Vacuum chuck device for silicon wafer detection

Abstract

The application discloses a vacuum chuck device for silicon wafer detection and relates to the technical field of silicon wafer detection and processing. The device comprises a detector for detecting the thickness of a silicon wafer, a mounting frame and a transmission assembly. A plurality of positioning plates are arranged on the mounting frame. First negative pressure chucks for adsorbing the lower surface of the silicon wafer are uniformly arranged on the positioning plates. The detector is located on one side of the positioning plates. A transfer path is formed between the mounting frame and the transmission assembly. A transfer frame is movably arranged on the transfer path. The transfer frame is located above the first negative pressure chucks. A lifting plate is arranged on the transfer frame. The lifting plate is arranged on the transfer frame in a lifting mode. Second negative pressure chucks for adsorbing the upper surface of the silicon wafer are arranged on the bottom of the lifting plate. The horizontal projection of the second negative pressure chucks coincides with the horizontal projection of the first negative pressure chucks. The device is convenient for nondestructive transfer of the silicon wafer after detection.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon wafer detection processing, and in particular to a vacuum chuck device for silicon wafer detection. BACKGROUND

[0002] The resistivity of a silicon wafer refers to the ratio of the resistance value at a specific temperature to the thickness of the silicon wafer, and is an important parameter for measuring the electrical conductivity of the silicon wafer. Therefore, the thickness of the silicon wafer is a very important parameter in the manufacturing process, and directly affects the electrical properties and mechanical strength of the silicon wafer.

[0003] At present, in the sorting process of the silicon wafer, a detector is needed to detect the thickness of the silicon wafer, and in order to ensure the stability of the silicon wafer detection process, a vacuum chuck is usually arranged at the bottom of the silicon wafer to achieve the fixing effect of the silicon wafer.

[0004] However, since the silicon wafer is fixed by the chuck during the detection process, after detection, the user needs to hold the side edge of the silicon wafer with his hand and pull the side edge of the silicon wafer upwards, but since the pulling force is difficult to control, the edge of the silicon wafer is easily broken, and it is difficult to non-destructively transfer the detected silicon wafer. SUMMARY

[0005] The present application provides a vacuum chuck device for silicon wafer detection, which facilitates non-destructive transfer of the detected silicon wafer.

[0006] The present application provides a vacuum chuck device for silicon wafer detection, which adopts the following technical solution:

[0007] A vacuum chuck device for silicon wafer detection, comprising a detector for detecting the thickness of the silicon wafer, a mounting frame, and a transmission assembly, wherein the mounting frame is provided with a plurality of positioning plates, the positioning plates are uniformly provided with first negative pressure chucks for adsorbing the lower surface of the silicon wafer, the detector is located on one side of the positioning plate, the mounting frame and the transmission assembly form a transfer path therebetween, a transfer frame is movably arranged on the transfer path, the transfer frame is located above the first negative pressure chucks, the transfer frame is provided with a lifting plate, the lifting plate is movably arranged on the transfer frame, the bottom of the lifting plate is provided with a second negative pressure chuck for adsorbing the upper surface of the silicon wafer, and the horizontal projection of the second negative pressure chuck coincides with the horizontal projection of the first negative pressure chuck.

[0008] By adopting the above technical scheme, since the silicon wafer is fixed by suction cups in the detection process, after detection, the user needs to hold the side edge of the silicon wafer by hand and pull the side edge of the silicon wafer upward, but the pulling force is difficult to control, thereby easily causing the edge of the silicon wafer to be broken. Therefore, by means of the lifting plate on the transfer frame, the lower surface of the first negative pressure suction cup is in contact with the upper surface of the silicon wafer, the silicon wafer is pulled upward to make the silicon wafer and the first negative pressure suction cup in a disengaged state, and the first negative pressure suction cup and the second negative pressure suction cup are matched with each other, so that the second negative pressure suction cup and the first negative pressure suction cup are in a registered state on the upper and lower surfaces of the silicon wafer, respectively, and the upward pulling force is uniformly distributed on the upper surface of the silicon wafer. Therefore, the edge of the silicon wafer can be effectively prevented from being broken, and the movable transfer frame is arranged between the detector and the transmission assembly. The silicon wafer after detection is transferred to the transmission assembly by the movable transfer frame, thereby facilitating the non-destructive transfer of the silicon wafer after detection.

