High temperature chip testing system

Abstract

The application discloses a high-temperature chip testing system, a box body and a plurality of drawer units embedded in corresponding installation openings of the box body. The drawer unit further comprises a chip clamp, a chip circuit board and a testing board. A plurality of chip probes are installed on the testing board. The chip probe further comprises a needle tube and a temperature change inlayed core. The needle tube with the built-in spiral spring is located in the needle sleeve. The tail of the needle is located in the needle tube, and the head of the needle extends out of the needle tube. The tail of the needle has a hollow wide-mouth tube with a diameter larger than the needle. The hollow wide-mouth tube is composed of a plurality of circumferentially spaced strip petals. A plurality of the strip petals enclose a storage cavity, and a line groove is formed between the adjacent strip petals. The application improves the chip testing efficiency, further improves the stability of the detection data, and improves the consistency and comparability of the data.

Description

Technical Field

[0001] This invention relates to a high-temperature chip testing system and belongs to the field of chip testing technology. Background Technology

[0002] Currently, aging and testing are essential steps for many companies in the mass production of electronic products to ensure quality, eliminating components that fail early or have poor stability, thereby ensuring their reliability. The specific method of aging testing involves using an aging test furnace, heating the components with electricity to maintain a constant high temperature, and driving the components to operate for a period of time. If any components fail during this period, they are discarded and replaced.

[0003] Existing ambient temperature and high temperature chip testing systems suffer from unstable test signals and significant signal loss as the temperature rises within the aging test chamber. This results in relatively poor reliability and consistency of test data and may also pose a risk of electrical sparks, thus creating safety hazards. Summary of the Invention

[0004] The purpose of this invention is to provide a constant temperature and high temperature chip testing system. This system improves chip testing efficiency, and as the temperature increases, it enhances the sensitivity and accuracy of the detection signal, avoids the risk of electrical sparks, reduces safety hazards, and further improves the stability of the test data, thereby improving the consistency and comparability of the data.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is: a constant temperature and high temperature chip testing system, comprising a chip fixture, a chip circuit board and a test board, wherein the chip fixture contains a plurality of chips to be tested that are electrically connected to the chip circuit board, the chip circuit board has a plurality of external contact points corresponding to the chips to be tested, and the test board is equipped with a plurality of chip probes.

[0006] The chip probe includes: a needle tip, a needle sleeve, and a helical spring located inside the needle sleeve. The tail of the needle tip is located inside the needle sleeve, and the head of the needle tip extends out from inside the needle sleeve. It also includes: a needle tube and a thermochromic embedded core. The needle tube, which houses the helical spring, is located inside the needle sleeve. The tail of the needle tip is located inside the needle tube, and the head of the needle tip extends out from inside the needle tube. The tail of the needle tip has a hollow wide-mouth tube with a diameter larger than that of the needle tip. This hollow wide-mouth tube is composed of several strip-shaped lobes spaced circumferentially. The several strip-shaped lobes form a cavity, and there is a groove between adjacent strip-shaped lobes. The thermochromic embedded core is embedded in the cavity of the hollow wide-mouth tube. One end of the helical spring contacts the thermochromic embedded core, and the other end contacts the tail of the needle tube. The thermal expansion coefficient of the thermochromic embedded core is greater than the thermal expansion coefficients of the needle tip, the needle tube, and the needle sleeve.

[0007] The lower part of the chip probe's sleeve is mounted on the test board, and the tip of each chip probe makes electrical contact with the corresponding external contact point on the chip circuit board.

[0008] The following are further improvements to the above technical solution:

[0009] 1. In the above scheme, the number of strip-shaped lobes in the hollow wide-mouth tube is 3 to 6.

[0010] 2. In the above scheme, the tail of the needle tube has a through hole.

[0011] 3. In the above scheme, the needle head has a constricted portion, the inner diameter of which is smaller than the diameter of the hollow wide-mouth tube of the needle.

[0012] 4. The above solution also includes a probe socket, which has several first through holes for chip probes to be embedded.

[0013] 5. In the above scheme, the chip fixture further includes a chip carrier and a heating plate, the heating plate being disposed on the side of the chip fixture facing the test board.

[0014] 6. The above solution also includes a heat sink located between the chip fixture and the test board.

