High temperature resistant cutting adhesive tape and preparation method thereof

Abstract

The present application relates to the technical field of adhesive tape, in particular to the field of IPC B65H35, further to a high-temperature-resistant cutting adhesive tape and a preparation method thereof.From top to bottom, the high-temperature-resistant cutting adhesive tape comprises a protective layer, an adhesive layer and a substrate layer in sequence.The adhesive of the adhesive layer comprises the following raw materials in parts by mass: 70-90 parts of prepolymer, 20-50 parts of active diluent, 3-10 parts of photoinitiator, 1-4 parts of antioxidant and 3-6 parts of silane coupling agent.The present application selects to introduce bisphenol A epoxy acrylate and phenolic epoxy acrylate, and selects isobornyl acrylate and dipropylene glycol diacrylate to be used as the active diluent together, so that the cross-linking degree of the adhesive system is high, the system has a suitable curing shrinkage, the cohesive strength of the system is large, the high-temperature-resistant cutting adhesive tape has good bonding performance while the high-temperature-resistant performance is improved, and the prepared high-temperature-resistant cutting adhesive tape has excellent bonding performance and high-temperature-resistant performance.

Description

Technical Field

[0001] This invention relates to the field of adhesive tape technology, particularly to the field of IPC B65H35, and further to a high-temperature resistant cutting tape and its preparation method. Background Technology

[0002] In the process of manufacturing semiconductor chips, dicing semiconductor wafers to obtain semiconductor chips is a necessary step. To ensure chip production yield and efficiency, semiconductor chip dicing tape is often used to protect, fix, and support the chips. However, since the processing temperature of semiconductor chips is around 150℃, existing adhesives are prone to residue or delamination, which seriously affects the quality of semiconductor chips and may even result in defective products.

[0003] Chinese patent CN 110922912 A discloses a high-temperature resistant acrylic ester high-adhesion tape and its preparation method. The high-temperature resistant acrylic ester high-adhesion tape includes a substrate layer, and a high-temperature resistant layer, an adhesive layer, and a release film layer sequentially disposed on the substrate layer. The high-temperature resistant layer is formed by mixing, coating, and baking the following materials in parts by weight: acrylate, inorganic heat-insulating filler, carbon fiber, curing agent, coupling agent, flame retardant, and methyl acetate. The adhesive layer includes: epoxy resin, polyvinyl acetate, methyl acrylate, high-temperature resistant adhesive, o-phenylenediamine, and isocyanate. This technical solution separately designs the high-temperature resistant layer and the adhesive layer, which can provide the tape with high-temperature resistance, but the preparation method is relatively complex. Summary of the Invention

[0004] The first aspect of the present invention provides a high-temperature resistant cutting tape, which includes, from top to bottom, a protective layer, an adhesive layer, and a substrate layer.

[0005] Preferably, the protective layer is made of polyethylene terephthalate or low-density polyethylene.

[0006] Preferably, the protective layer is made of polyethylene terephthalate.

[0007] Preferably, the substrate layer is one or a combination of polyethylene terephthalate, polyvinyl chloride, polyethylene naphthalate, and polyvinyl chloride.

[0008] Preferably, the substrate layer is made of polyimide.

[0009] Preferably, the adhesive of the adhesive layer comprises, by weight, the following raw materials: 70-90 parts prepolymer, 20-50 parts reactive diluent, 3-10 parts photoinitiator, 1-4 parts antioxidant, and 3-6 parts silane coupling agent.

[0010] Preferably, the prepolymer is selected from one or more combinations of acrylates, silicone-modified acrylates, bisphenol A epoxy acrylates, phenolic epoxy acrylates, and modified epoxy acrylates.

[0011] Preferably, the prepolymer is a combination of bisphenol A epoxy acrylate and phenolic epoxy acrylate.

[0012] Preferably, the mass ratio of bisphenol A epoxy acrylate to phenolic epoxy acrylate is (3-5):(1-3).

[0013] Preferably, the viscosity of the bisphenol A epoxy acrylate is 5000-15000 cps (60°C).