[0009] Preferably, the mounting frame comprises a longitudinal beam, and the upper surface of the longitudinal beam is provided with a plurality of cross beams, and the cross beams are connected with the positioning plate.

[0010] By adopting the above technical scheme, the mounting frame is assembled by the longitudinal beam and a plurality of cross beams to form a stable mounting frame for providing a stable support platform for the positioning plate.

[0011] Preferably, the mounting frame further comprises a bottom plate, and a turntable is arranged between the bottom plate and the longitudinal beam.

[0012] By adopting the above technical scheme, since the thicknesses of the side edges of the silicon wafer are different, the bottom plate and the longitudinal beam are rotated to adjust the placement angle of the silicon wafer, thereby measuring the thicknesses of the side edges of the silicon wafer.

[0013] Preferably, at least two sets of clamping pieces are arranged on the mounting frame, and the clamping pieces are connected with the mounting frame through a rotating shaft, one end of the rotating shaft is provided with a bending part, and the other end of the rotating shaft is provided with a hydraulic rod, the hydraulic rod is rotatably arranged on the mounting frame, and the output end of the hydraulic rod is hingedly connected with the clamping piece.

[0014] By adopting the above technical scheme, before the detection of the silicon wafer, the silicon wafer is in a free state on the first negative pressure suction cup, and it is difficult to quickly position the position of the silicon wafer. Therefore, by driving the hydraulic rod, one end of the clamping piece is stressed, and the clamping piece rotates around the central axis of the rotating shaft. At this time, the other end of the clamping piece moves towards the edge of the silicon wafer. By relative movement of the two sets of clamping pieces, the silicon wafer is registered on the first negative pressure suction cup until the bending part is positioned at the edge of the silicon wafer, thereby achieving the effect of quickly positioning the silicon wafer.

[0015] Preferably, the transfer frame comprises a positioning frame, a driving assembly arranged on the positioning frame, and a sliding frame arranged at the output end of the driving assembly, the driving assembly is used to drive the sliding of the sliding frame on the positioning frame, and the positioning frame is located above the first negative pressure suction disc.

[0016] By adopting the above technical scheme, the sliding frame is driven by the driving assembly to slide back and forth on the positioning frame, so as to realize the function of directional transfer of the silicon wafer.

[0017] Preferably, a steel frame is arranged on the sliding frame, a limiting plate is arranged at the bottom of the steel frame, a limiting rod is arranged at the bottom of the limiting plate, the limiting rod penetrates the inside of the lifting plate, and the lifting plate is arranged on the limiting rod.

[0018] By adopting the above technical scheme, the lifting plate is at a suitable height by adjusting the up-down position of the lifting plate on the limiting rod, and the contact and separation of the second negative pressure suction disc with the upper surface of the silicon wafer are controlled by the lifting and lowering of the lifting plate. The lifting plate moves straight up and down under the limiting action of the limiting rod, so as to ensure the fit between the second negative pressure suction disc and the upper surface of the silicon wafer. In addition, the steel frame can enhance the stability between the sliding frame and the limiting plate.

[0019] Preferably, the driving assembly comprises a sliding groove arranged on the positioning frame and a driving motor, the output end of the driving motor is connected with a lead screw, the lead screw penetrates the sliding frame, and the sliding frame is arranged in the sliding groove.

[0020] By adopting the above technical scheme, since the movement of the sliding frame on the ground will cause bumping, it is easy to cause the surface of the silicon wafer to vibrate. In the process of transferring the silicon wafer, the upper surface of the silicon wafer is easy to separate from the second negative pressure suction disc. Therefore, in order to smoothly drive the sliding frame, the lead screw is driven by the driving motor to rotate, and the sliding frame is driven to slide back and forth in the sliding groove, so that the sliding frame is in a suspended state on the sliding frame, and the silicon wafer after detection is smoothly transferred.

[0021] Preferably, a through hole is arranged at the center position of the lifting plate, a pressing plate is arranged in the through hole in an extension manner, a gas cylinder is connected to the top of the pressing plate, the gas cylinder is fixed on the sliding frame, and the output end of the gas cylinder is connected with the upper surface of the pressing plate.

