A method and device for preparing a solid powder composite material electrode

Abstract

The present application provides a method and apparatus for preparing a solid-powder composite material electrode, comprising: obtaining a three-dimensional model of a target electrode, and setting a cavity within the three-dimensional model near one end of the machining surface to obtain a printed model of the target electrode; preparing the target electrode based on the printed model; wherein, when preparing the cavity, conductive powder is added to the cavity. By adding conductive powder to the cavity, the area of ​​the workpiece impacted by particles is increased during machining, thereby achieving the technical effect of improving the precision of part machining and electrode machining efficiency by eliminating the recast layer and microcracks on the workpiece surface during electrode machining.

Description

Technical Field

[0001] The present application relates to electrode processing technology, and in particular to a method and device for preparing a solid-powder composite material electrode. Background Art

[0002] Electric spark cutting is the mainstream method for processing difficult-to-cut metal materials. Its processing principle is a pulsed spark discharge between the electrode and the part. The high temperature generated locally and instantaneously by the electric spark corrodes the metal to achieve the processing method required for the size, shape and surface quality of the part.

[0003] Existing methods for designing electrode shapes include selective laser sintering, which uses 3D printing to spread the electrode powder to the desired location and then sinter it using a laser to create a solid electrode. Laser sintering is suitable for producing small, thin sheets and can easily sinter powders or sheet compacts with different compositions from the matrix. However, electrodes produced using existing laser sintering technology still suffer from poor workpiece processing and low efficiency. Summary of the Invention

[0004] In view of the above problems, the present application is proposed to provide a method for preparing a solid-powder composite material electrode that overcomes the above problems or at least partially solves the above problems. The method comprises:

[0005] Obtaining a three-dimensional model of a target electrode, and setting a cavity inside the three-dimensional model near one end of the processing surface to obtain a printed model of the target electrode;

[0006] The target electrode is prepared according to the printing model; wherein, when preparing the cavity, conductive powder is added into the cavity.

[0007] Furthermore, a step of setting a cavity in the three-dimensional model near one end of the processing surface to obtain a printed model of the target electrode includes:

[0008] Obtaining the processing depth required for processing the target electrode;

[0009] generating a distance between the cavity and the machining surface according to the machining depth;

[0010] The position of the cavity is determined according to the distance between the cavity and the processing surface to obtain a printing model of the target electrode; wherein, the number of cavities can be set as required.

[0011] Furthermore, the step of preparing the target electrode according to the printed model includes:

[0012] Slicing the printed model in a horizontal direction along the printing direction;

[0013] generating an identification code for the 3D printer based on the sliced ​​printing model;

[0014] The 3D printer prepares the target electrode according to the identification code; wherein the preparation method is layer-by-layer laser sintering.

[0015] Furthermore, the step of slicing the printed model in a horizontal direction along the printing direction includes:

[0016] The number of slices is determined according to the size of the printed model; wherein the cavity portion is cut into at least two slices.

[0017] Furthermore, the preparation steps include:

[0018] Adding electrode main body powder to the powder spreading plate of the 3D printer;

[0019] The powder spreading plate evenly spreads the electrode main body powder to the area to be sintered;

[0020] The 3D printer controls the laser to scan the area required for sintering to generate a solid;

[0021] The electrode main body powder is sintered layer by layer according to the identification code to generate the target electrode.

[0022] Furthermore, when the mold cavity is prepared, the step of adding conductive powder into the mold cavity includes:

[0023] When the cavity is prepared, the powder spreading plate spreads the electrode main body powder to the area of ​​the cavity to be sintered;

[0024] The laser scans the area of ​​the cavity to be sintered to generate a solid cavity;

[0025] The powder spreading plate spreads the conductive powder evenly into the cavity.

[0026] Furthermore, the steps after adding the conductive powder into the cavity include:

[0027] After adding the conductive powder, the powder spreading plate spreads the electrode main body powder over the cavity;

[0028] The laser scans the electrode main body powder covering the cavity to generate a portion of the target electrode that wraps the conductive powder;

[0029] On the basis of the portion of the target electrode, laser sintering is continued layer by layer until the target electrode is completed.

