Substrate peeling method for ceramic-copper clad substrate with lead

Abstract

The present application relates to a kind of base material stripping method of pin ceramic copper-clad substrate, using base material stripping tool to strip pin, the base material stripping tool includes rack and several clamping devices, positioning device and breaking device respectively installed on rack, each described clamping device and rack form clamping work site, the positioning device points to clamping work site, the breaking device is installed in the output end of clamping work site, and the stripping method includes the following steps: S1: processing breaking mark on ceramic copper-clad substrate;S2: copper-clad substrate is pushed into clamping work site, and the positioning device is embedded into processing breaking mark in turn to position copper-clad substrate;S3: each described clamping device clamps copper-clad substrate;S4: the breaking device bends along breaking mark at copper-clad substrate, and stripping quality is good.

Description

Technical Field

[0001] The invention relates to the technical field of copper-clad substrate production, in particular to a method for stripping a base material of a ceramic copper-clad substrate with pins. Background Art

[0002] Generally speaking, the finished product of the copper-clad substrate is composed of a substrate and a copper sheet. Ceramics are divided into materials such as alumina and ZTA. The substrate is large and the covered copper sheet is small, so that pins cannot be formed. In order to make a copper-clad substrate with pins, the copper-clad substrate is broken apart to separate the substrate and the copper sheet. After discarding the excess substrate, copper pins can be left on the remaining copper-clad substrate. However, the quality of manual breaking is poor, and there is an urgent need for a tooling that can stably break the substrate and copper sheet apart. Summary of the Invention

[0003] In order to overcome the technical defects of the prior art, the present invention provides a substrate stripping method of a ceramic copper-clad substrate with pins, which has good stripping quality.

[0004] The technical solution adopted by the present invention is:

[0005] A method for stripping a substrate of a ceramic copper-clad substrate with pins is provided, wherein the pins are stripped using a substrate stripping tool. The substrate stripping tool comprises a frame and a plurality of clamping devices, positioning devices, and breaking devices respectively mounted on the frame. A clamping work position is formed between each of the clamping devices and the frame. The positioning device points to the clamping work position. The breaking device is mounted at the output end of the clamping work position. The stripping method comprises the following steps:

[0006] S1: Processing breaking marks on ceramic copper-clad substrate;

[0007] S2: Push the copper-clad substrate into the clamping work position, and the positioning device is embedded in the processing breaking mark to position the copper-clad substrate;

[0008] S3: Each of the clamping devices clamps the copper-clad substrate;

[0009] S4: The breaking device bends the copper-clad substrate along the breaking mark.

[0010] Preferably, the frame includes a base and a support frame, the support frame is mounted on the base, and each of the clamping devices and positioning devices is mounted on the support frame.

[0011] Preferably, the positioning device in S2 includes a positioning column and a positioning spring, the positioning column passes through the support frame and slides up and down along the support frame, the two ends of the positioning spring are respectively installed on the positioning column and the support frame, and the direction of action of the positioning spring causes the positioning column to be pressed toward the clamping working position.

[0012] Preferably, the end of the positioning column is provided with a sharp corner.

[0013] Preferably, each of the clamping devices includes a clamping bolt, a clamping knob and a clamping block, the clamping bolt is connected to the support frame through a threaded pair, the clamping knob is fixed on the top of the clamping bolt, and the clamping block is fixed on the bottom of the clamping bolt.

[0014] Preferably, a breaking arc is provided on one side of the base close to the output end of the clamping work position, and the breaking device rotates along the breaking arc, and the breaking device squeezes the ceramic copper-clad substrate in the direction of the breaking arc.

[0015] Preferably, the breaking device includes a breaking roller and two breaking links, the two ends of the breaking roller are rotatably mounted on the breaking links, the two breaking links are rotatably mounted on the side of the base close to the breaking arc, and the center of the motion trajectory of the breaking roller coincides with the center of the breaking arc.

[0016] Preferably, the breaking device further comprises an operating frame, and the operating frame is installed at the output ends of the two breaking connecting rods.

[0017] The beneficial effects of the present invention are:

[0018] A method for stripping a substrate of a ceramic copper-clad substrate with pins is provided, wherein the pins are stripped using a substrate stripping tool. The substrate stripping tool comprises a frame and a plurality of clamping devices, positioning devices, and breaking devices respectively mounted on the frame. A clamping work position is formed between each of the clamping devices and the frame. The positioning device points to the clamping work position. The breaking device is mounted at the output end of the clamping work position. The stripping method comprises the following steps:

[0019] S1: Processing a breaking mark on the ceramic copper-clad substrate. Specifically, the breaking mark is a notch distributed along a straight line by cutting and burning with a laser cutting machine. The ceramic copper-clad substrate can be broken by breaking it apart along the breaking mark.

