Pulse number selection method, system and computer device for blind hole

Abstract

This application relates to a method, system, and computer device for selecting the number of pulses for blind vias. The method includes: obtaining the adaptive power of a test board; machining multiple first blind vias on the test board using the adaptive power and different pulse test counts; observing the hole quality characteristics of the multiple first blind vias; and selecting an appropriate number of pulses from the different pulse test counts. This method improves the accuracy of selecting the number of pulses for blind vias, thereby improving the machining quality of blind vias.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a method for selecting the number of pulses for a blind hole, a system for selecting the number of pulses for a blind hole, and a computer device. Background Technology

[0002] With the continuous development of technology, laser technology is also gradually iterating. In the process of drilling blind holes with laser, the quality of the blind hole is affected by the number of pulses. Therefore, it is essential to test the number of pulses for the blind hole.

[0003] Currently, in the process of selecting the number of pulses for blind holes, technicians usually rely on their accumulated personal experience and subjective judgment to select an appropriate number of pulses for processing the blind holes. However, this selection method is prone to problems where technicians cannot accurately control whether the currently set number of pulses meets the actual preset processing requirements, which can lead to poor processing quality of the blind holes. Summary of the Invention

[0004] Therefore, it is necessary to provide a pulse number selection method, apparatus, pulse number selection device for blind holes, computer-readable storage medium, and computer program product to address the above-mentioned technical problems and improve the accuracy of pulse number selection for blind hole processing, thereby improving the processing quality of blind holes.

[0005] In a first aspect, this application provides a method for selecting the number of pulses emitted in a blind aperture, the method comprising:

[0006] Obtain the adaptive power of the test board; use the adaptive power and different pulse test counts to process multiple first blind holes on the test board; observe the hole quality characteristics of the multiple first blind holes, and select the appropriate pulse count from the different pulse test counts.

[0007] In one embodiment, the test board includes a first test board and a second test board, wherein the first test board and the second test board are different test boards;

[0008] The acquisition of the test board's adaptive power includes one of the following:

[0009] The standard power of the first test board is used as the adaptive power; multiple second blind holes are machined on the second test board using a first preset number of pulse tests and different drilling test powers; the adaptive power is selected from the different drilling test powers according to the hole morphology characteristics of the multiple second blind holes.

[0010] In one embodiment, the second test plate is a test plate with a surface covered by a non-metallic material and a metallic interior; after selecting the appropriate power from the different drilling test powers based on the hole morphology characteristics of the plurality of second blind holes, the method further includes:

[0011] Using the aforementioned adaptive power and different second preset pulse test counts, the plurality of first blind holes are processed on the second test board; a critical pulse test count is selected from the different second preset pulse test counts, wherein the critical pulse test count is the number of pulse test counts required to process any one of the first blind holes to expose the metal material; based on the critical pulse test count, the different pulse test counts are set, and an applicable pulse count is selected from the different pulse test counts.

[0012] In one embodiment, the first test board is a test board with a surface covered by a metal material and an interior containing metal; after using the standard power of the first test board as the adaptive power, the method further includes:

[0013] Using the standard power and different third preset pulse test counts, the plurality of first blind holes are processed on the first test board; a pulse test critical count is selected from the different third preset pulse test counts, wherein the pulse test critical count is the number of pulse test counts required to process any one of the first blind holes to expose the metal material; based on the pulse test critical count, the different pulse test counts are set, and an applicable pulse count is selected from the different pulse test counts.

[0014] In one embodiment, before machining multiple second blind holes on the second test board using a first preset number of pulse tests and different drilling test powers, the method further includes:

[0015] Divide the multiple second blind holes of the second test board into corresponding second blind hole arrays; set different drilling test power for the multiple second blind hole arrays respectively.

[0016] In one embodiment, selecting the appropriate power from the different drilling test powers based on the hole morphology characteristics of the plurality of second blind holes includes:

[0017] The appropriate power is selected from the different drilling test powers based on the feature similarity between the hole morphology features of the plurality of second blind hole arrays and the standard hole morphology features.

[0018] In one embodiment, the hole quality characteristics include hole machining quality characteristics and hole quality geometric characteristics; observing the hole quality characteristics of the plurality of first blind holes, and selecting the applicable number of pulses from the different pulse test counts, includes:

[0019] Based on the hole processing quality characteristics of any of the first blind holes, a first quality selection result for the first blind hole is obtained, and based on the hole quality geometric characteristics of any of the first blind holes, a second quality selection result for the first blind hole is obtained; observe the first quality selection results and second quality selection results of multiple first blind holes, and select the applicable number of pulses from the different pulse test counts.

[0020] In one embodiment, the hole processing quality characteristics include slice copper loss, hole shape quality characteristics, glass fiber protrusion and glass fiber shrinkage, and the hole quality geometric characteristics include upper diameter, lower diameter and diameter ratio.

[0021] Secondly, this application also provides a pulse number selection system for blind holes, the pulse number selection system for blind holes includes a host computer, a laser processing equipment and an observation device, the laser processing equipment includes an acquisition module and a processing module;

[0022] The acquisition module is used to acquire the adaptive power of the test board;

[0023] The processing module is used to process multiple first blind holes on the test board using the adaptive power and different pulse test counts;

[0024] The host computer is used to create machining files for the plurality of first blind holes and send the machining files to the machining module;

[0025] The observation device is used to observe the hole quality characteristics of the plurality of first blind holes and select the appropriate number of pulses from the different pulse test numbers.

[0026] Thirdly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0027] Obtain the adaptive power of the test board; use the adaptive power and different pulse test counts to process multiple first blind holes on the test board; observe the hole quality characteristics of the multiple first blind holes, and select the appropriate pulse count from the different pulse test counts.

