A display module and a preparation method thereof

Abstract

An embodiment of the present invention provides a display module and a manufacturing method thereof. The manufacturing method of the display module includes: preparing a display panel, the display panel includes a display area and a device setting area, and there is a cutting boundary between the display area and the device setting area; preparing an adhesion component on the light-emitting side of the display panel, the adhesion component includes an adhesion layer, an adhesion protection layer and an adhesion force adjustment structure; along the thickness direction of the display module, the adhesion force adjustment structure overlaps with the cutting boundary; in the setting area of the adhesion force adjustment structure, the adhesion layer and the adhesion protection layer have a first adhesion force; in the non-setting area of the adhesion force adjustment structure, the adhesion layer and the adhesion protection layer have a second adhesion force, and the first adhesion force is less than the second adhesion force; tearing off the adhesion protection layer. By adopting the above technical solution, an adhesion force adjustment structure is arranged at a position corresponding to the cutting boundary, so that the acting force on the cutting boundary can be reduced during the process of tearing off the adhesion protection layer, and the film layer warping at the cutting boundary can be avoided.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technologies, and particularly to a display module and a method for manufacturing the same. Background Art

[0002] A display module is one of the important components constituting a display screen and is currently widely used in the field of electronic display technologies.

[0003] The display module includes a display panel structure. The protective film in the display panel is directly attached to a special adhesive (Optically Clear Adhesive, OCA) for bonding transparent optical elements (such as lenses, etc.). Therefore, during the process of manufacturing the display module, when tearing off the protective film, due to the large adhesion force between the protective film and the OCA, a relatively large acting force is generated at the cutting boundary position between the display area and the device setting area, and then the film layer in the display area adjacent to the cutting boundary position will be peeled off, affecting the display effect. Summary of the Invention

[0004] Embodiments of the present invention provide a display module and a method for manufacturing the same, so as to reduce the acting force on the cutting boundary during the process of tearing off the adhesion protective layer and avoid film layer warping at the cutting boundary.

[0005] In a first aspect, embodiments of the present invention provide a method for manufacturing a display module, including:

[0006] Preparing a display panel, where the display panel includes a display area and a device setting area, and there is a cutting boundary between the display area and the device setting area;

[0007] Preparing an adhesion assembly on the light-emitting side of the display panel, where the adhesion assembly includes an adhesion layer, an adhesion protective layer, and an adhesion force adjustment structure; along the thickness direction of the display module, the adhesion force adjustment structure overlaps with the cutting boundary; in the setting area of the adhesion force adjustment structure, the adhesion layer and the adhesion protective layer have a first adhesion force; in the non-setting area of the adhesion force adjustment structure, the adhesion layer and the adhesion protective layer have a second adhesion force, and the first adhesion force is less than the second adhesion force;

[0008] Tearing off the adhesion protective layer.

[0009] In a second aspect, embodiments of the present invention further provide a display module manufactured by using the manufacturing method according to any item in the first aspect;

[0010] The display module includes a display panel and an adhesion layer located on the light-emitting side of the display panel;

[0011] The display panel includes a display area and a device setting area. There is a cutting boundary between the display area and the device setting area, and the film layers in the display area and the film layers in the device setting area are not integrally arranged;

[0012] A groove is provided on one side surface of the adhesion layer away from the display panel. Along the thickness direction of the display module, the groove overlaps with the cutting boundary.

[0013] In the manufacturing method of the display module provided by the embodiment of the present invention, an adhesion assembly is prepared on the light-emitting side of the display panel. Among them, the adhesion assembly includes an adhesion layer, an adhesion protection layer, and an adhesion force adjustment structure. Along the thickness direction of the display module, the adhesion force adjustment structure overlaps with the cutting boundary. That is, during the process of attaching the adhesion layer and the adhesion protection layer, by setting the adhesion force adjustment structure at the cutting boundary position, it is possible to make the adhesion force in the area where the adhesion force adjustment structure is set different from that in the non-setting area. Further, in the area where the adhesion force adjustment structure is set, the adhesion layer and the adhesion protection layer have a first adhesion force; in the non-setting area of the adhesion force adjustment structure, the adhesion layer and the adhesion protection layer have a second adhesion force, and the first adhesion force is less than the second adhesion force. In this way, during the process of tearing off the adhesion protection layer, the pulling force between the adhesion protection layer and the adhesion layer can be reduced at the position corresponding to the cutting boundary, avoiding the problem that the film layer at the cutting boundary position is peeled off and warped due to a large pulling force, and ensuring the structural stability of the display module. Description of the Drawings

[0014] Figure 1 It is a flowchart of a manufacturing method of a display module provided by an embodiment of the present invention;

[0015] Figure 2 It is a planar schematic diagram of a display module provided by an embodiment of the present invention;

[0016] Figure 3 For Figure 2 It is a cross-sectional structural schematic diagram of a display module provided along the section line A-A';

[0017] Figure 4 It is a flowchart of another manufacturing method of a display module provided by an embodiment of the present invention;

[0018] Figure 5 For Figure 2 It is another cross-sectional structural schematic diagram of a display module provided along the section line A-A';

[0019] Figure 6 It is a flowchart of yet another manufacturing method of a display module provided by an embodiment of the present invention;

[0020] Figure 7 It is a flowchart of yet another manufacturing method of a display module provided by an embodiment of the present invention;

[0021] Figure 8 Another schematic cross-sectional structure diagram of a display module along the section line A-A' provided for Figure 2 is shown in FIG.

