Bonding method and bonding apparatus

Abstract

The application discloses a bonding method and a bonding device. The bonding method comprises the following steps: placing a wafer on a first supporting frame of a vacuum bonder; placing a bonding adhesive on a second supporting frame of the vacuum bonder, one of the first supporting frame and the second supporting frame has a size larger than a size of a cavity of the vacuum bonder, and the other has a size smaller than the size of the cavity; placing a carrier plate and the first supporting frame on opposite sides of the second supporting frame respectively and spacing the carrier plate and the first supporting frame from the bonding adhesive respectively, wherein the carrier plate is adsorbed on a bonding chuck of the vacuum bonder; aligning and approaching the carrier plate, the second supporting frame and the first supporting frame; and reducing the air pressure in the vacuum bonder through a suction port on a housing of the vacuum bonder to bond the carrier plate and the wafer together through the bonding adhesive. The method can reduce the amount of gas to be sucked out of the vacuum bonder, and the size of the first supporting frame or the second supporting frame is larger, which is convenient for taking the bonded combination.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a bonding method and bonding equipment. Background Technology

[0002] Currently, semiconductor wafers used in system packaging processes are typically quite thin. To facilitate subsequent fabrication, a carrier is usually used to temporarily bond the semiconductor wafer. This carrier then serves as the substrate for the semiconductor wafer during processing, protecting it from damage due to its thinness. Once the semiconductor wafer has been fabricated, it must be debonded from the carrier.

[0003] Existing vacuum bonding designs involve placing the entire carrier frame, substrate, and wafer assembly containing the bonding components into the vacuum chamber of the bonding machine. This process is difficult, and removing the bonding components after bonding is also challenging. Summary of the Invention

[0004] A first aspect of this application provides a bonding method, comprising: placing a wafer on a first carrier frame of a vacuum bonding machine; placing a bonding adhesive on a second carrier frame of the vacuum bonding machine, wherein one of the first carrier frame and the second carrier frame has a size larger than the cavity size of the vacuum bonding machine, and the other has a size smaller than the cavity size; placing a carrier plate and the first carrier frame on opposite sides of the second carrier frame and spaced apart from the bonding adhesive, wherein the carrier plate is adsorbed onto a bonding chuck of the vacuum bonding machine; aligning the carrier plate, the second carrier frame, and the first carrier frame and bringing them close together; and drawing air into the vacuum bonding machine through an air intake port on the housing of the vacuum bonding machine to reduce the air pressure inside the vacuum bonding machine so that the carrier plate and the wafer are bonded together by the bonding adhesive.

[0005] A second aspect of this application also provides a bonding apparatus for bonding a carrier plate and a wafer together, the bonding apparatus comprising:

[0006] Bonding suction cups are used to attach carrier plates;

[0007] A first carrier frame and a second carrier frame. The first carrier frame is used to carry the wafer, and the second carrier frame is provided with a bonding agent for bonding. The wafer and the carrier plate are respectively disposed on opposite sides of the bonding agent and are spaced apart from the bonding agent. The size of one of the first carrier frame and the second carrier frame is larger than the cavity size of the vacuum bonding machine, and the other is smaller than the cavity size.

[0008] The suction port, formed on the housing of the bonding equipment, is used to draw air from the bonding equipment, reducing the air pressure inside the bonding equipment so that the carrier and the wafer are bonded together by the adhesive.

[0009] The beneficial effects of this application are as follows: This application provides a bonding method in which the size of one of the first and second carrier frames is larger than the cavity size of the vacuum bonding machine, while the size of the other is smaller than the cavity size of the vacuum bonding machine. This configuration reduces the amount of gas that needs to be removed from the vacuum bonding machine during the wafer-carrier bonding process. Furthermore, the fact that the size of one of the first and second carrier frames is larger than the cavity size of the vacuum bonding machine facilitates the placement of the bonding compound into the vacuum bonding machine before bonding and the removal of the bonded wafer from the vacuum bonding machine. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic flowchart of the wafer bonding method of this application;

[0012] Figure 2 This is a top view of the structure of the second carrier frame and the first carrier frame placed in the vacuum bonding machine before wafer pre-packaging in this application;

[0013] Figure 3 This is a schematic diagram of the wafer placement location in this application;

[0014] Figure 4 This is a schematic diagram of the wafer packaging process of this application;

[0015] Figure 5 This is a schematic diagram of the wafer packaging structure of this application;

[0016] Figure 6 This is a schematic diagram of the wafer being removed from the vacuum bonding machine and cut after bonding according to this application;

[0017] Figure 7 This is a schematic diagram of the processing after the bonding wafer is diced in this application. Detailed Implementation

[0018] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0019] It should be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0020] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0021] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0022] As used in this specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrases "if determined" or "if [described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [described condition or event] is detected," or "in response to detection of [described condition or event]."

