Back-drilling detection method and system

Abstract

The present specification provides a back drilling detection method and system, comprising: acquiring a back drilling program of a to-be-tested board, and calling theoretical position information of a to-be-back-drilled hole from the back drilling program; acquiring an image of the to-be-tested board, and determining processing position information of the to-be-back-drilled hole according to the image of the to-be-tested board; generating a hole position compensation file based on the theoretical position information and the processing position information; modifying the back drilling program according to the hole position compensation file to obtain a compensated back drilling program; back drilling the to-be-tested board by using the compensated back drilling program; and back drilling detecting the to-be-tested board after back drilling processing by using the compensated back drilling program. The hole position in the back drilling program is compensated by using the processing position information acquired from the image of the to-be-tested board, so as to ensure the back drilling precision; meanwhile, the compensated back drilling program is used for detection, so that the detection result is more accurate.

Description

Technical Field

[0001] This manual relates to the field of circuit board processing technology, and in particular to back-drilling inspection methods and systems. Background Technology

[0002] With the development of Internet technology, the demand for circuit boards such as high-speed communication backplanes and high-performance cloud servers has grown rapidly. Furthermore, with the increase in technical requirements, the traces on printed circuit boards (PCBs) are becoming denser, the overall hole diameter is becoming smaller, and the requirements for back-drilling processes are becoming increasingly stringent, as are the alignment accuracy requirements.

[0003] In existing technologies, PCB circuit boards typically undergo multiple processing steps. For example, before back drilling, there are processes such as copper plating. During these processes, the resin in the PCB expands and contracts due to temperature variations. If back drilling is performed directly on the PCB after the initial drilling according to a pre-set back drilling program, back drilling deviation may occur. This deviation affects the control of the length of the residual copper stub, which has a significant impact on signal transmission. If the residual copper stub is too long, it may cause significant signal transmission loss or even damage the integrity of signal transmission. Therefore, ensuring back drilling accuracy is a problem that urgently needs to be solved. Summary of the Invention

[0004] In view of this, embodiments of this specification provide a back-drilling detection method. This specification also relates to a back-drilling detection system to address the technical deficiencies existing in the prior art.

[0005] According to a first aspect of the embodiments of this specification, a back-drilling detection method is provided, comprising:

[0006] Obtain the back-drilling program of the board under test, and retrieve the theoretical position information of the hole to be back-drilled from the back-drilling program;

[0007] Acquire an image of the board under test, and determine the processing position information of the back drill hole based on the image of the board under test;

[0008] A hole position compensation file is generated based on the theoretical position information and the machining position information;

[0009] The back-drilling program is modified according to the hole position compensation file to obtain a compensated back-drilling program;

[0010] The test board is back-drilled using the aforementioned compensation back-drilling program.

[0011] The back-drilling test is performed on the test board after back-drilling using the aforementioned compensation back-drilling program.

[0012] Optionally, the method for generating a hole position compensation file based on the theoretical position information and the machining position information includes:

[0013] Based on the theoretical position information and the processing position information, calculate the position deviation information of each back-drilled hole in the test board;

[0014] Based on the positional deviation information of all back-drilled holes in the test plate, a hole position compensation file corresponding to the test plate is generated.

[0015] Optionally, the method for modifying the back-drilling program according to the hole position compensation file to obtain a compensated back-drilling program includes:

[0016] The back-drilling program is modified using the hole position compensation file to obtain the compensated back-drilling program corresponding to the test board;

[0017] Establish the binding relationship between the compensation back-drilling program and the board under test, and write the compensation back-drilling program into the file sharing directory.

[0018] Optionally, the method of performing back-drilling on the test board using the compensated back-drilling program includes:

[0019] When the back-drilling processing task corresponding to the board under test is triggered, the compensation back-drilling program bound to the current board under test is read from the file sharing directory according to the binding relationship.

[0020] The test board is back-drilled according to the compensation back-drilling program.

[0021] Optionally, the method for performing back-drilling detection on the test board after back-drilling using the compensated back-drilling program includes:

[0022] According to the binding relationship, the compensation back-drilling program bound to the current test board is read in the file sharing directory, and the compensation position information of the back-drilling hole is retrieved from the compensation back-drilling program.

[0023] Obtain a back-drilled image of the board under test after back-drilling, and determine the back-drilling position information of the back-drilled hole based on the back-drilled image;

[0024] Based on the compensation position information and the back drill position information, calculate the back drill hole deviation information for each back drill hole in the test board after back drill processing.

[0025] Based on the back-drilling hole deviation information of all back-drilled holes in the test board after back-drilling, it is determined whether the back-drilling of the test board meets the back-drilling requirements.

[0026] Optionally, the method for determining whether the back-drilling of the test board meets the back-drilling requirements based on the back-drilling hole deviation information of all back-drilled holes in the test board after back-drilling includes:

[0027] Based on the back-drilling hole deviation information of all back-drilled holes in the test board after back-drilling, determine the deviation value of each back-drilled hole.

[0028] The deviation value of each back drill hole is compared with a preset deviation threshold.

[0029] If the deviation of a set number of back-drilled holes is greater than the preset deviation threshold, then the back-drilling of the side plate to be drilled is determined to be non-compliant with the back-drilling requirements.

[0030] Optionally, the method for acquiring an image of the test board and determining the machining position information of the back-drilling hole based on the image of the test board includes:

[0031] Obtain the first drilling program of the test board, and retrieve the first drilling theoretical position information of each back-drilling hole in the test board from the first drilling program;

[0032] An image of the test board is acquired, and the processing position information of all the back-drilled holes is determined from the image using the theoretical position information of all the back-drilled holes.

[0033] Optionally, the back-drilling detection method further includes:

[0034] Determine the identification information of the board under test;

[0035] For each board under test, a binding relationship is established between the hole position compensation file, the compensation back drilling program, and the identification information to form a data package that corresponds one-to-one with the board under test, and the data package is written to the file sharing directory.

[0036] Optionally, after comparing the deviation value of each back-drilled hole with a preset deviation threshold, the method further includes:

[0037] If no deviation value of any back-drilled hole is greater than the preset deviation threshold, then the back-drilling of the side plate to be drilled is determined to meet the back-drilling requirements.

[0038] Establish a detection binding relationship between the back-drilling test results corresponding to the back-drilling requirements and the board under test, so as to form a test result package that corresponds one-to-one with the board under test, and write the test result package into the file sharing directory.

[0039] Optionally, the back-drilling detection method further includes:

[0040] When the usage task corresponding to the board under test is triggered, the detection result package is read from the file sharing directory according to the detection binding relationship;

[0041] Based on the test results, it is determined whether the test board after back-drilling meets the usage requirements corresponding to the task.

[0042] According to a second aspect of the embodiments of this specification, a back-drilling detection system is provided, comprising:

[0043] The program acquisition module is configured to acquire the back drilling program of the board under test and retrieve the theoretical position information of the back drilling hole from the back drilling program.

[0044] The image acquisition module is configured to acquire an image of the board under test and determine the processing position information of the back drill hole based on the image of the board under test;

[0045] The file generation module is configured to generate a hole position compensation file based on the theoretical position information and the machining position information;

[0046] The correction module is configured to correct the back-drilling program according to the hole position compensation file to obtain a compensated back-drilling program.

[0047] The back-drilling module is configured to perform back-drilling on the board under test using the compensated back-drilling program.

[0048] The back-drilling detection module is configured to perform back-drilling detection on the test board after back-drilling processing using the compensated back-drilling program.

[0049] Optionally, the file generation module includes a calculation information unit and a file generation unit;

[0050] The calculation information unit is configured to calculate the position deviation information of each back-drilled hole in the test board based on the theoretical position information and the processing position information;

[0051] The file generation unit is configured to generate a hole position compensation file corresponding to the side plate based on the position deviation information of all back-drilled holes in the test plate.