[0022] Figure 9 The flowchart of another preparation method of the display module provided by the embodiment of the present invention is shown in FIG.

[0023] Figure 10 Another schematic cross-sectional structure diagram of a display module along the section line A-A' provided for Figure 2 is shown in FIG.

[0024] Figure 11 The flowchart of another preparation method of the display module provided by the embodiment of the present invention is shown in FIG.

[0025] Figure 12 A partial schematic diagram of a display module provided by the embodiment of the present invention is shown in FIG.

[0026] Figure 13 Another schematic cross-sectional structure diagram of a display module along the section line A-A' provided for Figure 2 is shown in FIG.

[0027] Figure 14 The flowchart of another preparation method of the display module provided by the embodiment of the present invention is shown in FIG.

[0028] Figure 15 The flowchart of another preparation method of the display module provided by the embodiment of the present invention is shown in FIG.

[0029] Figure 16 A partial schematic diagram of another display module provided by the embodiment of the present invention is shown in FIG.

[0030] Figure 17 The schematic diagram of the structure of a display module provided by the embodiment of the present invention is shown in FIG. Detailed implementation manners

[0031] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only for explaining the present invention, rather than limiting the present invention. In addition, it should be noted that, for the sake of convenience of description, only parts related to the present invention are shown in the drawings, rather than all the structures.

[0032] Figure 1 The flowchart of a preparation method of a display module provided by the embodiment of the present invention is shown in FIG. As Figure 1 shown, the preparation method of the display module includes:

[0033] S101 , preparing a display panel, wherein the display panel comprises a display area and a device setting area, and a cutting boundary exists between the display area and the device setting area.

[0034] Specifically, Figure 2 A schematic plan view of a display module provided by an embodiment of the present invention, Figure 3 for Figure 2 A schematic diagram of a cross-sectional structure of a display module along a cross-sectional line AA' is provided, as shown in FIG. Figure 2 and Figure 3 As shown, the display panel includes a display area 10 and a device setting area 20. Among them, the display area 10 may include a plurality of sub-pixels arranged in an array (not shown in the figure), and the sub-pixels may include light-emitting elements and pixel circuits connected to each other, and the pixel circuit is used to provide a display signal to the light-emitting element to realize the display function of the display panel. Further, the light-emitting element may be an organic light-emitting diode (OLED), Mini LED, Micro LED or quantum dot light-emitting diode (QLED), etc., and the specific type of the light-emitting element is not limited in the embodiment of the present invention. The pixel circuit may be a 2T1C circuit, a 7T1C circuit or a 7T2C circuit, etc. "2T1C circuit" means that the pixel circuit is a pixel circuit including two thin film transistors (T) and one capacitor (C), and other "7T1C circuits", "7T2C circuits", etc. are similar, and the specific type of the pixel circuit in the embodiment of the present invention is not limited.

[0035] Optionally, the device setting area 20 can be understood as the setting area of electronic components, and the electronic components can be, for example, cameras or distance sensors, etc., which are used to realize additional functions of the display panel in addition to the display function, such as imaging function or realizing the screen-off function according to the distance detection result. Furthermore, the device setting area 20 is used to place electronic components, so during the preparation process of the display panel, it is necessary to remove the film layer in the device setting area 20 in order to reserve the setting space of the electronic components in this area, so there is a cutting boundary 30 between the display area 10 and the device setting area 20.

[0036] S102, preparing an adhesive component on the light-emitting side of the display panel.

[0037] Specifically, the adhesion component includes an adhesion layer, an adhesion protective layer and an adhesion force adjustment structure; along the thickness direction of the display module, the adhesion force adjustment structure overlaps with the cutting boundary; in the setting area of the adhesion force adjustment structure, the adhesion layer and the adhesion protective layer have a first adhesion force; in the non-setting area of the adhesion force adjustment structure, the adhesion layer and the adhesion protective layer have a second adhesion force, and the first adhesion force is less than the second adhesion force.

[0038] Specifically, the adhesion component 40 may include an adhesion layer 41, an adhesion protection layer 42, and an adhesion force adjustment structure 43. The adhesion layer 41 can achieve double-sided bonding between the adhesion protection layer 42 and the display panel, and the adhesion protection layer 42 is used to protect the adhesion layer 41 before covering the outermost protective cover plate (such as cover glass), to prevent the surface of the adhesion layer 41 from being contaminated due to long-term exposure and reduce the adhesion force.

