Method and device for identifying non-current-carrying copper foil, storage medium and electronic device

Abstract

The present application discloses a method and device for identifying non-flowable copper foil, a storage medium and an electronic device. The method for identifying non-flowable copper foil comprises: obtaining a distance parameter of a target via hole among a plurality of via holes deployed on a printed circuit board covered with copper foil, wherein the copper foil is divided into a plurality of copper foil pixels, and the distance parameter is used to indicate a first distance between a first copper foil pixel point closest to the target via hole and the target via hole, and a second distance between a second copper foil pixel point farthest from the target via hole and the target via hole; determining the flow capacity of the target via hole according to the first distance and the second distance; when the flow capacity is lower than a target flow capacity threshold, determining the copper foil on a triangular region formed between the target via hole and a connected adjacent via hole as the non-flowable copper foil to be removed. The above technical solution is adopted to solve the problems of low recognition efficiency of non-flowable copper foil in the related art.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of computers, and more specifically, to a method and device for identifying non-current-carrying copper foil, a storage medium, and an electronic device. Background Art

[0002] There are many PCB (Printed Circuit Board) design software on the market. In PCB design, if copper foil is laid in areas with dense vias, especially BGA areas, it will cause the copper foil to be cut off by vias to form sharp corners and this part of the copper foil will not have the ability to pass current, affecting the integrity of the signal.

[0003] For the above-mentioned non-current-carrying copper foil, currently layout engineers are required to manually trim the copper foil, and they need to manually check the protruding parts of the copper foil and optimize the copper foil, which is time-consuming, labor-intensive and easy to miss.

[0004] In view of the low efficiency of identifying non-current-carrying copper sheets in related technologies, no effective solution has been proposed yet. Summary of the invention

[0005] The embodiments of the present application provide a method and device for identifying a non-current-carrying copper sheet, a storage medium, and an electronic device, so as to at least solve the problem of low efficiency in identifying a non-current-carrying copper sheet in the related art.

[0006] According to an embodiment of the embodiments of the present application, a method for identifying non-flowable copper sheets is provided, including: obtaining a distance parameter of a target via among a plurality of vias deployed on a printed circuit board covered with copper sheets, wherein the copper sheets are divided into a plurality of copper sheet pixels, and the distance parameter is used to indicate a first distance between a first copper sheet pixel point closest to the target via and the target via, and to indicate a second distance between a second copper sheet pixel point farthest from the target via and the target via; determining the flow capacity of the target via according to the first distance and the second distance; and when the flow capacity is lower than a target flow capacity threshold, determining the copper sheet on a triangular region formed between the target via and a connected adjacent via as the non-flowable copper sheet to be removed.

[0007] Optionally, obtaining the distance parameters of a target via among multiple vias deployed on a printed circuit board covered with copper foil includes: obtaining the position attribute of each of the multiple copper foil pixels to obtain a position attribute set, wherein the position attribute is used to indicate the coordinate position of the corresponding copper foil pixel on the printed circuit board, and the position attribute set includes copper foil pixels and position attributes with a corresponding relationship; determining the distance between each of the copper foil pixels in the copper foil and the target via according to the position attribute set to obtain a distance set; obtaining a minimum distance and a maximum distance from the distance set as the distance parameters, wherein the first distance is the minimum distance and the second distance is the maximum distance.

[0008] Optionally, obtaining the position attribute of each of the multiple copper skin pixel points includes: obtaining an initial calling function corresponding to the printed circuit board, wherein the calling function is used to call all information of the printed circuit board; setting the parameters of the initial calling function to copper skin parameters to obtain a target calling function, wherein the target calling function is used to call the copper skin information in the all information of the printed circuit board, and the copper skin information is used to indicate the distribution of copper skin on the printed circuit board; executing the target calling function to access the copper skin information to obtain the position attribute of each of the multiple copper skin pixel points corresponding to the copper skin.

[0009] Optionally, determining the flow capacity of the target via according to the first distance and the second distance includes: comparing the first distance and the second distance corresponding to the target via; and when the first distance is not equal to the second distance, determining that the flow capacity is lower than the target flow capacity threshold.

[0010] Optionally, determining the copper skin on the quasi-triangular area formed between the target via and the connected adjacent via as the non-flow copper skin to be removed includes: obtaining the copper skin boundary formed by the target via and the adjacent via, wherein the copper skin boundary is the boundary where the copper skin surrounds the target via and the adjacent via, and the copper skin boundary includes a first major arc corresponding to the target via and a second major arc corresponding to the adjacent via; generating a common tangent of the first major arc and the second major arc; and determining the copper skin on the quasi-triangular area enclosed by the common tangent and the copper skin boundary as the non-flow copper skin to be removed.