[0028] The aforementioned method, system, and computer equipment for selecting the number of pulses for blind vias first obtain the adaptive power of the test board. Then, multiple first blind vias are fabricated on the test board using the adaptive power and different pulse test counts. Finally, based on the hole quality characteristics of the multiple first blind vias, the appropriate number of pulses is selected from the different pulse test counts. That is, by comparing the hole quality characteristics of the multiple first blind vias fabricated under different pulse test counts, the appropriate number of pulses for fabricating the blind vias can be selected. Therefore, in the process of determining the number of pulse test counts for testing different blind vias, multiple different blind vias are fabricated using the same power and different pulse counts. The hole quality characteristics of the blind vias are observed, and the hole quality characteristics that meet the requirements are selected. Assuming that the hole quality characteristics of multiple blind vias all meet the requirements, the corresponding pulse counts are all acceptable pulse counts. Finally, the appropriate number of pulses is selected from multiple different pulse counts. This method can quickly select the appropriate number of pulses, avoiding technical defects such as errors in manually set pulse test numbers. Therefore, it improves the accuracy of pulse selection for blind holes, thereby improving the processing quality of blind holes. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a flowchart illustrating a method for selecting the number of pulses emitted by a blind aperture in one embodiment;

[0031] Figure 2 This is a flowchart illustrating the method for selecting the number of pulses emitted by a blind aperture in another embodiment;

[0032] Figure 3 This is a block diagram of a blind aperture pulse count selection system in one embodiment;

[0033] Figure 4 This is an internal structural diagram of a pulse count selection device for a blind aperture in one embodiment. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0035] First, it should be understood that a circuit board can be a printed circuit board (PCB), an IC packaging substrate, or other circuit boards used to connect chips. It is widely used in electronic devices such as computers, communication equipment, and consumer electronics. Laser drilling technology can produce blind vias that are smaller and more complex in shape, which is of great significance for meeting the needs of high-density PCBs. Circuit boards are usually composed of multiple layers of materials, typically with an internal conductive layer, i.e., copper material. A blind via is a hole that enters the circuit board from one side without penetrating the copper material. There is a lack of a scientific and effective method for comprehensively testing and optimizing the pulse count for selecting blind vias. Often, it can only be determined through experience or extensive trial and error. Currently, in selecting the pulse count for blind vias, technicians usually rely on their accumulated personal experience and subjective judgment to select an appropriate pulse count for processing. However, this method often leads to difficulties in accurately controlling whether the currently set pulse count meets the actual preset processing requirements, resulting in poor processing quality of the blind vias. Therefore, there is an urgent need for a pulse number selection method to improve the accuracy of pulse number selection for blind hole machining, thereby improving the machining quality of blind holes.

[0036] In one embodiment, such as Figure 1As shown, a method for selecting the number of pulses for blind holes is provided. This embodiment takes the application of this method to a pulse selection system for blind holes as an example. Specifically, the pulse selection system for blind holes may include a host computer, laser processing equipment, and an observation device. The host computer may be a personal computer, laptop, smartphone, or tablet computer, etc., and can be separate from or integrated with the laser processing equipment. The observation device is generally a microscope, and can be separate from or integrated with the host computer. The laser processing equipment can perform laser processing on the test board. The processing technology may include drilling blind holes, grooving, or scribing. The observation device may be an aperture measuring instrument, a laser power meter, a laser pulse generator and counter, etc. It is understood that the laser processing equipment may include an acquisition module and a processing module. The acquisition module is used to acquire the test board. The processing module is used to process multiple first blind holes on the test board using the adapted power and different pulse test counts. The host computer, laser processing equipment, and observation device can communicate with each other. In the process of selecting the pulse count for blind holes, the host computer first creates processing drawings for multiple first blind holes and sends the drawings to the processing module of the processing equipment. The acquisition module also acquires the adapted power of the test board. Then, the processing module processes multiple first blind holes on the test board using the adapted power and different pulse test counts. Finally, the observation device observes the hole quality characteristics of multiple first blind holes, thereby selecting the appropriate pulse count from different pulse test counts. This avoids the influence of other factors on the selection of the pulse count for blind holes, making the selected appropriate pulse count relatively compatible with the pulse count of the test board. Therefore, it can improve the selection effect of the pulse count for blind holes. In this embodiment, the method includes the following steps 202 to 206. Wherein:

[0037] Step 202: Obtain the power rating of the test board.

[0038] It should be noted that the test board refers to the PCB board for which the pulse number of blind vias is selected. Blind vias can be processed on the test board using laser processing equipment. In one feasible approach, assuming the test board is a PCB board with copper foil covering its surface, its adaptive power can be obtained through standard laser processing technology. That is, the laser processing equipment directly uses standard power for processing without the need to calculate the adaptive power. In another feasible approach, assuming the test board is a PCB board with resin covering its surface, its adaptive power is obtained through calculation. It can be understood that different types of test boards will use different power levels to drill blind vias on the test board.

[0039] As an example, obtain the standard power and use the standard power as the adapted power of the test board.

[0040] Step 204: Multiple first blind holes are fabricated on the test board using adapted power and different pulse test counts.

