Cooling unit, heat treatment apparatus provided with the same, and heat treatment method

Abstract

The present application relates to a cooling unit, a thermal processing apparatus having the same, and a thermal processing method, and more particularly, to a technology for rapidly and effectively lowering the temperature of a heating plate by having a heat exchange medium of a cooling unit contact the heating plate and circulating a refrigerant after a thermal processing process of a substrate is performed by a thermal processing apparatus. The cooling unit includes a cooling plate that moves toward a heating plate of a heating unit that performs a thermal processing process on a substrate; a refrigerant flow path that is provided inside the cooling plate and through which a refrigerant flows; and a heat exchange medium that contacts at least a portion of the heating plate to cool the heating plate by performing heat exchange between the heating plate and the refrigerant in the refrigerant flow path.

Description

TECHNICAL FIELD

[0001] The present application relates to a cooling unit, a thermal processing apparatus having the same, and a thermal processing method, and more particularly, to a technology for rapidly and effectively lowering the temperature of a heating plate by contacting a heat exchange medium of a cooling unit to the heating plate and circulating a refrigerant after a thermal processing process of a substrate is performed by a thermal processing apparatus. BACKGROUND

[0002] Generally, in order to manufacture a semiconductor element, various processes such as cleaning, evaporation, photolithography, etching, and ion implantation are performed. The photolithography process performed to form a pattern plays an important role in realizing high integration of a semiconductor element.

[0003] The photolithography process is performed to form a photoresist pattern on a semiconductor substrate. The photolithography process includes a coating process of forming a photoresist film on a substrate, an exposure process of forming a photoresist pattern from the photoresist film, and a developing process of removing a region irradiated with light or an opposite region thereof in the exposure process, and a baking process of heating and cooling the substrate before and after each process is performed.

[0004] The baking process heats the substrate by a thermal processing unit. The thermal processing unit has a heating plate on which a wafer is placed. Before a process is completed on wafers belonging to one group and a process is performed on wafers belonging to a next group, the temperature of the heating plate should be adjusted to conform to process conditions (for example, a heating temperature) of the wafers belonging to the next group. The temperature rise of the heating plate can be rapidly performed by increasing heat energy supplied to the heating plate.

[0005] However, the temperature drop of the heating plate is achieved by a natural cooling method, and thus a long time is consumed. The time consumed by the natural cooling method corresponds to standby time and greatly reduces the operation rate of the apparatus. SUMMARY

[0006] The present application has been made to solve the conventional technical problems as described above, and aims to propose a scheme capable of improving the cooling speed of a heating plate of a thermal processing apparatus.

[0007] In particular, the present application aims to solve the problem that when a natural cooling method is applied to cool a heating plate of a thermal processing unit, a long time is consumed and the operation rate of the entire apparatus is greatly reduced.

[0008] The objects of the present application are not limited to the foregoing, and other objects and advantages of the present application not mentioned above can be understood from the following description.

[0009] An embodiment of a cooling unit according to the present application can include a cooling plate that moves toward a heating plate of a heating unit that performs a heat treatment process on a substrate; a refrigerant flow path that is provided inside the cooling plate and through which a refrigerant flows; and a heat exchange medium that contacts at least a portion of the heating plate to cool the heating plate by exchanging heat between the heating plate and the refrigerant in the refrigerant flow path.

[0010] Preferably, the heat exchange medium can include cooling fins that are dispersedly disposed on a lower surface of the cooling plate and have a set level of thermal conductivity.

[0011] More preferably, an upper portion of the cooling fins can protrude inside the refrigerant flow path to directly contact the refrigerant flowing in the refrigerant flow path.

[0012] As an example, the heat exchange medium can further include a ball flange that is insertedly disposed on a lower portion of the cooling fins and contacts the heating plate.

[0013] Preferably, the ball flange can be provided by a material having a set level of thermal conductivity and elasticity.

