Heat dissipating back brace and heat dissipating device

Abstract

The application discloses a heat dissipation back clamp, and relates to the technical field of heat dissipation. The heat dissipation back clamp comprises a heat-conducting bottom plate, a cover shell, an atomizer and a heat dissipation piece. The heat-conducting bottom plate is used for contacting with an electronic device. The cover shell is arranged on the heat-conducting bottom plate and forms a containing cavity with the heat-conducting bottom plate. The cover shell is provided with a ventilation opening. The atomizer is arranged on the cover shell. A nozzle of the atomizer is communicated with the containing cavity. The heat dissipation piece is arranged in the containing cavity. The heat dissipation piece is arranged opposite to the ventilation opening. The heat dissipation piece is located between the heat-conducting bottom plate and the nozzle. The atomizer sprays the atomized mist on the surface of the heat dissipation piece. A heat-conducting channel is formed between the heat dissipation piece and the heat-conducting bottom plate.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation back clamp and a heat dissipation device. BACKGROUND

[0002] With the rapid development of the integrated circuit and semiconductor industry, the chip of an electronic device is advancing towards high integration and high power consumption, and the heat dissipation of the electronic device has become an important problem that people are concerned about. The most direct and simple method at present is an external heat sink, among which a heat dissipation back clamp is the most common.

[0003] The heat dissipation mode of the heat dissipation back clamp on the market at present mainly includes air cooling and semiconductor refrigeration. The heat dissipation back clamp of the air cooling type has a slow heat end temperature reduction rate, thereby restricting the heat dissipation capacity of the cold end. The heat dissipation back clamp of the semiconductor refrigeration type is usually arranged on a wireless charging device. However, for the heat dissipation back clamp type wireless charging device with a charging power of about 25W, the cold surface temperature is about 40℃, and the hot surface temperature reaches 55-65℃. At this time, the cold surface basically has no heat dissipation effect, and the temperature of the ventilation opening of the hot surface is too high, which is poor in user experience. SUMMARY

[0004] The purpose of the embodiments of the application is to provide a heat dissipation back clamp and a heat dissipation device, which can solve the problem of poor heat dissipation effect of the heat dissipation back clamp at present.

[0005] In order to solve the above technical problems, the application is implemented as follows:

[0006] In a first aspect, the embodiments of the application provide a heat dissipation back clamp, comprising:

[0007] A heat-conducting bottom plate configured to contact an electronic device;

[0008] A cover arranged on the heat-conducting bottom plate and forming a containing cavity with the heat-conducting bottom plate, the cover being provided with a ventilation opening;

[0009] An atomizer arranged in the cover, a nozzle of the atomizer being in communication with the containing cavity;

[0010] A heat dissipation member arranged in the containing cavity, the heat dissipation member being arranged opposite to the ventilation opening, the heat dissipation member being located between the heat-conducting bottom plate and the nozzle, so that the spray emitted by the nozzle adheres to the surface of the heat dissipation member, and a heat-conducting channel is formed between the heat dissipation member and the heat-conducting bottom plate.

[0011] In a second aspect, the embodiments of the application further provide a heat dissipation device, comprising a base and the heat dissipation back clamp described above, the heat dissipation back clamp being arranged in a containing groove of the base.

[0012] In the embodiment of the present application, the atomizer is arranged on the cover, the nozzle of the atomizer is arranged opposite to the heat dissipation member arranged in the accommodating cavity, the spray sprayed by the nozzle is mixed with the cold air flowing through the vent to form saturated wet air with liquid drops, the saturated wet air is attached to the surface of the heat dissipation member, under the action of heat on the surface of the heat dissipation member, the liquid drops are phase changed and evaporated, thereby absorbing a large amount of latent heat, and further improving the heat dissipation efficiency. Therefore, the embodiment of the present application can solve the problem of poor heat dissipation effect of the current heat dissipation back clip. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 An exploded view of the heat dissipation back clip disclosed in the embodiment of the present application is shown in the figure.

[0014] Figure 2 A structure schematic view of the heat dissipation back clip disclosed in the embodiment of the present application is shown in the figure.

[0015] Figure 3 An exploded view of part of the structure of the heat dissipation back clip disclosed in the embodiment of the present application is shown in the figure.