[0011] Optionally, after the copper skin on the triangular area enclosed by the common tangent and the copper skin boundary is determined as the non-flow copper skin to be removed, the method further includes: obtaining the area area and area coordinates of the triangular area; generating a copper skin removal task carrying the area area and area coordinates, wherein the copper skin removal task is used to indicate the removal of the copper skin of the area area on the area coordinates; and displaying the copper skin removal task on the processing interface corresponding to the printed circuit board.

[0012] Optionally, obtaining the area and area coordinates of the triangle-like region includes: generating a peripheral triangle corresponding to the triangle-like region, wherein the peripheral triangle is the minimum circumscribed triangle of the triangle-like region; obtaining the first vertex coordinates, the second vertex coordinates and the third vertex coordinates of the peripheral triangle; constructing a first vector based on the first vertex coordinates and the second vertex coordinates, and constructing a second vector based on the first vertex coordinates and the third vertex coordinates; determining the product of the first vector and the second vector as the area of ​​the triangle-like region, and determining the first vertex coordinates, the second vertex coordinates and the third vertex coordinates as the area coordinates.

[0013] Optionally, after displaying the copper skin removal task on the processing interface corresponding to the printed circuit board, the method further includes: detecting the execution status of the copper skin removal task; when the execution status indicates that the copper skin removal task has been completed, identifying the triangular-like area; when it is identified that copper skin still exists in the triangular-like area, prompting an execution error of the copper skin removal task.

[0014] According to another embodiment of the embodiment of the present application, a device for identifying non-flow-through copper foil is also provided, including: a first acquisition module, used to acquire a distance parameter of a target via among a plurality of vias deployed on a printed circuit board covered with copper foil, wherein the copper foil is divided into a plurality of copper foil pixels, and the distance parameter is used to indicate a first distance between a first copper foil pixel point closest to the target via and the target via, and to indicate a second distance between a second copper foil pixel point farthest from the target via and the target via; a first determination module, used to determine the flow capacity of the target via according to the first distance and the second distance; and a second determination module, used to determine the copper foil on a triangular area formed between the target via and a connected adjacent via as non-flow-through copper foil to be removed when the flow capacity is lower than a target flow capacity threshold.

[0015] According to another aspect of the embodiments of the present application, a computer-readable storage medium is provided, in which a computer program is stored, wherein the computer program is configured to execute the above-mentioned method for identifying non-current-carrying copper foil when running.

[0016] According to another aspect of the embodiment of the present application, an electronic device is also provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the method for identifying non-current-carrying copper foil through the computer program.

[0017] In an embodiment of the present application, a distance parameter of a target via hole among multiple via holes deployed on a printed circuit board covered with copper foil is obtained, wherein the copper foil is divided into multiple copper foil pixel points, and the distance parameter is used to indicate a first distance between a first copper foil pixel point closest to the target via hole and the target via hole, and a second distance between a second copper foil pixel point farthest from the target via hole and the target via hole; the flow capacity of the target via hole is determined according to the first distance and the second distance; when the flow capacity is lower than the target flow capacity threshold, the copper foil on the triangular area formed between the target via hole and the connected adjacent via hole is determined as the non-flow copper foil to be removed, that is, firstly, the distance parameter of the target via hole among multiple via holes deployed on the printed circuit board covered with copper foil is obtained, The copper skin is divided into a plurality of copper skin pixels. According to the distance parameter, the first distance between the first copper skin pixel closest to the target via and the target via can be determined, as well as the second distance between the second copper skin pixel farthest from the target via and the target via. The flow capacity of the target via is determined based on the first distance and the second distance. When the flow capacity is lower than the target flow capacity threshold, that is, the flow capacity of the target via is low, the copper skin on the triangular area formed between the target via and the connected adjacent via can be determined as the non-flow copper skin to be removed. The above process does not require manual identification of the non-flow copper skin, and the recognition efficiency of the non-flow copper skin is guaranteed without missing the non-flow copper skin. The above technical solution solves the problems of low recognition efficiency of the non-flow copper skin in the related technology, and achieves the technical effect of improving the recognition efficiency of the non-flow copper skin. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] Figure 1 It is a hardware environment schematic diagram of a method for identifying copper foil without current flow according to an embodiment of the present application;

[0021] Figure 2 is a flow chart of a method for identifying non-current-carrying copper skin according to an embodiment of the present application;

[0022] Figure 3 is a schematic diagram of a non-current-carrying copper sheet according to an embodiment of the present application;

[0023] Figure 4 is a schematic diagram of a first distance and a second distance according to an embodiment of the present application;

[0024] Figure 5 is a schematic diagram of determining a non-current-carrying copper sheet according to an embodiment of the present application;

[0025] Figure 6 is a schematic diagram of a method for determining the area and coordinates of a quasi-triangular region according to an embodiment of the present application;

