Method and device for acquiring thermal diffusion coefficient, and storage medium

Abstract

The application provides a thermal diffusivity acquisition method and device and a storage medium, relates to the technical field of material thermal physical property parameter testing, and is used for simplifying the process of acquiring and measuring the thermal diffusivity of a material. The method comprises the following steps: in the process of heating a known material and a material to be measured, an electronic device acquires a plurality of first infrared images at different times and a plurality of second infrared images at different times. For each infrared image at a time, the electronic device respectively acquires a first set of pixel values in the first infrared image and a second set of pixel values in the second infrared image. The electronic device determines a plurality of first Gaussian curves and a plurality of second Gaussian curves. The electronic device determines a first slope based on the plurality of first Gaussian curves and a second slope based on the plurality of second Gaussian curves. Then, the electronic device acquires the thermal diffusivity of the known material, and determines the thermal diffusivity of the material to be measured based on the thermal diffusivity of the known material, the first slope and the second slope.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of material thermal physical property parameter testing, and particularly relates to a thermal diffusivity acquisition method and device and a storage medium. BACKGROUND

[0002] Thermal diffusivity, as one of important thermal physical property parameters of solid materials, represents the ability of each part of an object to tend to be consistent in temperature during heating or cooling, and is an important basis for evaluating and calculating the heat transfer performance of materials.

[0003] At present, there are many methods for measuring the thermal diffusivity of materials, including the plane heat source method, the thermal probe method, the constant flow heating method, the thermal probe method, etc. However, these methods usually have high requirements for the shape of the test piece, and some even need to specially prepare a sample and bury the probe, and the process is relatively complex. Therefore, how to simplify the measurement of the thermal diffusivity of materials has become a technical problem to be solved. SUMMARY

[0004] The present application provides a thermal diffusivity acquisition method and device and a storage medium, which are used to simplify the process of acquiring and measuring the thermal diffusivity of materials.

[0005] To achieve the above object, the present application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a thermal diffusivity acquisition method. In the method, during the heating of a known material and a to-be-tested material, a plurality of first infrared images at different times and a plurality of second infrared images at different times are acquired, the first infrared images being infrared images of the known material, and the second infrared images being infrared images of the to-be-tested material. For each infrared image at a time, a first pixel value set in the first infrared image and a second pixel value set in the second infrared image are acquired respectively, to acquire a plurality of first pixel value sets and a plurality of second pixel value sets, the pixel value set being pixel values of pixel points located on the same straight line in the infrared image at a time. Each first pixel value set is subjected to Gaussian fitting to determine a plurality of first Gaussian curves, and each second pixel value set is subjected to Gaussian fitting to determine a plurality of second Gaussian curves. A first slope is determined based on the plurality of first Gaussian curves, the first slope being determined based on a Gaussian broadening parameter of the plurality of first Gaussian curves. A second slope is determined based on the plurality of second Gaussian curves, the second slope being determined based on a Gaussian broadening parameter of the plurality of second Gaussian curves. The thermal diffusivity of the known material is acquired, and the thermal diffusivity of the to-be-tested material is determined based on the thermal diffusivity of the known material, the first slope and the second slope.

[0007] Based on the technical scheme, in the process of heating the known material and the to-be-detected material, the electronic device can obtain the pixel value of the infrared image after obtaining the first infrared image and the second infrared image, and then reflect the temperature of the material. Then, the electronic device can fit the pixel value to obtain the first Gaussian curve and the second Gaussian curve, and determine the first slope determined based on the Gaussian broadening parameter of the first Gaussian curve and the second slope determined based on the Gaussian broadening parameter of the plurality of second Gaussian curves. Then, since the ratio of the slopes of the two materials is the same as the ratio of the thermal diffusion coefficients of the two materials, the electronic device can obtain the thermal diffusion coefficient of the known material, and determine the thermal diffusion coefficient of the to-be-detected material based on the thermal diffusion coefficient of the known material, the first slope and the second slope. In this way, the process of obtaining the thermal diffusion coefficient of the material can be simplified, and the difficulty of obtaining the thermal diffusion coefficient of the material is reduced.

[0008] In a possible design, for each first Gaussian curve, a first Gaussian broadening parameter is determined according to the first Gaussian curve to obtain a plurality of first Gaussian broadening parameters. The plurality of first Gaussian broadening parameters and a plurality of time points are linearly fitted to determine the first slope.

[0009] In a possible design, for each second Gaussian curve, a second Gaussian broadening parameter is determined according to the second Gaussian curve to obtain a plurality of second Gaussian broadening parameters. The plurality of second Gaussian broadening parameters and a plurality of time points are linearly fitted to determine the second slope.

[0010] In a possible design, a first ratio is determined, the first ratio being a ratio between the thermal diffusion coefficient of the known material and the second slope. The thermal diffusion coefficient of the to-be-detected material is determined based on the first ratio and the first slope.

[0011] In a second aspect, the present application provides a device for obtaining a thermal diffusion coefficient, which comprises an obtaining unit and a processing unit.

