Reciprocating wire electric discharge wire cutting inter-electrode chip removal device and chip removal method

Abstract

The application discloses a reciprocating wire-cut electric spark wire-cutting inter-electrode chip removal device and method in the technical field of electric discharge machining, and aims to solve the problems of the prior art, such as difficultly greatly improving cutting efficiency, and easily producing burn marks on the surface of a workpiece when cutting a large amount of energy, and the like, and the device comprises a jet system, a liquid supply system and a control system. In the jet chip removal period of the discharge interval, the working liquid system is turned off, high-pressure airflow is sprayed into the machining area in the cutting gap of the workpiece, the etching products remaining in the cutting gap are blown out in time, and the heat generated by the discharge is taken away. The control system controls the jet system and the liquid supply system to work alternately and cyclically during the discharge, and displays the inter-electrode chip removal condition in the upper computer interface in real time. The application adopts grouped pulse discharge and jet chip removal during the discharge interval, simultaneously improves the cutting efficiency and the surface quality of the workpiece, and is beneficial to reducing the surface damage of the electrode wire.

Description

Technical Field

[0001] This invention relates to a chip removal device and method for reciprocating wire electrical discharge machining, belonging to the field of electrical discharge machining technology. Background Technology

[0002] Electrical discharge wire cutting (EDM) relies on the electrical and thermal effects of electrical discharge to remove material, overcoming the limitations imposed by the mechanical properties of materials on processing. It can also cut complex-shaped parts using simple electrode wires, playing an irreplaceable role in precision mold making, aerospace, aviation, and automotive manufacturing. Reciprocating wire EDM is an EDM technology with completely independent intellectual property rights in my country, and its high cost-effectiveness has led to its gradual global adoption.

[0003] Cutting efficiency is the primary process parameter to consider in reciprocating wire electrical discharge machining (EDM). To improve cutting efficiency,

[0004] Increasing the pulse discharge energy is a common method, but as the pulse energy increases, the cutting efficiency does not improve rapidly and continuously. Furthermore, it can lead to a decrease in workpiece surface quality, even severe burns, increased electrode wire wear, and a higher risk of breakage, further impacting overall cutting efficiency. These problems are primarily attributed to the increased discharge erosion products and heightened working fluid vaporization under high-energy cutting conditions. This results in a continuous deterioration of chip removal conditions and the discharge state between electrodes. The erosion products within the kerf cannot be promptly removed by the working fluid and electrode wire, becoming trapped and accumulating on the workpiece surface at high discharge temperatures, forming burn marks. Therefore, the root cause of workpiece surface burns lies in the deterioration of cooling and cleaning conditions within the kerf.

[0005] Currently, engineers generally use measures such as increasing the concentration of the working fluid, adding detergents, and extending the pulse interval to improve the washing performance and chip removal capacity of the working fluid, thereby reducing the degree of burns on the cutting surface. However, with further increases in discharge energy, burns are still difficult to avoid. Some researchers have proposed using high-pressure spraying to improve chip removal performance under high-energy cutting conditions, which has improved cutting efficiency to some extent. However, the use of composite working fluids during processing generates a large number of bubbles between the electrodes under high pressure, which adversely affects inter-electrode cooling and cleaning. Summary of the Invention

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a chip removal device and method for reciprocating wire EDM, which adopts grouped pulse discharge and intermittent jet discharge for chip removal, thereby improving cutting efficiency and workpiece surface quality, and helping to reduce damage to the electrode wire surface.

[0007] To achieve the above objectives, the present invention is implemented using the following technical solution:

[0008] On one hand, the present invention provides a chip removal device between electrodes for reciprocating wire electrical discharge machining. The chip removal device is installed on a machine tool and includes an air jet system and a liquid supply system. The air jet system is used to discharge the erosion products in the workpiece kerf during the intermittent pulse discharge cycle and to cool the workpiece and the electrode wire. The liquid supply system is used to provide a working medium during the pulse discharge cycle and to cool and clean the workpiece kerf.