[0016] Figure 4 A structure schematic view of the cover, the atomizer and the fan disclosed in the embodiment of the present application is shown in the figure.

[0017] Figure 5 A sectional view of the atomizer and the fan disclosed in the embodiment of the present application is shown in the figure.

[0018] Figure 6 A structure schematic view of part of the heat dissipation device disclosed in the embodiment of the present application is shown in the figure.

[0019] Figure 7 A sectional view of the structure shown in the figure. Figure 6 A sectional view of the structure shown in the figure.

[0020] Figure 8 A structure schematic view of the water delivery pipe and the connecting wire disclosed in the embodiment of the present application is shown in the figure.

[0021] Explanation of reference signs:

[0022] 100-heat dissipation back clip, 110-heat conductive bottom plate, 120-cover, 121-vent, 121a-first vent, 121b-second vent, 121b1-central vent, 121b2-edge vent, 130-atomizer, 131-nozzle, 132-housing, 132a-atomizing cavity, 132b-water inlet, 133-ultrasonic atomizing piece, 140-heat dissipation member, 141-base, 142-heat dissipation fin, 150-fan, 151-tub, 151a-flow guiding surface, 160-semiconductor refrigeration member, 170-first heat insulation member, 171-avoidance opening, 180-wireless charging coil, 191-first magnetic shielding piece, 192-second magnetic shielding piece, 193-circuit board;

[0023] 200 - base, 210 - containing groove, 211 - fixing buckle, 220 - water storage tank, 230 - winding groove, 240 - power line, 250 - water inlet, 260 - control button;

[0024] 300 - water delivery pipe, 310 - first pipe section, 320 - second pipe section;

[0025] 400 - water pump;

[0026] 500 - filter;

[0027] 600 - connecting line. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0029] The terms "first", "second", and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0030] The heat dissipation back brace and the heat dissipation device provided by the embodiments of the present application will be described in detail below in conjunction with the drawings and specific examples and application scenarios.

[0031] Reference Figures 1 to 8 The embodiments of the present application disclose a heat dissipation back brace, which comprises a heat-conducting bottom plate 110, a cover 120, an atomizer 130 and a heat dissipation piece 140. The heat-conducting bottom plate 110 is used to contact with an electronic device, so as to transfer the heat generated by the electronic device to the heat-conducting bottom plate 110. Optionally, the heat-conducting bottom plate 110 can be made of a high-heat-conducting non-metallic material, such as ceramic, etc., which is not specifically limited here; further optionally, the side of the heat-conducting bottom plate 110 facing the electronic device can be provided with a silica gel pad or the like structure, so as to reduce the gap between the heat dissipation back brace and the electronic device, thereby reducing the thermal resistance of the heat-conducting contact. The above-mentioned electronic device can be a smart phone, a tablet computer, an electronic book reader, a wearable device (such as a smart watch), an electronic game console or the like electronic device, and the type of the electronic device is not specifically limited in the embodiments of the present application.

[0032] The cover 120 is arranged on the heat-conducting bottom plate 110 and forms a containing cavity with the heat-conducting bottom plate 110, the cover 120 is used for protecting the structure arranged in the containing cavity, the cover 120 is provided with a ventilation opening 121, so that the containing cavity is communicated with the external environment, the heat in the containing cavity can be dissipated to the external environment through the ventilation opening 121, and the air in the external environment can also enter the containing cavity through the ventilation opening 121. Optionally, the cover 120 can be made of plastic, and of course can also be made of other materials, which is not limited here.

[0033] The atomizer 130 is arranged on the cover 120, the atomizer 130 and the cover 120 can adopt an integrated structure or a split structure, which is not limited here; the nozzle 131 of the atomizer 130 is communicated with the containing cavity, that is, the nozzle 131 can spray mist into the containing cavity; optionally, the nozzle 131 can be of an annular structure, and the nozzle 131 sprays mist to the periphery of the containing cavity, which is beneficial to improve the uniformity of the mist diffusion.