[0041] It should be noted that the pulse test count refers to the number of pulses used to drill the first blind hole. The pulse count is the number of pulses emitted by the laser per unit time, which affects the drilling depth of the blind hole. It is understood that the processing of the blind hole is not achieved by a single pulse, but by a series of pulses with the same energy and pulse width continuously removing material from the test plate to meet the required dimensions. The pulse counts of multiple sets may not be correlated, or they may meet certain setting rules. Multiple processing drawings for the first blind holes can be drawn using preset drawing tools. These processing drawings contain multiple drawn blind holes. For different blind holes, different pulse test counts can be set. For example, multiple sets of pulse test counts can be set to 35, 40, 45, 50, 55, 60, 65, 70, and 75 respectively. Multiple first blind holes can be obtained by combining the appropriate power. It can be understood that in the process of processing the first blind hole, in addition to testing the appropriate power and the number of pulse test counts, other processing parameters can be set. Different blind holes can have the same other processing parameter settings. The other processing parameters can be the diameter of the blind hole. The preset drawing tool can be CAD software deployed on the host computer.

[0042] It should be noted that during the processing of multiple first holes using laser processing equipment, all conditions are the same except for the number of pulse tests set. Thus, different numbers of pulse tests can be used to objectively reflect the degree of compatibility between the number of pulse tests and the first hole to be processed.

[0043] Step 206: Observe the hole quality characteristics of multiple first blind holes, and select the appropriate number of pulses from different pulse test counts.

[0044] It should be noted that the quality of the first blind vias processed by different pulse test counts combined with the same adaptive power is different. The via quality characteristics are used to reflect the quality of the blind vias, specifically the upper via diameter, lower via diameter, and slice copper loss. For example, in one feasible method, an upper via diameter standard threshold can be preset, and then the upper via diameters of multiple first blind vias can be compared with the preset upper via diameter threshold. The pulse test count corresponding to the upper via diameter closest to the preset upper via diameter threshold is taken as the pulse applicable count of the test board.

[0045] As an example, step 206 includes: comparing the hole quality features of multiple first blind holes with preset hole quality feature thresholds to obtain hole quality feature comparison results, and selecting the applicable number of pulses for the test board from different pulse test counts based on the hole quality feature comparison results.

[0046] The aforementioned method for selecting the number of pulses for blind holes is applied to a pulse number selection system for blind holes. This system includes a host computer, laser processing equipment, and an observation device. First, the adaptive power of the test board is obtained. Then, multiple first blind holes are processed on the test board using the adaptive power and different pulse test numbers. Finally, based on the hole quality characteristics of the multiple first blind holes, the appropriate number of pulses is selected from the different pulse test numbers. That is, by comparing the hole quality characteristics of the multiple first blind holes processed under different pulse test numbers, the appropriate number of pulses for processing the blind hole can be selected. Therefore, in the process of determining the number of pulse test numbers for testing different blind holes, multiple different blind holes are processed using the same power and different pulse numbers. The hole quality characteristics of the blind holes are observed among the multiple different blind holes, and the hole quality characteristics that meet the requirements are selected. Assuming that the hole quality characteristics of multiple blind holes all meet the requirements, the corresponding pulse numbers are all acceptable pulse numbers. Finally, the appropriate number of pulses is selected from multiple different pulse numbers. This method can quickly select the appropriate number of pulses, avoiding technical defects such as errors in manually set pulse test numbers. Therefore, it improves the accuracy of pulse selection for blind holes, thereby improving the processing quality of blind holes.

[0047] In one embodiment, such as Figure 2 As shown, the test board includes a first test board and a second test board, wherein the first test board and the second test board are different test boards; the adaptive power of the test board is obtained, including one of the following:

[0048] Step 302: Use the standard power of the first test board as the adaptation power;

[0049] It should be noted that the specific laser processing technology for processing blind vias differs for different first and second test boards. The first test board refers to a test board that can be processed for blind vias using standard laser power processing technology, while the second test board refers to a test board that cannot be processed for blind vias using standard laser power processing technology. Specifically, the first test board can be a copper-plated PCB board, while the second test board can be a copper-free PCB board, that is, the material covering the surface of the PCB board is not copper foil. Specifically, the material covering the surface of the copper-free PCB board can be one of ABF (Ajinomoto, reinforcing film), PP (Prepreg, prepreg or film), and cover film material.

[0050] As an example, step 302 includes: using the standard power of the first test board as the adapted power of the first test board.

[0051] Step 304: Using a first preset number of pulse tests and different drilling test powers, process multiple second blind holes on the second test board; select an appropriate power from the different drilling test powers according to the hole shape characteristics of the multiple second blind holes.

[0052] It should be noted that, in the process of selecting the appropriate power for the second test board, the first preset number of pulse tests can be set in advance. That is, the number of pulses for processing the second blind hole is fixed, and then different drilling test powers are set for the second blind hole to be processed. The drilling test power is used to characterize the power of drilling the second blind hole. In one feasible method, the first preset number of pulses can be 15. It can be understood that after setting the first preset number of pulse tests and different drilling test powers, the second blind hole can be processed on the second test board by the laser processing equipment, so as to lay the foundation for selecting the appropriate power for the second test board. To ensure the correct selection of different processing parameters, the positions for processing the first and second blind holes on the second test board can be set to be different.

[0053] It should be noted that the hole morphology features are used to characterize the morphology of blind holes. Specifically, they can be the condition of the blind hole opening crack, the condition of the blind hole opening scorching, and the condition of the blind hole opening collapse. For example, in one feasible method, assuming that drilling test power is set for 20 second blind holes respectively, after processing 20 second blind holes, by comparing the hole morphology features of the 20 second blind holes laterally, the second blind hole with a relatively good morphology can be obtained, and the drilling test power corresponding to the second blind hole is marked as the adaptive power.