[0052] Optionally, the system further includes a cloud database; the correction program module includes a program correction unit and a relationship establishment unit;

[0053] The program correction unit is configured to use the hole position compensation file to correct the back drilling program to obtain the compensated back drilling program corresponding to the test board.

[0054] The relationship establishment unit is configured to establish a binding relationship between the compensation back-drilling program and the board under test, and send the compensation back-drilling program to the cloud database.

[0055] The cloud database includes a file-sharing directory; the compensation back-drilling program is written to the file-sharing directory.

[0056] Optionally, the back-drilling module includes a request program unit and a back-drilling processing unit;

[0057] The request program unit is configured to send a program read request to the cloud database according to the binding relationship when the back-drilling processing task corresponding to the board under test is triggered, and to receive the compensation back-drilling program fed back by the cloud database in response to the program read request.

[0058] The back-drilling processing unit is configured to perform back-drilling processing on the holes to be back-drilled in the test board according to the compensated back-drilling program.

[0059] Optionally, the back drill detection module includes an information retrieval unit, an image acquisition unit, a deviation information calculation unit, and a back drill detection unit;

[0060] The information retrieval unit is configured to read the compensation back-drilling program bound to the current test board in the file sharing directory according to the binding relationship, and retrieve the compensation position information of the back-drilling hole from the compensation back-drilling program.

[0061] The image acquisition unit is configured to acquire a back-drilled image of the board under test after back-drilling processing, and determine the back-drilling position information of the back-drilled hole based on the back-drilled image.

[0062] The deviation calculation unit is configured to calculate the back-drill hole deviation information of each back-drill hole in the test board after back-drilling based on the compensation position information and the back-drill position information.

[0063] The back-drilling detection unit is configured to determine whether the back-drilling of the test board meets the back-drilling requirements based on the back-drilling hole deviation information of all back-drilled holes in the test board after back-drilling processing.

[0064] The back-drilling inspection method provided in this embodiment aims to improve back-drilling accuracy and perform back-drilled hole inspection after back-drilling to determine whether the board under test can be used for subsequent operations. First, the back-drilling program of the board under test is acquired to extract the theoretical position information of the back-drilled holes. Simultaneously, an image of the board under test is acquired to determine the processing position information of the back-drilled holes. Based on this, a hole position compensation file is generated according to the theoretical and processing position information. The hole position compensation file is then used to correct the back-drilling program, resulting in a corrected compensated back-drilling program. This compensated program is then used to perform back-drilling on the board under test, ensuring back-drilling accuracy. After back-drilling, the compensated program is used again to perform back-drilling inspection on the board under test to determine if the back-drilled holes are in positional deviation. Boards with correct back-drilled holes are selected for subsequent processing to avoid producing unusable boards. Attached Figure Description

[0065] Figure 1 This is a schematic diagram of a back-drilling detection method provided in one embodiment of this specification;

[0066] Figure 2 This is a flowchart of a back-drilling detection method provided in one embodiment of this specification;

[0067] Figure 3 This is a schematic diagram of the back-drilling process in a back-drilling detection method provided in one embodiment of this specification;

[0068] Figure 4 This is a schematic diagram of the back-drilling process in another back-drilling detection method provided in one embodiment of this specification;

[0069] Figure 5 This is a schematic diagram of the structure of a back-drilling detection system provided in one embodiment of this specification;

[0070] Figure 6 This is a structural block diagram of a computing device provided in one embodiment of this specification. Detailed Implementation

[0071] Many specific details are set forth in the following description to provide a full understanding of this specification. However, this specification can be implemented in many other ways than those described herein, and those skilled in the art can make similar extensions without departing from the spirit of this specification. Therefore, this specification is not limited to the specific implementations disclosed below.

[0072] The terminology used in one or more embodiments of this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the one or more embodiments of this specification. The singular forms “a,” “described,” and “the” as used in one or more embodiments of this specification and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in one or more embodiments of this specification refers to and includes any or all possible combinations of one or more associated listed items.

[0073] It should be understood that although the terms first, second, etc., may be used to describe various information in one or more embodiments of this specification, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, first may also be referred to as second without departing from the scope of one or more embodiments of this specification, and similarly, second may also be referred to as first. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to a determination."

[0074] This specification provides a back-drilling detection method, and also relates to a back-drilling detection system and a computing device, which will be described in detail in the following embodiments.

[0075] See Figure 1 The schematic diagram shown illustrates the back-drilling detection method provided in this embodiment. To improve back-drilling accuracy and enable back-drilled hole detection after back-drilling to determine whether the board under test can be used for subsequent operations, the back-drilling program of the board under test can be obtained first. The theoretical position information of the back-drilled holes in the board under test can be extracted from the back-drilling program. At the same time, an image of the board under test can be obtained to determine the processing position information of the back-drilled holes based on the image. Based on this, a hole position compensation file can be generated according to the theoretical position information and the processing position information. This allows for the determination of the hole position deviation of the back-drilled holes after one drilling by combining the actual position information and the theoretical position information. This enables subsequent correction of the hole position deviation, thereby ensuring back-drilling accuracy. Based on this, the back-drilling program can be modified using the hole position compensation file to obtain the modified compensated back-drilling program. At this time, the compensated back-drilling program can be used to perform back-drilling on the test board. After the back-drilling process, the compensated back-drilling program can be used again to perform back-drilling inspection on the test board to determine whether the back-drilled holes in the test board are in positional deviation. Test boards with no problems in the back-drilled holes can be selected for subsequent processing to avoid producing unusable test boards.

[0076] Figure 2 A flowchart of a back-drilling detection method according to an embodiment of this specification is shown, which specifically includes the following steps:

[0077] Step S202: Obtain the back drilling program of the board to be tested, and retrieve the theoretical position information of the hole to be back drilled from the back drilling program.

[0078] The back-drilling inspection method provided in this embodiment is applied to the back-drilling processing stage. That is, the board under test obtained at this stage has already undergone one drilling operation, leaving at least one through-hole. The location and diameter of the through-hole are determined according to actual requirements. The through-hole enables interconnection between different layers of the board under test, facilitates the insertion and soldering of electronic components onto the board, and provides positioning or alignment points for subsequent processing steps. The drilling can be achieved through at least one of laser drilling, punching, and milling. For example, the through-hole can also be located in the insulating areas of different layers of the printed circuit board. This embodiment does not impose any limitations on this method.

[0079] Specifically, the board under test (TBT) refers to a printed circuit board that requires back-drilling processing. It can be a PCB (Printed Circuit Board), IC substrate, or other types of material; this embodiment does not impose any limitations. Correspondingly, the back-drilling program is a data structure that records the theoretical position, diameter, and first-drill tool information of the holes to be back-drilled on the TTB. It is associated with the back-drilling tape and the back-drilling information table; that is, the above information is recorded in the back-drilling tape and the back-drilling information table respectively, to facilitate the subsequent generation of back-drilling information. Correspondingly, the holes to be back-drilled specifically refer to the through-holes among the multiple through-holes remaining after the first drilling of the TTB, which require back-drilling processing. This allows back-drilling of the holes during the back-drilling process. Correspondingly, the theoretical position information specifically includes the coordinate information of the holes to be back-drilled in the back-drilling program.

[0080] Therefore, when back drilling is required after the test board has completed one drilling operation, in order to avoid deviations in back drilling that may affect the use of the test board, the back drilling program of the test board can be obtained first, and the back drilling holes in the test board that need to be back drilled can be identified. Then, the theoretical position information corresponding to the back drilling holes can be extracted from the back drilling program, so as to facilitate subsequent position correction by combining the actual position information of the back drilling holes. This ensures that back drilling can be performed through the corrected compensation file, thereby ensuring the accuracy of back drilling.

[0081] In practical applications, the acquisition of the back-drilling program and the extraction of theoretical position information can be accomplished by information processing equipment. Information processing equipment specifically refers to equipment used for calculation and analysis, such as computers deployed according to business needs. This embodiment does not impose any limitations.

