A highly integrated modular inverter brick

Abstract

This invention discloses a highly integrated modular inverter brick, comprising a water-cooled plate and multiple components. The water-cooled plate has multiple connection structures, and each component is connected to one of these connection structures. The components include a thin-film capacitor positioned below the water-cooled plate, an IGBT module positioned above the water-cooled plate, a drive unit PCBA, and a chip protection card. The chip protection card is mounted on the drive unit PCBA, and the assembled unit is fixed to the IGBT module and the water-cooled plate. A water channel is provided at the end of the water-cooled plate that is in contact with the IGBT module. Compared to traditional solutions, this highly integrated modular inverter brick achieves lightweighting, high efficiency, and cost control, while improving system efficiency and performance. Furthermore, high integration reduces costs, the number of parts, and assembly time, improving production efficiency and quality. Moreover, in case of internal component damage, repairs can be performed without sequentially disassembling upper-level components.

Description

Technical Field

[0001] This invention pertains to modular inverter bricks, and particularly relates to a highly integrated modular inverter brick. Background Technology

[0002] The inverter brick product is a modular inverter product that is compatible with various new energy vehicles such as HEV, PHEV, and BEV. During the period of rapid development of the new energy vehicle market, many vehicle manufacturers have begun to try to independently develop electric drive assemblies. Based on the technological accumulation of previous generations of inverters, developing an inverter module that is compact, flexible in installation, and compatible with multiple architectures has become an urgent problem to be solved.

[0003] Existing structural solutions typically employ a stacking method, placing various components sequentially into the main housing from top to bottom. This traditional approach suffers from low integration, high development costs, and an inability to meet diverse layout and interface requirements. Furthermore, if internal components of the controller fail, the upper-layer components must be removed sequentially for repair. Summary of the Invention

[0004] To address the above problems, this invention proposes a highly integrated modular inverter brick.

[0005] The objective of this invention can be achieved through the following methods:

[0006] This invention provides a highly integrated modular inverter brick, including a water-cooled plate and multiple components. The water-cooled plate is provided with multiple connection structures, and the multiple components are connected to the multiple connection structures in a one-to-one correspondence. The components include a thin-film capacitor disposed below the water-cooled plate, an IGBT module disposed above the water-cooled plate, a drive unit PCBA, and a chip protection card. The chip protection card is mounted on the drive unit PCBA, and the assembled whole is fixed to the IGBT module and the water-cooled plate. The end of the water-cooled plate that is in contact with the IGBT module is provided with a water channel.

[0007] Furthermore, the components also include a three-phase mounting base, an isolation plate, and a control unit PCBA. The three-phase mounting base is fixed above the water-cooled plate after being connected to the IGBT module. The isolation plate is fixedly connected to the water-cooled plate, and the control unit PCBA is mounted on the isolation plate.

[0008] Furthermore, a sealing ring is provided between the water-cooled plate and the IGBT module.

[0009] Furthermore, the components also include a current sensor chip, which can be mounted on the drive unit PCBA or a water-cooled plate.

[0010] Furthermore, the multiple connection structures include multiple fixing points set on the two end faces of the water-cooled plate.

[0011] Furthermore, the fixing points include: a drive unit PCBA fixing point and a film capacitor fixing point arranged diagonally, an IGBT module fixing point and a three-phase mounting base fixing point arranged diagonally, wherein the three-phase mounting base fixing point is located on the side closer to the three-phase mounting base, the drive unit PCBA fixing point is located on the side away from the three-phase mounting base, an isolation plate fixing point is arranged near the drive unit PCBA fixing point, and a production line hoisting point is arranged near the isolation plate fixing point.

[0012] Furthermore, the three-phase mounting base includes a three-phase mounting base copper busbar, a three-phase current sensor core, and a plastic component, with the three-phase current sensor core and the three-phase mounting base copper busbar connected by the plastic component. ， The three-phase mounting bracket copper busbar is located on the side closest to the IGBT module, and the three-phase current sensor core is positioned near the three-phase mounting bracket copper busbar.