[0020] S2: Push the copper-clad substrate into the clamping working position, and the positioning device is embedded in the processing breaking mark to position the copper-clad substrate. The positioning device is embedded in the processing breaking mark, and the positioning device conveniently positions the copper-clad substrate, and the breaking mark is accurately close to the breaking device, with high positioning efficiency, accurate positioning and convenient positioning;

[0021] S3: Each of the clamping devices clamps the copper-clad substrate, and clamps the copper-clad substrate on the substrate stripping tool;

[0022] S4: The breaking device bends the copper-clad substrate along the breaking mark to separate the copper sheet and the substrate, removes the peeled substrate to expose the copper sheet, and forms the copper sheet into pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1It is a schematic diagram of the overall structure of the present invention.

[0024] Figure 2 for Figure 1 Enlarged schematic diagram of point A in the middle.

[0025] Figure 3 It is a side view schematic diagram of the positional relationship between the present invention and the ceramic substrate.

[0026] Figure 4 It is a side view schematic diagram of the present invention.

[0027] Figure 5 Schematic diagram of the ceramic substrate structure.

[0028] Figure 6 This shows the relationship between the ceramic substrate and the base during the peeling process.

[0029] Description of reference numerals:

[0030] 1. Frame; 2. Clamping device; 3. Positioning device; 4. Breaking device; 5. Clamping work station; 31. Positioning column; 32. Positioning tension spring; 21. Clamping bolt; 22. Clamping knob; 23. Pressing block; 11. Breaking arc; 12. Base; 13. Support frame; 41. Breaking roller; 42. Breaking connecting rod; 43. Operating frame; 6. Base plate; 7. Copper sheet. DETAILED DESCRIPTION

[0031] The present invention will be further described below in conjunction with the accompanying drawings:

[0032] like Figure 1-6 As shown, this embodiment provides a substrate stripping method for a ceramic copper-clad substrate with pins, using a substrate stripping tool to strip the pins. The substrate stripping tool includes a frame 1 and a plurality of clamping devices 2, positioning devices 3 and breaking devices 4 respectively installed on the frame 1. A clamping work position 5 is formed between each clamping device 2 and the frame 1. The positioning device 3 points to the clamping work position 5. The breaking device 4 is installed at the output end of the clamping work position 5. The stripping method includes the following steps:

[0033] S1: Processing a breaking mark on the ceramic copper-clad substrate. Specifically, the breaking mark is a notch distributed along a straight line by cutting and burning on the substrate 6 using a laser cutting machine. The ceramic copper-clad substrate can be broken by breaking it apart along the breaking mark.

[0034] S2: Push the copper-clad substrate into the clamping work position 5, and the positioning device 3 is embedded in the processing breaking mark to position the copper-clad substrate. The positioning device 3 is embedded in the processing breaking mark, and the positioning device 3 conveniently positions the copper-clad substrate, and accurately places the breaking mark close to the breaking device 4, with high positioning efficiency, accurate positioning and convenient positioning;

[0035] Specifically, the positioning device 3 includes a positioning column 31 and a positioning spring 32. The positioning column 31 passes through the support frame 13 and slides up and down along the support frame 13. The two ends of the positioning spring 32 are respectively installed on the positioning column 31 and the support frame 13. The action direction of the positioning spring 32 makes the positioning column 31 press toward the clamping working position 5. The end of the positioning column 31 is provided with a sharp corner. After the copper-clad substrate is slowly pushed in from the clamping working position 5, the sharp corner of the positioning column 31 slides along the copper sheet 7 until it falls into the breaking mark and clamps the copper-clad substrate, thereby positioning the copper-clad substrate.

[0036] S3: Each clamping device 2 clamps the copper-clad substrate and clamps the copper-clad substrate on the substrate stripping tool;

[0037] S4: The breaking device 4 bends the copper-clad substrate along the breaking mark to separate the copper sheet 7 and the substrate 6, removes the peeled substrate 6 to expose the copper sheet 7, and forms the copper sheet 7 into a lead.

[0038] The frame 1 includes a base 12 and a support frame 13. The support frame 13 is installed on the base 12 by welding. Each clamping device 2 and the positioning device 3 are installed on the support frame 13. The support frame 13 is used to fix each clamping device 2, and to increase the distance between each clamping device 2 and the base 12 so that a clamping work position 5 is formed between each clamping device 2 and the base 12.