[0026] Figure 7 It is a structural block diagram of a device for identifying non-current-carrying copper skin according to an embodiment of the present application. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0028] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0029] The method embodiments provided in the embodiments of the present application can be executed in a computer terminal, a device terminal or a similar computing device. Taking running on a computer terminal as an example, Figure 1 FIG. 1 is a schematic diagram of the hardware environment of a method for identifying a non-current-carrying copper sheet according to an embodiment of the present application. Figure 1 As shown, the computer terminal may include one or more ( Figure 1 Only one is shown in the figure) processor 102 (processor 102 may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data. In an exemplary embodiment, the computer terminal may also include a transmission device 106 and an input / output device 108 for communication functions. It can be understood by those skilled in the art that Figure 1 The structure shown is only for illustration and does not limit the structure of the above-mentioned computer terminal. Figure 1 More or fewer components as shown, or with Figure 1 Equivalent functions or comparisons shown Figure 1 A different configuration with more features is shown.

[0030] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the method for identifying the non-current copper foil in the embodiment of the present invention. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, to implement the above method. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 may further include a memory remotely arranged relative to the processor 102, and these remote memories may be connected to the computer terminal via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0031] The transmission device 106 is used to receive or send data via a network. The specific example of the above network may include a wireless network provided by a communication provider of a computer terminal. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, referred to as NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 106 can be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0032] In this embodiment, a method for identifying non-current-carrying copper is provided, which is applied to the above-mentioned computer terminal. Figure 2 is a flow chart of a method for identifying a non-current-carrying copper sheet according to an embodiment of the present application, such as Figure 2 As shown, the process includes the following steps:

[0033] Step S202, obtaining a distance parameter of a target via hole among a plurality of via holes deployed on a printed circuit board covered with copper skin, wherein the copper skin is divided into a plurality of copper skin pixels, and the distance parameter is used to indicate a first distance between a first copper skin pixel point closest to the target via hole and the target via hole, and is used to indicate a second distance between a second copper skin pixel point farthest from the target via hole and the target via hole;

[0034] Step S204, determining the flow capacity of the target via hole according to the first distance and the second distance;

[0035] Step S206 , when the flow capacity is lower than the target flow capacity threshold, the copper on the triangular area formed between the target via hole and the connected adjacent via hole is determined as the non-flow copper to be removed.

[0036] Through the above steps, firstly, the distance parameter of the target via among the multiple vias deployed on the printed circuit board covered with copper foil is obtained, and the copper foil is divided into multiple copper foil pixels. According to the distance parameter, the first distance between the first copper foil pixel closest to the target via and the target via can be determined, as well as the second distance between the second copper foil pixel farthest from the target via and the target via. The flow capacity of the target via is determined based on the above first distance and the second distance. When the flow capacity is lower than the target flow capacity threshold, that is, the flow capacity of the target via is low, therefore, the copper foil on the triangular area formed between the target via and the connected adjacent via can be determined as the non-flow copper foil to be removed. The above process does not require manual identification of the non-flow copper foil, and the recognition efficiency of the non-flow copper foil is guaranteed without missing the non-flow copper foil. The above technical solution solves the problems of low recognition efficiency of the non-flow copper foil in the related technology, and achieves the technical effect of improving the recognition efficiency of the non-flow copper foil.

[0037] There are many PCB design software on the market. Cadence is the most widely used software in the industry, not only because it has powerful functions and multiple related software to support it, but also because it provides an open secondary development interface and a relatively complete development language library, so users can carry out secondary development according to their own needs. Skill language is a high-level programming language based on C language and LISP language built into Cadence software. Cadence provides a wealth of interactive functions for skill language. Studying skill language and then writing tools can greatly improve work efficiency.

[0038] In PCB design, if copper foil is laid in areas with dense vias, especially in BGA areas, it will cause the copper foil to be cut off by vias to form sharp corners and this part of the copper foil will not have the ability to pass current. Figure 3 is a schematic diagram of a non-current-carrying copper sheet according to an embodiment of the present application, such as Figure 3 As shown, the copper foil between via 1 and via 2 in rectangular area 1 is connected and has flow capacity, i.e., flow-through copper foil. However, the copper foil between multiple vias in rectangular area 2 forms a triangular area. The copper foil in such a triangular area does not have flow capacity, i.e., the non-flow-through copper foil, which affects the integrity of the signal. When layout engineers manually trim the copper foil, they need to manually check the protruding parts of the copper foil and optimize the copper foil. By manually determining which copper foils are non-flow-through copper foils and then optimizing the copper foils, it is not only time-consuming and labor-intensive, but also easy to miss and be inaccurate when there are many copper foils, and the manual operation efficiency is low.

