Flipping mechanism

Abstract

This application relates to the field of semiconductor testing technology and provides a flipping mechanism. This flipping mechanism uses a flipping power source to drive a first connecting arm to move along a second direction. The first connecting arm exerts a force on the object being flipped, causing it to move along the second direction. At this time, due to the relative base assembly of the first and second swing arms, one end of each swing arm has a fixed point, and both the first and second swing arms are connected to the object being flipped. Therefore, the object being flipped bears the thrust of the first connecting arm and the tension of the swing arms, causing the rear end of the object to tilt upwards to allow for rotation. This improves flipping accuracy and protection of the semiconductor devices in the carrier tray, avoids the difficulties in designing the motion trajectory inherent in linkage mechanisms, facilitates limiting the flipping angle of the object being flipped, and makes operation more convenient.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to a flipping mechanism. Background Technology

[0002] In the semiconductor inspection and sorting process, semiconductor devices are characterized by their small size, large quantity, and heavy weight. Therefore, they need to be placed on a carrier tray before and after inspection and sorting. The semiconductor devices are then transported to various workstations on the machine for inspection and transfer by the translational transport of the carrier tray.

[0003] For most workstations, the inspection and transfer of semiconductor devices can be completed simply by vertical operation. The carrier tray is moved horizontally to the bottom of the workstation, where the mechanism moves down to grip or inspect the device. However, for some workstations, horizontal transport alone cannot meet the transport requirements before inspection. Typically, the carrier tray needs to be rotated 90°, from a horizontal to a vertical position, before being placed into the testing station for horizontal testing.

[0004] Existing vehicle disc tilting mechanisms typically mount the drive unit vertically on the side, primarily using servo motors or linkage mechanisms for actuation. However, servo motors suffer from vibrations, which can affect tilting accuracy and damage semiconductor devices within the vehicle disc. Linkage mechanisms, on the other hand, involve multiple links, making it difficult to design the motion trajectories for each link. Furthermore, changes in the angle of any link can affect the motion characteristics of the entire linkage mechanism, hindering adjustments to the tilting angle. Summary of the Invention

[0005] Therefore, it is necessary to provide a flipping mechanism that can effectively control the flipping angle and flip smoothly.

[0006] A flipping mechanism includes a base assembly, a flipped body, a swing arm, and a drive assembly: the base assembly has a flipping space, the flipped body is located in the flipping space for accommodating a carrier disk, the flipped body has a first position and a second position at an angle relative to the first position; the swing arm connects the flipped body and the base assembly, and both ends of the flipped body along a first direction are rotatably connected to the base assembly via the swing arm; one end of each swing arm is hinged to the flipped body, and the other end is hinged to the base assembly, the hinge position of each swing arm with the flipped body is a first passive hinge point, and the hinge position with the base assembly is a second passive hinge point; the drive assembly includes a flipping power source located on one side of the flipped body along the first direction, so as to... A first connecting arm is connected between the flipping power source and the flipped body. The first connecting arm is hinged to the flipped body, and the hinge position of the first connecting arm and the flipped body is an active hinge point. The flipping power source drives the first connecting arm to move relative to the base assembly along a second direction, and the first connecting arm drives the flipped body to rotate around a first axis to switch between the first position and the second position. The first axis is the line connecting each of the second passive hinge points, and the second direction is arranged at an angle to the first direction. The distance between the active hinge point and the base assembly is 'a', and the distance between each of the second passive hinge points and the base assembly is 'b', where 'a' is not equal to 'b', and the active hinge point does not coincide with each of the first passive hinge points.

[0007] It is understood that the flipping mechanism provided in this application drives the first connecting arm to move along the second direction via a flipping power source. The first connecting arm exerts a force on the flipped object to move along the second direction. At this time, due to the relative base assembly of the first and second swing arms, one end of the first and second swing arms each has a fixed point, and both the first and second swing arms are connected to the flipped object. Therefore, the flipped object will bear the thrust of the first connecting arm and the tension of the swing arm, thereby causing the rear end of the flipped object to tilt up to satisfy the rotation of the flipped object. During the entire flipping process, there is no need to use a servo motor, thus avoiding the inherent vibration of the servo motor during operation, thereby improving the flipping accuracy and the protection of the semiconductor devices in the carrier disk. At the same time, when converting horizontal motion to rotational motion, the difficulty in designing the motion trajectory that exists when using a linkage mechanism is avoided. Furthermore, by limiting the travel of the first connecting arm along the second direction, the flipping angle of the flipped object can be limited, making operation more convenient.

[0008] In some embodiments, the first position is defined as the state in which the flipped object is located parallel to the base assembly; in the first position, the distance between each of the second passive hinge points and the base assembly is greater than the distance between the active hinge point and the base assembly, and greater than the distance between each of the first passive hinge points and the base assembly; and / or, in the first position, the distance between the active hinge point and the base assembly is equal to the distance between each of the first passive hinge points and the base assembly.