[0030] The embodiment of the present invention discloses a device for preparing a solid-powder composite material electrode, which is characterized in that it is applied to the preparation of a solid-powder composite material electrode, and the device includes the following:

[0031] A model design module is used to obtain a three-dimensional model of a target electrode and set a cavity inside the three-dimensional model near one end of the processing surface to obtain a printed model of the target electrode;

[0032] An electrode preparation module is used to prepare the target electrode according to the printed model; wherein, during the preparation process, when preparing to the cavity, conductive powder is added into the cavity.

[0033] An embodiment of the present invention discloses a computer device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the program implements the steps for preparing a solid-powder composite material electrode as described above.

[0034] An embodiment of the present invention discloses a computer-readable storage medium having a computer program stored thereon, wherein the computer program is characterized in that when the program is executed by a processor, the method for preparing a solid-powder composite material electrode as described above is implemented.

[0035] This application has the following advantages:

[0036] In the embodiments of the present application, relative to the problems of imprecise workpiece processing and low processing efficiency in the prior art, the present application proposes a technical solution by adding conductive powder to the electrode, specifically "obtaining a three-dimensional model of the target electrode, and setting a cavity at one end near the processing surface inside the three-dimensional model to obtain a printed model of the target electrode; preparing the target electrode according to the printed model; wherein, when preparing to the cavity, adding conductive powder to the cavity", by adding conductive powder to the cavity, the area of ​​the workpiece impacted by particles is increased during processing, thereby achieving the technical effect of improving the precision of part processing and electrode processing efficiency by eliminating the recast layer and microcracks on the surface of the workpiece when the electrode processes the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for the description of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0038] Figure 1 This is a flow chart of a method for preparing a solid-powder composite material electrode provided in one embodiment of the present application;

[0039] Figure 2 This is a schematic diagram of a solid-powder composite material electrode structure provided in one embodiment of the present application;

[0040] Figure 3 This is a structural block diagram of a solid-powder composite material electrode preparation device provided in one embodiment of the present application;

[0041] Figure 4 It is a structural diagram of a computer device provided in one embodiment of the present application.

[0042] The reference numerals in the drawings of the specification are as follows:

[0043] 1. Target electrode; 2. Cavity. DETAILED DESCRIPTION

[0044] To make the objectives, features, and advantages of this application more readily apparent, the present application is further described below in conjunction with the accompanying drawings and specific embodiments. It is apparent that the embodiments described are only a portion of the embodiments of this application, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments in this application without inventive effort are also within the scope of protection of this application.

[0045] Through analysis of existing technologies, the inventors found that the machined surface of the workpiece after electrospark machining generally has a recast layer of 10-15 microns. The presence of the recast layer will affect the machining accuracy of the machined surface of the workpiece. However, if conductive powder is added to the electrode, the conductive powder will increase the discharge gap of the electric spark during electrode machining, thereby increasing the discharge channel of the electric spark machining. That is, the conductive powder can increase the particle impact area of ​​the part to be machined, reduce the thickness of the recast layer on the surface of the workpiece, thereby eliminating the defects of the recast layer and improving the machining accuracy of the electrode.

[0046] Reference Figure 1 and Figure 2 , shows a flow chart and structure of a method for preparing a solid-powder composite material electrode provided by an embodiment of the present application, the method comprising:

[0047] S100, obtaining a three-dimensional model of a target electrode, and setting a cavity inside the three-dimensional model near one end of a processing surface to obtain a printed model of the target electrode;

[0048] S200, preparing the target electrode according to the printed model; wherein, when preparing the cavity, adding conductive powder into the cavity.

[0049] In the embodiments of the present application, relative to the problems of imprecise electrode processing and large electrode loss in the prior art, the present application proposes a technical solution by adding conductive powder to the electrode, specifically "obtaining a three-dimensional model of the target electrode, and setting a cavity at one end near the processing surface inside the three-dimensional model to obtain a printed model of the target electrode; preparing the target electrode according to the printed model; wherein, when preparing to the cavity, adding conductive powder to the cavity", by adding conductive powder to the cavity, the area of ​​the workpiece impacted by particles is increased during processing, thereby achieving the technical effect of improving the precision of part processing and electrode processing efficiency by eliminating the recast layer and microcracks on the surface of the workpiece when the electrode processes the workpiece.

[0050] Next, a method for preparing a solid-powder composite material electrode in this exemplary embodiment will be further described.

[0051] In an embodiment of the present application, as in step S100, a three-dimensional model of the target electrode is obtained, and a cavity is set inside the three-dimensional model near one end of the processing surface to obtain a printed model of the target electrode; it should be noted that the present application needs to first obtain a three-dimensional model of the target electrode, because the three-dimensional model can display the internal structure of the model, and it is also convenient to modify the internal structure of the model.