[0014] As another example, the heat exchange medium can further include a thermal pad that is insertedly disposed on a lower portion of the cooling fins and contacts the heating plate.

[0015] Preferably, the thermal pad can be provided by a material having a set level of thermal conductivity and elasticity.

[0016] As an example, the thermal pad can be formed in an area corresponding to a shape of a lower surface of the cooling plate.

[0017] As another example, the thermal pad can be formed in a set area and dispersedly disposed in a plurality on the lower surface of the cooling plate.

[0018] Further, the cooling unit can further include a driving member that moves the cooling plate in a horizontal direction and a vertical direction to contact the heat exchange medium with the heating plate.

[0019] In addition, an embodiment of a heat treatment apparatus according to the present application can include a housing that provides an internal space in which a heat treatment process is performed on a substrate; a heating unit that is disposed in the internal space of the housing to heat a substrate to a set temperature to perform a heat treatment process; a conveying unit that conveys a substrate in the internal space of the housing; the cooling unit of claim 1 that cools the heating unit; and a controller that controls operations of the heating unit, the conveying unit, and the cooling unit.

[0020] Preferably, the heating unit can include a heating plate configured with a heating member to perform a heat treatment process on a substrate, and a cover located above the heating plate and movable in a vertical direction toward the heating plate to provide a heating space.

[0021] In addition, the transport unit can include a transport plate on which a substrate is placed, an arm connected to one side of the transport plate, and a driving member to move the arm to move the transport plate in a horizontal direction and a vertical direction.

[0022] As an example, the cooling plate of the cooling unit can be integrated with the transport plate of the transport unit.

[0023] As another example, the cooling unit can be disposed on a lower surface of the transport plate of the transport unit.

[0024] Further, the heating unit can further include a temperature adjustment plate disposed apart below the heating plate to discharge a temperature control gas to a lower surface of the heating plate.

[0025] In addition, an embodiment of a heat treatment method according to the present application can include a cooling unit moving step of moving a cooling unit above a heating plate of a heating unit in a state in which the temperature of the heating plate of the heating unit rises as a heat treatment process is performed on a substrate, a heating plate cooling step of lowering the cooling unit to contact a heat exchange medium of the cooling unit with an upper surface of the heating plate and cooling the heating plate, and a cooling unit returning step of returning the cooling unit to an original position.

[0026] As an example, the heating plate cooling step can include a heat exchange medium contacting step of lowering a cooling plate of the cooling unit toward the heating plate to contact a heat exchange medium of the cooling unit with an upper surface of the heating plate, and a heat exchange step of cooling the heating plate by heat exchange between the heat exchange medium and the heating plate by supplying a refrigerant through a refrigerant flow path of the cooling unit.

[0027] Further, the heat treatment method can further include a step of supplying a cooling gas to a lower surface of the heating plate through a temperature adjustment plate of the heating member.

[0028] In addition, a preferred embodiment of the thermal processing apparatus according to the present application can include a housing providing an internal space in which a substrate is subjected to a thermal processing process; a heating unit including a heating plate provided with a heating member to subject the substrate to the thermal processing process, and a cover located above the heating plate and movable in a vertical direction toward the heating plate to provide a heating space; a conveying unit to convey the substrate in the internal space of the housing; and a cooling unit including a cooling plate movable toward the heating plate of the heating unit to subject the substrate to the thermal processing process, a refrigerant flow path provided inside the cooling plate and through which a refrigerant flows, cooling fins dispersedly provided on a lower surface of the cooling plate and having a portion of an upper portion protruding inside the refrigerant flow path to directly contact the refrigerant flowing in the refrigerant flow path and having a predetermined level of thermal conductivity, a ball flange insertedly provided on a portion of the lower portion of the cooling fins and provided with a material having a predetermined level of thermal conductivity and elasticity and contacting the heating plate, and a driving member to move the cooling plate in a horizontal direction and a vertical direction.