[0054] As an example, step 304 includes: selecting a target drilling test power from different drilling test powers; using the target drilling test power and a first preset number of pulse tests to process a second blind hole on the second test board; and returning to the execution step; selecting a target drilling test power from different drilling test powers; using the target drilling test power and a first preset number of pulse tests to process a second blind hole on the second test board; until all different drilling test powers are selected as target drilling test powers, thereby processing multiple second blind holes; by comparing the hole morphology characteristics of multiple second blind holes, selecting a target second blind hole from multiple second blind holes, and using the drilling test power of the target second blind hole as the adaptation power.

[0055] In this embodiment, different methods are used to obtain the adaptive power of the test board according to different test board types. For the first test board, the standard power of the first test board can be directly used as the adaptive power. For the second test board, multiple sets of different drilling test powers and the first preset number of pulse tests can be set, and blind holes are drilled on the second test board using the above-mentioned different drilling test powers and the first preset number of pulse tests to obtain multiple second blind holes. Finally, by comparing the hole morphology characteristics among the multiple second blind holes, the process of selecting the adaptive power from multiple sets of drilling test powers can be realized. This achieves the purpose of obtaining the adaptive power of the test board in a targeted manner based on the different test board types, thus reducing the limitations of selecting the number of pulses for blind holes.

[0056] In one embodiment, the second test plate is a test plate with a surface covered by a non-metallic material and a metal interior;

[0057] After selecting an appropriate power from different drilling test powers based on the hole morphology characteristics of multiple second blind holes, the method further includes:

[0058] Multiple first blind holes are machined on the second test board using an appropriate power and different second preset pulse test counts; a pulse test critical count is selected from different second preset pulse test counts, wherein the pulse test critical count is the number of pulse test counts required to machine any first blind hole to expose the metal material; different pulse test counts are set according to the pulse test critical count, and an appropriate number of pulses is selected from the different pulse test counts.

[0059] It should be noted that for the second test board, which has a non-metallic surface and an internal metal layer, the material covering the surface of the copper-free PCB board can be one of ABF (Ajinomoto, reinforcing film), PP (Prepreg, prepreg or film), or a cover film material. A metal layer, typically copper, lies beneath the covering material. After determining the power rating of the second test board, different preset pulse test counts can be set. Each preset pulse test count is matched to the power rating of the second test board. Different preset pulse test counts and power ratings are then used to process the first blind via on the second test board. It is understood that to ensure the independence of different processing parameter selections, the positions of the first and second blind vias processed on the first test board are different. Different preset pulse test counts are used to select the critical pulse test count. Finally, based on the critical pulse test count for processing the first blind via to expose the metal material, different pulse test counts can be set. The number of pulses is then selected from different pulse test counts to obtain multiple sets of different pulse test counts that meet the actual preset processing requirements of the second test board. In one feasible method, assuming the appropriate power is 50%W, different second preset pulse test counts are set to 5, 10, 15, 20, 25, 30, 35, 40, and 45 pulses respectively, based on the different positions of the first blind holes to be processed. After processing, the upper and lower hole diameter ratios of the multiple first blind holes obtained by processing are observed under a microscope to observe whether the metal is just exposed, that is, whether the blind hole has penetrated the surface medium of the test board. This determines the critical pulse test count at which the metal is just exposed and the processed first blind hole meets the preset processing requirements. If the metal is still not exposed in the 9th group, the second preset pulse test count is adjusted until the bottom copper surface of the processed blind hole is just exposed. That is, the critical pulse test count is selected from different second preset pulse test counts, and then the pattern of the test drawing is used to drill blind holes in other positions on the copper-free PCB test board.

[0060] As an example, based on the adaptive power, different second preset pulse test counts matching the adaptive power are obtained. Using different second preset pulse test counts and adaptive power, multiple first blind holes are processed on the second test board. The first blind hole with a bottom feature different from other first blind holes is taken as the target first blind hole, and the second preset pulse test count corresponding to the target first blind hole is taken as the pulse test critical count. Based on the pulse test critical count, different pulse test counts are set for the second test board.

[0061] Understandably, for the first blind hole, the machined first blind hole can be used both to select the critical number of pulse tests and to set different pulse test numbers. After selecting the critical number of pulse tests, different pulse test numbers can be set for the same first blind hole, or different pulse test numbers can be set for different first blind holes. Before drilling, technicians first need to plan the layers. Specifically, the outline and hole positions of the test board can be drawn in the CAD software deployed on the host computer, thus obtaining multiple processing layers, and generating [data / processing] based on these processing layers. A processing file is created, which contains processing parameters. These parameters can be represented by specific codes or tags. The processing parameters include a basic number of pulse tests. The overall process of selecting the critical pulse test count for different second preset pulse test counts is as follows: The basic second preset pulse test count (35 pulses) is set in the processing file, and the processing file is saved. A first blind via is obtained by processing with 35 pulses and the first processing layer in the processing file. At this point, the obtained first blind via exposes the copper layer, but the hole shape that just exposes the copper layer does not meet the processing requirements. For example, the shape of the blind via to be processed... The first blind hole is square, but the blind hole processed under the second preset pulse test count is tapered. Therefore, based on the critical pulse test count, different pulse test counts are set, and an appropriate pulse count is selected from these. If the first blind hole is not processed to expose the copper layer using the second preset pulse test count, the pulse test count is increased based on the basic second preset pulse test count to obtain multiple other second preset pulse test counts. For example, the second preset pulse test count is designed to increase by 5 pulses sequentially for different processing layers, that is, the second preset pulse count corresponding to the second processing layer... The test firing count is 40 shots, and the second preset pulse test firing count corresponding to the third processing layer is 45 shots, etc. It can be understood that the above different settings for the second preset pulse test firing count can be based on modifying the corresponding code in the processing file or adding code logic to the processing file, until the target first blind hole is processed to expose the metal material by using different second preset pulse test firing counts and adaptive power. Finally, the second preset pulse test firing count corresponding to the target first blind hole can be used as the pulse test critical firing count, where the pulse test critical firing count can be 40 shots, 45 shots, or 50 shots, etc.