[0052] In an embodiment of the present application, the above step S100 further includes:

[0053] Step S110: obtaining the machining depth required for machining the target electrode. It should be noted that the side of the electrode facing the part is the machining surface, and the depth to which the part needs to be eroded by the EDM is the machining depth.

[0054] Step S120: Generate the distance between the cavity and the machining surface based on the machining depth. It should be noted that when a part is further machined, there is generally more than one process, and it needs to undergo rough machining and then fine machining. A distance needs to be set before the electrode cavity of this application to ensure loss during rough machining. The thickness of the loss area of ​​this application is generated by the machining depth, and the loss depth is 10%-20% of the machining depth. The specific data of the above loss depth is determined by conditions such as the material of the electrode body and the machining speed.

[0055] Step S130: Determine the position of the cavity based on the distance between the cavity and the processing surface, and obtain the printing model of the target electrode; wherein, the cavity can be set as needed; it should be noted that the distance between the bottom of the cavity and the processing surface is the distance generated in step S120. The cavity of the present application can be set as many as possible, and they are arranged in sequence in the direction away from the processing surface, so that the electrode carries enough conductive powder to ensure that the electrode has enough conductive powder after in-depth processing and wear.

[0056] In an embodiment of the present application, in the above step S200, the step of preparing the target electrode according to the printed model further includes:

[0057] Step S211: Slicing the printed model horizontally along the printing direction. It should be noted that there is a printing direction when printing electrodes, which is generally vertical. Slicing the printed model horizontally along the printing direction facilitates production because laser sintering is suitable for producing small-area slices and is easy to sinter powders or slice compacts with different compositions from the matrix together.

[0058] Step S212: generating a 3D printer identification code based on the sliced ​​printing model. It should be noted that slicing the printing model means modifying the parameters of the printing model. The modified parameters need to be used to generate a code file that can be recognized by the printer. After recognition, the printer will gradually print out the target electrodes according to the code file.

[0059] Step S213: The 3D printer prepares the target electrode based on the identification code, wherein the preparation method is layer-by-layer laser sintering. It should be noted that the identification code includes the printed shape and the printing step sequence. Laser sintering is a technology that uses laser as a heat source to sinter a powder compact.

[0060] In an embodiment of the present application, in the above step S211, the step of slicing the printed model along the horizontal direction of the printing direction includes:

[0061] Step S2111: Determine the number of slices based on the size of the printed model; wherein the cavity portion is cut into at least two slices. It should be noted that in order to facilitate the addition of conductive powder into the cavity, during the cavity production process, a partial cavity with an opening must be produced first, and then conductive powder must be added to the cavity.

[0062] In an embodiment of the present application, in the above step S200, the preparation step includes:

[0063] Step S221: adding electrode main body powder to the powder spreading plate of the 3D printer. It should be noted that the electrode main body powder is generally pure copper powder, or various alloy powders, such as copper-tin alloy powder, brass powder and some cemented carbide powder, etc.

[0064] Step S222: The powder spreading plate evenly spreads the electrode main body powder to the area to be sintered. It should be noted that the sintered solid surface will be flat only after the powder spreading plate evenly spreads the powder to the designated position.

[0065] Step S223: the 3D printer controls the laser to scan the area to be sintered to generate a solid. It should be noted that the laser melts the powder by high-temperature heating, and the melted powder cools and solidifies to form a solid.

[0066] Step S224: Sintering the electrode main body powder layer by layer according to the identification code to generate the target electrode. It should be noted that the powder after laser melting is bonded to the solid layer below, and the shape of the electrode is gradually processed to the desired shape.

[0067] In an embodiment of the present application, in the above step S200, when the mold cavity is prepared, the step of adding conductive powder into the mold cavity includes:

[0068] Step S231: When the cavity is prepared, the powder spreading plate spreads the electrode main body powder to the area of ​​the cavity to be sintered;

[0069] Step S232: The laser scans the area of ​​the cavity to be sintered to generate a solid cavity. It should be noted that the solid cavity must be sintered before the conductive powder can be loaded into the cavity. The conductive powder may be aluminum powder, silicon powder, chromium powder, iron powder, carbon powder, etc.

[0070] Step S233: The powder spreading plate evenly spreads the conductive powder into the mold cavity.

