Automated material handling system and method of handling thereof

Abstract

The application relates to an automated material handling system and a handling method thereof, which comprises an automated trolley and a first transfer mechanism, the automated trolley is provided with a first lifting mechanism and a first grabbing piece connected with the first lifting mechanism, and the first grabbing piece is used for taking and placing wafer boxes; the first transfer mechanism is arranged below the automated trolley, the first transfer mechanism is provided with a first moving mechanism and a first carrier, the first moving mechanism is connected with the first carrier and is used for driving the first carrier to move, the first carrier is used for carrying the wafer boxes, the running speed and the running direction of the first carrier and the first grabbing piece are consistent or the control deviation is within a preset range, when the first carrier moves to a docking position which is mutually docked with the first grabbing piece, the first grabbing piece can place the wafer boxes on the first carrier and can grab the wafer boxes on the first carrier.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor integrated circuits, in particular to an automated material handling system and a handling method thereof. BACKGROUND

[0002] The automated material handling system (AMHS) in the semiconductor integrated circuit is used to carry a batch of semiconductor products, and is used to transfer between each operation device or storage cabinet, so as to avoid the low efficiency problem of traditional manual handling, and to ensure the cleanliness of the production plant, so that the automated material handling system has become one of the necessary equipment in the semiconductor manufacturing factory. The core carrier in the automated material handling system is the automated overhead crane (OHT), and the crane device is often used to carry the wafer box (FOUP) containing the wafer. Specifically, the wafer box containing the wafer is carried to the corresponding machine table for processing, and after the wafer processing is completed, the automated overhead crane is used to grab and carry the wafer box to the next station machine for processing or store it in the suspended temporary storage shelf (OHB, Over Head Buffer) for waiting for the next step processing.

[0003] In the traditional technology, when the machine table processes the wafer in the wafer box, the wafer box needs to go to the next station, the automated overhead crane first needs to travel to the wafer box storage site (Load Port) of the machine table and stop, then lower the lifting belt to grab the wafer box through the chuck, and then retract the lifting belt, and finally start the crane to go to the next machine table or the OHB. Similarly, when the wafer box needs to be placed on the machine table, the crane first travels to the storage site of the machine table where the wafer box needs to be placed and stops, then lowers the lifting belt to place the wafer box on the storage site of the machine table, and finally retracts the lifting belt and starts to travel away. However, the wafer box handling efficiency is low, and the utilization rate of the crane is high. SUMMARY

[0004] Therefore, it is necessary to overcome the defects of the prior art, and to provide an automated material handling system and a handling method thereof, which can greatly reduce the handling time of the automated overhead crane and improve the handling efficiency.

[0005] The technical scheme is as follows: an automated material handling system, the automated material handling system comprising:

[0006] an automated overhead crane, the automated overhead crane being provided with a first lifting mechanism and a first grabbing member connected with the first lifting mechanism, the first grabbing member being used to take and place a wafer box; and

[0007] The first transfer mechanism is arranged below the automated trolley, and is provided with a first moving mechanism and a first carrier. The first moving mechanism is connected with the first carrier and is used to drive the first carrier to move. The first carrier is used to carry the wafer box. The running speed and direction of the first carrier and the first grabbing piece are consistent or the deviation is controlled within a preset range. When the first carrier moves to a docking position opposite to the first grabbing piece, the first grabbing piece can place the wafer box on the first carrier and grab the wafer box on the first carrier.

[0008] In one of the embodiments, the automated material handling system further comprises a guide rail. The automated trolley runs along the guide rail. One of the automated trolley and the guide rail is provided with a first sensor, and the other is provided with a first matching piece matched with the first sensor. The first sensor is electrically connected with the automated trolley. The automated trolley can control the first lifting mechanism to lower the first grabbing piece according to the sensing signal of the first sensor, and / or lower the running speed of the automated trolley along the guide rail.

[0009] In one of the embodiments, one of the automated trolley and the first carrier is provided with a second sensor, and the other is provided with a second matching piece matched with the second sensor. The second sensor is electrically connected with the automated trolley. The automated trolley can control the first grabbing piece to place and take the wafer box according to the sensing signal of the second sensor.

[0010] In one of the embodiments, the automated material handling system further comprises a second transfer mechanism. The second transfer mechanism can transfer the wafer box between the first carrier and a storage site.

[0011] In one of the embodiments, the automated material handling system further comprises a transfer mechanism and a buffer mechanism arranged between the first transfer mechanism and the second transfer mechanism. The transfer mechanism is used to transfer the wafer box placed thereon to the first carrier or the buffer mechanism, and to obtain the wafer box on the first carrier or the buffer mechanism. The second transfer mechanism can transfer the wafer box between the buffer mechanism and the storage site.

[0012] In one of the embodiments, the transfer mechanism comprises a second moving mechanism and a transfer piece. The second moving mechanism is connected with the transfer piece, and is used to drive the transfer piece to move. The second transfer piece can place the wafer box, transfer the wafer box placed thereon to the first carrier or the buffer mechanism, and obtain the wafer box on the first carrier or the buffer mechanism.

[0013] In one of the embodiments, one of the first carrier and the transfer mechanism is provided with a third sensor, and the other is provided with a third matching part matched with the third sensor; the third sensor is electrically connected with the first moving mechanism or the second moving mechanism, and the first moving mechanism or the second moving mechanism can stop moving according to the sensing signal of the third sensor.

[0014] One of the transfer mechanism and the buffer mechanism is provided with a fourth sensor, and the other is provided with a fourth matching part matched with the fourth sensor; the fourth sensor is electrically connected with the second moving mechanism, and the second moving mechanism can stop moving according to the sensing signal of the fourth sensor.

[0015] In one of the embodiments, the buffer mechanism comprises a rotating part and a second carrier; the rotating part is connected with the second carrier and can drive the second carrier to rotate, and the second carrier is used for placing the wafer box.