[0009] It also includes a control system, which is electrically connected to both the jet system and the liquid supply system, and is used to control the jet system and the liquid supply system to work alternately in a cycle.

[0010] Optionally, the machine tool uses a grouped pulse power supply for electrical discharge machining, with the negative terminal of the grouped pulse power supply connected to the electrode wire and the positive terminal of the grouped pulse power supply connected to the workpiece.

[0011] The jet system includes jet nozzles, an air source distributor, and a high-pressure air source device. Multiple jet nozzles are arranged in a circumferential pattern on a jet nozzle support. The jet nozzle support is located above the workpiece, and the electrode wire passes through the central through hole of the jet nozzle support. The inlet of the air source distributor is connected to the high-pressure air source device, and the outlet is connected to each jet nozzle. The air source distributor is used to evenly distribute the high-pressure airflow to each jet nozzle.

[0012] The gas source distributor is connected to the high-pressure gas source device via a pipeline equipped with a high-frequency gas pulse valve and a gas pressure regulating valve. The high-frequency gas pulse valve is used to control the gas flow interruption, and the gas pressure regulating valve is used to control the output gas flow pressure.

[0013] Optionally, a support plate is connected to one side of the jet nozzle support. The support plate is connected to the column and can move up and down on the column.

[0014] Optionally, the liquid supply system includes a working liquid tank, a water pump, an upper spray nozzle, and a lower spray nozzle. The electrode wire passes through the upper spray nozzle, the through hole in the middle of the air nozzle support, and the lower spray nozzle in sequence from top to bottom. The working liquid tank is connected to the upper and lower spray nozzles via a three-way valve. The water pump is located on the pipeline connecting the working liquid tank and the three-way valve.

[0015] The pipeline connecting the working fluid tank and the three-way valve is also equipped with a liquid flow control valve and a high-frequency liquid pulse valve. The liquid flow control valve is used to control the liquid flow rate, and the high-frequency liquid pulse valve is used to control the on / off state of the liquid.

[0016] Optionally, the control system includes a main control unit and multiple transmitters. The main control unit is electrically connected to the transmitters, the grouped pulse power supply, the high-frequency gas pulse valve, the gas pressure regulating valve, the liquid flow control valve, and the high-frequency liquid pulse valve.

[0017] The transmitter includes a liquid flow transmitter and multiple gas pressure transmitters. The gas pressure transmitters are divided into a first gas pressure transmitter, a second gas pressure transmitter, and a third gas pressure transmitter. The first gas pressure transmitter is located on the underside of the workpiece, the second gas pressure transmitter is located at the inlet of the gas source distributor, the third gas pressure transmitter is located at the outlet of the high-pressure gas source device, and the liquid flow transmitter is located at the outlet of the water pump.

[0018] Optionally, the control system also includes a PC, which is connected to the main control unit via serial communication. The PC has a host computer interface, which is used to set chip removal and processing parameters, and to display the pressure difference curves of the second pressure transmitter and the first pressure transmitter in real time, so that the processing personnel can monitor the chip removal status between the electrodes in real time.

[0019] On the other hand, the present invention also provides a method for chip removal between electrodes in reciprocating wire electrical discharge machining, which includes the following steps:

[0020] a. Initialize the parameters of the chip removal device;

[0021] b. During the pulse discharge cycle, the jet system is shut down and the liquid supply system is turned on by the control system, and the grouped pulse power supply is turned on for discharge processing;

[0022] c. During the air jet chip removal cycle, the liquid supply system is shut down and the air jet system is turned on by the control system. The air jet system sprays high-pressure airflow into the machining area inside the cut of the workpiece to blow out the residual discharge erosion products inside the cut.

[0023] d. By analyzing the pressure difference between the second gas pressure transmitter and the first gas pressure transmitter, determine whether there is any residual accumulation of discharge erosion products in the processing area within the cut.

[0024] If the airflow pressure difference does not exceed the set value of the pressure difference, it means that there is no residual accumulation of discharge erosion products. Then repeat steps b to c until the cutting process is completed.