[0009] In other words, by limiting the relationship between each hinge point, the accuracy and stability of the flipping can be improved, and situations such as incomplete flipping can be avoided as much as possible.

[0010] In some embodiments, the flipping mechanism further includes a guide component and a flipping detection component mounted on the base assembly; the guide components are respectively provided on both sides of the flipped body along the first direction, and the flipping detection component is provided on at least one side of the flipped body; the first connecting arm is connected to the guide component on the same side, and the other guide component is connected to the flipped body through a second connecting arm, the second connecting arm being hinged to the flipped body; the first connecting arm and / or the second connecting arm are connected to a first baffle, the first baffle being movable along the second direction to trigger the flipping detection component, the flipping detection component being used to detect that the flipped body is in the first position or the second position.

[0011] In other words, the guide assembly improves movement stability; simultaneously, the cooperation of the first and second connecting arms enhances force distribution, making it easier to rotate the object being rotated. Furthermore, since the rotation detection assembly is installed on the side opposite to the rotation power source, it ensures that rotation and detection are performed synchronously while reducing assembly interference.

[0012] In some embodiments, the first position is defined as the state in which the flipped object is parallel to the base assembly, and the second position is defined as the state in which the flipped object is perpendicular to the base assembly. The flip detection assembly includes a first sensor and a second sensor, which are arranged at intervals along the second direction. The first baffle can selectively trigger the first sensor and the second sensor to switch the flipped object between the first position and the second position. In the first position, the trigger position of the first sensor is set directly opposite the active hinge point along the third direction.

[0013] It is understandable that by setting up the first and second sensors, the movement accuracy of the object being flipped can be improved, thereby improving the flipping accuracy.

[0014] In some embodiments, each set of guide components includes a guide rail and a guide slider slidably connected to the guide rail. The guide rail is mounted on the base assembly, and the guide slider is connected to the first connecting arm or the second connecting arm on the same side. The guide component also includes a buffer seat mounted on the guide rail, and the buffer seats are provided on both sides along the length direction of the guide rail.

[0015] In other words, the cooperation of the guide rail and the guide slider satisfies the movement guidance of the first and second connecting arms. At the same time, the buffer seat not only satisfies the limit of the sliding stroke, but also reduces vibration during the limiting process.

[0016] In some embodiments, the first position is defined as the state in which the flipped body is parallel to the base assembly; the flipping mechanism further includes a lifting assembly and a lifting detection assembly; both the lifting assembly and the lifting detection assembly are mounted on the flipped body, the lifting assembly is used to constrain or drive the carrier disk to move along a second direction within the flipped body, and the lifting assembly is capable of moving along the second direction; the lifting assembly is connected to a second baffle, the second baffle is capable of moving synchronously with the lifting assembly to trigger the lifting detection assembly, and the lifting detection assembly is used to limit the movement position of the carrier disk along the second direction.

[0017] Understandably, the lifting assembly is used to position the vehicle disc relative to the object being flipped, and to limit the vehicle disc's movement to ensure it does not detach from the object being flipped during rotation. Simultaneously, the lifting detection assembly can detect whether the vehicle disc has been moved into position.

[0018] In some embodiments, the lifting detection assembly includes a third sensor and a fourth sensor, which are arranged at a distance along the second direction. At the first position, the second baffle can move synchronously with the lifting assembly to selectively trigger either the third sensor or the fourth sensor. The arrangement of the third and fourth sensors satisfies the movement limit of the lifting assembly.

[0019] In some embodiments, the lifting assembly includes a lifting base, a lifting power source, and a lifting plate; the lifting base is mounted on the overturned body, the lifting power source is mounted on the lifting base, the lifting plate is connected to the lifting power source, the lifting power source is used to drive the lifting plate to move away from or towards the carrier plate, and the lifting plate is provided with at least two top contact columns arranged at intervals along the first direction; the second baffle is mounted on the lifting base.

[0020] In other words, the lifting plate is lifted by a lifting power source, causing the top contact column to connect with the carrier plate, thus limiting the movement of the carrier plate. At the same time, the two top contact columns effectively form a two-point positioning system with the carrier plate, improving the reliability of the connection.

[0021] In some embodiments, the lifting plate is connected to a third baffle, and the lifting base is connected to a fifth sensor. The third baffle can move along a third direction with the lifting plate to trigger the fifth sensor. The fifth sensor is used to limit the lifting height of the lifting plate in order to improve lifting stability and reduce the interference of lifting on movement.

[0022] In some embodiments, the flipping mechanism further includes a transfer assembly mounted on the flipped body. The transfer assembly is used to drive the lifting assembly to move to feed the carrier disk into or out of the flipped body. The flipped body has opposing guide grooves on both sides along the first direction. This improves the stability of the carrier disk's movement relative to the flipped body. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of a flipping mechanism provided in an embodiment of this application;

[0025] Figure 2 This is a schematic diagram illustrating the cooperation between a tilting mechanism and a carrier disk according to an embodiment of this application.

