A needle mechanism

Abstract

The ejector pin mechanism comprises at least one ejector pin cap assembly, a lifting assembly, a rotating assembly and a Z-axis moving assembly. Each ejector pin cap assembly comprises an ejector pin cap and an ejector pin arranged in the inner cavity of the ejector pin cap, and the ejector pin is in sliding connection with the ejector pin cap. The lifting assembly comprises a cam motor and a cam, the cam motor drives the cam to rotate, the cam drives the ejector pin cap to move up and down, and the ejector pin is fixed and does not move. The rotating assembly is connected with the ejector pin cap assembly and is used for rotating and switching the ejector pin cap assembly. The Z-axis moving assembly is in sliding connection with the ejector pin cap assembly and is used for driving the ejector pin cap assembly to move up and down along the Z-axis direction. The ejector pin cap assembly is driven by the Z-axis moving assembly to move up and down, the ejector pin cap is driven by the lifting assembly to move up and down, and the ejector pin is fixed and does not move. Thus, the movement of the ejector pin cap up and down replaces the movement of the ejector pin up and down, and the problems of uneven speed, deviation and chip damage in the chip picking process are solved. In addition, the ejector pin can be replaced, and the picking of various chip sizes can be adapted.

Description

Technical Field

[0001] This application relates to the field of chip pickup technology, and more particularly to a pin mechanism. Background Technology

[0002] On chip mounting equipment, chips of different sizes and specifications can be automatically switched on the equipment by automatically changing the type of wafer ring or directly switching the loading table. When the chip is mounted, it needs to be picked up on the blue film by the ejector pin mechanism. Different ejector pin assemblies need to be switched when switching between different specifications of chips.

[0003] Currently, the ejector mechanism mainly uses a motor to drive a cam to rotate. The cam drives the shaft connected to the ejector pin through a ball bushing assembly, causing the ejector pin to move up and down to pierce the blue film disk and eject the chip. However, when ejecting the chip by moving the ejector pin up and down, problems such as difficulty in picking up the chip, unstable speed, and chip misalignment during the picking process may occur, which may cause chip damage. Summary of the Invention

[0004] This application provides a ejector pin mechanism to solve problems such as uneven chip picking speed and offset in the current ejector pin mechanism.

[0005] This application provides an ejector mechanism, comprising:

[0006] At least one ejector cap assembly, each of the ejector cap assemblies including an ejector cap and an ejector pin disposed in the inner cavity of the ejector cap, the ejector pin being slidably connected to the ejector cap;

[0007] The lifting assembly includes a cam motor and a cam. The cam motor drives the cam to rotate, and the cam causes the ejector cap to move up and down, while the ejector pin remains stationary.

[0008] A rotating component, connected to the ejector cap assembly, is used to rotate and switch the ejector cap assembly;

[0009] The Z-axis moving component is slidably connected to the ejector pin assembly and is used to drive the ejector pin assembly to move up and down along the Z-axis.

[0010] The ejector mechanism provided in this application includes at least one ejector cap assembly, a lifting assembly, a rotating assembly, and a Z-axis moving assembly. Each ejector cap assembly includes an ejector cap and an ejector pin disposed within the cavity of the ejector cap, with the ejector pin and ejector cap slidably connected. The lifting assembly includes a cam motor and a cam. The cam motor drives the cam to rotate, and the cam drives the ejector cap to move up and down, while the ejector pin remains stationary. The rotating assembly is connected to the ejector cap assembly and is used to rotate and switch the ejector cap assembly. The Z-axis moving assembly is slidably connected to the ejector cap assembly and is used to drive the ejector cap assembly to move up and down along the Z-axis. This application uses the Z-axis moving assembly to drive the ejector cap assembly to move up and down along the Z-axis, and the lifting assembly to drive the ejector cap to move up and down while ensuring the ejector pin remains stationary. This method replaces the up-and-down movement of the ejector pin with the up-and-down movement of the ejector pin, resulting in a stable ejector cap movement speed and avoiding chip damage caused by uneven speed during chip pickup. Furthermore, this application includes multiple ejector cap assemblies, which can be switched by rotating the assembly, thus enabling multiple ejector pin replacements to accommodate the pickup of various chip sizes. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of an ejector pin mechanism provided in an embodiment of this application;

[0012] Figure 2 This is a schematic diagram of another angle of the ejector mechanism provided in an embodiment of this application;

[0013] Figure 3 A partial structural schematic diagram of an ejector mechanism provided in an embodiment of this application;

[0014] Figure 4 This is a partial structural diagram of a pin mechanism from another angle, provided in an embodiment of this application.