[0016] In one of the embodiments, the buffer mechanism further comprises a first base, a fifth sensor and a fifth matching part; the rotating part is arranged on the first base; one of the fifth sensor and the fifth matching part is arranged on the first base, and the other is directly or indirectly arranged on the second carrier; the fifth sensor is electrically connected with the rotating part, and the rotating part is used for stopping rotating according to the sensing signal of the fifth sensor.

[0017] In one of the embodiments, the buffer mechanism further comprises a second base and a second lifting mechanism arranged between the rotating part and the second carrier; the rotating part is connected with the second base, and the second lifting mechanism is arranged on the second base and connected with the second carrier.

[0018] In one of the embodiments, the second lifting mechanism comprises two rotating arms arranged in cross and connected in rotation, and a telescopic part arranged on the second base; the two ends of the rotating arm are respectively slidably arranged on the second base and the second carrier through the sliding blocks, and the telescopic part is connected with at least one of the rotating arms.

[0019] In one of the embodiments, the buffer mechanism is at least two; the second transfer mechanism can move close to any one of the buffer mechanisms.

[0020] In one of the embodiments, the second transfer mechanism is provided with a third lifting mechanism and a second grabbing part; the second grabbing part is used for taking and placing the wafer box, and the third lifting mechanism is connected with the second grabbing part.

[0021] In one of the embodiments, a load sensor is arranged on the transfer mechanism, and the load sensor is configured to sense whether the wafer box is placed on the transfer mechanism.

[0022] A method for transferring a wafer box between a first carrier and a second carrier, the method comprising the steps of:

[0023] In the step of transferring the wafer box between the automated crane and the first transfer mechanism, the first carrier is driven to move at an increased speed by the first moving mechanism, and when the first carrier moves to a docking position where the first carrier and the first gripping member are in mutual docking, the first carrier and the first gripping member are controlled to have a same or a controlled deviation within a preset range in speed and direction, and the wafer box is transferred between the first gripping member and the first carrier.

[0024] In one of the embodiments, the step of transferring the wafer box between the automated crane and the first transfer mechanism further comprises:

[0025] Before the first carrier moves to the docking position where the first carrier and the first gripping member are in mutual docking, the first carrier is driven to move at an increased speed by the first moving mechanism, the automated crane is controlled to decrease in speed, and the first lifting mechanism is controlled to lower the first gripping member.

[0026] When the first carrier moves to the docking position where the first carrier and the first gripping member are in mutual docking, the first carrier is driven to move at a constant speed by the first moving mechanism, and the automated crane is driven to move at a constant speed.

[0027] After the wafer box is transferred between the first gripping member and the first carrier, the first carrier is driven to move at a decreased speed by the first moving mechanism, the automated crane is controlled to increase in speed, and the first lifting mechanism is controlled to raise the first gripping member.

[0028] In one of the embodiments, the method further comprises the steps of transferring the wafer box between the first carrier and the transfer mechanism, transferring the wafer box between the transfer mechanism and the buffer mechanism, transferring the wafer box between the buffer mechanism and the second transfer mechanism, and transferring the wafer box between the second transfer mechanism and the storage station.

[0029] The automated material handling system and the handling method thereof have the advantages that, compared with the prior art, the first transfer mechanism is added below the automated trolley, so that the automated trolley can take and place the wafer boxes from the first transfer mechanism instead of from the storage site, and under the control of the first transfer mechanism, the first carrier can be moved to the docking position opposite to the first gripping piece at the same or approximately the same speed as the automated trolley, so as to realize the mutual transfer of the wafer boxes between the first gripping piece and the first carrier. Therefore, the speed of the automated trolley during the taking and placing of the wafer boxes does not need to be reduced to a stop state, which greatly improves the handling efficiency of the automated trolley and reduces the utilization rate of the automated trolley. BRIEF DESCRIPTION OF DRAWINGS

[0030] The accompanying drawings, which form a part of the present application, are intended to provide further understanding of the present application and are incorporated herein for a purpose of explanations. The schematic embodiments of the present application and the descriptions thereof are used to explain the present application and do not constitute improper limitations to the present application.

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the accompanying drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.

[0032] Figure 1 Structure schematic diagram of the automated material handling system of an embodiment of the present application;

[0033] Figure 2 Structure schematic diagram of the second sensor and the second cooperating piece in mutual alignment during the placing process of an embodiment of the present application;

[0034] Figure 3 Structure schematic diagram of the first transfer mechanism and the transfer mechanism from one perspective of an embodiment of the present application;

[0035] Figure 4 Structure schematic diagram of the first transfer mechanism, the transfer mechanism and the buffer mechanism from one perspective of an embodiment of the present application;

[0036] Figure 5 Structure schematic diagram of the third sensor and the third cooperating piece in mutual alignment of an embodiment of the present application;

[0037] Figure 6 Structure schematic diagram of the buffer mechanism of an embodiment of the present application;

[0038] Figure 7 Structure schematic diagram of the first transfer mechanism, the second transfer mechanism and the transfer mechanism from one perspective of an embodiment of the present application;

[0039] Figure 8 A perspective view of a second transfer mechanism according to an embodiment of the present application.

[0040] 10, automated crane; 11, first lifting mechanism; 12, first grabbing piece; 13, first sensor; 14, second sensor; 20, first transfer mechanism; 21, first moving mechanism; 22, first carrier; 221, second matching piece; 222, third sensor; 30, wafer box; 40, guide rail; 41, first matching piece; 50, second transfer mechanism; 51, third lifting mechanism; 52, second grabbing piece; 60, storage site; 70, transfer mechanism; 71, second moving mechanism; 72, transfer piece; 73, third matching piece; 74, load sensor; 80, buffer mechanism; 81, rotating piece; 811, rotating motor; 812, first gear; 813, second gear; 82, second carrier; 83, first base; 84, fifth sensor; 85, fifth matching piece; 86, second base; 87, second lifting mechanism; 871, rotating arm; 872, telescopic piece; 873, sliding block. DETAILED DESCRIPTION

[0041] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a variety of ways beyond the specific embodiments described herein without departing from the scope of the present application, and it is understood that similar improvements can be made by those skilled in the art without departing from the spirit of the present application, and therefore the present application is not limited to the specific embodiments disclosed below.

