably connected with a plurality of clamps, the surface of the clamps clamps the chip body, the inner wall of the clamps is threadedly connected with a bidirectional screw, the top of the bidirectional screw is fixedly connected with a pulley group, and the inner wall of the clamp close to the chip body is installed with a rubber plate; the surface of the bidirectional screw is rotatably connected with the inner wall of the box body, and the surface of the bidirectional screw is provided with a plurality of bidirectional screw sections. The other output end of the pulley group is fixedly connected to the top of another bidirectional screw, and the chip bodies are placed one by one between the two clamping plates. At this time, the bidirectional screw is rotated, and the bidirectional screw will drive the other bidirectional screw to rotate at the same time through the pulley group. The bidirectional screw will drive the two clamping plates to gather together through the surface threads. The gathered clamping plates will clamp the semiconductor and can fix it to prevent it from colliding with each other during transportation and thus causing damage. At the same time, the rubber plate on the clamping plate can protect the clamped semiconductor to prevent damage to the clamping part.

[0006] Preferably, a filtering and dehumidifying device is provided on the right side of the box, and the filtering and dehumidifying device includes a filter plate, the inner wall of the filter plate is rotatably connected to a turntable, a side of the turntable away from the filter plate is fixedly connected to a plurality of guide plates, and a plurality of fan groups are installed on the left side of the filter plate; the turntable is a breathable structure, and the left side of the filter plate is fixedly connected to the right side of the box. During transportation, the fan group will start and allow external air to pass through the filter plate into the box. When the gas passes through the filter plate, it will contact the desiccant inside the filter plate and absorb the moisture, so that the interior of the box is filled with dry gas, which can effectively prevent the presence of humid gas inside the box from causing rust on the surface of the semiconductor metal parts. At the same time, ventilation and drying can prevent the inside of the box from mold.

[0007] Preferably, a rotating loosening device is provided on the side of the turntable away from the filter plate, and the rotating loosening device includes an arc plate, the surface of the arc plate is fixedly connected to two mounting plates, an arc rod is fixedly connected between the two mounting plates, and two collision balls are slidably connected to the surface of the arc rod; the left side of the arc plate is fixedly connected to the right side of the turntable, and the two sides of the arc plate are in contact with the surface of the guide plate, and the wind blown into the box by the fan group will push the guide plate on the turntable to rotate, and then connect the turntable to rotate together, the turntable will drive the arc plate to rotate, the arc plate will drive the arc rod on the mounting plate to rotate, and the arc rod will drive the two collision balls on the surface to move, and the collision ball will collide with another collision ball and the mounting plate, thereby vibrating, and the rotation can disperse the desiccant agglomerated in the filter plate, and at the same time, the rotation of the guide plate on the turntable will replace the desiccant at different positions in the filter plate, so that the desiccant that has absorbed moisture and the desiccant that has not absorbed moisture can be mixed, thereby improving the drying effect.

[0008] Preferably, the inner wall of the clamp is provided with a supporting and protective device, and the supporting and protective device includes an elastic plate, a sponge pad is fixedly connected to the side of the elastic plate close to the chip body, and an arc-shaped groove is opened on the inner wall of the box; the surface of the elastic plate is slidably connected to the inner wall of the clamp, and the side of the sponge pad away from the elastic plate is in contact with the surface of the chip body, and the two sides of the elastic plate are in contact with the inner wall of the arc-shaped groove. When the clamp clamps the semiconductor, it will drive the elastic plate to move together, and the elastic plate will drive the sponge pad to move and contact the semiconductor, so that the semiconductor can be wrapped, further improving its protection effect, and at the same time preventing dust. Then it is accumulated on its surface, and the clamping plate can move and adjust the clamping according to the thickness of the semiconductor. At the same time, the elastic plate will move toward the clamping plate through elasticity, and the two sides of the elastic plate are in contact with the arc groove. When the two clamping plates drive the elastic plate to separate up and down, the elastic plate will move to both sides in the arc groove, so that the elastic plate will arch according to the curvature of the arc groove, and then it can drive the sponge pad to move up, reducing the pressure of the sponge pad on the semiconductor, which is suitable for thicker semiconductors. When the semiconductor is thinner, the clamping plates will gather and move, so that the elastic plate will unfold along the arc groove, and the sponge pad will move toward the semiconductor, thereby ensuring that the sponge pad can protect the thinner semiconductor.