[0034] The heat dissipation piece 140 is arranged in the containing cavity, and the heat dissipation piece 140 is arranged opposite to the ventilation opening 121, so as to accelerate the flow of the gas, thereby improving the heat dissipation efficiency of the heat dissipation piece 140. The heat dissipation piece 140 is located between the heat-conducting bottom plate 110 and the nozzle 131, so that the mist sprayed by the nozzle 131 adheres to the surface of the heat dissipation piece 140, and the heat dissipation piece 140 and the heat-conducting bottom plate 110 form a heat-conducting channel, so that the heat on the heat-conducting bottom plate 110 is transmitted to the heat dissipation piece 140 through the heat-conducting channel. Optionally, the heat dissipation piece 140 and the heat-conducting bottom plate 110 can be in direct contact, thereby forming a heat-conducting channel, or the heat dissipation piece 140 and the heat-conducting bottom plate 110 are arranged in a spaced manner, and there is an air or other medium capable of conducting heat between the heat dissipation piece 140 and the heat-conducting bottom plate 110, thereby forming a heat-conducting channel.

[0035] In the embodiment of the present application, by arranging the atomizer 130 on the cover 120, the nozzle 131 of the atomizer 130 is arranged opposite to the heat dissipation piece 140 arranged in the containing cavity, the mist sprayed by the nozzle 131 is mixed with the cold air flowing through the ventilation opening 121 to form saturated wet air with liquid drops, the saturated wet air adheres to the surface of the heat dissipation piece 140, and under the action of the heat on the surface of the heat dissipation piece 140, the liquid drops evaporate by phase change, thereby absorbing a large amount of latent heat, and further improving the heat dissipation efficiency. Therefore, the embodiment of the present application can solve the problem of poor heat dissipation effect of the current heat dissipation back clip.

[0036] Optionally, the heat dissipation member 140 can be a heat dissipation fin; or the heat dissipation member 140 comprises a base 141 and a plurality of heat dissipation fins 142, the plurality of heat dissipation fins 142 are arranged at intervals on the base 141, and each heat dissipation fin 142 is located on the side of the base 141 close to the nozzle 131. In this scheme, the heat dissipation member 140 adopts this structure, which has a larger heat dissipation area, not only helps to improve the heat dissipation efficiency of the heat dissipation member 140, but also the spray sprayed by the nozzle 131 can be more attached to the surface of the heat dissipation member 140, thereby improving the working efficiency of the atomizer 130.

[0037] Optionally, the heat dissipation fin 142 can be made of high-thermal-conductivity metal materials such as aluminum, copper, etc.; further optionally, the heat dissipation fin 142 can be made of aluminum, which not only has high heat dissipation efficiency, but also has smaller mass, which is conducive to reducing the weight of the heat dissipation back clip, so as to facilitate carrying.

[0038] Optionally, the heat dissipation fin 142 can be sunflower type, needle rib type, straight rib type, etc.; further optionally, the heat dissipation fin 142 can be needle rib type, which has a larger surface area, which is conducive to improving the heat dissipation efficiency.

[0039] In the optional embodiment, the heat dissipation back clip further comprises a fan 150, which can be arranged between the nozzle 131 and the heat dissipation fin 142. At this time, the plurality of heat dissipation fins 142 can be uniformly distributed on the side of the base 141 facing the nozzle 131, but this will result in a larger thickness of the entire heat dissipation back clip, and the utilization rate of the fan 150 is lower. Based on this, optionally, the base 141 comprises a connected edge region and a central region, the plurality of heat dissipation fins 142 are located in the edge region, the fan 150 is arranged in the central region of the base 141, the plurality of heat dissipation fins 142 are arranged around the fan 150, and are distributed along the circumference of the base 141, and the fan 150 is arranged between the base 141 and the nozzle 131. By adopting this arrangement, not only can the space utilization rate of the containing cavity be improved, thereby reducing the thickness of the heat dissipation back clip, but also the plurality of heat dissipation fins 142 are arranged around the fan 150, which can make the wind blown by the fan 150 act more on the heat dissipation fin 142, thereby improving the utilization rate of the fan 150.

[0040] Optionally, the fan 150 can be a side flow fan, an axial flow fan, an inclined flow fan, etc., which is not limited here. Further optionally, when the plurality of heat dissipation fins 142 are arranged around the fan 150, the fan 150 can be a side flow fan, which not only can improve the utilization rate of the fan 150, but also can improve the heat dissipation efficiency of the heat dissipation fin 142; and the thickness of the side flow fan is smaller, which is conducive to reducing the thickness of the heat dissipation back clip.