[0015] Figure 5 This is a schematic diagram of the assembly of the ejector cap assembly and the lifting assembly in an ejector mechanism provided in an embodiment of this application;

[0016] Figure 6 This is a schematic diagram of the structure of an ejector cap assembly in an ejector mechanism provided in an embodiment of this application;

[0017] Figure 7 A cross-sectional view of an ejector cap assembly in an ejector mechanism provided in an embodiment of this application;

[0018] Figure 8 This is an assembly cross-sectional view of the ejector cap assembly and the lifting assembly in an ejector mechanism provided in an embodiment of this application;

[0019] Figure 9 A front view of an ejector cap assembly in an ejector mechanism provided in an embodiment of this application;

[0020] Figure 10 This is a schematic diagram of the assembly of the ejector cap assembly and the rotating assembly in an ejector mechanism provided in an embodiment of this application. Detailed Implementation

[0021] To facilitate the description of the technical solution of the application, some concepts involved in this application will be explained first below.

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0023] LD (Laser Diode) is an optical chip approximately 0.2mm x 0.2mm in size, used in high-speed optical devices such as TOSA. When mounting LDs, a pick-up mechanism is needed to pick them up from the blue film, which can lead to difficulties such as pick-up difficulties, unstable speed, and chip misalignment during the pick-up process. Additionally, other large-sized chips are also involved in the mounting of optical devices, necessitating the use of different types of picks.

[0024] Figure 1 This is a schematic diagram of the ejector mechanism provided in an embodiment of this application. Figure 2 This is a schematic diagram of the ejector mechanism provided in an embodiment of this application from another angle. (See diagram below.) Figure 1 , Figure 2 As shown, the ejector mechanism provided in this embodiment includes at least one ejector cap assembly 100, a lifting assembly, a Z-axis moving assembly 300, an X-axis moving assembly 400, a Y-axis moving assembly 500, and a rotating assembly 600. The ejector cap assembly 100 is movably connected to the lifting assembly, which drives the ejector cap in the ejector cap assembly 100 to move up and down, while the ejector pin in the ejector cap assembly 100 remains fixed. The ejector cap assembly 100 is rotatably connected to the rotating assembly 600, which rotates to switch positions. The ejector cap assembly 100 is slidably connected to the ejector cap assembly 100 and is used to drive the ejector cap assembly 100 to move up and down along the Z-axis; the X-axis moving assembly 400 is connected to the Z-axis moving assembly 300 and is used to drive the Z-axis moving assembly 300 and the ejector cap assembly 100 to move left and right along the X-axis; the Y-axis moving assembly 500 is connected to the X-axis moving assembly 400 and is used to drive the X-axis moving assembly, the Z-axis moving assembly and the ejector cap assembly 100 to move back and forth along the Y-axis.

[0025] Specifically, when picking up the LD chip, the ejector cap assembly 100 is moved along the Z-axis, X-axis, and Y-axis directions by the Z-axis moving component 300, X-axis moving component 400, and Y-axis moving component 500 to position the ejector cap assembly 100 directly below the LD chip. Then, based on the size of the LD chip, the ejector cap assembly 100 is rotated and switched by the rotating component 600 to select the corresponding ejector pin. Next, the ejector cap in the ejector cap assembly 100 is moved up and down by the lifting component, while the ejector pin inside the ejector cap remains stationary, allowing the ejector cap to move the ejector pin up and down. In this way, the ejector cap is raised to the working height, and the ejector pin passing through the ejector cap is used for demolding the LD chip.

[0026] Figure 3 This is a partial structural schematic diagram of the ejector mechanism provided in an embodiment of this application. Figure 4 This is a partial structural diagram of the ejector mechanism provided in an embodiment of this application from another angle. (See diagram below.) Figure 3 , Figure 4 As shown, the rotating assembly includes a support plate 200 and a connecting plate 800. The pin cap assembly 100 is slidably disposed on one side of the support plate 200, and the connecting plate 800 is fixedly disposed on the other side of the support plate 200.

