A PCB heat dissipation structure and related power supply device and electronic device

Abstract

The embodiment of the application discloses a PCB heat dissipation structure and related power supply equipment and electronic equipment, the structure comprises a mainboard and a ceramic substrate, the mainboard comprises a board main body, electronic components, a first metal piece and a second metal piece, one first metal piece corresponds to one second metal piece, the electronic components arranged on the first plate surface of the board main body are connected with the first metal piece, the mainboard is formed with a first heat conduction hole corresponding to penetrating one first metal piece, the board main body and one second metal piece, the surface of the first heat conduction hole is attached with a first metal connecting piece, the first metal connecting piece connects the first metal piece and the second metal piece, the ceramic substrate comprises a ceramic substrate, a third metal piece and a fourth metal piece, the third metal piece is arranged on the first plate surface of the ceramic substrate and is connected with the second metal piece, and the fourth metal piece is arranged on the second plate surface of the ceramic substrate and is used for being connected with a heat dissipation device. The PCB heat dissipation structure provided by the application has good heat dissipation effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic circuits, and particularly relates to a PCB heat dissipation structure and related power supply equipment and electronic equipment. BACKGROUND

[0002] In order to improve the heat dissipation effect of the PCB board and avoid damage of the PCB board due to high temperature, most of the current PCB board structures are usually connected with heat sinks to cool the PCB board. In the related art, the electronic components of the PCB board are usually connected with the heat sink by using heat-conducting insulating glue to ensure the heat dissipation effect of the PCB board. However, the heat-conducting effect of the heat-conducting insulating glue is limited, and the heat dissipation effect of the electronic components is not high enough. SUMMARY

[0003] The embodiments of the present application provide a PCB heat dissipation structure and power supply equipment, which aims to improve the heat dissipation effect of the PCB board.

[0004] In a first aspect, the present application provides a PCB heat dissipation structure, characterized in that the PCB heat dissipation structure comprises:

[0005] a main board, the main board comprising a board main body, electronic components, a first metal piece, and a second metal piece, the first metal piece and the second metal piece being respectively arranged on two opposite board surfaces of the board main body, and the first metal piece being arranged corresponding to the second metal piece, the board surface of the board main body connected with the first metal piece being defined as a first board surface of the board main body, and the board surface of the board main body connected with the second metal piece being defined as a second board surface of the board main body, the first board surface of the board main body being provided with the electronic components, and the electronic components arranged on the first board surface of the board main body being connected with the first metal piece, the main board being formed with a first heat-conducting hole corresponding to penetrating through the first metal piece, the board main body, and the second metal piece, a first metal connecting piece being attached to a surface of the first heat-conducting hole, and the first metal connecting piece connecting the first metal piece and the second metal piece; and

[0006] a ceramic substrate, the ceramic substrate comprising a ceramic substrate sheet, a third metal piece, and a fourth metal piece, the third metal piece being arranged on a first board surface of the ceramic substrate and connected with the second metal piece, the fourth metal piece being arranged on a second board surface of the ceramic substrate and used for being connected with a heat sink, the first board surface of the ceramic substrate being a board surface of two board surfaces of the ceramic substrate facing the board main body, and the second board surface of the ceramic substrate being a board surface of the two board surfaces of the ceramic substrate away from the board main body. Optionally, the second board surface of the board main body is also provided with the electronic components, and the PCB heat dissipation structure further comprises:

[0007] The connecting plate comprises a connecting main plate, a fifth metal piece and a sixth metal piece, the fifth metal piece is arranged on the first plate surface of the connecting main plate and connected with the second metal piece, the sixth metal piece is arranged on the second plate surface of the connecting main plate and connected with the third metal piece, the fifth metal piece is arranged corresponding to the sixth metal piece, the second heat conduction hole corresponding to the fifth metal piece, the connecting main plate and the sixth metal piece is formed, the surface of the second heat conduction hole is attached with the second metal connecting piece, the second metal connecting piece connects the fifth metal piece and the sixth metal piece, the first plate surface of the connecting main plate is the plate surface of the connecting main plate facing the plate body, and the second plate surface of the connecting main plate is the plate surface of the connecting main plate facing the ceramic substrate.

[0008] The connecting main plate is formed with a receiving groove, and the electronic component connected to the second plate surface of the plate body is located in the receiving groove.

[0009] Optionally, the receiving groove is provided with at least two, and the electronic component arranged on the second plate surface of the plate body is located in one of the receiving grooves.

[0010] Optionally, the receiving groove is arranged through the connecting main plate.

[0011] Optionally, if the electronic component arranged on the second plate surface of the plate body is located in the same electric circuit with the electronic component arranged on the first plate surface of the plate body, the electronic component arranged on the second plate surface of the plate body is connected with the second metal piece.

[0012] Optionally, the second plate surface of the plate body is further provided with a seventh metal piece, and the seventh metal piece is connected with the fifth metal piece.

[0013] If the electronic component arranged on the second plate surface of the plate body is located in different electric circuits with the electronic component arranged on the first plate surface of the plate body, the electronic component arranged on the second plate surface of the plate body is connected with the seventh metal piece.