[0041] Further, in a further optional embodiment, the fan 150 has a boss 151 on one side close to the nozzle 131, and the boss 151 has a cross-sectional area gradually decreasing in the extension direction of the fan 150 towards the nozzle 131, so as to form a guide surface 151a, the guide surface 151a avoids the nozzle 131 at one end thereof, that is, the guide surface 151a does not shield the nozzle 131 at one end thereof, so as to avoid that the boss 151 shields the nozzle 131. In this way, the guide surface 151a is arranged to make the spray emitted by the nozzle 151 flow along the guide surface 151a towards the fan 150, and the guide surface 151a is beneficial to reduce the flow resistance when the spray diffuses, so as to improve the working efficiency of the atomizer 130. Optionally, the guide surface 151a can be a conical surface, or an arc-shaped convex surface or an arc-shaped concave surface, which is not limited here; further optionally, the guide surface 151a can be an arc-shaped concave surface, which has the effect of gathering the spray, so as to make more spray flow towards the fan 150, thereby further improving the working efficiency of the atomizer 130.

[0042] In another optional embodiment, the heat-dissipating back clip further comprises a semiconductor refrigeration device 160, the semiconductor refrigeration device 160 is arranged in the accommodating cavity, the semiconductor refrigeration device 160 is located between the heat-dissipating member 140 and the heat-conducting bottom plate 110, the cold end of the semiconductor refrigeration device 160 is arranged opposite to the heat-conducting bottom plate 110, and the hot end of the semiconductor refrigeration device 160 is arranged opposite to the heat-dissipating member 140, that is, the heat on the heat-conducting bottom plate 110 is first transferred to the cold end of the semiconductor refrigeration device 160, and then the heat of the cold end is transferred to the hot end of the semiconductor refrigeration device 160, and then transferred to the heat-dissipating member 140, and then dissipated by the heat-dissipating member 140. In this way, the semiconductor refrigeration device 160 is used for refrigeration, which has the characteristics of no noise, no pollution, high reliability and long service life; and it has no mechanical transmission part and does not need refrigerant. Of course, the semiconductor refrigeration device 160 in this embodiment can also be replaced by a condenser for refrigeration.

[0043] Optionally, the surface of the heat-dissipating member 140 facing the semiconductor refrigeration device 160 can be coated with a heat-conducting interface material, such as silicone grease, gel, etc., which is not limited here.

[0044] Further optional embodiment, the heat dissipation back clip further comprises a first heat insulation piece 170, the first heat insulation piece 170 is arranged in the accommodating cavity, the first heat insulation piece 170 is located between the heat conduction bottom plate 110 and the heat dissipation piece 140, and the first heat insulation piece 170 is used to block the heat on the heat dissipation piece 140 from flowing back to the heat conduction bottom plate 110, so as to improve the heat conduction efficiency of the heat conduction bottom plate 110. The first heat insulation piece 170 is provided with a avoiding opening 171, and the semiconductor refrigeration piece 160 is arranged in the avoiding opening 171. At this time, the heat on the heat conduction bottom plate 110 can be ensured to be transferred to the semiconductor refrigeration piece 160, and at the same time, the heat on the heat dissipation piece 140 can be prevented from flowing back to the heat conduction bottom plate 110, that is, the heat on the heat conduction bottom plate 110 is unidirectional. Optionally, the first heat insulation piece 170 can be made of low-thermal-conductivity insulation material, such as foamed insulation cotton, aerogel and the like, which is not limited here.

[0045] Optionally, the heat dissipation back clip further comprises a circuit board 193, the circuit board 193 is arranged in the avoiding opening 171, and the circuit board 193 is electrically connected with the semiconductor refrigeration piece 160, the fan 150, the atomizer 130 and the like respectively. The circuit board 193 not only can play a role of power supply, but also can control the working state of the semiconductor refrigeration piece 160, the fan 150 and the atomizer 130, such as the rotating speed of the fan 150, the voltage of the semiconductor refrigeration piece 160 (i.e. refrigeration capacity), the atomization amount of the atomizer 130 and the like, so as to match the heat dissipation state of the current heat dissipation piece 140.