[0025] If the airflow pressure difference exceeds the set value, it indicates that there is residual accumulation of discharge erosion products. In this case, the main control unit extends the inter-electrode jet chip removal time until the airflow pressure difference drops to the set range.

[0026] Furthermore, the pulse discharge cycle consists of the duration of one or more consecutive groups of grouped pulse discharges from the grouped pulse power supply.

[0027] Furthermore, the jet chip removal cycle is set within a pause period after the end of a pulse discharge cycle.

[0028] Furthermore, the parameter initialization of the chip removal device includes setting the nozzle height, airflow pressure, working fluid flow rate, and the pressure difference between the second gas pressure transmitter and the first gas pressure transmitter.

[0029] Compared with the prior art, the beneficial effects achieved by the present invention are as follows:

[0030] This invention employs a grouped pulse power supply. During the interval at the end of the pulse discharge cycle, the working fluid is turned off, and a jet system is used to spray high-pressure airflow into the processing area within the cut. The high-pressure airflow blows out the etched products that have not been discharged from the cut and removes the heat generated by the high temperature within the cut. After the jet chip removal cycle ends, the working fluid is turned on, the jet system is turned off, and the next pulse discharge cycle begins.

[0031] This invention utilizes grouped pulse discharge and intermittent jet chip removal to provide ideal chip removal and cooling conditions between electrodes, improving the discharge environment and thus further increasing the table feed speed and reducing the probability of short circuits. This enables continuous and stable cutting under high pulse discharge energy, further improving cutting efficiency and workpiece surface quality. The high-speed airflow rapidly removes heat from the workpiece cutting surface and electrode wire surface, which helps reduce the thickness of the altered layer on the workpiece surface and reduces the probability of electrode wire surface damage and burnout. Attached Figure Description

[0032] Figure 1 This is a schematic diagram illustrating the structural principle of a reciprocating wire EDM chip removal device in one embodiment of the present invention.

[0033] Figure 2 This is a top view of the nozzle support of the reciprocating wire EDM chip removal device in one embodiment of the present invention.

[0034] Figure 3 This is a schematic flowchart of a reciprocating wire EDM chip removal method in one embodiment of the present invention.

[0035] Figure 4 This is a schematic diagram of the pulse discharge cycle and air jet chip removal cycle of the reciprocating wire EDM chip removal method in one embodiment of the present invention.

[0036] Figure 5 This is a schematic diagram of electrical discharge chip removal within the workpiece kerf in the prior art;

[0037] Figure 6 This is a schematic diagram of air jet chip removal in the workpiece kerf of a reciprocating wire EDM chip removal method in one embodiment of the present invention.

[0038] In the diagram: 1. Column, 2. Support plate, 3. Electrode wire, 4. Upper water spray nozzle, 5. Air spray nozzle support, 6. First gas pressure transmitter, 7. Air spray nozzle, 8. Workpiece, 9. Power input block, 10. Lower water spray nozzle, 11. Gas source distributor, 12. Second gas pressure transmitter, 13. High-frequency gas pulse valve, 14. Gas pressure regulating valve, 15. Third gas pressure transmitter, 16. High-pressure gas source device, 17. Group pulse power supply, 18. Main control unit, 19. Working fluid tank, 20. Water pump, 21. Liquid flow control valve, 22. Liquid flow transmitter, 23. High-frequency liquid pulse valve, 24. Three-way valve, 25. Erosion product, 26. PC. Implementation

[0039] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0040] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0041] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances. Example

[0042] like Figure 1 As shown in the embodiment of the present invention, the reciprocating wire EDM chip removal device is installed on the wire EDM machine tool and includes an air jet system and a liquid supply system. The air jet system is used to discharge the erosion products 25 in the kerf of the workpiece 8 during the pulse discharge cycle and to cool the workpiece 8 and the electrode wire 3. The liquid supply system is used to provide the working medium during the pulse discharge cycle and to cool and clean the kerf of the workpiece 8.