[0014] Preferably, the viscosity of the phenolic epoxy acrylate is 10,000 to 30,000 cps (60°C).

[0015] Preferably, the reactive diluent is one or a combination of monofunctional reactive diluents, difunctional reactive diluents, and multifunctional reactive diluents.

[0016] Preferably, the reactive diluent is a combination of a monofunctional reactive diluent and a difunctional reactive diluent.

[0017] Preferably, the monofunctional active diluent is selected from one or more combinations of 2-(2-ethoxyethoxy)ethyl acrylate, 2-phenoxyethyl acrylate, tetrahydrofuran acrylate, tert-butyl methacrylate, isodecyl acrylate, isobornyl methacrylate, isobornyl acrylate, 4-hydroxybutyl acrylate, hydroxyethyl methacrylate, and carboxyacrylate.

[0018] Preferably, the monofunctional active diluent is isobornyl acrylate.

[0019] Preferably, the bifunctional active diluent is selected from one or more combinations of tripropylene glycol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, ethylene glycol diacrylate, and dipropylene glycol diacrylate.

[0020] Preferably, the bifunctional active diluent is dipropylene glycol diacrylate.

[0021] Preferably, the mass ratio of isoborneol acrylate to dipropylene glycol diacrylate is (1-3):1.

[0022] In this invention, the high-temperature resistance of the adhesive can be improved by introducing bisphenol A epoxy acrylate, silicone-modified acrylate, and phenolic epoxy acrylate. However, the inventors found that when only isobornyl acrylate is used as the reactive diluent, the adhesive performance of the prepared adhesive is poor. When only dipropylene glycol diacrylate is used as the reactive diluent, the adhesive performance of the prepared adhesive is improved, but small bubbles appear. When both isobornyl acrylate and dipropylene glycol diacrylate are used as reactive diluents, the prepared adhesive has both good high-temperature resistance and good adhesive performance. The applicant hypothesizes that: when isobornyl acrylate is used alone, the adhesive system has a low degree of crosslinking, few crosslinking points, low cohesive strength, and poor bonding performance; when dipropylene glycol diacrylate is used alone, due to its bifunctional reactive diluent, the adhesive system has a large curing shrinkage rate, resulting in bubbles; when isobornyl acrylate and dipropylene glycol diacrylate are selected together as reactive diluents, and the mass ratio of isobornyl acrylate to dipropylene glycol diacrylate is controlled at (1-3):1, the adhesive system has a high degree of crosslinking, a suitable curing shrinkage rate, high cohesive strength, and improved bonding and high-temperature performance.

[0023] Preferably, the mass ratio of the prepolymer to the reactive diluent is (1.5 to 2.5):1.

[0024] Preferably, the photoinitiator is selected from one or more combinations of 1-hydroxycyclohexylphenyl ketone, 2-methyl-1-(4-methylmercaptophenyl)-2-morpholino-1-propanone, 2-hydroxy-2-methyl-1-phenylpropanone, 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoylphenylphosphonate, benzoyl dimethyl ketal, benzophenone, benzoyl peroxide, cyclohexanone peroxide, cumene peroxide, and azobisisobutyronitrile.

[0025] Preferably, the photoinitiator is 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide.

[0026] Preferably, the antioxidant is selected from one or more combinations of antioxidant 1076, antioxidant 264, antioxidant 168, antioxidant 1790, triphenyl ester, diphenyl isooctyl phosphite, triisooctyl phosphite, triisodecyl phosphite, and trilauryl phosphite.

[0027] Preferably, the antioxidant is antioxidant 1790.

[0028] Preferably, the silane coupling agent is selected from any one of KH-550, KH560, KH-570, and KH-792.

[0029] Preferably, the silane coupling agent is KH-550.

[0030] Preferably, the preparation method of the adhesive includes the following steps: mixing the prepolymer, reactive diluent, photoinitiator, antioxidant and silane coupling agent evenly according to the mass parts.

[0031] The second aspect of the present invention provides a method for preparing a high-temperature resistant cutting tape, comprising the following steps: applying an adhesive to a substrate layer, bonding a protective layer to the adhesive layer, curing by ultraviolet light irradiation, and winding to obtain a high-temperature resistant cutting tape.