[0046] Optionally, the atomizer 130 can be a compression type atomizer or a mesh type atomizer. In other embodiments, the atomizer 130 comprises a shell 132 and an ultrasonic atomizing piece 133. Optionally, the shell 132 and the cover 120 can be an integrated structure for easy installation. The shell 132 has an atomizing cavity 132a and a water inlet 132b, the atomizing cavity 132a is in communication with the water inlet 132b and the nozzle 131 respectively, the ultrasonic atomizing piece 133 is arranged in the atomizing cavity 132a and is arranged opposite to the nozzle 131. The ultrasonic atomizing piece 133 scatters water into countless tiny droplets by high-frequency oscillation to fill the entire atomizing cavity 132a, and adjusts the working state of the ultrasonic atomizing piece 133 to control the spray flow, and the spray is sprayed out of the nozzle 131. Therefore, the scheme adopts an ultrasonic atomizer, which has the characteristics of uniform and stable spraying, dense spraying and not easy to block.

[0047] When the heat dissipation back clip further comprises the fan 150, and the heat dissipation piece 140 comprises the base 141 and the plurality of heat dissipation ribs 142, the spray produced by the ultrasonic atomization piece 133 is sprayed out from the nozzle 131, the negative pressure of the fan 150 sucks the mixed cold air outside to form the saturated wet air with the micro liquid drops, and the fan 150 pressurizes and speeds up to blow to the surface of the heat dissipation rib 142, at this time, the innumerable micro liquid drops are attached to the surface of the heat dissipation rib 142 and evaporate, a large amount of latent heat is absorbed through the phase change evaporation of the liquid drops, and the efficiency of the heat dissipation mode is greatly improved compared with the traditional air cooling heat dissipation; at the same time, the innumerable micro liquid drops increase the surface area of heat exchange with the air to a certain extent, and faster evaporation cooling can be realized; in addition, because the air is in an unsaturated state, the wall temperature can be reduced to the dew point temperature at room temperature through the evaporation cooling of the liquid, and the dew point temperature is usually lower than the room temperature, so that the effect of room temperature refrigeration is realized.

[0048] In another alternative embodiment, the heat dissipation back clip further comprises a wireless charging coil 180, and the wireless charging coil 180 is arranged between the heat-conducting bottom plate 110 and the heat dissipation piece 140. The wireless charging coil 180 is used to charge the electronic device placed on the heat dissipation back clip. That is, the heat dissipation back clip can be used as a wireless charger, so that the heat dissipation back clip has multifunctionalization, which is conducive to improving the user experience.

[0049] In a further alternative embodiment, the heat dissipation back clip further comprises a second heat insulation piece arranged in the accommodation cavity, and the second heat insulation piece is located between the heat-conducting bottom plate 110 and the wireless charging coil 180. When the wireless charging coil 180 works, heat will be generated, and the second heat insulation piece is used to block the heat generated by the wireless charging coil 180 from being transmitted to the heat-conducting bottom plate 110. Optionally, the second heat insulation piece can be made of low-thermal-conductivity thermal insulation materials such as foamed thermal insulation cotton and aerogel, which are not limited here.

[0050] Optionally, the heat dissipation back clip further comprises a first magnetic shielding piece 191 arranged between the wireless charging coil 180 and the heat dissipation piece 140. When the wireless charging coil 180 works, a magnetic field will be generated, and the first magnetic shielding piece 191 is used to block the magnetic field to avoid interaction with the heat dissipation piece 140, thereby reducing eddy current loss and improving the charging efficiency of the wireless charging coil 180.

[0051] In other embodiments, the heat dissipation back clip further comprises a second magnetic shielding piece 192 arranged between the wireless charging coil 180 and the heat-conducting bottom plate 110. When the wireless charging coil 180 works, a magnetic field will be generated, and the second magnetic shielding piece 192 is used to block the magnetic field to avoid interaction with the heat-conducting bottom plate 110, thereby reducing eddy current loss and improving the charging efficiency of the wireless charging coil 180.