[0039] Furthermore, along the thickness direction of the display module (such as the X direction shown in Figure 3 ), the adhesion force adjustment structure 43 overlaps with the cutting boundary 30, or rather, along the thickness direction X of the display module, the adhesion force adjustment structure 43 covers the cutting boundary 30. By adjusting the adhesion force adjustment structure 43, the adhesion force between the adhesion layer 41 and the adhesion protection layer 42 in the area where the cutting boundary 30 is set is smaller. In this way, when removing the adhesion protection layer 42, the pulling force between the adhesion protection layer 42 and the adhesion layer 40 can be reduced, avoiding the problem that the film layer at the cutting boundary position is peeled and warped due to a large pulling force, and ensuring the structural stability of the display module. Specifically, in the area where the adhesion force adjustment structure 43 is set, the first adhesion force between the adhesion layer 41 and the adhesion protection layer 42 is present, and in the non-set area of the adhesion force adjustment structure 43, the second adhesion force between the adhesion layer 41 and the adhesion protection layer 42 is present, and the first adhesion force is less than the second adhesion force. Such a setting can reduce the pulling force between the adhesion protection layer 42 and the adhesion layer 40 when tearing off the adhesion protection layer 42, further reducing the pulling force between the adhesion layer 40 and the film layer below it, avoiding the problem that the film layer at the cutting boundary 30 is peeled and warped due to a large pulling force, and ensuring the structural stability of the display module.

[0040] As Figure 3 shown, taking the display panel including an OLED display panel as an example, in order to prevent the OLED from being eroded by water and oxygen, a thin film encapsulation structure can be set on the light-emitting side of the OLED. The thin film encapsulation structure can, for example, include a multi-layer stacked structure of an inorganic layer - an organic layer - an inorganic layer, such as the inorganic layer 60, the organic layer 70, and the inorganic layer 80 in Figure 3 . And in order to reduce the film layer step difference between the display area 10 and the device setting area 20, an organic material can be set below the adhesion layer 40 for filling and planarization, such as Figure 3The organic layer 50 in it. Thus, before removing the adhesion protection layer 42, the display area 10 of the display panel may include the adhesion protection layer 42, the adhesion layer 40, the organic layer 50, the inorganic layer 60, the organic layer 70, the inorganic layer 80, and the display function layer 90 below it, etc. Since the materials between adjacent two layers are different, when subjected to a pulling force, the problem of peeling and warping is likely to occur between different film layers. Therefore, in the embodiments of the present invention, the adhesion force between the adhesion layer 41 and the adhesion protection layer 42 in the cutting boundary 30 setting area is adjusted to be smaller through the adhesion force adjustment structure 43. Thus, when removing the adhesion protection layer 42, the pulling force between the adhesion protection layer 42 and the adhesion layer 40 can be reduced, further reducing the pulling force between the adhesion layer 40 and the organic layer 50 below it, and even further reducing the pulling force between the organic layer 50 and the inorganic layer 60 below it, etc., ensuring the structural stability of the display module at the cutting boundary 30 position, further preventing the problem of film layer peeling and warping from extending to the display area 10, ensuring the structural stability of the display area 10, and ensuring the display effect of the display panel.

[0041] S103, tear off the adhesion protection layer.

[0042] Specifically, after other structures of the display module are prepared, in the last process of the display module, the adhesion protection layer 42 needs to be torn off to facilitate covering a protection cover plate on the adhesion layer 41, playing a role in protecting the entire display panel.

[0043] The preparation method of the display module provided by the embodiments of the present invention includes preparing an adhesion assembly on the light-emitting side of the display panel. Among them, the adhesion assembly includes an adhesion layer, an adhesion protection layer, and an adhesion force adjustment structure. Along the thickness direction of the display module, the adhesion force adjustment structure overlaps with the cutting boundary. That is, during the process of the adhesion layer and the adhesion protection layer being attached, the adhesion force adjustment structure is set at the cutting boundary position, and the adhesion force of the area where the adhesion force adjustment structure is set can be made different from that of the non-set area. Further, in the area where the adhesion force adjustment structure is set, the adhesion layer and the adhesion protection layer have a first adhesion force; in the non-set area of the adhesion force adjustment structure, the adhesion layer and the adhesion protection layer have a second adhesion force, and the first adhesion force is less than the second adhesion force. Thus, during the process of tearing off the adhesion protection layer, the pulling force between the adhesion protection layer and the adhesion layer can be reduced at the position corresponding to the cutting boundary, avoiding the problem of film layer peeling and warping caused by a large pulling force at the cutting boundary position, and ensuring the structural stability of the display module.

[0044] Optionally, Figure 4 is a flowchart of another preparation method of the display module provided by the embodiments of the present invention. As Figure 4 shown, the preparation method specifically describes how to prepare the adhesion assembly on the light-emitting side of the display panel. As Figure 4 shown, the preparation method of the display module includes:

[0045] S201. Prepare a display panel, where the display panel includes a display area and a device setting area, and there is a cutting boundary between the display area and the device setting area.