[0062] In this embodiment, different preset second pulse test counts are used to determine the critical pulse test count. After determining the critical pulse test count, multiple sets of pulse test counts are set for the second test board based on the critical pulse test count. The appropriate pulse count is selected from these different counts. After determining the critical pulse test count, different pulse test counts can be set for the second test board based on the critical pulse test count, and finally, the appropriate pulse count is selected from these different counts. If the hole shape that exposes the copper layer does not meet the processing requirements, for example, if the blind hole to be processed is a square hole, but the blind hole processed under the critical pulse test count is a tapered hole, processing the tapered hole into a square hole requires further increasing the pulse count. Specifically, assuming the critical pulse test count is 45, the different pulse test counts set for the second test board can be 45, 50, 55, 60, and 65, until a suitable hole quality characteristic is achieved, thus selecting the appropriate pulse count.

[0063] In one embodiment, the first test plate is a test plate with a surface covered by a metal material and a metal interior;

[0064] After using the standard power of the first test board as the adaptation power, the method also includes:

[0065] Using standard power and different third preset pulse test counts, multiple first blind holes are machined on the first test board; a pulse test critical count is selected from different third preset pulse test counts, wherein the pulse test critical count is the number of pulse tests required to machine any first blind hole to expose the metal material; different pulse test counts are set according to the pulse test critical count, and an applicable pulse count is selected from the different pulse test counts.

[0066] It should be noted that for the first test board, which has a surface covered by metal material and contains metal internally, after obtaining the standard power, different pulse test counts need to be set. Similar to the second test board, it also involves setting different third preset pulse test counts and machining multiple first blind holes on the first test board with the standard power. Based on the bottom characteristics of the first blind holes, the critical pulse test count is selected. It can be understood that after selecting the critical pulse test count, different pulse test counts can be set for the same first blind hole or for different first blind holes. The critical pulse test count is the number of pulse test counts required to machine the first blind hole until the metal material is exposed. By selecting the critical pulse test count from different third preset pulse test counts, different pulse test counts can be set based on the critical pulse test count required to machine the first blind hole until the metal material is exposed. The appropriate pulse count can then be selected from these different pulse test counts to obtain multiple sets of different applicable pulse counts that meet the actual preset processing requirements of the first test board.

[0067] As an example, based on the standard power, different third preset pulse test counts matching the adapted power are obtained. Using different third preset pulse test counts and standard power, multiple first blind holes are processed on the first test board. The first blind hole with a bottom feature different from other first blind holes is taken as the target first blind hole, and the third preset pulse test count corresponding to the target first blind hole is taken as the pulse test critical count. Based on the pulse test critical count, different pulse test counts are set for the first test board. The appropriate pulse count is selected from the different pulse test counts to obtain multiple sets of different appropriate pulse counts that meet the actual preset processing requirements of the first test board.

[0068] For example, in one feasible approach, the overall process of selecting the critical pulse test count for different third preset pulse test counts is as follows: A basic third preset pulse test count (40 pulses) is set in the processing file, and the processing file is saved. A first blind via is obtained by processing with 40 pulses and the fourth processing layer in the processing file. At this point, the first blind via exposes the bottom copper. However, the hole shape that just exposes the copper layer does not meet the processing requirements. For example, the shape of the blind via to be processed is a square hole, but the blind via obtained under the pulse test critical count is a square hole. Therefore, based on the pulse test critical count, different pulse test counts are set, and the appropriate pulse count is selected from these different pulse test counts. If the third preset pulse test count is used and the first blind via is not processed to expose the copper layer, or the shape of the first blind via exposing the copper layer is a tapered hole (the shape of the blind via to be processed is a square hole), then... Then, based on the basic third preset pulse test count, the number of pulse tests is increased to obtain multiple other third preset pulse test counts. For example, the third preset pulse test count can be designed to increase by 5 pulses sequentially for different processing layers. That is, the third preset pulse test count for the sixth processing layer is 45 pulses, the third preset pulse test count for the seventh processing layer is 50 pulses, and so on. It can be understood that the above different third preset pulse test count settings can be based on modifying the corresponding code in the processing file or adding code logic to the processing file until the target first blind hole is processed to expose the metal material using different third preset pulse test counts and adaptive power. Finally, the third preset pulse test count corresponding to the target first blind hole can be used as the pulse test critical count, where the pulse test critical count can be 50, 55, and 60 pulses, etc.

[0069] In this embodiment, different preset third pulse test counts are used to determine the critical pulse test count. After determining the critical pulse test count, multiple sets of pulse test counts are set for the first test board based on the critical pulse test count. The appropriate pulse count is selected from these different counts. After determining the critical pulse test count, different pulse test counts can be set for the first test board, and the appropriate pulse count can be selected from these different counts. The hole shape that just exposes the copper layer does not meet the processing requirements. For example, the blind hole to be processed is a square hole, but the blind hole processed under the critical pulse test count is a tapered hole. To process the tapered hole into a square hole, the pulse count needs to be increased further. Specifically, assuming the critical pulse test count is 45, the different pulse test counts set for the first test board can be 45, 50, 55, 60, and 65, until a suitable hole quality characteristic is achieved, thus selecting the appropriate pulse count.

[0070] In one embodiment, before machining multiple second blind holes on the second test board using a first preset number of pulse tests and different drilling test powers, the method further includes:

[0071] Divide the multiple second blind vias of the second test board into corresponding second blind via arrays; set different drilling test power for each of the multiple second blind via arrays.