[0039] In the technical solution provided in the above step S202, a distance parameter of a target via among multiple vias deployed on a printed circuit board covered with copper foil is obtained, wherein the copper foil is divided into multiple copper foil pixels, and the distance parameter is used to indicate a first distance between a first copper foil pixel point closest to the target via and the target via, and to indicate a second distance between a second copper foil pixel point farthest from the target via and the target via.

[0040] Optionally, in this embodiment, the copper skin is divided into a plurality of copper skin pixels, wherein each copper skin pixel has a unique position on the printed circuit board, and each copper skin pixel can be positioned by, but is not limited to, coordinates.

[0041] Optionally, in this embodiment, the distance parameter records a first distance between a first copper pixel point closest to the target via and the target via, and a second distance between a second copper pixel point farthest from the target via and the target via. Figure 4 is a schematic diagram of a first distance and a second distance according to an embodiment of the present application, such as Figure 4 As shown, there are two layout modes of vias on the copper sheet, namely, layout one and layout two.

[0042] There are two upper and lower vias on the copper foil of layout 1. The upper and lower vias (via 1 and via 2) are connected to form a complete area not covered by the copper foil. The first distance and the second distance are explained by taking the upper via 1 as the target via. The copper foil can be regarded as N copper foil pixels, where the coordinate position of each copper foil pixel can be uniquely determined. The center of the target via is regarded as the position of the target via. Then Figure 4 The first copper pixel point in the layout 1 is the copper pixel point closest to the target via hole. At this time, the distance between the first copper pixel point and the target via hole can be used as the first distance. Figure 4 The second copper pixel in is the copper pixel farthest from the target via hole, and the distance between the second copper pixel and the target via hole can be used as the second distance. Obviously, the two are not equal.

[0043] There are two upper and lower vias on the copper foil of layout 2. The upper and lower vias are not connected. There is copper foil covering via 3 and via 4. The upper via 3 is used as the target via to illustrate the first distance and the second distance. The copper foil can be regarded as N copper foil pixels, where the coordinate position of each copper foil pixel can be uniquely determined. The center of the target via is regarded as the position of the target via. Then Figure 4 The first copper pixel point of the second layout is the copper pixel point closest to the target via hole. At this time, the distance between the first copper pixel point and the target via hole can be used as the first distance. Figure 4The second copper pixel in is the copper pixel farthest from the target via hole, and the distance between the second copper pixel and the target via hole can be used as the second distance. Obviously, the first distance and the second distance are the radius of the target via hole, and the two are equal.

[0044] In an exemplary embodiment, the distance parameters of a target via among multiple vias deployed on a printed circuit board covered with copper foil can be obtained in the following manner, but is not limited to: obtaining the position attribute of each of the multiple copper foil pixels to obtain a position attribute set, wherein the position attribute is used to indicate the coordinate position of the corresponding copper foil pixel on the printed circuit board, and the position attribute set includes copper foil pixels and position attributes with a corresponding relationship; determining the distance between each of the copper foil pixels and the target via according to the position attribute set to obtain a distance set; obtaining the minimum distance and the maximum distance from the distance set as the distance parameters, wherein the first distance is the minimum distance and the second distance is the maximum distance.

[0045] Optionally, in this embodiment, the copper skin can be regarded as composed of N copper skin pixels, wherein the coordinate position of each copper skin pixel can be uniquely determined, and the coordinate position of each of the multiple copper skin pixels on the printed circuit board can be obtained.

[0046] Optionally, in this embodiment, the position attribute set includes copper pixels and position attributes with corresponding relationships; that is, the position attribute set can record the distance between each copper pixel and the target via to obtain a distance set, and then obtain the minimum distance and the maximum distance from the distance set as the distance parameters, and finally determine the minimum distance as the first distance, and the maximum distance as the second distance.

[0047] In an exemplary embodiment, the position attribute of each of the multiple copper skin pixel points can be obtained in the following manner but is not limited to: obtaining an initial calling function corresponding to the printed circuit board, wherein the calling function is used to call all the information of the printed circuit board; setting the parameters of the initial calling function to copper skin parameters to obtain a target calling function, wherein the target calling function is used to call the copper skin information in the all the information of the printed circuit board, and the copper skin information is used to indicate the distribution of the copper skin on the printed circuit board; executing the target calling function to access the copper skin information to obtain the position attribute of each of the multiple copper skin pixel points corresponding to the copper skin.

[0048] Optionally, in this embodiment, the initial calling function may be but is not limited to the axlSelect() function, and shape is selected in the find window, that is, the parameters of the initial calling function are set to copper parameters, and the copper information of all copper sheets on the printed circuit board is obtained, and the obtained copper information is put into the list shape(). Taking the elements in the list as an example, for example, List shape()=List(shape1, shape2, shape3...), wherein the distribution of copper sheets on the printed circuit board can be determined according to List shape(), and each shape contains the position attribute of the corresponding copper sheet pixel point. Each element in the list shape() is traversed, and the closest distance a (first distance) and the farthest distance b (second distance) from via to shape are obtained through the axlShapeToVia function.

