Cutting apparatus and cutting method

Abstract

The present application discloses a cutting device and a cutting method. The cutting device comprises an adjusting platform and a cutting mechanism. The adjusting platform defines a receiving space on its bearing surface. The cutting mechanism is arranged corresponding to the adjusting platform and can rotate relative to the adjusting platform, and the cutting mechanism comprises at least one winding seat and a cutting line. At least one winding seat comprises a seat body capable of moving relative to the adjusting platform and a first guide wheel mounted on the seat body. The cutting line is wound around the first guide wheel of at least one winding seat to form a first cutting section. The cutting mechanism and the adjusting platform are configured to be relatively movable in a direction non-perpendicular to the bearing surface, so that the first cutting section passes through the receiving space. Accordingly, the cutting device can cut the object to be cut arranged in the receiving space while confirming the crystal direction angle.

Description

Technical Field

[0001] This invention relates to a cutting device, and more particularly to a cutting device and method employing a relatively movable adjustable platform and a cutting mechanism. Background Technology

[0002] In existing cutting operations (such as ingot slicing), the error is mostly inferred from the finished product to adjust the next cutting operation. However, existing cutting operations struggle to control the precision of each cutting operation. Therefore, the inventor believed that the above-mentioned shortcomings could be improved. Through dedicated research and the application of scientific principles, the inventor has finally proposed an invention with a reasonable design that effectively improves upon these shortcomings. Summary of the Invention

[0003] The present invention provides a cutting device and a cutting method that can effectively improve the defects that may occur in existing cutting operations.

[0004] This invention discloses a cutting device, comprising: an adjusting platform having a bearing surface, and the adjusting platform defining an accommodating space on the bearing surface; and a cutting mechanism disposed corresponding to the adjusting platform and rotatable relative to it, the cutting mechanism including at least one winding seat and a cutting wire; wherein the at least one winding seat includes: a base movable relative to the adjusting platform; and a first guide wheel mounted on the base; wherein the cutting wire is wound around the first guide wheel of the at least one winding seat to form a first cutting segment, and the cutting mechanism and the adjusting platform are configured to move relative to each other along a first direction not perpendicular to the bearing surface, so that the first cutting segment passes through the accommodating space.

[0005] Preferably, there are at least two winding seats, and the cutting wire is wound around the first guide wheels of the two winding seats to form a first cutting segment between the two first guide wheels; each winding seat includes a second guide wheel mounted on the seat body; in each winding seat, the cutting wire is wound around the first guide wheel and the second guide wheel, and the central axis of the first guide wheel is not parallel to the central axis of the second guide wheel.

[0006] Preferably, the first guide wheel of each winding seat is detachably mounted on the seat body; when each first guide wheel is removed from the seat body, the cutting wire passes through two second guide wheels to form a second cutting segment between the two second guide wheels, and the cutting mechanism and the adjusting platform are configured to move relative to each other in a second direction so that the second cutting segment enters the receiving space.

[0007] Preferably, the first direction and the second direction form an angle between 75 degrees and 105 degrees.

[0008] Preferably, the adjustment stage includes at least one vacuum suction cup, one end of which is located on the bearing surface and communicates with the receiving space.

[0009] Preferably, the adjustment platform is configured to rotate relative to the cutting mechanism so that the bearing surface forms an adjustment angle with the first direction.

[0010] This invention also discloses a cutting method, comprising: a pre-cutting step; fixing an object to be cut onto a cutting device; wherein the cutting device includes: an adjustment platform having a bearing surface, and the object to be cut is fixed on the bearing surface; and a cutting mechanism disposed corresponding to the adjustment platform and rotatable relative to it, and the cutting mechanism includes at least one winding seat and a cutting wire; wherein the at least one winding seat includes a body movable relative to the adjustment platform and a first guide wheel mounted on the body; wherein the cutting wire passes through the first guide wheel of the at least one winding seat to form a first cutting segment; a dicing step: the cutting mechanism and the adjustment platform move relative to each other in a first direction not perpendicular to the bearing surface, so that the first cutting segment moves through the top of the object to be cut, and cuts off a chip to be inspected from the object; and a chip inspection step: inspecting the chip to be inspected with a crystal orientation detector to determine the crystal orientation angle of the chip to be inspected.

[0011] Preferably, when the difference between the crystal orientation angle in the inspection step and a preset crystal orientation angle meets a preset allowable error, the cutting method further implements a cutting step: cutting the object to be cut so that the object to be cut forms a plurality of predetermined cut pieces.