[0026] Figure 3 This is a first partial schematic diagram of a flipping mechanism provided in an embodiment of this application;

[0027] Figure 4 A side view of a flipping mechanism provided in an embodiment of this application;

[0028] Figure 5 This is a second schematic diagram of a flipping mechanism provided in an embodiment of this application;

[0029] Figure 6 A schematic diagram of a base assembly provided in an embodiment of this application;

[0030] Figure 7 This is a schematic diagram of the flipped object provided in an embodiment of this application.

[0031] Reference numerals: 10. Base assembly; 11. Active panel; 12. Driven panel; 13. Connecting plate; 14. Support column; 20. Object to be flipped; 21. Support base plate; 22. Support side plate; 30. Drive assembly; 31. Flipping power source; 32. First connecting arm; 33. Second connecting arm; 40. Swing arm; 41. First swing arm; 42. Second swing arm; 43. First baffle; 50. Guide assembly; 51. Guide rail; 52. Guide slider; 53. Buffer seat; 60. Flipping detection assembly; 61. First sensor; 62. Second sensor; 70. Top Lifting assembly; 71. Lifting base; 72. Lifting power source; 73. Lifting plate; 74. Second baffle; 75. Moving guide rail; 80. Lifting detection assembly; 81. Third sensor; 82. Fourth sensor; 90. Transfer assembly; 100. Tilting mechanism; 200. Carrier plate; 101. Tilting space; 201. Receiving cavity; 202. Guide slide; 321. First pin; 411. Second pin; 412. Third pin; 531. Buffer; 711. Fifth sensor; 731. Top contact column; 732. Third baffle; 7101. Assembly slot. Detailed Implementation

[0032] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0033] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0035] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0037] like Figure 1 , Figure 2 , Figure 3 and Figure 6 As shown, this application provides a flipping mechanism 100, including a base assembly 10, a flipped body 20, a swing arm 40, and a drive assembly 30. The base assembly 10 has a flipping space 101, and the flipped body 20 is located in the flipping space 101, having a first position and a second position at an angle relative to the first position. The flipped body 20 can flip within the flipping space 101 under the action of the drive assembly 30 to switch between the first and second positions. The flipped body 20 is used to accommodate a carrier tray 200 to achieve the flipping of the carrier tray 200, satisfying the testing of semiconductor devices. The first position is defined as the state where the flipped body 20 is parallel to the base assembly 10, and the second position is defined as the state where the flipped body 20 is perpendicular to the base assembly 10.

[0038] A swing arm 40 is connected between the flipped object 20 and the base assembly 10 to prevent the flipped object 20 from detaching from the base assembly 10. Both ends of the flipped object 20 along the first direction are rotatably connected to the base assembly 10 via the swing arm 40 to improve connection reliability. One end of each swing arm 40 is hinged to the flipped object 20, and the other end is hinged to the base assembly 10.

[0039] The drive assembly 30 includes a flipping power source 31 located on one side of the flipped body 20 along a first direction, and a first connecting arm 32 connected between the flipping power source 31 and the flipped body 20, the first connecting arm 32 being hinged to the flipped body 20. The flipping power source 31 drives the first connecting arm 32 to move relative to the base assembly 10 along a second direction, and the first connecting arm 32 causes the flipped body 20 to rotate around a first axis.

[0040] Combination Figures 1-4 As shown, the hinge position between each swing arm 40 and the flipped body 20 is the first passive hinge point A, the hinge position between each swing arm 40 and the base assembly 10 is the second passive hinge point B, and the hinge position between the first connecting arm 32 and the flipped body 20 is the active hinge point C. Then the first axis is the line connecting each of the second passive hinge points B.

[0041] At this time, the distance between the active hinge point C and the base assembly 10 is a, and the distance between each of the second passive hinge points B and the base assembly 10 is b. a is not equal to b, and the active hinge point C does not coincide with each of the first passive hinge points A.

[0042] Among them, the X-axis direction is the first direction, the Y-axis direction is the second direction, and the Z-axis direction is the third direction; at the same time, the two swing arms 40 are respectively the first swing arm 41 and the second swing arm 42. The first swing arm 41 is connected to the side with the flipping power source 31, and the second swing arm 42 is connected to the other side of the flipped body 20 along the first direction.

[0043] In this embodiment, the flipping power source 31 drives the first connecting arm 32 to move along the second direction, and the first connecting arm 32 exerts a force on the flipped body 20 to move along the second direction. At this time, due to the arrangement of the first swing arm 41 and the second swing arm 42 relative to the base assembly 10, one end of the first swing arm 41 and one end of the second swing arm 42 both have a fixed point, and both the first swing arm 41 and the second swing arm 42 are connected to the flipped body 20. Therefore, the flipped body 20 will bear the pushing force of the first connecting arm 32 and the pulling force of the swing arm 40, thereby causing the rear end of the flipped body 20 to tilt up to satisfy the rotation of the flipped body 20.