[0022] By adopting the above technical scheme, the lifting and lowering of the pressing plate are driven by the gas cylinder, the pressing plate passes through the through hole and abuts against the upper surface of the silicon wafer, the silicon wafer is pressed, the silicon wafer is stably connected with the first negative pressure suction disc, the air in the first negative pressure suction disc is discharged, and the stable transfer of the silicon wafer is realized.

[0023] Preferably, an adjusting rod is arranged at the top of the second negative pressure suction disc, and the adjusting rod penetrates and slides in the inside of the lifting plate.

[0024] By adopting the technical scheme, the adjusting rod is lifted in the inside of the lifting plate to realize the abutment between the second negative pressure suction disc and the upper surface of the silicon wafer and continuously apply pressure, so that the silicon wafer is stably adsorbed on the second negative pressure suction disc.

[0025] Preferably, the bottom horizontal surface of the second negative pressure suction disc is arranged in a staggered manner with the bottom horizontal surface of the pressing plate through the linkage arranged between the adjusting rod and the pressing plate.

[0026] By adopting the technical scheme, the linkage controls the positions of the second negative pressure suction disc and the pressing plate, so that the bottom horizontal surface of the second negative pressure suction disc is always in a staggered state with the bottom horizontal surface of the pressing plate. When the pressing plate moves downward and the bottom horizontal surface of the second negative pressure suction disc is higher than the bottom horizontal surface of the pressing plate, the upper surface of the silicon wafer is pressed by the pressing plate, so that the silicon wafer is stably adsorbed on the first negative pressure suction disc. When the pressing plate moves upward and the bottom horizontal surface of the second negative pressure suction disc is lower than the bottom horizontal surface of the pressing plate, the upper surface of the silicon wafer is contacted and adsorbed by the second negative pressure suction disc, so that the silicon wafer is stably adsorbed on the second negative pressure suction disc.

[0027] In summary, the present application has the following beneficial effects:

[0028] 1. The lower surface of the first negative pressure suction disc is contacted with the upper surface of the silicon wafer by means of the lifting plate on the transfer frame, the silicon wafer is pulled upward to be in a disengaged state with the first negative pressure suction disc, the first negative pressure suction disc and the second negative pressure suction disc are matched with each other, the second negative pressure suction disc and the first negative pressure suction disc are in a registered state on the upper and lower surfaces of the silicon wafer respectively, the upward pulling force is uniformly distributed on the upper surface of the silicon wafer, therefore, the edge of the silicon wafer can be effectively prevented from being broken, and the movable transfer frame is arranged between the detector and the transmission assembly, the silicon wafer after detection is transferred to the transmission assembly by the movable transfer frame, so that the silicon wafer after detection can be conveniently transferred without damage. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a schematic diagram of the overall structure of the vacuum suction disc device for silicon wafer detection in the embodiment;

[0030] Figure 2 is a schematic diagram of the internal structure of the mounting frame in the embodiment;

[0031] Figure 3 is a schematic diagram of the internal structure of the transfer frame in the embodiment;

[0032] Figure 4 is an exploded view of the structure between the pressing plate and the air cylinder in the embodiment;

[0033] Figure 5 is a schematic diagram of the structure of the Figure 4 enlarged structure at A in the embodiment;

[0034] Figure 6 is the overall structure schematic diagram of the second negative pressure suction disc in the upside state of the pressing plate in this embodiment;

[0035] Figure 7 is the overall structure schematic diagram of the second negative pressure suction disc in the downside state of the pressing plate in this embodiment;

[0036] Reference signs: 1, detector; 2, mounting frame; 201, longitudinal beam; 202, cross beam; 203, bottom plate; 3, transmission assembly; 4, positioning plate; 5, first negative pressure suction disc; 6, transfer frame; 601, positioning frame; 602, driving assembly; 60201, driving motor; 60202, sliding groove; 60203, screw rod; 603, sliding frame; 7, lifting plate; 8, second negative pressure suction disc; 9, rotating disc; 10, clamping piece; 11, rotating shaft; 12, bending part; 13, hydraulic rod; 14, steel frame; 15, limiting plate; 16, limiting rod; 17, through hole; 18, pressing plate; 19, air cylinder; 20, adjusting rod; 21, linkage piece; 2101, linkage rod; 2102, rotating rod; 2103, strip-shaped notch; 2104, movable block. DETAILED DESCRIPTION

[0037] The following further describes the present application in conjunction with the drawings. It is necessary to point out here that the following detailed description is only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application according to the above application content.