[0013] Furthermore, the IGBT module includes an IGBT module copper busbar, a three-phase mounting copper busbar, and the IGBT module copper busbar being fixedly connected.

[0014] Furthermore, the three-phase mounting base copper busbar and the IGBT module copper busbar are connected by bolts and / or welding.

[0015] Furthermore, the thin-film capacitor includes a housing and a thin-film capacitor core, with the housing and water-cooling plate integrally formed, and the thin-film capacitor core encapsulated within the water-cooling plate.

[0016] Furthermore, the isolation plate is installed on the side of the water-cooled plate, and the control unit PCBA is installed on the outside of the isolation plate.

[0017] Compared with the prior art, this application has the following beneficial effects:

[0018] Compared to traditional solutions, highly integrated modular inverter bricks offer advantages in terms of weight reduction, efficiency, and cost control. This approach integrates multiple components and functions, reducing overall weight and size while improving system efficiency and performance. Furthermore, high integration lowers costs, reduces the number of parts and assembly time, improves production efficiency and quality, and allows for repair of damaged internal components without the need to disassemble upper-level components sequentially.

[0019] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures pointed out in the description, claims and drawings. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram of a highly integrated modular inverter brick assembly according to an embodiment of the present invention is shown;

[0022] Figure 2 An exploded view of a highly integrated modular inverter brick according to an embodiment of the present invention is shown;

[0023] Figure 3 A schematic diagram of an IGBT module according to an embodiment of the present invention is shown;

[0024] Figure 4 A schematic diagram of a water-cooled plate according to an embodiment of the present invention is shown;

[0025] Figure 5 A schematic diagram of a three-phase mounting bracket according to an embodiment of the present invention is shown;

[0026] Figure 6 A schematic diagram of the drive unit PCBA according to an embodiment of the present invention is shown;

[0027] Figure 7 A schematic diagram of a control unit PCBA according to an embodiment of the present invention is shown;

[0028] In the diagram, 10-water-cooled plate, 101-water channel, 102-drive unit PCBA 50 fixing point, 103-IGBT module fixing point, 104-film capacitor fixing point, 105-three-phase mounting bracket fixing point, 106-isolation plate fixing point, 107-production line hoisting point, 20-film capacitor, 30-sealing ring, 40-IGBT module, 50-drive unit PCBA, 60-chip protection card, 70-three-phase mounting bracket, 701-three-phase current sensor core, 702-three-phase mounting bracket copper busbar, 703-plastic parts, 80-isolation plate, 90-control unit PCBA. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] like Figure 1 , 2 As shown, a highly integrated modular inverter brick includes a water-cooled plate 10 and multiple components. The water-cooled plate 10 has multiple connection structures, and the multiple components are connected to the multiple connection structures in a one-to-one correspondence. The components include a thin-film capacitor 20, an IGBT (Insulated Gate Bipolar Transistor) module 40, a drive unit PCBA 50, a chip protection card 60, a three-phase mounting base 70, an isolation plate 80, and a control unit PCBA 90.

[0031] The water-cooled plate 10 has a protruding square structure on the side away from the three-phase mounting base 70. The square structure has a protruding column with a hole, and an opening fixing structure that is flush with the square structure and opposite to the protruding column with the hole. The outer side of the water-cooled plate 10 has two opening fixing structures that are lower than the horizontal plane of the square structure, which are mainly used for connecting and fixing with other components or housings.

[0032] The inner edge of the film capacitor 20, on the side away from the three-phase mounting base 70, has a copper busbar structure with six openings, which corresponds one-to-one with the copper busbar structure with six openings on the side of the IGBT module 40, also away from the three-phase mounting base 70, for fixed connection. The IGBT module 40 and the film capacitor 20 can also be connected by bolts and / or welding. The outer edge of the film capacitor 20, on the side away from the three-phase mounting base 70, has a copper busbar structure with two openings for connection to other components.