[0032] Preferably, the temperature for ultraviolet light curing is 50–80°C.

[0033] Beneficial effects: This invention selects bisphenol A epoxy acrylate and phenolic epoxy acrylate, and uses isobornyl acrylate and dipropylene glycol diacrylate as reactive diluents. When the mass ratio of isobornyl acrylate to dipropylene glycol diacrylate is controlled at (1-3):1, the adhesive system has a high degree of crosslinking, a suitable curing shrinkage rate, and high cohesive strength. It has good adhesion while improving high temperature resistance. Therefore, the prepared high temperature resistant cutting tape has excellent adhesion and high temperature resistance. Detailed Implementation

[0034] Example 1

[0035] Example 1 provides a high-temperature resistant cutting tape, which includes, from top to bottom, a protective layer, an adhesive layer, and a substrate layer.

[0036] The protective layer is made of polyethylene terephthalate.

[0037] The substrate layer is made of polyvinyl chloride.

[0038] The adhesive of the adhesive layer comprises, by weight, the following raw materials: 80 parts prepolymer, 40 parts reactive diluent, 8 parts photoinitiator, 3 parts antioxidant, and 5 parts silane coupling agent.

[0039] The prepolymer is bisphenol A epoxy acrylate and phenolic epoxy acrylate.

[0040] The mass ratio of bisphenol A epoxy acrylate to phenolic epoxy acrylate is 4:3.

[0041] The bisphenol A epoxy acrylate has a viscosity of 8500±1500cps (60℃) and was purchased from Guangdong Boxin New Material Technology Co., Ltd., model: B-100.

[0042] The phenolic epoxy acrylate has a viscosity of 20000±5000cps (30℃) and was purchased from Guangdong Boxin New Material Technology Co., Ltd., model: B-191A.

[0043] The reactive diluent is isobornyl acrylate and dipropylene glycol diacrylate.

[0044] The mass ratio of isoborneol acrylate to dipropylene glycol diacrylate is 2:1.

[0045] The photoinitiator is 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide.

[0046] The antioxidant is antioxidant 1790.

[0047] The silane coupling agent is KH-550.

[0048] The preparation method of the adhesive includes the following steps: mixing the prepolymer, reactive diluent, photoinitiator, antioxidant and silane coupling agent evenly according to the mass parts.

[0049] The method for preparing the high-temperature resistant cutting tape includes the following steps: applying an adhesive to a substrate layer, covering the adhesive layer with a protective layer, curing it by ultraviolet light irradiation, and then winding it up to obtain the high-temperature resistant cutting tape.

[0050] The temperature for UV curing is 65°C.

[0051] Example 2

[0052] Example 2 provides a high-temperature resistant cutting tape, which includes, from top to bottom, a protective layer, an adhesive layer, and a substrate layer.

[0053] The protective layer is made of polyethylene terephthalate.

[0054] The substrate layer is made of polyvinyl chloride.

[0055] The adhesive of the adhesive layer comprises, by weight, the following raw materials: 85 parts prepolymer, 50 parts reactive diluent, 9 parts photoinitiator, 3 parts antioxidant, and 5 parts silane coupling agent.

[0056] The prepolymer is bisphenol A epoxy acrylate and phenolic epoxy acrylate.

[0057] The mass ratio of bisphenol A epoxy acrylate to phenolic epoxy acrylate is 4:3.

[0058] The bisphenol A epoxy acrylate has a viscosity of 8500±1500cps (60℃) and was purchased from Guangdong Boxin New Material Technology Co., Ltd., model: B-100.

[0059] The phenolic epoxy acrylate has a viscosity of 20000±5000cps (30℃) and was purchased from Guangdong Boxin New Material Technology Co., Ltd., model: B-191A.

[0060] The reactive diluent is isobornyl acrylate and dipropylene glycol diacrylate.

[0061] The mass ratio of isoborneol acrylate to dipropylene glycol diacrylate is 2:1.

[0062] The photoinitiator is 2,4,6-(trimethylbenzoyl)diphenylphosphine oxide.