[0044] In this process, the absence of a servo motor eliminates the need for vibration inherent in servo motor operation, thereby improving flipping accuracy and protecting the semiconductor devices in the carrier disk 200. Simultaneously, the cooperation of the two swing arms 40 and the first connecting arm 32 effectively creates two revolute joints on the object being flipped 20, converting horizontal motion into rotational motion and avoiding the difficulties in designing motion trajectories that arise with linkage mechanisms. Furthermore, by limiting the travel of the first connecting arm 32 along the second direction, the flipping angle of the object being flipped 20 can be restricted, making operation more convenient.

[0045] In one specific embodiment, the tilting power source 31 is a rodless cylinder. The stroke of the rodless cylinder is easy to adjust, and combined with the length of the swing arm 40 itself, it can meet the conversion between horizontal and rotational motion, and facilitate the adjustment of the tilting angle. Compared with a linkage mechanism, this setting does not require consideration of the coordination of multiple linkages, improves the design difficulty, and facilitates the adjustment of the tilting angle.

[0046] It should be added that, based on the initial state of the first connecting arm 32, the side of the flipped body 20 closest to the first connecting arm 32 is the front end, and the other side is the rear end. When the first connecting arm 32 is in the initial state, the flipped body 20 is in the first position.

[0047] It should also be noted that the aforementioned limitations regarding the relationship between the active hinge point C, the first passive hinge point A, and the second passive hinge point B are based on the first position. It is precisely because of the relationship between the various hinge points in the first position that the normal flipping of the object 20 can be satisfied, as well as the formation of the second position, and the flipping accuracy and stability can be guaranteed.

[0048] like Figure 1 , Figure 3 and Figure 4 As shown, exemplarily, in the first position, the distance b between each of the second passive hinge points B and the base assembly 10 is greater than the distance a between the active hinge point C and the base assembly 10, and greater than the distance between each of the first passive hinge points A and the base assembly 10; the distance a between the active hinge point C and the base assembly 10 is equal to the distance between each of the first passive hinge points A and the base assembly 10. At this time, the flipping power source 31 and the first connecting arm 32 are both located below the second passive hinge point B, therefore the first passive hinge point A is also located below the second passive hinge point B and is in the same horizontal plane as the active hinge point C, so as to improve the flipping accuracy and stability and avoid situations such as incomplete flipping.

[0049] Please continue to refer to Figure 4 As shown, further, there is a first connecting line between the active hinge point C and the first passive hinge point A, and a first perpendicular line between the second passive hinge point B and the first connecting line; in the first position, the distance c between the active hinge point C and the first perpendicular line is less than the distance d between the first passive hinge point A and the first perpendicular line.

[0050] In other words, the first connecting arm 32 is hinged to the flipped body 20 via the first pin 321, one end of the first swing arm 41 is hinged to the flipped body 20 via the second pin 411, and the other end of the first swing arm 41 is hinged to the base assembly 10 via the third pin 412. At this time, the active hinge point C is located on the axis of the first pin 321, the first passive hinge point A is located on the axis of the second pin 411, and the second passive hinge point B is located on the axis of the third pin 412. Furthermore, along the first direction, the active hinge point C, the first passive hinge point A, and the second passive hinge point B together form a triangle. Thus, a 90-degree rotation of the flipped body 20 can be achieved.

[0051] Taking the first swing arm 41 as an example, since the first connecting arm 32 needs to translate along the second direction, the first swing arm 41 rotates around the second passive hinge point B. According to the torque M = F × L, with the same force F, the larger L is, the larger the torque M is, which is more conducive to rotation. At the same time, since both the first swing arm 41 and the first connecting arm 32 have a connecting function relative to the flipped body 20, they provide support for the flipped body 20. Therefore, considering uniform force distribution and stable support, the distance between the active hinge point C and the first passive hinge point A is related to the length of the flipped body 20 along the second direction, and the active hinge point C needs to be closer to the first vertical line than the first passive hinge point A.

[0052] Please continue to refer to Figure 1 and Figure 4 As shown, in an optional embodiment, in the first position, the distance between the active hinge point C and the first passive hinge point A accounts for 45%-60% of the length of the flipped body 20 along the second direction. Simultaneously, in the first position, the active hinge point C, the first passive hinge point A, and the second passive hinge point B together form a right-angled triangle; and the distance between the active hinge point C and the front end of the flipped body 20 is approximately equal to the distance between the first passive hinge point A and the rear end of the flipped body 20. This ensures that the flipped body 20 experiences uniform force and its rotation is more stable. In a specific embodiment, in the first position, the distance between the active hinge point C and the first passive hinge point A accounts for 45%, 50%, 55%, or 60% of the length of the flipped body 20 along the second direction.