[0082] Step S204: Obtain an image of the board to be tested, and determine the processing position information of the back drilling hole based on the image of the board to be tested.

[0083] Specifically, after extracting the theoretical position information of the back-drilled hole in the test board, in order to avoid the position error that may occur after the first drilling during back drilling, an image of the test board can be acquired. Then, the processing position information of the back-drilled hole can be located based on the image of the test board, that is, the actual position information of the back-drilled hole, so as to facilitate the subsequent position correction before back drilling according to the position information, thereby ensuring the accuracy of back drilling.

[0084] Specifically, the image of the test board refers to the image taken with the back-drilling surface as the shooting surface of the test board that needs to be back-drilled. This image can be obtained through a position information acquisition device, which is a device that can determine the position information of the back-drilled holes on the test board. That is, it can scan the test board and record the actual position of each through hole (including the hole to be drilled) to facilitate the subsequent construction of hole position compensation files based on the theoretical position of the back-drilled holes. The position information acquisition device can be a CCD (charge coupled device camera). Correspondingly, the processing position information specifically refers to the actual position information of the hole to be back-drilled after the first drilling process. Because the first drilling stage may have problems such as tool precision and resin expansion and contraction due to temperature, the through hole formed after the first drilling may have a certain deviation from the theoretical position of the first drilling (the coordinate position set in the first drilling program). If back drilling is performed according to the theoretical position of back drilling (the coordinate position set in the original back drilling program), it may cause the back drilling to deviate from the first drilling, thus affecting the normal use of the circuit board. Therefore, the processing position information of the hole to be back-drilled can be collected, and a hole position compensation file can be constructed by combining the processing position information and the theoretical position information to ensure the accuracy of back drilling during the back drilling process.

[0085] It should be noted that the location information of any back-drilled hole on the test board is determined using the same coordinate system to ensure that different location information determined at different stages can be jointly calculated, facilitating downstream business use. All location information is located using coordinate values ​​in both the X and Y axes.

[0086] In practical applications, when locating the machining position information of a back-drilled hole based on an image, to ensure positioning accuracy, the theoretical position information of the hole to be drilled can be determined first. Then, based on this, the hole closest to the theoretical position information in the image of the test board can be selected as the same back-drilled hole. Finally, the actual position information of this hole can be determined based on the image and used as the machining position information. Alternatively, the theoretical position information of each back-drilled hole in the test board can be determined, and the image position information of each hole can be located simultaneously. Then, the difference between the theoretical and image position information of the back-drilled holes with a mapping relationship can be calculated, and the hole with the smallest difference can be selected as the same back-drilled hole. Finally, the machining position information can be located based on the image position information of this hole.

[0087] It should be noted that, in order to ensure the accuracy of the conversion when determining the processing position information from the image position information, a conversion matrix between the image position and the processing position can be pre-constructed. Then, the processing position information is calculated based on the image position information and the conversion matrix. The conversion matrix can be constructed by locating a known point in the image and another known point on the test board that has a mapping relationship with the known point in the image. Then, the conversion matrix is ​​constructed based on the coordinate conversion relationship between the two known points.

[0088] Furthermore, in determining the machining position information of each back-drilled hole in the test board, considering that the accuracy of the machining position information determination will affect the accuracy of the back-drilling process, in order to ensure the accuracy of the back-drilling process, the theoretical position information of the first drill can be extracted by acquiring the first drill program of the test board, and then the image of the test board can be acquired. Based on the theoretical position information of the first drill, the machining position information of the back-drilled hole can be determined from the image. In this embodiment, the specific implementation method is as follows:

[0089] Obtain the first drilling program of the test board, and retrieve the first drilling theoretical position information of each back-drilling hole in the test board from the first drilling program; obtain an image of the test board, and use the first drilling theoretical position information of all the back-drilling holes to determine the processing position information of all the back-drilling holes from the image.

[0090] Specifically, the "one-drill program" refers to a data structure that records the theoretical position, diameter, and tool information of the hole to be drilled when the board under test undergoes one-drill processing. Correspondingly, the theoretical position information of one-drill refers to the theoretical position information of each hole to be back-drilled in the board under test. Ideally, after one-drill processing, the hole position formed after one-drill overlaps with the theoretical position of one-drill, and the theoretical position information of the hole to be back-drilled at this time is also the theoretical position information of one-drill. Correspondingly, the position of the back-drilled hole after back-drill processing should also overlap with the theoretical position of one-drill. However, due to errors in the processing, the position may change. Therefore, it is necessary to combine the theoretical position information of the hole to be back-drilled with the theoretical position information of one-drill from the image to locate the processing position information of the hole to be back-drilled.

[0091] Based on this, after obtaining the theoretical position information of the holes to be back-drilled, in order to ensure the accuracy of the machining position positioning and thus realize the subsequent construction of hole position compensation files, the first drilling program of the test board can be obtained first. The method of obtaining the first drilling program is the same as that of obtaining the back drilling program mentioned above, and will not be elaborated on in this embodiment. Then, the theoretical position information of the first drilling of each hole to be back-drilled in the test board can be retrieved from the first drilling program. After that, an image of the test board can be obtained. Then, using the theoretical position information of the first drilling of all holes to be back-drilled as the reference position, the through hole with the smallest position error with the hole to be back-drilled in the image is selected as the same hole to be back-drilled. Then, the position information of the hole is located according to the image, which can be used as the machining position information of the hole to be back-drilled. The machining position information of each hole to be back-drilled is implemented in this way.

[0092] It should be noted that since the board under test is a printed circuit board after one drilling process, its back drilling surface is opposite to the first drilling surface. For example, if the PCB board has two sides, A and B, and the first drilling is completed on side A, then the back drilling needs to be completed on side B. Therefore, after obtaining the theoretical position information of the through hole formed by the first drilling from the first drilling program, coordinate transformation is required. That is, based on the oppositeity between the back drilling and the first drilling surface, the coordinates of the through hole in the first drilling program can be flipped. For example, if the coordinates of hole 1 in the first drilling are (x, y), then the flipped coordinates are (x, -y). On this basis, it can be matched with the theoretical position information of the hole to be back drilled in the back drilling program. In other words, the hole position information in the first drilling program with the same coordinates as the back drilling program after the coordinate flip can be marked as the position information of the hole to be back drilled, that is, the theoretical position information of the hole to be back drilled.

[0093] Furthermore, after determining the theoretical position information of the first drill hole to be back drilled, in order to accurately locate the processing position information of the first drill hole based on the image, the theoretical position information of all the first drill holes to be back drilled can be selected as the reference position information. Then, each reference position information is added to the image. Based on this, through holes with a deviation from the reference position information within a certain range are selected in the image as the back drill holes. Then, the theoretical position information of the back drill holes to be back drilled can be repositioned according to the image. For example, the theoretical position information of the first drill hole to be back drilled 1 is (x1, y1). After adding it to the image, through holes with a coordinate deviation range of 2 to 3 μ (this range can be customized according to the processing accuracy) can be selected as the corresponding back drill holes to be back drilled 1 in the image. After comparison, it is determined that the back drill hole 2 in the image belongs to this deviation range. Then, the back drill hole 2 in the image is considered to be the back drill hole 1 in the test board. Then, based on the image, the coordinates of the back drill hole 2 can be located, and it can be used as the processing position information of the back drill hole 1.

[0094] In addition, the hole with the smallest deviation within the range can be used as the same hole to be drilled. For example, if it is determined by comparison that holes 2 and 3 in the image are within the deviation range, then the deviation values ​​between holes 2 and 3 and the reference position information of hole 1 can be calculated. The hole with the smallest absolute deviation value can be marked as the same hole to be drilled as hole 1. Then, based on the image, the coordinates of the hole to be drilled can be located and used as the processing position information of hole 1.

[0095] In summary, by combining image positioning with the processing position information of the hole to be back-drilled, and considering that the positioning basis is influenced by the theoretical position information of the first drill, the positioning accuracy can be ensured. This facilitates the subsequent construction of a hole position compensation file by combining the processing position information and the theoretical position information, thus ensuring the accuracy of back-drilling during back-drilling processing.