[0063] The antioxidant is antioxidant 1790.

[0064] The silane coupling agent is KH-550.

[0065] The preparation method of the adhesive includes the following steps: mixing the prepolymer, reactive diluent, photoinitiator, antioxidant and silane coupling agent evenly according to the mass parts.

[0066] The method for preparing the high-temperature resistant cutting tape includes the following steps: applying an adhesive to a substrate layer, covering the adhesive layer with a protective layer, curing it by ultraviolet light irradiation, and then winding it up to obtain the high-temperature resistant cutting tape.

[0067] The temperature for UV curing is 65°C.

[0068] Example 3

[0069] Example 3 provides a high-temperature resistant cutting tape, the specific implementation of which is the same as that of Example 1, except that the mass fraction of the active diluent is 30 parts.

[0070] Example 4

[0071] Example 4 provides a high-temperature resistant cutting tape, which is implemented in the same way as Example 1, except that the active diluent is 2-phenoxyethyl acrylate and isobornyl acrylate, and the mass ratio of 2-phenoxyethyl acrylate to isobornyl acrylate is 1:1.

[0072] Example 5

[0073] Example 5 provides a high-temperature resistant cutting tape, the specific implementation of which is the same as that of Example 1, except that the mass ratio of isoborneol acrylate to dipropylene glycol diacrylate is 4:1.

[0074] Example 6

[0075] Example 6 provides a high-temperature resistant cutting tape, the specific implementation of which is the same as that of Example 1, except that the mass ratio of bisphenol A epoxy acrylate to phenolic epoxy acrylate is 2:1.

[0076] Performance testing methods:

[0077] 1. High temperature resistance: High temperature resistant cutting tape was applied to the silicon wafer and baked in an oven at 150°C for 20 minutes. After cooling and peeling, the surface of the silicon wafer was observed for any residual adhesive. The results are shown in Table 1.

[0078] 2.180° peel strength: Tested according to the standard method of GB / T2792-2014, the results are shown in Table 1.

[0079] Test results:

[0080] Table 1:

[0081] High temperature resistance 180° peel strength (N / m) Example 1 No residue 420 Example 2 No residue 410 Example 3 There is residual glue 320 Example 4 There is residual glue 310 Example 5 There is residual glue 300 Example 6 There is residual glue 340

Claims

1. A high temperature resistant dicing tape, characterized by, From top to bottom in turn includes protective layer, adhesive layer, substrate layer; The adhesive of the adhesive layer comprises the following raw materials in parts by mass: 70-90 parts of prepolymer, 40-50 parts of active diluent, 3-10 parts of photoinitiator, 1-4 parts of antioxidant, 3-6 parts of silane coupling agent; The prepolymer is a combination of bisphenol A epoxy acrylate and phenolic epoxy acrylate, the mass ratio of bisphenol A epoxy acrylate to phenolic epoxy acrylate is 4:3, the viscosity of bisphenol A epoxy acrylate is 5000-15000 cps, and the viscosity of the phenolic epoxy acrylate is 10000-30000 cps; The active diluent is a combination of monofunctional active diluent and difunctional active diluent; the monofunctional active diluent is isobornyl acrylate, and the difunctional active diluent is one-dipropylene glycol diacrylate; the mass ratio of isobornyl acrylate to one-dipropylene glycol diacrylate is (1-3):1; The photoinitiator is 2,4,6-(trimethylbenzoyl) diphenyl phosphine oxide.

2. The high temperature resistant dicing tape of claim 1, wherein, The protective layer is polyethylene terephthalate material or low-density polyethylene material.

3. The high temperature resistant dicing tape of claim 1, wherein, The substrate layer is one or a combination of polyethylene terephthalate material, polyvinyl chloride material, polyethylene naphthalate material, and polyimide material.

4. A method of manufacturing a high temperature resistant dicing tape according to any one of claims 1 to 3, characterized in that, The method comprises the following steps: coating the adhesive on the substrate layer, laminating the protective layer on the adhesive layer, curing by ultraviolet light irradiation, and winding to obtain a high-temperature-resistant cutting adhesive tape.