[0014] Optionally, the first metal piece comprises a connecting part and at least one heat conduction part, the first heat conduction hole is arranged corresponding to the heat conduction part, the plate body and the second metal piece, the electronic component arranged on the first plate surface comprises a plurality of pins, and one pin is connected with the connecting part of one first metal piece.

[0015] Optionally, one first metal piece is connected with at least two electronic components arranged on the first plate surface of the plate body.

[0016] Optionally, the fourth metal pieces are provided in plurality, and the plurality of fourth metal pieces are arranged at intervals on the second plate surface of the ceramic substrate.

[0017] In a second aspect, the application provides a power supply device, which comprises a heat sink and the PCB heat dissipation structure.

[0018] The technical scheme of the application provides a PCB heat dissipation structure, which comprises a main plate and a ceramic substrate. The main plate comprises a plate main body, electronic components, a first metal piece and a second metal piece. The main plate is provided with a first heat conduction hole penetrating through the main plate. A first metal connecting piece attached to the surface of the first heat conduction hole connects the first metal piece and the second metal piece. The ceramic substrate comprises a ceramic substrate, a third metal piece and a fourth metal piece. The third metal piece is connected to the second metal piece, and the fourth metal piece is connected to a heat sink. The heat transfer process of the PCB heat dissipation structure is as follows: the heat generated by the operation of the electronic components first flows to the first metal piece through the circuit, and then is transferred to the second metal piece on the second plate surface of the plate main body through the first metal connecting piece attached to the surface of the first heat conduction hole. Then, the heat is transferred to the third metal piece through the second metal piece, and then the heat on the third metal piece is transferred to the fourth metal piece through the ceramic substrate. Finally, the heat is transferred to the heat sink through the fourth metal piece for heat dissipation. The PCB heat dissipation structure provided by the application uses metal and ceramic substrate for heat conduction, which has high heat conduction efficiency and good heat dissipation effect. In addition, the ceramic substrate is connected to the heat sink, which can effectively isolate the electronic components and the heat sink, and avoid the electrical conduction between the electronic components and the heat sink. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0020] Figure 1 The structural schematic diagram of the PCB heat dissipation structure provided by the embodiments of the application is shown in the figure.

[0021] Figure 2 The structural schematic diagram of the PCB heat dissipation structure provided by the embodiments of the application is shown in the figure.

[0022] Figure 3 The structural schematic diagram of the PCB heat dissipation structure provided by the embodiments of the application is shown in the figure. Figure 2 The structural schematic diagram of the PCB heat dissipation structure provided by the embodiments of the application is shown in the figure.

[0023] Figure 4 The structural schematic diagram of the PCB heat dissipation structure provided by the embodiments of the application is shown in the figure. Figure 1 The structural schematic diagram of the PCB heat dissipation structure provided by the embodiments of the application is shown in the figure.

[0024] Figure 5 for Figure 1 A schematic structural diagram showing a first board surface of a connecting board in the PCB heat dissipation structure shown;

[0025] Figure 6 for Figure 1 A schematic structural diagram showing the second board surface of the connecting board in the PCB heat dissipation structure shown;

[0026] Figure 7 for Figure 1 The schematic structural diagram of the first surface of the ceramic substrate in the PCB heat dissipation structure shown;

[0027] Figure 8 for Figure 1 The PCB heat dissipation structure shown is a schematic structural diagram of the second surface of the ceramic substrate.

[0028] Description of Figure Numbers:

[0029] 100. PCB heat dissipation structure; 10. Main board; 10a. First thermal conductive hole; 10b. Through hole; 11. Board body; 13. Electronic components; 15. First metal part; 17. Second metal part; 19. First metal connector; 21. Seventh metal part; 30. Connecting plate; 30a. Second thermal conductive hole; 30b. Receiving groove; 31. Connecting main board; 33. Fifth metal part; 35. Sixth metal part; 37. Second metal connector; 50. Ceramic substrate; 51. Ceramic substrate; 53. Third metal part; 55. Fourth metal part; 70a. Connecting hole. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the present application, in order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application, and preferred embodiments of the present application are provided in the accompanying drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of the present application. The present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0031] In addition, the terms "first", "second", etc. are used only for descriptive purposes and are not to be construed as indicating or implying relative importance or an indicated number of technical features. Therefore, the features defined as "first", "second", etc. can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly and specifically limited. In the description of the present application, the meaning of "several" is at least one, such as one, two, etc., unless otherwise explicitly and specifically limited.

[0032] The PCB board generally includes a substrate circuit structure and a multi-layer circuit structure. Among them, the substrate circuit structure can only set the circuit on one side of the substrate and connect electronic components. Because the substrate circuit structure cannot make a complex circuit system, the power density of the substrate circuit structure is difficult to improve. In contrast, the multi-layer circuit structure can be provided with multi-layer circuits and can be connected and installed on both sides of the substrate to produce high-power density products.

[0033] In related technologies, in order to improve the heat dissipation effect of the PCB board and avoid damage to the PCB board due to high temperature, whether it is a substrate circuit structure or a multi-layer circuit structure, the PCB board and the heat sink are connected by a heat-conducting insulating adhesive to ensure the heat dissipation effect of the PCB board. However, the heat-conducting effect of the heat-conducting insulating adhesive is limited, and the heat dissipation effect of the electronic components is not high enough.