[0052] When the heat dissipation back clip simultaneously comprises the first magnetic separation sheet 191 and the second magnetic separation sheet 192, the first magnetic separation sheet 191 is arranged between the wireless charging coil 180 and the heat dissipation piece 140, and the second magnetic separation sheet 192 is arranged between the wireless charging coil 180 and the heat conduction bottom plate 110, that is, the wireless charging coil 180 is located between the first magnetic separation sheet 191 and the second magnetic separation sheet 192, which is conducive to further improving the charging efficiency of the wireless charging coil 180.

[0053] Optionally, the number of the ventilation openings 121 can be one; or the number of the ventilation openings 121 is at least two, and the at least two ventilation openings 121 comprise a first ventilation opening 121a and a second ventilation opening 121b, the first ventilation opening 121a is arranged on the side wall of the shell 120, and the second ventilation opening 121b is arranged on the top of the shell 120, at this time, the heat dissipation piece 140 is directed to the ventilation openings 121 in the axial and radial directions of the heat dissipation piece 140, which is conducive to improving the heat dissipation efficiency of the heat dissipation piece 140.

[0054] Optionally, the number of the first ventilation openings 121a is at least two, and each first ventilation opening 121a is arranged at intervals along the circumference of the shell 120, so as to improve the air flow and improve the heat dissipation efficiency of the heat dissipation piece 140.

[0055] Optionally, the number of the second ventilation openings 121b is at least two, and each second ventilation opening 121b is arranged at intervals along the circumference of the shell 120, so as to improve the air flow. Further optionally, the at least two second ventilation openings 121b comprise a center ventilation opening 121b1 and an edge ventilation opening 121b2, the center ventilation opening 121b1 is closer to the atomizer 130 than the edge ventilation opening 121b2, each center ventilation opening 121b1 is distributed at intervals around the atomizer 130, so that the air entering the center ventilation opening 121b1 is fully mixed with the spray ejected by the nozzle 131; each edge ventilation opening 121b2 is distributed at intervals along the edge of the top of the shell 120, so that the air entering each edge ventilation opening 121b2 acts on the fan 150, thereby accelerating the heat dissipation efficiency of the fan 150.

[0056] In the optional embodiment, the heat dissipation back clip further comprises an annular magnetic piece arranged on the inner surface of the shell 120. When the heat dissipation back clip needs to work, the heat dissipation back clip is magnetically connected with the electronic device, so as to facilitate the disassembly of the heat dissipation back clip. Of course, the heat dissipation back clip can also be connected with the electronic device in a telescopic side edge clamping mode, a gamepad mode or the like.

[0057] Based on the heat dissipation back clip provided in the embodiments of the present application, the embodiments of the present application further provide a heat dissipation device comprising a base 200 and the heat dissipation back clip 100 described in any of the above embodiments, and the heat dissipation back clip 100 is arranged in the accommodating groove 210 of the base 200, so as to facilitate the carrying of the heat dissipation device.

[0058] Optionally, the accommodating groove 210 is provided with a retractable fixing buckle 211, which can be matched with or separated from the heat dissipation back clip 100 to facilitate the fixing and removal of the heat dissipation back clip 100. Further optionally, the number of the fixing buckles 211 is at least two, and each fixing buckle 211 is arranged along the circumference of the accommodating groove 210 to improve the stability of the heat dissipation back clip 100.

[0059] In an optional embodiment, the heat dissipation device further comprises a water delivery pipe 300, a water pump 400 and a filter 500. Optionally, the water pump 400 can be a micro water pump, such as a peristaltic pump, which can self-suck and pump gas, liquid or gas-solid two-phase medium. The base 200 is provided with a water storage tank 220, and the water pump 400 is arranged in the water storage tank 220. The water outlet end of the water pump 400 is connected in communication with the first end of the water delivery pipe 300, and the filter 500 is arranged at the port of the water inlet end of the water pump 400. The filter 500 is used to filter impurities in the water entering the water delivery pipe 300, so as to avoid the influence of impurities on the operation of the atomizer 130. In the case that the heat dissipation back clip 100 is in a working state, the second end of the water delivery pipe 300 is connected in communication with the atomizer 130 of the heat dissipation back clip 100. That is, when the heat dissipation back clip 100 is dissipating heat, the water stored in the water storage tank 220 is pumped into the atomizer 130 by the water pump 400 for atomization by the atomizer 130. Of course, the water required for atomization by the atomizer 130 can also be provided by a water source other than the heat dissipation back clip. Relatively speaking, when the water storage tank 220 and the water pump 400 are provided, there is no need to provide an additional water source, which is convenient for users to use.