[0027] The Z-axis moving assembly 300 includes a fixed frame 700, a guide rail 310, a fixed plate 320, a lead screw, and a moving motor 330. The guide rail 310 is slidably connected to the fixed frame 700. The fixed plate 320 is fixedly mounted on the guide rail 310 and is fixedly connected to the connecting plate 800. The moving motor 330 is rotatably connected to the lead screw, and the lead screw is rotatably connected to the guide rail 310. Thus, the moving motor 330 drives the lead screw to rotate, which in turn drives the guide rail 310 to reciprocate up and down within the fixed frame 700. The guide rail 310 then drives the fixed plate 320 to reciprocate up and down, which in turn drives the connecting plate 800 to reciprocate up and down. The connecting plate 800 then drives the support plate 200 to reciprocate up and down, which in turn drives the ejector cap assembly 100 to reciprocate up and down, thereby moving the ejector cap assembly 100 to the working height.

[0028] In some embodiments, the fixing frame 700 is an L-shaped fixing frame, that is, the fixing frame 700 includes a bottom fixing plate and a side fixing plate connected to each other. The side fixing plate is arranged along the Z-axis direction, and the bottom fixing plate is perpendicular to the side fixing plate. The guide rail 310, the lead screw, the fixing plate 320 and the moving motor 330 are all located on one side of the side fixing plate. The bottom fixing plate faces the X-axis moving assembly 400, and the Z-axis moving assembly 300 is fixedly connected to the X-axis moving assembly 400 through the bottom fixing plate of the fixing frame 700.

[0029] Figure 5 This is an assembly diagram of the ejector cap assembly and the lifting assembly in the ejector mechanism provided in the embodiments of this application. Figure 6This is a schematic diagram of the ejector cap assembly in the ejector mechanism provided in an embodiment of this application. Figure 5 , Figure 6 As shown, the lifting assembly includes a cam 210 and a cam motor 230. The cam 210 and the pin cap assembly 100 are located on the same side of the support plate 200, and the cam motor 230 is located on the other side of the support plate 200. The drive shaft of the cam motor 230 passes through the support plate 200 and is rotatably connected to the cam 210, that is, the cam motor 230 drives the cam 210 to rotate.

[0030] The ejector cap assembly 100 includes an ejector cap 110, a bearing 120, a lifting plate 130, and a slide rail 140. The bearing 120 is correspondingly arranged with the cam 210. One end of the lifting plate 130 is fixedly connected to the bearing 120, and the other end is fixedly connected to the ejector cap 110. The side of the lifting plate 130 is slidably connected to the slide rail 140, and the slide rail 140 is fixedly connected to the support plate 200. That is, the lifting plate 130, through its slidable connection with the slide rail 140, positions the ejector cap assembly 100 on one side of the support plate 200.

[0031] When the cam motor 230 drives the cam 210 to rotate, the cam 210 may or may not make contact with the bearing 120. When the cam 210 rotates to the position where it contacts the bearing 120, as the cam 210 continues to rotate, the cam 210 drives the bearing 120 to move upward, the bearing 120 drives the lifting plate 130 to move upward, and the lifting plate 130 drives the ejector cap 110 to move upward, thereby causing the ejector cap 110 to demold the chip.

[0032] In some embodiments, when the lifting plate 130 moves upward, since the lifting plate 130 is slidably connected to the slide rail 140, the slide rail 140 serves as a guide, and the lifting plate 130 slides upward along the slide rail 140.

[0033] When the cam 210 rotates to the position where it is separated from the bearing 120, as the cam 210 continues to rotate, the ejector cap assembly 100 loses its upward force, and the ejector cap 110, the lifting plate 130 and the bearing 120 slide downward under the action of gravity, causing the ejector cap 110 to separate from the chip.

[0034] In some embodiments, the ejector mechanism further includes a baffle 250, one end of which is fixed to the support plate 200 and the other end is fixed to the top surface of the slide rail 140. A return spring 150 is provided between the baffle 250 and the lifting plate 130. When the lifting plate 130 moves upward under the action of the cam 210, the return spring 150 is compressed. When the cam 210 separates from the bearing 120, the lifting plate 130 can move downward under the action of the return spring 150 to quickly move the ejector cap 110 downward.

[0035] In some embodiments, the lifting plate 130 includes a side plate, a connecting column, and a protruding plate. The side plate and the connecting column are parallel to the support plate 200. One end of the connecting column is connected to one end of the side plate, and the other end is connected to the bearing 120. The side surface of the side plate can abut against the outer wall of the ejector cap 110, and the other end of the side plate supports and fixes the ejector cap 110. The protruding plate is perpendicular to the side plate, and one end of the return spring 150 is fixedly connected to the protruding plate, and the other end is fixedly connected to the baffle 250.

