A method for improving the production efficiency of PCB board resin plug holes, a storage medium and a drilling machine

Abstract

The present application relates to the technical field of PCB production, and particularly relates to a method for improving the production efficiency of resin plug holes of PCBs, a storage medium and a drilling machine, which comprises the following steps: S1, placing a first PCB and a second PCB on a base plate, aligning the tail end of the first PCB with the head end of the second PCB, and laying aluminum sheets on the surfaces of the first PCB and the second PCB; a first drilling device of a drilling machine drills the aluminum sheets and the base plate on the first PCB and drills the aluminum sheets and the base plate on the head end of the second PCB, and a second drilling device drills the aluminum sheets and the base plate on the tail end of the second PCB, and the second drilling device is positioned by the drilling data of the aluminum sheets and the base plate on the head end of the second PCB and is associated with the first drilling device; S2, after resin plug holes are formed, the PCBs are removed, and two other PCBs are placed, so that the resin plug holes can be formed on multiple PCBs at the same time, and the production efficiency of the resin plug holes is improved.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, and specifically to a method, storage medium, and drilling rig for improving the production efficiency of resin plugging of PCBs. Background Technology

[0002] With the rapid development of 5G network information technology and the upgrading of server platform design and complexity, the PCB market is gradually adopting resin plugs to replace blocked holes to improve product quality and reliability. As products are upgraded, the market share of resin plugs is increasing year by year. Therefore, increasing the production capacity of resin plugs has become an important efficiency improvement and cost reduction issue for every PCB manufacturer.

[0003] However, the current resin plugging production method still has shortcomings: before resin plugging, drilling and copper plating are required. During drilling, in order to reduce drilling accuracy and avoid drilling too many holes at once, which would reduce drilling precision, Figure 1 As shown, the drilling machine can only process one board at a time, and then process another board after completing one board. However, since the boarding process takes a certain amount of time, and the hole plugging process also takes a certain amount of time, resin hole plugging is inefficient because it can only process one PCB board at a time. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method to improve the production efficiency of resin plugging of PCB boards. This method can simultaneously perform resin plugging on multiple PCB boards, overcome the deviation caused by drilling multiple holes, and effectively improve the production efficiency of resin plugging.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A method for improving the production efficiency of resin-filled vias in PCB boards is provided, comprising the following steps.

[0007] S1. Place a pad on the drilling machine station, and place the first PCB board and the second PCB board on the pad at the same time. The tail end of the first PCB board is aligned with the head end of the second PCB board. Aluminum sheets are laid on the surface of the first PCB board and the surface of the second PCB board at the same time.

[0008] The drilling machine uses a first drilling data and a second drilling data. The first drilling data drills holes in the aluminum sheet and pad on the first PCB board and drills holes in the aluminum sheet and pad at the beginning of the second PCB board. The second drilling data drills holes in the aluminum sheet and pad at the end of the second PCB board. The second drilling data is positioned based on the drilling data of the aluminum sheet and pad at the beginning of the second PCB board and is associated with the first drilling data to obtain the aluminum sheet and pad after resin plugging.

[0009] S2. Simultaneously fill the holes of the first PCB board and the second PCB board with resin. After filling the holes with resin, remove the first PCB board and the second PCB board, and reinstall the other two PCB boards.

[0010] In some implementations, the long side of the first PCB board is placed side by side with the long side of the second PCB board.

[0011] In some implementations, a gap is left at the splicing point between the first PCB board and the second PCB board.

[0012] In some implementations, the spacing between the first PCB board and the second PCB board is 2 inches.

[0013] In some embodiments, the gap is filled with a filler plate, the thickness of which is the same as the thickness of the PCB board.

[0014] In some embodiments, in step S2, a plugging scraper is used to plug the resin holes, and the blade length of the plugging scraper is not less than the length of the PCB boards side by side.

[0015] In some implementations, the drilling data includes a 2 mil borehole diameter compensation for the drill bit.

