A production method for a single rectifier bridge

Abstract

The present invention discloses a method for producing a single-unit rectifier bridge, relating to the field of semiconductor product welding technology. The method comprises the following steps: S1: sequentially placing a lower soldering sheet, a chip, and an upper soldering sheet into a pre-welding mold, which is then placed into a welding furnace to produce a pre-welded die; S2: sequentially loading the soldering mold with lower leads, the pre-welded die from step S1, and the upper leads, which is then placed into a welding furnace for welding to produce a single-unit rectifier bridge. The present invention solves the technical problem of existing lead placement errors, which affects the quality of rectifier bridges.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor product welding, and in particular to a production method of a monomer rectifier bridge. Background Art

[0002] In the semiconductor product soldering industry, when soldering a single rectifier bridge, the industry typically pre-solders the solder lugs and chips using a pre-soldering mold and a tunnel furnace. The different leads are then manually inserted into the soldering mold. The pre-soldered chips are then placed in the assembly mold and soldered through the tunnel furnace to form a semi-finished product. This manual assembly method is inefficient and lacks anti-reverse features, making it easy for human negligence to cause incorrect lead usage. The manual insertion of leads not only contaminates the lead surface plating, resulting in poor appearance, but also easily impacts the pre-soldered die, leading to poor post-package testing and resulting in scrapped materials. Summary of the Invention

[0003] The purpose of the present invention is to provide a production method for a single rectifier bridge, which solves the technical problem in the prior art that lead placement is prone to errors, thereby affecting the quality of the rectifier bridge.

[0004] The present invention discloses a method for producing a single rectifier bridge, comprising the following steps:

[0005] S1: Pour the lower solder sheet, chip and upper solder sheet into the pre-soldering mold in sequence, and then send it into the welding furnace to obtain pre-soldering grains;

[0006] S2: The lower lead, the pre-welded die in step S1, and the upper lead are sequentially loaded onto the welding mold, and then the mold is placed into a welding furnace for welding to obtain a single rectifier bridge;

[0007] The specific steps of filling the lower lead in step S2 are as follows:

[0008] S201: placing a first positioning plate with a first feeding trough on the welding mold, then placing a sliver assembly loaded with a first lower lead on the first positioning plate, opening the sliver assembly, allowing the first lower lead to fall from the first feeding trough into the welding groove of the welding mold, and finally removing the first positioning plate to complete loading of the first lower lead;

[0009] S202: placing a second positioning plate with a second feeding trough on the welding mold, then placing a comb assembly loaded with the second lower lead on the second positioning plate, opening the comb assembly, allowing the second lower lead to fall from the second feeding trough into the welding groove of the welding mold, and finally removing the second positioning plate to complete the loading of the second lower lead;

[0010] The specific steps of loading the pre-welded die in step S2 are as follows:

[0011] S203: First, connect the chip suction pen to the vacuum tube, suck the P side or N side of the pre-welded die in step S1, then move it above the soldering mold, remove the vacuum tube, make the pre-welded die fall into the soldering groove of the soldering mold, and then remove the chip suction pen;

[0012] The specific steps of filling the upper lead in step S2 are as follows:

[0013] S204: placing a third positioning plate with a third feeding trough on the welding mold, then placing a comb assembly loaded with the first upper lead on the third positioning plate, opening the comb assembly, allowing the first upper lead to fall from the third feeding trough into the welding groove of the welding mold, and finally removing the third positioning plate to complete the loading of the first upper lead;

[0014] S205: Place a fourth positioning plate with a fourth feed trough on the welding mold, then place the comb assembly with the second upper lead on the fourth positioning plate, open the comb assembly, so that the second upper lead falls from the fourth feed trough into the welding groove of the welding mold, and finally remove the fourth positioning plate to complete the loading of the second upper lead.

[0015] This application first uses a variety of different positioning plates to achieve separate placement of leads, thereby improving the assembly efficiency of the rectifier bridge and avoiding misalignment of the leads, thereby ensuring product quality.