[0096] Step S206: Generate a hole position compensation file based on the theoretical position information and the processing position information.

[0097] To ensure accurate back-drilling during the back-drilling stage and to inspect the back-drilling results afterward to determine the usability of the board under test, a hole position compensation file can be generated for each hole to be back-drilled on the board under test by combining the processing position information and theoretical position information of each hole. This allows subsequent back-drilling and back-drilling inspection processes to be based on the hole position compensation file.

[0098] Specifically, the hole position compensation file records the deviation distance between the actual position and the theoretical position of the hole to be back-drilled. This information is used to adjust the processing position of the CNC drilling machine, enabling back-drilling of the hole at the actual position to form a back-drilled hole with a high degree of overlap with a drilled hole. The hole position compensation file can also be used to detect the back-drilling accuracy of the back-drilled hole formed after back-drilling.

[0099] Furthermore, during the generation of the hole position compensation file, in order to ensure that the hole position compensation file corresponds to the test board, the deviation information of each back-drilled hole in the test board is recorded for subsequent use. The position deviation information of each back-drilled hole can be calculated by combining the processing position information and the theoretical position information. In this embodiment, the specific implementation method is as follows:

[0100] Based on the theoretical position information and the processing position information, the position deviation information of each back-drilled hole in the test board is calculated; based on the position deviation information of all back-drilled holes in the test board, a hole position compensation file corresponding to the test board is generated.

[0101] Specifically, the positional deviation information refers to the information obtained by calculating the coordinate difference between the machining position information and the theoretical position information of the hole to be back-drilled. This information includes the horizontal coordinate deviation value and the vertical coordinate deviation value, and the offset direction can be distinguished by + / -. Based on this, after determining the theoretical and machining position information of each hole to be back-drilled in the test board, in order to ensure the accuracy of the back-drilling position during the back-drilling process, the positional deviation information of each hole to be back-drilled in the test board can be calculated based on the theoretical and machining position information of each hole to be back-drilled. This determines the deviation between each hole to be back-drilled after the first drilling and the theoretical back-drilling position information. Using this deviation, a hole position compensation file corresponding to the test board can be generated, so that the back-drilling program of the test board can be updated using the hole position compensation file to correct the deviation information based on the theoretical position information of the hole to be back-drilled, thereby ensuring that the back-drilling process can be completed on the hole position after the first drilling.

[0102] Continuing with the previous example, such as Figure 3 As shown, after determining the hole to be drilled 1 and its corresponding theoretical coordinates (x1, y1) and diameter r1, a CCD camera can be used to detect the hole position of the hole to be drilled 1 on the PCB circuit board. Based on the hole position detection results, the actual coordinates of the hole to be drilled 1 are determined to be (x11, y11), and the diameter is r11 (where r1 = r11). Then, the x-axis coordinates and y-axis coordinates of the theoretical coordinates and the actual coordinates are compared respectively, and it is determined that x1 - x11 = 5mil and y1 - y11 = 3mil. It can be determined that after one drilling, the hole to be drilled 1 formed is 5mil downward and 3mil to the left relative to the theoretical coordinates set at the time of the first drilling. Its x-axis and y-axis deviations are as follows. Figure 3 As shown. If back drilling is to be performed subsequently, the CNC drilling machine needs to be adjusted to adjust the deviation distance before completing the back drilling to ensure accuracy. Therefore, a hole position compensation file for the PCB board can be generated based on a downward deviation of 5mil and a leftward deviation of 3mil for convenient subsequent use.

[0103] In summary, by constructing a hole position compensation file by combining the reference position information and processing position information of the hole to be drilled, it is possible to ensure the positioning deviation distance at multiple angles, which facilitates the subsequent processing stage. The hole position compensation file can be used to correct the processing position and detect the hole position of the back drill.

[0104] Step S208: Modify the back-drilling program according to the hole position compensation file to obtain a compensated back-drilling program.

[0105] Specifically, after obtaining the hole position compensation file of the test board based on the processing position information and theoretical position information of the hole to be back drilled, in order to ensure that the back drilling process can perform back drilling on the actual position of the hole to be back drilled, the hole position compensation file can be used to modify the back drilling program of the test board to obtain a compensated back drilling program. This program adds the deviation information of the hole position compensation file to the theoretical position information of the hole to be back drilled in the back drilling program, so as to obtain the actual back drilling position information required for the actual back drilling process.

[0106] The compensated back-drilling program specifically refers to the back-drilling program that is composed of the actual back-drilling position information obtained after correcting the theoretical position information of the hole to be back-drilled in the back-drilling program. The CNC drilling machine can directly perform back-drilling on the test plate according to the compensated back-drilling program, thereby ensuring the accuracy of back-drilling.

[0107] In practical applications, when using the hole position compensation file to correct the back drilling program of the test board, the calculation is actually based on the horizontal and vertical coordinate deviation information recorded in the hole position compensation file and the theoretical coordinate information of the hole to be back drilled in the back drilling program. The horizontal and vertical coordinate deviation information is added or subtracted on the theoretical coordinate information to obtain the true back drilling position information. Then, the theoretical position information in the back drilling program is replaced with this information to obtain the compensated back drilling program, so that the true back drilling position information in the compensated back drilling program can be directly used for back drilling processing in the future.

[0108] Following the previous example, once the hole position compensation file x000001 (downward deviation 5mil, leftward deviation 3mil) corresponding to the hole to be back drilled 1 is obtained, the deviation information recorded in the hole position compensation file can be used to correct the theoretical coordinates (x1, y1) of the hole to be back drilled 1 in the back drilling program of the PCB board. The corrected real position information corresponding to the hole to be back drilled 1 is (x1-5mil, y1-3mil). By using this coordinate information to update the back drilling program of the PCB board, the corresponding compensated back drilling program of the PCB board can be obtained, which is convenient for subsequent back drilling processing.

[0109] Furthermore, after completing the back-drilling program correction, considering that the CNC drilling machine and the information processing device that generates the hole position compensation file may not belong to the same control terminal during use, in order to enable the CNC drilling machine to obtain the compensation back-drilling program corresponding to the circuit board being back-drilled at the current moment, the compensation back-drilling program can be stored in a shared file directory, and other entities in the subsequent processing can read the compensation back-drilling program from the directory; in this embodiment, the specific implementation method is as follows:

[0110] The back-drilling program is modified using the hole position compensation file to obtain the compensation back-drilling program corresponding to the test board; the binding relationship between the compensation back-drilling program and the test board is established, and the compensation back-drilling program is written to the file sharing directory.

[0111] Specifically, the file sharing directory refers to the directory used to store the compensation back-drilling program corresponding to the board under test. It can exist in a mobile storage medium, such as a mobile hard drive or USB flash drive, or it can be a network shared directory. That is, after the information processing device completes the correction of the back-drilling program, it can write the compensation back-drilling program to the mobile storage medium or the network shared directory, so that when the CNC drilling machine performs back-drilling processing on the board under test, it can read and use it from the mobile storage medium or the network shared directory.

[0112] Based on this, after correcting the back-drilling program using the hole position compensation file, a compensated back-drilling program corresponding to the test board is obtained. To ensure that the CNC drilling machine and hole position detection equipment are readily available and that the read compensated back-drilling program has a unique correspondence with the test board, a binding relationship can be established between the compensated back-drilling program and the test board. This binding relationship can be established by scanning a QR code, barcode, or specifying printed text; this embodiment does not impose any limitations. After establishing the binding relationship between the test board and the compensated back-drilling program, the compensated back-drilling program can be written to a shared file directory to achieve persistence of the program. This facilitates subsequent back-drilling processing and detection by retrieving the compensated back-drilling program from the shared file directory based on the binding relationship, thereby ensuring the accuracy of back-drilling and the precision of back-drilling detection.