[0042] Reference Figure 1 , Figure 1The structural schematic diagram of the automated material handling system of an embodiment of the present application is shown. The automated material handling system provided by an embodiment of the present application comprises an automated trolley 10 and a first transfer mechanism 20. The automated trolley 10 is provided with a first lifting mechanism 11 and a first grabbing piece 12 connected with the first lifting mechanism 11. The first grabbing piece 12 is used for taking and placing wafer boxes 30. The first transfer mechanism 20 is arranged below the automated trolley 10. The first transfer mechanism 20 is provided with a first moving mechanism 21 and a first carrier 22. The first moving mechanism 21 is connected with the first carrier 22 and is used for driving the first carrier 22 to move. The first carrier 22 is used for carrying the wafer boxes 30. The running speed and the running direction of the first carrier 22 and the first grabbing piece 12 are consistent or the control deviation is within a preset range. When the first carrier 22 moves to a docking position which is mutually docked with the first grabbing piece 12, the first grabbing piece 12 can place the wafer boxes 30 on the first carrier 22 and can grab the wafer boxes 30 on the first carrier 22. The docking position where the first carrier 22 and the first grabbing piece 12 are mutually docked is specifically, for example, a position where the first carrier 22 is arranged directly below the first grabbing piece 12.

[0043] The above-mentioned automated material handling system is equivalent to the conventional technology. Since the first transfer mechanism 20 is added below the automated trolley 10, the automated trolley 10 does not need to take and place from the storage site 60 in the prior art, but takes and places from the first transfer mechanism 20. Under the control of the first transfer mechanism 20, the first carrier 22 can move to a position opposite to the first grabbing piece 12 (i.e. the docking position which is mutually docked) at the same or approximately the same running speed as the automated trolley 10 to realize the mutual transfer of the wafer boxes 30 between the first grabbing piece 12 and the first carrier 22. Therefore, the running speed of the automated trolley 10 during the process of taking and placing the wafer boxes 30 does not need to be reduced to a stop state, that is, the handling efficiency of the automated trolley 10 can be greatly improved and the utilization rate of the automated trolley 10 is reduced.

[0044] It should be noted that the first lifting mechanism 11 is used to realize the lifting action of the first grabbing piece 12. It can be lifted by a lifting belt, or it can be lifted by, for example, a lifting chain, a gear and rack type lifting, a cylinder lifting, a motor lead screw lifting, a hydraulic cylinder lifting, etc. The specific lifting method can be flexibly selected and arranged according to actual needs, which is not limited here.

[0045] It should be noted that the first grabbing piece 12 is used to realize the taking and placing of the wafer boxes 30. It can be taken and placed by a chuck, or it can be taken and placed by, for example, a negative pressure suction cup, a magnetic suction disc, a mechanical hand, etc. The specific taking and placing method can be flexibly selected and arranged according to actual needs, which is not limited here.

[0046] It should be noted that the first moving mechanism 21 is used to realize the moving action of driving the first carrier 22, and can be, for example, a motor screw moving mechanism, a transmission belt moving mechanism, a transmission chain moving mechanism, a gear and rack moving mechanism, a pneumatic cylinder moving mechanism, a hydraulic cylinder moving mechanism, etc. The specific type can be selected and set flexibly according to actual needs, and is not limited herein.

[0047] It should be further noted that in the embodiment, the wafer box 30 on the automated crane 10 can be placed on the first carrier 22, and the wafer box 30 on the first carrier 22 can also be supplied to the automated crane 10.

[0048] In one embodiment, the automated material handling system further comprises a guide rail 40. The automated crane 10 runs along the guide rail 40. The first sensor 13 is arranged on one of the automated crane 10 and the guide rail 40, and the first matching part 41 is arranged on the other one to cooperate with the first sensor 13. The first sensor 13 is electrically connected to the automated crane 10, and the automated crane 10 can control the first lifting mechanism 11 to lower the first grabbing part 12 according to the sensing signal of the first sensor 13, and / or the automated crane 10 can reduce the running speed of the automated crane 10 along the guide rail 40. In this way, on the one hand, since the running speed of the automated crane 10 along the guide rail 40 is relatively fast during the working process, and the running speed of the first carrier 22 needs to be gradually increased from the initial stationary state in order to dock with the automated crane 10, by sensing whether the automated crane 10 runs to the docking position where the first carrier 22 is about to dock, and gradually reducing the running speed of the automated crane 10, the running speed of the first grabbing part 12 and the first carrier 22 at the docking position can be the same or substantially the same, and then the wafer box 30 can be smoothly transferred between the first carrier 22 and the first grabbing part 12; on the other hand, since the position of the first grabbing part 12 is higher than the position of the first carrier 22 during the working process of the automated crane 10, by sensing whether the automated crane 10 runs to the docking position where the first carrier 22 is about to dock, and gradually reducing the position of the first grabbing part 12, the height position between the first grabbing part 12 and the first carrier 22 at the docking position can meet the operation of taking and placing the wafer box 30, and then the wafer box 30 can be smoothly transferred between the first carrier 22 and the first grabbing part 12.

[0049] Optionally, when the first sensor 13 is arranged on the automated trolley 10, the first matching part 41 is correspondingly arranged on the guide rail 40, and when the automated trolley 10 runs through the position of the first matching part 41, the first sensor 13 can sense the position and transmit a corresponding sensing signal to the automated trolley 10, and the automated trolley 10 can control the first lifting mechanism 11 to lower the first grabbing part 12 or control the running speed of the automated trolley 10 according to the sensing signal. Of course, the first matching part 41 can also be arranged on the automated trolley 10, and the first sensor 13 can be arranged on the guide rail 40.