[0072] It should be noted that, due to the randomness of the hole shape characteristics of a single blind via, in order to improve the accuracy of the selection of the matching power of the test board, the blind via array can be divided in the processing drawing, and a set of drilling test power can be set for different blind via arrays. For example, in one feasible method, the processing drawing of the PCB board for blind via processing can be drawn on CAD using 9 layers. The 9 layers are also the processing drawing, which includes 9 blind via arrays. The blind via diameter of any blind via is 50um, the number of blind vias in any blind via array is greater than 300, and the distance between the centers of any two blind vias is 4 times the blind via diameter. Then, by using the blind via array position information in the processing drawing, 9 second blind via arrays can be located. The second blind via array refers to the array area waiting to be processed to obtain the second blind vias.

[0073] As an example, based on the position information of multiple blind hole arrays in the processing drawings, multiple second blind hole arrays corresponding to the second blind hole divisions are obtained on the test board; a target second blind hole array is selected from the different second blind hole arrays, and a first drilling test power is set for the target second blind hole array; and a second drilling test power is set for the other second blind hole arrays according to the positional relationship between the target second blind hole array and other second blind hole arrays. The first drilling test power and multiple sets of second drilling test powers are used together as different drilling test powers set for the second test board.

[0074] In one embodiment, based on the hole morphology characteristics of multiple second blind holes, an appropriate power is selected from different drilling test powers, including:

[0075] Based on the similarity between the hole morphology features of multiple second blind hole arrays and the standard hole morphology features, an appropriate power is selected from different drilling test powers.

[0076] It should be noted that after drilling blind holes to obtain multiple second blind holes, the hole morphology characteristics of the processed second blind holes will differ due to the different drilling test powers used for different second blind hole arrays. Therefore, the blind hole array morphology characteristics of each group of second blind holes can be selected by using the hole morphology characteristics of the second blind holes within each group of second blind holes. Finally, the blind hole array morphology characteristics of each group of second blind holes are compared with the standard blind hole array morphology characteristics to select the appropriate power from multiple drilling test powers. Here, one group of second blind holes corresponds to one second blind hole array.

[0077] As an example, the processed second blind holes belonging to the same second blind hole array are divided into the same second blind hole group. After polling multiple groups of second blind hole arrays, the second blind hole group is obtained. For any second blind hole group, the following steps are performed: the hole morphology features of all second blind holes in the second blind hole group are fused to obtain the blind hole array morphology features of the second blind hole group, until the blind hole array morphology features of all second blind hole groups are obtained; the feature similarity between multiple blind hole array morphology features and standard blind hole array morphology features is selected respectively, and the second blind hole group with the highest feature similarity is taken as the target second blind hole group, and the drilling test power corresponding to the target second blind hole group is taken as the adaptation power.

[0078] In one feasible approach, nine second blind via arrays are positioned on the test board from top to bottom, and the maximum power is set to nine power levels from top to bottom along a percentage from 0 to 1. That is, the drilling test power corresponding to the uppermost second blind via array is 10%W, and the drilling test power corresponding to the lowermost second blind via array is 90%W.

[0079] In this embodiment, during the process of selecting the appropriate power from multiple sets of borehole test power, a second blind hole array is obtained by dividing multiple second blind holes, and then different second blind hole groups corresponding to the second blind hole array are processed. Using the second blind holes in each group of second blind holes, the blind hole array morphological characteristics of multiple groups of second blind holes are determined. Based on the feature similarity between the blind hole array morphological characteristics and the standard blind hole array morphological characteristics, the appropriate power is selected from multiple sets of borehole test power. This avoids the error situation that occurs in the process of selecting the appropriate power based on a single hole morphological characteristics. Therefore, it lays the foundation for further improving the selection accuracy of the pulse number selection for blind holes.

[0080] In one embodiment, the hole quality characteristics include hole machining quality characteristics and hole quality geometric characteristics; observing the hole quality characteristics of multiple first blind holes, and selecting the appropriate number of pulses from different pulse test counts, including:

[0081] Based on the hole processing quality characteristics of any first blind hole, a first quality selection result for the first blind hole is obtained, and based on the hole quality geometric characteristics of any first blind hole, a second quality selection result for the first blind hole is obtained; observe the first quality selection results and second quality selection results of multiple first blind holes, and select the appropriate number of pulses from different pulse test counts.

[0082] It should be noted that hole quality characteristics include hole machining quality characteristics and hole quality geometric characteristics. Hole machining quality characteristics specifically include cross-cutting copper loss and hole shape quality, while hole quality geometric characteristics specifically include upper hole diameter, lower hole diameter, and hole diameter ratio. By comprehensively considering different dimensions of hole quality characteristics, a relatively suitable pulse count can be selected. For example, in one feasible approach, 10 blind holes are selected for each group of blind holes. The upper hole diameter, lower hole diameter, hole diameter ratio, cross-cutting copper loss, and hole shape quality of the 10 holes are measured and listed in a table. Based on the actual quality control requirements, the applicable pulse count range is selected. For example, if the actual quality control requirement is an upper hole diameter of 50µm±10, and a pulse count of 50 to 60 pulses is required to machine a hole with an upper hole diameter of 50µm±10, then the applicable pulse count range is 50 to 60 pulses. Simultaneously, the applicable pulse count range must be selected in conjunction with requirements for lower hole diameter, hole diameter ratio, cross-cutting copper loss, and hole shape quality.

[0083] As an example, for any first blind hole, a first quality selection result is obtained based on the hole processing quality characteristics of the first blind hole, and a second quality selection result is obtained based on the hole quality geometric characteristics of the first blind hole. By fusing the first quality selection result and the second quality selection result of the first blind hole, a total quality selection result of the first blind hole is obtained. Based on the total quality selection result of all first blind holes, the appropriate number of pulses is selected from different pulse test pulse counts.