[0046] S202. Prepare an adhesion layer and an adhesion protection layer.

[0047] Specifically, the adhesion layer and the adhesion protection layer can be prepared independently, and then the adhesion layer is bonded to the light-emitting side of the display panel. Alternatively, the adhesion layer can also be directly prepared on the light-emitting side of the display panel, and the adhesion protection layer is prepared independently. The embodiments of the present invention do not limit the preparation process of the adhesion layer and the adhesion protection layer.

[0048] S203. Prepare a groove on the adhesion surface between the adhesion layer and the adhesion protection layer, and the adhesion force adjustment structure includes the groove.

[0049] Specifically, Figure 5 For Figure 2 Another schematic cross-sectional structure of the display module along the section line A-A' is provided. As Figure 5 shown, the adhesion force adjustment structure 43 includes a groove 431, and the position of the groove 431 can be set on the surface of the adhesion layer 41 away from the display panel and the surface of the adhesion protection layer 42 close to the display panel. That is to say, the groove 431 can be set on the upper surface of the adhesion layer 41 and the lower surface of the adhesion protection layer 42. It should be noted that, Figure 5 only taking the groove 431 being set on the upper surface of the adhesion layer 41 and the lower surface of the adhesion protection layer 42 as an example for illustration, it can be understood that the groove can also be only set on the upper surface of the adhesion layer 41, as Figure 3 shown, or only set on the lower surface of the adhesion protection layer 42. By preparing the groove 431 on the adhesion surface between the adhesion layer 41 and the adhesion protection layer 42, the first adhesion force in the area where the adhesion force adjustment structure 43 is set can be made smaller than the second adhesion force in the non-set area. In this way, during the process of tearing off the adhesion protection layer 42, the pulling force between the adhesion protection layer 42 and the adhesion layer 41 can be further reduced at the position corresponding to the cutting boundary 30, avoiding the problem of film layer peeling and warping due to the large pulling force at the cutting boundary 30 position, and ensuring the structural stability of the display module.

[0050] S204. Tear off the adhesion protection layer.

[0051] The manufacturing method of the display module provided by the embodiment of the present invention can make the first adhesion force in the area where the adhesion force adjustment structure is set less than the second adhesion force in the non-set area by preparing a groove on the adhesion surface between the adhesion layer and the adhesion protection layer. In this way, during the process of tearing off the adhesion protection layer, the pulling force between the adhesion protection layer and the adhesion layer can be reduced at the position corresponding to the cutting boundary, avoiding the problem that the film layer at the cutting boundary position is peeled and warped due to the large pulling force, and ensuring the structural stability of the display module.

[0052] Optionally, Figure 6 is a flowchart of another manufacturing method of the display module provided by the embodiment of the present invention. As Figure 6 shown, the manufacturing method specifically describes how to prepare a groove on the adhesion surface between the adhesion layer and the adhesion protection layer. As Figure 6 shown, the manufacturing method of the display module includes:

[0053] S301. Prepare a display panel, the display panel includes a display area and a device setting area, and there is a cutting boundary between the display area and the device setting area.

[0054] S302. Prepare an adhesion layer and an adhesion protection layer.

[0055] S303. Prepare a groove on the surface of the adhesion layer away from the display panel.

[0056] Specifically, continue to refer to Figure 3 , a groove 431 is prepared on the surface of the adhesion layer 41 away from the display panel, that is, a groove 431 is prepared on the upper surface of the adhesion layer 41. Along the thickness direction X of the display module, the groove 431 overlaps with the cutting boundary 30. That is to say, by preparing a groove 431 on the surface of the adhesion layer 41 away from the display panel, the adhesion force between the adhesion layer 41 and the adhesion protection layer 42 in the cutting boundary 30 setting area can be made smaller, which is convenient for tearing off the adhesion protection layer 42.

[0057] Furthermore, the depth of the groove 431 is less than the thickness of the adhesion layer 41. Such a setting can ensure that the protection cover plate is completely attached to the adhesion layer 41 when the protection cover plate is covered on the adhesion layer 41 after tearing off the adhesion protection layer 42 later.

[0058] S304. Attach an adhesion protection layer to the side of the adhesion layer away from the display panel.

[0059] Specifically, continue to refer to Figure 3 , an adhesion protection layer 42 is attached to the side of the adhesion layer 41 away from the display panel. The adhesion protection layer 42 is used to protect the adhesion layer 41 before covering the outermost protection cover plate, avoiding surface contamination of the adhesion layer 41 due to long-term exposure and reducing the adhesion force.

[0060] S305. Tear off the adhesive protective layer.