[0034] In view of the above problems, see Figures 1 to 8 The present application provides a PCB heat dissipation structure 100 and a power supply device. The PCB heat dissipation structure 100 related to the embodiments of the present application can be applied to handheld devices, vehicle-mounted devices, wearable devices, computer devices and other electronic devices, and can also be applied to power supply devices or inverters and other structures.

[0035] See Figures 1 to 8The application provides a PCB heat dissipation structure 100, which comprises a main plate 10 and a ceramic substrate 50. The main plate 10 comprises a plate body 11, an electronic component 13, a first metal piece 15 and a second metal piece 17. The first metal piece 15 and the second metal piece 17 are arranged on two opposite plate surfaces of the plate body 11 respectively, and the first metal piece 15 is arranged correspondingly to the second metal piece 17. The plate surface of the plate body 11 connected with the first metal piece 15 is defined as the first plate surface of the plate body 11, and the plate surface of the plate body 11 connected with the second metal piece 17 is defined as the second plate surface of the plate body 11. The electronic component 13 is arranged on the first plate surface of the plate body 11, and the electronic component 13 arranged on the first plate surface of the plate body 11 is connected with the first metal piece 15. The main plate 10 is formed with a first heat conduction hole 10a corresponding to penetrating through the first metal piece 15, the plate body 11 and the second metal piece 17. The surface of the first heat conduction hole 10a is attached with a first metal connecting piece 19, and the first metal connecting piece 19 is connected with the first metal piece 15 and the second metal piece 17. The ceramic substrate 50 comprises a ceramic substrate 51, a third metal piece 53 and a fourth metal piece 55. The third metal piece 53 is arranged on the first plate surface of the ceramic substrate 50 and connected with the second metal piece 17. The fourth metal piece 55 is arranged on the second plate surface of the ceramic substrate 51 and used for being connected with a heat sink. The first plate surface of the ceramic substrate 51 is the plate surface of the two plate surfaces of the ceramic substrate 51 facing the plate body 11, and the second plate surface of the ceramic substrate 51 is the plate surface of the two plate surfaces of the ceramic substrate 51 away from the plate body 11.

[0036] The first metal piece 15, the second metal piece 17, the first metal connecting piece 19, the third metal piece 53 and the fourth metal piece 55 can be made of copper, aluminum or gold. The metal material has excellent heat conduction performance, which can effectively improve the efficiency and effect of heat energy generated by the electronic component 13 to the heat sink. In the embodiment, the material of the first metal piece 15, the second metal piece 17, the first metal connecting piece 19, the third metal piece 53 and the fourth metal piece 55 can be copper, so as to reduce the manufacturing cost of the PCB heat dissipation structure 100.

[0037] The shapes of the first metal piece 15 and the second metal piece 17 can be any shape such as a circle, a square, or an irregular shape, and the like, and are not limited herein. The shapes of the first metal piece 15 and the second metal piece 17 can be designed according to the structure of the circuit of the main board 10, for example, can be arranged at a position where no circuit is formed on the main board 10 or at a position where no electronic component 13 is mounted on the main board 10, as long as the electronic component 13 is connected and the circuit system is not affected. The shapes of the first metal piece 15 and the second metal piece 17 can be the same or different, and can be set according to actual needs, as long as the first metal connecting piece 19 attached to the surface of the first heat-conducting hole 10a can connect the first metal piece 15 and the second metal piece 17 to achieve heat conduction. The number of the first metal piece 15 and the second metal piece 17 can be set according to the circuit system of the main board 10, and is not limited herein. The number of the second metal piece 17 can be set corresponding to the number of the first metal piece 15, so as to ensure that the first metal piece 15 is connected to the second metal piece 17, avoid cross conduction of the circuit, and ensure the reliability of the circuit system of the main board 10.

[0038] The electronic component 13 connected in different circuits is connected to different first metal pieces 15 to avoid cross interference of the circuit.

[0039] The main board 10 can be a power board for setting and mounting electronic components 13 and main circuit systems, and a single main board 10 can realize all functions of the circuit system. The main board 10 can be a substrate circuit structure or a multi-layer board circuit structure. When the main board 10 is a substrate circuit structure, the electronic components 13 on the main board 10 can be all mounted on the first board surface of the board body 11, i.e., the board surface of the board body 11 away from the ceramic substrate 51. In an embodiment, when the electronic components 13 are all arranged on the first board surface of the board body 11, the main board 10 and the ceramic substrate 50 can be directly connected. At this time, the positions of the second metal pieces 17 can be set corresponding to the positions of the third metal pieces 53, so as to position the main board 10 and the ceramic substrate 50 when they are assembled, thereby ensuring the accuracy of the assembly position of the PCB heat dissipation structure 100 and improving the convenience of the assembly of the PCB heat dissipation structure 100. When the main board 10 is a multi-layer board circuit structure capable of preparing high-power density products, the opposite two sides of the board body 11 can both be mounted with electronic components 13, and at this time, the ceramic substrate 50 is connected to at least one side of the board body 11 connected with the electronic components 13.