[0015] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0016] 1. The present invention relates to a high-temperature chip testing system, wherein the tail of the chip probe has a hollow wide-mouth tube with a diameter larger than the needle tip. This hollow wide-mouth tube is composed of several strip-shaped lobes spaced circumferentially, and the strip-shaped lobes form a cavity. There is a groove between adjacent strip-shaped lobes. The temperature-sensitive embedded core is embedded in the cavity of the hollow wide-mouth tube. One end of the helical spring contacts the temperature-sensitive embedded core, and the other end contacts the tail of the probe tube. This improves the sensitivity and accuracy of the detection signal, reduces probe self-heating, avoids the risk of electric sparks, improves safety, and further improves the stability of the detection data, thereby improving the consistency and comparability of the data.

[0017] 2. The present invention provides a high-temperature chip testing system, comprising a housing and several drawer units. These drawer units are embedded in corresponding mounting openings within the housing. Each drawer unit further comprises a chip fixture, a chip circuit board, and a test board. The chip fixture contains several chips to be tested that are electrically connected to the chip circuit board. The chip circuit board has several external contact points corresponding to the chips to be tested. The test board is equipped with several chip probes to accommodate more chip fixtures containing chips, thereby increasing the chip aging test throughput and improving chip testing efficiency. Attached Figure Description

[0018] Appendix Figure 1 This is a three-dimensional structural diagram of the ambient temperature and high temperature chip testing system of the present invention;

[0019] Appendix Figure 2 This is a partial three-dimensional exploded view of the testing system of the present invention;

[0020] Appendix Figure 3 For the appendix Figure 2 A schematic diagram of a partial three-dimensional structure;

[0021] Appendix Figure 4 For the appendix Figure 2 A schematic diagram of the further decomposition of the local structure;

[0022] Appendix Figure 5 This is a three-dimensional structural diagram of the chip probe in the ambient high temperature chip testing system of the present invention;

[0023] Appendix Figure 6 For the appendix Figure 5 A schematic diagram of the decomposed structure;

[0024] Appendix Figure 7 For the appendix Figure 6 A further breakdown diagram of the structure;

[0025] Appendix Figure 8 For the appendix Figure 7 A further breakdown diagram of the structure;

[0026] Appendix Figure 9 This is a three-dimensional structural diagram of the chip probe in the testing system of the present invention from another perspective;

[0027] Appendix Figure 10 For the appendix Figure 9 A partial structural diagram.

[0028] In the above attached figures: 1. Needle tip; 2. Helical spring; 3. Needle sleeve; 31. Flange; 32. Inner convex part; 4. Needle tube; 41. Closure part; 42. Through hole; 5. Temperature-sensitive embedded core; 6. Hollow wide-mouth tube; 61. Strip-shaped petal; 62. Wire groove; 7. Storage cavity; 8. Chip clamp; 81. Chip carrier board; 82. Heating plate; 9. Chip circuit board; 91. External contact point; 10. Test board; 11. Chip probe; 12. Probe socket; 121. First through hole; 13. Heat sink; 131. Second through hole; 14. Housing; 15. Drawer unit. Detailed Implementation

[0029] In the description of this patent, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this patent based on the specific circumstances.

[0030] Example 1: A high-temperature chip testing system includes a chip fixture 8, a chip circuit board 9, and a test board 10. The chip fixture 8 contains a plurality of chips to be tested that are electrically connected to the chip circuit board 9. The chip circuit board 9 has a plurality of external contact points 91 corresponding to the chips to be tested. The test board 10 is equipped with a plurality of chip probes 11.

[0031] The chip probe 11 includes: a needle tip 1, a needle sleeve 3, and a helical spring 2 located within the needle sleeve 3. The tail of the needle tip 1 is located within the needle sleeve 3, and the head of the needle tip 1 extends out from within the needle sleeve 3. It also includes: a needle tube 4 and a thermochromic embedded core 5. The needle tube 4, which houses the helical spring 2, is located within the needle sleeve 3. The tail of the needle tip 1 is located within the needle tube 4, and the head of the needle tip 1 extends out from within the needle tube 4. The tail of the needle tip 1 has a hollow, wide-mouthed tube 6 with a diameter larger than that of the needle tip 1. The hollow wide-mouth tube 6 is composed of several strip-shaped petals 61 arranged circumferentially. The strip-shaped petals 61 form a storage cavity 7. There is a groove 62 between adjacent strip-shaped petals 61. The thermochromic inlay core 5 is embedded in the storage cavity 7 of the hollow wide-mouth tube 6. One end of the helical spring 2 is in contact with the thermochromic inlay core 5, and the other end is in contact with the tail of the needle tube 4. The thermal expansion coefficient of the thermochromic inlay core 5 is greater than the thermal expansion coefficients of the needle 1, the needle tube 4, and the needle sheath 3.