[0009] The present invention adopts the above technical solution to bring the following beneficial effects:

[0010] 1. The semiconductor chip packaging box with a protective device, through the coordinated operation of the box body, the revolving door, the clamping plate, the rubber plate, the chip body, the bidirectional screw, and the pulley group, the gathered clamping plates will clamp the semiconductor, and can fix and limit it to prevent collision between them during transportation and thus damage.

[0011] 2. The semiconductor chip packaging box with a protective device, through the coordinated operation of the filter plate, the turntable, the guide plate, and the fan group, when the gas passes through the filter plate, it will contact the desiccant inside it and absorb the moisture, so that the inside of the box is filled with dry gas, which can effectively prevent the presence of humid gas inside the box and cause rust on the surface of the semiconductor metal parts.

[0012] 3. The semiconductor chip packaging box with a protective device operates in coordination among the arc plate, the mounting plate, the arc rod, and the collision ball. The collision ball will collide with another collision ball and the mounting plate, thereby vibrating and rotating to disperse the agglomerated desiccant in the filter plate.

[0013] 4. The semiconductor chip packaging box with a protective device, through the coordinated operation of the elastic plate, the sponge pad, and the arc groove, the elastic plate will drive the sponge pad to move and contact with the semiconductor, and then can wrap the semiconductor, further improving its protective effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0015] Figure 2 This is a schematic diagram of the internal structure of the box of the present invention;

[0016] Figure 3 It is a schematic diagram of the splint structure of the present invention;

[0017] Figure 4 A half-section diagram of the filter plate structure of the present invention;

[0018] Figure 5 It is a schematic diagram of the multi-directional structure of the turntable of the present invention;

[0019] Figure 6 It is a schematic diagram of the multi-directional structure of the arc plate of the present invention;

[0020] Figure 7 It is a schematic diagram of the elastic plate structure of the present invention.

[0021] In the figure: 1. box body; 2. revolving door; 3. filtering and dehumidifying device; 31. filter plate; 32. turntable; 33. guide plate; 34. fan assembly; 4. rotating loosening device; 41. arc plate; 42. mounting plate; 43. arc rod; 44. collision ball; 5. supporting and protective device; 51. elastic plate; 52. sponge pad; 53. arc groove; 6. splint; 61. rubber plate; 7. chip body; 8. bidirectional screw; 9. pulley assembly. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Example

[0024] A semiconductor chip packaging box with a protective device, such as Figure 1-Figure 7As shown, it includes a box body 1, the inner wall of the left side of the box body 1 is rotatably connected to a revolving door 2, the inner wall of the box body 1 is slidably connected to a plurality of clamps 6, the surface of the clamps 6 clamps a chip body 7, the inner wall of the clamps 6 is threadedly connected to a bidirectional screw 8, the top of the bidirectional screw 8 is fixedly connected to a pulley group 9, and the inner wall of the clamps 6 close to the chip body 7 is installed with a rubber plate 61; the surface of the bidirectional screw 8 is rotatably connected to the inner wall of the box body 1, the surface of the bidirectional screw 8 is provided with multiple sections of bidirectional threads, the other output end of the pulley group 9 is connected to the other bidirectional screw 8 The top is fixedly connected, and the chip bodies 7 are placed one by one between the two clamps 6. At this time, the bidirectional screw 8 is rotated, and the bidirectional screw 8 will drive another bidirectional screw 8 to rotate at the same time through the pulley set 9. The bidirectional screw 8 will drive the two clamps 6 to gather together through the surface thread. The gathered clamps 6 will clamp the semiconductor and can fix it to prevent it from colliding with each other during transportation and thus being damaged. At the same time, the rubber plate 61 on the clamp 6 can protect the clamped semiconductor and prevent damage to the clamping part.

[0025] Preferably, a filtering and dehumidifying device 3 is provided on the right side of the box 1, and the filtering and dehumidifying device 3 includes a filter plate 31, the inner wall of the filter plate 31 is rotatably connected to a turntable 32, a side of the turntable 32 away from the filter plate 31 is fixedly connected to a plurality of guide plates 33, and a left side of the filter plate 31 is installed with a plurality of fan groups 34; the turntable 32 is a breathable structure, and the left side of the filter plate 31 is fixedly connected to the right side of the box 1. During transportation, the fan group 34 will start and allow external air to pass through the filter plate 31 into the box 1. When the gas passes through the filter plate 31, it will contact the desiccant inside the filter plate 31 and absorb the moisture, so that the inside of the box 1 is filled with dry gas, which can effectively prevent the presence of humid gas inside the box 1 from causing rust on the surface of the semiconductor metal parts. At the same time, ventilation and drying can prevent the inside of the box 1 from mold.