[0023] To illustrate the fabrication method of this application, the first aspect of this application proposes a bonding method. The embodiments of this application mainly target bonding of thin wafers, using a thin wafer for microdisplays as an example. Please refer to... Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a schematic flowchart of the wafer bonding fabrication method of this application; Figure 2 This is a top view schematic diagram of the second carrier frame and the first carrier frame placed in a vacuum bonding machine before wafer pre-packaging in this application. Figure 3 This is a schematic diagram of the wafer mounting location in this application. The bonding method specifically includes the following steps:

[0024] S11: Place the wafer on the first carrier frame of the vacuum bonding machine.

[0025] The vacuum bonding machine 20 includes a first carrier frame 30 on which the wafer 10 is placed. The first carrier frame 30 provides a platform for the wafer 10 to carry out the bonding process.

[0026] In one embodiment of this application, when the size of the first carrier frame 30 is larger than the cavity size of the vacuum bonding machine 20, the first carrier frame 30 can be placed on the cavity of the vacuum bonding machine 20 to provide a support position for other bonding components in subsequent bonding processes. Specifically, a first colloid 31 is disposed on the first carrier frame 30, and the wafer 10 is bonded to the first carrier frame 30 through the first colloid 31.

[0027] S12: A bonding component for bonding is installed on the second carrier frame of the vacuum bonding machine.

[0028] Specifically, the vacuum bonding machine 20 includes not only the first support frame 30, but also a second support frame 32. The second support frame 32 is provided with a bonding component 33, which can bond the components to be bonded, thereby fixing the components to be bonded.

[0029] To facilitate the insertion of the first carrier frame 30 or the second carrier frame 32 into the vacuum bonding machine 20, or to facilitate the subsequent removal of the bonded composition, one of the first carrier frame 30 and the second carrier frame 32 can be larger than the cavity size of the vacuum bonding machine 20, while the other is smaller than the cavity size. This facilitates the insertion of the pre-bonding composition into the vacuum bonding machine 20 and the removal of the bonded composition from the vacuum bonding machine 20.

[0030] It should be noted that this dimension is the projected area of ​​the cavity of the first carrier frame 30, the second carrier frame 32, and the vacuum bonding machine 20 on the horizontal plane.

[0031] In the embodiments of this application, the example is given where the size of the first carrier frame 30 is larger than the internal size of the vacuum bonding machine 20, and the size of the first carrier frame 32 is smaller than the internal size of the vacuum bonding machine 20. It can be understood that the size of the first carrier frame 30 can also be smaller than the internal size of the vacuum bonding machine 20, and the size of the first carrier frame 32 can be larger than the internal size of the vacuum bonding machine 20.

[0032] In the embodiments of this application, the adhesive 33 is a double-sided adhesive, which is attached to the second support frame 32.

[0033] S13: The carrier plate and the first bearing frame are respectively placed on opposite sides of the second bearing frame and spaced apart from the glued parts.

[0034] Specifically, such as Figure 2 and Figure 3 As shown, wafer 10 has an alignment mark, which is a notch on the arc of wafer 10. Correspondingly, the first carrier frame 30 has a protrusion corresponding to the notch. Thus, before temporary bonding, wafer 10 is aligned with the notch mark and the protrusion on the first carrier frame 30, and then wafer 10 is placed on the first carrier frame 30. Specifically, wafer 10 is bonded to the first carrier frame 30. Furthermore, the lower surface 11 of an integrated circuit (IC) on wafer 10 is bonded to the first carrier frame 30. For example, the lower surface 11 of the wafer is closer to the first carrier frame 30 than the upper surface 12 of the wafer 10 for bonding.