[0012] The acquisition unit is configured to acquire a plurality of first infrared images and a plurality of second infrared images at different time points during heating of the known material and the material to be measured, the first infrared images being infrared images of the known material, and the second infrared images being infrared images of the material to be measured. The acquisition unit is further configured to acquire, for each infrared image at a time point, a first set of pixel values in the first infrared image and a second set of pixel values in the second infrared image, to acquire a plurality of first sets of pixel values and a plurality of second sets of pixel values, the set of pixel values being pixel values of pixel points located on a same straight line in the infrared image at the time point. The processing unit is configured to perform Gaussian fitting on each first set of pixel values to determine a plurality of first Gaussian curves, and perform Gaussian fitting on each second set of pixel values to determine a plurality of second Gaussian curves. The processing unit is configured to determine a first slope based on the plurality of first Gaussian curves, the first slope being determined based on a Gaussian broadening parameter of the plurality of first Gaussian curves. The processing unit is configured to determine a second slope based on the plurality of second Gaussian curves, the second slope being determined based on a Gaussian broadening parameter of the plurality of second Gaussian curves. The processing unit is configured to acquire a thermal diffusivity of the known material, and determine a thermal diffusivity of the material to be measured based on the thermal diffusivity of the known material, the first slope, and the second slope.

[0013] In a possible design, the processing unit is configured to determine, for each first Gaussian curve, a first Gaussian broadening parameter based on the first Gaussian curve, to acquire a plurality of first Gaussian broadening parameters. The processing unit is configured to perform linear fitting on the plurality of first Gaussian broadening parameters and the plurality of time points to determine the first slope.

[0014] In a possible design, the processing unit is configured to determine, for each second Gaussian curve, a second Gaussian broadening parameter based on the second Gaussian curve, to acquire a plurality of second Gaussian broadening parameters. The processing unit is configured to perform linear fitting on the plurality of second Gaussian broadening parameters and the plurality of time points to determine the second slope.

[0015] In a possible design, the processing unit is configured to determine a first ratio between the thermal diffusivity of the known material and the second slope. The processing unit is configured to determine the thermal diffusivity of the material to be measured based on the first ratio and the first slope.

[0016] In a third aspect, the present application provides a device for acquiring a thermal diffusivity, the device comprising a processor and a memory, the processor and the memory being coupled, the memory being configured to store one or more programs comprising computer execution instructions, and the processor being configured to execute the computer execution instructions stored in the memory to implement the method for acquiring a thermal diffusivity described in the first aspect and any possible implementation manner of the first aspect when the device for acquiring a thermal diffusivity is running.

[0017] In a fourth aspect, the present application provides a computer readable storage medium, wherein the computer readable storage medium stores instructions, and when the instructions are executed on a computer, the computer is caused to perform the method for obtaining the thermal diffusivity described in the first aspect and any possible implementation manner of the first aspect.

[0018] In a fifth aspect, the present application provides a chip, wherein the chip comprises a processor and a communication interface, the communication interface is coupled with the processor, and the processor is configured to execute computer programs or instructions to implement the method for obtaining the thermal diffusivity described in the first aspect and any possible implementation manner of the first aspect.

[0019] The technical problems and technical effects that can be solved by the thermal diffusivity obtaining apparatus, the computer device, the computer storage medium or the chip in the above solution can refer to the technical problems and technical effects solved by the first aspect, and details are not described herein. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 A system architecture diagram of a communication system is provided for the embodiments of the present application.

[0021] Figure 2 A flowchart of the method for obtaining the thermal diffusivity is provided for the embodiments of the present application.

[0022] Figure 3 An example diagram of a Gaussian curve is provided for the embodiments of the present application.

[0023] Figure 4 A linear fitting diagram is provided for the embodiments of the present application.

[0024] Figure 5 A structural diagram of the thermal diffusivity obtaining apparatus is provided for the embodiments of the present application.

[0025] Figure 6 Another schematic diagram of the thermal diffusivity obtaining apparatus is provided for the embodiments of the present application.

[0026] Figure 7 A conceptual partial view of a computer program product is provided for the embodiments of the present application. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0028] The character " / " is generally used to represent an "or" relationship between the associated objects in front and back. For example, A / B can be understood as A or B.

[0029] The terms "first" and "second" in the description and claims of the present application are used to distinguish different objects, not to describe a specific order of the objects.

[0030] In addition, the terms "comprising" and "having" and any variations thereof mentioned in the description of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or modules is not limited to the listed steps or modules, but can optionally include other steps or modules that are not listed, or can optionally include other steps or modules inherent to the process, method, product or device.

[0031] In addition, in the embodiments of the present application, the words "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design solution described as "exemplary" or "for example" in the present application should not be interpreted as being more preferred or advantageous than other embodiments or design solutions. Rather, the use of the words "exemplary" or "for example" is intended to present concepts in a concrete manner.

[0032] Thermal diffusivity, as one of the important thermophysical property parameters of solid materials, characterizes the ability of the parts of an object to tend to be uniform in temperature during heating or cooling, and is an important basis for evaluating and calculating the heat transfer performance of materials. For example, thermal diffusivity explains the heat carrying capacity and heat transport capacity of a substance. Thermal diffusivity is an important parameter for characterizing the thermal properties of materials, which describes the thermal inertia of an object. The larger the coefficient, the smaller the thermal inertia, and the faster the object reaches thermal equilibrium with the surrounding environment.