[0036] In some embodiments, the lifting plate 130 is provided with two protruding plates with a certain gap between them, the slide rail 140 is embedded in the gap between the two protruding plates, and the side plate of the lifting plate 130 is slidably connected to the slide rail 140.

[0037] When the lifting plate 130 is provided with two protruding plates, a return spring 150 is provided between the baffle 250 and each protruding plate, and the two return springs 150 are located on opposite sides of the slide rail 140.

[0038] In some embodiments, the lifting assembly further includes a sensing plate 220 and a sensor 240. The sensing plate 220 is disposed on the surface of the cam 210, and the sensor 240 is disposed on the side of the cam 210. The sensing plate 220 and the sensor 240 are used to detect the rotation angle of the cam 210. For example, the sensing plate 220 can be used to detect the rotation angle of the cam 210 in real time, and the sensor 240 can be used to detect the initial angle of the cam 210. Thus, after the chip is demolded by the ejector cap assembly 100, the cam 210 can be restored to its original state according to the initial angle detected by the sensor 240 and the rotation angle detected by the sensing plate 220 to ensure the consistency of the initial position of the cam 210, thereby enabling the rapid demolding of the next chip.

[0039] Figure 7 This is a cross-sectional view of the ejector cap assembly in the ejector mechanism provided in the embodiments of this application. Figure 8 This is an assembly cross-sectional view of the ejector cap assembly and the lifting assembly in the ejector mechanism provided in an embodiment of this application. Figure 7 , Figure 8 As shown, the ejector cap assembly 100 also includes a connector 170 and a linear bearing 180. Both the connector 170 and the linear bearing 180 are located inside the cavity of the ejector cap 110. The ejector pin 160 is fixedly connected to the connector 170, the connector 170 is fixedly connected to the linear bearing 180, and the linear bearing 180 is fixedly connected to the ejector cap 110.

[0040] Thus, the cam motor 230 drives the cam 210 to rotate. When the cam 210 contacts the bearing 120, it can drive the bearing 120 to move upward. The bearing 120 drives the lifting plate 130 to slide upward along the slide rail 140. The lifting plate 130 drives the ejector cap 110 to move upward. When the ejector cap 110 moves upward, it drives the linear bearing 180, the connecting piece 170 and the ejector pin 160 to move upward. The ejector pin 160, the connecting piece 170 and the linear bearing 180 are fixed in the inner cavity of the ejector cap 110.

[0041] When the ejector cap 110 moves the ejector pin 160 upward, the ejector cap 110 supports the blue film, and the ejector pin 160 through the ejector cap 110 lifts and demolds the chip.

[0042] In some embodiments, when the ejector pin 160 is fixed in the inner cavity of the ejector pin cap 110 by the linear bearing 180 in the ejector pin cap assembly 100, the inner wall of the ejector pin cap 110 may be provided with threads, and the linear bearing may be threadedly connected to the ejector pin cap 110 by the external threads to ensure the stability of the ejector pin 160 installation.

[0043] In some embodiments, the ejector cap assembly 100 may further include a slider 190, which is slidably connected to the slide rail 140. The side plate of the lifting plate 130 is fixedly connected to the slider 190. Thus, the cam motor 230 drives the cam 210 to rotate. When the cam 210 contacts the bearing 120, it drives the bearing 120 to move upward. The bearing 120 drives the lifting plate 130 to move upward. The lifting plate 130 drives the slider 190 to slide upward along the slide rail 140. At the same time, the lifting plate 130 drives the ejector cap 110 to move upward.

[0044] Figure 9 This is a front view of the ejector cap assembly in the ejector mechanism provided in an embodiment of this application. Figure 9 As shown, the ejector mechanism provided in this application embodiment may include three ejector cap assemblies 100, and the ejector pins 160 in the three ejector cap assemblies 100 are of different types, so as to achieve demolding of chips of different sizes through different ejector pins 160.

[0045] The three ejector cap assemblies 100 have identical structures, each including a bearing, a lifting plate, a slide rail, and an ejector cap. The cam 210 is located at the position where the central axes of the three ejector cap assemblies 100 are connected. For example, two of the three ejector cap assemblies are arranged opposite each other, and their central axes are on the same straight line. The remaining ejector cap assembly is located on the central axis of the line connecting the two ejector cap assemblies. That is, the central axes of the two ejector cap assemblies are set along the Z-axis direction, and the central axis of the remaining ejector cap assembly is perpendicular to the Z-axis direction and located in the X-axis direction.