[0035] The carrier plate 40 is adsorbed onto the bonding chuck of the vacuum bonding machine 20. The vacuum bonding machine 20 has a vacuum chuck installed inside its cavity, such as... Figure 3 The first bonding chuck 21 or the second bonding chuck 22 is shown. The carrier plate 40, the second carrier frame 32, and the first carrier frame 30 are positioned between the bonding chucks 21 or 22 in the vacuum bonding machine 20. Figure 3 As shown, the first bonding suction cup 21 adsorbs the carrier 40, and the first carrier frame 30 is held on the housing of the vacuum bonding machine 20 because its size is larger than the internal size of the cavity of the vacuum bonding machine 20.

[0036] It is worth noting that when the size of the first carrier frame 30 is larger than the cavity size of the vacuum bonding machine 20, and the size of the second carrier frame 32 is smaller than the cavity size of the vacuum bonding machine 20, only the first bonding chuck 21 needs to be used; this application uses this as a specific embodiment. However, when the size of the second carrier frame 32 is larger than the cavity size of the vacuum bonding machine 20, and the size of the first carrier frame 30 is smaller than the cavity size of the vacuum bonding machine 20, only the second bonding chuck 22 needs to be used. In specific practical situations, the selection of the size of the first carrier frame 30, the size of the second carrier frame 32, and the corresponding first bonding chuck 21 or second bonding chuck 22 is not limited here.

[0037] The carrier plate 40 includes a glass backing plate. Specifically, to align the carrier plate 40, the second carrier frame 32, the wafer 10, and the first carrier frame 30, the vacuum chuck 21 of the vacuum bonding machine 20 can be used to pick up the glass carrier plate, thus avoiding grease contamination caused by directly holding the carrier plate 40 by hand or other tools. The carrier plate 40 and the first carrier frame 30 are then respectively positioned on opposite sides of the second carrier frame 32 and spaced apart from the bonding component 33. This spacing facilitates subsequent alignment of these four components.

[0038] S14: Align the carrier plate, the second carrier frame, and the first carrier frame and bring them close together.

[0039] The wafer 10 and the carrier plate 40 are respectively disposed on opposite sides of the adhesive component 33, and the adhesive component 33 is disposed on the second carrier frame 32. Therefore, when the second carrier frame 32 is placed into the vacuum bonding machine 20, the wafer 10 and the carrier plate 40 can be placed into the vacuum bonding machine 20 at the same time.

[0040] Then, the carrier plate 40, the second carrier frame 32, and the first carrier frame 30 are aligned and brought closer together. Specifically, since the carrier plate 40, the second carrier frame 32, and the first carrier frame 30 may shift slightly after being placed in the vacuum bonding machine 20, and the wafer 10 is placed on the first carrier frame 30, in order to align the carrier plate 40, the second carrier frame 32, and the first carrier frame 30, they can be aligned first and then brought closer together to make it easier for them to bond together.

[0041] Since the carrier plate 40, the second carrier frame 32, the wafer 10 and the first carrier frame 30 all have a certain three-dimensional shape, when the carrier plate 40, the second carrier frame 32, the wafer 10 and the first carrier frame 30 are aligned, they can be aligned according to the pre-bonding, so that the aligned carrier plate 40, the second carrier frame 32, the wafer 10 and the first carrier frame 30 are close to each other to be aligned according to the pre-sealing area, and an aligned assembly is obtained.

[0042] S15: Air is drawn into the vacuum bonder through the air intake port on the vacuum bonder housing, reducing the air pressure inside the vacuum bonder so that the carrier and the wafer are bonded together by the adhesive.

[0043] Specifically, during the bonding process between the vacuum bonding machine 20 and the sealed wafer 10 and the carrier 40, a sealed space is formed inside the vacuum bonding machine 20. By drawing air into the sealed space of the vacuum bonding machine 20 through the air intake port (not shown in the figure) on the housing of the vacuum bonding machine 20, the air pressure inside the vacuum bonding machine 20 can be reduced, thereby allowing the carrier 40 and the wafer 10 to be bonded together by the bonding component 33, thus initially forming a bonded wafer.