[0049] In the technical solution provided in the above step S204, the flow capacity of the target via is determined according to the first distance and the second distance.

[0050] Optionally, in this embodiment, the process of determining the flow capacity of the target via hole by the first distance and the second distance can be regarded as determining the distribution and layout of the target via hole on the copper sheet according to the first distance and the second distance, and then determining the flow capacity of the target via hole based on the distribution and layout, for example, Figure 4 As shown, when the first distance and the second distance indicate that the layout mode of the target via is layout one, it is determined that the flow capacity of the target via is lower than the target flow capacity threshold, that is, the triangular area formed between the target via (via 1) and via 2 is non-flow copper, and when the first distance and the second distance indicate that the layout mode of the target via is layout two, it is determined that the flow capacity of the target via is greater than or equal to the target flow capacity threshold, that is, the area formed between the target via (via 3) and via 4 is flow copper.

[0051] In an exemplary embodiment, the flow capacity of the target via can be determined based on the first distance and the second distance in the following manner, but is not limited to: comparing the first distance and the second distance corresponding to the target via; and when the first distance is not equal to the second distance, determining that the flow capacity is lower than the target flow capacity threshold.

[0052] Optionally, in this embodiment, by comparing the first distance (shortest distance a) and the second distance (farthest distance b) corresponding to the target via hole, the following situations may exist:

[0053] Case 1: If a=b=0, the via and shape have the same attributes and no processing is required.

[0054] Case 2: If a=b≠0, the via is surrounded by shape and has flow capacity, so no processing is required.

[0055] Case 3: If a≠b and ≠0, the position information of the non-current-carrying copper area is obtained.

[0056] In the technical solution provided in the above step S206, when the flow capacity is lower than the target flow capacity threshold, the copper on the triangular area formed between the target via and the connected adjacent via is determined as the non-flow copper to be removed.

[0057] Optionally, in this embodiment, when the flow capacity is lower than the target flow capacity threshold, that is, a quasi-triangular area is formed between the target via and an adjacent via, and the copper on the quasi-triangular area is determined as non-flow-carrying copper to be removed.

[0058] In an exemplary embodiment, the copper skin on the triangular area formed between the target via and the connected adjacent via can be determined as the non-flow copper skin to be removed in the following manner, but is not limited to: obtaining the copper skin boundary formed by the target via and the adjacent via, wherein the copper skin boundary is the boundary where the copper skin surrounds the target via and the adjacent via, and the copper skin boundary includes a first major arc corresponding to the target via and a second major arc corresponding to the adjacent via; generating a common tangent of the first major arc and the second major arc; and determining the copper skin on the triangular area enclosed by the common tangent and the copper skin boundary as the non-flow copper skin to be removed.

[0059] Optionally, in this embodiment, Figure 5 is a schematic diagram of determining the non-current-carrying copper skin according to an embodiment of the present application, such as Figure 5 As shown, the positioning method for the quasi-triangular area formed between via 1 and via 2 in layout one can be: the copper skin on the quasi-triangular area enclosed by the common tangent of the copper skin boundary and the first major arc corresponding to the target via (via 1) and the second major arc corresponding to the adjacent via (via 2) is determined as the non-flow copper skin to be removed. The copper skin in state one in the figure reaches state two after the non-flow copper skin is removed.

[0060] In an exemplary embodiment, after the copper skin on the triangular region enclosed by the common tangent and the copper skin boundary is determined as the non-flow copper skin to be removed, the following methods may be included but are not limited to: obtaining the area area and area coordinates of the triangular region; generating a copper skin removal task carrying the area area and area coordinates, wherein the copper skin removal task is used to indicate the removal of the copper skin of the area area on the area coordinates; and displaying the copper skin removal task on the processing interface corresponding to the printed circuit board.

[0061] Optionally, in this embodiment, the area and coordinates of the triangular region are obtained; a copper removal task carrying the area and coordinates is generated. The above process can be completed automatically without manual operation, and the copper removal task is displayed on the processing interface corresponding to the printed circuit board, and the program is loaded in the command window; the corresponding command is run; the software automatically trims the non-flow copper according to the algorithm. There is no need to manually identify the non-flow copper, and the recognition efficiency of the non-flow copper is guaranteed without missing the non-flow copper.