[0053] Please combine Figures 1-3As shown, in an optional embodiment, the flipping mechanism 100 further includes a guide component 50 and a flipping detection component 60 mounted on the base assembly 10; along the first direction, guide components 50 are respectively provided on both sides of the flipped body 20, and a flipping detection component 60 is provided on the side of the flipped body 20 connected to the second swing arm 42; a first connecting arm 32 is connected to the guide component 50 on the same side, and another guide component 50 is connected to the flipped body 20 through a second connecting arm 33, and the second connecting arm 33 is hinged to the flipped body 20; the second connecting arm 33 is connected to a first baffle 43, and the first baffle 43 can move along the second direction to trigger the flipping detection component 60, which is used to detect whether the flipped body 20 is in a first position or a second position.

[0054] In other words, the guide component 50 improves movement stability; simultaneously, the cooperation of the first connecting arm 32 and the second connecting arm 33 enhances the force distribution, making it easier to rotate the object to be rotated 20. During the rotation process, the rotation detection component 60 limits the travel of the first connecting arm 32 and the second connecting arm 33, ensuring that the object to be rotated 20 rotates exactly 90 degrees. Furthermore, since the rotation detection component 60 is installed on the side opposite to the rotation power source 31, it ensures that rotation and detection are synchronized while reducing assembly interference. At the same time, the rotation detection component 60 limits the rotation angle of the object to be rotated 20, allowing it to stably stop at the first or second position, thus improving rotation stability.

[0055] like Figure 3 As shown, exemplarily, the flip detection component 60 includes a first sensor 61 and a second sensor 62, which are arranged at a distance along a second direction. A first baffle 43 can selectively trigger either the first sensor 61 or the second sensor 62 to switch the flipped object 20 between a first position and a second position. In practical use, the first sensor 61 can be located at the front end of the flipped object 20, while the second sensor 62 is installed at the rear end. When the first baffle 43 triggers the first sensor 61, it indicates that the flipped object 20 is in the first position; when the first baffle 43 triggers the second sensor 62, it indicates that the flipped object 20 is in the second position. Moreover, the arrangement of the first sensor 61 and the second sensor 62 improves the movement accuracy of the flipped object 20, thereby improving the flipping accuracy.

[0056] Furthermore, the arrangement of the first sensor 61 and the second sensor 62 involves limiting the travel distance of the first connecting arm 32 and the second connecting arm 33 along the second direction; therefore, the distance between the first sensor 61 and the second sensor 62 is related to the positional relationship between the aforementioned hinge points when they are in the first position. Specifically, the installation position of the first sensor 61 is determined first, using the active hinge point C as a reference. Then, the position of the second sensor 62 is determined by combining the positions of the first passive hinge point A and the second passive hinge point B, as well as the lengths of the first swing arm 41 and the second swing arm 42.

[0057] Specifically, the distance between the first sensor 61 and the second sensor 62 is smaller than the distance between the active hinge point C and the first passive hinge point A; and, in the first position, the trigger position of the first sensor 61 is set directly opposite the active hinge point C along a third direction, while the trigger position of the second sensor 62 is offset relative to the first passive hinge point A along a second direction and is located on the side of the first passive hinge point A closer to the active hinge point C. This improves the flipping stability and accuracy of the flipped object 20.

[0058] Please continue to refer to Figure 3 In some embodiments, each guide assembly 50 includes a guide rail 51 and a guide slider 52 slidably connected to the guide rail 51. The guide rail 51 is mounted on the base assembly 10, and the guide slider 52 is connected to the first connecting arm 32 or the second connecting arm 33 on the same side. The guide assembly 50 also includes a buffer seat 53 mounted on the guide rail 51, and buffer seats 53 are provided on both sides along the length direction of the guide rail 51. That is, the cooperation between the guide rail 51 and the guide slider 52 satisfies the movement guidance of the first connecting arm 32 and the second connecting arm 33. At the same time, the buffer seat 53 limits the sliding stroke of the guide slider 52 on the one hand, and buffers the vibration generated during the limiting on the other hand. In this way, the flipping stability and flipping accuracy can be improved, which can play a protective role for semiconductor devices, reduce the vibration and displacement of semiconductor devices during the flipping process, and thus improve the detection accuracy.

[0059] The buffer seat 53 includes a seat body and a buffer 531. The buffer 531 is inserted into the seat body to buffer and limit the guide slider 52. Of course, the buffer 531 can also directly abut against the first connecting arm 32 or the second connecting arm 33 to achieve the limiting.