[0038] Embodiment: The present application discloses a vacuum suction disc device for silicon wafer detection, such as Figure 1As shown, it comprises a detector 1 for detecting the thickness of the silicon wafer, a mounting frame 2 and a transmission assembly 3, wherein the transmission assembly 3 is a belt machine, the mounting frame 2 is provided with a plurality of positioning plates 4, the positioning plates 4 are uniformly provided with first negative pressure suction cups 5 for adsorbing on the lower surface of the silicon wafer, the detector 1 is located on one side of the positioning plate 4, the mounting frame 2 and the transmission assembly 3 form a transfer path, a transfer frame 6 is movably arranged on the transfer path, the transfer frame 6 is located above the first negative pressure suction cup 5, the transfer frame 6 is provided with a lifting plate 7, the lifting plate 7 is lifted on the transfer frame 6, the bottom of the lifting plate 7 is provided with a second negative pressure suction cup 8 for adsorbing on the upper surface of the silicon wafer, the horizontal projection of the second negative pressure suction cup 8 and the horizontal projection of the first negative pressure suction cup 5 coincide with each other; Since the silicon wafer is fixed by suction cups during detection, after detection, the user needs to hold the side edge of the silicon wafer with his hand and pull the side edge of the silicon wafer upward, but it is difficult to control the upward pulling force, which may easily cause the edge of the silicon wafer to break, therefore, by means of the lifting plate 7 on the transfer frame 6, the lower surface of the first negative pressure suction cup 5 is in contact with the upper surface of the silicon wafer, the silicon wafer is pulled upward to make the silicon wafer and the first negative pressure suction cup 5 in a disengaged state, and the first negative pressure suction cup 5 and the second negative pressure suction cup 8 are matched with each other, so that the second negative pressure suction cup 8 and the first negative pressure suction cup 5 are respectively in a registration state on the upper and lower surfaces of the silicon wafer, and the upward pulling force is uniformly distributed on the upper surface of the silicon wafer, therefore, the edge of the silicon wafer can be effectively prevented from breaking, and by arranging the movable transfer frame 6 between the detector 1 and the transmission assembly 3, the silicon wafer after detection is transferred to the transmission assembly 3 by the movable transfer frame 6.

[0039] It is worth noting that the mounting frame 2 is provided with a negative pressure vacuum pump, and the negative pressure vacuum pump is provided with two output headers, the two output headers are provided with control valves, and the two output headers are respectively connected with the first negative pressure suction cup 5 and the second negative pressure suction cup 8 for controlling the internal air pressure of the first negative pressure suction cup 5 and the second negative pressure suction cup 8.

[0040] As shown in Figure 2 The mounting frame 2 comprises a longitudinal beam 201, the upper surface of the longitudinal beam 201 is provided with a plurality of cross beams 202, the cross beams 202 are connected with the positioning plates 4; the mounting frame 2 is assembled by the longitudinal beam 201 and a plurality of cross beams 202 to form a stable mounting frame 2 for providing a stable support platform for the positioning plates 4; the mounting frame 2 further comprises a bottom plate 203, the bottom plate 203 and the longitudinal beam 201 are provided with a rotating disc 9; since the thickness of each side edge of the silicon wafer is different, the bottom plate 203 and the longitudinal beam 201 are rotated by driving the rotating disc 9 to adjust the placing angle of the silicon wafer, so as to measure the thickness of each side edge of the silicon wafer.