[0016] The beneficial effects of the method for improving the production efficiency of resin-filled vias in PCB boards according to the present invention are as follows:

[0017] The present invention provides a method for improving the production efficiency of resin-filled vias on PCB boards. The drilling data includes multiple drilling profiles, where subsequent drilling profiles use the positioning holes of previously used profiles as references. This links the multiple drilling profiles together, ensuring consistent positioning. This overcomes the low efficiency problem of traditional methods that can only process one PCB board resin-filled via at a time. Furthermore, linking multiple drilling profiles prevents positioning deviations caused by drilling two PCB board resin-filled vias on the same backing plate and aluminum sheet simultaneously, which could lead to expansion and contraction misalignment during resin filling. Therefore, the PCB board resin-filled via production method of the present invention not only has high efficiency but also high production precision.

[0018] A storage medium is also provided, wherein the computer-readable storage medium stores a computer program, which is read and executed by a processor to implement the above-described method for improving the production efficiency of resin plugging of PCB boards.

[0019] A drilling rig is also provided, which includes the aforementioned storage medium. Attached Figure Description

[0020] Figure 1 This is a PCB layout diagram for resin-filled vias using existing technology.

[0021] Figure 2 This is a PCB layout diagram of the resin-filled holes in the embodiment.

[0022] Figure 3 This is a product image of the resin-filled PCB board obtained in the embodiment.

[0023] Figure label:

[0024] First PCB board 11, second PCB board 12; positioning hole 2; filler board 3. Detailed Implementation

[0025] Preferred embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0026] The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular forms “a” and “the” as used in this invention and the appended claims are intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0027] It should be understood that although the terms "first," "second," "third," etc., may be used in this invention to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this invention, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Thus, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] Example 1

[0029] This embodiment discloses a method for improving the production efficiency of resin-filled vias in PCB boards. Figure 2 As shown, the process includes the following steps: S1, placing a pad on the drilling machine station, placing the first PCB board 11 and the second PCB board 12 on the pad at the same time, aligning the tail end of the first PCB board 11 with the head end of the second PCB board 12, and laying aluminum sheets on the surfaces of the first PCB board 11 and the second PCB board 12 at the same time.

[0030] The drilling machine uses first drilling data and second drilling data. The first drilling data drills holes in the aluminum sheet and pad on the first PCB board 11 and drills holes in the aluminum sheet and pad at the beginning of the second PCB board 12. The second drilling data drills holes in the aluminum sheet and pad at the end of the second PCB board 12. The second drilling data is positioned based on the drilling data of the aluminum sheet and pad at the beginning of the second PCB board 12 and is associated with the first drilling data to obtain the aluminum sheet and pad after resin plugging.

[0031] S2. Simultaneously fill the holes of the first PCB board 11 and the second PCB board 12 with resin. After filling the holes with resin, remove the first PCB board 11 and the second PCB board 12, and reinstall the other two PCB boards.

[0032] In this embodiment, the long side of the first PCB board 11 is placed side by side with the long side of the second PCB board 12.

[0033] In this embodiment, a gap is left at the splicing position between the first PCB board 11 and the second PCB board 12.

[0034] When removing PCB board 1, the gap left at the splicing position makes it easy for a person to pick up PCB board 1 from the gap.

[0035] In this embodiment, the distance between the first PCB board 11 and the second PCB board 12 is 2 inches.

[0036] The 2-inch spacing not only makes it easy for a person to insert their hand to pick up PCB board 1, but also avoids the spacing being too large, so that the spacing is kept as small as possible to prevent the aluminum sheets laid on PCB board 1 from being damaged due to excessive spacing.

[0037] In this embodiment, the gap is filled with a filler plate, and the thickness of the filler plate is the same as the thickness of the PCB board.

[0038] In actual production, when resin plugging is performed, the resin ink is laid along the entire PCB board 1. If the spacing is too large, it will cause air bubbles to form in the resin ink and on the worktable, affecting the processing effect. Filling the gap with filler plate 3 can effectively prevent air bubbles from forming in the resin ink. At the same time, the thickness of the filler plate is the same as the thickness of the PCB board, thus avoiding the filler plate being too high and affecting the aluminum sheet.