[0046] In some embodiments, the support plate 200 may be a semi-circular structure, the central axis of the cam 210 passes through the center of the support plate 200, and three ejector cap assemblies 100 are respectively arranged radially along the semi-circular support plate 200, wherein two ejector cap assemblies 100 are located on the same vertical diameter upward, and the remaining ejector cap assembly 100 is located on the horizontal radial direction.

[0047] In some embodiments, the number of ejector cap assemblies 100 in the ejector mechanism is not limited to three. The number of ejector cap assemblies 100 can be set on the support plate 200 according to the actual situation. In addition, the shape of the support plate 200 and the arrangement of the multiple ejector cap assemblies 100 on the support plate 200 are not limited to the above description. The shape of the support plate 200 and the arrangement of the ejector cap assemblies 100 on the support plate 200 can be set according to the actual situation. For example, the shape of the support plate 200 can be circular. The angle between adjacent ejector cap assemblies 100 can be set according to the actual situation. All of these are within the protection scope of the embodiments of this application.

[0048] Figure 10 This is a schematic diagram illustrating the assembly of the ejector cap assembly and the rotating assembly in the ejector mechanism provided in an embodiment of this application. Figure 10 As shown, since the support plate 200 is provided with multiple ejector pin assemblies 100, the ejector pins 160 in the multiple ejector pin assemblies 100 are of different types. Different types of ejector pins 160 are used to eject chips of different sizes. Therefore, the type of ejector pin 160 needs to be selected according to the size of the chip to be picked up. After selecting the type of ejector pin 160, the support plate 200 is driven to rotate by the rotating assembly 600 so as to rotate the selected ejector pin assembly 100 directly under the chip.

[0049] Specifically, the rotating assembly 600 also includes a rotating motor, which can be fixedly connected to the fixed plate 320. The rotating shaft of the rotating motor is rotatably connected to the connecting plate 800, and the connecting plate 800 is fixedly connected to the support plate 200. Thus, the rotating motor drives the connecting plate 800 to rotate, the connecting plate 800 drives the support plate 200 to rotate, and the support plate 200 drives the ejector cap assembly 100 to rotate. When the selected ejector cap assembly 100 rotates to directly below the chip, the rotating motor stops rotating, and then the ejector cap 110 is driven to move upward by the lifting assembly to achieve chip demolding.

[0050] When replacing a chip, the rotary motor needs to be restarted. The rotary motor drives the connecting plate 800 to rotate, which in turn drives the support plate 200 to rotate. The support plate 200 then drives the ejector pin assembly 100 to rotate until the ejector pin assembly 100 is directly below the chip.

[0051] The usage process of the ejector mechanism provided in this application embodiment is as follows:

[0052] In use, the X-axis and Y-axis moving components drive the ejector cap assembly to move left and right, and forward and backward, moving it directly below the chip to be picked up. Then, the Z-axis moving component moves the ejector cap assembly up and down to the working height. Next, the rotating component drives the support plate to rotate, causing multiple ejector cap assemblies on the support plate to rotate and switch working positions, so that the ejector cap assembly of the corresponding specification rotates directly below the chip and above the lifting component. Then, the lifting component drives the ejector cap in the ejector cap assembly to move upward along the slide rail, so that the ejector cap supports the blue film of the chip, and the ejector pins passing through the ejector cap hold the chip. Then, the lifting component continues to drive the ejector cap to move upward, so that the ejector pins lift and demold the chip.

[0053] The ejector pin mechanism provided in this application adopts a unique ejector pin cap moving mechanism. The ejector pin cap assembly is driven to move up and down along the Z-axis by the Z-axis moving component, to move left and right along the X-axis by the X-axis moving component, and to move back and forth along the Y-axis by the Y-axis moving component, thereby moving the ejector pin cap assembly to the working height directly below the chip. The ejector pin cap assembly can move up and down by the cam motor in the lifting component in cooperation with the cam and bearing. The ejector pin assembly is connected to the ejector pin cap by the bearing, and the ejector pin is fixed on the connector and connected to the ejector pin cap by the linear bearing, so that when the ejector pin cap moves up and down, the ejector pin in the inner cavity of the ejector pin cap remains stationary, and the ejector pin moves up and down with the ejector pin cap. Multiple ejector pin assemblies are set on a rotating component, and the ejector pins in the multiple ejector pin assemblies are of different types, which can realize the rapid switching of various ejector pins and is compatible with chips of different sizes.