[0029] According to the present application, the temperature of the heating plate can be rapidly lowered by more effectively performing heat exchange between the refrigerant and the heating plate, thereby greatly improving the operation rate of the entire apparatus.

[0030] In particular, the ball flange or the thermal conductive pad having a high thermal conductivity and elasticity ensures substantial contact force and contact area with the heating plate, and the cooling fins directly contact the refrigerant to perform heat exchange, thereby further improving the cooling speed of the heating plate.

[0031] Further, a predetermined level of separation distance can be ensured between the cooling plate and the heating plate by the cooling fins and the ball flange, and thus the cooling unit can cool the heating plate even in a case where a lift pin is protruded on the heating plate according to a situation.

[0032] Effects of the present application are not limited to the above-mentioned effects, and other effects not mentioned herein can be clearly understood by those skilled in the art from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figures 1 to 3 An embodiment of a thermal processing apparatus according to the present application is illustrated.

[0034] Figure 4 An embodiment of a cooling unit according to the present application is illustrated.

[0035] Figure 5 Another embodiment of a cooling unit according to the present application is illustrated.

[0036] Figure 6 A flowchart of an embodiment of a thermal processing method according to the present application is illustrated.

[0037] Figures 7 to 10 An example of an execution process of the heat treatment method according to the present application is shown.

[0038] (Explanation of Reference Numerals)

[0039] 100: heat treatment device,

[0040] 110: housing,

[0041] 130: conveyance unit,

[0042] 131: conveyance plate,

[0043] 132: arm,

[0044] 137: drive member,

[0045] 150: heating unit,

[0046] 151: heating plate,

[0047] 200, 200a: cooling unit,

[0048] 210, 210a: cooling plate,

[0049] 220, 220a: refrigerant flow path,

[0050] 230, 230a: cooling fin,

[0051] 240: ball flange,

[0052] 240a: thermally conductive pad,

[0053] 300: controller. DETAILED DESCRIPTION

[0054] Hereinafter, a preferred embodiment of the present application will be explained in detail with reference to the attached drawings, but the present application is not limited or restricted by the embodiment.

[0055] In order to explain the present application and the advantages in action of the present application and the objects achieved by the implementation of the present application, a preferred embodiment of the present application is exemplified below and explained with reference thereto.

[0056] First, the terms used in the present application are used only to describe specific embodiments and do not limit the present application, and the singular expression can include the plural expression unless it is explicitly stated otherwise in the context. In addition, in the present application, the terms "include" or "have" or the like are used to indicate the presence of features, numbers, steps, actions, components, parts or combinations thereof described in the specification, and it should be understood that the presence or additional possibility of one or more other features or numbers, steps, actions, components, parts or combinations thereof is not precluded.

[0057] In the description of the present application, when it is judged that a specific description for a related known configuration or function can confuse the gist of the present application, the detailed description thereof is omitted.

[0058] The present application proposes a technology that, after performing a heat treatment process of a substrate by a heat treatment apparatus, makes a heat exchange medium of a cooling unit contact a heating plate and circulates a refrigerant, thereby being able to rapidly and effectively reduce the temperature of the heating plate.

[0059] Figures 1 to 3 An embodiment of a heat treatment apparatus according to the present application is shown. Referring to Figures 1 to 3 An embodiment of a heat treatment apparatus according to the present application is shown. Referring to

[0060] The heat treatment apparatus 100 can perform a heat treatment on a substrate W. For example, the heat treatment apparatus 100 can perform a prebake process of heating the substrate W to a predetermined temperature to remove an organic substance or moisture on the surface of the substrate W before coating a photoresist, or perform a soft bake process performed after coating the photoresist on the substrate W, or the like, and perform a cooling process of cooling the substrate W after each of the heating processes, or the like.

[0061] The heat treatment apparatus 100 can include a housing 110, a conveying unit 130, a heating unit 150, a cooling unit 200, a controller 170, and the like.