[0041] As shown in Figure 2As shown, the mounting frame 2 is provided with at least two sets of clamping members 10, and the clamping members 10 and the mounting frame 2 are connected through a rotating shaft 11. The rotating shaft 11 is rotatably arranged on the mounting frame 2, and the rotating shaft 11 penetrates the middle part of the clamping member 10. One end of the rotating shaft 11 is provided with a bending part 12, and the other end of the rotating shaft 11 is provided with a hydraulic rod 13. The hydraulic rod 13 is rotatably arranged on the mounting frame 2, and the output end of the hydraulic rod 13 is hingedly connected with the clamping member 10. Before the detection of the silicon wafer, the silicon wafer is in a free state on the first negative pressure suction disc 5, and it is difficult to quickly position the position of the silicon wafer. Therefore, the one end of the clamping member 10 is stressed by driving the hydraulic rod 13, and the clamping member 10 rotates around the central axis of the rotating shaft 11. At this time, the other end of the clamping member 10, i.e. the bending part 12, moves towards the edge of the silicon wafer. Through the relative movement of the two sets of clamping members 10, the silicon wafer is aligned on the first negative pressure suction disc 5, until the bending part 12 is positioned at the edge of the silicon wafer, thereby achieving the effect of quickly positioning the silicon wafer.

[0042] As Figure 3As shown, the transfer frame 6 includes a positioning frame 601, a driving assembly 602 arranged on the positioning frame 601, and a sliding frame 603 arranged at the output end of the driving assembly 602, the driving assembly 602 is used to drive the sliding frame 603 to slide on the positioning frame 601, and the positioning frame 601 is located above the first negative pressure suction disc 5; the driving assembly 602 includes a sliding groove 60202 arranged on the positioning frame 601 and a driving motor 60201, the output end of the driving motor 60201 is connected with a lead screw 60203, the lead screw 60203 penetrates through the sliding frame 603, and the sliding frame 603 is slidingly arranged in the sliding groove 60202; since the movement of the sliding frame 603 on the ground will cause bumping, which is easy to cause the surface of the silicon wafer to vibrate, and the upper surface of the silicon wafer is easy to be separated from the second negative pressure suction disc 8 in the process of transferring the silicon wafer, therefore, in order to smoothly drive the sliding frame 603, the lead screw 60203 is driven by the driving motor 60201 to rotate, and the sliding frame 603 is driven to slide back and forth in the sliding groove 60202, so that the sliding frame 603 is in a suspended state on the sliding frame 603, which is used to smoothly transfer the detected silicon wafer; a steel frame 14 is arranged on the sliding frame 603, a limiting plate 15 is arranged at the bottom of the steel frame 14, a limiting rod 16 is arranged at the bottom of the limiting plate 15, the limiting rod 16 penetrates through the inside of the lifting plate 7, and the lifting plate 7 is liftingly arranged on the limiting rod 16; by adjusting the up-and-down position of the lifting plate 7 on the limiting rod 16, and using the bolt arranged on the lifting plate 7 to make the bolt top on the sliding interface between the lifting plate 7 and the limiting rod 16, the lifting plate 7 is fixed on the limiting rod 16, so that the lifting plate 7 is at a suitable height, and the contact and separation between the second negative pressure suction disc 8 and the upper surface of the silicon wafer are controlled by the lifting of the lifting plate 7, the lifting plate 7 moves straight up and down by the limiting action of the limiting rod 16, which is used to ensure the fit between the second negative pressure suction disc 8 and the upper surface of the silicon wafer, and the stability between the sliding frame 603 and the limiting plate 15 can be enhanced by the arranged steel frame 14.

[0043] As shown in the figure, Figure 4 A through hole 17 is arranged at the center position of the lifting plate 7, a pressing plate 18 is telescopically arranged in the through hole 17, the top of the pressing plate 18 is connected with a pneumatic cylinder 19, the pneumatic cylinder 19 is fixed on the sliding frame 603, and the output end of the pneumatic cylinder 19 is connected with the upper surface of the pressing plate 18; by arranging the pneumatic cylinder 19, the lifting of the pressing plate 18 is driven by the pneumatic cylinder 19, so that the pressing plate 18 penetrates through the through hole 17 and abuts against the upper surface of the silicon wafer, and the silicon wafer is pressed, so that the silicon wafer is stably connected with the first negative pressure suction disc 5, the air in the first negative pressure suction disc 5 is discharged, and the stable transfer of the silicon wafer is realized.

[0044] The top of the second negative pressure chuck 8 is provided with an adjusting rod 20 which penetrates and slides in the inside of the lifting plate 7; by driving the adjusting rod 20, the adjusting rod 20 is lifted and lowered in the inside of the lifting plate 7, so that the second negative pressure chuck 8 is abutted against the upper surface of the silicon wafer and continuously presses, so that the silicon wafer is stably adsorbed on the second negative pressure chuck 8.