[0062] In an exemplary embodiment, the area and area coordinates of the triangle-like region can be obtained in the following manner but is not limited to: generating a peripheral triangle corresponding to the triangle-like region, wherein the peripheral triangle is the minimum circumscribed triangle of the triangle-like region; obtaining the first vertex coordinates, the second vertex coordinates and the third vertex coordinates of the peripheral triangle; constructing a first vector based on the first vertex coordinates and the second vertex coordinates, and constructing a second vector based on the first vertex coordinates and the third vertex coordinates; determining the product of the first vector and the second vector as the area of ​​the triangle-like region, and determining the first vertex coordinates, the second vertex coordinates and the third vertex coordinates as the area coordinates.

[0063] Optionally, in this embodiment, after determining the quasi-triangle region, the area and coordinates of the quasi-triangle region are obtained. Figure 6 is a schematic diagram of a method for determining the area and coordinates of a quasi-triangular region according to an embodiment of the present application, such as Figure 6As shown, the coordinates (x, y) of via are obtained by function axlVia, and the coordinates of each vertex of shape around via are obtained by function axlshape. The three vertices of the quasi-triangle area are A(X1, Y1), B(X2, Y2) and C(X3, Y3). The direction vector vector1 from point A(X1, Y1) to point B(X2, Y2) and the direction vector vector2 from point A(X1, Y1) to point C(X3, Y3) are calculated respectively. The area of ​​the quasi-triangle area that needs to be optimized is calculated by vectors: S1 = |vector1|*|vector2|*cos<vector1,vector2> Finally, the axlcutshape function is used to correct the shape of this part, and the shape of the shadow area is cut off.

[0064] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods of each embodiment of the present application.

[0065] Figure 7 is a structural block diagram of a device for identifying a non-current-carrying copper sheet according to an embodiment of the present application; Figure 7 As shown, including:

[0066] A first acquisition module 702 is used to acquire a distance parameter of a target via hole among a plurality of via holes deployed on a printed circuit board covered with copper foil, wherein the copper foil is divided into a plurality of copper foil pixels, and the distance parameter is used to indicate a first distance between a first copper foil pixel point closest to the target via hole and the target via hole, and is used to indicate a second distance between a second copper foil pixel point farthest from the target via hole and the target via hole;

[0067] A first determination module 704, configured to determine a flow capacity of the target via hole according to the first distance and the second distance;

[0068] The second determination module 706 is used to determine the copper on the triangular area formed between the target via and the connected adjacent via as non-current-carrying copper to be removed when the current-carrying capacity is lower than the target current-carrying capacity threshold.

[0069] In an exemplary embodiment, the first acquisition module includes:

[0070] A first acquisition unit is used to acquire a position attribute of each of the plurality of copper pixel points to obtain a position attribute set, wherein the position attribute is used to indicate a coordinate position of the corresponding copper pixel point on the printed circuit board, and the position attribute set includes copper pixel points and position attributes having a corresponding relationship;

[0071] A first determining unit is used to determine the distance between each copper sheet pixel in the copper sheet and the target via hole according to the position attribute set to obtain a distance set;

[0072] The second acquisition unit is used to acquire a minimum distance and a maximum distance from the distance set as the distance parameters, wherein the first distance is the minimum distance and the second distance is the maximum distance.

[0073] In an exemplary embodiment, the first acquiring unit is configured to:

[0074] Acquire an initial calling function corresponding to the printed circuit board, wherein the calling function is used to call all information of the printed circuit board;

[0075] The parameter of the initial calling function is set as the copper sheet parameter to obtain the target calling function, wherein the target calling function is used to call the copper sheet information in the whole information of the printed circuit board, and the copper sheet information is used to indicate the distribution of the copper sheet on the printed circuit board;

[0076] The target calling function is executed to access the copper skin information, and the position attribute of each of the copper skin pixel points among the multiple copper skin pixel points corresponding to the copper skin is obtained.

[0077] In an exemplary embodiment, the first determining module includes:

[0078] A comparing unit, configured to compare the first distance and the second distance corresponding to the target via hole;

[0079] The second determining unit is configured to determine that the flow capacity is lower than the target flow capacity threshold when the first distance is not equal to the second distance.

[0080] In an exemplary embodiment, the second determining module includes:

[0081] A third acquisition unit is used to acquire a copper boundary formed by the target via and the adjacent via, wherein the copper boundary is a boundary where the copper surrounds the target via and the adjacent via, and the copper boundary includes a first major arc corresponding to the target via and a second major arc corresponding to the adjacent via;

[0082] A first generating unit, configured to generate a common tangent line between the first major arc and the second major arc;

[0083] The third determining unit is used to determine the copper skin on the triangular region enclosed by the common tangent line and the copper skin boundary as the non-current-carrying copper skin to be removed.