[0032] The lower part of the needle sleeve 3 of the chip probe 11 is mounted on the test board 10, and the needle tip 1 of each chip probe 11 is in electrical contact with the corresponding external contact point 91 of the chip circuit board 9.

[0033] The hollow wide-mouth tube 6 has 3 strip-shaped lobes 61.

[0034] The tail of the aforementioned needle tube 4 has a through hole 42.

[0035] The aforementioned chip fixture 8 further includes a chip carrier board 81 and a heating plate 82, which is disposed on the side of the chip fixture 8 facing the test board 10.

[0036] The outer side of the needle sleeve 3 has a flange 31, and the inner side of the needle sleeve 3 has an inner protrusion 32 that contacts the tail of the needle tube 4.

[0037] Example 2: A constant temperature and high temperature chip testing system includes a chip fixture 8, a chip circuit board 9 and a test board 10. The chip fixture 8 has a plurality of chips to be tested that are electrically connected to the chip circuit board 9. The chip circuit board 9 has a plurality of external contact points 91 corresponding to the chips to be tested. The test board 10 is equipped with a plurality of chip probes 11.

[0038] The chip probe 11 includes: a needle tip 1, a needle sleeve 3, and a helical spring 2 located within the needle sleeve 3. The tail of the needle tip 1 is located within the needle sleeve 3, and the head of the needle tip 1 extends out from within the needle sleeve 3. It also includes: a needle tube 4 and a thermochromic embedded core 5. The needle tube 4, which houses the helical spring 2, is located within the needle sleeve 3. The tail of the needle tip 1 is located within the needle tube 4, and the head of the needle tip 1 extends out from within the needle tube 4. The tail of the needle tip 1 has a hollow, wide-mouthed tube 6 with a diameter larger than that of the needle tip 1. The hollow wide-mouth tube 6 is composed of several strip-shaped petals 61 arranged circumferentially. The strip-shaped petals 61 form a storage cavity 7. There is a groove 62 between adjacent strip-shaped petals 61. The thermochromic inlay core 5 is embedded in the storage cavity 7 of the hollow wide-mouth tube 6. One end of the helical spring 2 is in contact with the thermochromic inlay core 5, and the other end is in contact with the tail of the needle tube 4. The thermal expansion coefficient of the thermochromic inlay core 5 is greater than the thermal expansion coefficients of the needle 1, the needle tube 4, and the needle sheath 3.

[0039] The lower part of the needle sleeve 3 of the chip probe 11 is mounted on the test board 10, and the needle tip 1 of each chip probe 11 is in electrical contact with the corresponding external contact point 91 of the chip circuit board 9.

[0040] The hollow wide-mouth tube 6 has four strip-shaped lobes 61, and the tail of the needle tube 4 has a through hole 42.

[0041] The head of the needle tube 4 has a constricted portion 41, the inner diameter of which is smaller than the diameter of the hollow wide-mouth tube 6 of the needle 1.

[0042] The ambient high temperature chip testing system also includes a probe socket 12, which has several first through holes 121 for chip probes 11 to be inserted, and a heat sink 13 located between the chip fixture 8 and the test board 10; the probe socket 12 is inserted into the second through holes 131 of the heat sink 13.