[0062] The housing 110 can provide a space for implementing a baking process inside. The housing 110 can be provided in a cuboid shape, and the shape and the internal space size of the housing 110 can be changed as needed.

[0063] The housing 110 can include a first side wall 111, a second side wall 113, a loading / unloading passage 112, and the like.

[0064] The first side wall 111 can be provided at one side of the housing 110, and the second side wall 113 can be provided at the opposite side of the first side wall 111. A loading / unloading passage 112 through which the substrate W can be loaded or unloaded can be formed at the side wall of the housing 110. As an example, the loading / unloading passage 112 can be formed at the first side wall 111. The loading / unloading passage 112 can provide a path through which the substrate W is moved.

[0065] The conveying unit 130 can convey the substrate W within the housing 110. The conveying unit 130 can include a conveying plate 131, an arm 132, a support ring 133, a driving part 137, etc.

[0066] The substrate W can be seated on the conveying plate 131. The conveying plate 131 can be provided in a circular shape, and its shape can be deformed as necessary. The conveying plate 131 can be formed in a size corresponding to the substrate W. Preferably, the conveying plate 131 can be provided of a metal material having excellent thermal conductivity.

[0067] A guide hole 135 can be formed in the conveying plate 131. The guide hole 135 can be provided to extend from the outer side of the conveying plate 131 to the inner side thereof. The guide hole 135 can be provided in such a manner that it does not interfere with or collide with the lifting pin 153 when the conveying plate 131 is moved.

[0068] The arm 132 can be fixedly coupled to the conveying plate 131. The arm 132 can be provided between the conveying plate 131 and the driving part 137.

[0069] The support ring 133 can be provided around the conveying plate 131. The support ring 133 can support the edge of the conveying plate 131. When the substrate W is seated on the conveying plate 131, the support ring 133 can perform a function of supporting the substrate W so that the substrate W is placed at a fixed position.

[0070] The driving part 137 can drive the conveying plate 131. The driving part 137 can move the conveying plate 131 in the horizontal or vertical direction. The driving part 137 can move the conveying plate 131 toward the first position 101 and the second position 102.

[0071] The first position 101 can be a position at which the conveying plate 131 is adjacent to the first side wall 111. The second position 102, which is a position at which the conveying plate 131 is adjacent to the second side wall 113, can be a position above the heating plate 151.

[0072] The heating unit 150 can heat the substrate W to a set temperature. The heating unit 150 can include the heating plate 151, the lifting pin 153, the cover 155, the driver 157, and a temperature adjustment plate 156, etc., as necessary.

[0073] A heating member 152 that heats the substrate W can be provided inside the heating plate 151. For example, the heating member 152 can be provided by a heating coil, or differently therefrom, a heating pattern can be provided as the heating member 152 in the heating plate 151. The heating plate 151 can be provided in a cylindrical shape, and can be variously deformed in shape as necessary. A pin hole 154 that accommodates the lift pin 153 can be formed inside the heating plate 151.

[0074] The pin hole 154 can provide a path for the lift pin 153 to move as the lift pin 153 moves the substrate W up and down. The pin hole 154 can be provided to penetrate the heating plate 151 in the up and down direction, and can be provided in plural.

[0075] The lift pin 153 can move up and down by a lift mechanism (not shown). The lift pin 153 can place the substrate W on the heating plate 151. The lift pin 153 can lift the substrate W to a position spaced apart from the heating plate 151 by a certain distance.

[0076] A cover 155 can be positioned above the heating plate 151, and can be provided in a shape corresponding to the shape of the heating plate 151. The shape of the cover 155 can be variously deformed as necessary. The cover 155 can provide a heating space inside.

[0077] The cover 155 can move in the vertical direction toward the heating plate 151 by a driver 157 as the substrate W is moved toward the heating plate 151. The cover 155 can form a heating space of the substrate W by moving downward by a driver 165 as the substrate W is heated by the heating plate 151.