[0043] The machine tool uses a grouped pulse power supply 17 for electrical discharge machining. The negative terminal of the grouped pulse power supply 17 is connected to the electrode wire 3, and the positive terminal of the grouped pulse power supply 17 is connected to the workpiece 8. The workpiece 8 is placed on the electrode wire 3, and the grouped pulse power supply 17 performs grouped pulse discharge to cut the workpiece 8.

[0044] The jet system includes a jet nozzle 7, an air source distributor 11, and a high-pressure air source device 16, combined with... Figure 2 Multiple jet nozzles 7 are evenly arranged in a circular pattern on the jet nozzle support 5. The motor wire 3 is inserted into the central through hole of the jet nozzle support 5. There are no fewer than 3 jet nozzles 7, which are used to spray high-pressure airflow into the cut of the workpiece 8 processing area.

[0045] The nozzle support 5 is positioned above the workpiece 8, with a support plate 2 connected to one side. The support plate 2 is connected to the column 1. The column 1 is an L-shaped plate, with its horizontal portion fixed to the upper arm of the wire EDM machine. Its vertical portion has an annular groove. The support plate 2 is fixed to the vertical portion of the column 1 and its vertical position can be adjusted via the annular groove. However, this is not a limitation; any other method that allows the support plate 2 to move vertically on the column 1 is also acceptable.

[0046] Each nozzle 7 is connected to the outlet of the air source distributor 11, and the inlet of the air source distributor 11 is connected to the high-pressure air source device 16. The air source distributor 11 is used to evenly distribute the high-pressure airflow to each nozzle 7. The gas in the high-pressure air source device 16 does not have a harmful effect on processing and the environment, and can be air, nitrogen, or an inert gas.

[0047] The pipeline connecting the gas source distributor 11 and the high-pressure gas source device 16 is equipped with a high-frequency gas pulse valve 13 and a gas pressure regulating valve 14. The frequency of the high-frequency gas pulse valve 13 is not less than 1000Hz. The high-frequency gas pulse valve 13 is used to control the flow of gas, and the gas pressure regulating valve 14 is used to control the output gas pressure.

[0048] The fluid supply system includes a working fluid tank 19, a water pump 20, an upper spray nozzle 4, and a lower spray nozzle 10. The electrode wire 3 passes through the upper spray nozzle 4, the through hole in the middle of the air nozzle support 5, and the lower spray nozzle 10 sequentially from top to bottom. The diameter of the through hole in the middle of the air nozzle support 5 is consistent with the diameter of the spray hole on the nozzle to ensure that the working fluid can smoothly enter the cutting kerf during the discharge cycle. The specific distances from the upper spray nozzle 4 and the lower spray nozzle 10 to the workpiece 8 need to be adjusted according to the thickness of the workpiece 8.

[0049] The working fluid tank 19 is connected to the upper spray nozzle 4 and the lower spray nozzle 10 via a three-way valve. The water pump 20, the liquid flow control valve 21, and the high-frequency liquid pulse valve 23 are all located on the pipeline connecting the working fluid tank 19 and the three-way valve 24. The frequency of the high-frequency liquid pulse valve 23 is not less than 1000Hz. The liquid flow control valve 21 is used to control the liquid flow rate, and the high-frequency liquid pulse valve 23 is used to control the on / off state of the liquid. Example

[0050] Based on Embodiment 1, this embodiment also includes a control system. The control system is used to control the group pulse power supply 17, the jet system and the liquid supply system. It includes a PC 26, a main control unit 18 and multiple transmitters. The main control unit 18 can be an FPGA, a microcontroller or a DSP as the main controller.