[0113] It should be noted that when the file-sharing directory exists on a removable storage medium, after the compensation back-drilling program is written to this directory, the user needs to plug and unplug the removable storage medium into the CNC drilling machine for the CNC drilling machine to be able to read and use the compensation back-drilling program from the removable storage medium. When the file-sharing directory is a network-shared directory, it is necessary to ensure that both the information processing equipment and the CNC drilling machine are connected to the network-shared directory to enable the writing and reading of the compensation back-drilling program via the network. In practical applications, the storage format of the file-sharing directory can be selected as needed; this embodiment does not impose any limitations.

[0114] Following the previous example, after obtaining the compensation back-drilling program corresponding to the PCB board, the binding relationship between the compensation back-drilling program and the PCB board can be established by scanning the QR code on the PCB. Then, the compensation back-drilling program can be written to the network shared directory. This allows the compensation back-drilling program that is bound to the QR code on the PCB board to be read from the network shared directory when performing back-drilling or back-drilling detection on the PCB board.

[0115] In summary, by establishing a binding relationship between the compensation back-drilling program and the test board, and writing it to the file sharing directory, it is more convenient for CNC drilling machines and hole position detection equipment to directly read the required compensation back-drilling program from the file sharing directory, thereby realizing automatic adjustment of the spindle machining position and hole position detection, and effectively improving back-drilling efficiency.

[0116] Step S210: Perform back drilling on the test board using the compensation back drilling program.

[0117] Specifically, after constructing the compensation back-drilling program as described above, when back-drilling is required, the compensation back-drilling program can be directly used to back-drill the test board. That is, since the compensation back-drilling program records the actual position information of the hole to be back-drilled, the back-drilling machine can directly perform back-drilling according to the actual position information in the compensation back-drilling program, thereby ensuring the accuracy of the back-drilling. This embodiment uses a CNC drilling machine as an example for illustration, but this should not limit the scope of protection of this application. In other embodiments, the back-drilling machine can also be a laser drilling machine or other types of drilling equipment.

[0118] In practical applications, back-drilling involves controlling the CNC drilling machine's spindle position according to the compensation back-drilling program. In other words, once the CNC drilling machine obtains the compensation back-drilling program, it can adjust the spindle position based on the actual hole position information within the program. This aligns the adjusted spindle position with the actual position of the hole to be back-drilled. The adjusted spindle position is then used to perform back-drilling on the test board, creating a back-drilled hole that coincides with the center of a drilled hole. Specifically, the spindle position refers to the location of the tool used for back-drilling. Adjusting the spindle position allows for adjustment of the tool's position, ensuring the tool is aligned with the hole for back-drilling.

[0119] In addition, the CNC drilling machine can scan the work order with a barcode scanner to load the back drilling tape, thereby identifying the back drilling holes on the test board that need to be back drilled. At the same time, the CNC drilling machine can use the configured CCD camera to capture the image identifier of the test board, and read the corresponding compensation back drilling program of the current test board from the network shared directory based on the image identifier. This allows the spindle on the CNC drilling machine to perform back drilling using the real position information in the compensation back drilling program, ensuring that the back drilling hole coincides with a drilled hole.

[0120] Furthermore, during back-drilling processing, considering that its processing technology may not be continuous with the compensation back-drilling program, the compensation back-drilling program will be written to the file-shared directory. Therefore, when back-drilling processing is required, the compensation back-drilling program needs to be read from the file-shared directory first, and then the back-drilling processing can be performed. In this embodiment, the specific implementation method is as follows:

[0121] When the back-drilling processing task corresponding to the board under test is triggered, the compensation back-drilling program bound to the current board under test is read from the file-shared directory according to the binding relationship; and the back-drilling processing of the board under test is performed according to the compensation back-drilling program.

[0122] Specifically, the back-drilling task refers to the task triggered when the test board undergoes back-drilling processing. Therefore, when the back-drilling task corresponding to the test board is triggered, it indicates that the CNC drilling machine needs to perform back-drilling processing on the test board. In this case, an image identifier of the test board can be acquired using a scanning device. Based on the image identifier, a compensation back-drilling program bound to the image identifier can be read from the shared file directory. This compensation back-drilling program is then used to perform the back-drilling processing, thereby ensuring the accuracy of the back-drilling process.

[0123] Following the previous example, when back-drilling is required on a PCB board, a barcode scanner can be used to read the QR code on the PCB board. Then, based on this QR code, the corresponding compensation back-drilling program for the PCB board can be retrieved from a network shared directory. At this point, the actual position information (x1-5mil, y1-3mil) corresponding to the hole to be back-drilled (1) in the compensation back-drilling program can be used to adjust the spindle machining position on the CNC drilling machine, aligning the adjusted tool with the coordinates (x1-5mil, y1-3mil). This ensures the tool can coincide with the actual hole position of the hole to be back-drilled (1). Then, back-drilling is performed, forming a back-drilled hole on the PCB board. The back-drilled hole is shown below. Figure 4 As shown.

[0124] In summary, by adjusting the spindle machining position of the CNC drilling machine in conjunction with the compensation back-drilling program, it can be ensured that the CNC drilling machine's cutting tool coincides with the hole position after the first drilling. On this basis, back-drilling machining can be performed to ensure the accuracy of back-drilling machining.

[0125] Step S212: Use the compensated back-drilling program to perform back-drilling detection on the test board after back-drilling processing.

[0126] Specifically, after back-drilling the board under test using the compensation back-drilling program, back-drilled holes will be formed on the board. However, considering that during back-drilling, due to factors such as the precision of the drilling equipment, there may be a deviation between the actual back-drilled hole position and the theoretical back-drilled position, i.e., a deviation between the back-drilled hole and the first drilled hole (back-drilling deviation), if the deviation between the back-drilled hole formed and the position information recorded in the compensation back-drilling program is large, it may affect the use of the printed circuit board. Therefore, after back-drilling is completed, the compensation back-drilling program can be used again to perform back-drilling inspection on the back-drilled board under test to determine whether the board under test can be used, thereby avoiding the problem of related components being unusable after being soldered to the circuit board, thus wasting resources.

[0127] In addition, back-drilling detection can be completed by a hole position detection device. Specifically, the hole position detection device is a calculation device that collects the actual position information of the back-drilled holes formed after the back-drilling process on the test board and calculates the theoretical position information. The hole position detection device is also equipped with a position information acquisition device and a scanning device to collect the actual position information of the back-drilled holes and calculate the theoretical position information of the back-drilled holes.

[0128] Furthermore, when performing back-drilling detection on the test board after back-drilling using the compensated back-drilling program, the position information of the back-drilled hole in the compensated back-drilling program is actually used as the reference position information for detection. Then, it is compared with the actual position information of the back-drilled hole formed after back-drilling on the test board, and the detection result is determined based on the comparison result. In this embodiment, the specific implementation method is as follows:

[0129] According to the binding relationship, the compensation back-drilling program bound to the current test board is read from the file sharing directory, and the compensation position information of the back-drilling hole is retrieved from the compensation back-drilling program; the back-drilling image of the test board after back-drilling is obtained, and the back-drilling position information of the back-drilling hole is determined according to the back-drilling image; based on the compensation position information and the back-drilling position information, the back-drilling hole deviation information of each back-drilling hole in the test board after back-drilling is calculated; based on the back-drilling hole deviation information of all back-drilling holes in the test board after back-drilling is processed, it is determined whether the back-drilling of the test board meets the back-drilling requirements.

[0130] Specifically, the compensation position information refers to the theoretical position information corresponding to the back-drilled holes formed after compensation on the test board. Conversely, the back-drilled position information refers to the actual position information corresponding to the back-drilled holes formed after back-drilling processing on the test board. Furthermore, the back-drilled image refers to the image acquired from the back-drilled test board; the back-drilled hole deviation information refers to the calculated deviation between the actual and theoretical position information of each back-drilled hole; and the back-drilling requirements refer to the conditions (preset inspection standards) for verifying the qualification of the back-drilling processing of the test board, used to determine whether the back-drilled test board can be used for downstream business.