[0033] A thin-film capacitor 20 is positioned below the water-cooled plate 10 to store energy and stabilize voltage, thus contributing to a stable output current. The thin-film capacitor 20 comprises a housing and a capacitor core. It can be connected to the water-cooled plate via a fixing point 104, allowing for a detachable connection and easy replacement. Alternatively, the housing and water-cooled plate 10 can be integrally molded, with the capacitor core encapsulated within the plate, resulting in a simpler and more cost-effective structure. An IGBT module 40 is positioned above the water-cooled plate 10. The three-phase mounting bracket 70 connects to the IGBT module 40 and is then fixed above the water-cooled plate 10.

[0034] like Figure 6As shown, the chip protection card 60 has four raised pillars, and three square contact bumps are set between adjacent pillars. These bumps are mainly for contact with the three-phase current sensor cores 701 on the three-phase mounting base 70. The four raised pillars are secured on both sides of the three sets of three-phase current sensor cores 701. The drive unit PCBA 50 has four U-shaped slots and a stepped notch along its periphery. The stepped notch is designed to match the shape of the square notch on the isolation plate 80 for easy installation. The three U-shaped slots correspond one-to-one with the three U-shaped slots on the isolation plate 80 for easy connection and fixation. The drive unit PCBA 50 has several round holes of different sizes near the chip protection card 60 and several round holes of different sizes on the side away from the chip protection card 60. This design is to allow the contact pointer on the IGBT module 40 to pass through the drive unit PCBA 50. The drive unit PCBA (50) has a current sensor chip, which can also be mounted on the water-cooled plate (10). The chip protection card 60 is mounted on the drive unit PCBA50. After assembly, the whole unit is fixed on the IGBT module 40 and the water-cooling plate 10, which makes the installation compact and reduces the volume of the module brick.

[0035] like Figure 7 As shown, the isolation plate 80 has a square notch at the diagonal of the side away from the water-cooling plate 10, mainly to adapt to the shape of the shell and components. The outer edge of the notch has an opening structure for connection and fixation with the shell and components. One set of opposite sides of the isolation plate 80 has folded edges, with one U-shaped groove adjacent to the folded edge and two U-shaped grooves on the outer side, mainly to adapt to the shape of other components and facilitate installation. The isolation plate 80 is fixedly connected to the water-cooling plate 10, and the control unit PCBA90 is mounted on the isolation plate 80. The isolation plate 80, positioned between the drive unit PCBA50 and the control unit PCBA90, isolates signal interference; this arrangement also saves cost and space. The isolation plate 80 can be mounted above the drive unit PCBA50, or fixedly connected to the side of the water-cooling plate 10. The control unit PCBA90 is mounted on the outside of the isolation plate 80.

[0036] like Figure 3 As shown, a sealing ring 30 is provided between the water-cooled plate 10 and the IGBT module 40. The shape of the sealing ring 30 is the same as that of the IGBT module 40, which is rectangular. In order to prevent the heat emitted by the film capacitor 20 during use and the water in the water channel 101 from damaging the sealing ring 30, the sealing ring is made of high temperature and water resistant rubber material, such as nitrile rubber sealing ring, fluororubber sealing ring, etc.

[0037] The IGBT module 40 has a copper busbar structure with six openings on the side away from the three-phase mounting base 70. This structure is fixedly connected to the copper busbar structure with six openings on the inner edge of the film capacitor 20 on the side away from the three-phase mounting base 70. The IGBT module 40 and the film capacitor 20 can also be connected by bolts and / or welding. The side of the IGBT module 40 near the copper busbar structure with six openings has several raised pointers, and the side of the IGBT module 40 near the three-phase mounting base 70 also has several raised pointers. These raised pointers pass through several corresponding circular holes on the drive unit PCBA50.