[0051] The transmitter includes a liquid flow transmitter 22 and multiple gas pressure transmitters. The gas pressure transmitters are divided into a first gas pressure transmitter 6, a second gas pressure transmitter 12, and a third gas pressure transmitter 15. The first gas pressure transmitter 6 is located below the lower surface of the cut of the workpiece 8 and is used to detect the airflow pressure at the cut outlet. The second gas pressure transmitter 12 is located at the inlet of the gas source distributor 11 and is used to detect the airflow pressure entering the gas source distributor 11. The third gas pressure transmitter 15 is located at the outlet of the high-pressure gas source device 16 and is used to detect the magnitude of the airflow pressure output by the high-pressure gas source device 16. The liquid flow transmitter 22 is located at the outlet of the water pump 20 and is used to detect the working liquid flow rate output by the water pump 20.

[0052] The main control unit 18 is electrically connected to the transmitter, the group pulse power supply 17, the high-frequency gas pulse valve 13, the gas pressure regulating valve 14, the liquid flow control valve 21, and the high-frequency liquid pulse valve 23.

[0053] Specifically, the main control unit 18 receives signals from the first gas pressure transmitter 6, the second gas pressure transmitter 12, and the third gas pressure transmitter 15. It uses a gas pressure regulating valve 14 to control the airflow pressure output from the high-pressure gas source device 16, and controls the on / off state of the high-frequency gas pulse valve 13. It can also analyze the airflow pressure difference between the inlet of the gas source distributor 11 and the lower side of the workpiece 8 based on the detection signals from the first pressure transmitter 6 and the second pressure transmitter 12. The magnitude of the pressure difference determines whether there is residual accumulation of discharge erosion products in the machining area within the kerf. If residual accumulation of discharge erosion products is present, the duration of the air jet chip removal can be extended to promptly blow away the accumulated erosion products.

[0054] The main control unit 18 also controls the flow rate of the working fluid output by the water pump 20 using the liquid flow control valve 21 based on the signal collected by the liquid flow transmitter 22, and controls the on / off of the working fluid using the high-frequency liquid pulse valve 23. The PC 26 is connected to the main control unit 18 via serial communication. The PC 26 is equipped with a host computer interface, in which chip removal and processing parameters can be set, and the pressure difference curve between the second pressure transmitter 12 and the first pressure transmitter 6 can be displayed in real time, which is convenient for the processing personnel to monitor the chip removal status between the electrodes. Example

[0055] This embodiment provides a chip removal method between electrodes in a reciprocating wire electrical discharge machining (EDM) system, implemented by the chip removal device described in the above embodiment, and includes the following steps:

[0056] like Figure 3 As shown, before cutting, the installation position of the support plate 2 on the column 1 is adjusted according to the thickness of the workpiece 8 and the magnitude of the pulse discharge energy, so that the jet nozzle 7 is at a certain height on the upper surface of the workpiece 8. The airflow pressure and working fluid flow rate are preset in the main control unit 18.

[0057] The third gas pressure transmitter 15 converts the gas pressure output from the high-pressure gas source device 16 into a standard electrical signal and sends it to the main control unit 18. The main control unit 18 adjusts the gas pressure output from the gas pressure regulating valve 14 according to the preset gas pressure value. The liquid flow transmitter 22 converts the working liquid flow output from the water pump 20 into a standard electrical signal and sends it to the main control unit 18. The main control unit 18 adjusts the working liquid flow output from the liquid flow control valve 21 according to the preset working liquid flow value.

[0058] Combination Figure 4 The main control unit 18 sets the pulse discharge cycle, taking the duration of one or more consecutive group pulse discharges of the group pulse power supply 17 as a discharge cycle, and the pause time after the end of a discharge cycle as the air jet chip removal period.

[0059] During the pulse discharge cycle, the main control unit 18 closes the high-frequency gas pulse valve 13 and opens the high-frequency liquid pulse valve 23. The working fluid is drawn out of the working fluid tank 19 by the water pump 20 and enters the cutting gap through the upper water nozzle 4 and the lower water nozzle 10 along with the high-speed running electrode wire 3. Then, it is discharged from the processing gap along with some of the erosion products 25 generated by the inter-electrode discharge.

[0060] During the air jet chip removal cycle, the main control unit 18 closes the high-frequency liquid pulse valve 23 and opens the high-frequency gas pulse valve 13. High-pressure airflow is injected into the machining area inside the cut through the air jet nozzles 5, which are evenly distributed in the circumferential direction of the electrode wire 3, to blow away the residual etching products 25.