[0131] The process of determining the back drill hole location information based on the back drill image is similar to the process of determining the processing location information of the back drill hole based on the image of the test board described above, and will not be elaborated further in this embodiment.

[0132] Continuing with the previous example, when it forms as follows Figure 4After back-drilling the holes as shown, to ensure that the PCB board can be used for subsequent component soldering, the corresponding compensation back-drilling program for the PCB board can be read from the network shared directory using a hole position detection device. Since back-drilling hole 1 is back-drilled according to the compensated coordinates (x1-5mil, y1-3mil), the actual coordinates (x111, y111) of the back-drilling hole on the PCB board can be acquired by the CCD camera of the hole position detection device. By comparing x111 with x1-5mil, it is determined that the back-drilling hole deviates to the right by a length 'a'. By comparing y111 with y1-3mil, it is determined that the back-drilling hole deviates upward by a length 'b'. Then, by comparing the above deviation information with the back-drilling requirements, it can be determined whether the back-drilling of the PCB board is accurate.

[0133] In summary, by combining the compensation back-drilling program with back-drilling testing of the test board, it is possible to judge the accuracy of the back-drilling results after back-drilling processing, thereby facilitating downstream businesses to decide whether to use the test board.

[0134] Furthermore, after obtaining the back-drill hole position deviation information of all back-drilled holes in the board under test, in order to determine whether the board under test is usable, a deviation threshold comparison method can be used to make the determination. In this embodiment, the specific implementation method is as follows:

[0135] Based on the back-drilling hole deviation information of all back-drilled holes in the test board after back-drilling, the deviation value of each back-drilled hole is determined; the deviation value of each back-drilled hole is compared with a preset deviation threshold; if the deviation value of a set number of back-drilled holes is greater than the preset deviation threshold, it is determined that the back-drilling of the test board does not meet the back-drilling requirements. If no back-drilled hole has a deviation value greater than the preset deviation threshold, it is determined that the back-drilling of the test board meets the back-drilling requirements; a detection binding relationship is established between the back-drilling detection results corresponding to the back-drilling requirements and the test board to form a detection result package corresponding one-to-one with the test board, and the detection result package is written to the file sharing directory.

[0136] Specifically, the preset deviation threshold refers to a threshold for comparing the deviation value of each back-drilled hole. It is used to determine whether the deviation of each back-drilled hole is too large, thereby determining whether the board under test meets the back-drilling requirements. The test results may include the back-drilling position information of the back-drilled holes obtained from the test, the back-drilling hole deviation information, the deviation values ​​of the horizontal and vertical axes, and the comparison conclusion between the deviation values ​​and the preset deviation threshold.

[0137] Based on this, considering that the board under test is a high-precision printed circuit board, any significant deviation in a single back-drilled hole could render the board unusable. Therefore, during back-drilling testing, after obtaining the back-drilling hole deviation information for all back-drilled holes on the board under test, the deviation value of each back-drilled hole can be determined. This deviation value can then be compared with a preset deviation threshold. If a set number of back-drilled holes have deviation values ​​greater than the preset threshold, the back-drilling of the board under test is deemed non-compliant. If no single back-drilled hole has a deviation value greater than the preset threshold, the back-drilling of the board under test is deemed compliant. Furthermore, to facilitate subsequent secondary verification of back-drilling accuracy when using the board under test, a binding relationship can be established between the back-drilling test results corresponding to the back-drilling requirements and the board under test, forming a test result package that corresponds one-to-one with the board under test. This test result package is then written to a shared file directory. Subsequent processing allows reading the test result package from the shared file directory for secondary verification of the board under test, preventing any omissions.

[0138] Continuing with the previous example, if 'a' is greater than the lateral deviation threshold 'a1' and / or 'b' is greater than the longitudinal deviation threshold 'b1', it indicates a low overlap between the back-drilled hole and the hole to be back-drilled (1). Therefore, the PCB does not meet the back-drilling requirements and cannot be used for subsequent processing, requiring scrapping. If 'a' is less than the lateral deviation threshold 'a1' and 'b' is less than the longitudinal deviation threshold 'b1', it indicates a high overlap between the back-drilled hole and the hole to be back-drilled (1). Therefore, the PCB meets the back-drilling requirements and can be used for subsequent processing. To further verify the PCB when it is used, a binding relationship can be established between the back-drilling test results and the PCB itself, forming a corresponding test result package. This package can then be written to a network shared directory, allowing the test result package to be read from the network shared directory during the application phase to determine the back-drilling result of the PCB.

[0139] In summary, by using a deviation threshold to determine back-drilling requirements, the accuracy of the determination results can be ensured. Writing the test result package to a shared file directory facilitates secondary verification by downstream users. In this embodiment, test result packages are only created for PCBs that pass the test, saving space in the network shared directory. Of course, in other embodiments, test result packages can also be created for PCBs that fail the test, allowing engineers to analyze the negative results and make technical improvements. The specific scope of the test result package can be set according to the specific application scenario, and this application does not limit it.

[0140] Based on this, when the board under test needs to be used, the test result package can be read directly from the file-shared directory based on the test binding relationship, thereby checking whether the board under test is usable according to the test results. In this embodiment, the specific implementation method is as follows:

[0141] When the usage task corresponding to the board under test is triggered, the detection result package is read from the file sharing directory according to the detection binding relationship; and the detection result package is used to determine whether the board under test after back-drilling meets the usage requirements corresponding to the usage task.

[0142] Specifically, the usage task refers to the task triggered when the test board that meets the back-drilling requirements needs to be used, such as a task to perform subsequent processing on the test board. In actual implementation, the usage task can be set according to different processing stages of the test board, and this embodiment does not make any limitations here.

[0143] Based on this, when the usage task corresponding to the board under test is triggered, it indicates that the board under test needs to be used at this time. In order to avoid the board under test being unable to pass the test when it is used, the test result package can be read from the file sharing directory according to the test binding relationship. Based on the data information contained in the test result package, it can be determined whether the board under test after back-drilling meets the usage requirements corresponding to the usage task, thereby deciding whether to use the board under test.

[0144] Furthermore, to enable traceability of the back-drilling test results of the test board at any subsequent stage, a binding relationship can be established between the test board, the hole position compensation file, and the compensation back-drilling program. Data packets can then be written to the file-shared directory based on this relationship. In this implementation, the specific implementation method is as follows:

[0145] Determine the identification information of the board under test; establish a binding relationship between the hole position compensation file, the compensation back drilling program and the identification information for each board under test to form a data packet corresponding to the board under test, and write the data packet to the file sharing directory.

[0146] Specifically, the identification information refers to the unique identification information corresponding to the board under test, including but not limited to QR codes, barcodes, or printed text. This embodiment does not make any limitations here. Correspondingly, the data package specifically refers to the data package composed of the hole position compensation file, the compensation back drilling program, and the identification information. In addition, the data package may also include the through hole program and / or the back drilling program. This embodiment does not make any limitations here.

[0147] Based on this, in order to facilitate downstream businesses in using the board under test (BUT) to test the back-drilling process or back-drilling accuracy, the identification information of the BUT can be determined first. Then, through the binding relationship established between the BUT, the hole position compensation file, the compensation back-drilling program, and the identification information, the data packets corresponding to the BUT can be retrieved from the file sharing directory. Since the data packets record all the data content corresponding to the BUT during the back-drilling stage, the previous processing data of the BUT can be read from the data packets and used by downstream businesses when using the BUT.