[0078] The driver 165 can be coupled with the cover 155 through a support part 161. The driver 165 can lift the cover 155 up and down as the substrate W is transferred or conveyed toward the heating plate 151. As an example, the driver 165 can be provided as an air cylinder.

[0079] A temperature adjustment plate 156 is provided spaced apart below the heating plate 151, and is provided with an exhaust flow path 157 to exhaust gas to the lower surface of the heating plate 151, thereby adjusting the temperature of the heating plate 151. As an example, the temperature adjustment plate 157 can selectively exhaust heated air or cooled air to raise, maintain, or lower the temperature of the heating plate 151.

[0080] The cooling unit 200 can cool the heating plate 151 or the processed substrate W. The cooling unit 200 can be disposed inside the conveyor plate 131, or the conveyor plate 131 can be included as a structure of the cooling unit 200. In this embodiment, the cooling plate 210 of the cooling unit 200 and the conveyor plate 131 have the same structure, and the upper part of the cooling plate 210 of the cooling unit 200 can serve as the conveyor plate 131.

[0081] Depending on the situation, the cooling plate of the cooling unit 200 may be a separate structure from the conveyor plate 131, and the cooling unit 200 may be disposed on the lower surface of the conveyor plate 131.

[0082] The controller 300 can control the operation of the conveying unit 130, the heating unit 150, the cooling unit 200, etc.

[0083] Regarding cooling unit 220, refer to... Figure 4 An embodiment of the cooling unit according to the present invention will be described together.

[0084] The cooling unit 200 may include a cooling plate 210, a cooling flow path 220, a heat exchange medium, etc.

[0085] The cooling plate 210 of the cooling unit 200 can function as the conveying plate 131 of the conveying unit 130, and a refrigerant flow path 220 can be provided inside it. Here, the upper surface of the cooling plate 210 can function as the conveying plate 131.

[0086] The refrigerant flow path 220 can be formed in a zigzag pattern inside the cooling plate 210 and configured to pass through the entire area of ​​the cooling plate 210.

[0087] The cooling unit 200 may include a drive member (not shown) that moves the cooling plate 210 in the horizontal and vertical directions. As an example, the arm 132 and drive component 137 of the conveying unit 130 may function as drive members of the cooling unit 200.

[0088] Refrigerant supplied through a refrigerant supply section (not shown) can flow through refrigerant flow path 220. As an example, cooling water can be used as the refrigerant; various types of refrigerants can be used as needed.

[0089] The heat exchange medium may include cooling fins 230 and ball bearing flanges 240, etc.

[0090] Multiple cooling fins 230 can be distributed on the lower surface of the cooling plate 210 of the cooling unit 200. The cooling fins 230 can be formed of a material with a high thermal conductivity. The cooling fins 230 can penetrate the lower surface of the cooling plate 210, and a portion of the upper part protrudes into the refrigerant flow path 220 to directly contact the refrigerant flowing in the refrigerant flow path 220.

[0091] The ball flange 240 can be disposed at the lower end of the cooling fin 230. The ball flange 240 can be provided as a material with high thermal conductivity and elasticity.

[0092] The driving component of the cooling unit 200 can move the cooling plate 210 above the heating plate 151 and then lower it, so that the ball flange 240 located at the end of the cooling plate 230 can contact the heating plate 151.

[0093] The heat exchange through the structure of such a cooling unit 200 can quickly and effectively reduce the temperature of the heating plate 151.

[0094] Furthermore, a certain degree of separation distance can be ensured between the cooling plate 210 and the heating plate 151 by means of the cooling plate 230 and the ball bearing flange 240. Therefore, even if the heating plate 151 is provided with a lifting pin 153, the heating plate 151 can still be cooled by the cooling unit 200.

[0095] Figure 5 Another embodiment of the cooling unit according to the present invention is shown.