[0044] In this design, one of the first carrier frame 30 and the second carrier frame 30 is larger than the cavity size of the vacuum bonding machine 20, while the other is smaller than the cavity size. This means that the larger first carrier frame 30 or the second carrier frame 32 can extend to the outside of the vacuum bonding machine 20, thus isolating the originally sealed space inside the cavity of the vacuum bonding machine 20. This reduces the amount of air that needs to be extracted by at least half. Furthermore, the larger first carrier frame 30 or the second carrier frame 32 makes it easier to place the carrier frame before bonding into the vacuum bonding machine 20 and to retrieve the bonded composition from the vacuum bonding machine 20.

[0045] Therefore, this application provides a wafer bonding method in which one of the first carrier frame 30 and the second carrier frame 32 has a size larger than the cavity size of the vacuum bonding machine 20, while the other has a size smaller than the cavity size of the vacuum bonding machine 20. This configuration can reduce the amount of gas that needs to be removed from the vacuum bonding machine 20 during the bonding process between the wafer 10 and the carrier plate 40. Moreover, the larger size of one of the first carrier frame 30 and the second carrier frame 32 also facilitates the placement of the pre-bonding composition into the vacuum bonding machine 20 and the removal of the bonded composition from the vacuum bonding machine 20.

[0046] The wafer 10 can be bonded to the first carrier frame 30 using a first adhesive 31, which includes at least one of single-sided or double-sided adhesive. If the first adhesive 31 is a single-sided adhesive, the wafer 10 is bonded to the first carrier frame 30 using the single-sided adhesive. Specifically, the side of the wafer 10 with the circuit structure is attached to the first adhesive of the first carrier frame 30.

[0047] The carrier 40 and the wafer 10 can be bonded to the second carrier frame 32 by the adhesive 33. Specifically, when the adhesive 33 is double-sided adhesive, the carrier 40 and the wafer 10 can be bonded to the second carrier frame 32 by the double-sided adhesive. The materials used for the first adhesive 31 and the adhesive 33 can be the same or different, and the types can be the same or different. No specific limitation is made here.

[0048] Thus, wafer 10 can be bonded to the first carrier frame 30 via the first adhesive 31, and to the second carrier frame 32 via the adhesive 33, thereby bonding the carrier plate 40 to the wafer 10 together via the adhesive 33. Furthermore, wafer 10 can be bonded to the first carrier frame 30 via single-sided adhesive; wafer 10 can be bonded to the second carrier frame 32 via double-sided adhesive; thereby bonding the carrier plate 40 to the wafer 10 together via double-sided adhesive 33.

[0049] To facilitate the subsequent bonding process, it is worth noting that the single-sided or double-sided adhesive should be kept as flat as possible to ensure precise alignment between the components on both sides of the bonded part 33.

[0050] Both the first support frame 30 and the second support frame 32 are circular or square. The square shape includes rectangles and squares. The dimension of either the first support frame 30 or the second support frame 32 is larger than the dimension of the other.

[0051] Furthermore, before the vacuum bonder is bonded to the wafer via an air intake port on its housing, reducing the air pressure inside the machine, the carrier and wafer are bonded together using adhesive bonding components. Please refer to [link to relevant documentation]. Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the wafer packaging process described in this application. Figure 5 This is a schematic diagram of the wafer packaging structure of this application. The bonding method specifically includes:

[0052] The vacuum bonding machine 20 has a sealing ring 211 or 221 at the closed part of the housing. In this way, the first bonding suction cup 21 and the second bonding suction cup 22 are tightly attached to the opposite sides of the first support frame 30 through the sealing ring 211 or 221 to form a sealed space.

[0053] Based on one of the first support frame 30 and the second support frame 32, which is larger than the cavity size of the vacuum bonding machine 20, the internal space of the vacuum bonding machine 20 is divided, and two spaced-apart sealed spaces are obtained in conjunction with the housing of the vacuum bonding machine. The other of the first and second support frames, which is smaller than the cavity size, is disposed within one of the two sealed spaces. In one embodiment of this application, the size of the second support frame 32 is smaller than the internal size of the cavity of the vacuum bonding machine 20; that is, when the vacuum bonding machine 20 is sealed closed, the second support frame 32 is placed within the sealed space.

