Method for automatically adjusting chip suction depth under tray disc deformation state

Abstract

The present application relates to a kind of TRAY plate deformation state automatic adjustment chip suction depth method, including real-time numerical deformation mode formula adjustment method and pre-detection regional adjustment method, real-time numerical deformation mode formula adjustment method uses automatic detection technology, and according to parabolic model calculates the model of deformation mode, to predict the adjusted suction depth of all chips in TRAY plate;Pre-detection regional adjustment method divides TRAY plate into several regions by region, and uses automatic detection technology to calculate the suction depth of the center position in each region as the suction depth of all chips in the region.The present application can quickly and effectively realize the automatic suction of IC chip in TRAY plate deformation carrier by real-time numerical deformation mode formula adjustment method and pre-detection regional adjustment method, to greatly improve production efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and more specifically to a method for automatically adjusting the chip pick-up depth when the TRAY disk is deformed. Background Technology

[0002] Semiconductor IC chips are commonly transported using a tray loading method. To ensure the quality of IC chips, they often need to be placed in an oven during the manufacturing process to ensure that the ICs are dried. This process can easily cause the trays to deform, which in turn affects the subsequent automated equipment's pick-up device, which needs to remove the ICs from the deformed trays at an appropriate depth.

[0003] Because the TRAY disc is deformed and dented, the pick-up device cannot reach the IC and therefore cannot pick it up. Existing technological solutions, such as... Figure 1 As shown, the suction nozzle is equipped with a vacuum generator and a vacuum sensor. The vacuum generator is used to pick up the chip, and the vacuum sensor is used to determine whether the chip has been successfully picked up. When the suction nozzle is at the standard suction depth and the vacuum generator is activated, but due to deformation of the TRAY tray carrier, the vacuum sensor cannot reach a valid value, such as... Figure 2 As shown, the system employs automatic detection technology. The nozzle begins to rise from the standard suction depth to a preset rise value (e.g., 1 mm), then begins to descend in increments of 0.1 mm, checking again whether the vacuum sensor has reached a valid value. This descent process is repeated until the vacuum sensor reaches a valid value.

[0004] The automatic detection technology is generally suitable for use when a single chip fails to be picked up. If this method is used on all chips in the TRAY disk carrier, the efficiency will be greatly reduced. Summary of the Invention

[0005] The technical problem solved by this invention is to provide an efficient automatic IC chip picking method for TRAY disk deformation.

[0006] The technical solution adopted by this invention to solve its technical problem is:

[0007] The method for automatically adjusting the chip pick-up depth under the deformation state of the TRAY disk includes a real-time numerical deformation mode formula adjustment method and a pre-detection regional adjustment method. The real-time numerical deformation mode formula adjustment method uses automatic detection technology and calculates the deformation mode model based on a parabolic model to predict and calculate the adjusted pick-up depth of all chips in the TRAY disk. The pre-detection regional adjustment method divides the TRAY disk into several regions and uses the automatic detection technology to calculate the pick-up depth at the center of each region as the pick-up depth of all chips in that region. The real-time numerical deformation mode formula adjustment method and the pre-detection regional adjustment method can be switched freely.

[0008] Furthermore, the real-time numerical deformation mode formula adjustment method includes the following steps:

[0009] Step 1: Using the aforementioned automatic detection technology, calculate the absorption depth of the TRAY disc after deformation;

[0010] Step 2: Based on the chip's position in the TRAY disk, calculate the model of the deformation mode;

[0011] Step 3: Calculate the adjusted absorption depth of all chips based on the model of the deformation mode.

[0012] Furthermore, the automatic detection method in step 1 above includes the following steps:

[0013] Step 101: The nozzle rises from the standard suction depth by a preset rise value as the automatic detection suction start depth;

[0014] Step 102: The suction nozzle begins to gradually move downwards at a preset displacement value, and the vacuum value sensor detects whether it has reached an effective value.

[0015] Step 103: When the vacuum sensor detects a valid value, record the number of downward displacement steps, and calculate the displacement depth based on the number of downward displacement steps and the preset displacement value;

[0016] Step 104: Calculate the absorption depth after deformation. The absorption depth after deformation can be obtained by adding the displacement depth in step 103 to the automatically detected absorption start depth.

[0017] Furthermore, the preset displacement value is much smaller than the preset rise value.

[0018] Furthermore, the deformation mode model in step 2 adopts an upward-opening parabolic model, which is symmetrical about the center position of the length of the TRAY disc, dividing the TRAY disc into a deepening zone and a shallowing zone. In the deepening zone, the suction depth of the nozzle gradually decreases; in the shallowing zone, the suction depth of the nozzle gradually increases.