[0096] The Figure 5 The cooling unit 200a shown in the embodiment can be used with the Figure 4 The cooling unit 200 in the embodiment similarly includes a cooling plate 210a, a cooling flow path 220a, a heat exchange medium, etc.

[0097] According to the above Figure 5 In the cooling unit 200a of the embodiment, the heat exchange medium can be in contact with the cooling medium according to the... Figure 4 The heat exchange medium of the cooling unit 200 in the embodiments is configured differently.

[0098] The heat exchange medium may include cooling fins 230a and thermal pads 240a, etc.

[0099] The cooling fin 230a, made of a material with high thermal conductivity, can be disposed on the lower surface of the cooling plate 210a of the cooling unit 200a and penetrate the lower surface of the cooling plate 210a. A portion of the upper part protrudes into the refrigerant flow path 220a and comes into direct contact with the refrigerant flowing in the refrigerant flow path 220a.

[0100] The heat conductive pad 240a can be provided in contact with the lower surface of the cooling plate 210a. The heat conductive pad 240a can be provided in a material having high heat conductivity and elasticity.

[0101] The heat conductive pad 240a can be provided in a shape corresponding to the lower surface of the cooling plate 210a to cover the entire lower surface of the cooling plate 210a. According to circumstances, the heat conductive pad 240a can also have a certain area and be distributed in a plurality of regions on the lower surface of the cooling plate 210a.

[0102] The cooling fin 230a has a portion of the lower part thereof inserted into the upper surface of the heat conductive pad 240a, and thus heat exchange can be more effectively performed between the heat conductive pad 240a and the refrigerant flowing in the refrigerant flow path 220a.

[0103] The driving member of the cooling unit 200a can lower the cooling plate 210a after moving the cooling plate 210a onto the heating plate 151, and the heat conductive pad 240a provided on the lower surface of the cooling plate 210a can be in contact with the heating plate 151.

[0104] Heat exchange through the structure of the cooling unit 200a can rapidly and effectively reduce the temperature of the heating plate 151.

[0105] In addition, in the present application, a heat treatment method of a heat treatment apparatus according to the present application is proposed by observing the cooling unit according to the present application and the heat treatment method of the heat treatment apparatus described above, and the heat treatment method according to the present application will be observed through an embodiment below.

[0106] Figure 5 A flowchart showing an embodiment of the heat treatment method according to the present application, Figure 4 An example of the execution process of the heat treatment method according to the present application is shown.

[0107] In a state in which the temperature of the heating plate 151 of the heating unit 150 of the heat treatment apparatus 100 is increased to a certain level or more by performing a heat treatment process on a substrate, when the temperature of the heating plate 151 needs to be rapidly reduced in order to perform a next process, the heating plate 151 of the heating unit 150 can be cooled by the cooling unit 200.

[0108] To this end, first, the cooling plate 210 of the cooling unit 200 can be moved above the heating plate 151 (S110).

[0109] When the cooling plate 210 is moved to a position corresponding to above the heating plate 151, the cooling plate 210 can be lowered toward the upper surface of the heating plate 151 (S120).

[0110] As described above Figure 6As shown in (a) and (b), the cooling plate 210 can be moved horizontally above the heating plate 151 by the drive component 137, and the cooling plate 210 can be lowered at a position corresponding to the upper surface of the heating plate 151.

[0111] Furthermore, as described Figures 7 to 10 As shown, as a structure of the heat exchange medium of the cooling unit 200, after the ball flange 240 contacts the upper surface of the heating plate 151 (S130), the cooling plate 210 of the cooling unit 200 can be further lowered so that the ball flange 240 is uniformly pressurized and contacts the upper surface of the heating plate 151.

[0112] As described Figure 7 As shown, refrigerant R can be supplied to the refrigerant flow path 220 of the cooling unit 200 while the ball bearing flange 240 is in uniform contact with the upper surface of the heating plate 151, causing the refrigerant R to circulate in the refrigerant flow path 220 (S140). Here, various cooling substances can be used as the refrigerant; for example, cooling water can be used.