[0033] At present, there are many methods for measuring the thermal diffusivity of materials, including plane heat source method, thermal probe method, constant flow heating method, thermal probe method, etc. However, these methods usually have high requirements for the shape of the test piece, and some even need to specially prepare samples to bury the probe, and the process is relatively complex. Therefore, how to simplify the measurement of the thermal diffusivity of materials has become a technical problem to be solved.

[0034] To address the aforementioned problems, this application provides a method for obtaining the thermal diffusivity. In this method, during the heating of a known material and a material to be tested, an electronic device can acquire multiple first infrared images and multiple second infrared images at different times. The first infrared image is an infrared image of the known material, and the second infrared image is an infrared image of the material to be tested. Then, for each infrared image at a given time, the electronic device can acquire a first set of pixel values ​​in the first infrared image and a second set of pixel values ​​in the second infrared image, where each set of pixel values ​​represents the pixel values ​​of pixels located on the same straight line in the infrared image at a given time. The electronic device can perform Gaussian fitting on each first set of pixel values ​​to determine multiple first Gaussian curves, and perform Gaussian fitting on each second set of pixel values ​​to determine multiple second Gaussian curves. Then, the electronic device can determine a first slope based on the multiple first Gaussian curves, the first slope being determined by Gaussian broadening parameters based on the multiple first Gaussian curves. Furthermore, the electronic device can determine a second slope based on the multiple second Gaussian curves, the second slope being determined by Gaussian broadening parameters based on the multiple second Gaussian curves. Then, the electronic device can acquire the thermal diffusivity of a known material and, based on the thermal diffusivity of the known material, the first slope, and the second slope, determine the thermal diffusivity of the material to be tested.

[0035] In this way, after the electronic device acquires the infrared image, the process of obtaining the material's thermal diffusivity can be simplified and the difficulty of obtaining the material's thermal diffusivity can be reduced based on the infrared image's thermal diffusivity coefficient. The implementation environment of this application embodiment is described below.

[0036] like Figure 1 The diagram illustrates a communication system provided in this application embodiment. The system includes an electronic device 101, an infrared temperature acquisition device 102, and a heating device 103. The electronic device 101 and the infrared temperature acquisition device 102 can be connected wirelessly or via a wired connection. For example, the electronic device 101 can be connected to the infrared temperature acquisition device via a thermocoupler.

[0037] The heating device 103 can be used to heat the object 104 to change its temperature. The heating device 103 can be a cassette heating element, a cartridge heating element, a heating element, etc.

[0038] It should be noted that the positions of the heating device 103 and the object 104 to be heated are not limited in this embodiment. For example, the heating device 103 may be located on the upper surface of the object 104 to be heated. Or, for example, the heating device 103 may be located on the side of the object 104 to be heated.

[0039] The infrared temperature acquisition device 102 is configured to acquire an infrared image of the object 104 to be heated. The infrared temperature acquisition device can transmit the infrared image of the object 104 to be heated to the electronic device 101.

[0040] The electronic device 101 is configured to process the infrared image and obtain the thermal diffusivity of the object 104 to be heated.

[0041] The electronic device (e.g., a terminal) can be a device with a transceiver function. The terminal can be deployed on land, including indoors or outdoors, handheld or vehicle-mounted; can be deployed on the water surface (such as ships, etc.); and can be deployed in the air (such as airplanes, balloons, and satellites, etc.). The terminal includes a handheld device, a vehicle-mounted device, a wearable device, or a computing device with a wireless communication function. Exemplarily, the terminal can be a mobile phone, a tablet computer, or a computer with a wireless transceiver function. The terminal device can also be a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in unmanned driving, a wireless terminal in telemedicine, a wireless terminal in smart power grids, a wireless terminal in smart cities, a wireless terminal in smart homes, etc.

[0042] It should be noted that the electronic device can also be a server, which can be a single physical server or a server cluster composed of multiple servers. Alternatively, the server cluster can also be a distributed cluster. Alternatively, the server can be a cloud server. The specific implementation of the server is not limited in the embodiments of the present application.

[0043] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0044] As shown in FIG. 1, a method for obtaining thermal diffusivity provided by the embodiments of the present application is provided, which includes the following steps. Figure 2

[0045] S201, the electronic device acquires a plurality of first infrared images at different times and a plurality of second infrared images at different times.

[0046] The first infrared image is an infrared image of a known material, and the second infrared image is an infrared image of a material to be measured.

[0047] In the embodiments of the present application, during the heating of the known material and the material to be measured, the electronic device can periodically acquire a plurality of first infrared images and periodically acquire a plurality of second infrared images.

[0048] ​For example, the electronic device can collect the first infrared image and the second infrared image at a preset time interval. For example, the electronic device can collect the first infrared image and the second infrared image at 10:01, collect the first infrared image and the second infrared image at 10:02, and collect the first infrared image and the second infrared image at 10:03.

[0049] It should be noted that, before the known material and the to-be-measured material are heated, it is necessary to ensure that the known material and the to-be-measured material are in thermal equilibrium with the ambient temperature.