[0012] Preferably, in the preliminary step, at least two winding seats are used, and the cutting wire passes through the first guide wheels of the two winding seats to form a first cutting segment between the two first guide wheels. Each winding seat includes a second guide wheel mounted on the seat body. The cutting step includes a longitudinal cutting step: each first guide wheel of the cutting mechanism is removed, and a cutting wire passes through the two second guide wheels to form a second cutting segment between the two second guide wheels. The cutting mechanism is then moved relative to the adjustment platform so that the second cutting segment cuts the object to be cut multiple times along a second direction at different positions. Each time the second cutting segment cuts the object to be cut along the second direction, the second cutting segment cuts to the preset boundary of the object to be cut, but does not penetrate the object.

[0013] Preferably, after the longitudinal cutting step, the cutting step further includes a transverse cutting step: reinstalling each first guide wheel on the cutting mechanism, and then adjusting the stage relative to the cutting mechanism so that the first cutting segment cuts the preset boundary of the object to be cut along the first direction, thereby forming a plurality of predetermined cut pieces that are separated from each other.

[0014] Preferably, when the difference between the crystal orientation angle in the inspection step and a preset crystal orientation angle does not meet a preset tolerance, the cutting method further implements an adjustment step: rotating the adjustment stage in the direction of eliminating the difference; after the adjustment step, the slicing step and the inspection step are then implemented; the adjustment step, the slicing step and the inspection step are implemented in turn N times, where N is a positive integer, and the difference between the crystal orientation angle in the Nth inspection step and the preset crystal orientation angle meets the preset tolerance.

[0015] Preferably, in the preliminary step, the object to be cut is adsorbed and fixed onto the bearing surface by adjusting at least one vacuum suction cup of the stage.

[0016] In summary, the cutting equipment and cutting method disclosed in the embodiments of the present invention are configured such that the cutting mechanism and the adjusting stage are able to move relative to each other in a first direction that is not perpendicular to the bearing surface, so that the first cutting segment passes through the object to be cut (or the accommodating space), thereby facilitating the implementation of the slicing step and the inspection step, and enabling the object to be cut to be cut to be cut after confirming its crystal orientation angle.

[0017] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0018] Figure 1 This is a three-dimensional schematic diagram of the cutting device according to an embodiment of the present invention.

[0019] Figure 2 for Figure 1 A three-dimensional schematic diagram of the cutting equipment moving in the first direction.

[0020] Figure 3 for Figure 1 A three-dimensional schematic diagram of the cutting equipment moving in the second direction.

[0021] Figure 4 for Figure 1 A top-view schematic diagram of the cutting mechanism of the cutting equipment.

[0022] Figure 5 for Figure 1 A front view diagram of the cutting mechanism of the cutting equipment.

[0023] Figure 6 This is a flowchart illustrating the cutting method according to an embodiment of the present invention.

[0024] Figure 7 for Figure 6 A schematic diagram of the preliminary steps of the cutting method in the diagram.

[0025] Figure 8 for Figure 6 A schematic diagram of the slicing steps in the cutting method.

[0026] Figure 9 for Figure 6 A schematic diagram of the inspection steps for the cutting method in the image.

[0027] Figure 10 for Figure 6 The cutting steps of the cutting method in the diagram Figure 1 .

[0028] Figure 11 for Figure 6 The cutting steps of the cutting method in the diagram Figure 2 .

[0029] Figure 12 for Figure 6 A schematic diagram illustrating the adjustment steps of the cutting method in the diagram. Detailed Implementation

[0030] The following specific embodiments illustrate the implementation of the "cutting equipment and cutting method" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0031] It should be understood that while terms such as “first,” “second,” and “third” may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term “or” as used herein may, as appropriate, include any combination of one or more of the associated listed items.

[0032] Please see Figures 1 to 12As shown, this is an embodiment of the present invention. This embodiment discloses a cutting apparatus 100 and a cutting method S100, which is described below using the cutting of a crystal ingot G as an example. The cutting method S100 is implemented using the cutting apparatus 100 of this embodiment, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the cutting apparatus 100 may be used to cut objects other than the crystal ingot G, and the cutting apparatus used in the cutting method S100 may be different from that described in this embodiment.