[0113] Alternatively, while the refrigerant R circulates in the refrigerant flow path 220, the refrigerant and the heating plate 151 in contact with the ball flange 240 exchange heat through the cooling fins 230 of the cooling unit 200, thereby cooling the heating plate 151 (S150).

[0114] Furthermore, as described Figure 8 As shown, while cooling is performed by contacting the cooling unit 200 with the upper surface of the heating plate 151, cooling gas A, such as cooling air, is supplied through the discharge flow path 157 of the temperature regulating plate 156 disposed below the heating plate 151, thereby reducing the temperature of the heating plate 151 more effectively.

[0115] Furthermore, when the temperature of the heating plate 151 drops to a set level, the cooling plate 210 is raised and returned to its original position (S160), thereby ending the cooling process of the heating plate.

[0116] In this embodiment, the heat treatment method is described as applicable to the above. Figure 9 The cooling unit for the ball flange, but it can also be achieved by applying the aforementioned Figure 10 Figure 4 Figure 5 The cooling unit of the thermally conductive pad is used to perform the heat treatment method according to the invention.

[0117] By performing such a heat treatment method according to the invention, the heating plate can be cooled more quickly and effectively.

[0118] Based on the above observations, the present invention can significantly improve the overall operating rate of the equipment by rapidly reducing the temperature of the heating plate through more efficient heat exchange between the refrigerant and the heating plate.

[0119] In particular, the cooling speed of the heating plate can be further increased by ensuring substantial contact force and contact area with the heating plate through the ball flange or the heat-conductive pad having high thermal conductivity and elasticity, and performing heat exchange by directly contacting the cooling fin with the refrigerant.

[0120] Further, a certain level of separation distance between the cooling plate and the heating plate can be ensured by the cooling fin and the ball flange, and thus the heating plate can be cooled by the cooling unit even in a case where the lift pin is protruded on the heating plate according to a situation.

[0121] The above description is only illustrative of the technical concept of the present application, and those having ordinary knowledge in the art to which the present application pertains can make various modifications and changes within the scope of the essential characteristics of the present application. Therefore, the embodiments described in the present application are for illustrating the technical concept of the present application and are not intended to limit the present application, and the technical concept of the present application is not limited by such embodiments. The scope of protection of the present application should be interpreted according to the appended claims, and all technical concepts within the equivalent scope thereof should be interpreted as being included in the scope of protection of the present application.

Claims

1. A cooling unit, characterized in that The cooling unit includes: a cooling plate that moves toward a heating plate of a heating unit that performs a heat treatment process on a substrate; a refrigerant flow path that is provided inside the cooling plate and through which a refrigerant flows; and a heat exchange medium that contacts at least a portion of the heating plate to cool the heating plate by exchanging heat between the heating plate and the refrigerant in the refrigerant flow path, the heat exchange medium includes: cooling fins that are dispersedly arranged on a lower surface of the cooling plate and have a set level of thermal conductivity; and a ball flange that is inserted into a lower portion of the cooling fins and contacts the heating plate.

2. The cooling unit according to claim 1, wherein an upper portion of the cooling fins protrudes into the refrigerant flow path to directly contact the refrigerant flowing in the refrigerant flow path.

3. The cooling unit according to claim 1, wherein the ball flange is provided by a material having a set level of thermal conductivity and elasticity.

4. The cooling unit according to claim 1, wherein the heat exchange medium further includes: a thermal pad that is inserted into a lower portion of the cooling fins and contacts the heating plate.

5. The cooling unit according to claim 4, wherein the thermal pad is provided by a material having a set level of thermal conductivity and elasticity.

6. The cooling unit according to claim 4, wherein the thermal pad is formed in an area corresponding to a shape of a lower surface of the cooling plate.

7. The cooling unit according to claim 4, wherein the thermal pad is formed in a set area and is dispersedly arranged on the lower surface of the cooling plate.