[0050] In a possible design, before the electronic device collects the first infrared image at multiple time points and the second infrared image at multiple time points, the electronic device can collect the temperature of the known material and the temperature of the to-be-measured material. In a case where the temperature of the known material and the temperature of the to-be-measured material are both the same as a first target temperature, the electronic device sends a heating instruction to the heating device, where the heating instruction is used to instruct to heat the known material and the to-be-measured material. The first target temperature is the temperature of the known material and the ambient temperature of the region where the to-be-measured material is located.

[0051] It should be noted that the temperature measurement needs to be arranged in a workroom with environmental control, and the environmental illumination and the environmental temperature of the test are kept constant. The known material and the to-be-measured material are respectively placed on a workbench, so that the materials are in thermal equilibrium with the surrounding environment. Then, a heating device with a temperature not exceeding the melting point of the to-be-measured material is placed on the to-be-measured material and the known material, and an infrared temperature collection device (such as an infrared thermal imager) is used to monitor the temperature change of the heating surface region. In this process, the heating time and the heating source temperature of the known material and the to-be-measured material are kept the same.

[0052] S202, the electronic device respectively collects a first pixel value set in the first infrared image and a second pixel value set in the second infrared image.

[0053] The pixel value set is a pixel value of a pixel point located on the same straight line in an infrared image at a time point.

[0054] In an embodiment of the present application, the pixel value is used to indicate the temperature of a region in the material at the same position as the pixel point.

[0055] In a possible design, the pixel value is proportional to the temperature of the region.

[0056] That is, the greater the pixel value of the pixel point, the higher the temperature of the region corresponding to the pixel point. The smaller the pixel value of the pixel point, the lower the temperature of the region corresponding to the pixel point.

[0057] In a possible implementation, for each first infrared image, the electronic device can determine a first pixel point, the first pixel point being any pixel point in the first infrared image. Then, the electronic device can determine a first pixel point set from the first infrared image according to a position of the first pixel point, the first pixel point set including pixel points that are collinear with the first pixel point, and the pixel points in the first pixel point set being on the same straight line. Then, the electronic device can obtain pixel values of each pixel point in the first pixel point set, to obtain a first pixel value set.

[0058] That is, the first pixel point set includes pixel points (including the first pixel point) that are collinear, that is, the pixel points in the first pixel point set are all located on a straight line that extends based on the first pixel point.

[0059] In a possible implementation, for each second infrared image, the electronic device can determine a second pixel point, the second pixel point being any two pixel points in the second infrared image. Then, the electronic device can determine a second pixel point set from the second infrared image according to a position of the second pixel point, the second pixel point set including pixel points that are collinear with the second pixel point, and the pixel points in the second pixel point set being on the same two straight lines. Then, the electronic device can obtain pixel values of each pixel point in the second pixel point set, to obtain a second pixel value set.

[0060] In the embodiments of the present application, the known material and the to-be-measured strategy are both non-crystalline solid materials.

[0061] It can be understood that, since the Gaussian broadening parameter of any direction of the non-crystalline solid material is the same as the time (such as the first slope or the second slope described above). Therefore, in the case that the known material and the to-be-measured strategy are both non-crystalline solid materials, the electronic device can obtain pixel values in any direction of the material.

[0062] In the embodiments of the present application, for the infrared image at each time, the electronic device can respectively obtain a first pixel value set in the first infrared image and a second pixel value set in the second infrared image, to obtain a plurality of first pixel value sets and a plurality of second pixel value sets.

[0063] S203, the electronic device performs Gaussian fitting on each first pixel value set to determine a plurality of first Gaussian curves, and performs Gaussian fitting on each second pixel value set to determine a plurality of second Gaussian curves.

[0064] In a possible implementation, the electronic device can determine the first Gaussian curve based on a Gaussian fitting formula for the first pixel value set. The electronic device determines the second Gaussian curve based on the Gaussian fitting formula for the second pixel value set.

[0065] In this embodiment of the application, a Gaussian curve is used to reflect the relationship between the temperature of the first region and the first distance. The temperature of the first region is the temperature of the region corresponding to the pixel, and the first distance is the distance between the region corresponding to the pixel and the heating source.

[0066] Alternatively, Gaussian curves can be used to reflect the relationship between the distance between a pixel and the heating source and the pixel value of the pixel.

[0067] In one possible design, the Gaussian fitting formula can be:

[0068]

[0069] Where a is a constant, d represents the position of the region corresponding to the pixel, and c represents the standard deviation of the Gaussian widening parameter.

[0070] For example, such as Figure 3 As shown, it illustrates the relationship between the distance between the region corresponding to multiple pixels located on the same straight line and the heating source, and the temperature of the region corresponding to the pixel (or the relationship between the distance between the pixel and the heating source and the pixel value of the pixel).

[0071] In this diagram, the x-axis represents temperature (or pixel value), and the y-axis represents the radial distance between the region corresponding to the pixel and the heating source. Curve 301 represents the Gaussian curve of the set of pixel values ​​in the infrared image at the 1st second, curve 302 represents the Gaussian curve of the set of pixel values ​​in the infrared image at the 4th second, and curve 303 represents the Gaussian curve of the set of pixel values ​​in the infrared image at the 7th second.