[0084] In an exemplary embodiment, the apparatus further comprises:

[0085] A second acquisition module is used to acquire the area and coordinates of the quasi-triangular region after the copper skin on the quasi-triangular region enclosed by the common tangent line and the copper skin boundary is determined as the non-current-carrying copper skin to be removed;

[0086] A generation module, used for generating a copper sheet removal task carrying the area and coordinates of the region, wherein the copper sheet removal task is used for indicating the removal of the copper sheet of the area of ​​the region on the coordinates of the region;

[0087] A display module is used to display the copper skin removal task on a processing interface corresponding to the printed circuit board.

[0088] In an exemplary embodiment, the second acquisition module includes:

[0089] A second generating unit, configured to generate an outer triangle corresponding to the triangle-like region, wherein the outer triangle is a minimum circumscribed triangle of the triangle-like region;

[0090] A fourth acquisition unit, used to acquire the first vertex coordinates, the second vertex coordinates and the third vertex coordinates of the outer triangle;

[0091] a construction unit, configured to construct a first vector according to the first vertex coordinates and the second vertex coordinates, and to construct a second vector according to the first vertex coordinates and the third vertex coordinates;

[0092] The fourth determining unit is used to determine the product of the first vector and the second vector as the area of ​​the quasi-triangle region, and to determine the first vertex coordinates, the second vertex coordinates and the third vertex coordinates as the area coordinates.

[0093] In an exemplary embodiment, the apparatus further comprises:

[0094] A detection module, used for detecting the execution status of the copper skin removal task after the copper skin removal task is displayed on the processing interface corresponding to the printed circuit board;

[0095] An identification module, configured to identify the triangular region when the execution status indicates that the copper skin removal task has been completed;

[0096] The prompt module is used to prompt that the copper skin removal task is executed incorrectly when it is identified that copper skin still exists in the triangular region.

[0097] It should be noted that the above modules can be implemented by software or hardware. For the latter, it can be implemented in the following ways, but not limited to: the above modules are all located in the same processor; or the above modules are located in different processors in any combination.

[0098] Through the above embodiment, firstly, the distance parameter of the target via among the multiple vias deployed on the printed circuit board covered with copper foil is obtained, and the copper foil is divided into multiple copper foil pixels. According to the distance parameter, the first distance between the first copper foil pixel closest to the target via and the target via can be determined, as well as the second distance between the second copper foil pixel farthest from the target via and the target via. The flow capacity of the target via is determined based on the above first distance and the second distance. When the flow capacity is lower than the target flow capacity threshold, that is, the flow capacity of the target via is low, therefore, the copper foil on the triangular area formed between the target via and the connected adjacent via can be determined as the non-flow copper foil to be removed. The above process does not require manual identification of the non-flow copper foil, and the recognition efficiency of the non-flow copper foil is guaranteed without missing the non-flow copper foil. The above technical solution solves the problems of low recognition efficiency of the non-flow copper foil in the related technology, and achieves the technical effect of improving the recognition efficiency of the non-flow copper foil.

[0099] In an exemplary embodiment,

[0100] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above method embodiments when running.

[0101] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.

[0102] An embodiment of the present application further provides an electronic device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0103] In an exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor, and the input / output device is connected to the processor.

[0104] For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary implementation modes, and this embodiment will not be described in detail herein.

[0105] Obviously, those skilled in the art should understand that the above modules or steps of the present application can be implemented by a general computing device, they can be concentrated on a single computing device, or distributed on a network composed of multiple computing devices, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be executed in a different order from that herein, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. Thus, the present application is not limited to any specific combination of hardware and software.

[0106] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A method for identifying non-current-carrying copper sheets. It is characterized in that include: Obtaining a distance parameter of a target via hole among a plurality of via holes deployed on a printed circuit board covered with copper skin, wherein the copper skin is divided into a plurality of copper skin pixels, and the distance parameter is used to indicate a first distance between a first copper skin pixel point closest to the target via hole and the target via hole, and is used to indicate a second distance between a second copper skin pixel point farthest from the target via hole and the target via hole; Determining a flow capacity of the target via according to the first distance and the second distance; When the flow capacity is lower than the target flow capacity threshold, the copper skin on the triangular area formed between the target via hole and the connected adjacent via hole is determined as the non-flow copper skin to be removed; The step of obtaining the distance parameter of a target via hole among a plurality of via holes deployed on a printed circuit board covered with copper comprises: Obtaining a position attribute of each of the plurality of copper pixels to obtain a position attribute set, wherein the position attribute is used to indicate a coordinate position of the corresponding copper pixel on the printed circuit board, and the position attribute set includes copper pixels and position attributes having a corresponding relationship; Determine the distance between each copper sheet pixel in the copper sheet and the target via hole according to the position attribute set to obtain a distance set; A minimum distance and a maximum distance are acquired from the distance set as the distance parameters, wherein the first distance is the minimum distance and the second distance is the maximum distance.