[0033] Furthermore, for the sake of clarity in explaining this embodiment, the various components of the cutting device 100 and their connection relationships will be described first, followed by a description of the cutting method S100 using the cutting device 100. The cutting device 100 includes an adjustment platform 1 and a cutting mechanism 2 that is disposed corresponding to the adjustment platform 1 and is rotatable relative to it. The adjustment platform 1 and the cutting device 100 can move or rotate relative to each other, and the specific operation of the adjustment platform 1 and the cutting device 100 can be controlled by inputting corresponding parameters into a control panel (not shown in the figure) or a computer (not shown in the figure), but the present invention is not limited thereto.

[0034] Specifically, such as Figures 1 to 3 As shown, the adjustment stage 1 has a bearing surface 11 and at least one vacuum suction cup 12 corresponding to the bearing surface 11. The adjustment stage 1 defines a receiving space 13 on the bearing surface 11 for receiving an object to be cut (such as...). Figure 7 The ingot G shown is configured such that at least one end of the vacuum chuck 12 is located on the bearing surface 11 and communicates with the accommodating space 13, for adsorbing and positioning the object to be cut on the bearing surface 11, thereby enabling rapid positioning of the object to be cut without generating any waste, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, at least one of the vacuum chucks 12 may be omitted or replaced with other components (such as adhesive and sacrificial material) according to design requirements.

[0035] Furthermore, the adjusting platform 1 and the cutting mechanism 2 are configured to move relative to each other along a first direction D1 that is not perpendicular to the bearing surface 11, and are configured to move relative to each other along a second direction D2, with the first direction D1 and the second direction D2 forming an angle between 75 degrees and 105 degrees.

[0036] It should be noted that, in the above description of this embodiment, "relatively moving" means that at least one of the adjusting platform 1 and the cutting mechanism 2 can move. Furthermore, for ease of explanation, in this embodiment, the first direction D1 is parallel to the bearing surface 11 and is a horizontal direction, while the second direction D2 is perpendicular to the bearing surface 11 and is described as a vertical direction. That is, the angle between the first direction D1 and the second direction D2 is 90 degrees in this embodiment, but the present invention is not limited to this.

[0037] Furthermore, such as Figure 12 As shown, in this embodiment, the adjustment platform 1 is configured to rotate relative to the cutting mechanism 2, so that the bearing surface 11 forms an adjustment angle σ11 with the first direction D1, thereby synchronously adjusting the orientation of the object to be cut relative to the cutting mechanism 2. However, the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the cutting device 100 can rotate relative to the adjustment platform 1 to adjust the orientation of the object to be cut relative to the cutting mechanism 2.

[0038] More specifically, such as Figures 1 to 3 As shown, the cutting mechanism 2 includes two winding seats 21 and a cutting line 22 wound around the two winding seats 21. In this embodiment, the two winding seats 21 have substantially the same structure and are arranged in a substantially mirror-symmetrical manner, but the invention is not limited thereto. For example, in other embodiments of the invention not shown, the two winding seats 21 may be slightly different or not arranged in a mirror-symmetrical manner; or, the number of winding seats 21 may be at least one.

[0039] In this embodiment, each winding seat 21 includes a body 213 movable relative to the adjustment platform 1, and a first guide wheel 211 and a second guide wheel 212 mounted on the body 213 and spaced apart from each other. In any of the winding seats 21 in this embodiment, the body 213 is generally L-shaped. The first guide wheel 211 and the second guide wheel 212 are rotatably mounted at both ends of the body 213 along their central axes C211 and C212, respectively. The central axis C211 of the first guide wheel 211 is not parallel to the central axis C212 of the second guide wheel 212 (e.g., two planes perpendicular to the two central axes C211 and C212 are perpendicular to each other). The first guide wheel 211 is preferably detachably mounted on the body 213, but is not limited thereto.

[0040] More specifically, both the first guide wheel 211 and the second guide wheel 212 are disc-shaped. The radius of the first guide wheel 211 is smaller than the radius of the second guide wheel 212, and the two first guide wheels 211 are located inside the two second guide wheels 212. Preferably, the central axis C211 of the first guide wheel 211 is parallel to the second direction D2, while the central axis C212 of the second guide wheel 212 is preferably parallel to the first direction D1.