[0050] In an embodiment, the first sensor 13 includes but is not limited to an electronic code scanner, and the first matching part 41 is a readable code such as a two-dimensional code or a bar code. When the electronic code scanner reads the readable code, a corresponding sensing signal is transmitted to the automated trolley 10. In addition, the first sensor 13 can also be arranged as an RFID (Radio Frequency Identification) sensor, and the first matching part 41 is an electronic tag or a radio frequency card. When the RFID sensor reads the first matching part 41, a corresponding sensing signal is transmitted to the automated trolley 10. In addition, the first sensor 13 can also be arranged as a proximity switch, and the first matching part 41 is a sensing element matched with the proximity switch. When the proximity switch senses the sensing element, a sensing signal can also be transmitted to the automated trolley 10. For example, the first sensor 13 can also be a laser range finder, an ultrasonic range finder, etc. The first sensor 13 senses the distance of the first matching part 41 and transmits a sensing signal to the automated trolley 10 when the distance of the first matching part 41 is within a preset range.

[0051] In an embodiment, the first matching part 41 is arranged on the guide rail 40, and the first matching part 41 is not limited to be arranged at one position, for example, it can be arranged at two different positions. Specifically, one of the first matching parts 41 is used for picking operation, that is, when the automated trolley 10 needs to pick up goods, the first sensor 13 can sense one of the first matching parts 41 during movement through the position of one of the first matching parts 41, and control the automated trolley 10 to act when one of the first matching parts 41 is sensed. The other first matching part 41 is used for putting operation, that is, when the automated trolley 10 needs to put down goods, the first sensor 13 can also sense the other first matching part 41 during movement through the position of the other first matching part 41, and control the automated trolley 10 to act when the other first matching part 41 is sensed.

[0052] It should be noted that as an optional solution, the automated material handling system is not limited to the first sensor 13 and the first matching part 41 described above, but can also be completed by the program itself, so that the structure of the device can be simplified.

[0053] Referring to Figure 1 with Figure 2 , Figure 2 Fig. 6 shows a structure diagram of the second sensor 14 and the second cooperating part 221 in the process of putting down the goods according to an embodiment of the present application. In an embodiment, one of the automated trolley 10 and the first carrier 22 is provided with the second sensor 14, and the other is provided with the second cooperating part 221 cooperating with the second sensor 14. The second sensor 14 is electrically connected with the automated trolley 10, and the automated trolley 10 can control the first grabbing part 12 to take and put down the wafer box 30 according to the sensing signal of the second sensor 14. In this way, when the first carrier 22 moves to the docking position opposite to the first grabbing part 12, for example, the position directly below the first grabbing part 12, the second sensor 14 can generate a sensing signal and provide it to the automated trolley 10, and the automated trolley 10 can control the first grabbing part 12 to take and put down the wafer box 30 according to the sensing signal of the second sensor 14, so that the wafer box 30 can be taken and put down quickly and accurately.

[0054] It should be noted that the second sensor 14 and the second cooperating part 221 are similar to the first sensor 13 and the first cooperating part 41, which will not be described here again, and can be flexibly adjusted and set according to actual needs.

[0055] In the embodiment, the second sensor 14 is, for example, a laser detector or an ultrasonic detector, and the second cooperating part 221 is a reflecting plate capable of reflecting the detection light signal of the second sensor 14. When the first carrier 22 moves to the docking position opposite to the first grabbing part 12, the detection light signal of the second sensor 14 is just opposite to the position of the reflecting plate, and after being reflected by the reflecting plate, it can be received by the second sensor 14, so that the reflecting plate can be sensed, that is, it can be judged that the first carrier 22 moves to the docking position, and the first grabbing part 12 of the automated trolley 10 can perform the grabbing action.

[0056] It should be noted that as an optional solution, the automated material handling system is not limited to the second sensor 14 and the second cooperating part 221 described above, but can also be completed by its own program, so that the structure of the device can be simplified.

[0057] Referring to Figure 7 with Figure 8 , Figure 7 Fig. 6 shows a structure diagram of the first transfer mechanism 20, the second transfer mechanism 50 and the transfer mechanism 70 according to an embodiment of the present application; Figure 8FIG. 2 shows a perspective view of a second transfer mechanism 50 according to an embodiment of the present application. In one embodiment, the automated material handling system further comprises a second transfer mechanism 50. The second transfer mechanism 50 is capable of transferring the FOUPs 30 between the first carriers 22 and the storage sites 60. In this way, the second transfer mechanism 50 can deliver FOUPs 30 from the storage sites 60 to the first carriers 22 and vice versa, as desired.