[0016] Based on the above technical solution, the embodiment of the present application can also be improved as follows:

[0017] Furthermore, the specific steps of step S1 are as follows:

[0018] S101: pouring solder flakes into a solder flake sieve tray, connecting the solder flake sieve tray to a vacuum tube, shaking the solder flake sieve tray so that some solder flakes are adsorbed in the solder flake sieve tray, and turning the solder flake sieve tray over to remove excess solder flakes;

[0019] S102: placing the solder sheet sieve plate on the pre-soldering mold, removing the vacuum tube, and allowing the solder sheet to fall into the pre-soldering mold as the lower solder sheet;

[0020] S103: Pour the chips into a chip sieve tray, connect the chip sieve tray to a vacuum tube, shake the chip sieve tray so that some chips are adsorbed into the chip sieve tray, and then flip the chip sieve tray to remove excess chips;

[0021] S104: placing the chip sieve plate on the pre-soldering mold in step S102, removing the vacuum tube, and allowing the chip to fall into the pre-soldering mold;

[0022] S105: pouring solder flakes into a solder flake sieve tray, connecting the solder flake sieve tray to a vacuum tube, shaking the solder flake sieve tray so that some solder flakes are adsorbed in the solder flake sieve tray, and turning the solder flake sieve tray over to remove excess solder flakes;

[0023] S106: placing the solder sheet sieve plate on the pre-soldering mold, removing the vacuum tube, and allowing the solder sheet to fall into the pre-soldering mold as an upper solder sheet;

[0024] S107: Send the pre-welding mold in step S106 into the welding furnace for welding to obtain pre-welded grains. The beneficial effect of this step is that the welding pieces and chips are placed by vacuum adsorption, which is conducive to improving work efficiency.

[0025] Furthermore, in step S101, the solder pieces are poured into the solder piece sieve tray by supporting the solder pieces through an antistatic film and then pouring the pieces;

[0026] The method of pouring the solder sheets into the solder sheet sieve plate in step S105 is also to support the solder sheets through the antistatic film and then pour them. The beneficial effect of adopting this step is to reduce static electricity through the antistatic film, which is conducive to improving product quality.

[0027] Furthermore, the welding mold in step S2 is provided with a plurality of welding grooves;

[0028] The welding groove comprises: two lower lead grooves and two upper lead grooves, the two lower lead grooves are arranged side by side and spaced apart, and a lower through groove extending downward is formed at the end of the lower lead groove;

[0029] The upper lead groove intersects with the lower lead groove;

[0030] The two upper lead grooves are arranged side by side and spaced apart, and an upper through groove extending downward is provided at the end of the upper lead groove. The beneficial effect of adopting this step is that the assembly of the rectifier bridge is facilitated by the corresponding welding mold.

[0031] Furthermore, in the step S201, when a first positioning plate with a first blanking groove is placed on the welding mold, the first blanking groove corresponds to one of the lower lead grooves;

[0032] In step S202, when a second positioning plate with a second feed groove is placed on the welding mold, the second feed groove corresponds to the remaining lower lead groove;

[0033] In step 204, when a third positioning plate having a third blanking groove is placed on the welding mold, the third blanking groove corresponds to one of the upper lead grooves;

[0034] In step 205, a fourth positioning plate with a fourth feed trough is placed on the welding mold, and the third feed trough corresponds to the remaining upper lead trough. The beneficial effect of this step is that a variety of different feed troughs and lead troughs cooperate with each other to ensure accuracy and facilitate lead assembly.

[0035] Furthermore, a plurality of protrusions are arranged at intervals on the chip suction pen, and the protrusions are used to absorb the pre-soldered grains. The beneficial effect of adopting this step is that the pre-soldered grains are adsorbed by the chip suction pen to complete the subsequent assembly.

[0036] Furthermore, the sliver assembly comprises:

[0037] A comb strip, wherein one side of the comb strip is provided with a plurality of wire grooves spaced apart along the length direction of the comb strip;

[0038] A fixing plate is arranged on a side of the comb strip where the wire groove is opened.