[0060] Please combine Figure 1 , Figure 2 and Figure 5As shown, in some embodiments, the flipping mechanism 100 further includes a lifting assembly 70 and a lifting detection assembly 80; both the lifting assembly 70 and the lifting detection assembly 80 are mounted on the flipped body 20. The lifting assembly 70 is used to constrain or drive the carrier disk 200 to move in a second direction within the flipped body 20, and the lifting assembly 70 is capable of moving in the second direction. The lifting assembly 70 is connected to a second baffle 74, which can move synchronously with the lifting assembly 70 at any time to trigger the lifting detection assembly 80. The lifting detection assembly 80 is used to limit the movement position of the carrier disk 200 in the second direction.

[0061] In actual use, the vehicle disk 200 moves into the object to be flipped 20 via the translation component. At this point, the vehicle disk 200 is not fully in position relative to the object to be flipped 20. Therefore, the lifting component 70 needs to move to a position that mates with the vehicle disk 200 and connect with it. Then, it drives the vehicle disk 200 to move in the second direction to ensure that the vehicle disk 200 is in position relative to the object to be flipped 20. Moreover, the connection between the lifting component 70 and the vehicle disk 200 effectively limits the movement of the vehicle disk 200, ensuring that it will not detach from the object to be flipped 20 during rotation. Simultaneously, the lifting detection component 80 can detect whether the vehicle disk 200 has been moved into position and then determine whether the flipping operation needs to be initiated. If the vehicle disk 200 has not been moved into position, the flipping operation will not be activated.

[0062] like Figure 5 As shown, exemplarily, the lifting detection assembly 80 includes a third sensor 81 and a fourth sensor 82, which are arranged at a distance along a second direction. In the first position, the second baffle 74 can move synchronously with the lifting assembly 70 to selectively trigger the third sensor 81 and the fourth sensor 82; the distance between the third sensor 81 and the fourth sensor 82 is smaller than the distance between the first sensor 61 and the second sensor 62.

[0063] Specifically, when the carrier plate 200 is fed in from the front end of the object to be flipped 20, the lifting assembly 70 is positioned near the rear end of the object to be flipped 20. At this time, the third sensor 81 is located near the front end, and the fourth sensor 82 is located at the rear end. When the lifting assembly 70 is positioned where the second baffle 74 triggers the third sensor 81, it indicates that the lifting assembly 70 has moved to the position where it connects with the carrier plate 200, so as to drive the carrier plate 200 to move into place relative to the object to be flipped 20. When the lifting assembly 70 moves to the position where the second baffle 74 triggers the fourth sensor 82, it indicates that the lifting assembly 70 has carried the carrier plate 200 into place, and subsequent flipping operations can be performed. At this time, the first baffle 43 is always positioned where the first sensor 61 is triggered. Then, entering the flipping state, when the first baffle 43 moves with the second connecting arm 33 to the position that triggers the second sensor 62, the carrier disk 200 flips to a vertical state; and during this process, the lifting assembly 70 is positioned at the position where the second baffle 74 triggers the fourth sensor 82, and is connected to the carrier disk 200. When the carrier disk 200 is flipped in the opposite direction by the flipped body 20, the first baffle 43 can move from the second sensor 62 to the position that triggers the first sensor 61, and the carrier disk 200 is in a horizontal state. At this time, the second baffle 74 is still located at the position that triggers the fourth sensor 82. Then the lifting assembly 70 moves toward the position where the second baffle 74 triggers the third sensor 81, so as to send the carrier disk 200 in and facilitate connection with the next carrier disk.

[0064] Understandably, when the first baffle 43 is in the position that triggers the first sensor 61, and the second baffle 74 is in the position that triggers the third sensor 81, it represents the starting position for the carrier disk 200 to move in and out relative to the flipped body 20; when the second baffle 74 is in the position that triggers the fourth sensor 82, it represents that the carrier disk 200 is in the correct position relative to the flipped body 20, at which point the carrier disk 200 can be flipped, or the carrier disk 200 can be flipped and then moved out to the starting position. Furthermore, after the carrier disk 200 is sent out from the flipped body 20, and the flipped body 20 is flipped from the second vertical position back to the first horizontal position, the second baffle 74 of the lifting assembly 70 triggers the third sensor 81 again, so that the lifting assembly 70 can quickly receive subsequent carrier disks 200, improving the equipment's throughput efficiency.

[0065] Furthermore, the dimension of the flipped body 20 along the second direction must be greater than the travel distance of the first connecting arm 32 along the second direction, and the lifting assembly 70 initiates its connection with the carrier disk 200 from a position near the center of the flipped body 20. Therefore, the distance between the third sensor 81 and the fourth sensor 82 needs to be smaller than the distance between the first sensor 61 and the second sensor 62, and there must be an overlap area in the distances.