[0058] Referring to FIG. 1, the automated material handling system further comprises a first transfer mechanism 20, a transfer mechanism 70, and a buffer mechanism 80. The first transfer mechanism 20 is configured to transfer FOUPs 30 between the first carriers 22 and the transfer mechanism 70. The transfer mechanism 70 is configured to transfer FOUPs 30 between the first carriers 22 and the buffer mechanism 80. The buffer mechanism 80 is configured to transfer FOUPs 30 between the transfer mechanism 70 and the storage sites 60. Figure 4 With reference to FIG. 1, the automated material handling system further comprises a first transfer mechanism 20, a transfer mechanism 70, and a buffer mechanism 80. The first transfer mechanism 20 is configured to transfer FOUPs 30 between the first carriers 22 and the transfer mechanism 70. The transfer mechanism 70 is configured to transfer FOUPs 30 between the first carriers 22 and the buffer mechanism 80. The buffer mechanism 80 is configured to transfer FOUPs 30 between the transfer mechanism 70 and the storage sites 60. Figure 7 With reference to FIG. 1, the automated material handling system further comprises a first transfer mechanism 20, a transfer mechanism 70, and a buffer mechanism 80. The first transfer mechanism 20 is configured to transfer FOUPs 30 between the first carriers 22 and the transfer mechanism 70. The transfer mechanism 70 is configured to transfer FOUPs 30 between the first carriers 22 and the buffer mechanism 80. The buffer mechanism 80 is configured to transfer FOUPs 30 between the transfer mechanism 70 and the storage sites 60. Figure 4 With reference to FIG. 1, the automated material handling system further comprises a first transfer mechanism 20, a transfer mechanism 70, and a buffer mechanism 80. The first transfer mechanism 20 is configured to transfer FOUPs 30 between the first carriers 22 and the transfer mechanism 70. The transfer mechanism 70 is configured to transfer FOUPs 30 between the first carriers 22 and the buffer mechanism 80. The buffer mechanism 80 is configured to transfer FOUPs 30 between the transfer mechanism 70 and the storage sites 60.

[0059] Referring to FIG. 1, the automated material handling system further comprises a first transfer mechanism 20, a transfer mechanism 70, and a buffer mechanism 80. The first transfer mechanism 20 is configured to transfer FOUPs 30 between the first carriers 22 and the transfer mechanism 70. The transfer mechanism 70 is configured to transfer FOUPs 30 between the first carriers 22 and the buffer mechanism 80. The buffer mechanism 80 is configured to transfer FOUPs 30 between the transfer mechanism 70 and the storage sites 60. Figure 4 With reference to FIG. 1, the automated material handling system further comprises a first transfer mechanism 20, a transfer mechanism 70, and a buffer mechanism 80. The first transfer mechanism 20 is configured to transfer FOUPs 30 between the first carriers 22 and the transfer mechanism 70. The transfer mechanism 70 is configured to transfer FOUPs 30 between the first carriers 22 and the buffer mechanism 80. The buffer mechanism 80 is configured to transfer FOUPs 30 between the transfer mechanism 70 and the storage sites 60. Figure 7In one embodiment, the transfer mechanism 70 comprises a second moving mechanism 71 and a transfer member 72. The second moving mechanism 71 is connected to the transfer member 72 and is configured to drive the transfer member 72 to move. The transfer member 72 is configured to place the wafer carrier 30, to transfer the wafer carrier 30 placed thereon to the first carrier 22 or the buffer mechanism 80, and to obtain the wafer carrier 30 from the first carrier 22 or the buffer mechanism 80. Thus, since the transfer mechanism 70 comprises the second moving mechanism 71, the position of the transfer member 72 can be moved close to the first carrier 22 or the buffer mechanism 80 under the driving of the second moving mechanism 71. Therefore, the wafer carrier 30 can be quickly and smoothly transferred when the transfer member 72 is close to the first carrier 22 or the buffer mechanism 80.

[0060] Referring to Figure 1 and Figure 4 In one embodiment, the second moving mechanism 71 is arranged in parallel with the first moving mechanism 21 and is configured to move in the same direction as the first moving mechanism 21 or to deviate from the direction of the first moving mechanism 21 within a preset range. Thus, the position of the transfer member 72 can be moved close to the first carrier 22.

[0061] Of course, as an alternative, in order to transfer the wafer carrier 30 between the first carrier 22, the transfer mechanism 70 and the buffer mechanism 80, the transfer mechanism 70 is not limited to the second moving mechanism 71. The first carrier 22 can be moved close to the transfer mechanism 70 by the first moving mechanism 21. In addition, the buffer mechanism 80 is also configured to be movable, for example, to move close to the transfer mechanism 70 to transfer the wafer carrier 30.

[0062] In one embodiment, the transfer member 72 comprises a fork or other device capable of transferring the wafer carrier 30, which is not limited herein and can be selected and arranged as required.

[0063] Referring to Figure 4 and Figure 5 , Figure 5Fig. 3 shows a schematic view of the third sensor 222 and the third matching member 73 when they are in position. In one embodiment, the first carrier 22 and the transfer mechanism 70 are provided with the third sensor 222 and the third matching member 73, respectively. The third sensor 222 is electrically connected to the first moving mechanism 21 or the second moving mechanism 71, and the first moving mechanism 21 or the second moving mechanism 71 can stop moving according to the sensing signal of the third sensor 222. Thus, when the first carrier 22 and the transfer mechanism 70 are close to each other, the third sensor 222 can generate a sensing signal and provide it to the first moving mechanism 21 or the second moving mechanism 71, and the first moving mechanism 21 or the second moving mechanism 71 can stop moving according to the sensing signal of the third sensor 222, so that the wafer box 30 can be transferred between the transfer mechanism 70 and the first carrier 22.

[0064] Specifically, the third sensor 222 is arranged on the transfer member 72 of the transfer mechanism 70, for example. Correspondingly, the third matching member 73 is arranged on the first carrier 22, for example.

[0065] Please refer to Figure 4 In one embodiment, the transfer mechanism 70 and the buffer mechanism 80 are provided with the fourth sensor (not shown) and the fourth matching member (not shown), respectively. The fourth sensor is electrically connected to the second moving mechanism 71, and the second moving mechanism 71 can stop moving according to the sensing signal of the fourth sensor. Thus, when the transfer mechanism 70 and the buffer mechanism 80 are close to each other, the fourth sensor can generate a sensing signal and provide it to the second moving mechanism 71, and the second moving mechanism 71 can stop moving according to the sensing signal of the fourth sensor, so that the wafer box 30 can be transferred between the transfer mechanism 70 and the buffer mechanism 80.

[0066] It should be noted that the third sensor 222 and the third matching member 73, and the fourth sensor and the fourth matching member are similar to the first sensor 13 and the first matching member 41, and will not be described here.