[0039] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0040] The present application provides a method for producing a single rectifier bridge. This method can realize that an entire row of leads fall into a welding mold without having to manually place them one by one. The production efficiency is high, labor costs are saved, and the material will not be scrapped due to incorrect use of the leads. The leads do not come into direct contact with the operator, which will not contaminate the leads, and the chip will not be impacted, thereby improving the electrical yield of the material. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0042] Figure 1 This is a structural schematic diagram of a welding mold in a method for producing a single rectifier bridge according to a specific embodiment of the present invention;

[0043] Figure 2 for Figure 1 An enlarged schematic diagram of a part A in FIG;

[0044] Figure 3 This is a schematic structural diagram of a first positioning plate in a specific embodiment of the present invention;

[0045] Figure 4 This is a schematic structural diagram of a second positioning plate in a specific embodiment of the present invention;

[0046] Figure 5 This is a schematic structural diagram of a third positioning plate in a specific embodiment of the present invention;

[0047] Figure 6 This is a schematic structural diagram of a fourth positioning plate in a specific embodiment of the present invention;

[0048] Figure 7 This is a schematic structural diagram of a chip suction pen in a specific embodiment of the present invention;

[0049] Figure 8 This is a structural diagram of a sliver assembly in a specific embodiment of the present invention;

[0050] The specific markings are as follows:

[0051] 1-welding mold; 2-first positioning plate; 3-second positioning plate; 4-third positioning plate; 5-fourth positioning plate; 6-chip suction pen; 7-comb assembly;

[0052] 101-welding groove; 102-lower lead groove; 103-upper lead groove; 104-lower through groove; 105-upper through groove;

[0053] 201-first feeding trough; 301-second feeding trough; 401-third feeding trough; 501-fourth feeding trough;

[0054] 601-protrusion; 701-comb strip; 702-line groove; 703-fixed plate. DETAILED DESCRIPTION

[0055] The following embodiments of the technical solution of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are therefore only examples and are not intended to limit the scope of protection of the present invention.

[0056] It should be noted that, unless otherwise specified, the technical or scientific terms used in this application should have the common meanings understood by those skilled in the art to which the present invention belongs.

[0057] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed or detachable connections, or integration; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0058] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0059] Example:

[0060] like Figure 1-8 As shown, the embodiment of the present application discloses a method for producing a single rectifier bridge, which is used to quickly and accurately complete the production of the rectifier bridge and can minimize the occurrence of lead errors;

[0061] The specific steps are as follows:

[0062] S1: Pour the lower solder sheet, chip and upper solder sheet into the pre-soldering mold in sequence, and then send it into the welding furnace to obtain pre-soldering grains; the details are as follows:

[0063] S101: pouring the solder sheets into a solder sheet sieve tray, and connecting the solder sheet sieve tray to a vacuum tube. When pouring the solder sheets, first support the solder sheets through an antistatic film, and then pour them;

[0064] The solder sieve plate is swung to allow some solder pieces to be adsorbed in the plate, and the plate is flipped over to remove excess solder pieces. The solder sieve plate in this application is a hollow sieve plate with multiple through holes. After the vacuum tube is connected and the plate is vacuumed, a large number of solder pieces can be adsorbed through the through holes. When the plate is flipped over, the excess solder pieces can be removed.

[0065] S102: placing a solder sheet sieve plate on the pre-welding mold, removing the vacuum tube, and allowing the solder sheet to fall into the pre-welding mold as the lower solder sheet; the side of the solder sheet sieve plate that attracts the solder sheet corresponds to the pre-welding mold, and after removing the vacuum tube, the solder sheet falls due to its own weight and reaches the welding groove of the welding mold;

[0066] S103: Pour the chips into the chip sieve tray, connect the chip sieve tray to a vacuum tube, shake the chip sieve tray so that some chips are adsorbed into the chip sieve tray, and then flip the chip sieve tray to remove excess chips. Similarly, the chip sieve tray can adsorb chips after being connected to the vacuum tube, and after flipping, excess chips can fall off.