[0039] Each clamping device 2 includes a clamping bolt 21, a clamping knob 22 and a clamping block 23. The clamping bolt 21 is connected to the support frame 13 through a threaded pair. The clamping knob 22 is fixed on the top of the clamping bolt 21, and the clamping block 23 is fixed on the bottom of the clamping bolt 21. After the copper-clad substrate is positioned by the positioning device 3, each clamping knob 22 is rotated to allow each clamping block 23 to clamp the substrate 6, thereby fixing the substrate 6 before the breaking operation.

[0040] A breaking arc 11 is provided on one side of the base 12 near the output end of the clamping work position 5. The breaking device 4 rotates along the breaking arc 11. The breaking device 4 squeezes the ceramic copper-clad substrate in the direction of the breaking arc 11. The breaking device 4 includes a breaking roller 41, an operating frame 43 and two breaking links 42. The two ends of the breaking roller 41 are rotatably mounted on the breaking links 42. The two breaking links 42 are rotatably mounted on the side of the base 12 near the breaking arc 11. The center of the motion trajectory of the breaking roller 41 coincides with the center of the breaking arc 11. The operating frame 43 is mounted on the two breaking links. At the output end of the breaking link 42, the operating frame 43 drives the two breaking links 42 and the breaking roller 41 to rotate with the axis of the breaking arc 11 as the hinge axis. The breaking roller 41 breaks the ceramic copper-clad substrate and makes the broken substrate 6 gradually rotate along the breaking arc 11. Since the substrate 6 is a hard material and the copper sheet 7 is soft and deformable, the copper sheet 7 will fit into the breaking arc 11 during the gradual rotation of the substrate 6 along the breaking arc 11, so that the substrate 6 and the copper sheet 7 are gradually separated. Due to the gradual separation of the copper sheet 7 and the substrate 6 by the breaking arc 11, the peeling quality is good.

[0041] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which shall fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A method for stripping a base material of a ceramic copper-clad substrate with pins, characterized in that: A substrate stripping tool is used to strip pins. The substrate stripping tool includes a frame and several clamping devices, positioning devices and breaking devices respectively installed on the frame. A clamping work station is formed between each clamping device and the frame. The frame includes a base and a support frame. The support frame is installed on the base. Each clamping device and positioning device is installed on the support frame. A breaking arc is provided on one side of the base close to the output end of the clamping work station. The breaking device rotates along the breaking arc. The breaking device squeezes the ceramic copper-clad substrate in the direction of the breaking arc. The positioning device points to the clamping work station. The breaking device is installed at the output end of the clamping work station. The stripping method includes the following steps: S1: Processing breaking marks on ceramic copper-clad substrate; S2: Push the copper-clad substrate into the clamping work position, and the positioning device is embedded in the processing breaking mark to position the copper-clad substrate; S3: Each of the clamping devices clamps the copper-clad substrate; S4: The breaking device bends the copper-clad substrate along the breaking mark to separate the copper sheet and the substrate, removes the peeled substrate to expose the copper sheet, and forms the copper sheet into pins.

2. The method for stripping the base material of the ceramic copper clad substrate with leads according to claim 1, characterized in that: The positioning device in S2 includes a positioning column and a positioning spring. The positioning column passes through the support frame and slides up and down along the support frame. The two ends of the positioning spring are respectively installed on the positioning column and the support frame. The direction of action of the positioning spring causes the positioning column to be pressed toward the clamping working position.

3. The method for stripping the base material of the ceramic copper-clad substrate with leads according to claim 2, wherein: The end of the positioning column is provided with a sharp corner.

4. The method for stripping the base material of the ceramic copper clad substrate with leads according to claim 1, characterized in that: Each of the clamping devices includes a clamping bolt, a clamping knob and a clamping block. The clamping bolt is connected to the support frame through a threaded pair. The clamping knob is fixed on the top of the clamping bolt, and the clamping block is fixed on the bottom of the clamping bolt.

5. The method for stripping the base material of the ceramic copper clad substrate with leads according to claim 1, characterized in that: The breaking device includes a breaking roller and two breaking connecting rods, the two ends of the breaking roller are rotatably mounted on the breaking connecting rods, the two breaking connecting rods are rotatably mounted on the side of the base close to the breaking arc, and the center of the motion trajectory of the breaking roller coincides with the center of the breaking arc.

6. The method for stripping the base material of the ceramic copper clad substrate with leads according to claim 5, characterized in that: The breaking device further comprises an operating frame, which is mounted on the output ends of the two breaking connecting rods.

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