[0019] Furthermore, the model method for deriving the deformation mode is as follows:

[0020] Step 201: Automatically detect the position of the TRAY disk;

[0021] Step 202: Calculate the adjustment coefficient (a) based on the parabola formula (y=ax2+bx+c);

[0022] Step 203: Based on the adjustment coefficient, calculate and predict the chip extraction depth in each TRAY disk of the deepening zone and the shallowing zone respectively;

[0023] Step 204: Repeat the above steps.

[0024] Furthermore, the pre-detection regional adjustment method includes the following steps:

[0025] Step S11: Divide the TRAY disk into several areas;

[0026] Step S12: Use the center of each area as the adjustment standard;

[0027] Step S13: Perform automatic nozzle depth detection at the center of each region with a preset standard suction depth;

[0028] Step S14: Use the automatic detection depth obtained in step S13 as the adjusted absorption depth, and use it as the absorption depth of all chips in the region.

[0029] Furthermore, in step S11, the TRAY disk is divided equally in both the horizontal and vertical directions.

[0030] Furthermore, the horizontal and vertical dimensions of the TRAY disk in the system software are designed to prevent errors caused by exceeding the index value.

[0031] This invention uses a real-time numerical deformation mode formula adjustment method and a pre-detection regional adjustment method to automatically adjust the absorption depth of the TRAY disk in the deformation state. This can quickly and effectively realize the automatic absorption of IC chips in the TRAY disk deformation carrier, thereby greatly improving production efficiency. Moreover, the two methods can be flexibly switched according to different TRAY disks.

[0032] The real-time numerical deformation mode formula adjustment method uses automatic detection technology and establishes a deformation mode model to predict and calculate the pick-up depth of all chips after adjustment. This deformation mode model is applicable to the automatic pick-up of chips in the concave (recessed) state of the TRAY disk.

[0033] The pre-detection regional adjustment method divides the TRAY disk into several regions and uses automatic detection technology to calculate the pick-up depth at the center of each region. This center pick-up depth is then used as the pick-up depth for all chips within that region. This method is suitable for automatic chip pick-up even with irregularly deformed TRAY disks. Attached Figure Description

[0034] Figure 1 This addresses the existing problems in the background technology of this invention;

[0035] Figure 2 This is the prior art described in the background section of this invention;

[0036] Figure 3 The implementation method steps of this invention;

[0037] Figure 4 for Figure 3 Specific implementation examples;

[0038] Figure 5 This is another implementation method step of the present invention;

[0039] Figure 6 for Figure 5 Specific implementation examples.

[0040] The diagram is marked as follows:

[0041] 1. Tray disc, 2. IC chip, 3. Nozzle. Detailed Implementation

[0042] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0044] like Figure 1 As shown in the left image, a normal semiconductor IC chip is being picked up by an automated device. The nozzle 1 of the automated device only needs to descend to the standard pick-up depth (system preset value) to pick up the IC chip 2. However, because its loading tool TRAY disk 2 is deformed (dented), the IC chip shifts downwards (as shown in the image). Figure 1 As shown in the right figure, the suction nozzle was unable to remove the IC chip 2 from the deformed TRAY disk 1 at the standard suction depth.

[0045] Figure 2 This is a solution based on existing technology. The nozzle is equipped with a vacuum generating device and a vacuum sensor. The vacuum generating device is used to pick up the chip, and the vacuum sensor is used to determine whether the chip has been successfully picked up. When the nozzle is at the standard pick-up depth and the vacuum generating device is turned on, but the vacuum sensor cannot reach a valid value due to the deformation of the TRAY disc, the system will use automatic detection technology. Automatic detection technology: The nozzle starts to rise from the standard pick-up depth by a preset value (e.g., 1 mm). The depth after the rise is the automatic detection pick-up starting depth. Then, it begins to descend at a preset displacement step (e.g., 0.1 mm), and checks again whether the vacuum sensor has reached a valid value. This descent step is repeated until the vacuum sensor reaches a valid value. The position at this point is the pick-up depth after deformation.

[0046] The automatic detection technology is generally suitable for use when a single chip fails to be picked up. If this method is used on all chips in the TRAY disk, the efficiency will be greatly reduced.

[0047] Therefore, this invention provides a method for automatically adjusting the chip pick-up depth under the deformation state of a TRAY disk based on a real-time numerical deformation mode formula adjustment, such as... Figure 3 The diagram shows the method for adjusting the formula in a real-time numerical deformation model, which includes the following steps:

[0048] Step S1: Calculate the absorption depth after deformation using automatic detection technology;

[0049] Step S2: Based on the position of this chip in the TRAY disk, calculate the model of the deformation mode;

[0050] Step S3: Calculate the adjusted pick-up height of all chips based on the model of the deformation mode.