[0084] In one embodiment, the hole processing quality characteristics include slice copper loss, blind hole type quality characteristics, glass fiber protrusion and glass fiber shrinkage, and the hole quality geometric characteristics include upper hole diameter, lower hole diameter and hole diameter ratio.

[0085] It should be noted that the copper loss during slicing, hole quality characteristics, fiberglass protrusion, and fiberglass shrinkage can all be understood as quantitative indicators for evaluating the hole processing quality characteristics. Similarly, the upper hole diameter, lower hole diameter, and hole diameter ratio can all be understood as quantitative indicators for evaluating the hole quality geometric characteristics. Different quantitative indicators are affected by various factors in the laser processing process, such as laser power, cutting speed, cutting depth, PCB board material, and thickness. By comprehensively evaluating the hole processing quality characteristics and hole quality geometric characteristics using multiple quantitative indicators, the quality of the blind holes processed under the current pulse test firing number can be accurately reflected, thus providing an accurate basis for selecting the appropriate pulse firing number.

[0086] In one feasible approach, the test type of the test board is first analyzed. If the test board is a surfaceless copper PCB, a processing layer is created on the host computer. Based on the blind via array position information of the processing layer, multiple second blind via arrays are obtained on the surfaceless copper PCB. Then, a processing file is generated based on the processing layer and multiple sets of drilling test powers. The processing file is then run by a laser processing device to process multiple second blind vias on the surfaceless copper PCB. Based on the hole morphology characteristics of the multiple second blind vias, an appropriate power is selected from multiple sets of drilling test powers. Using a second preset pulse test count, the critical pulse test count for the surfaceless copper PCB is determined. Based on the critical pulse test count, different pulse test counts are set for the surfaceless copper PCB. Multiple second blind vias are then processed on the surfaceless copper PCB using different pulse test counts and appropriate powers. Finally, combining the hole processing quality characteristics and hole quality geometry characteristics of the multiple second blind vias, the appropriate pulse count is selected from different pulse test counts.

[0087] In other words, by comparing the hole quality characteristics of multiple first blind holes processed under different pulse test counts, the appropriate number of pulses for processing the blind holes can be selected. Therefore, in determining the pulse test count for different blind holes, multiple different blind holes are processed using the same power and different pulse counts. The hole quality characteristics of the blind holes are observed, and the hole quality characteristics that meet the requirements are selected. Assuming that the hole quality characteristics of multiple blind holes all meet the requirements, the corresponding pulse counts are all acceptable. Finally, the appropriate number of pulses is selected from multiple different pulse counts. This method can quickly select the appropriate number of pulses, avoiding technical defects such as errors in manually set pulse test counts. Therefore, it improves the accuracy of selecting the pulse count for blind holes, thereby improving the processing quality of the blind holes.

[0088] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0089] Based on the same inventive concept, this application also provides a pulse count selection system for blind holes to implement the pulse count selection method for blind holes described above. The solution provided by this device is similar to the implementation described in the above method; therefore, the specific limitations of the pulse count selection system embodiments for one or more blind holes provided below can be found in the limitations of the pulse count selection method for blind holes described above, and will not be repeated here.

[0090] In one exemplary embodiment, such as Figure 3 As shown, a blind aperture pulse count selection system includes a host computer 40, a laser processing device 41, and an observation device 42. The laser processing device includes an acquisition module 411 and a generation module 412, wherein:

[0091] The acquisition module 411 is used to acquire the adaptive power of the test board;

[0092] The processing module 412 is used to process multiple first blind holes on the test board using the adaptive power and different pulse test counts;

[0093] The host computer 40 is used to create machining files for the plurality of first blind holes and send the machining files to the machining module;

[0094] The observation device 42 is used to observe the hole quality characteristics of the plurality of first blind holes and select the appropriate number of pulses from the different pulse test numbers.

[0095] In one embodiment, the test board includes a first test board and a second test board, wherein the first test board and the second test board are different test boards; the acquisition module 411 is further configured to:

[0096] The standard power of the first test board is used as the adaptive power; multiple second blind holes are machined on the second test board using a first preset number of pulse tests and different drilling test powers; the adaptive power is selected from the different drilling test powers according to the hole morphology characteristics of the multiple second blind holes.

[0097] In one embodiment, the second test plate is a test plate with a surface covered by a non-metallic material and an interior containing metal; the blind aperture pulse count selection system is further used for:

[0098] Using the aforementioned adaptive power and different second preset pulse test counts, the plurality of first blind holes are processed on the second test board; a critical pulse test count is selected from the different second preset pulse test counts, wherein the critical pulse test count is the number of pulse test counts required to process any one of the first blind holes to expose the metal material; based on the critical pulse test count, the different pulse test counts are set, and an applicable pulse count is selected from the different pulse test counts.

[0099] In one embodiment, the first test plate is a test plate with a surface covered by a metal material and an interior containing metal; the blind aperture pulse count selection system is further used for:

[0100] Using the standard power and different third preset pulse test counts, the plurality of first blind holes are processed on the first test board; a pulse test critical count is selected from the different third preset pulse test counts, wherein the pulse test critical count is the number of pulse test counts required to process any one of the first blind holes to expose the metal material; based on the pulse test critical count, the different pulse test counts are set, and an applicable pulse count is selected from the different pulse test counts.

[0101] In one embodiment, the pulse count selection system for the blind aperture is further used for:

[0102] Divide the multiple second blind holes of the second test board into corresponding second blind hole arrays; set different drilling test power for the multiple second blind hole arrays respectively.