[0061] An embodiment of the present invention provides a method for manufacturing a display module. By preparing a groove on the surface of the adhesive layer away from the display panel, the adhesion force between the adhesive layer and the adhesive protective layer can be reduced at the cutting boundary. In this way, during the process of tearing off the adhesive protective layer, the pulling force between the adhesive protective layer and the adhesive layer can be reduced at the position corresponding to the cutting boundary, avoiding the problem that the film layer at the cutting boundary position peels and warps due to a large pulling force, and ensuring the structural stability of the display module.

[0062] Optionally, Figure 7 is a flowchart of another method for manufacturing a display module provided by an embodiment of the present invention. As Figure 7 shown, the preparation method specifically describes how to prepare a groove on the adhesion surface between the adhesive layer and the adhesive protective layer. As Figure 7 shown, the method for manufacturing a display module includes:

[0063] S401. Prepare a display panel, the display panel includes a display area and a device setting area, and there is a cutting boundary between the display area and the device setting area.

[0064] S402. Prepare an adhesive layer and an adhesive protective layer.

[0065] S403. Prepare a groove on one surface of the adhesive protective layer.

[0066] Specifically, Figure 8 is Figure 2 another schematic cross-sectional structure diagram of a display module along the section line A-A'. As Figure 8 shown, a groove 431 is prepared on one surface of the adhesive protective layer 42, that is, the preparation position of the groove 431 can be the lower surface of the adhesive protective layer 42. Along the thickness direction X of the display module, the groove 431 overlaps with the cutting boundary 30. That is to say, the cutting boundary 30 is the setting area of the groove 431, and the adhesive protective layer 42 and the adhesive layer 41 cannot be bonded. The adhesive protective layer 42 and the adhesive layer 41 can be bonded in the non-setting area of the groove 431. In this way, during the process of tearing off the adhesive protective layer 42, the pulling force between the adhesive protective layer 42 and the adhesive layer 41 can be reduced at the position corresponding to the cutting boundary 30, avoiding the problem that the film layer at the cutting boundary 30 position peels and warps due to a large pulling force, and ensuring the structural stability of the display module.

[0067] Furthermore, the depth of the groove 431 is less than the thickness of the adhesive protective layer 42. Such a setting can prevent the adhesive protective layer 42 from exposing the adhesive layer 41 through the groove 431, and further prevent the adhesive layer 41 from being contaminated during the manufacturing process of the display module.

[0068] S404. Attach the adhesion protection layer to the side of the adhesion layer away from the display panel with the groove facing the adhesion layer.

[0069] Specifically, continue to refer to Figure 8 , attach the adhesion protection layer 42 to the side of the adhesion layer 41 away from the display panel with the groove 431 facing the adhesion layer 41, which can protect the adhesion layer 41.

[0070] S405. Tear off the adhesion protection layer.

[0071] The embodiment of the present invention provides a method for manufacturing a display module. By preparing a groove on one surface of the adhesion protection layer and attaching the adhesion protection layer to the side of the adhesion layer away from the display panel with the groove facing the adhesion layer, the adhesion force between the adhesion layer and the adhesion protection layer can be reduced at the cutting boundary. In this way, during the process of tearing off the adhesion protection layer, the pulling force between the adhesion protection layer and the adhesion layer can be reduced at the position corresponding to the cutting boundary, avoiding the problem of film layer peeling and warping caused by a large pulling force at the cutting boundary position and ensuring the structural stability of the display module.

[0072] Optionally, Figure 9 is a flowchart of another method for manufacturing a display module provided by the embodiment of the present invention. As Figure 9 shown, the method for manufacturing the display module specifically describes how to prepare the adhesion component on the light-emitting side of the display panel. As Figure 9 shown, the method for manufacturing the display module includes:

[0073] S501. Prepare a display panel, where the display panel includes a display area and a device setting area, and there is a cutting boundary between the display area and the device setting area.

[0074] S502. Prepare an adhesion layer and an adhesion protection layer.

[0075] S503. Prepare a release layer on the side of the adhesion layer away from the display panel, and / or prepare a release layer on one surface of the adhesion protection layer.

[0076] Specifically, Figure 10 is Figure 2 another schematic cross-sectional structure diagram of the display module along the section line A-A', as Figure 10As shown, a release layer 432 is prepared on the side of the adhesion layer 41 away from the display panel. The release layer 432 can be prepared by coating a release agent at the overlapping position of the upper surface of the adhesion layer 41 and the cutting boundary 30. By preparing the release layer 432, the adhesion between the adhesion layer 41 and the adhesion protection layer 42 in the area where the release layer 432 is provided can be reduced. In this way, the first adhesion force between the adhesion layer 41 and the adhesion protection layer 42 in the area where the release layer 432 is provided can be made smaller than the second adhesion force between the adhesion layer 41 and the adhesion protection layer 42 in the area where the release layer 432 is not provided. Such a setting can reduce the pulling force on the cutting boundary 30 when the adhesion protection layer 42 is torn off, and thus can avoid warping of the display area 10 adjacent to the cutting boundary 30, ensuring the normal display of the display module.