[0040] The ceramic substrate 50 can be an insulating and heat-conducting material such as alumina (AlO) ceramic or aluminum nitride (AlN) ceramic, so as to ensure the heat-conducting and insulating effect of the ceramic substrate 50. The ceramic substrate 50 has high thermal conductivity, which can ensure the efficiency of heat energy transmission between the third metal piece 53 and the fourth metal piece 55, thereby ensuring the heat dissipation effect of the entire heat dissipation process of the electronic component 13. In addition, the ceramic substrate 50 also has high temperature resistance, which can avoid the problem of damage due to the excessively high temperature of the transmitted heat energy. Meanwhile, the ceramic substrate 50 is also an electrical insulator, which can effectively prevent the electrical conduction between the circuit of the mainboard 10 and the heat sink. In addition, the ceramic substrate 50 also has good anti-radiation effect, and the use of the ceramic substrate 50 in the PCB heat dissipation structure 100 can also reduce the influence of the external environment on the performance of the mainboard 10.

[0041] The technical scheme of the present application provides a PCB heat dissipation structure 100, which comprises a mainboard 10 and a ceramic substrate 50. The mainboard 10 comprises a mainboard body 11, an electronic component 13, a first metal piece 15, and a second metal piece 17. The mainboard 10 is provided with a first heat-conducting hole 10a, and a first metal connecting piece 19 attached to the surface of the first heat-conducting hole 10a connects the first metal piece 15 and the second metal piece 17. The ceramic substrate 50 comprises a ceramic substrate 51, a third metal piece 53, and a fourth metal piece 55. The third metal piece 53 is connected to the second metal piece 17, and the fourth metal piece 55 is connected to the heat sink. The heat transfer process of the PCB heat dissipation structure 100 is as follows: the heat energy generated by the operation of the electronic component 13 first flows to the first metal piece 15 through the circuit, and then is transmitted to the second metal piece 17 on the second surface of the mainboard body 11 by the first metal connecting piece 19 attached to the surface of the first heat-conducting hole 10a. Then, the heat energy is transmitted to the third metal piece 53 by the second metal piece 17, and then the heat energy on the third metal piece 53 is transmitted to the fourth metal piece 55 by the ceramic substrate 51. Finally, the heat energy is transmitted to the heat sink for heat dissipation by the fourth metal piece 55. The PCB heat dissipation structure 100 provided in the present application only uses metal and the ceramic substrate 51 for heat conduction in the entire heat dissipation process. In addition, the ceramic substrate 50 is connected to the heat sink, which can effectively isolate the electronic component 13 and the heat sink, thereby avoiding the electrical conduction between the electronic component 13 and the heat sink.

[0042] It can be understood that the circuit board itself is usually processed to form through holes 10b, which include plating through holes (PTH) and non-plating through holes (NPTH). By connecting the first metal piece 15 and the second metal piece 17 through the first heat-conducting hole 10a arranged on the main plate 10, not only the heat dissipation effect of the PCB heat dissipation structure 100 can be effectively guaranteed, but also the first heat-conducting hole 10a can be processed and manufactured at the same time as the through hole 10b is processed and manufactured, thereby reducing the manufacturing and processing difficulty of the PCB heat dissipation structure 100 and reducing the processing cost. Moreover, the first metal connecting piece 19 attached to the surface of the first heat-conducting hole 10a can also dissipate heat through the first heat-conducting hole 10a, which can further improve the heat dissipation effect.

[0043] It can be understood that at least two electronic components 13 are usually arranged on the same board surface of the board body 11. Specifically, the electronic components 13 can be two, three, four or more, which are not limited here. It can be understood that the multiple electronic components 13 arranged on the board body 11 can be of the same kind or of different kinds. The size specifications of the multiple electronic components 13 can be the same or different. Therefore, the maximum vertical distance of the at least two electronic components 13 arranged on the same board surface relative to the board surface of the board body 11 is not completely the same, that is, the multiple electronic components 13 connected on the same board surface of the board body 11 have a height difference relative to the board surface of the board body 11. The thickness of the conventional ceramic substrate 50 on the market is usually thin, and when the electronic components 13 are arranged on the second board surface of the board body 11, the commonly used ceramic substrate 50 cannot be adjusted to adapt to the height difference between the electronic components 13 arranged on the second board surface of the board body 11.

[0044] Referring to Figures 1 to 3In an embodiment of the present application, the second plate surface of the plate body 11 is also provided with the electronic component 13, and the PCB heat dissipation structure 100 further comprises a connecting plate 30, the connecting plate 30 comprising a connecting main plate 31, a fifth metal piece 33 and a sixth metal piece 35, the fifth metal piece 33 being arranged on the first plate surface of the connecting main plate 31 and connected with the second metal piece 17, the sixth metal piece 35 being arranged on the second plate surface of the connecting main plate 31 and connected with the third metal piece 53, the fifth metal piece 33 corresponding to the sixth metal piece 35, the connecting plate 30 being formed with a second heat conduction hole 30a corresponding to the fifth metal piece 33, the connecting main plate 31 and the sixth metal piece 35, the surface of the second heat conduction hole 30a being attached with a second metal connecting piece 37, the second metal connecting piece 37 connecting the fifth metal piece 33 and the sixth metal piece 35, the first plate surface of the connecting main plate 31 being the plate surface of the two plate surfaces of the connecting main plate 31 facing the plate body 11, and the second plate surface of the connecting main plate 31 being the plate surface of the two plate surfaces of the connecting main plate 31 facing the ceramic substrate 51; the connecting main plate 31 being formed with a receiving groove 30b, and the electronic component 13 connected to the second plate surface of the plate body 11 being located in the receiving groove 30b.