[0054] Specifically, such as Figure 3 As shown, a first sealing ring 211 is provided on the edge of the opening of the upper half of the vacuum bonding machine 20, and a second sealing ring 221 is provided on the edge of the opening of the lower half of the vacuum bonding machine 20. If the first support frame 30 is larger than the cavity size of the vacuum bonding machine, the second support frame 32 is smaller than the cavity size. The first sealing ring 211 and the second sealing ring 221 are aligned and tightly attached to the opposite sides of the first support frame 30, so that the first bonding suction cup 21 and the second bonding suction cup 22 are both tightly attached to the sides of the first support frame 30 through valve seals 211 or 221 to form two spaced-apart sealed spaces.

[0055] Furthermore, if the second carrier frame 32 is larger than the cavity size of the vacuum bonding machine, and the first carrier frame 30 is smaller than the cavity size, the first sealing ring 211 and the second sealing ring 221 are aligned and tightly attached to the opposite sides of the second carrier frame 32, so that the first bonding suction cup 21 and the second bonding suction cup 22 are both tightly attached to the sides of the second carrier frame 32 through the sealing ring 211 or 221 to form two spaced-apart sealed spaces.

[0056] Furthermore, the process of drawing air into the vacuum bonding machine through the air intake port on the vacuum bonding machine housing, thereby reducing the air pressure inside the vacuum bonding machine and bonding the carrier plate and the wafer together using adhesive bonding components, specifically includes:

[0057] Vacuum evacuation is performed through the suction port (not shown) on the housing of the vacuum bonding machine 20, in the sealed space containing one of the first carrier frame 30 and the second carrier frame 32, which is smaller than the cavity size. This reduces the air pressure in the sealed space, thereby removing air from between the wafer 10 and the bonding component 33, and between the bonding component 33 and the carrier plate 40. This improves the bonding effect between the wafer 10 and the bonding component 33, and between the bonding component 33 and the carrier plate 40. In other words, the reduced air pressure in the sealed space allows the carrier plate 40 and the wafer 10 to be bonded together via the bonding component 33. The volume of the vacuum-evacuated gas is less than or equal to half the internal cavity gas volume of the vacuum bonding machine 20.

[0058] like Figure 5 As shown, the vacuum bonding machine 20 is isolated into two sealed spaces: an upper sealed space and a lower sealed space. The upper sealed space contains the second carrier frame 32 and the carrier plate 40.

[0059] Specifically, such as Figure 5 As shown, the upper sealed space of the vacuum bonding machine 20 is provided with a first bonding suction cup 21. When the first support frame 30 extends outside the cavity of the vacuum bonding machine 20 and the second support frame 32 is disposed in the upper sealed space of the vacuum bonding machine 20, the upper sealed space of the vacuum bonding machine 20 can be vacuumed, thereby reducing the air pressure between the carrier plate 40, the adhesive 33, and the wafer 10 to bond the wafer 10 and the carrier plate 40.

[0060] Furthermore, when the second carrier frame 32 extends outside the cavity of the vacuum bonding machine 20 and the first carrier frame 30 is disposed in the lower half of the sealed space of the vacuum bonding machine 20, the lower half of the sealed space of the vacuum bonding machine 20 can be vacuumed to remove the air between the carrier 40 and the adhesive 33, and the lower half of the sealed space can be vacuumed by the second bonding chuck 22 to remove the air between the adhesive 33 and the wafer 10, thereby reducing the air pressure between the carrier 40, the adhesive 33, and the wafer 10 to bond the wafer 10 and the carrier 40.

[0061] Generally, air can be evacuated during the bonding process, allowing the first carrier frame 30 and the second carrier frame 32 to adhere to opposite sides of the bonding component 33, thereby bonding the wafer 10 to the glass substrate 40 as a single unit. By aligning first and then bringing them closer together, combined with the structure of the second carrier frame 32 and the first carrier frame 30, the amount of air that needs to be evacuated during the bonding process can be reduced compared to the past.