[0071] In an embodiment of the present application, in the above step S200, when the mold cavity is prepared, the step of adding conductive powder into the mold cavity includes:

[0072] In an embodiment of the present application, in the above step S200, the steps after adding the conductive powder into the cavity include:

[0073] Step S241: After adding the conductive powder, the powder spreading plate spreads the electrode main body powder over the mold cavity;

[0074] Step S242: The laser scans the electrode main body powder covering the cavity to generate a portion of the target electrode that wraps the conductive powder;

[0075] Step S243: Based on the target electrode of the portion, continue laser sintering layer by layer until the target electrode is completed. It should be noted that if more cavities need to be set, repeat steps S231-S233.

[0076] In the embodiment of the present application, the electrode of the present application is set in the feeding device of the EDM machine and connected to the positive pole of the pulse power supply. The part to be processed is connected to the negative pole of the pulse power supply. The electrode of the present application is immersed in the EDM oil to remove the debris and heat generated during processing and ensure the processing stability. The electrode is firstly used for rough processing of the part to be processed. As the electrode is processed, the loss unit is mm. 3 / min, the conductive powder in the electrode is released, eliminating defects such as the recast layer and discharge pits on the electrode surface until the processing is completed.

[0077] It should be noted that, under the premise of no conflict, the embodiments and features in the embodiments of this application can be combined with each other. This application solves the problems of imprecise electrode processing and large electrode loss in the prior art by providing electrodes wrapped with conductive powder. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0078] It should be noted that for the sake of simplicity, the method embodiments are described as a series of actions. However, those skilled in the art should be aware that the embodiments of the present invention are not limited by the order of the actions described, because according to the embodiments of the present invention, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in this specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of the present invention.

[0079] As for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0080] In the examples of this application, refer to Figure 3 , shows a structural block diagram of a solid-powder composite material electrode preparation device provided by an embodiment of the present application, which specifically includes the following modules:

[0081] A model design module is used to obtain a three-dimensional model of a target electrode and set a cavity inside the three-dimensional model near one end of the processing surface to obtain a printed model of the target electrode;

[0082] An electrode preparation module is used to prepare the target electrode according to the printed model; wherein, during the preparation process, when preparing to the cavity, conductive powder is added into the cavity.

[0083] In an embodiment of the present application, the model design module includes:

[0084] A processing depth acquisition module is used to obtain the processing depth required for processing the target electrode;

[0085] a distance generating module, configured to generate a distance between the cavity and the machining surface according to the machining depth;

[0086] The cavity position determination module is used to determine the position of the cavity according to the distance between the cavity and the processing surface to obtain the printing model of the target electrode; wherein, the cavity can be set as needed.

[0087] In an embodiment of the present application, the electrode preparation module includes:

[0088] a slicing module, configured to slice the printed model in a horizontal direction along a printing direction;

[0089] A code generation module, configured to generate an identification code for a 3D printer based on the sliced ​​printing model;

[0090] Laser sintering module, the 3D printer prepares the target electrode according to the identification code; wherein the preparation method is layer-by-layer laser sintering.

[0091] In an embodiment of the present application, the slicing module includes:

[0092] The cavity slicing module is used to determine the number of slices according to the size of the printed model; wherein the cavity part is cut into at least two slices.

[0093] In an embodiment of the present application, the laser sintering module includes:

[0094] A powder filling module, used for adding electrode main body powder to the powder spreading plate of the 3D printer;

[0095] A powder spreading module, wherein the powder spreading plate evenly spreads the electrode main body powder to the area to be sintered;

[0096] A sintering module, wherein the 3D printer controls the laser to scan the area to be sintered to generate a solid;

[0097] A stepping module is used to sinter the electrode main body powder layer by layer according to the identification code to generate the target electrode.

[0098] In an embodiment of the present application, the laser sintering module includes:

[0099] A powder spreading module, when preparing to the cavity, the powder spreading plate spreads the electrode body powder to the area of ​​the cavity to be sintered;

[0100] A sintering module, used for controlling the laser to scan the area of ​​the cavity to be sintered to generate a solid cavity;

[0101] The powder spreading module is used to control the powder spreading plate to evenly spread the conductive powder into the mold cavity.