[0041] Furthermore, in a top view plane perpendicular to the central axis C211 of the first guide wheel 211 (e.g.: Figure 4 In this context, the second guide wheel 212 is approximately located in the tangential direction of the first guide wheel 211; and in a forward-looking plane perpendicular to the central axis C212 of the second guide wheel 212 (e.g.: Figure 5 In this invention, the first guide wheel 211 is generally located in the tangential direction of the second guide wheel 212, but the invention is not limited thereto.

[0042] like Figures 1 to 3 As shown, the cutting wire 22 is wound around the first guide wheel 211 and the second guide wheel 212 of each of the winding seats 21. For example, the cutting wire 22 is sequentially wound around the second guide wheel 212 and the first guide wheel 211 of one of the winding seats 21, and then wound around the first guide wheel 211 and the second guide wheel 212 of another winding seat 21. The central angle of the portion abutting against any of the first guide wheel 211 or the second guide wheel 212 of the cutting wire 22 corresponding to the corresponding central axes C211 and C212 is no greater than 90 degrees, but the present invention is not limited to this.

[0043] The cutting wire 22 passes around the two first guide wheels 211 to form a first cutting segment 221 between the two first guide wheels 211, and the cutting mechanism 2 and the adjusting platform 1 are configured to move relative to each other along the first direction D1 so that the first cutting segment 221 passes through the receiving space 13. Furthermore, when the first guide wheels 211 of each winding seat 21 are removed from the seat body 213, the cutting wire 22 passes around the two second guide wheels 212 to form a second cutting segment 222 between the two second guide wheels 212, and the cutting mechanism 2 and the adjusting platform 1 are configured to move relative to each other along the second direction D2 so that the second cutting segment 222 enters the receiving space 13.

[0044] Furthermore, although any of the winding seats 21 in this embodiment is described as including the seat body 213, the first guide wheel 211 and the second guide wheel 212, in other embodiments of the present invention not shown, the second guide wheel 212 may be omitted according to design requirements; or, when the number of winding seats 21 is at least one, the cutting wire 22 is wound around the first guide wheel 211 of at least one winding seat 21 to form the first cutting segment 221.

[0045] The above is a structural description of the cutting device 100 described in this embodiment; as follows: Figures 6 to 12 As shown, the cutting method S100 using the cutting device 100 will be described below. In this embodiment, the cutting method S100 sequentially includes a preparatory step S110, a slicing step S130, a slicing inspection step S150, an adjustment step S170, and a cutting step S190, but is not limited thereto.

[0046] For example, in other embodiments of the present invention not illustrated, the number of times and the schedule of the plurality of steps S110 to S190 of the cutting method S100 can be adjusted and varied according to design requirements, and at least one of the adjustment step S170 and the cutting step S190 can be selectively omitted. Each of the steps S110 to S190 will be described sequentially below, and the technical details of the cutting device 100 are described above.

[0047] The preceding step S110: as follows Figure 6 and Figure 7 As shown, an ingot G is fixed to the cutting device 100 (the bearing surface 11), and in this embodiment, the ingot G is adsorbed and fixed to the bearing surface 11 by at least one of the vacuum suction cups 12 of the adjusting stage 1 (e.g., the ingot G is fixed within the receiving space 13). Furthermore, in other embodiments of the invention not illustrated, the ingot G may also be fixed to the bearing surface 11 of the adjusting stage 1 by adhesive and sacrificial material, thereby positioning it within the receiving space 13.

[0048] The slicing step S130: as follows Figure 6 and Figure 8 As shown, the cutting mechanism 2 and the adjusting stage 1 move relative to each other along the first direction D1, so that the first cutting segment 221 moves through the top of the ingot G and cuts a chip G1 to be tested from the ingot G. The chip G1 to be tested is obtained by the first cutting segment 221 passing through the annular side of the ingot G along the first direction D1, and the thickness of the chip G1 to be tested is preferably as small as possible.

[0049] In this embodiment, the ingot G is located on one side of the first cutting segment 221, while the two first guide wheels 211 are located on the other side of the first cutting segment 221. The cutting device 100 moves the adjusting platform 1 relative to the cutting mechanism 2 along the first direction D1 so that the ingot G is cut by the first cutting segment 221 along the first direction D1. The two first guide wheels 211 are able to effectively bear the reaction force generated during the cutting process.