[0148] The back-drilling inspection method provided in this embodiment aims to improve back-drilling accuracy and perform back-drilled hole inspection after back-drilling to determine whether the board under test can be used for subsequent operations. First, the back-drilling program of the board under test is acquired to extract the theoretical position information of the back-drilled holes. Simultaneously, an image of the board under test is acquired to determine the processing position information of the back-drilled holes. Based on this, a hole position compensation file is generated according to the theoretical and processing position information. The hole position compensation file is then used to correct the back-drilling program, resulting in a corrected compensated back-drilling program. This compensated program is then used to perform back-drilling on the board under test, ensuring back-drilling accuracy. After back-drilling, the compensated program is used again to perform back-drilling inspection on the board under test to determine if the back-drilled holes are in positional deviation. Boards with correct back-drilled holes are selected for subsequent processing to avoid producing unusable boards.

[0149] Corresponding to the above method embodiments, this specification also provides embodiments of a back-drilling detection system. Figure 5 A schematic diagram of a back-drilling detection system according to an embodiment of this specification is shown. Figure 5 As shown, the system includes:

[0150] The program acquisition module 502 is configured to acquire the back drilling program of the board under test and retrieve the theoretical position information of the back drilling hole from the back drilling program.

[0151] Image acquisition module 504 is configured to acquire an image of the board under test and determine the processing position information of the back drill hole based on the image of the board under test;

[0152] The file generation module 506 is configured to generate a hole position compensation file based on the theoretical position information and the machining position information;

[0153] The correction program module 508 is configured to correct the back drilling program according to the hole position compensation file to obtain a compensated back drilling program.

[0154] Back drilling module 510 is configured to back drill the board under test using the compensated back drilling program.

[0155] The back-drilling detection module 512 is configured to perform back-drilling detection on the test board after back-drilling processing using the compensated back-drilling program.

[0156] In an optional embodiment, the file generation module 506 includes a calculation information unit and a file generation unit;

[0157] The calculation information unit is configured to calculate the position deviation information of each back-drilled hole in the test board based on the theoretical position information and the processing position information;

[0158] The file generation unit is configured to generate a hole position compensation file corresponding to the side plate based on the position deviation information of all back-drilled holes in the test plate.

[0159] In an optional embodiment, the system further includes a cloud database; the correction module 508 includes a correction unit and a relationship establishment unit;

[0160] The program correction unit is configured to use the hole position compensation file to correct the back drilling program to obtain the compensated back drilling program corresponding to the test board.

[0161] The relationship establishment unit is configured to establish a binding relationship between the compensation back-drilling program and the board under test, and send the compensation back-drilling program to the cloud database.

[0162] The cloud database includes a file-sharing directory; the compensation back-drilling program is written to the file-sharing directory.

[0163] In an optional embodiment, the back-drilling module 510 includes a request program unit and a back-drilling processing unit.

[0164] The request program unit is configured to send a program read request to the cloud database according to the binding relationship when the back-drilling processing task corresponding to the board under test is triggered, and to receive the compensation back-drilling program fed back by the cloud database in response to the program read request.

[0165] The back-drilling processing unit is configured to perform back-drilling processing on the holes to be back-drilled in the test board according to the compensated back-drilling program.

[0166] In one optional embodiment, the back drill detection module 512 includes an information retrieval unit, an image acquisition unit, a deviation information calculation unit, and a back drill detection unit;

[0167] The information retrieval unit is configured to read the compensation back-drilling program bound to the current test board in the file sharing directory according to the binding relationship, and retrieve the compensation position information of the back-drilling hole from the compensation back-drilling program.

[0168] The image acquisition unit is configured to acquire a back-drilled image of the board under test after back-drilling processing, and determine the back-drilling position information of the back-drilled hole based on the back-drilled image.

[0169] The calculation deviation information unit is configured to calculate the back drill hole deviation information of each back drill hole in the test board after back drill processing based on the compensation position information and the back drill position information.

[0170] The back-drilling detection unit is configured to determine whether the back-drilling of the test board meets the back-drilling requirements based on the back-drilling hole deviation information of all back-drilled holes in the test board after back-drilling processing.

[0171] In one optional embodiment, the back drill detection unit includes a subunit for determining deviation value information, a comparison subunit, and a judgment subunit;

[0172] The deviation value determination information subunit is configured to determine the deviation value of each back-drilled hole based on the back-drilled hole deviation information of all back-drilled holes in the test board after back-drilling.

[0173] The comparison subunit is configured to compare the deviation value of each back drill hole with a preset deviation threshold.

[0174] The determination subunit is configured to determine that the back drilling of the side plate does not meet the back drilling requirements if the deviation value of a set number of back drill holes is greater than the preset deviation threshold.

[0175] In an optional embodiment, the image acquisition module 504 includes a drilling process acquisition unit and a location information determination unit;

[0176] The drill program acquisition unit is configured to acquire a drill program of the test board and retrieve the theoretical position information of each back-drilling hole in the test board from the drill program.

[0177] The position information determination unit is configured to acquire an image of the test board and, using the theoretical position information of all the back-drilled holes, determine the processing position information of all the back-drilled holes from the image.

[0178] In an optional embodiment, the apparatus further includes a module for determining identification information and a module for writing to a directory;

[0179] The identification information determination module is configured to determine the identification information of the board under test;

[0180] The writing directory module is configured to establish a binding relationship between the hole position compensation file, the compensation back drilling program and the identification information for each board under test, so as to form a data packet corresponding to the board under test one by one, and write the data packet to the file sharing directory.

[0181] In an optional embodiment, the apparatus further includes a module for determining compliance and a module for establishing relationships;

[0182] The module for determining compliance is configured to determine that the back drilling of the side plate meets the back drilling requirements if there is no deviation value of any back drill hole greater than the preset deviation threshold.

[0183] The relationship establishment module is configured to establish a detection binding relationship between the back-drilling test results corresponding to the back-drilling requirements and the board under test, so as to form a test result package that corresponds one-to-one with the board under test, and write the test result package into the file sharing directory.

[0184] In an optional embodiment, the device further includes a result reading module and a determination module;

[0185] The result reading module is configured to read the detection result package in the file-sharing directory according to the detection binding relationship when the usage task corresponding to the board under test is triggered.

[0186] The determination module is configured to determine, based on the detection result package, whether the test board after back-drilling meets the usage requirements corresponding to the usage task.

[0187] The back-drilling inspection system provided in this embodiment aims to improve back-drilling accuracy and perform back-drilled hole inspection after back-drilling to determine whether the board under test can be used for subsequent operations. It first acquires the back-drilling program of the board under test to extract the theoretical position information of the back-drilled holes. Simultaneously, it acquires an image of the board under test to determine the processing position information of the back-drilled holes. Based on this, a hole position compensation file is generated using the theoretical and processing position information. This compensation file is then used to correct the back-drilling program, resulting in a corrected compensated back-drilling program. The compensated program is then used to perform back-drilling on the board under test, ensuring accuracy. After back-drilling, the compensated program is used again to inspect the back-drilled holes, determining if there are any positional deviations. Boards with correct back-drilled holes are selected for subsequent processing to avoid producing unusable boards.

[0188] The above is a schematic scheme of a back-drilling detection system according to this embodiment. It should be noted that the technical solution of this back-drilling detection system and the technical solution of the back-drilling detection method described above belong to the same concept. For details not described in detail in the technical solution of the back-drilling detection system, please refer to the description of the technical solution of the back-drilling detection method described above.

[0189] Figure 6 A structural block diagram of a computing device 600 according to an embodiment of this specification is shown. The components of the computing device 600 include, but are not limited to, a memory 610 and a processor 620. The processor 620 is connected to the memory 610 via a bus 630, and a database 650 is used to store data.

[0190] The computing device 600 also includes an access device 640, which enables the computing device 600 to communicate via one or more networks 660. Examples of these networks include Public Switched Telephone Network (PSTN), Local Area Network (LAN), Wide Area Network (WAN), Personal Area Network (PAN), or combinations of communication networks such as the Internet. The access device 640 may include one or more of any type of wired or wireless network interface (e.g., a network interface card (NIC)), such as an IEEE 802.11 Wireless Local Area Network (WLAN) wireless interface, a Wi-MAX (Worldwide Interoperability for Microwave Access) interface, an Ethernet interface, a Universal Serial Bus (USB) interface, a cellular network interface, a Bluetooth interface, a Near Field Communication (NFC) interface, and so on.