[0062] Typically, when the carrier frame 30 or 32 extends outside the cavity of the vacuum bonding machine 20, the volume of the isolated upper and lower sealed spaces of the vacuum bonding machine 20 is the same, which is half the volume of the overall sealed space. When one of the carrier frames 30 or 32 is inside the cavity of the vacuum bonding machine 20, the volume of one of the upper and lower sealed spaces is half the original volume of the overall sealed space. However, as long as the air between the wafer 10 and the bonding agent 33, and between the bonding agent 33 and the carrier 40, is eliminated to the point that the carrier 40 and the wafer 10 can be bonded together, it is not necessary to completely eliminate all the air in the upper or lower sealed spaces. Of course, to improve the bonding effect between the carrier 40 and the wafer 10, all the air in the upper or lower sealed spaces can be completely eliminated; the specific operation is not limited.

[0063] Furthermore, please refer to Figure 6 and Figure 7 , Figure 6 This is a schematic diagram showing the wafer being removed from the vacuum bonding machine and diced after bonding, according to this application. Figure 7 This is a schematic diagram of the processing after the bonding wafer is diced according to this application, specifically including:

[0064] First, the carrier 40 and wafer 10, after being bonded together, are cut. Specifically, as follows: Figure 6 As shown, after the carrier 40 and the wafer 10 are bonded to meet the requirements, the vacuum bonding machine 20 is first turned on. The wafer 10, which is bonded together, is taken out of the vacuum bonding machine 20 by taking the first carrier frame 30. Since the first carrier frame 30 is relatively large, it is easier to remove the bonded wafer 10 from the vacuum chuck, which is convenient for operation and can also improve production efficiency.

[0065] Then, a preset shape mark is made on the bonded wafer 10, and according to the preset shape, such as a circle, the bonded carrier 40 and the wafer 10 can be cut. Specifically, as follows: Figure 6 and Figure 7As shown, the cutting blade needs to avoid the bearing parts of the second bearing frame 32 and the first bearing frame 30 to avoid causing irreparable damage to the second bearing frame 32 and the first bearing frame 30, and also to facilitate the reuse of the second bearing frame 32 and the first bearing frame 30.

[0066] Furthermore, since the first carrier frame 30 of the vacuum bonding machine 10 has a first colloid 31 on the side that contacts the wafer 10, and the second carrier frame 32 has an adhesive 33, the bonded carrier 40 and the wafer 10 can be free from the constraints of other factors, making it easier to cut and obtain the bonded wafer 10.

[0067] Furthermore, based on the diced wafer 10, the first colloid 31 is debonded to obtain the bonded wafer 10.

[0068] Specifically, such as Figure 7 As shown, the bonding wafer 10 with a temporary protective substrate can be obtained by ultraviolet irradiation to remove the adhesive. The temporary protective substrate can be a substrate glass.

[0069] Furthermore, a second aspect of this application provides a bonding apparatus for bonding a carrier 40 and a wafer 10 together, the bonding apparatus specifically being as follows: Figure 3 The vacuum bonding machine 20 shown includes:

[0070] Bonding suction cups 21 or 22 are used to adsorb the carrier plate 40;

[0071] A first carrier frame 30 and a second carrier frame 32 are provided. The first carrier frame 30 is used to carry the wafer 10, and the second carrier frame 32 is provided with a bonding adhesive 33. The size of one of the first carrier frame 30 and the second carrier frame 32 is larger than the cavity size of the vacuum bonding machine 20, and the other is smaller than the cavity size.

[0072] An air intake (not shown) is formed on the housing of the bonding equipment to draw air from the vacuum bonding machine 20, reducing the air pressure inside the bonding equipment so that the carrier plate 40 and the wafer 10 are bonded together by the adhesive 33.

[0073] Therefore, this application provides a bonding device, in which the bonding device can specifically be as follows: Figure 3 In the vacuum bonding machine 20 shown, the size of one of the first carrier frame 30 and the second carrier frame 32 is larger than the cavity size of the vacuum bonding machine 20, while the size of the other is smaller than the cavity size of the vacuum bonding machine 20. This arrangement can reduce the amount of gas that needs to be extracted from the vacuum bonding machine 20 during the bonding process of bonding the wafer 10 and the carrier plate 40. Moreover, the larger size of one of the first carrier frame 30 and the second carrier frame 32 also facilitates the placement of the pre-bonding composition into the vacuum bonding machine 20 and the removal of the bonded composition from the vacuum bonding machine 20.