[0050] The examination step S150: as follows: Figure 6 and Figure 9 As shown, a crystal orientation inspection machine 200 is used to inspect the chip G1 under test to determine its crystal orientation angles. In this embodiment, the surface of the chip G1 under test can be defined with mutually perpendicular X-axis and Y-axis, and the crystal orientation inspection machine 200 is an X-ray inspection machine capable of testing the chip G1 under test, thereby measuring a crystal orientation angle value on each of the X-axis and Y-axis of the chip G1 under test. That is to say, the crystal orientation angle in this embodiment includes two crystal orientation angle values ​​corresponding to the X-axis and Y-axis of the chip G1 under test, but the present invention does not limit the measurement and definition method of the crystal orientation angle.

[0051] When the difference between the crystal orientation angle in the inspection step S150 and a preset crystal orientation angle meets a preset allowable error, the cutting method S100 further implements the cutting step S190: as follows Figure 6 , Figure 10 ,and Figure 11 As shown, the ingot G is cut to form multiple seed crystals G2 (i.e., multiple predetermined cuts). The method by which the ingot G is cut into the multiple seed crystals G2 can be adjusted and varied according to design requirements and is not limited to the figures in this embodiment.

[0052] It should be further noted that the preset crystal orientation angle in this embodiment includes a preset crystal orientation angle value corresponding to the X-axis and the Y-axis, and the preset tolerance error is preferably such that the difference between the crystal orientation angle value of the chip under test G1 and the preset crystal orientation angle value is not greater than 0.01 degrees on either the X-axis or the Y-axis, but the present invention is not limited thereto.

[0053] Furthermore, in this embodiment, the cutting step S190 sequentially includes a longitudinal cutting step S191 and a transverse cutting step S192. The longitudinal cutting step S191: as follows... Figure 10As shown, the cutting mechanism 2 removes each of the first guide rollers 211, and then moves the cutting mechanism 2 relative to the adjusting platform 1 so that the second cutting segment 222 can cut the ingot G multiple times along the second direction D2 at different positions. Each time the second cutting segment 222 cuts the ingot G along the second direction D2, the second cutting segment 222 cuts to a preset boundary line of the ingot G, but does not penetrate the ingot G.

[0054] The transverse cutting step S192: as follows Figure 11 As shown, the cutting mechanism 2 reinstalls each of the first guide wheels 211, and then moves the adjustment platform 1 relative to the cutting mechanism 2, so that the first cutting segment 221 can cut the preset boundary of the ingot G along the first direction D1, thereby causing the ingot G to form a plurality of seed crystals G2 that are separated from each other.

[0055] However, when the difference between the crystal orientation angle in the inspection step S150 and the preset crystal orientation angle does not meet the preset allowable error, the cutting method S100 further implements the adjustment step S170: such as Figure 6 and Figure 12 As shown, the adjustment platform 1 is rotated in the direction to eliminate the difference (e.g., the adjustment angle σ11 is formed). Furthermore, after the adjustment step S170, the slicing step S130 and the inspection step S150 are then performed.

[0056] That is, the adjustment step S170, the slicing step S130, and the inspection step S150 are sequentially performed N times (N is a positive integer), and when the difference between the crystal orientation angle in the Nth inspection step S150 and the preset crystal orientation angle meets the preset allowable error, the cutting method S100 then proceeds as follows. Figure 10 and Figure 11 The cutting step S190 shown is illustrated.

[0057] Technical Effects of the Embodiments of the Invention

[0058] In summary, the cutting equipment and cutting method disclosed in the embodiments of the present invention are configured such that the cutting mechanism and the adjusting platform are able to move relative to each other in a first direction that is not perpendicular to the bearing surface, so that the first cutting segment passes through the ingot (or the accommodating space), thereby facilitating the implementation of the slicing step and the inspection step, and enabling the ingot to be cut after confirming its crystal orientation angle.

[0059] Furthermore, the cutting method disclosed in the embodiments of the present invention can also be combined with the adjustment step in the slicing step and the inspection step to effectively control the placement of the crystal ingot, thereby improving the accuracy of the crystal orientation angle.

[0060] Furthermore, the cutting equipment and cutting method disclosed in the embodiments of the present invention fix the ingot (or the object to be cut) by providing at least one of the vacuum suction cups, thereby reducing the material cost of using adhesive and sacrificial material, and effectively saving the time required to remove the adhesive (e.g., about 10 hours).

[0061] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the patent scope of the present invention.