[0054] In this application, the ejector cap moves up and down through the lifting component, replacing the up and down movement of the ejector pin. The ejector cap moves smoothly and without deviation, solving the problems of uneven speed and deviation in the chip picking process and avoiding the problem of easy damage during chip picking. Furthermore, multiple ejector pins can be replaced to adapt to various chip sizes.

[0055] The ejector mechanism provided in this application embodiment has a compact structure. The ejector cap assembly is moved up and down as a whole by a lead screw and guide rail mechanism, so as to achieve precise position control. The cam motor drives the cam to rotate, and the cam drives the ejector cap to move up and down on the slide rail, so as to achieve a smooth movement speed and no position or angle deviation during the lifting process. The rotating component realizes the rapid switching of various ejector pins to automatically change the ejector pin type.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A pin mechanism, characterized in that, include: Support plate; A lifting assembly, fixed to the support plate, includes a cam motor and a cam, wherein the cam motor drives the cam to rotate; At least one ejector cap assembly, each of the ejector cap assemblies comprising: Thimble cap; A ejector pin is disposed in the inner cavity of the ejector pin cap, and the ejector pin is fixedly connected to the ejector pin cap; a bearing is disposed corresponding to the cam; The lifting plate is fixedly connected at one end to the bearing and at the other end to the ejector pin cap; The slide rail is slidably connected to the side of the lifting plate, and the slide rail is fixedly connected to the support plate; When the cam drives the ejector cap to move up and down, the ejector pin remains stationary. When the cam rotates to the position where it contacts the bearing, as the cam continues to rotate, the cam drives the bearing to move upward, and the bearing drives the lifting plate and the ejector cap located on the lifting plate to move upward. When the cam rotates to the position where it separates from the bearing, as the cam continues to rotate, the ejector cap assembly loses its upward force, causing the ejector cap to separate from the chip. A rotating component, connected to the ejector cap assembly, is used to rotate and switch the ejector cap assembly; The Z-axis moving component is slidably connected to the ejector cap assembly and is used to drive the ejector cap assembly to move up and down along the Z-axis. A baffle plate, one end of which is fixed to the support plate and the other end of which is fixed to the top surface of the slide rail; a return spring is provided between the baffle plate and the lifting plate; the return spring is located on opposite sides of the slide rail.

2. The ejector mechanism according to claim 1, characterized in that, The rotating assembly includes a support plate, a connecting plate, and a rotary motor. The pin cap assembly and the cam are located on one side of the support plate, the cam motor and the rotary motor are located on the other side of the support plate, and one end of the connecting plate is rotatably connected to the rotary motor and the other end is fixedly connected to the support plate.

3. The ejector mechanism according to claim 2, characterized in that, The ejector cap assembly further includes a connector and a linear bearing. The connector and the linear bearing are both located inside the cavity of the ejector cap. The ejector pin is fixedly connected to the connector, the connector is fixedly connected to the linear bearing, and the linear bearing is fixedly connected to the ejector cap.

4. The ejector mechanism according to claim 1, characterized in that, The lifting assembly also includes a sensing plate and a sensor. The cam motor is connected to the cam drive. The sensing plate is disposed on the surface of the cam, and the sensor is disposed on the side of the cam. The sensing plate and the sensor are used to detect the rotation angle of the cam.

5. The ejector mechanism according to claim 2, characterized in that, The Z-axis moving assembly includes a fixed frame, a moving motor, a guide rail, a lead screw, and a fixed plate. The guide rail is slidably connected to the fixed frame, the fixed plate is fixedly mounted on the guide rail, and the fixed plate is fixedly connected to the connecting plate. The movable motor is rotatably connected to the lead screw, and the lead screw is rotatably connected to the guide rail.

6. The ejector mechanism according to claim 5, characterized in that, Also includes: The X-axis moving component is fixedly connected to the fixed frame and is used to drive the pin cap assembly to move along the X-axis direction; The Y-axis moving component is fixedly connected to the X-axis moving component and is used to drive the pin cap assembly to move along the Y-axis direction.

7. The ejector mechanism according to claim 1, characterized in that, The ejector pins in the multiple ejector pin cap assemblies are not the same.

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