[0045] In the embodiment, the electronic component 13 is arranged on both sides of the plate body 11, thereby increasing the range of arrangement of the electronic component 13 and improving the performance of the main plate 10.

[0046] In the embodiment, the connecting plate 30 can be assembled by different materials, i.e. the first metal connecting piece 19 can be made of a material with good heat conduction performance, such as copper, aluminum, silver and other metal materials, and the connecting main plate 31 can be made of other materials with low cost, for example, the connecting main plate 31 can be a plastic plate. Of course, in order to facilitate the manufacturing and processing, the connecting plate 30 can also be a circuit board without formed circuit.

[0047] In the embodiment, the second metal connecting piece 37 can be attached to the hole surface of the second heat conduction hole 30a by coating or plating. By arranging the second heat conduction hole 30a on the connecting plate 30 to connect the fifth metal piece 33 and the sixth metal piece 35, the heat dissipation effect of the PCB heat dissipation structure 100 can be ensured, and the manufacturing and processing difficulty of the PCB heat dissipation structure 100 can be reduced, thereby reducing the processing cost. Moreover, the second metal connecting piece 37 can also dissipate heat through the second heat conduction hole 30a, thereby further improving the heat dissipation effect.

[0048] In the working process of the main plate 10, the electronic component 13 connected to both sides of the plate body 11 will generate heat, and the heat energy of the electronic component 13 can be transmitted to the second metal piece 17, and then transmitted to the fifth metal piece 33 of the connecting plate 30 by the second metal piece 17, and then transmitted to the sixth metal piece 35 by the second metal connecting piece 37 attached to the surface of the second heat conduction hole 30a, so as to be transmitted to the second metal piece 17 of the ceramic substrate 50 by the sixth metal piece 35.

[0049] It can be understood that the opening of the accommodating groove 30b provided on the connecting plate 30 is arranged towards the electronic component 13 provided on the second plate surface of the plate body 11, and at least part of the structure of the electronic component 13 will be correspondingly inserted into the accommodating groove 30b. In this way, not only can the positioning be performed through the electronic component 13 and the accommodating groove 30b when the main plate 10 and the connecting plate 30 are assembled, but also the electronic component 13 can be prevented from being exposed, and the risk of damage to the electronic component 13 can be reduced. In addition, the accommodating groove 30b provided on the connecting plate 30 is also used to adapt to the height difference between different electronic components 13, so as to accommodate electronic components 13 of different size specifications, so that the main plate 10 is stably connected to the ceramic substrate 50, the stability and reliability of the connection between the plate body 11, the connecting plate 30 and the ceramic substrate 50 are ensured, and the relative inclination between the plate surfaces of the plates is avoided to interfere with each other. Moreover, when the connecting plate 30 is used to realize leveling, the heat sink does not need to be correspondingly provided with a groove for accommodating the electronic component 13, and the PCB heat dissipation structure 100 can be connected to the flat surface of the heat sink. In this way, the PCB heat dissipation structure 100 can be adapted to more types of heat sinks, the adaptability of the PCB heat dissipation structure 100 to the heat sink is improved, and the design and processing cost of the heat sink is reduced, which facilitates batch processing of the heat sink.

[0050] It can be understood that one accommodating groove 30b can accommodate at least one electronic component 13. In an example embodiment of the present application, referring to Figure 2 and Figure 5 In an example embodiment of the present application, the accommodating groove 30b is provided with at least two, and the electronic component 13 provided on the second plate surface of the plate body 11 is located in one of the accommodating grooves 30b.

[0051] In the present embodiment, when one electronic component 13 is correspondingly installed in one accommodating groove 30b, the shape of each accommodating groove 30b can be set according to the shape of the electronic component 13 corresponding thereto, so as to further improve the stability of the connection between the electronic component 13 and the connecting plate 30, and avoid the positional deviation of the main plate 10 relative to the connecting plate 30. Moreover, in this way, the installation position of the main plate 10 and the connecting plate 30 can be more accurately positioned through the electronic component 13 and the accommodating groove 30b, and the accuracy of the connection position is ensured.

[0052] Referring to Figure 2 , Figure 5 and Figure 6In an example of the present application, the accommodating groove 30b is arranged through the connecting main plate 31. That is, the accommodating groove 30b can be a through groove. In this way, the size of the accommodating groove 30b can be reduced, and the processing of the accommodating groove 30b is facilitated. In addition, in this way, some electronic components 13 with a relatively large thickness can directly pass through the accommodating groove 30b and contact the ceramic substrate 51 for heat conduction, thereby further improving the heat dissipation efficiency. In the present example, the accommodating groove 30b is arranged as a through groove, which can further miniaturize and lighten the PCB heat dissipation structure 100.

[0053] Of course, in other examples, the depth of the accommodating groove 30b can also be arranged according to the thickness of the electronic components 13 arranged on the second plate surface of the plate body 11, and no further limitation is made herein.