[0067] Please refer to Figure 4 and Figure 6 , Figure 6The structure diagram of the buffer mechanism 80 of an embodiment of the present application is shown. In an embodiment, the buffer mechanism 80 comprises a rotating member 81 and a second carrier 82. The rotating member 81 is connected to the second carrier 82 and can drive the second carrier 82 to rotate. The second carrier 82 is used to place the wafer box 30. Thus, in the unloading operation of the storage site 60, the second transfer mechanism 50 places the wafer box 30 on the second carrier 82 of the buffer mechanism 80. Under the driving of the rotating member 81, the second carrier 82 can rotate to drive the wafer box 30 to rotate to a suitable angular position. Thus, when the wafer box 30 is subsequently fed to the automated trolley 10, the angular position of the wafer box 30 meets the requirements of the automated trolley 10. In addition, in the loading operation of the storage site 60, after the wafer box 30 is transferred to the second carrier 82, under the driving of the rotating member 81, the second carrier 82 can rotate to drive the wafer box 30 to rotate to a suitable angular position, thereby meeting the angular requirements of the second transfer mechanism 50 for the wafer box 30.

[0068] It should be noted that the rotating angle of the second carrier 82 by the rotating member 81 is flexibly set according to the angular requirements of the second transfer mechanism 50 and the automated trolley 10 for the wafer, which is not limited herein. In the present embodiment, after the wafer box 30 is installed on the rotating member 81, the rotating member 81 usually drives the second carrier 82 to rotate forward by 90° or to rotate reversely by 90° before moving to the transfer mechanism 70 or the second transfer mechanism 50, which can respectively meet the angular requirements of the automated trolley 10 for the wafer box 30 and meet the angular requirements of the second transfer mechanism 50 for the wafer box 30.

[0069] It should be noted that the rotating member 81 has various structural forms, as long as it can drive the first carrier 22 to rotate, which is not described herein.

[0070] Please refer to Figure 4 and Figure 6 In an embodiment, the buffer mechanism 80 further comprises a first base body 83, a fifth sensor 84 and a fifth matching member 85. The rotating member 81 is arranged on the first base body 83. One of the fifth sensor 84 and the fifth matching member 85 is arranged on the first base body 83, and the other is directly or indirectly arranged on the second carrier 82. The fifth sensor 84 is electrically connected to the rotating member 81, and the rotating member 81 is used to stop rotating according to the sensing signal of the fifth sensor 84. Thus, the fifth sensor 84 and the fifth matching member 85 are mutually inductive and matched, which plays a positioning role and can accurately control the rotating angle of the rotating member 81.

[0071] Specifically, the fifth sensor 84 is arranged on the first base body 83, for example, and the fifth sensor 84 is arranged as two, one of which is arranged at an initial position and the other is arranged at an end position. The rotating angles corresponding to the initial position and the end position are the rotating angle of the rotating member 81.

[0072] Of course, as an optional solution, the fifth sensor 84 and the fifth matching part 85 can also be omitted, for example, an angle encoder is arranged on the rotation shaft of the rotating part 81, and the angle of rotation is determined according to the signal sensed by the angle encoder.

[0073] Please refer to Figure 6 In an embodiment, the buffering mechanism 80 further comprises a second base 86 and a second lifting mechanism 87 arranged between the rotating part 81 and the second carrier 82. The rotating part 81 is connected to the second base 86, and the second lifting mechanism 87 is arranged on the second base 86 and connected to the second carrier 82. In this way, the rotating part 81 drives the second lifting mechanism 87 and the second carrier 82 to rotate synchronously by driving the second base 86 to rotate. Since the second lifting mechanism 87 is arranged, the second carrier 82 and the wafer box 30 placed thereon can be lifted before the rotating part 81 rotates, so as to avoid interference with the second base 86 or other structures during rotation, and the rotation effect is more smooth.

[0074] Please refer to Figure 6 In an embodiment, the fifth sensor 84 is arranged on the first base 83, and the fifth matching part 85 is arranged on the second base 86, since the second base 86 is relatively close to the first base 83. In addition, the rotating part 81 specifically comprises a rotating motor 811 arranged on the first base 83, a first gear 812 arranged on the rotating shaft of the rotating motor 811, and a second gear 813 arranged on the second base 86, and the first gear 812 and the second gear 813 are meshed with each other. In this way, when the rotating motor 811 rotates, the first gear 812 drives the second gear 813 to rotate, and the second gear 813 drives the second base 86 to rotate when it rotates, thereby driving the second lifting mechanism 87 and the second carrier 82 arranged on the second base 86 to rotate synchronously.

[0075] Please refer to Figure 6 In an embodiment, the second lifting mechanism 87 comprises two rotating arms 871 arranged in cross and connected in rotation, and a telescopic part 872 arranged on the second base 86. The two ends of the rotating arm 871 are respectively arranged on the second base 86 and the second carrier 82 through the sliding block 873 in a sliding manner, and the telescopic part 872 is connected to at least one of the rotating arms 871. In this way, when the telescopic part 872 acts, the telescopic part 872 drives the rotating arm 871 to rotate, and the rotating arm 871 can realize the lifting action of the second carrier 82 when it rotates.

[0076] It should be noted that the second lifting mechanism 87 can also be provided in other structural forms, including but not limited to lifting belts, chains, gear racks, air cylinders, motor lead screws, hydraulic cylinders, etc., and the specific structure can be selected and set as required, which is not limited here.

[0077] Please refer to Figure 4 In one embodiment, the buffer mechanism 80 is at least two. The second transfer mechanism 50 can move close to any one of the buffer mechanisms 80. In this way, the buffer of at least two wafer boxes 30 can be achieved.

[0078] Of course, as an optional solution, the buffer mechanism 80 can also be provided as one.