2. The method according to claim 1, It is characterized in that The obtaining of the position attribute of each of the plurality of copper pixels includes: Acquire an initial calling function corresponding to the printed circuit board, wherein the calling function is used to call all information of the printed circuit board; The parameter of the initial calling function is set as the copper sheet parameter to obtain the target calling function, wherein the target calling function is used to call the copper sheet information in the whole information of the printed circuit board, and the copper sheet information is used to indicate the distribution of the copper sheet on the printed circuit board; The target calling function is executed to access the copper skin information, and the position attribute of each of the copper skin pixel points among the multiple copper skin pixel points corresponding to the copper skin is obtained.

3. The method according to claim 1, It is characterized in that The determining the flow capacity of the target via hole according to the first distance and the second distance includes: Comparing the first distance and the second distance corresponding to the target via hole; When the first distance is not equal to the second distance, it is determined that the flow capacity is lower than the target flow capacity threshold.

4. The method according to claim 1, It is characterized in that The step of determining the copper skin on the triangular region formed between the target via hole and the connected adjacent via hole as the non-flow copper skin to be removed includes: Acquire a copper boundary formed by the target via and the adjacent via, wherein the copper boundary is a boundary where the copper surrounds the target via and the adjacent via, and the copper boundary includes a first major arc corresponding to the target via and a second major arc corresponding to the adjacent via; generating a common tangent line between the first major arc and the second major arc; The copper skin on the triangular region enclosed by the common tangent line and the copper skin boundary is determined as the non-current-carrying copper skin to be removed.

5. The method according to claim 4, It is characterized in that After determining the copper skin on the triangular region enclosed by the common tangent line and the copper skin boundary as the non-current-carrying copper skin to be removed, the method further includes: Obtaining the area and coordinates of the triangular region; Generate a copper sheet removal task carrying the area and coordinates of the region, wherein the copper sheet removal task is used to instruct to remove the copper sheet of the area on the coordinates of the region; The copper skin removal task is displayed on a processing interface corresponding to the printed circuit board.

6. The method according to claim 5, It is characterized in that The obtaining of the area and coordinates of the triangular region comprises: Generate an outer triangle corresponding to the triangle-like region, wherein the outer triangle is the minimum circumscribed triangle of the triangle-like region; Obtain the first vertex coordinates, the second vertex coordinates and the third vertex coordinates of the outer triangle; Constructing a first vector according to the first vertex coordinates and the second vertex coordinates, and constructing a second vector according to the first vertex coordinates and the third vertex coordinates; The product of the first vector and the second vector is determined as the region area of ​​the triangular region, and the first vertex coordinates, the second vertex coordinates and the third vertex coordinates are determined as the region coordinates.

7. The method according to claim 5, It is characterized in that After displaying the copper skin removal task on a processing interface corresponding to the printed circuit board, the method further includes: Detecting the execution status of the copper skin removal task; When the execution status indicates that the copper skin removal task has been completed, identifying the triangular region; When it is identified that copper skin still exists in the triangular region, it is prompted that the copper skin removal task is executed incorrectly.

8. A device for identifying non-current-carrying copper sheets. It is characterized in that include: A first acquisition module is used to acquire a distance parameter of a target via hole among a plurality of via holes deployed on a printed circuit board covered with copper foil, wherein the copper foil is divided into a plurality of copper foil pixels, and the distance parameter is used to indicate a first distance between a first copper foil pixel point closest to the target via hole and the target via hole, and is used to indicate a second distance between a second copper foil pixel point farthest from the target via hole and the target via hole; A first determination module, configured to determine a flow capacity of the target via hole according to the first distance and the second distance; A second determination module is used to determine the copper skin on the triangular area formed between the target via hole and the connected adjacent via hole as the non-current-carrying copper skin to be removed when the current-carrying capacity is lower than the target current-carrying capacity threshold; Wherein, the first acquisition module includes: A first acquisition unit is used to acquire a position attribute of each of the plurality of copper pixel points to obtain a position attribute set, wherein the position attribute is used to indicate a coordinate position of the corresponding copper pixel point on the printed circuit board, and the position attribute set includes copper pixel points and position attributes having a corresponding relationship; A first determining unit is used to determine the distance between each copper sheet pixel in the copper sheet and the target via hole according to the position attribute set to obtain a distance set; The second acquisition unit is used to acquire a minimum distance and a maximum distance from the distance set as the distance parameters, wherein the first distance is the minimum distance and the second distance is the maximum distance.

9. A computer-readable storage medium, It is characterized in that The computer-readable storage medium includes a stored program, wherein the program executes the method according to any one of claims 1 to 7 when executed.

10. An electronic device comprising a memory and a processor, It is characterized in that A computer program is stored in the memory, and the processor is configured to execute the method according to any one of claims 1 to 7 through the computer program.

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