[0072] S204. The electronic device determines the first slope based on multiple first Gaussian curves.

[0073] The first slope is determined based on the Gaussian broadening parameters of multiple first Gaussian curves.

[0074] In one possible implementation, for each first Gaussian curve, the electronic device can determine a first Gaussian broadening parameter based on the first Gaussian curve to obtain multiple first Gaussian broadening parameters. Then, the electronic device can perform linear fitting on the multiple first Gaussian broadening parameters and multiple time points to determine a first slope.

[0075] In other words, the first Gaussian broadening parameter is the Gaussian broadening parameter in any direction of the material under test.

[0076] In one possible design, the electronic device can determine the first slope based on Formula 2.

[0077] b 2 =(R 2 Formula 2 (+8αt).

[0078] wherein b is used to represent a Gaussian broadening parameter, R is used to represent a thermal beam radius of the heating source, a is used to represent a thermal diffusivity, and t is used to represent a heating time.

[0079] That is, in the embodiments of the present application, the thermal diffusivity is related to the Gaussian broadening parameter b in the equation.

[0080] It should be noted that the formula two can be determined based on the heat conduction mode (i.e., the formula three).

[0081]

[0082] wherein T is used to represent a temperature of a region in the material, e is used to represent a heat outflow rate, 0 is used to represent a thickness of the region from the heating source, and Q is used to represent a heat quantity.

[0083] In the embodiments of the present application, the electronic device can obtain the thermal beam radius of the heating source and the heating time, and determine the first Gaussian broadening parameter based on the standard deviation of the Gaussian broadening parameter of the first Gaussian curve. Then, the electronic device can determine the first slope based on the first Gaussian broadening parameter, the thermal beam radius of the heating source, and the heating time.

[0084] S205, the electronic device determines a second slope based on a plurality of second Gaussian curves.

[0085] wherein the second slope is determined based on a plurality of second Gaussian broadening parameters of the second Gaussian curves.

[0086] In a possible implementation, for each second Gaussian curve, the electronic device can determine a second Gaussian broadening parameter according to the second Gaussian curve to obtain a plurality of second Gaussian broadening parameters. Then, the electronic device can perform linear fitting on the plurality of second Gaussian broadening parameters and a plurality of time instants to determine the second slope.

[0087] That is, the second Gaussian broadening parameter is the Gaussian broadening parameter in any direction of the known material.

[0088] Similarly, the electronic device can determine the second Gaussian broadening parameter based on the standard deviation of the Gaussian broadening parameter of the second Gaussian curve.

[0089] For example, as shown in FIG. 4, Figure 4 which shows the first slope of the material to be measured and the second slope of the known material. Wherein the oblique line 401 is linearly fitted based on the Gaussian broadening parameter of the material to be measured, and the oblique line 402 is linearly fitted based on the Gaussian broadening parameter of the known material.

[0090] For example, if the material to be measured is coal gangue sintered brick, and the known material is a polyethylene plate (which can be referred to as a PE plate for short), the linear regression equation of the coal gangue sintered brick is: b 2 = 0.7548t + 4.052, and the slope is 0.7548. The linear regression equation of the PE plate is: b 2 = 0.3814t + 9.657, and the slope is 0.3814.

[0091] In S206, the electronic device acquires the thermal diffusivity of the known material.

[0092] In a possible implementation, the electronic device stores the thermal diffusivity of the known material.

[0093] In S207, the electronic device determines the thermal diffusivity of the material to be measured based on the thermal diffusivity of the known material, the first slope, and the second slope.

[0094] It should be noted that, in the embodiments of the present application, the ratio of the linear fitting slopes of the Gaussian broadening parameters of the two materials changing with time is the same as the ratio of the thermal diffusivities of the two materials. That is, the ratio between the first slope and the second slope is the same as the ratio between the thermal diffusivity of the material to be measured and the thermal diffusivity of the known material.

[0095] For example, formula four can satisfy the relationship that the ratio of the linear fitting slopes of the Gaussian broadening parameters of the two materials changing with time is the same as the ratio of the thermal diffusivities of the two materials.

[0096]

[0097] In the formula, α1 is used to represent the thermal diffusivity of the material to be measured, α2 is used to represent the thermal diffusivity of the known material, k1 is used to represent the slope of the material to be measured (that is, the first slope), and k2 is used to represent the slope of the known material (that is, the second slope).

[0098] In a possible implementation, the electronic device can determine a first ratio, which is the ratio between the thermal diffusivity of the known material and the second slope. Then, the electronic device can determine the thermal diffusivity of the material to be measured based on the first ratio and the first slope.

[0099] It should be noted that, in the embodiments of the present application, the thermal diffusivity of the material in any direction is the same.