[0060] Optionally, the base 200 is further provided with a water inlet 250 and an air vent. The water inlet 250 and the air vent are arranged on the same plane of the base 200 as the accommodating groove 210, and are connected in communication with the water storage tank 220. The water inlet 250 is used to inject water into the water storage tank 220, and the air vent is used to adjust the pressure difference balance between the inside and outside of the water storage tank 220 to ensure the normal pumping of water flow.

[0061] Optionally, the base 200 is further provided with a plurality of control buttons 260 for controlling the working state of the heat dissipation device, such as the start and stop of the water pump 400, the on-off of the connecting line 600 described below, etc.

[0062] Optionally, the heat dissipation device further comprises a connecting line 600, and the first end of the connecting line 600 is electrically connected with the base 200. In the case that the heat dissipation back clip 100 is in a working state, the second end of the connecting line 600 is electrically connected with the heat dissipation back clip 100. In this scheme, when the heat dissipation back clip 100 is dissipating heat, the base 200 not only supplies water to the heat dissipation back clip 100, but also supplies power to the heat dissipation back clip 100, and at this time the base 200 serves as a power supply. Of course, a power supply line can also be additionally provided on the heat dissipation back clip 100.

[0063] Optionally, the connecting line 600 and the water supply pipe 300 can be separately arranged; or the water supply pipe 300 comprises a first pipe section 310 and a second pipe section 320 connected with each other, the inner diameter of the first pipe section 310 is larger than the diameter of the connecting line 600, the first pipe section 310 is sleeved outside part of the connecting line 600, and a water supply passage is formed between the inner wall of the first pipe section 310 and the surface of the connecting line 600. In this scheme, the connecting line 600 and the water supply pipe 300 are coupled to form a water-electricity coupling pipe, which is beneficial to reduce the number of components of the heat dissipation device, and can avoid the interlaced winding of the pipelines, so as to facilitate the storage of the pipelines; and the connecting line 600 and the water supply pipe 300 are independently separated at the end of the water-electricity coupling pipe, so as to facilitate the separate work of the two, for example, the connecting line 600 can be separately connected to the charging interface of the electronic device.

[0064] It should be noted that the water supply pipe 300 needs to have good sealing performance, and at the same time, the flexibility for storage is also required, which can adopt a corrugated pipe or a soft rubber, and the bifurcation of the connecting line 600 and the water supply pipe 300 needs to be filled with enough sealant or fused to be bonded in order to ensure the sealing performance. The outlet of the water supply pipe 300 is provided with a damping valve to prevent the liquid from freely flowing out when the water supply pipe 300 is pulled out.

[0065] In other embodiments, the outer circumferential surface of the base 200 is provided with a winding groove 230, and the water supply pipe 300 can be wound in the winding groove 230, so as to facilitate the storage of the water supply pipe 300.

[0066] Optionally, the base 200 has a power line 240 as a total input of the power supply of the heat dissipation device, which is used to be electrically connected with the power supply, so as to supply power to the base 200. Further optionally, the power line 240 can be a telescopic power line, so as to facilitate the storage.

[0067] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments, and the above specific embodiments are only illustrative but not restrictive, and those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the scope protected by the claims.