[0102] In an embodiment of the present application, the laser sintering module includes:

[0103] A powder spreading module, after adding the conductive powder, the powder spreading plate spreads the electrode main body powder over the mold cavity;

[0104] A sintering module, wherein the laser scans the electrode main body powder covering the cavity to generate a portion of the target electrode that wraps the conductive powder;

[0105] The stepping module is used for continuing to laser sinter layer by layer on the basis of the portion of the target electrode until the target electrode is completed.

[0106] Reference Figure 4 , showing a computer device of a method for preparing a solid-powder composite material electrode of the present application, which may specifically include the following:

[0107] The computer device 12 is a general-purpose computing device. The components of the computer device 12 may include but are not limited to: one or more processors or processing units 16, memory 28, and a bus 18 connecting different system components (including memory 28 and processing unit 16).

[0108] Bus 18 represents one or more of several types of bus structures, including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, a processor, or a local bus using any of a variety of bus architectures. Examples of these architectures include, but are not limited to, an Industry Standard Architecture (ISA) bus, a Micro Channel Architecture (MAC) bus, an Enhanced ISA bus, an Audio Video Electronics Standards Association (VESA) local bus, and a Peripheral Component Interconnect (PCI) bus.

[0109] The computer device 12 typically includes a variety of computer system readable media. These media can be any available media that can be accessed by the computer device 12, including volatile and non-volatile media, removable and non-removable media.

[0110] Memory 28 may include computer system readable media in the form of volatile memory, such as random access memory 30 and / or cache memory 32. Computer device 12 may further include other removable / non-removable, volatile / non-volatile computer system storage media. By way of example only, storage system 34 may be configured to read and write to non-removable, non-volatile magnetic media (commonly referred to as a "hard drive"). Although Figure 4Not shown, a disk drive for reading and writing to a removable non-volatile disk (such as a "floppy disk"), and an optical drive for reading and writing to a removable non-volatile optical disk (such as a CD-ROM, DVD-ROM, or other optical media) can be provided. In these cases, each drive can be connected to the bus 18 via one or more data medium interfaces. The memory may include at least one program product having a set (e.g., at least one) of program modules 42, which are configured to perform the functions of the various embodiments of the present application.

[0111] A program / utility 40 having a set (at least one) of program modules 42 may be stored, for example, in a memory. Such program modules 42 include, but are not limited to, an operating system, one or more application programs, other program modules 42, and program data, each of which, or some combination thereof, may include an implementation of a network environment. The program modules 42 generally perform the functions and / or methods of the embodiments described herein.

[0112] The computer device 12 may also communicate with one or more external devices 14 (e.g., a keyboard, a pointing device, a display 24, a camera, etc.), one or more devices that enable an operator to interact with the computer device 12, and / or any device that enables the computer device 12 to communicate with one or more other computing devices (e.g., a network card, a modem, etc.). Such communication may be performed through an I / O interface 22. Furthermore, the computer device 12 may also communicate with one or more networks (e.g., a local area network (LAN)), a wide area network (WAN), and / or a public network (e.g., the Internet) through a network adapter 20. Figure 4 As shown, the network adapter 20 communicates with the other modules of the computer device 12 via the bus 18. Figure 4 Not shown, other hardware and / or software modules may be used in conjunction with the computer device 12, including but not limited to microcode, device drivers, redundant processing units 16, external disk drive arrays, RAID systems, tape drives, and data backup storage systems 34.

[0113] The processing unit 16 executes various functional applications and data processing by running the programs stored in the memory 28, such as implementing a method for preparing a solid-powder composite material electrode provided in an embodiment of the present application.

[0114] That is, when the above-mentioned processing unit 16 executes the above-mentioned program, it achieves: obtaining a three-dimensional model of the target electrode, and setting a cavity inside the three-dimensional model near one end of the processing surface to obtain a printed model of the target electrode; preparing the target electrode according to the printed model; wherein, when preparing to the cavity, adding conductive powder into the cavity.

[0115] In an embodiment of the present application, the present application further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements a method for preparing a solid-powder composite material electrode as provided in all embodiments of the present application.

[0116] That is, when the program is executed by the processor, it is implemented as follows: obtaining a three-dimensional model of the target electrode, and setting a cavity inside the three-dimensional model near one end of the processing surface to obtain a printed model of the target electrode; preparing the target electrode according to the printed model; wherein, when preparing the cavity, adding conductive powder into the cavity.

[0117] Any combination of one or more computer-readable media may be employed. A computer-readable medium may be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include: an electrical connection having one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium may be any tangible medium containing or storing a program that may be used by or in conjunction with an instruction execution system, apparatus, or device.