[0100] It can be understood that, in the process of heating the known material and the to-be-tested material, after the electronic device acquires the first infrared image and the second infrared image, the pixel value of the infrared image can be acquired, and then the temperature of the material is reflected. Then, the electronic device can fit the pixel value to obtain the first Gaussian curve and the second Gaussian curve, and determine the first slope determined based on the Gaussian broadening parameter of the first Gaussian curve and the second slope determined based on the Gaussian broadening parameter of the plurality of second Gaussian curves. Then, since the ratio of the slopes of the two materials is the same as the ratio of the thermal diffusivities of the two materials, the electronic device can acquire the thermal diffusivity of the known material, and determine the thermal diffusivity of the to-be-tested material based on the thermal diffusivity of the known material, the first slope, and the second slope. In this way, the process of acquiring the thermal diffusivity of the material can be simplified, and the difficulty of acquiring the thermal diffusivity of the material is reduced.

[0101] The above mainly introduces the scheme provided by the embodiments of the present application from the perspective of the method. It can be understood that, in order to implement the above functions, the thermal diffusivity acquisition device or the electronic device comprises a hardware structure and / or a software module corresponding to the execution of each function. Those skilled in the art should easily realize that, in combination with the thermal diffusivity acquisition method steps of each example described in the embodiments disclosed in the present application, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a certain function is implemented in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0102] The embodiments of the present application also provide a thermal diffusivity acquisition device. The thermal diffusivity acquisition device can be a computer device, a CPU in the computer device, a processing module for acquiring the thermal diffusivity in the computer device, or a client for acquiring the thermal diffusivity in the computer device.

[0103] The embodiments of the present application can divide the functions of acquiring the thermal diffusivity according to the above method examples into functional modules or functional units. For example, each functional module or functional unit can be divided according to each function, or two or more functions can be integrated into one processing module. The above integrated module can be implemented in the form of hardware or in the form of a software functional module or functional unit. In the embodiments of the present application, the division of the modules or units is illustrative, and is only a logical functional division. When actually implemented, another division mode can be used.

[0104] As Figure 5As shown in the figure, a structural schematic diagram of a thermal diffusivity acquisition device provided by an embodiment of the present application is shown. The thermal diffusivity acquisition device is used to execute Figure 2 The thermal diffusivity acquisition method shown. The thermal diffusivity acquisition device can include an acquisition unit 501 and a processing unit 502.

[0105] The acquisition unit 501 is configured to acquire a plurality of first infrared images at different times and a plurality of second infrared images at different times in a process of heating a known material and a material to be measured, the first infrared images being infrared images of the known material, and the second infrared images being infrared images of the material to be measured. The acquisition unit 501 is further configured to acquire, for each infrared image at a time, a first set of pixel values in the first infrared image and a second set of pixel values in the second infrared image, respectively, to acquire a plurality of first sets of pixel values and a plurality of second sets of pixel values, the set of pixel values being pixel values of pixel points located on the same straight line in the infrared image at a time. The processing unit 502 is configured to perform Gaussian fitting on each first set of pixel values to determine a plurality of first Gaussian curves, and perform Gaussian fitting on each second set of pixel values to determine a plurality of second Gaussian curves. The processing unit 502 is configured to determine a first slope based on the plurality of first Gaussian curves, the first slope being determined based on a Gaussian broadening parameter of the plurality of first Gaussian curves. The processing unit 502 is configured to determine a second slope based on the plurality of second Gaussian curves, the second slope being determined based on a Gaussian broadening parameter of the plurality of second Gaussian curves. The processing unit 502 is configured to acquire a thermal diffusivity of the known material, and determine a thermal diffusivity of the material to be measured based on the thermal diffusivity of the known material, the first slope, and the second slope.

[0106] In a possible design, the processing unit 502 is configured to determine, for each first Gaussian curve, a first Gaussian broadening parameter according to the first Gaussian curve, to acquire a plurality of first Gaussian broadening parameters. The processing unit 502 is configured to perform linear fitting on the plurality of first Gaussian broadening parameters and the plurality of times to determine the first slope.

[0107] In a possible design, the processing unit 502 is configured to determine, for each second Gaussian curve, a second Gaussian broadening parameter according to the second Gaussian curve, to acquire a plurality of second Gaussian broadening parameters. The processing unit 502 is configured to perform linear fitting on the plurality of second Gaussian broadening parameters and the plurality of times to determine the second slope.

[0108] In a possible design, the processing unit 502 is configured to determine a first ratio, the first ratio being a ratio between the thermal diffusivity of the known material and the second slope. The processing unit 502 is configured to determine the thermal diffusivity of the material to be measured based on the first ratio and the first slope.

[0109] Figure 6This is a schematic diagram of the hardware structure of a device for obtaining the thermal diffusivity according to an exemplary embodiment. The device for obtaining the thermal diffusivity may include a processor 602, which executes application code to implement the method for obtaining the thermal diffusivity in this application.

[0110] The processor 602 may be a central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits used to control the execution of the program of the present application.

[0111] like Figure 6 As shown, the device for obtaining the thermal diffusivity may further include a memory 603. The memory 603 stores the application code that executes the scheme of this application, and its execution is controlled by the processor 602.

[0112] Memory 603 may be a read-only memory (ROM) or other type of static storage device capable of storing static information and instructions, random access memory (RAM) or other type of dynamic storage device capable of storing information and instructions, or electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but not limited thereto. Memory 603 may exist independently and be connected to processor 602 via bus 604. Memory 603 may also be integrated with processor 602.