[0074] Furthermore, bonding equipment also includes: cutting components (such as...) Figure 7 The components include a trapezoidal frame (with a central angle) and a de-adhesion component; the cutting component is used to cut the bonded carrier 40 and wafer 10, specifically as described in the steps for cutting the bonded carrier 40 and wafer 10, which will not be elaborated here; the de-adhesion component is used to de-adhere the first adhesive 31 based on the cut wafer 10 to obtain the bonded wafer 10, and the de-adhesion process can be performed as described above, which will not be elaborated here.

[0075] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or direct or indirect application in other related technical fields, are similarly included in the patent protection scope of this application.

Claims

1. A bonding method characterized by, The bonding method includes: The wafer is placed on the first carrier frame of the vacuum bonding machine; A bonding component for bonding is provided on the second support frame of the vacuum bonding machine. The size of one of the first support frame and the second support frame is larger than the cavity size of the vacuum bonding machine, and the other is smaller than the cavity size. The carrier plate and the first support frame are respectively disposed on opposite sides of the second support frame and spaced apart from the bonded parts, wherein the carrier plate is adsorbed onto the bonding suction cup of the vacuum bonding machine; The carrier plate, the second bearing frame, and the first bearing frame are aligned and brought close together. Based on one of the first and second support frames, which are larger than the cavity size, the space inside the vacuum bonding machine cavity is divided, and two spaced-apart sealed spaces are obtained in conjunction with the housing of the vacuum bonding machine. Air is drawn into the vacuum bonding machine through the air intake port on the vacuum bonding machine housing, reducing the air pressure inside the vacuum bonding machine so that the carrier plate and the wafer are bonded together by the adhesive.

2. The bonding method according to claim 1, wherein Before drawing air into the vacuum bonding machine through the air intake port on the vacuum bonding machine housing to reduce the air pressure inside the vacuum bonding machine and bond the carrier plate and the wafer together through the adhesive, the bonding method further includes: The first support frame and the second support frame, which are smaller than the cavity size, are disposed in one of the two sealed spaces.

3. The bonding method according to claim 2, characterized in that, The process of drawing air into the vacuum bonding machine through the air intake port on the vacuum bonding machine housing to reduce the air pressure inside the vacuum bonding machine, thereby bonding the carrier plate and the wafer together through the adhesive, includes: Vacuum evacuation is performed through the air intake on the housing of the vacuum bonding machine to evacuate the sealed space containing either the first carrier frame or the second carrier frame, which is smaller than the cavity size. This reduces the air pressure in the sealed space, allowing the carrier plate and the wafer to be bonded together through the bonding agent.

4. The bonding method according to claim 3, characterized in that, The volume of the vacuum pump is less than or equal to half the internal cavity volume of the vacuum bonding machine.

5. The bonding method according to claim 4, characterized in that, The wafer is bonded to the first carrier frame by a first adhesive, which is a single-sided adhesive.

6. The bonding method according to claim 5, characterized in that, The adhesive component is double-sided adhesive.

7. The bonding method according to claim 5, characterized in that, Both the first and second support frames are circular or square.

8. The bonding method according to claim 6, characterized in that, The bonding method further includes: The carrier plate and the wafer, after being bonded together, are then cut. Based on the cut wafer, the first colloid is debonded to obtain a bonded wafer.

9. A bonding apparatus for bonding a carrier substrate and a wafer together, characterized in that, The bonding apparatus employs the bonding method as described in any one of claims 1-8, and the bonding apparatus comprises: A bonding suction cup is used to adsorb the carrier plate; A first carrier frame and a second carrier frame, wherein the first carrier frame is used to support the wafer, and the second carrier frame is provided with a bonding adhesive, wherein the size of one of the first carrier frame and the second carrier frame is larger than the cavity size of the bonding device, and the other is smaller than the cavity size; An air intake is formed on the housing of the bonding equipment and is used to draw air from the bonding equipment to reduce the air pressure inside the bonding equipment so that the carrier plate and the wafer are bonded together by adhesive bonding.

10. The bonding apparatus according to claim 9, characterized in that, The bonding device further includes: a cutting component and a debonding component; A cutting component is used to cut the carrier plate and the wafer after they are bonded together. A debonding component is used to debond the first adhesive located between the wafer and the first carrier frame based on the diced wafer, to obtain a bonded wafer.

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