[0066] like Figure 5As shown, in some embodiments, the lifting assembly 70 includes a lifting base 71, a lifting power source 72, and a lifting plate 73. The lifting base 71 is mounted on the body to be flipped 20, the lifting power source 72 is mounted on the lifting base 71, and the lifting plate 73 is connected to the lifting power source 72. The lifting plate 73 has at least two top contact columns 731 arranged at intervals along a first direction. A second baffle 74 is mounted on the lifting base 71. Specifically, the lifting base 71 is constructed with an assembly groove 7101 to accommodate the lifting power source 72. A guide shaft is connected between the lifting plate 73 and the lifting base 71 to guide the movement of the lifting plate 73 and improve movement stability. At the same time, the arrangement of the two top contact columns 731 is equivalent to forming a two-point positioning with the carrier plate 200, improving connection reliability. Of course, the number of top contact columns 731 can also be three, four, or more, but not too many. The lifting power source 72 can be a cylinder.

[0067] Furthermore, a third baffle 732 is connected to the lifting plate 73, and a fifth sensor 711 is connected to the lifting base 71. The lifting height of the lifting plate 73 is limited by the cooperation of the third baffle 732 and the fifth sensor 711, so as to improve the lifting stability and reduce the interference of the lifting on the movement.

[0068] Furthermore, two movable guide rails 75 are provided on the flipped body 20, which are arranged opposite to each other and spaced apart along the first direction. The lifting base 71 is connected to the movable guide rails 75 via a slider. At the same time, the flipping mechanism 100 also includes a transfer assembly 90, which is installed on the flipped body 20 and is used to send the carrier disk 200 into or out of the flipped body 20.

[0069] In this embodiment, the transfer component 90 is connected to the lifting base 71 to drive the carrier disk 200 by moving the lifting base 71 in the second direction. The transfer component 90 can be a rodless cylinder. Alternatively, a buffer seat 53 can be provided to buffer and limit the movement of the lifting base 71.

[0070] The following is a detailed description of the specific structure of the base assembly 10 and the flipped body 20.

[0071] like Figure 1 , Figure 2 and Figure 6As shown, in some embodiments, the side with the flipping power source 31 is designated as the active side, and the other side as the passive side. In this case, the base assembly 10 includes an active panel 11, a driven panel 12, and a connecting plate 13. The active panel 11 and the driven panel 12 are spaced apart along a first direction, and the connecting plate 13 connects the active panel 11 and the driven panel 12 for integrated assembly. Two connecting plates 13 can be provided and spaced apart along a second direction to improve connection reliability. Both connecting plates 13 are installed at the bottom of the active panel 11 and the driven panel 12 for elevation support, preventing interference with other structures. Simultaneously, the dimension of the active panel 11 along the first direction is larger than that of the driven panel 12 along the first direction. The flipping power source 31 is installed on the active panel 11, and the flipping detection assembly 60 is installed on the driven panel 12. This avoids the suspended arrangement of the flipping power source 31, improving installation stability. Furthermore, support columns 14 are installed on both the active panel 11 and the driven panel 12 to facilitate the installation of the swing arm 40.

[0072] like Figure 1 , Figure 2 and Figure 7 As shown, the flipped body 20 further includes a supporting base plate 21 and supporting side plates 22 connected to both sides of the supporting base plate 21 along a first direction. The two supporting side plates 22 and the supporting base plate 21 together define a receiving cavity 201. The lifting assembly 70, the lifting detection assembly 80, and the transfer assembly 90 are all installed in the receiving cavity 201. At the same time, guide grooves 202 are provided on the side of each of the two supporting side plates 22 facing the receiving cavity 201, which not only support the carrier plate 200 but also guide the translation of the carrier plate 200. Wear-resistant pads can be provided on the groove walls of the guide grooves 202 to reduce wear on the carrier plate 200 during movement.

[0073] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0074] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A flipping mechanism, characterized in that, The flipping mechanism (100) includes: The base assembly (10) is provided with a flip space (101); The flipped body (20), located on the flipping space (101), is used to accommodate the vehicle disk (200), the flipped body (20) having a first position and a second position set at an angle relative to the first position; A swing arm (40) is connected between the flipped body (20) and the base assembly (10), and both ends of the flipped body (20) along the first direction are rotatably connected to the base assembly (10) through the swing arm (40); one end of each swing arm (40) is hinged to the flipped body (20), and the other end is hinged to the base assembly (10). The hinge position of each swing arm (40) with the flipped body (20) is the first passive hinge point, and the hinge position with the base assembly (10) is the second passive hinge point. The drive assembly (30) includes a flipping power source (31) located on one side of the flipped body (20) along a first direction, and a first connecting arm (32) connected between the flipping power source (31) and the flipped body (20). The first connecting arm (32) is hinged to the flipped body (20), and the hinge position of the first connecting arm (32) and the flipped body (20) is an active hinge point. The flipping power source (31) drives the first connecting arm (32) to move relative to the base assembly (10) along the second direction. The first connecting arm (32) drives the flipped body (20) to rotate around the first axis to switch between the first position and the second position. The first axis is the line connecting each of the second passive hinge points, and the second direction is arranged at an angle to the first direction. The distance between the active hinge point and the base assembly (10) is a, and the distance between each of the second passive hinge points and the base assembly (10) is b. a is not equal to b, and the active hinge point does not coincide with each of the first passive hinge points.