[0077] It should be noted that Figure 10 Only the technical solution of preparing the release layer 432 on the side of the adhesion layer 41 away from the display panel is shown. It can be understood that preparing the release layer 432 on one side surface of the adhesion protection layer 42, that is, preparing the release layer 432 on the lower surface of the adhesion protection layer 42, and preparing the release layer 432 on the side of the adhesion layer 41 away from the display panel and preparing the release layer 432 on one side surface of the adhesion protection layer 42 can both reduce the adhesion between the adhesion layer 41 and the adhesion protection layer 42 in the area where the release layer 432 is provided.

[0078] S504. Adhere the adhesion layer and the adhesion protection layer through the release layer. The adhesion force adjustment structure includes the release layer.

[0079] Specifically, by adhering the adhesion layer and the adhesion protection layer through the release layer, the adhesion force between the adhesion layer and the adhesion protection layer corresponding to the area where the release layer is provided is reduced.

[0080] S505. Tear off the adhesion protection layer.

[0081] It should be noted that during the process of tearing off the adhesion protection layer, the release layer is torn off together.

[0082] The embodiment of the present invention provides a method for manufacturing a display module. By preparing a release layer on the side of the adhesion layer away from the display panel, and / or, preparing a release layer on one side surface of the adhesion protection layer, the adhesion force between the adhesion layer and the adhesion protection layer can be reduced at the cutting boundary. In this way, during the process of tearing off the adhesion protection layer, the pulling force between the adhesion protection layer and the adhesion layer can be reduced at the position corresponding to the cutting boundary, avoiding the problem of film layer peeling and warping caused by a large pulling force at the cutting boundary position, and ensuring the structural stability of the display module.

[0083] Optionally, Figure 11 is a flowchart of another method for manufacturing a display module provided by the embodiment of the present invention. As Figure 11The preparation method shown in FIG. 1 specifically describes how to prepare the adhesive component on the light-emitting side of the display panel. Figure 11 As shown, the method for preparing the display module includes:

[0084] S601 , preparing a display panel, wherein the display panel comprises a display area and a device setting area, and a cutting boundary exists between the display area and the device setting area.

[0085] S602 , preparing an adhesive component on the light-emitting side of the display panel.

[0086] Specifically, the adhesive component includes a first component area and a second component area, and the enclosed outline of the first component area and the second component area covers the cutting boundary; the first component area is located on the side close to the starting position for tearing off the adhesive protective layer, and the second component area is located on the side away from the starting position for tearing off the adhesive protective layer.

[0087] Specifically, Figure 12 A partial schematic diagram of a display module provided by an embodiment of the present invention, Figure 13 for Figure 2 A schematic diagram of a cross-sectional structure of another display module along the section line AA' is provided. Figure 12 and Figure 13 As shown, the adhesive component 40 may include a first component area 44 and a second component area 45. The first component area 44 is located on a side close to the start position of tearing off the adhesive protective layer 42, and the second component area 45 is located on a side away from the start position of tearing off the adhesive protective layer 42. Figure 13 , from the direction of the first component area 44 to the second component area 45, that is, from the direction indicated by D in the figure, when the adhesive protective layer 42 is torn off, since the right side of the first component area 44 is the device setting area 20, even if there is film peeling, it is the film layer of the device setting area 20 that is peeled off, and even if the film layer at the cutting boundary position causes the film layer of the device setting area 20 to peel off and warp due to the large pulling force, it has no effect on the film layer of the display area 10 on the right side of the first component area 44, and will not affect the stability of the display area 10. However, the right side of the second component area 45 is the display area 10, and if there is film peeling, it is the film layer in the display area 10 that is peeled off, that is, the film layer at the cutting boundary position will cause the film layer of the display area 10 to peel off and warp due to the large pulling force, thereby affecting the stability of the display area 10. Therefore, by preparing the adhesion adjustment structure 43 at least in the second component area 45, on the one hand, it can be ensured that when the adhesive protection layer 42 is torn off in the direction from the first component area 44 to the second component area 45, the film layer at the cutting boundary position is prevented from peeling and warping due to a large pulling force, thereby ensuring the structural stability of the display module. On the other hand, the process flow can be simplified and the preparation efficiency can be improved.

[0088] It should be noted that the referenceFigure 12 The film sizes of the adhesive layer 41 and the adhesive protective layer 42 should be consistent, but in order to facilitate the distinction between the adhesive layer 41 and the adhesive protective layer 42, the film size of the adhesive layer 41 is exemplarily made smaller than the film size of the adhesive protective layer 42.

[0089] S603, preparing an adhesion layer and an adhesion protection layer.

[0090] S604, preparing an adhesion adjustment structure at least in the second component region.

[0091] S605, tear off the adhesive protective layer.