[0067] S104: placing the chip sieve tray on the pre-soldering mold in step S102, removing the vacuum tube, and allowing the chips to fall into the pre-soldering mold; the principle is similar to that of loading the upper solder sheet, and after removing the vacuum tube, the pre-soldering die falls due to its own weight and reaches the soldering groove of the soldering mold;

[0068] S105: pouring the solder pieces into a solder piece sieve tray, and connecting the solder piece sieve tray to a vacuum tube. When pouring the solder pieces, first support the solder pieces through an antistatic film, and then pour them;

[0069] Swing the solder sheet sieve plate so that some solder sheets are adsorbed in the solder sheet sieve plate, flip the solder sheet sieve plate to remove excess solder sheets; similarly, the treatment method for the upper solder sheet is similar to that for the lower solder sheet;

[0070] S106: placing the solder sheet sieve plate on the pre-soldering mold, removing the vacuum tube, and allowing the solder sheet to fall into the pre-soldering mold as an upper solder sheet;

[0071] S107: sending the pre-welding mold in step S106 into a welding furnace for welding to obtain pre-welded grains; the process of entering the welding furnace for welding is an existing process and will not be repeated here;

[0072] S2: The lower lead, the pre-welded die in step S1, and the upper lead are sequentially loaded onto the welding mold, and then the mold is fed into a welding furnace for welding to obtain a single rectifier bridge. The welding temperature in this application is the existing temperature and will not be described here. The design is mainly for how to assemble the semi-finished product (the product before being fed into the welding furnace) to improve work efficiency.

[0073] The specific steps of filling the lower lead in step S2 are as follows:

[0074] S201: placing a first positioning plate with a first feeding trough on the welding mold, then placing a sliver assembly loaded with a first lower lead on the first positioning plate, opening the sliver assembly, allowing the first lower lead to fall from the first feeding trough into the welding groove of the welding mold, and finally removing the first positioning plate to complete loading of the first lower lead;

[0075] S202: placing a second positioning plate with a second feeding trough on the welding mold, then placing a comb assembly loaded with the second lower lead on the second positioning plate, opening the comb assembly, allowing the second lower lead to fall from the second feeding trough into the welding groove of the welding mold, and finally removing the second positioning plate to complete the loading of the second lower lead;

[0076] The specific steps of loading the pre-welded die in step S2 are as follows:

[0077] S203: first connect the chip suction pen to the vacuum tube, adsorb the P side or N side of the pre-soldered grain in the step S1, then move it to the top of the welding mold, remove the vacuum tube, so that the pre-soldered grain falls into the welding groove of the welding mold, and then remove the chip suction pen. The chip suction pen is vacuum adsorption, that is, it adsorbs the pre-soldered grain. After removing the vacuum tube, the pre-soldered grain will fall and reach the welding groove of the welding mold. In this application, a rectifier bridge includes four leads and four pre-soldered grains. When filling, two pre-soldered grains on the P side are filled, and then two pre-soldered grains on the N side are filled. The specific operation method is the operation method of S203, except that the P side or N side of the pre-soldered grain is selected for adsorption;

[0078] The specific steps of filling the upper lead in step S2 are as follows:

[0079] S204: placing a third positioning plate with a third feeding trough on the welding mold, then placing a comb assembly loaded with the first upper lead on the third positioning plate, opening the comb assembly, allowing the first upper lead to fall from the third feeding trough into the welding groove of the welding mold, and finally removing the third positioning plate to complete the loading of the first upper lead;

[0080] S205: Place a fourth positioning plate with a fourth feed trough on the welding mold, then place the comb assembly with the second upper lead on the fourth positioning plate, open the comb assembly, so that the second upper lead falls from the fourth feed trough into the welding groove of the welding mold, and finally remove the fourth positioning plate to complete the loading of the second upper lead.

[0081] The product in this application includes 4 leads and 4 pre-soldered chips. During assembly, first assemble the two lower leads, then install the 4 pre-soldered chips, and finally assemble the two upper leads. After assembly is completed, it is sent to the welding furnace for welding.