[0113] like Figure 6 As shown, the device for obtaining the thermal diffusivity may further include a communication interface 601, wherein the communication interface 601, processor 602, and memory 603 may be coupled to each other, for example, through a bus 604. The communication interface 601 is used for information exchange with other devices, for example, supporting information exchange between the thermal diffusivity acquisition device and other devices.

[0114] It should be pointed out that, Figure 6The device structure shown in the foregoing embodiments does not constitute a limitation on the acquisition device of the thermal diffusivity, except Figure 6 The acquisition device of the thermal diffusivity can include more or fewer components than those shown in the drawings, or combine certain components, or arrange different components, in addition to the components shown.

[0115] In actual implementation, the functions implemented by the processing unit 502 can be invoked by the processor 602 shown in the foregoing embodiments to implement the program codes in the memory 603. Figure 6

[0116] The present application also provides a computer readable storage medium, and the computer readable storage medium stores instructions, when the instructions in the computer readable storage medium are executed by a processor of a computer device, the computer can execute the acquisition method of the thermal diffusivity provided by the foregoing embodiments. For example, the computer readable storage medium can be the memory 603 including instructions, and the foregoing instructions can be executed by the processor 602 of the computer device to complete the above method. Alternatively, the computer readable storage medium can be a non-transitory computer readable storage medium, for example, the non-transitory computer readable storage medium can be a ROM, a RAM, a CD-ROM, a magnetic tape, a floppy disk, and an optical data storage device, etc.

[0117] Figure 7 The present application also provides a computer readable storage medium, and the computer readable storage medium stores instructions, when the instructions in the computer readable storage medium are executed by a processor of a computer device, the computer can execute the acquisition method of the thermal diffusivity provided by the foregoing embodiments. For example, the computer readable storage medium can be the memory 603 including instructions, and the foregoing instructions can be executed by the processor 602 of the computer device to complete the above method. Alternatively, the computer readable storage medium can be a non-transitory computer readable storage medium, for example, the non-transitory computer readable storage medium can be a ROM, a RAM, a CD-ROM, a magnetic tape, a floppy disk, and an optical data storage device, etc.

[0118] In one embodiment, the computer program product is provided using a signal bearing medium 700. The signal bearing medium 700 can include one or more program instructions that, when executed by one or more processors, can provide the functionality or some of the functionality described above with respect to Figure 2 the embodiments shown in the foregoing Figure 2 For example, with reference to the embodiments shown in the foregoing Figure 7 one or more features of S201-S207 can be assumed by one or more instructions associated with the signal bearing medium 700. Furthermore,

[0119] In some examples, the signal bearing medium 700 can include a computer readable medium 701 such as, but not limited to, a hard disk drive, a compact disc (CD), a digital video disc (DVD), a digital tape, memory, read-only memory (ROM), or random access memory (RAM), etc.

[0120] ​In some embodiments, the signal-bearing medium 700 can include a computer- readable medium 702, such as, but not limited to, memory, a read / write (R / W) CD, a R / W DVD, etc.

[0121] In some embodiments, the signal-bearing medium 700 can include a communication medium 703, such as, but not limited to, digital and / or analog communication medium (e.g., fiber optic cable, waveguide, wired communication links, wireless communication links, etc.).

[0122] The signal-bearing medium 700 can be conveyed by a wireless form of the communication medium 703. The one or more program instructions can be, for example, computer-executable or logic-implementing instructions.

[0123] In some examples, such as for Figure 5 The described thermal diffusivity acquisition apparatus can be configured to provide various operations, functions, or actions in response to the one or more program instructions of the computer-readable medium 701, the computer-recordable medium 702, and / or the communication medium 703.

[0124] From the above description of embodiments, it is apparent that a person skilled in the art can clearly appreciate that, for the convenience and brevity of description, only the above-described division of the functional modules is taken as an example, and in actual application, the above-described functions can be completed by different functional modules, that is, the internal structure of the apparatus is divided into different functional modules to complete the full classification or part of the functions described above.

[0125] In several embodiments provided in the present application, it should be understood that the disclosed apparatus and method can be implemented in other ways. For example, the apparatus embodiments described above are only illustrative, and for example, the division of the modules or units is only a logical function division, and in actual implementation, another division manner can be used, for example, a plurality of units or components can be combined or integrated into another apparatus, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the displayed or discussed units can be indirect coupling or communication connection through some interfaces, apparatuses or units, and can be electrical, mechanical or other forms.

[0126] The units described as separate components can or can not be physically separate, and the components displayed as units can be one physical unit or a plurality of physical units, that is, can be located in one place, or can be distributed to a plurality of different places. Part or all of the classification units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0127] In addition, each function unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software function unit.

[0128] When the integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application essentially or the part that contributes to the prior art or the whole classification or part of the technical solutions can be embodied in the form of a software product. The software product is stored in a storage medium, including a plurality of instructions to make a device (which can be a single-chip microcomputer, a chip, etc.) or a processor execute all or part of the steps of the method of each embodiment of the present application. The foregoing storage medium includes a U disk, a mobile hard disk, a ROM, a RAM, a magnetic disk or an optical disk, and various storage medium that can store program codes.