[0054] Referring to Figure 2 and Figure 4 In an example of the present application, if the electronic components 13 arranged on the second plate surface of the plate body 11 are in the same electric circuit as the electronic components 13 arranged on the first plate surface of the plate body 11, the electronic components 13 arranged on the second plate surface of the plate body 11 are connected to the second metal piece 17.

[0055] In the present example, not only the electrical connection between the electronic components 13 in the same electric circuit can be achieved, but also the heat generated by the operation of the electronic components 13 can be transmitted to the second metal piece 17, and then transmitted to the heat sink through the connecting plate 30 and the ceramic substrate 50. In the present example, by connecting the electronic components 13 arranged on the opposite plate surfaces of the plate body 11 in the same electric circuit to the same second metal piece 17, the number of second metal pieces 17 can be reduced, and the design and manufacturing cost can be reduced.

[0056] Referring to Figure 2 and Figure 4 In an example of the present application, the second plate surface of the plate body 11 is further provided with a seventh metal piece 21, and the seventh metal piece 21 is connected to the fifth metal piece 33. If the electronic components 13 arranged on the second plate surface of the plate body 11 are in different electric circuits from the electronic components 13 arranged on the first plate surface of the plate body 11, the electronic components 13 arranged on the second plate surface of the plate body 11 are connected to the seventh metal piece 21.

[0057] In the embodiment, the electronic components 13 on the second plate surface of the plate body 11 connected with the seventh metal piece 21 are not connected with the electronic components 13 on the first plate surface of the plate body 11. In this way, the seventh metal piece 21 can ensure that the heat generated by the electronic components 13 in the electric circuit formed between the electronic components 13 on the second plate surface of the plate body 11 is transmitted to the fifth metal piece 33 on the connecting plate 30 through the seventh metal piece 21, and finally transmitted to the heat sink. At this time, the number of the fifth metal piece 33 can be equal to the sum of the number of the second metal piece 17 and the number of the seventh metal piece 21. One fifth metal piece 33 is connected with one second metal piece 17 or one seventh metal piece 21.

[0058] In an example embodiment of the present application, the first metal piece 15 includes a connecting portion and at least one heat conduction portion, the first heat conduction hole 10a is arranged through the heat conduction portion, the plate body 11 and the second metal piece 17, and the electronic components 13 on the first plate surface include a plurality of pins, one pin is connected with one connecting portion of the first metal piece 15.

[0059] In the embodiment, one pin can be connected with one, two or more heat conduction portions through the connecting portion, and the number of the heat conduction portions can be arranged according to the space layout of the plate body 11.

[0060] In the embodiment, the number of the heat conduction portions and the area of the heat conduction portions can be increased as much as possible according to the space layout of the plate body 11, so as to increase the connection and heat conduction efficiency between the first metal piece 15 and the second metal piece 17, and further improve the heat dissipation efficiency and effect of the electronic components 13 connected with the first metal piece 15.

[0061] In order to further improve the efficiency of heat energy transmission from the first metal piece 15 to the second metal piece 17 and improve the heat dissipation effect of the heat energy, the number of the first heat conduction holes 10a through the corresponding arranged heat conduction portions and the second metal piece 17 can be increased, or the aperture of the first heat conduction holes 10a through the corresponding arranged heat conduction portions and the second metal piece 17 can be increased.

[0062] In an example embodiment of the present application, one first metal piece 15 is connected with at least two electronic components 13 arranged on the first plate surface of the plate body 11.

[0063] In the embodiment, the at least two electronic components 13 arranged on the first plate surface of the plate body 11 connected with the same first metal piece 15 are located in the same electric circuit. When the at least two electronic components 13 are connected with the same first metal piece 15, the space position for arranging the first metal piece 15, the second metal piece 17 and other structures in the space layout of the main plate 10 can be reduced, so as to avoid the insufficient layout space affecting the operation of the circuit system or affecting the heat dissipation effect.

[0064] It can be understood that when the space position available for disposing the first metal piece 15 and the second metal piece 17 in the layout space of the plate body 11 is enough, each electronic component 13 disposed on the first plate face of the plate body 11 in the same electric circuit can also be connected with different first metal pieces 15, so as to facilitate the reasonable design of the layout of the electronic components 13 and simplify the difficulty of connecting the electronic components 13 and the first metal pieces 15 while ensuring that each electronic component 13 is connected with the first metal piece 15 for heat conduction.

[0065] Referring to Figure 2 and Figure 8 In an example embodiment of the present application, the fourth metal piece 55 is provided in plurality, and the plurality of fourth metal pieces 55 are arranged at intervals on the second plate face of the ceramic substrate 51.

[0066] It can be understood that the fourth metal piece 55 can be circular, square or any other shape, which is not limited here. The fourth metal piece 55 is provided in plurality, and the plurality of fourth metal pieces 55 are arranged at intervals, which can reduce the stress of the connection between the ceramic substrate 50 and the heat sink, facilitate the connection and installation of the PCB heat dissipation structure 100 and the heat sink, and improve the stability of the connection between the PCB heat dissipation structure 100 and the heat sink. In addition, the provision of the plurality of fourth metal pieces 55 can also ensure the range of the distribution of the fourth metal pieces 55 on the ceramic substrate 51, ensure that the contact area between the fourth metal pieces 55 and the heat sink is large enough, thereby improving the efficiency of the heat energy on the ceramic substrate 51 to the heat sink and improving the heat dissipation effect.