[0082] When filling the leads and pre-soldering the dies, the present application uses a positioning plate for assembly, which can effectively distinguish the leads in different parts (leads have different lengths) to ensure accuracy.

[0083] The welding die 1 in the present application is different from the existing design. A plurality of welding slots 101 are spaced apart on the welding die body, so that multiple rectifier bridges can be assembled at the same time, thereby improving the welding speed of the rectifier bridges.

[0084] The specific structure of the welding mold 101 includes: two lower lead grooves 102 and two upper lead grooves 103, the two lower lead grooves 102 are arranged side by side and spaced apart, and a lower through groove 104 extending downward is formed at the end of the lower lead groove 102;

[0085] The upper lead groove 103 intersects with the lower lead groove 102, and the angle formed by the intersection is an acute angle;

[0086] The two upper lead grooves 103 are arranged side by side and spaced apart, and an upper through groove 105 extending downward is formed at the end of the upper lead groove 103;

[0087] Wherein, in the step S201, when the first positioning plate 2 with the first blanking groove 201 is placed on the welding mold 1, the first blanking groove 201 corresponds to one of the lower lead grooves 102;

[0088] In step S202, when a second positioning plate with a second feed groove 301 is placed on the welding mold 1, the second feed groove corresponds to the remaining lower lead groove 102;

[0089] In step 204, when the third positioning plate 4 with the third blanking groove 401 is placed on the welding mold 1, the third blanking groove 401 corresponds to one of the upper lead grooves 103;

[0090] In step 205 , a fourth positioning plate 5 with a fourth blanking groove 501 is placed on the welding mold 1 , and the fourth blanking groove 501 corresponds to the remaining upper lead groove 103 .

[0091] The chip suction pen 6 is provided with a plurality of protrusions 601 at intervals, and the protrusions 601 are used to absorb the pre-welded die, preferably two protrusions, which absorb different N-sides or P-sides.

[0092] Wherein, the comb strip assembly 7 includes:

[0093] A comb strip 701, wherein a plurality of wire grooves 702 are provided at intervals along the length of one side of the comb strip 701;

[0094] The fixing plate 703 is arranged on the side of the comb strip 701 where the wire groove 702 is opened; when the present application is in use, the comb strip 701 can be first set at the discharge end of the wire arrangement machine to receive the lead wire, and then the fixing plate 703 is set and placed on the side of the comb strip 701 with the wire groove 702 to ensure the stability of the lead wire, and then placed on the corresponding positioning plate to facilitate the loading of the lead wire.

[0095] In the description of the present invention, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0096] In the description of this specification, the reference terms "one embodiment," "some embodiments," "example," "specific example," or "some examples" mean that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and description of the present invention.

Claims

1. A method for producing a single rectifier bridge, characterized in that: The following steps are involved: S1: Pour the lower solder sheet, chip and upper solder sheet into the pre-soldering mold in sequence, and then send it into the welding furnace to obtain pre-soldering grains; S2: The lower lead, the pre-welded die in step S1, and the upper lead are sequentially loaded onto the welding mold, and then the mold is placed into a welding furnace for welding to obtain a single rectifier bridge; The specific steps of filling the lower lead in step S2 are as follows: S201: placing a first positioning plate with a first feeding trough on the welding mold, then placing a sliver assembly loaded with a first lower lead on the first positioning plate, opening the sliver assembly, allowing the first lower lead to fall from the first feeding trough into the welding groove of the welding mold, and finally removing the first positioning plate to complete loading of the first lower lead; S202: placing a second positioning plate with a second feeding trough on the welding mold, then placing a comb assembly loaded with the second lower lead on the second positioning plate, opening the comb assembly, allowing the second lower lead to fall from the second feeding trough into the welding groove of the welding mold, and finally removing the second positioning plate to complete the loading of the second lower lead; The specific steps of loading the pre-welded die in step S2 are as follows: S203: First, connect the chip suction pen to the vacuum tube, suck the P side or N side of the pre-welded die in step S1, then move it above the soldering mold, remove the vacuum tube, make the pre-welded die fall into the soldering groove of the soldering mold, and then remove the chip suction pen; The specific steps of filling the upper lead in step S2 are as follows: S204: placing a third positioning plate with a third feeding trough on the welding mold, then placing a comb assembly loaded with the first upper lead on the third positioning plate, opening the comb assembly, allowing the first upper lead to fall from the third feeding trough into the welding groove of the welding mold, and finally removing the third positioning plate to complete the loading of the first upper lead; S205: Place a fourth positioning plate with a fourth feed trough on the welding mold, then place the comb assembly with the second upper lead on the fourth positioning plate, open the comb assembly, so that the second upper lead falls from the fourth feed trough into the welding groove of the welding mold, and finally remove the fourth positioning plate to complete the loading of the second upper lead.