8. The cooling unit according to claim 1, further comprising: a driving member that moves the cooling plate in a horizontal direction and a vertical direction to contact the heat exchange medium with the heating plate. The heat treatment apparatus includes: a housing that provides an internal space in which a heat treatment process is performed on a substrate; a heating unit that is arranged in the internal space of the housing to heat the substrate to a set temperature to perform the heat treatment process; 9. A heat treatment apparatus characterized by comprising: a conveying unit that conveys the substrate in the internal space of the housing; the cooling unit according to claim 1 that cools the heating unit; and a controller that controls operations of the heating unit, the conveying unit, and the cooling unit.

10. The heat treatment apparatus according to claim 9, wherein the heating unit includes: a heating plate that is arranged with a heating member to perform the heat treatment process on the substrate; and a cover that is located above the heating plate and is movable in a vertical direction toward the heating plate to provide a heating space.

11. The heat treatment apparatus according to claim 9, wherein the conveying unit includes: a conveying plate on which the substrate is placed; an arm that is connected to one side of the conveying plate; and a driving member that moves the arm to move the conveying plate in a horizontal direction and a vertical direction.

12. The heat treatment apparatus according to claim 11, wherein a cooling plate of the cooling unit is integrated with a conveying plate of the conveying unit. ​ ​ ​ 13. The thermal processing apparatus of claim 11, wherein the cooling unit is disposed below a lower surface of a transport plate of the transport unit.

14. The thermal processing apparatus of claim 10, wherein the heating unit further comprises: a temperature adjustment plate disposed spaced below the heating plate to discharge temperature control gas to a lower surface of the heating plate. including: a cooling unit moving step of moving a cooling unit including a cooling plate and a heat exchange medium having a cooling fin having a heat conduction characteristic of a set level dispersedly disposed on a lower surface of the cooling plate and a ball flange inserted into a lower portion of the cooling fin to above the heating plate in a state where a temperature of a heating plate of the heating unit is rising as a thermal processing process is performed on a substrate; 15. A heat treatment method characterized by, a heating plate cooling step of lowering the cooling unit to make at least a portion of the ball flange contact an upper surface of the heating plate and cooling the heating plate; and a cooling unit returning step of returning the cooling unit to an original position.

16. The thermal processing method of claim 15, wherein the heating plate cooling step comprises: a heat exchange medium contacting step of lowering the cooling plate of the cooling unit toward the heating plate to make at least a portion of the ball flange contact an upper surface of the heating plate; and a heat exchanging step of cooling the heating plate by heat exchange between the heat exchange medium and the heating plate by supplying a refrigerant through a refrigerant flow path of the cooling unit.

17. The thermal processing method of claim 16, further comprising a step of supplying cooling gas to a lower surface of the heating plate through a temperature adjustment plate of the heating unit. including: a housing providing an internal space in which a thermal processing process is performed on a substrate; a heating unit including a heating plate provided with a heating member to perform a thermal processing process on a substrate and a cover located above the heating plate and movable in a vertical direction toward the heating plate to provide a heating space; a transport unit transporting a substrate in the internal space of the housing; and a cooling unit including a cooling plate movable toward a heating plate of a heating unit performing a thermal processing process on a substrate, a refrigerant flow path provided inside the cooling plate and supplying a refrigerant to flow, a cooling fin dispersedly disposed on a lower surface of the cooling plate and having a heat conduction characteristic of a set level and protruding to an inside of the refrigerant flow path with an upper portion thereof in direct contact with the refrigerant flowing in the refrigerant flow path, a ball flange inserted into a lower portion of the cooling fin and provided by a material having a heat conduction characteristic of a set level and elasticity and in contact with the heating plate, and a driving member moving the cooling plate in a horizontal direction and a vertical direction.

18. A heat treatment apparatus characterized by comprising: ​ ​ ​ ​ ​

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