[0026] Preferably, a rotating loosening device 4 is provided on one side of the rotating disk 32 away from the filter plate 31, and the rotating loosening device 4 includes an arc plate 41, and two mounting plates 42 are fixedly connected to the surface of the arc plate 41, and an arc rod 43 is fixedly connected between the two mounting plates 42, and two collision balls 44 are slidably connected to the surface of the arc rod 43; the left side of the arc plate 41 is fixedly connected to the right side of the rotating disk 32, and the two sides of the arc plate 41 are in contact with the surface of the guide plate 33. The wind blown into the box body 1 by the fan group 34 will push the guide plate 33 on the rotating disk 32 to rotate, thereby connecting the rotating disk 32 The turntable 32 rotates together, and the arc plate 41 drives the arc rod 43 on the mounting plate 42 to rotate. The arc rod 43 drives the two collision balls 44 on the surface to move. The collision ball 44 collides with another collision ball 44 and the mounting plate 42, thereby vibrating. The rotation can disperse the agglomerated desiccant in the filter plate 31. At the same time, the rotation of the guide plate 33 on the turntable 32 can replace the desiccant at different positions in the filter plate 31, so that the desiccant that has absorbed moisture and the desiccant that has not absorbed moisture can be mixed, thereby improving the drying effect.

[0027] Preferably, the inner wall of the clamping plate 6 is provided with a supporting and protective device 5, which includes an elastic plate 51, a sponge pad 52 is fixedly connected to the side of the elastic plate 51 close to the chip body 7, and an arc groove 53 is provided on the inner wall of the box body 1; the surface of the elastic plate 51 is slidably connected to the inner wall of the clamping plate 6, the side of the sponge pad 52 away from the elastic plate 51 is in contact with the surface of the chip body 7, and the two sides of the elastic plate 51 are in contact with the inner wall of the arc groove 53. When the clamping plate 6 clamps the semiconductor, it will drive the elastic plate 51 to move together, and the elastic plate 51 will drive the sponge pad 52 to move and contact the semiconductor, so that the semiconductor can be wrapped, further improving its protection effect, and at the same time preventing dust from accumulating on its surface. The clamping plate 6 can move and adjust the clamping according to the thickness of the semiconductor. At the same time, the elastic plate 51 will move toward the clamping plate 6 due to its elasticity, and the two sides of the elastic plate 51 are in contact with the arc groove 53. When the two clamping plates 6 drive the elastic plate 51 to separate up and down, the elastic plate 51 will move to both sides in the arc groove 53, so that the elastic plate 51 will arch according to the curvature of the arc groove 53, and then it can drive the sponge pad 52 to move upward, reducing the pressure of the sponge pad 52 on the semiconductor, which is suitable for thicker semiconductors. When the semiconductor is thinner, the clamping plates 6 will gather and move, so that the elastic plate 51 will expand along the arc groove 53, so that the sponge pad 52 moves toward the semiconductor, thereby ensuring that the sponge pad 52 can protect the thinner semiconductor.

[0028] Working principle: put the chip bodies 7 one by one between the two clamping plates 6, then rotate the bidirectional screw 8, and the bidirectional screw 8 will drive another bidirectional screw 8 to rotate at the same time through the pulley set 9, and the bidirectional screw 8 will drive the two clamping plates 6 to gather together through the surface threads, and the gathered clamping plates 6 will clamp the semiconductor, which can be fixed and limited to prevent collision and damage during transportation. At the same time, the rubber plate 61 on the clamping plate 6 can protect the clamped semiconductor and prevent damage to the clamping part;

[0029] During transportation, the fan group 34 will start and allow external air to pass through the filter plate 31 into the box body 1. When the air passes through the filter plate 31, it will contact the desiccant inside the filter plate 31 and absorb moisture, so that the inside of the box body 1 is filled with dry air, which can effectively prevent the presence of humid air inside the box body 1 from causing rust on the surface of the semiconductor metal parts. At the same time, ventilation and drying can prevent the inside of the box body 1 from getting moldy.