[0038] like Figure 4 As shown, the multiple connection structures are multiple fixing points set on the two end faces of the water-cooled plate 10. The fixing points include: drive unit PCBA fixing point 102, IGBT module fixing point 103, film capacitor fixing point 104, and three-phase fixing point 105. The drive unit PCBA fixing point 102 and the film capacitor fixing point 104 are set diagonally, and the IGBT module fixing point 103 and the three-phase fixing point 105 are set diagonally. The three-phase fixing point 105 is located on the side closer to the three-phase fixing base 70, and the drive unit PCBA fixing point 102 is located on the side away from the three-phase fixing base 70. An isolation plate fixing point 106 is set near the drive unit PCBA fixing point 102, and a production line hoisting point 107 is set near the isolation plate fixing point 106. The drive unit PCBA fixing point 102 and drive unit PCBA 50 are precisely and quickly fixed; the IGBT module fixing point 103 and IGBT module 40 are precisely and quickly fixed; the film capacitor fixing point 104 and film capacitor 20 are precisely and quickly fixed; the three-phase mounting base fixing point 105 and three-phase mounting base 70 are precisely and quickly fixed; and the isolation plate fixing point 106 and isolation plate 80 are precisely and quickly fixed. Therefore, the function of the fixing points is to accurately position and fix the module bricks, the main housing, and the components.

[0039] The end of the water-cooled plate 10 that is attached to the IGBT module 40 is provided with a water channel 101. The water flowing in the water channel 101 carries away the heat, and the water channel 101 can cool the film capacitor 20. At the same time, it improves the original design of the main shell and water channel as an integrated unit, which simplifies the original complex structure and avoids defects such as looseness and pores that are easy to occur in the water channel area of ​​the main shell.

[0040] like Figure 5As shown, the three-phase mounting bracket 70 includes a three-phase mounting bracket copper busbar 702, a three-phase current sensor core 701, and a plastic component 703. The three-phase current sensor core 701 and the three-phase mounting bracket copper busbar 702 are connected by the plastic component 703. This makes the installation more centralized, reduces the number of connecting parts, lowers costs, and improves space utilization. Three sets of three-phase mounting bracket copper busbars 702 and three-phase current sensor cores 701 are arranged correspondingly. The three-phase mounting bracket copper busbar 702 is located on the side closer to the IGBT module 40, and the three-phase current sensor core 701 is located adjacent to the three-phase mounting bracket copper busbar 702.

[0041] The IGBT module 40 has an IGBT module copper busbar on the side near the three-phase mounting bracket 70. The three-phase mounting bracket copper busbar 702 and the IGBT module copper busbar are fixedly connected. The number of groups of the IGBT module copper busbar is the same as the number of groups of the three-phase mounting bracket copper busbar 702, both being 3 groups, and their positions correspond one-to-one. The three-phase mounting bracket copper busbar 702 and the IGBT module copper busbar can also be connected by bolts and / or welding.

[0042] The installation steps for the highly integrated modular inverter brick of this invention are as follows:

[0043] First, install the film capacitor 20 below the water-cooled plate 10.

[0044] Secondly, the IGBT module 40 is positioned above the water-cooled plate 10, and a sealing ring 30 is provided between the water-cooled plate 10 and the IGBT module 40.

[0045] Next, the three-phase mounting bracket copper busbar 702 of the three-phase mounting bracket 70 is connected to the IGBT module copper busbar of the IGBT module 40 one by one and then fixed on the top of the water-cooling plate.

[0046] Then, the chip protection card 60 is assembled on the drive unit PCBA50, and the assembled whole is fixed on the IGBT module 40 and the water cooling plate 10.

[0047] Finally, an isolation plate 80 is installed above the drive unit PCBA50. The isolation plate 80 is fixedly connected to the water-cooled plate 10, and the control unit PCBA90 is installed on the isolation plate 80.