[0079] Please refer to Figure 7 With Figure 8 In one embodiment, the second transfer mechanism 50 is provided with a third lifting mechanism 51 and a second grabbing piece 52. The second grabbing piece 52 is used to take and place the wafer box 30, and the third lifting mechanism 51 is connected with the second grabbing piece 52. In this way, when the second grabbing piece 52 grabs the wafer box 30, the second grabbing piece 52 is driven to lift by the third lifting mechanism 51, and the wafer box 30 is lifted, so that the wafer box 30 can be quickly and smoothly transferred between the storage site 60 and the buffer mechanism 80.

[0080] It should be noted that similar to the first lifting mechanism 11, the third lifting mechanism 51 has many structural forms, which are not described here. In addition, the second grabbing piece 52 has a similar structure to the first grabbing piece 12, which is not described here. In addition, the first carrier 22 and the second carrier 82 are, for example, provided as trays, and of course can also be other structural forms.

[0081] Please refer to Figure 5 In one embodiment, the transfer mechanism 70 is provided with a load sensor 74. The load sensor 74 is used to sense whether the wafer box 30 is placed on the transfer mechanism 70. In this way, the load sensor 74 can determine whether the wafer box 30 is on the transfer mechanism 70 by sensing the weight, and further determine whether the transfer operation of the wafer box 30 between the transfer mechanism 70 and the first carrier 22 and the buffer mechanism 80 is successful.

[0082] Please refer to Figure 1 In one embodiment, a handling method of the automated material handling system of any of the above embodiments, the handling method comprising the following steps:

[0083] The first moving mechanism 21 drives the first carrier 22 to move to increase the running speed of the first carrier 22, and when the first carrier 22 moves to the docking position opposite to the first grabbing piece 12, the running speed and the running direction of the first carrier 22 and the first grabbing piece 12 are controlled to be consistent or the deviation is controlled to be within a preset range, and the wafer box 30 is transferred between the first grabbing piece 12 and the first carrier 22.

[0084] The above-mentioned wafer box transfer method of the automated material handling system is equivalent to the conventional technology. Since the first transfer mechanism 20 is added below the automated trolley 10, the automated trolley 10 does not need to take and place the wafer box from the storage site 60 in the prior art, but takes and places the wafer box from the first transfer mechanism 20. Under the control of the first transfer mechanism 20, the first carrier 22 can move to the position opposite to the first grabbing piece 12 at the same or approximately the same running speed as the automated trolley 10 to realize the mutual transfer of the wafer box 30 between the first grabbing piece 12 and the first carrier 22. Therefore, the running speed of the automated trolley 10 during the wafer box transfer process does not need to be reduced to a stop state, which greatly improves the transfer efficiency of the automated trolley 10 and reduces the utilization rate of the automated trolley 10.

[0085] It should be noted that the deviation of the running speed and the running direction within the preset range can be flexibly adjusted and set according to actual needs, which is not limited here.

[0086] In one embodiment, the wafer box transfer step between the automated trolley 10 and the first transfer mechanism 20 further includes: before the first carrier 22 moves to the docking position opposite to the first grabbing piece 12, the first moving mechanism 21 uniformly increases the running speed of the first carrier 22, the automated trolley 10 uniformly reduces the running speed, and the first lifting mechanism 11 uniformly lowers the position of the first grabbing piece 12. In this way, the running effect is more stable.

[0087] In one embodiment, when the first carrier 22 moves to the docking position opposite to the first grabbing piece 12, the first moving mechanism 21 drives the first carrier 22 to move at a constant speed, and the automated trolley 10 moves at a constant speed. In this way, the wafer box 30 can be smoothly transferred between the automated trolley 10 and the first transfer mechanism 20.

[0088] In one embodiment, after the wafer box 30 is transferred between the first grabbing member 12 and the first carrier 22, the first moving mechanism 21 uniformly reduces the running speed of the first carrier 22, the automated crane 10 uniformly increases the running speed, and the first lifting mechanism 11 uniformly increases the position of the first grabbing member 12. In this way, the running effect is relatively stable.

[0089] Of course, it should be noted that as some optional solutions, the first moving mechanism 21 is not uniformly changed when driving the first carrier 22 to move, the automated crane 10 is not uniformly changed during the speed changing process, and the first lifting mechanism 11 is also not uniformly changed when changing the position of the first grabbing member 12.

[0090] In one embodiment, the carrying method further comprises the steps of: transferring the wafer box 30 between the first carrier 22 and the transfer mechanism 70, transferring the wafer box 30 between the transfer mechanism 70 and the buffer mechanism 80, transferring the wafer box 30 between the buffer mechanism 80 and the second moving mechanism 50, and transferring the wafer box 30 between the second moving mechanism 50 and the storage site 60.

[0091] The technical features of the above embodiments can be combined in any way. In order to make the description simple, not all possible combinations of the technical features in the above embodiments are described, but as long as the combinations of the technical features do not contradict, they should be considered as the scope of the description.

[0092] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent application scope. It should be noted that for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these are within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

[0093] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0094] In addition, the terms "first", "second", etc. are used herein only to describe different instances, and are not used to denote or imply relative importance or a number of indications of the technical features indicated. Thus, the technical features defined with "first", "second", etc. can explicitly or implicitly include at least one of the technical features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified and limited.

[0095] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0096] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0097] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on another element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are only for illustrative purposes, and do not represent the only embodiment.