Claims

1. A cutting apparatus, characterized by, The cutting equipment includes: An adjustment platform having a bearing surface, and the adjustment platform defining an accommodating space on the bearing surface; and A cutting mechanism is disposed corresponding to and rotatable relative to the adjusting platform, and the cutting mechanism includes two winding seats and a cutting wire; wherein each of the winding seats includes: A single body that can move relative to the adjustment platform; A first guide wheel, detachably mounted to the base; and A second guide wheel is mounted on the base, and the central axis of the first guide wheel is not parallel to the central axis of the second guide wheel; The cutting wire is wound around the first guide wheel and the second guide wheel of the two winding seats to form a first cutting segment between the two first guide wheels, and the cutting mechanism and the adjusting platform are configured to move relative to each other in a first direction that is not perpendicular to the bearing surface, so that the first cutting segment passes through the receiving space. When each of the first guide wheels is removed from the seat, the cutting line passes around the two second guide wheels to form a second cutting segment between the two second guide wheels, and the cutting mechanism and the adjusting platform are configured to move relative to each other in a second direction so that the second cutting segment enters the receiving space.

2. The cutting apparatus of claim 1, wherein, The first direction and the second direction form an angle between 75 degrees and 105 degrees.

3. The cutting apparatus of claim 1, wherein, The adjustment platform includes at least one vacuum suction cup, one end of which is located on the bearing surface and communicates with the accommodating space.

4. The cutting apparatus of claim 1, wherein, The adjustment platform is configured to rotate relative to the cutting mechanism so that the bearing surface forms an adjustment angle with the first direction.

5. A method of cutting, characterized by The cutting method includes: A preliminary step; fixing an object to be cut onto a cutting device; wherein, the cutting device comprises: An adjustable platform having a bearing surface, and the object to be cut is fixed on the bearing surface; and A cutting mechanism is provided corresponding to and rotatable relative to the adjustment platform, and the cutting mechanism includes two winding seats and a cutting wire; wherein each winding seat includes a body movable relative to the adjustment platform, a first guide wheel detachably mounted on the body, and a second guide wheel mounted on the body, and the central axis of the first guide wheel is not parallel to the central axis of the second guide wheel; wherein the cutting wire passes through the first guide wheel and the second guide wheel of the two winding seats to form a first cutting segment between the two first guide wheels; The cutting process involves the following steps: the cutting mechanism and the adjusting platform move relative to each other in a first direction not perpendicular to the bearing surface, so that the first cutting segment moves through the top of the object to be cut, thereby cutting off a chip to be tested from the object; and The first inspection step: The chip to be inspected is inspected with a crystal orientation inspection machine to determine the crystal orientation angle of the chip to be inspected. When the difference between the crystal orientation angle and a preset crystal orientation angle meets a preset allowable error, the cutting method further implements a cutting step: Cutting the object to be cut so that the object to be cut is formed into multiple predetermined cut products. The cutting step includes a longitudinal cutting step: each of the first guide wheels of the cutting mechanism is removed, and a second cutting segment is formed between the two second guide wheels by the cutting line passing around the two second guide wheels. Then, the cutting mechanism is moved relative to the adjustment platform so that the second cutting segment cuts the object to be cut multiple times along a second direction at different positions.

6. The cutting method according to claim 5, wherein, Each time the second cutting segment cuts the object to be cut along the second direction, the second cutting segment cuts to the preset boundary of the object to be cut, but does not penetrate the object to be cut.

7. The cutting method according to claim 6, wherein The cutting step, following the longitudinal cutting step, further includes a transverse cutting step: reinstalling each of the first guide wheels on the cutting mechanism, and then moving the adjusting platform relative to the cutting mechanism so that the first cutting segment cuts the preset boundary of the object to be cut along the first direction, thereby causing the object to be cut to form a plurality of predetermined cut pieces that are separated from each other.

8. The cutting method of claim 5, wherein, When the difference between the crystal orientation angle in the inspection step and a preset crystal orientation angle does not meet a preset tolerance error, the cutting method further implements an adjustment step: rotating the adjustment stage in the direction to eliminate the difference; after the adjustment step, the slicing step and the inspection step are then implemented; the adjustment step, the slicing step, and the inspection step are implemented in turn N times, where N is a positive integer, and the difference between the crystal orientation angle in the Nth inspection step and the preset crystal orientation angle meets the preset tolerance error.

9. The cutting method according to claim 5, wherein, In the aforementioned preliminary step, the object to be cut is adsorbed and fixed on the support surface by at least one vacuum suction cup of the adjustment stage.

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