[0103] In one embodiment, the pulse count selection system for the blind aperture is further used for:

[0104] The appropriate power is selected from the different drilling test powers based on the feature similarity between the hole morphology features of the plurality of second blind hole arrays and the standard hole morphology features.

[0105] In one embodiment, the hole quality characteristics include hole machining quality characteristics and hole quality geometric characteristics; the observation device 42 is further used for:

[0106] Based on the hole processing quality characteristics of any of the first blind holes, a first quality selection result for the first blind hole is obtained, and based on the hole quality geometric characteristics of any of the first blind holes, a second quality selection result for the first blind hole is obtained; observe the first quality selection results and second quality selection results of multiple first blind holes, and select the applicable number of pulses from the different pulse test counts.

[0107] In one embodiment, the hole processing quality characteristics include slice copper loss, blind hole type quality characteristics, glass fiber protrusion and glass fiber shrinkage, and the hole quality geometric characteristics include upper hole diameter, lower hole diameter and hole diameter ratio.

[0108] Each module in the aforementioned blind aperture pulse count selection system can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in hardware or independently of the processor in the blind aperture pulse count selection device, or stored in software within the memory of the blind aperture pulse count selection device, so that the processor can call and execute the corresponding operations of each module.

[0109] In one exemplary embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 4 As shown. The computer device includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computing and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements a method for selecting the number of pulses emitted by a blind aperture. Those skilled in the art will understand that... Figure 4 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the pulse number selection device for the blind hole applied thereto. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0110] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.

[0111] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0112] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0113] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for selecting the number of pulses emitted by a blind aperture, characterized in that, The method includes: Obtain the power rating of the test board; Multiple first blind holes are fabricated on the test board using the aforementioned adaptive power and different pulse test counts; Observe the hole quality characteristics of the multiple first blind holes, and select the appropriate number of pulses from the different pulse test numbers.

2. The method according to claim 1, characterized in that, The test board includes a first test board and a second test board, wherein the first test board and the second test board are different test boards; The acquisition of the test board's adaptive power includes one of the following: The standard power of the first test board is used as the adapted power; Multiple second blind holes are machined on the second test board using a first preset number of pulse tests and different drilling test powers; based on the hole morphology characteristics of the multiple second blind holes, the appropriate power is selected from the different drilling test powers.

3. The method according to claim 2, characterized in that, The second test plate is a test plate with a surface covered by a non-metallic material and a metal interior; After selecting the appropriate power from the different drilling test powers based on the hole morphology characteristics of the plurality of second blind holes, the method further includes: Using the aforementioned adaptive power and different second preset pulse test counts, the plurality of first blind holes are processed on the second test board; A critical pulse test count is selected from the different second preset pulse test counts, wherein the critical pulse test count is the number of pulse tests required to process any of the first blind holes to expose the metal material; Based on the critical number of pulse tests, different numbers of pulse tests are set, and an appropriate number of pulse tests is selected from the different numbers of pulse tests.

4. The method according to claim 2, characterized in that, The first test board is a test board with a surface covered by a metal material and a metal interior; After using the standard power of the first test board as the adapted power, the method further includes: Using the standard power and different third preset pulse test counts, the plurality of first blind holes are processed on the first test board; The critical number of pulse tests is selected from the different third preset pulse test counts, wherein the critical number of pulse tests is the number of pulse tests required to process any of the first blind holes to expose the metal material; Based on the critical number of pulse tests, different numbers of pulse tests are set, and an appropriate number of pulse tests is selected from the different numbers of pulse tests.

5. The method according to claim 2, characterized in that, Before machining multiple second blind holes on the second test board using a first preset number of pulse tests and different drilling test powers, the method further includes: Divide the multiple second blind vias of the second test board into corresponding second blind via arrays; Different drilling test power settings are applied to the multiple second blind hole arrays.

6. The method according to claim 5, characterized in that, The step of selecting the appropriate power from the different drilling test powers based on the hole morphology characteristics of the plurality of second blind holes includes: The appropriate power is selected from the different drilling test powers based on the feature similarity between the hole morphology features of the plurality of second blind hole arrays and the standard hole morphology features.

7. The method according to claim 1, characterized in that, The hole quality characteristics include hole machining quality characteristics and hole quality geometric characteristics; The observation of the hole quality characteristics of the plurality of first blind holes, and the selection of the appropriate number of pulses from the different pulse test firing numbers, includes: Based on the hole processing quality characteristics of any of the first blind holes, a first quality selection result for the first blind hole is obtained, and based on the hole quality geometric characteristics of any of the first blind holes, a second quality selection result for the first blind hole is obtained. Observe the first quality selection results and the second quality selection results of multiple first blind holes, and select the applicable number of pulses from the different pulse test numbers.

8. The method according to claim 7, characterized in that, The hole processing quality characteristics include copper loss during slicing, hole shape quality characteristics, fiberglass protrusion, and fiberglass shrinkage. The hole quality geometric characteristics include upper hole diameter, lower hole diameter, and hole diameter ratio.

9. A pulse count selection system for a blind aperture, characterized in that, The blind hole pulse number selection system includes a host computer, laser processing equipment, and an observation device. The laser processing equipment includes an acquisition module and a processing module. The acquisition module is used to acquire the adaptive power of the test board; The processing module is used to process multiple first blind holes on the test board using the adaptive power and different pulse test counts; The host computer is used to create machining files for the plurality of first blind holes and send the machining files to the machining module; The observation device is used to observe the hole quality characteristics of the plurality of first blind holes and select the appropriate number of pulses from the different pulse test numbers.

10. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 8.

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