[0129] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any change or replacement within the technical scope disclosed in the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method of acquiring a thermal diffusivity, characterized by, The method comprises: During heating of a known material and a material to be measured, a plurality of time instants of first infrared images and a plurality of time instants of second infrared images are acquired, the first infrared images being infrared images of the known material, and the second infrared images being infrared images of the material to be measured; For each time-instant infrared image, a first pixel value set in the first infrared image and a second pixel value set in the second infrared image are respectively acquired to obtain a plurality of first pixel value sets and a plurality of second pixel value sets, and a pixel value set is pixel values of pixel points located on the same straight line in the infrared image at a time instant; Each first pixel value set is subjected to Gaussian fitting to determine a plurality of first Gaussian curves, and each second pixel value set is subjected to Gaussian fitting to determine a plurality of second Gaussian curves; A first slope is determined based on the plurality of first Gaussian curves, the first slope being determined based on Gaussian broadening parameters of the plurality of first Gaussian curves; A second slope is determined based on the plurality of second Gaussian curves, the second slope being determined based on Gaussian broadening parameters of the plurality of second Gaussian curves; A thermal diffusivity of the known material is acquired, and a thermal diffusivity of the material to be measured is determined based on the thermal diffusivity of the known material, the first slope and the second slope.

2. The method of claim 1, wherein, The first slope is determined based on the plurality of first Gaussian curves, comprising: For each first Gaussian curve, a first Gaussian broadening parameter is determined according to the first Gaussian curve to obtain a plurality of first Gaussian broadening parameters; The first slope is determined by linear fitting of the plurality of first Gaussian broadening parameters and the plurality of time instants.

3. The method of claim 1, wherein, The second slope is determined based on the plurality of second Gaussian curves, comprising: For each second Gaussian curve, a second Gaussian broadening parameter is determined according to the second Gaussian curve to obtain a plurality of second Gaussian broadening parameters; The second slope is determined by linear fitting of the plurality of second Gaussian broadening parameters and the plurality of time instants.

4. The method according to any one of claims 1 to 3, characterized in that, The thermal diffusivity of the material to be measured is determined based on the thermal diffusivity of the known material, the first slope and the second slope, comprising: A first ratio is determined, the first ratio being a ratio between the thermal diffusivity of the known material and the second slope; The thermal diffusivity of the material to be measured is determined based on the first ratio and the first slope.

5. A device for obtaining the thermal diffusivity, characterized in that, The apparatus comprises: An acquisition unit is configured to acquire, during heating of a known material and a material to be measured, a plurality of time instants of first infrared images and a plurality of time instants of second infrared images, the first infrared images being infrared images of the known material, and the second infrared images being infrared images of the material to be measured; The acquisition unit is further configured to, for each time-instant infrared image, acquire a first pixel value set in the first infrared image and a second pixel value set in the second infrared image to obtain a plurality of first pixel value sets and a plurality of second pixel value sets, and a pixel value set is pixel values of pixel points located on the same straight line in the infrared image at a time instant; The processing unit is configured to perform Gaussian fitting on each of the first pixel value set to determine a plurality of first Gaussian curves, and perform Gaussian fitting on each of the second pixel value set to determine a plurality of second Gaussian curves. The processing unit is configured to determine a first slope based on the plurality of first Gaussian curves, the first slope being determined based on a Gaussian broadening parameter of the plurality of first Gaussian curves. The processing unit is configured to determine a second slope based on the plurality of second Gaussian curves, the second slope being determined based on a Gaussian broadening parameter of the plurality of second Gaussian curves. The processing unit is configured to obtain a thermal diffusivity of the known material, and determine a thermal diffusivity of the material to be measured based on the thermal diffusivity of the known material, the first slope, and the second slope.

6. The apparatus of claim 5, wherein The processing unit is configured to determine, for each of the first Gaussian curves, a first Gaussian broadening parameter based on the first Gaussian curve to obtain a plurality of first Gaussian broadening parameters. The processing unit is configured to perform linear fitting on the plurality of first Gaussian broadening parameters and the plurality of time instants to determine the first slope.

7. The apparatus of claim 5, wherein The processing unit is configured to determine, for each of the second Gaussian curves, a second Gaussian broadening parameter based on the second Gaussian curve to obtain a plurality of second Gaussian broadening parameters. The processing unit is configured to perform linear fitting on the plurality of second Gaussian broadening parameters and the plurality of time instants to determine the second slope.

8. The apparatus of any one of claims 5-7, wherein The processing unit is configured to determine a first ratio, the first ratio being a ratio between the thermal diffusivity of the known material and the second slope. The processing unit is configured to determine the thermal diffusivity of the material to be measured based on the first ratio and the first slope.

9. A device for obtaining the thermal diffusivity, characterized in that, comprising: a processor and a memory; the processor and the memory are coupled; the memory is configured to store one or more programs comprising computer-executable instructions, when the thermal diffusivity obtaining apparatus is running, the processor executes the computer-executable instructions stored in the memory to enable the thermal diffusivity obtaining apparatus to perform the method of any one of claims 1-4.

10. A computer-readable storage medium having stored therein instructions, the computer-readable storage medium comprising: when the computer executes the instructions, the computer performs the method of any one of claims 1-4.

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