[0048] This completes the installation of a highly integrated modular inverter brick according to the present invention. The entire inverter brick comprises eight parts, including a chip protection card 60 mounted on the drive unit PCBA 50, which, after assembly, is fixed to the IGBT module 40 and the water-cooling plate 10. The three-phase mounting bracket 70 is connected to the IGBT module 40 and fixed above the water-cooling plate 10. Only six components actually need to be assembled on the production line, and precise positioning and connection can be quickly achieved through fixing points, greatly reducing installation difficulty, lowering development costs, and meeting more layout and interface requirements. Furthermore, if internal components of the controller are damaged, repair can be performed without sequentially disassembling upper-level components.

[0049] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A highly integrated modular inverter brick, characterized in that: The device includes a water-cooled plate (10) and multiple components. The water-cooled plate (10) is provided with multiple connection structures. The multiple components are connected to the multiple connection structures in a corresponding manner. The components include a thin film capacitor (20) disposed below the water-cooled plate (10), an IGBT module (40) disposed above the water-cooled plate (10), a drive unit PCBA (50) and a chip protection card (60). The chip protection card (60) is mounted on the drive unit PCBA (50). The assembled device is fixed to the IGBT module (40) and the water-cooled plate (10). The end of the water-cooled plate (10) that is in contact with the IGBT module (40) is provided with a water channel (101). The components also include a three-phase mounting bracket (70), an isolation plate (80), and a control unit PCBA (90). The three-phase mounting bracket (70) is connected to the IGBT module (40) and fixed above the water-cooled plate (10). The isolation plate (80) is fixedly connected to the water-cooled plate (10). The control unit PCBA (90) is mounted on the isolation plate (80). The multiple connection structures include multiple fixing points set on the two end faces of the water-cooled plate (10); The fixing points include: a drive unit PCBA fixing point (102) and a film capacitor fixing point (104) arranged diagonally, an IGBT module fixing point (103) and a three-phase fixing point (105) arranged diagonally, wherein the three-phase fixing point (105) is located on the side closer to the three-phase fixing point (70), the drive unit PCBA fixing point (102) is located on the side away from the three-phase fixing point (70), and an isolation plate fixing point (106) is arranged close to the drive unit PCBA fixing point (102).

2. The highly integrated modular inverter brick according to claim 1, characterized in that: A sealing ring (30) is provided between the water-cooled plate (10) and the IGBT module (40).

3. The highly integrated modular inverter brick according to claim 1, characterized in that: The components also include a current sensor chip, which is mounted on the drive unit PCBA (50) or the water-cooled plate (10).

4. The highly integrated modular inverter brick according to claim 1, characterized in that: Set up production line hoisting points (107) near the fixed point (106) of the isolation plate.

5. The highly integrated modular inverter brick according to claim 1, characterized in that: The three-phase mounting base (70) includes a three-phase mounting base copper busbar (702), a three-phase current sensor core (701), and a plastic part (703). The three-phase current sensor core (701) and the three-phase mounting base copper busbar (702) are connected by the plastic part (703). The three-phase mounting base copper busbar (702) is located on the side close to the IGBT module (40), and the three-phase current sensor core (701) is set near the three-phase mounting base copper busbar (702).

6. The highly integrated modular inverter brick according to claim 5, characterized in that: The IGBT module (40) includes an IGBT module copper busbar, a three-phase fixed base copper busbar (702), and the IGBT module copper busbar are fixedly connected.

7. The highly integrated modular inverter brick according to claim 6, characterized in that: The three-phase fixed base copper busbar (702) and the IGBT module copper busbar are connected by bolts and / or welding.

8. The highly integrated modular inverter brick according to claim 1, characterized in that: The thin-film capacitor (20) includes a housing and a thin-film capacitor core. The housing and the water-cooling plate (10) are integrally formed, and the thin-film capacitor core is encapsulated in the water-cooling plate (10).

9. The highly integrated modular inverter brick according to claim 1, characterized in that: The isolation plate (80) is installed on the side of the water-cooled plate (10), and the control unit PCBA (90) is installed on the outside of the isolation plate (80).

Images