[0061] The first gas pressure transmitter 6 and the second gas pressure transmitter 12 both convert the detected airflow pressure into a standard electrical signal and send it to the main control unit 18. The main control unit 18 judges and analyzes the pressure difference between the two airflows: if the airflow pressure difference does not exceed the set value, it is considered that the ventilation of the processing area within the cut is good and no corrosion products have accumulated; if the airflow pressure difference exceeds the set value, it is considered that the ventilation of the processing area within the cut has deteriorated and corrosion products have accumulated. In this case, the main control unit 18 extends the inter-electrode air jet chip removal time until the airflow pressure difference drops to within the set range.

[0062] Then, the normal discharge cycle and air jet chip removal cycle are resumed alternately to maintain the processing, so as to remove the erosion products generated under the large pulse discharge energy from the discharge area in time and take away the heat between the electrodes, so as to avoid the erosion products 25 from accumulating and remaining in the cut and on the surface of the workpiece 8 until the processing is completed.

[0063] like Figure 5 As shown, Figure 5 This diagram illustrates the discharge chip removal process within the workpiece kerf in existing technology. During high-energy cutting, the amount of erosion products 25 and heat generated by the discharge increases. Furthermore, the heat generated by the discharge intensifies the vaporization of the working fluid. Along the wire guide direction of the electrode wire 3, the flow rate of the working fluid within the kerf gradually decreases, and in some areas, complete vaporization occurs, resulting in a lack of working fluid. Consequently, the erosion products 25 cannot be completely removed from the kerf due to the limited amount of working fluid and the movement of the electrode wire 3. As processing continues, the erosion products generated by each pulse discharge are difficult to completely remove from the kerf. Under the repeated action of high temperatures between electrodes, these products easily adhere to the surface of the workpiece 8, forming burn marks, which inevitably has an adverse effect on the normal discharge of the next discharge cycle.

[0064] However, after adopting the chip removal device and chip removal method provided in this patent, combined with Figure 6 During the chip removal cycle between pulse discharges, the pressure of the high-pressure airflow introduced into the kerf is controlled by the first gas pressure transmitter 6 and the second gas pressure transmitter 12. The introduced high-pressure airflow can blow away the erosion products 25 remaining in the kerf during each pulse discharge cycle and remove the heat generated by the discharge, thus preventing the large amount of erosion products generated during high-energy cutting from accumulating and adhering to the workpiece cutting surface, and providing a more ideal discharge environment for the next discharge cycle.

[0065] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A chip removal device between electrodes for reciprocating wire electrical discharge machining, characterized in that, The chip removal device is installed on the machine tool and includes an air jet system and a liquid supply system; The jet system is used to discharge the erosion products in the workpiece kerf during the intermittent pulse discharge cycle and to cool the workpiece and electrode wire. The jet system includes a jet nozzle, a gas source distributor and a high-pressure gas source device. The pipeline connecting the gas source distributor and the high-pressure gas source device is equipped with a high-frequency gas pulse valve and a gas pressure regulating valve. The high-frequency gas pulse valve is used to control the gas flow interruption and the gas pressure regulating valve is used to control the output gas flow pressure. The liquid supply system is used to provide a working medium during the pulse discharge cycle and to cool and clean the workpiece cut. The liquid supply system includes a working liquid tank, a water pump, an upper spray nozzle, and a lower spray nozzle. The working liquid tank and the upper and lower spray nozzles are connected by a three-way valve. The water pump is installed on the pipeline connecting the working liquid tank and the three-way valve. The pipeline connecting the working liquid tank and the three-way valve is also equipped with a liquid flow control valve and a high-frequency liquid pulse valve. The liquid flow control valve is used to control the liquid flow rate, and the high-frequency liquid pulse valve is used to control the on / off state of the liquid. The machine tool uses a grouped pulse power supply for electrical discharge machining. The negative terminal of the grouped pulse power supply is connected to the electrode wire, and the positive terminal of the grouped pulse power supply is connected to the workpiece. It also includes a control system, which is electrically connected to both the jet system and the liquid supply system, and is used to control the jet system and the liquid supply system to work alternately and cyclically. The control system includes a main control unit and multiple transmitters. The main control unit is electrically connected to the transmitters, the grouped pulse power supply, the high-frequency gas pulse valve, the gas pressure regulating valve, the liquid flow control valve, and the high-frequency liquid pulse valve. The transmitter includes a liquid flow transmitter and multiple gas pressure transmitters. The gas pressure transmitters are divided into a first gas pressure transmitter, a second gas pressure transmitter, and a third gas pressure transmitter. The first gas pressure transmitter is located on the underside of the workpiece, the second gas pressure transmitter is located at the inlet of the gas source distributor, the third gas pressure transmitter is located at the outlet of the high-pressure gas source device, and the liquid flow transmitter is located at the outlet of the water pump. The control system also includes a PC, which is connected to the main control unit via serial communication. The PC has a host computer interface, which is used to set chip removal and processing parameters, and to display the pressure difference curves of the second pressure transmitter and the first pressure transmitter in real time, so that the processing personnel can monitor the chip removal status between the electrodes in real time.