2. The flipping mechanism according to claim 1, characterized in that, The first position is defined as the state in which the flipped body (20) is located parallel to the base assembly (10); In the first position, the distance between each of the second passive hinge points and the base assembly (10) is greater than the distance between the active hinge point and the base assembly (10), and greater than the distance between each of the first passive hinge points and the base assembly (10); and / or, in the first position, the distance between the active hinge point and the base assembly (10) is equal to the distance between each of the first passive hinge points and the base assembly (10).

3. The flipping mechanism according to claim 1, characterized in that, The flipping mechanism (100) further includes a guide assembly (50) and a flipping detection assembly (60) mounted on the base assembly (10); Along the first direction, the guide components (50) are respectively provided on both sides of the flipped body (20), and the flipping detection component (60) is provided on at least one side of the flipped body (20); the first connecting arm (32) is connected to the guide component (50) on the same side, and the other guide component (50) is connected to the flipped body (20) through the second connecting arm (33), and the second connecting arm (33) is hinged to the flipped body (20); The first connecting arm (32) and / or the second connecting arm (33) are connected to a first baffle (44), which is movable in a second direction to trigger the flip detection component (60), which is used to detect that the flipped object (20) is in the first position or the second position.

4. The flipping mechanism according to claim 3, characterized in that, The first position is when the flipped body (20) is parallel to the base assembly (10), and the second position is when the flipped body (20) is perpendicular to the base assembly (10). The flip detection component (60) includes a first sensor (61) and a second sensor (62), which are arranged at intervals along the second direction. The first baffle (44) can selectively trigger the first sensor (61) and the second sensor (62) to switch the flipped object (20) between a first position and a second position. In the first position, the trigger position of the first sensor (61) is set directly opposite the active hinge point along a third direction.

5. The flipping mechanism according to claim 3, characterized in that, Each of the guide components (50) includes a guide rail (51) and a guide slider (52) slidably connected to the guide rail (51). The guide rail (51) is mounted on the base assembly (10). The guide slider (52) is connected to the first connecting arm (32) or the second connecting arm (33) on the same side. The guide assembly (50) also includes a buffer seat (53) installed on the guide rail (51), and the buffer seat (53) is provided on both sides along the length direction of the guide rail (51).

6. The flipping mechanism according to claim 1, characterized in that, The first position is the state in which the flipped body (20) is parallel to the base assembly (10); The flipping mechanism (100) further includes a lifting assembly (70) and a lifting detection assembly (80). Both the lifting assembly (70) and the lifting detection assembly (80) are installed on the flipped body (20). In the first position, the lifting assembly (70) is used to constrain or drive the carrier disk (200) to move in the flipped body (20) along a second direction, and the lifting assembly (70) is capable of moving in the second direction. The lifting assembly (70) is connected to a second baffle (74), and the second baffle (74) is capable of moving synchronously with the lifting assembly (70) to trigger the lifting detection assembly (80). The lifting detection assembly (80) is used to limit the movement position of the carrier disk (200) in the second direction.

7. The flipping mechanism according to claim 6, characterized in that, The lifting detection assembly (80) includes a third sensor (81) and a fourth sensor (82), which are arranged at intervals along the second direction; In the first position, the second baffle (74) can move synchronously with the lifting assembly (70) to selectively trigger the third sensor (81) and the fourth sensor (82).

8. The flipping mechanism according to claim 6, characterized in that, The lifting assembly (70) includes a lifting base (71), a lifting power source (72), and a lifting plate (73); The lifting base (71) is installed on the overturned body (20), the lifting power source (72) is installed on the lifting base (71), the lifting plate (73) is connected to the lifting power source (72), the lifting power source (72) is used to drive the lifting plate (73) to move away from or closer to the carrier plate (200), the lifting plate (73) is provided with at least two top contact columns (731) arranged at intervals along the first direction; the second baffle (74) is installed on the lifting base (71).

9. The flipping mechanism according to claim 8, characterized in that, The lifting plate (73) is connected to a third baffle (732), and the lifting base (71) is connected to a fifth sensor (711). The third baffle (732) can move along a third direction with the lifting plate (73) to trigger the fifth sensor (711). The fifth sensor (711) is used to limit the lifting height of the lifting plate (73).

10. The flipping mechanism according to any one of claims 6 to 9, characterized in that, The flipping mechanism (100) further includes a transfer component (90) mounted on the flipped body (20) and the transfer component (90) is used to drive the lifting component (70) to move to send the carrier disk (200) into or out of the flipped body (20). The flipped body (20) has guide grooves (202) arranged opposite to each other on both sides along the first direction.

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