Claims

1. An automated material handling system, characterized in that, The automated material handling system includes: An automated overhead crane is provided with a first lifting mechanism and a first gripping component connected to the first lifting mechanism. The first gripping component is used to pick up and put down wafer cassettes. A first transfer mechanism is disposed below the automated overhead crane. The first transfer mechanism includes a first moving mechanism and a first carrier. The first moving mechanism is connected to the first carrier and is used to drive the first carrier to move. The first carrier is used to carry the wafer cassette. The running speed and running direction of the first carrier and the first gripper are consistent or the control deviation is within a preset range. When the first carrier moves to the docking position where it docks with the first gripper, the first gripper can place the wafer cassette on the first carrier and can grip the wafer cassette on the first carrier. A second transfer mechanism; the second transfer mechanism is capable of transferring the wafer cassette between the first carrier and the storage site; A transfer mechanism and a buffer mechanism are disposed between the first transfer mechanism and the second transfer mechanism; the transfer mechanism is used to transfer the wafer cassette placed thereon to the first carrier or the buffer mechanism, and is capable of acquiring the wafer cassette on the first carrier or the buffer mechanism; the second transfer mechanism is capable of transferring the wafer cassette between the buffer mechanism and the storage site. The buffer mechanism includes a rotating component and a second carrier; the rotating component is connected to the second carrier and can drive the second carrier to rotate, and the second carrier is used to place the wafer cassette. The transfer mechanism includes a second moving mechanism and a transfer component; the second moving mechanism is connected to the transfer component, and the second moving mechanism is used to drive the transfer component to move. The transfer component can place the wafer cassette, transfer the placed wafer cassette to the first carrier or the cache mechanism, and can acquire the wafer cassette on the first carrier or the cache mechanism. The second moving mechanism is arranged side by side with the first moving mechanism at intervals, and the moving direction of the second moving mechanism is consistent with the moving direction of the first moving mechanism or the deviation is controlled within a preset range.

2. The automated material handling system according to claim 1, characterized in that, The automated material handling system also includes a guide rail; the automated overhead crane runs along the guide rail; a first sensor is provided on one of the automated overhead crane and the guide rail, and a first mating component is provided on the other to cooperate with the first sensor; the first sensor is electrically connected to the automated overhead crane, and the automated overhead crane can control the first lifting mechanism to lower the first gripper according to the sensing signal of the first sensor, and / or the automated overhead crane reduces its running speed along the guide rail.

3. The automated material handling system according to claim 1, characterized in that, The automated overhead crane and one of the first carriers are provided with a second sensor, and the other is provided with a second mating component that cooperates with the second sensor; the second sensor is electrically connected to the automated overhead crane, and the automated overhead crane can control the first gripper to pick up and place the wafer cassette based on the sensing signal of the second sensor.

4. The automated material handling system according to claim 1, characterized in that, A third sensor is provided on one of the first carrier and the transfer mechanism, and a third mating component is provided on the other to cooperate with the third sensor; the third sensor is electrically connected to the first moving mechanism or the second moving mechanism, and the first moving mechanism or the second moving mechanism can stop moving according to the sensing signal of the third sensor; One of the transfer mechanism and the buffer mechanism is provided with a fourth sensor, and the other is provided with a fourth mating component that cooperates with the fourth sensor; the fourth sensor is electrically connected to the second moving mechanism, and the second moving mechanism can stop moving according to the sensing signal of the fourth sensor.

5. The automated material handling system according to claim 1, characterized in that, The buffer mechanism further includes a first base, a fifth sensor, and a fifth mating component. The rotating component is disposed on the first base. One of the fifth sensor and the fifth mating component is disposed on the first base, and the other is disposed directly or indirectly on the second carrier. The fifth sensor is electrically connected to the rotating component, and the rotating component is used to stop rotating according to the sensing signal of the fifth sensor.

6. The automated material handling system according to claim 1, characterized in that, The buffer mechanism further includes a second base and a second lifting mechanism disposed between the rotating component and the second carrier. The rotating component is connected to the second base, and the second lifting mechanism is disposed on the second base and connected to the second carrier.

7. The automated material handling system according to claim 6, characterized in that, The second lifting mechanism includes two rotating arms that are cross-arranged and rotatably connected, and a telescopic member disposed on the second base; the two ends of the rotating arms are respectively slidably disposed on the second base and the second carrier via sliders, and the telescopic member is connected to at least one of the rotating arms.

8. The automated material handling system according to claim 1, characterized in that, The cache mechanism is at least two; the second transfer mechanism is capable of moving closer to any one of the cache mechanisms.

9. The automated material handling system according to claim 1, characterized in that, The second transfer mechanism is provided with a third lifting mechanism and a second gripper; the second gripper is used to pick up and put down the wafer cassette, and the third lifting mechanism is connected to the second gripper.

10. The automated material handling system according to claim 1, characterized in that, The transfer mechanism is equipped with a load sensor, which is used to sense whether the wafer cassette is placed on the transfer mechanism.

11. A material handling method for an automated material handling system as described in any one of claims 1 to 10, characterized in that, The transport method includes the following steps: In the transfer step between the automated overhead crane and the first transfer mechanism, the first moving mechanism drives the first carrier to move, increasing the running speed of the first carrier. When the first carrier moves to the docking position where it docks with the first gripper, the running speed and running direction of the first carrier and the first gripper are controlled to be consistent or the deviation is controlled to be within a preset range, and the wafer cassette is transferred between the first gripper and the first carrier. The wafer cassette is transferred between the first carrier and the transfer mechanism, between the transfer mechanism and the cache mechanism, between the cache mechanism and the second transfer mechanism, and between the second transfer mechanism and the storage site.

12. The handling method according to claim 11, characterized in that, The wafer cassette further includes the following in the transfer step between the automated overhead crane and the first transfer mechanism: Before the first carrier moves to the docking position where it docks with the first gripper, the first moving mechanism increases the running speed of the first carrier, controls the automated crane to reduce its running speed, and controls the first lifting mechanism to lower the position of the first gripper. When the first carrier moves to the docking position where it docks with the first gripper, the first moving mechanism drives the first carrier to move at a constant speed, and the automated overhead crane moves at a constant speed. After the wafer cassette is transferred between the first gripper and the first carrier, the first moving mechanism reduces the running speed of the first carrier, controls the automated crane to increase its running speed, and controls the first lifting mechanism to raise the position of the first gripper.

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