[0045] As shown in Figure 5 The bottom horizontal surface of the second negative pressure chuck 8 is arranged in a staggered manner with the bottom horizontal surface of the pressing plate 18 by a linkage 21 arranged between the adjusting rod 20 and the pressing plate 18; the linkage 21 controls the positions of the second negative pressure chuck 8 and the pressing plate 18, so that the bottom horizontal surface of the second negative pressure chuck 8 and the bottom horizontal surface of the pressing plate 18 are always in a staggered state; the linkage 21 comprises a linkage rod 2101, the middle part of the linkage rod 2101 is provided with a bending part 12, and the inside of the bending part 12 penetrates a rotating rod 2102, the rotating rod 2102 is rotationally arranged on the lower surface of the lifting plate 7, one end of the rotating rod 2102 is rotationally connected with the upper surface of the pressing plate 18, the other end of the rotating rod 2102 is provided with a strip-shaped notch 2103, and the inside of the strip-shaped notch 2103 movably arranges a movable block 2104; here, the word "movable" can be understood as that the movable block 2104 can slide or rotate in the strip-shaped notch 2103, the movable block 2104 is connected with the adjusting rod 20; it is worth noting that in the initial state, the air cylinder 19 is in the contracted state, and the pressing plate 18 is located on the upper side of the second negative pressure chuck 8; when the air cylinder 19 drives the pressing plate 18 to move downward, the linkage rod 2101 is reversely rotated around the central axis of the rotating rod 2102, and under the limiting action of the movable block 2104, the adjusting rod 20 moves upward until the pressing plate 18 is located in the space below the second negative pressure chuck 8.

[0046] As shown in Figure 6 When the pressing plate 18 moves downward and the bottom horizontal surface of the second negative pressure chuck 8 is higher than the bottom horizontal surface of the pressing plate 18, the upper surface of the silicon wafer is pressed by the pressing plate 18, so that the silicon wafer is stably adsorbed on the first negative pressure chuck 5,

[0047] As shown in Figure 7 When the pressing plate 18 moves upward and the bottom horizontal surface of the second negative pressure chuck 8 is lower than the bottom horizontal surface of the pressing plate 18, the upper surface of the silicon wafer is contacted and adsorbed by the second negative pressure chuck 8, so that the silicon wafer is stably adsorbed on the second negative pressure chuck 8.

[0048] Working principle: before use, the user first flatly places the silicon wafer to be detected on the mounting frame 2, and then starts the power supply of the hydraulic rod 13, so that the clamping piece 10 rotates around the center axis of the rotating shaft 11 until the bent part of the clamping piece 10 is clamped on the edge of the silicon wafer, so as to realize the rapid positioning of the silicon wafer, then start the drive assembly 602, make the transfer frame 6 move to the upper side of the silicon wafer, then start the air cylinder 19, make the pressing plate 18 move downward until the upper surface of the silicon wafer, and continue to press, so that the silicon wafer is firmly adsorbed on the first negative pressure suction plate 5;

[0049] Then use the detector 1 to detect the thickness of the silicon wafer;

[0050] The detected silicon wafer is positioned on the first negative pressure suction plate 5, the pressing plate 18 is driven in reverse to move upward, and the second negative pressure suction plate 8 moves downward, until the second negative pressure suction plate 8 abuts against the upper surface of the silicon wafer, and continues to press, so that the silicon wafer is firmly adsorbed on the second negative pressure suction plate 8, and then the clamping piece 10 is driven in reverse to make the clamping piece 10 disengage from the positioning of the silicon wafer, and the power supply of the negative pressure vacuum pump is started, so that the inside of the first negative pressure suction plate 5 is in a positive pressure state, at this time the first negative pressure suction plate 5 disengages from the lower surface of the silicon wafer, and under the action of the air cylinder 19, the second negative pressure suction plate 8 moves upward to lift the silicon wafer.

[0051] Then drive the drive assembly 602 in reverse to make the transfer frame 6 move to the transmission assembly 3, use the negative pressure vacuum pump to make the inside of the second negative pressure suction plate 8 in a positive pressure state, at this time the silicon wafer is placed on the transmission assembly 3, and the transmission assembly 3 is used to convey the detected silicon wafer.