2. The reciprocating wire EDM chip removal device according to claim 1, characterized in that, The jet nozzles are provided in multiples and are evenly distributed in a circumferential shape on the jet nozzle support. The jet nozzle support is located above the workpiece, and the electrode wire passes through the central through hole of the jet nozzle support. The inlet of the air source distributor is connected to the high-pressure air source device, and the outlet is connected to each jet nozzle. The air source distributor is used to evenly distribute the high-pressure airflow to each jet nozzle.

3. The reciprocating wire EDM chip removal device according to claim 2, characterized in that, A support plate is connected to one side of the jet nozzle support. The support plate is connected to the column and can move up and down on the column.

4. The reciprocating wire EDM chip removal device according to claim 1, characterized in that, The electrode wire passes through the upper water nozzle, the through hole in the middle of the air nozzle support, and the lower water nozzle in sequence from top to bottom.

5. A method for chip removal between electrodes in a reciprocating wire electrical discharge machining (EDM) system, characterized in that, The reciprocating wire EDM chip removal device according to any one of claims 1 to 4 includes the following steps: a. Initialize the parameters of the chip removal device; b. During the pulse discharge cycle, the jet system is shut down and the liquid supply system is turned on by the control system, and the grouped pulse power supply is turned on for discharge processing; c. During the air jet chip removal cycle, the liquid supply system is shut down and the air jet system is turned on by the control system. The air jet system sprays high-pressure airflow into the machining area inside the workpiece kerf to blow out the residual discharge erosion products inside the kerf. d. By analyzing the pressure difference between the second gas pressure transmitter and the first gas pressure transmitter, determine whether there is any residual accumulation of discharge erosion products in the processing area within the cut. If the airflow pressure difference does not exceed the set value of the pressure difference, it means that there is no residual accumulation of discharge erosion products. Then repeat steps b to c until the cutting process is completed. If the airflow pressure difference exceeds the set value, it indicates that there is residual accumulation of discharge erosion products. In this case, the main control unit extends the inter-electrode jet chip removal time until the airflow pressure difference drops to the set range.

6. The reciprocating wire EDM chip removal method according to claim 5, characterized in that: The pulse discharge cycle consists of the duration of one or more consecutive groups of grouped pulse discharges from the grouped pulse power supply.

7. The reciprocating wire EDM chip removal method according to claim 5, characterized in that: The air jet chip removal cycle is set during the pause after the end of a pulse discharge cycle.

8. The reciprocating wire EDM chip removal method according to claim 5, characterized in that, The parameter initialization of the chip removal device includes setting the nozzle height, airflow pressure, working fluid flow rate, and the pressure difference between the second gas pressure transmitter and the first gas pressure transmitter.

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