[0191] In one embodiment of this application, the aforementioned components of the computing device 600 and Figure 6 Other components, not shown, can also be connected to each other, for example, via a bus. It should be understood that... Figure 6 The block diagram of the computing device shown is for illustrative purposes only and is not intended to limit the scope of this application. Those skilled in the art can add or replace other components as needed.

[0192] The computing device 600 can be any type of stationary or mobile computing device, including mobile computers or mobile computing devices (e.g., tablet computers, personal digital assistants, laptop computers, notebook computers, netbooks, etc.), mobile phones (e.g., smartphones), wearable computing devices (e.g., smartwatches, smart glasses, etc.) or other types of mobile devices, or stationary computing devices such as desktop computers or personal computers (PCs). The computing device 600 can also be a mobile or stationary server.

[0193] The processor 620 is used to implement the steps of the back-drilling detection method when executing computer-executable instructions.

[0194] The above is a schematic representation of a computing device according to this embodiment. It should be noted that the technical solution of this computing device and the technical solution of the back-drilling detection method described above belong to the same concept. For details not described in detail in the technical solution of the computing device, please refer to the description of the technical solution of the back-drilling detection method described above.

[0195] The foregoing has described specific embodiments of this specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are possible or may be advantageous.

[0196] The computer instructions include computer program code, which may be in the form of source code, object code, executable file, or some intermediate form. Computer-readable media carrying the computer instructions may include: any entity or device capable of carrying the computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium may be appropriately added or removed according to the requirements of patent practice. For example, in some regions, according to patent practice, computer-readable media may not include electrical carrier signals and telecommunication signals.

[0197] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this specification is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this specification. Furthermore, those skilled in the art should also understand that the embodiments described in this specification are preferred embodiments, and the actions and modules involved are not necessarily essential to this specification.

[0198] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0199] The preferred embodiments disclosed above are merely illustrative of this specification. The optional embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. These embodiments have been selected and specifically described in this specification to better explain the principles and practical applications of this specification, thereby enabling those skilled in the art to better understand and utilize this specification. This specification is limited only by the claims and their full scope and equivalents.

Claims

1. A back-drilling detection method, characterized in that, include: After the first drilling process, the back drilling program of the test board is obtained, and the theoretical position information of the hole to be back drilled is retrieved from the back drilling program. The theoretical position information is the coordinate information of the hole to be back drilled in the back drilling program. The hole to be back drilled is the through hole that needs to be back drilled among the multiple through holes left after the first drilling of the test board. Acquire an image of the board under test, and determine the processing position information of the back drill hole based on the image of the board under test, wherein the processing position information is the actual position information of the back drill hole after one drilling process; A hole position compensation file is generated based on the theoretical position information and the machining position information; The back-drilling program is modified according to the hole position compensation file to obtain a compensated back-drilling program; The test board is back-drilled using the aforementioned compensation back-drilling program. The back-drilling test is performed on the test board after back-drilling using the aforementioned compensation back-drilling program.

2. The back-drilling detection method according to claim 1, characterized in that, The method for generating a hole position compensation file based on the theoretical position information and the machining position information includes: Based on the theoretical position information and the processing position information, calculate the position deviation information of each back-drilled hole in the test board; Based on the positional deviation information of all back-drilled holes in the test board, a hole position compensation file corresponding to the test board is generated.

3. The back-drilling detection method according to claim 1, characterized in that, The method for modifying the back-drilling program according to the hole position compensation file to obtain a compensated back-drilling program includes: The back-drilling program is modified using the hole position compensation file to obtain the compensated back-drilling program corresponding to the test board; Establish the binding relationship between the compensation back-drilling program and the board under test, and write the compensation back-drilling program into the file sharing directory.

4. The back-drilling detection method according to claim 3, characterized in that, The method for performing back drilling on the test board using the compensated back drilling program includes: When the back-drilling processing task corresponding to the board under test is triggered, the compensation back-drilling program bound to the current board under test is read from the file sharing directory according to the binding relationship. The test board is back-drilled according to the compensation back-drilling program.

5. The back-drilling detection method according to claim 3, characterized in that, The method for performing back-drilling detection on the test board after back-drilling using the compensated back-drilling program includes: According to the binding relationship, the compensation back-drilling program bound to the current test board is read in the file sharing directory, and the compensation position information of the back-drilling hole is retrieved from the compensation back-drilling program. Obtain a back-drilled image of the board under test after back-drilling, and determine the back-drilling position information of the back-drilled hole based on the back-drilled image; Based on the compensation position information and the back drill position information, calculate the back drill hole deviation information for each back drill hole in the test board after back drill processing. Based on the back-drilling hole deviation information of all back-drilled holes in the test board after back-drilling, it is determined whether the back-drilling of the test board meets the back-drilling requirements.

6. The back-drilling detection method according to claim 5, characterized in that, The method for determining whether the back-drilling of the test board meets the back-drilling requirements based on the back-drilling hole deviation information of all back-drilled holes in the test board after back-drilling includes: Based on the back-drilling hole deviation information of all back-drilled holes in the test board after back-drilling, determine the deviation value of each back-drilled hole. The deviation value of each back drill hole is compared with a preset deviation threshold. If the deviation of a set number of back-drilled holes is greater than the preset deviation threshold, then the back-drilling of the test board is determined to be non-compliant with the back-drilling requirements.

7. The back-drilling detection method according to claim 1, characterized in that, The method for acquiring an image of the board under test and determining the machining position information of the back-drilling hole based on the image of the board under test includes: Obtain the first drilling program of the test board, and retrieve the first drilling theoretical position information of each back-drilling hole in the test board from the first drilling program; An image of the test board is acquired, and the processing position information of all the back-drilled holes is determined from the image using the theoretical position information of all the back-drilled holes.

8. The back-drilling detection method according to claim 1, characterized in that, The back-drilling detection method also includes: Determine the identification information of the board under test; For each board under test, a binding relationship is established between the hole position compensation file, the compensation back drilling program, and the identification information to form a data package that corresponds one-to-one with the board under test, and the data package is written to the file sharing directory.

9. The back-drilling detection method according to claim 6, characterized in that, Following the method of comparing the deviation value of each back-drilled hole with a preset deviation threshold, the method further includes: If no deviation value of any back drill hole is greater than the preset deviation threshold, then the back drill of the test board is determined to meet the back drill requirements. Establish a detection binding relationship between the back-drilling test results corresponding to the back-drilling requirements and the board under test, so as to form a test result package that corresponds one-to-one with the board under test, and write the test result package into the file sharing directory.

10. The back-drilling detection method according to claim 9, characterized in that, The back-drilling detection method also includes: When the usage task corresponding to the board under test is triggered, the detection result package is read from the file sharing directory according to the detection binding relationship; Based on the test results, it is determined whether the test board after back-drilling meets the usage requirements corresponding to the task.

11. A back-drilling detection system, characterized in that, include: The program acquisition module is configured to acquire the back drilling program of the board under test after the first drilling process, and retrieve the theoretical position information of the hole to be back drilled from the back drilling program. The theoretical position information is the coordinate information of the hole to be back drilled in the back drilling program. The hole to be back drilled is the through hole that needs to be back drilled among the multiple through holes left after the first drilling of the board under test. An image acquisition module is configured to acquire an image of the board under test and determine the processing position information of the back drill hole based on the image of the board under test, wherein the processing position information is the actual position information of the back drill hole after one drilling process; The file generation module is configured to generate a hole position compensation file based on the theoretical position information and the machining position information; The correction module is configured to correct the back-drilling program according to the hole position compensation file to obtain a compensated back-drilling program. The back-drilling module is configured to perform back-drilling on the board under test using the compensated back-drilling program. The back-drilling detection module is configured to perform back-drilling detection on the test board after back-drilling processing using the compensated back-drilling program.

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