[0118] A computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, which carries computer-readable program code. Such a propagated data signal may take a variety of forms, including, but not limited to, electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium that can transmit, propagate, or transport a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0119] The computer program code for performing the operations of the present application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" language or similar programming languages. The program code can be executed entirely on the operator's computer, partially on the operator's computer, as a separate software package, partially on the operator's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer can be connected to the operator's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (for example, using an Internet service provider to connect through the Internet). The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referenced to each other.

[0120] Although preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they become aware of the basic inventive concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0121] Finally, it should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or terminal device that includes a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or terminal device. In the absence of further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes the element.

[0122] The above is a detailed introduction to the preparation method and device of a solid powder composite material electrode provided by the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for general technical personnel in this field, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for preparing a solid powder composite material electrode, characterized in that: The method comprises: Obtaining a three-dimensional model of a target electrode, and setting a cavity inside the three-dimensional model near one end of the processing surface to obtain a printed model of the target electrode; The target electrode is prepared according to the printed model; the printed model is sliced ​​in a horizontal direction along the printing direction; an identification code of a 3D printer is generated according to the sliced ​​printed model; the 3D printer prepares the target electrode according to the identification code; wherein the preparation method is layer-by-layer laser sintering; Adding electrode main body powder to a powder spreading plate of the 3D printer; using the powder spreading plate to evenly spread the electrode main body powder to an area to be sintered; controlling the laser to scan the area to be sintered to generate a solid; and sintering the electrode main body powder layer by layer according to the identification code to generate the target electrode; Among them, when preparing the cavity, conductive powder is added into the cavity, including: the powder spreading plate spreads the electrode main body powder to the area of ​​the cavity to be sintered; the laser scans the area of ​​the cavity to be sintered to generate a solid cavity; the powder spreading plate evenly spreads the conductive powder into the cavity.

2. The electrode preparation method according to claim 1, characterized in that: The steps of setting a cavity at one end near the processing surface inside the three-dimensional model to obtain a printed model of the target electrode include: Obtaining the processing depth required for processing the target electrode; generating a distance between the cavity and the machining surface according to the machining depth; The position of the cavity is determined according to the distance between the cavity and the processing surface to obtain a printing model of the target electrode; wherein, a plurality of cavities are set as required.

3. The electrode preparation method according to claim 1, characterized in that: The step of slicing the printed model in a horizontal direction along the printing direction includes: The number of slices is determined according to the size of the printed model; wherein the cavity portion is cut into at least two slices.

4. The electrode preparation method according to claim 1, characterized in that: The steps after adding the conductive powder into the cavity include: After adding the conductive powder, the powder spreading plate spreads the electrode main body powder over the cavity; The laser scans the electrode main body powder covering the cavity to generate a portion of the target electrode that wraps the conductive powder; On the basis of the portion of the target electrode, laser sintering is continued layer by layer until the target electrode is completed.

5. A device for preparing a solid powder composite material electrode, the device being applied to the method according to any one of claims 1 to 4, characterized in that: Applied to the preparation of solid powder composite material electrodes, the device includes the following: A model design module is used to obtain a three-dimensional model of a target electrode and set a cavity inside the three-dimensional model near one end of the processing surface to obtain a printed model of the target electrode; An electrode preparation module, used for preparing the target electrode according to the printed model; Slicing the printed model horizontally along the printing direction; generating an identification code for a 3D printer based on the sliced ​​printed model; and preparing the target electrode using the 3D printer based on the identification code. The preparation method includes layer-by-layer laser sintering. Electrode main body powder is added to a powder spreading plate of the 3D printer; the powder spreading plate evenly spreads the electrode main body powder to an area to be sintered. The 3D printer controls a laser to scan the area to be sintered to generate a solid. Sintering the electrode main body powder layer by layer based on the identification code generates the target electrode. Among them, during the preparation process, when preparing to the cavity, conductive powder is added into the cavity, including: the powder spreading plate spreads the electrode main body powder to the area of ​​the cavity to be sintered; the laser scans the area of ​​the cavity to be sintered to generate a solid cavity; the powder spreading plate spreads the conductive powder evenly into the cavity.

6. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the program, the method according to any one of claims 1 to 4 is implemented.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the method according to any one of claims 1 to 4 is implemented.

Images