[0039] In this embodiment, in step S2, a via-plugging scraper is used to plug the vias with resin. The blade length of the via-plugging scraper is not less than the length of the PCB boards side by side. For example, the length of the via-plugging scraper is increased from 700 nm to 1000 mm.

[0040] In this embodiment, the drilling data includes a 2 mil diameter compensation for the drill aluminum sheet.

[0041] Considering the misalignment caused by different expansion and contraction control of PCB board 1 and differences in board edge, and taking into account the thickness of aluminum sheet, an additional 2mil design is added to the current design specifications as compensation.

[0042] Example 2

[0043] The storage medium disclosed in this embodiment stores a computer program. When the computer program is read and run by a processor, it implements the method for improving the production efficiency of resin plugging of PCB boards as described in Embodiment 1.

[0044] Example 3

[0045] This embodiment discloses a drilling rig that includes the storage medium described in Embodiment 2.

[0046] Effect verification:

[0047] The method described in Example 1 for improving the production efficiency of resin via plugging on two PCB boards saves 25 seconds in PCB board handling time compared to existing technologies, increasing efficiency by approximately 30%. The production time for each PCB board is 42.5 seconds, allowing each machine to produce an additional 1000 * 30% = 300 boards per day. Furthermore, from... Figure 3 It can be seen that the obtained product image has uniform openings.

[0048] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0049] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0050] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0051] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0052] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for improving the production efficiency of resin-filled vias in PCB boards, characterized by: Including the following step, S1. Place a pad on the drilling machine station, and place the first PCB board and the second PCB board on the pad at the same time. The tail end of the first PCB board is aligned with the head end of the second PCB board. Aluminum sheets are laid on the surface of the first PCB board and the surface of the second PCB board at the same time. The drilling machine uses a first drilling data and a second drilling data. The first drilling data drills holes in the aluminum sheet and pad on the first PCB board and drills holes in the aluminum sheet and pad at the beginning of the second PCB board. The second drilling data drills holes in the aluminum sheet and pad at the end of the second PCB board. The second drilling data is positioned based on the drilling data of the aluminum sheet and pad at the beginning of the second PCB board and is associated with the first drilling data to obtain the aluminum sheet and pad after resin plugging. S2. Simultaneously fill the holes of the first PCB board and the second PCB board with resin. After filling the holes with resin, remove the first PCB board and the second PCB board, and reinstall the other two PCB boards.

2. The method for improving the production efficiency of resin plugging in PCB boards according to claim 1, characterized in that: The long side of the first PCB board is placed side by side with the long side of the second PCB board.

3. The method for improving the production efficiency of resin plugging in PCB boards according to claim 2, characterized in that: A gap is left between the splicing points of the first PCB board and the second PCB board.

4. The method for improving the production efficiency of resin plugging in PCB boards according to claim 3, characterized in that: The spacing between the first PCB board and the second PCB board is 2 inches.

5. The method for improving the production efficiency of resin plugging in PCB boards according to claim 3, characterized in that: The gap is filled with a filler plate, and the thickness of the filler plate is the same as the thickness of the PCB board.

6. The method for improving the production efficiency of resin plugging in PCB boards according to claim 1, characterized in that: In step S2, a plugging scraper is used to plug the holes with resin, and the blade length of the plugging scraper is not less than the length of the PCB boards side by side.

7. The method for improving the production efficiency of resin plugging in PCB boards according to claim 1, characterized in that: The drilling data includes 2 mil hole diameter compensation for the aluminum drill bit.

8. A storage medium, characterized in that: The storage medium stores a computer program, which is read and executed by a processor to implement the method for improving the production efficiency of resin plugging of PCB boards as described in any one of claims 1-7.

9. A drilling rig, characterized in that: It includes the storage medium as described in claim 8.

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