Claims

1. A heat dissipating apparatus characterized by comprising: The base, water pipe, water pump, connecting line and heat dissipation back clip, the first end of the connecting line is electrically connected with the base, the heat dissipation back clip is detachably arranged in the accommodating groove of the base, the base has a water storage groove, the water pump is arranged in the water storage groove, the water outlet end of the water pump is communicated with the first end of the water pipe, the water pipe comprises a first pipe section and a second pipe section connected with each other, the inner diameter of the first pipe section is larger than the diameter of the connecting line, the first pipe section is sleeved outside part of the connecting line, and a water supply channel is formed between the inner wall of the first pipe section and the surface of the connecting line, The heat dissipation back clip comprises: A heat-conducting bottom plate for contacting the electronic device; A cover arranged on the heat-conducting bottom plate and forming an accommodating cavity with the heat-conducting bottom plate, the cover is provided with a ventilation opening; An atomizer arranged in the cover, a nozzle of the atomizer being communicated with the accommodating cavity; A heat dissipation member arranged in the accommodating cavity, the heat dissipation member is arranged opposite to the ventilation opening, and the heat dissipation member is located between the heat-conducting bottom plate and the nozzle, so that the spray emitted by the nozzle is attached to the surface of the heat dissipation member, and a heat-conducting channel is formed between the heat dissipation member and the heat-conducting bottom plate; In the case that the heat dissipation back clip is in a working state, the second end of the connecting line is electrically connected with the heat dissipation back clip, the second end of the water pipe is communicated with the atomizer, and the water storage groove is communicated with the atomizer through the water pipe.

2. The heat dissipating apparatus according to claim 1, wherein The heat dissipation member comprises a base and a plurality of heat dissipation fins, the plurality of heat dissipation fins are arranged at intervals on the base, and each heat dissipation fin is located on one side of the base close to the nozzle.

3. The heat dissipating apparatus according to claim 2, wherein The base comprises an edge region and a central region connected with each other, and the plurality of heat dissipation fins are located in the edge region; The heat dissipation back clip further comprises a fan, the fan is arranged in the central region of the base, the plurality of heat dissipation fins are arranged around the fan and are distributed along the circumference of the base, and the fan is arranged between the base and the nozzle.

4. The heat dissipating apparatus according to claim 3, wherein The side of the fan close to the nozzle has a boss, and the cross-sectional area of the boss gradually decreases in the extension direction of the fan to the nozzle, so as to form a flow guide surface, and one end of the flow guide surface facing the nozzle avoids the nozzle.

5. The heat dissipating apparatus according to claim 1, wherein The heat dissipation back clip further comprises a semiconductor refrigeration member, the semiconductor refrigeration member is arranged in the accommodating cavity, the semiconductor refrigeration member is located between the heat dissipation member and the heat-conducting bottom plate, the cold end of the semiconductor refrigeration member is arranged opposite to the heat-conducting bottom plate, and the hot end of the semiconductor refrigeration member is arranged opposite to the heat dissipation member.

6. The heat dissipating apparatus according to claim 5, wherein The heat dissipation back clip further comprises a first heat insulation member, the first heat insulation member is arranged in the accommodating cavity, the first heat insulation member is located between the heat-conducting bottom plate and the heat dissipation member, the first heat insulation member is provided with an avoiding opening, and the semiconductor refrigeration member is arranged in the avoiding opening.

7. The heat dissipating apparatus according to claim 1, wherein The atomizer comprises a shell and an ultrasonic atomizing sheet, the shell has an atomizing cavity and a water injection port, the atomizing cavity is communicated with the water injection port and the nozzle respectively, the ultrasonic atomizing sheet is arranged in the atomizing cavity and is arranged opposite to the nozzle.

8. The heat dissipating apparatus according to claim 1, wherein The heat dissipation back clip further comprises a wireless charging coil, the wireless charging coil is arranged between the heat conduction bottom plate and the heat dissipation piece, and the wireless charging coil is used for charging an electronic device placed on the heat dissipation back clip.

9. The heat dissipating apparatus according to claim 8, wherein The heat dissipation back clip further comprises a first magnetic isolation sheet arranged between the wireless charging coil and the heat dissipation piece, and / or the heat dissipation back clip further comprises a second magnetic isolation sheet arranged between the wireless charging coil and the heat conduction bottom plate.

10. The heat dissipating apparatus according to claim 1, wherein The number of the ventilation openings is at least two, the at least two ventilation openings comprise a first ventilation opening and a second ventilation opening, the first ventilation opening is arranged on the side wall of the shell, and the second ventilation opening is arranged on the top of the shell.

11. The heat dissipating apparatus according to claim 1, wherein The heat dissipation back clip further comprises an annular magnetic piece arranged on the inner surface of the shell.

12. The heat dissipating apparatus according to claim 1, wherein The heat dissipation device further comprises a filter arranged on the port of the water inlet end of the water pump.

Images