[0043] The working principle of the chip probe in the ambient high temperature chip testing system of this invention is as follows: As the temperature inside the chamber of the aging test system increases, the helical spring, which generates compressive force through deformation, has a length along the helical direction that is much greater than its actual length. Therefore, its deformation is the largest relative to other components due to the temperature increase, resulting in a large and unstable change in its compressive force. As the temperature inside the chamber increases, the temperature-sensitive embedded core 5, due to its large coefficient of thermal expansion, increases in volume. This radially pushes several strip-shaped petals 61 of the hollow wide-mouth tube 6 into contact with the inner wall of the needle tube 4. As the temperature increases, the contact pressure between the hollow wide-mouth tube 6 and the inner wall of the needle tube 4 increases, which reduces the contact resistance between the needle tip 1 and the needle tube 4, thereby improving the sensitivity and accuracy of the detection signal, reducing probe self-heating, avoiding the risk of electric sparks, and improving safety. It also greatly reduces the impact of the temperature deformation of the helical spring on the contact pressure between the needle tip 1 and the chip under test, thereby further improving the stability of the detection data and improving the consistency and comparability of the data.

[0044] Furthermore, the enclosure includes a housing and several drawer units, which are embedded in corresponding mounting openings within the housing. Each drawer unit further includes a chip fixture, a chip circuit board, and a test board. The chip fixture contains several chips to be tested that are electrically connected to the chip circuit board. The chip circuit board has several external contact points corresponding to the chips to be tested. The test board is equipped with several chip probes to accommodate more chip fixtures containing chips, thereby increasing the chip aging test throughput and improving chip testing efficiency.

[0045] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A high-temperature chip testing system, characterized in that: include: The enclosure (14) and several drawer units (15) are embedded in the corresponding mounting openings of the enclosure (14). The drawer unit (15) further includes: a chip fixture (8), a chip circuit board (9) and a test board (10). The chip fixture (8) has several chips to be tested that are electrically connected to the chip circuit board (9). The chip circuit board (9) has several external contact points (91) corresponding to the chips to be tested. Several chip probes (11) are installed on the test board (10). The chip probe (11) further includes: a needle tip (1), a needle sleeve (3), and a helical spring (2) located inside the needle sleeve (3). The tail of the needle tip (1) is located inside the needle sleeve (3), and the head of the needle tip (1) extends out from inside the needle sleeve (3). It also includes: a needle tube (4) and a thermochromic embedded core (5). The needle tube (4) containing the helical spring (2) is located inside the needle sleeve (3). The tail of the needle tip (1) is located inside the needle tube (4), and the head of the needle tip (1) extends out from inside the needle tube (4). The tail of the needle tip (1) has a hollow wide opening with a diameter larger than that of the needle tip (1). The hollow wide-mouth tube (6) is composed of several strip-shaped petals (61) arranged circumferentially. Several strip-shaped petals (61) form a storage cavity (7). There is a line groove (62) between adjacent strip-shaped petals (61). The thermochromic inlay core (5) is embedded in the storage cavity (7) of the hollow wide-mouth tube (6). One end of the spiral spring (2) is in contact with the thermochromic inlay core (5), and the other end is in contact with the tail of the needle tube (4). The thermal expansion coefficient of the thermochromic inlay core (5) is greater than the thermal expansion coefficients of the needle tip (1), the needle tube (4), and the needle sheath (3). The lower part of the needle sleeve (3) of the chip probe (11) is installed on the test board (10), and the needle tip (1) of each chip probe (11) is in electrical contact with the corresponding external contact point (91) of the chip circuit board (9).

2. The ambient temperature and high temperature chip testing system according to claim 1, characterized in that: The hollow wide-mouth tube (6) has 3 to 6 strip-shaped lobes (61).

3. The ambient temperature and high temperature chip testing system according to claim 1, characterized in that: The needle (4) has a through hole (42) at its tail.

4. The ambient temperature and high temperature chip testing system according to claim 1, characterized in that: The needle tube (4) has a constricted portion (41) at its head, the inner diameter of which is smaller than the diameter of the hollow wide-mouth tube (6) of the needle (1).

5. The ambient temperature and high temperature chip testing system according to claim 1, characterized in that: It also includes a probe socket (12) having a plurality of first through holes (121) for chip probes (11) to be inserted.

6. The ambient temperature and high temperature chip testing system according to claim 1, characterized in that: The chip fixture (8) further includes a chip carrier (81) and a heating plate (82), which is disposed on the side of the chip fixture (8) facing the test board (10).

7. The ambient temperature and high temperature chip testing system according to claim 1, characterized in that: It also includes a heat sink (13) located between the chip fixture (8) and the test board (10).

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