[0052] The above are the preferred embodiments of the present application, which do not limit the protection scope of the present application, therefore: any equivalent changes made on the structure, shape, principle of the present application should be covered in the protection scope of the present application.

Claims

1. A vacuum chuck device for silicon wafer inspection, characterized by: The utility model provides a silicon wafer thickness detection device, including detection appearance (1) for detecting silicon wafer thickness, mounting frame (2) and transmission assembly (3), be equipped with a plurality of positioning plate (4) on mounting frame (2), positioning plate (4) are uniformly equipped with first negative pressure sucking disc (5) for adsorbing in the lower surface of silicon wafer, detection appearance (1) is located in the side of positioning plate (4), the transfer path is formed between mounting frame (2) and transmission assembly (3), the transfer path is moved and is equipped with transfer frame (6), transfer frame (6) is located above first negative pressure sucking disc (5), be equipped with lifting plate (7) on transfer frame (6), lifting plate (7) is lifted and is equipped with in transfer frame (6), the bottom of lifting plate (7) is equipped with second negative pressure sucking disc (8) for adsorbing in the upper surface of silicon wafer, the horizontal projection of second negative pressure sucking disc (8) and the horizontal projection of first negative pressure sucking disc (5) coincide with each other, The center position of lifting plate (7) is equipped with through -hole (17), the inside telescopic of through -hole (17) is equipped with pressing plate (18), the top of pressing plate (18) is connected with pneumatic cylinder (19), pneumatic cylinder (19) is fixed on sliding frame (603), the output end of pneumatic cylinder (19) is connected with the upper surface of pressing plate (18); The top of second negative pressure sucking disc (8) is equipped with adjusting rod (20), adjusting rod (20) penetrates and slides in the inside of lifting plate (7); Through the linkage (21) between adjusting rod (20) and pressing plate (18), the bottom horizontal plane of second negative pressure sucking disc (8) and the bottom horizontal plane of pressing plate (18) are misaligned.

2. The vacuum chuck apparatus for silicon wafer inspection according to claim 1, wherein: The mounting frame (2) includes a longitudinal beam (201), and the upper surface of the longitudinal beam (201) is provided with a plurality of cross beams (202) connected with the positioning plates (4).

3. The vacuum chuck apparatus for silicon wafer inspection according to claim 2, wherein: The mounting frame (2) further includes a bottom plate (203) provided with a rotating disc (9) between the longitudinal beam (201).

4. The vacuum chuck apparatus for silicon wafer inspection according to claim 1, wherein: The mounting frame (2) is provided with at least two sets of clamping pieces (10), and the clamping pieces (10) are connected with the mounting frame (2) through rotating shafts (11). The rotating shafts (11) are rotatably arranged on the mounting frame (2) and penetrate the middle portions of the clamping pieces (10). One end of each rotating shaft (11) is provided with a bent portion (12), and the other end of the rotating shaft (11) is provided with a hydraulic rod (13) rotatably arranged on the mounting frame (2). The output end of the hydraulic rod (13) is hingedly connected with the clamping piece (10).

5. The vacuum chuck apparatus for silicon wafer inspection as recited in claim 1, wherein: The transfer frame (6) includes a positioning frame (601), a driving assembly (602) arranged on the positioning frame (601), and a sliding frame (603) arranged at the output end of the driving assembly (602). The driving assembly (602) is used to drive the sliding frame (603) to slide on the positioning frame (601), and the positioning frame (601) is located above the first negative pressure sucking disc (5).

6. The vacuum chuck apparatus for silicon wafer inspection according to claim 5, wherein: The sliding frame (603) is provided with a steel frame (14), the bottom of the steel frame (14) is provided with a limiting plate (15), the bottom of the limiting plate (15) is provided with a limiting rod (16), the limiting rod (16) penetrates the inside of the lifting plate (7), and the lifting plate (7) is lifted and arranged on the limiting rod (16).

7. The vacuum chuck apparatus for silicon wafer inspection as claimed in claim 5, wherein: The driving assembly (602) comprises a sliding groove (60202) and a driving motor (60201) arranged on the positioning frame (601), the output end of the driving motor (60201) is connected with a lead screw (60203), the lead screw (60203) penetrates the sliding frame (603), and the sliding frame (603) is slidably arranged in the sliding groove (60202).

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