[0067] In the embodiments of the present application, in order to ensure the heat conduction between the plates and the heat transfer effect between the metal parts, the two adjacent metal parts need to be in contact with each other. Taking the connection of the main plate 10 to the ceramic substrate 50 through the connecting plate 30 as an example, in order to ensure the heat transfer between the main plate 10, the connecting plate 30, the ceramic substrate 50, and the heat sink, that is, to ensure the connection between the second metal part 17 and the fifth metal part 33, the connection between the seventh metal part 21 and the fifth metal part 33, the connection between the sixth metal part 35 and the third metal part 53, and the connection between the fourth metal part 55 and the heat sink in the above embodiments. The above-mentioned various connection modes can adopt the mode of directly abutting contact for heat transfer. Specifically, in the present embodiment, the main plate body 11, the connecting plate 31, the ceramic substrate 51, and the heat sink can be connected by clamping, screw or bolt connection, etc. so that the above-mentioned two adjacent metal parts can be in abutting contact for heat transfer. Of course, in other embodiments, the second metal part 17 and the fifth metal part 33, the seventh metal part 21 and the fifth metal part 33, the sixth metal part 35 and the third metal part 53, and the fourth metal part 55 and the heat sink can be connected and contacted by welding, so as to ensure the connection and contact of the two adjacent metal parts while connecting and fixing the main plate 10, the connecting plate 30, the ceramic substrate 50, and the heat sink, ensuring the stability of the connection and fixation of the PCB heat dissipation structure 100, and avoiding the influence of the heat dissipation of the electronic components 13 due to the disconnection of the adjacent metal parts. In a specific implementation, after welding, the second plate surface of the main plate body 11 can be directly contacted with the first plate surface of the connecting plate 31, the second plate surface of the connecting plate 31 can be directly contacted with the first plate surface of the ceramic substrate 51, and the second plate surface of the ceramic substrate 51 can be directly contacted with the heat sink, so as to ensure the tightness of the structure connection, improve the connection strength between the structures, and avoid the entry of dust and other impurities.

[0068] In order to improve the stability of the connection between the main board 10, the ceramic substrate 50, the connecting plate 30 and the heat sink, the main board 10, the ceramic substrate 50, the connecting plate 30 and the heat sink can be further locked by screws or bolts on the basis of welding, so as to further improve the stability of the connection assembly between structures. For example, during the connection, screw holes can be arranged on the heat sink, and connecting holes 70a can be arranged on at least two of the main board 10, the ceramic substrate 50 and the connecting plate 30. For example, the second metal piece 17 can be welded with the fifth metal piece 33 to connect the main board 31 and the connecting plate 30, and the connecting holes 70a can be arranged on the connecting plate 30 and the ceramic substrate 50. The screws or bolts are locked in the screw holes of the heat sink through the connecting holes 70a, so as to connect and fix the main board 10, the ceramic substrate 50, the connecting plate 30 and the heat sink. In order to facilitate the alignment and assembly of the PCB heat dissipation structure 100 and the heat sink, threaded studs can be arranged on the side of the heat sink facing the PCB heat dissipation structure 100, and screw holes are arranged in the threaded studs and extend along the central axis direction of the threaded studs. During the assembly, the ceramic substrate 50, the connecting plate 30 and the main board 10 can be sequentially sleeved outside the threaded studs according to the positional relationship, and then the screws or bolts are inserted into the screw holes and abut against the first plate surface of the main board 10 in position, so as to limit and lock the relative position of the PCB heat dissipation structure 100 and the heat sink.

[0069] In the above embodiments, when the screws or bolts are used for connection, in order to improve the stability of the connection, the connecting holes 70a and the screw holes can be correspondingly provided with a plurality of connecting holes 70a. In order to further improve the stability, a plurality of connecting holes 70a can be symmetrically arranged. Meanwhile, during the arrangement of the connecting holes 70a, in order to avoid interfering with the mounting and arrangement of the electronic components 13, the plurality of connecting holes 70a can be arranged at the positions adjacent to the edges of the main board 10, the ceramic substrate 50 or the connecting plate 30.

[0070] The application also provides a power supply device, which comprises a heat sink and a PCB heat dissipation structure 100. The specific structure of the PCB heat dissipation structure 100 is described in the above embodiments. Since the power supply device adopts all the technical solutions of the above embodiments, it has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described here.

[0071] The power supply device can be a switching power supply, etc. The heat sink can be a sheet structure, i.e., a heat sink fin, and the fourth metal piece 55 is connected to one side surface thereof. Alternatively, the heat sink can include a mounting plate and a plurality of heat dissipation fins, the plurality of heat dissipation fins are connected to the same plate surface of the mounting plate at intervals, and the fourth metal piece 55 is connected to the side plate surface of the mounting plate away from the heat dissipation fins. The material of the mounting plate and the heat dissipation fins can be metal, such as aluminum, copper, gold, etc., to ensure the high efficiency of heat exchange between the third heat conduction piece and the heat sink. Specifically, the heat sink can absorb the heat energy on the second metal connecting piece 37 and can exchange heat with the space environment, thereby dissipating the absorbed heat energy, reducing the temperature, and ensuring that the electronic components 13 can continuously dissipate heat.