[0030] The wind blown into the box body 1 by the fan group 34 will push the guide plate 33 on the turntable 32 to rotate, and then the turntable 32 will rotate together. The turntable 32 will drive the arc plate 41 to rotate, and the arc plate 41 will drive the arc rod 43 on the mounting plate 42 to rotate. The arc rod 43 will drive the two collision balls 44 on the surface to move, and the collision ball 44 will collide with another collision ball 44 and the mounting plate 42, thereby vibrating. The rotation can disperse the agglomerated desiccant in the filter plate 31. At the same time, the rotation of the guide plate 33 on the turntable 32 will replace the desiccant at different positions in the filter plate 31, so that the desiccant that has absorbed moisture and the desiccant that has not absorbed moisture can be mixed, thereby improving the drying effect.

[0031] When the clamping plate 6 clamps the semiconductor, it will drive the elastic plate 51 to move together. The elastic plate 51 will drive the sponge pad 52 to move and contact with the semiconductor, thereby wrapping the semiconductor, further improving its protection effect, and preventing dust from accumulating on its surface. The clamping plate 6 can move and adjust the clamping according to the thickness of the semiconductor. At the same time, the elastic plate 51 will move toward the clamping plate 6 through elasticity, and the two sides of the elastic plate 51 will contact the arc groove 53. When the two clamping plates 6 drive the elastic plate 51 to separate up and down, the elastic plate 51 will move to both sides in the arc groove 53, so that the elastic plate 51 will arch according to the curvature of the arc groove 53, thereby driving the sponge pad 52 to move upward, reducing the pressure of the sponge pad 52 on the semiconductor. It is suitable for thicker semiconductors. When the semiconductor is thin, the clamping plates 6 will gather and move, so that the elastic plate 51 will unfold along the arc groove 53, so that the sponge pad 52 moves toward the semiconductor, thereby ensuring that the sponge pad 52 can protect the thinner semiconductor.

[0032] The present invention provides a semiconductor chip packaging box with a protective device. There are many methods and ways to implement the technical solution. The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be considered as the protection scope of the present invention. All components not specified in this embodiment can be implemented using existing technologies.

Claims

1. A semiconductor chip packaging box with a protective device, comprising a box body (1), characterized in that: The inner wall on the left side of the box body (1) is rotatably connected to a revolving door (2), the inner wall of the box body (1) is slidably connected to a plurality of clamping plates (6), the surface of the clamping plates (6) clamps the chip body (7), the inner wall of the clamping plates (6) is threadedly connected to a bidirectional screw rod (8), the top end of the bidirectional screw rod (8) is fixedly connected to a pulley group (9), and the inner wall of the clamping plates (6) close to the chip body (7) is installed with a rubber plate (61); The surface of the bidirectional screw (8) is rotatably connected to the inner wall of the box (1), the surface of the bidirectional screw (8) is provided with a plurality of bidirectional threads, and the other output end of the pulley assembly (9) is fixedly connected to the top end of another bidirectional screw (8); A filtering and dehumidifying device (3) is arranged on the right side of the box body (1), and the filtering and dehumidifying device (3) comprises a filter plate (31), the inner wall of the filter plate (31) is rotatably connected to a rotating disk (32), a side of the rotating disk (32) away from the filter plate (31) is fixedly connected to a plurality of guide plates (33), and a plurality of fan groups (34) are installed on the left side of the filter plate (31); The rotating disk (32) is a breathable structure, and the left side of the filter plate (31) is fixedly connected to the right side of the box (1); A rotating loosening device (4) is provided on one side of the rotating disk (32) away from the filter plate (31), the rotating loosening device (4) comprising an arc-shaped plate (41), two mounting plates (42) are fixedly connected to the surface of the arc-shaped plate (41), an arc-shaped rod (43) is fixedly connected between the two mounting plates (42), and two collision balls (44) are slidably connected to the surface of the arc-shaped rod (43); The left side of the arc-shaped plate (41) is fixedly connected to the right side of the rotating disk (32), and both sides of the arc-shaped plate (41) are in contact with the surface of the guide plate (33).

2. A semiconductor chip packaging box with a protective device according to claim 1, characterized in that: The inner wall of the clamping plate (6) is provided with a supporting and protective device (5), and the supporting and protective device (5) comprises an elastic plate (51). A sponge pad (52) is fixedly connected to the side of the elastic plate (51) close to the chip body (7), and an arc groove (53) is provided on the inner wall of the box body (1).

3. The semiconductor chip packaging box with a protective device according to claim 2, characterized in that: The surface of the elastic plate (51) is slidably connected to the inner wall of the clamping plate (6), the side of the sponge pad (52) away from the elastic plate (51) is in contact with the surface of the chip body (7), and the two sides of the elastic plate (51) are in contact with the inner wall of the arc groove (53).

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