[0092] The embodiment of the present invention provides a method for preparing a display module, by covering the cutting boundary with the enclosed contour of the first component area and the second component area, and preparing an adhesion adjustment structure at least in the second component area, which can ensure that when the adhesive protective layer is torn off in the direction from the first component area to the second component area, the film layer at the cutting boundary position is prevented from peeling and warping due to a large pulling force, thereby ensuring the structural stability of the display module. On the other hand, the process flow can be simplified and the preparation efficiency can be improved.

[0093] Optional, Figure 14 A flowchart of another method for preparing a display module provided by an embodiment of the present invention. Figure 14 The preparation method shown in FIG. 1 specifically describes how to prepare the adhesive component on the light-emitting side of the display panel. Figure 14 As shown, the method for preparing the display module includes:

[0094] S701 , preparing a display panel, wherein the display panel comprises a display area and a device setting area, and a cutting boundary exists between the display area and the device setting area.

[0095] S702, preparing an adhesion layer and an adhesion protection layer.

[0096] S703, preparing a ring-shaped continuous adhesion adjustment structure, wherein the ring-shaped continuous adhesion adjustment structure covers the cutting boundary.

[0097] For details, please refer to Figure 12 The annular continuous adhesion adjustment structure 43 can be an annular groove or an annular release layer. Further, the annular continuous adhesion adjustment structure 43 covers the cutting boundary 30, which can reduce the adhesion between the adhesion layer 41 and the adhesion protection layer 42 at the cutting boundary 30 in a large area, making it easier to tear off the adhesion protection layer 42.

[0098] S704, tear off the adhesive protective layer.

[0099] An embodiment of the present invention provides a method for preparing a display module. By preparing an annular continuous adhesion adjustment structure, the annular continuous adhesion adjustment structure covers the cutting boundary, which can greatly reduce the adhesion between the adhesion layer and the adhesion protective layer at the cutting boundary, thereby facilitating the subsequent tearing off of the adhesion protective layer to avoid warping of the display area, thereby ensuring normal display of the display area.

[0100] Optional, Figure 15 A flowchart of another method for preparing a display module provided by an embodiment of the present invention. Figure 15 The preparation method shown in FIG. 1 specifically describes how to prepare the adhesive component on the light-emitting side of the display panel. Figure 15 As shown, the method for preparing the display module includes:

[0101] S801 , preparing a display panel, wherein the display panel comprises a display area and a device setting area, and a cutting boundary exists between the display area and the device setting area.

[0102] S802, preparing an adhesion layer and an adhesion protection layer.

[0103] S803, preparing a plurality of independently arranged adhesion adjustment sections, wherein the enclosed contours of the plurality of adhesion adjustment sections cover the cutting boundary.

[0104] Specifically, Figure 16 A partial schematic diagram of another display module provided by an embodiment of the present invention. Figure 16 As shown, a plurality of independently arranged adhesion adjustment sections can be prepared on the upper surface of the adhesion layer 41, and the enclosed contour of the plurality of adhesion adjustment sections covers the cutting boundary 30. Such a setting can diversify the preparation process of the adhesion adjustment structure 43 on the one hand, and on the other hand, the adhesion between the adhesion layer 41 and the adhesion protection layer 42 can be reduced in the adhesion adjustment structure setting area, while also avoiding the problem of bubbles appearing when covering the adhesion layer 41 with a protective cover after the adhesion protection layer 42 is torn off due to too low adhesion.

[0105] S804, tear off the adhesive protective layer.

[0106] A method for preparing a display module provided by an embodiment of the present invention prepares a plurality of independently arranged adhesion adjustment sections, and the enclosed contours of the plurality of adhesion adjustment sections cover the cutting boundary. This can diversify the preparation process of the adhesion adjustment structure on the one hand, and on the other hand, can reduce the adhesion between the adhesion layer and the adhesion protective layer in the area where the adhesion adjustment structure is set, while also avoiding the problem of bubbles appearing when covering the adhesion layer with a protective cover after the adhesion protective layer is torn off due to too low adhesion.

[0107] Based on the same inventive concept, an embodiment of the present invention further provides a display module, which can be prepared by a method for preparing a display module. Specifically, Figure 17 is a schematic structural diagram of a display module provided by an embodiment of the present invention. As Figure 17 shown, the display module includes a display panel and an adhesion layer 41 located on the light-emitting side of the display panel; the display panel includes a display area 10 and a device setting area 20, there is a cutting boundary 30 between the display area 10 and the device setting area 20, and the film layer in the display area 10 and the film layer in the device setting area 20 are not integrally arranged; a groove 431 is provided on the surface of the adhesion layer 41 away from the display panel, and along the thickness direction X of the display module, the groove 431 overlaps with the cutting boundary 30. Further, a protective cover plate 11 is covered on the surface of the adhesion layer 41 away from the display panel, which can play a role in protecting the entire display panel.