[0072] To further improve the heat dissipation effect of the PCB heat dissipation structure 100, the power supply device can further include an air cooling structure and / or a water cooling structure, both of which can act on the heat sink to cool the heat sink and further accelerate the cooling efficiency of the heat sink. For example, the power supply device can further include a fan, and the fan acts on the heat sink to improve the cooling effect of the heat sink.

[0073] The above embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the patent of the present application. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application should be subject to the appended claims.

Claims

1. A PCB heat dissipation structure, characterized in that, The PCB heat dissipation structure comprises a main plate and a ceramic substrate The main plate comprises a plate body, electronic components, a first metal piece and a second metal piece, the first metal piece and the second metal piece are respectively arranged on two opposite plate surfaces of the plate body, the first metal piece is arranged corresponding to the second metal piece, the plate surface of the plate body connected with the first metal piece is defined as the first plate surface of the plate body, and the plate surface of the plate body connected with the second metal piece is defined as the second plate surface of the plate body, wherein the first plate surface and the second plate surface of the plate body are both provided with the electronic components, the electronic components arranged on the first plate surface of the plate body are connected with the first metal piece, the electronic components arranged on the second plate surface of the plate body are connected with the second metal piece, the main plate is formed with a first heat conduction hole corresponding to penetrating through the first metal piece, the plate body and the second metal piece, the surface of the first heat conduction hole is attached with a first metal connecting piece, and the first metal connecting piece connects the first metal piece and the second metal piece; and The ceramic substrate comprises a ceramic substrate, a third metal piece and a fourth metal piece, the third metal piece is arranged on the first plate surface of the ceramic substrate and connected with the second metal piece, the fourth metal piece is arranged on the second plate surface of the ceramic substrate and used for connecting with a heat sink, the second plate surface of the ceramic substrate is in contact with the heat sink, the first plate surface of the ceramic substrate is the plate surface of the two plate surfaces of the ceramic substrate facing the plate body, and the second plate surface of the ceramic substrate is the plate surface of the two plate surfaces of the ceramic substrate away from the plate body; The PCB heat dissipation structure further comprises a connecting plate The connecting plate comprises a connecting main plate, a fifth metal piece and a sixth metal piece, the fifth metal piece is arranged on the first plate surface of the connecting main plate and welded with the second metal piece, the sixth metal piece is arranged on the second plate surface of the connecting main plate and welded with the third metal piece, the fifth metal piece is arranged corresponding to the sixth metal piece, the connecting plate is formed with a second heat conduction hole corresponding to penetrating through the fifth metal piece, the connecting main plate and the sixth metal piece, the surface of the second heat conduction hole is attached with a second metal connecting piece, the second metal connecting piece connects the fifth metal piece and the sixth metal piece, the first plate surface of the connecting main plate is the plate surface of the two plate surfaces of the connecting main plate facing the plate body, the second plate surface of the connecting main plate is the plate surface of the two plate surfaces of the connecting main plate facing the ceramic substrate, the connecting main plate is formed with an accommodating groove, the electronic components connected with the second plate surface of the plate body are located in the accommodating groove, the first plate surface of the connecting main plate is in contact with the second plate surface of the plate body, and the second plate surface of the connecting main plate is in contact with the first plate surface of the ceramic substrate. The first metal pieces and the second metal pieces are provided in plurality, the first metal piece comprises a connecting portion and at least one heat conducting portion, the first heat conducting hole is provided through the heat conducting portion, the plate body and the second metal piece, the electronic components provided on the first plate surface comprise a plurality of pins, one pin is connected with the connecting portion of one first metal piece, and the connecting portion is connected with the at least one heat conducting portion.

2. The PCB heat dissipation structure of claim 1, wherein, The accommodating grooves are provided in at least two, the electronic components provided on the second plate surface of the plate body are located in one accommodating groove.

3. The PCB heat dissipation structure of claim 1, wherein, The accommodating grooves are provided through the connecting main plate.

4. The PCB heat dissipation structure of claim 1, wherein, If the electronic components provided on the second plate surface of the plate body and the electronic components provided on the first plate surface of the plate body are located in the same electric circuit, the electronic components provided on the second plate surface of the plate body are connected with the second metal piece.

5. The PCB heat dissipation structure of claim 1, wherein, The second plate surface of the plate body is further provided with a seventh metal piece, and the seventh metal piece is connected with the fifth metal piece. If the electronic components provided on the second plate surface of the plate body and the electronic components provided on the first plate surface of the plate body are located in different electric circuits, the electronic components provided on the second plate surface of the plate body are connected with the seventh metal piece.

6. The PCB heat dissipation structure according to any one of claims 1 to 5, wherein, One first metal piece is connected with at least two electronic components provided on the first plate surface of the plate body.

7. A power supply device characterized by comprising: The power supply device comprises a heat sink and the PCB heat dissipation structure as claimed in any one of claims 1 to 6.

8. An electronic device, comprising: The electronic device comprises a heat sink and the PCB heat dissipation structure as claimed in any one of claims 1 to 6.

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