2. The production method according to claim 1, characterized in that The specific steps of step S1 are as follows: S101: pouring solder flakes into a solder flake sieve tray, connecting the solder flake sieve tray to a vacuum tube, shaking the solder flake sieve tray so that some solder flakes are adsorbed in the solder flake sieve tray, and turning the solder flake sieve tray over to remove excess solder flakes; S102: placing the solder sheet sieve plate on the pre-soldering mold, removing the vacuum tube, and allowing the solder sheet to fall into the pre-soldering mold as the lower solder sheet; S103: Pour the chips into a chip sieve tray, connect the chip sieve tray to a vacuum tube, shake the chip sieve tray so that some chips are adsorbed into the chip sieve tray, and then flip the chip sieve tray to remove excess chips; S104: placing the chip sieve plate on the pre-soldering mold in step S102, removing the vacuum tube, and allowing the chip to fall into the pre-soldering mold; S105: pouring solder flakes into a solder flake sieve tray, connecting the solder flake sieve tray to a vacuum tube, shaking the solder flake sieve tray so that some solder flakes are adsorbed in the solder flake sieve tray, and turning the solder flake sieve tray over to remove excess solder flakes; S106: placing the solder sheet sieve plate on the pre-soldering mold, removing the vacuum tube, and allowing the solder sheet to fall into the pre-soldering mold as an upper solder sheet; S107: sending the pre-welding mold in step S106 into a welding furnace for welding to obtain pre-welded grains.

3. The production method according to claim 2, characterized in that In step S101, the solder pieces are poured into the solder piece sieve tray by supporting the solder pieces through an antistatic film and then pouring the pieces; In step S105 , the solder pieces are poured into the solder piece sieve tray by supporting the solder pieces through an antistatic film and then pouring the pieces.

4. The production method according to claim 1, characterized in that The welding mold in step S2 is provided with a plurality of welding grooves; The welding groove includes: two lower lead grooves and two upper lead grooves, the two lower lead grooves are arranged in parallel and spaced apart, and the ends of the lower lead grooves are provided with a lower through groove extending downward; The upper lead groove intersects with the lower lead groove; The two upper lead grooves are arranged in parallel and spaced apart, and an upper through groove extending downward is formed at the end of the upper lead groove.

5. The production method according to claim 4, characterized in that In the step S201, when a first positioning plate with a first blanking groove is placed on the welding mold, the first blanking groove corresponds to one of the lower lead grooves; In step S202, when a second positioning plate with a second feed groove is placed on the welding mold, the second feed groove corresponds to the remaining lower lead groove; In step 204, when a third positioning plate having a third blanking groove is placed on the welding mold, the third blanking groove corresponds to one of the upper lead grooves; In step 205, when a fourth positioning plate with a fourth blanking groove is placed on the welding mold, the fourth blanking groove corresponds to the remaining upper lead groove.

6. The production method according to claim 5, characterized in that The chip suction pen is provided with a plurality of protrusions at intervals, and the protrusions are used to absorb the pre-welded grains.

7. The production method according to claim 6, characterized in that The comb strip assembly comprises: A comb strip, wherein one side of the comb strip is provided with a plurality of wire grooves spaced apart along the length direction of the comb strip; A fixing plate is arranged on a side of the comb strip where the wire groove is opened.

Images