[0108] For the display module provided by the embodiment of the present invention, by providing an adhesion layer on the light-emitting side of the display panel, and a groove is provided on the surface of the adhesion layer away from the display panel, and along the thickness direction of the display module, the groove overlaps with the cutting boundary, it is possible to achieve different adhesion forces between the groove setting area and the non-setting area. Further, the adhesion force between the adhesion layer and the adhesion protection layer in the groove setting area is less than the adhesion force between the adhesion layer and the adhesion protection layer in the non-groove setting area. In this way, during the process of tearing off the adhesion protection layer, the pulling force between the adhesion protection layer and the adhesion layer is reduced, and further the pulling force between the adhesion layer and the film layer below it is reduced, avoiding the problem of film layer peeling and warping at the cutting boundary position due to a large pulling force, and ensuring the structural stability of the display module.

[0109] Note that the above is only the preferred embodiment of the present invention and the applied technical principle. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments, mutual combinations and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments only. Without departing from the inventive concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method for preparing a display module, characterized in that, Comprising: Preparing a display panel, the display panel including a display area and a device setting area, there being a cutting boundary between the display area and the device setting area; Preparing an adhesion assembly on the light-emitting side of the display panel, the adhesion assembly including an adhesion layer, an adhesion protection layer, and an adhesion force adjustment structure; along the thickness direction of the display module, the adhesion force adjustment structure overlaps with the cutting boundary; in the area where the adhesion force adjustment structure is provided, the adhesion layer and the adhesion protection layer have a first adhesion force; in the area where the adhesion force adjustment structure is not provided, the adhesion layer and the adhesion protection layer have a second adhesion force, and the first adhesion force is less than the second adhesion force; Removing the adhesion protection layer; Wherein, the adhesion assembly includes a first assembly area and a second assembly area, and the surrounding contour of the first assembly area and the second assembly area covers the cutting boundary; the first assembly area is located on the side close to the starting position of removing the adhesion protection layer, and the second assembly area is located on the side far from the starting position of removing the adhesion protection layer; Preparing an adhesion assembly on the light-emitting side of the display panel, including: Preparing an adhesion layer and an adhesion protection layer; Preparing an adhesion force adjustment structure at least in the second assembly area.

2. The preparation method according to claim 1, characterized in that, Preparing an adhesion assembly on the light-emitting side of the display panel, including: Preparing an adhesion layer and an adhesion protection layer; Preparing a groove on the adhesion surface between the adhesion layer and the adhesion protection layer, and the adhesion force adjustment structure includes the groove.

3. The preparation method according to claim 2, characterized in that, Preparing a groove on the adhesion surface between the adhesion layer and the adhesion protection layer, including: Preparing a groove on the surface of the adhesion layer away from the display panel; Attaching the adhesion protection layer to the side of the adhesion layer away from the display panel.

4. The preparation method according to claim 2, wherein, Preparing a groove on the adhesion surface between the adhesion layer and the adhesion protection layer, including: Preparing a groove on one surface of the adhesion protection layer; Attaching the adhesion protection layer to the side of the adhesion layer away from the display panel with the groove facing the adhesion layer.

5. The preparation method according to claim 2, characterized in that, The groove is provided on the surface of the adhesion layer away from the display panel, and the depth of the groove is less than the thickness of the adhesion layer; And / or, the groove is provided on the surface of the adhesion protection layer close to the display panel, and the depth of the groove is less than the thickness of the adhesion protection layer.

6. The preparation method according to claim 1, characterized in that, Preparing an adhesion assembly on the light-emitting side of the display panel, including: Preparing an adhesion layer and an adhesion protection layer; Preparing a release layer on the side of the adhesion layer away from the display panel, and / or preparing a release layer on one surface of the adhesion protection layer; Adhering the adhesion layer and the adhesion protection layer through the release layer, and the adhesion force adjustment structure includes the release layer.

7. The preparation method according to claim 1, characterized in that, Preparing an adhesion assembly on the light-emitting side of the display panel, including: Preparing an adhesion layer and an adhesion protection layer; Preparing an annular continuous adhesion force adjustment structure that covers the cutting boundary.

8. The preparation method according to claim 1, wherein Preparing an adhesion assembly on the light-emitting side of the display panel, including: Preparing an adhesion layer and an adhesion protection layer; Preparing a plurality of independently provided adhesion force adjustment sub-parts, and the surrounding contour of the plurality of adhesion force adjustment sub-parts covers the cutting boundary.

9. A display module, characterized in that, Prepared by the preparation method according to any one of claims 1 to 8; The display module includes a display panel and an adhesive layer located on the light emitting side of the display panel; The display panel comprises a display area and a device setting area, a cutting boundary exists between the display area and the device setting area, and the film layer located in the display area and the film layer located in the device setting area are not arranged in an integrated manner; A groove is provided on a surface of the adhesive layer on one side away from the display panel, and along the thickness direction of the display module, the groove overlaps with the cutting boundary; Wherein, the adhesive layer includes a first component area and a second component area, and the enclosed outline of the first component area and the second component area covers the cutting boundary; the first component area is located on a side close to the tearing starting position, and the second component area is located on a side away from the tearing starting position; the groove is at least located in the second component area.

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