[0051] To better understand the above steps, such as Figure 4 The image shows the deformation model of the real-time numerical deformation mode. This model is applicable to concave (depressed) TRAY disks, and the default deformation trend is to gradually sink towards the central area. Based on the standard suction depth on the far left, a progressively deeper zone (zone A) and a progressively shallower zone (zone B) can be distinguished. In the progressively deeper zone, the suction depth of the nozzle gradually sinks, while in the progressively shallower zone, the suction depth of the nozzle gradually rises. The midpoint of the TRAY disk is used as the boundary between the two zones, and the midpoint is preset as the maximum deformation depth. Thus, the concavity of the TRAY disk can be regarded as a standard parabola.

[0052] This invention adjusts the absorption depth using a real-time numerical deformation model formula. The deformation model formula of this invention is based on a preset parabolic formula to calculate the adjusted absorption depth. Furthermore, we set:

[0053] Standard suction depth: sHeight;

[0054] Automatically detected depth: adjHeight;

[0055] Automatic position detection for disk carriers: index;

[0056] The directional length of the disk carrier: Xn;

[0057] Midpoint of disk carrier: mIndex.

[0058] Based on the automatic detection technology, the depth after automatic detection = initial suction depth + depth per displacement step * number of displacement steps, where: initial suction depth = standard suction depth (sHeight) - preset rise value (rValue), depth per displacement step is i, and the number of displacement steps is j. Assuming the standard suction depth sHeight is 50mm and the preset rise value rValue is -1mm, then the initial suction depth after automatic detection = 50 - 1 = 49mm. With a depth per displacement step i of 0.1mm and 30 displacement steps j, the final depth after automatic detection is adjHeight = 49 + 0.1 * 30 = 52mm, meaning the TRAY disc is recessed by 2mm. The depth per displacement step is much smaller than the preset rise value to avoid excessive nozzle descent and damage to the IC chip.

[0059] like Figure 4 As shown, we then use the parabola formula (y=ax) 2 The adjusted suction depth is calculated using (+bx+c). The default TRAY disk deformation model is symmetrical about the midpoint mIndex axis, therefore y=ax 2 +c, therefore the formula for the deformation model is as follows:

[0060] After automatic detection, the depth is calculated as: adjHeight = sHeight + sIndex * sIndex * adjRatio; where;

[0061] adjRatio is the adjustment factor, and sIndex is the horizontal position of the TRAY disk when the automatic detection technology is first used.

[0062] Then: Adjustment coefficient

[0063] Therefore, the predicted adjustment depth addCalculateHeight at each location in the depth zone can be derived from the formula:

[0064] addCalculateHeight = sHeight + index* index *adjRatio.

[0065] The predicted adjusted depth (reduceCalculateHeight) at each location in the shallowing zone can be derived using this formula:

[0066] reduceCalculateHeight = sHeight + (Xn - index)*(Xn - index)*adjRatio.

[0067] Furthermore, to better understand the above real-time numerical deformation mode formula, such as Figure 4 As shown, in this embodiment, the directional length of the TRAY disk Xn=s=19, and the midpoint position of the TRAY disk mIndex=j=10. When the nozzle picks up the IC chip at point a (a=1), it can pick it up normally. However, when picking up the IC chip at point b (b=2), due to the deformation of the TRAY disk, the nozzle cannot pick up the IC chip at the standard pick-up depth sHeight. At this time, the system starts to use the method of the present invention. First, it uses automatic detection technology to calculate the pick-up depth at point b after deformation (i.e., the automatically detected depth adjHeight). Then, based on the position of this chip in the TRAY disk (sIndex=2), it calculates the model of the deformation mode and then calculates the pick-up height of all chips after adjustment.

[0068] Adjust the depth according to each position in the progressively deeper zone:

[0069] addCalculateHeight=sHeight + index*index*adjRatio,

[0070] It can be known that:

[0071] The extraction depth at point c (c=3) is calculated as sHeight + c*c*adjRatio, and so on. This allows for the prediction of the adjustment depth at each position in the depth gradient zone, enabling efficient and rapid extraction of IC chips at the corresponding positions and improving production efficiency.

[0072] When the TRAY disc deforms irregularly, it is only necessary to repeatedly predict the deformation model formula mentioned above to calculate and predict the nozzle adjustment depth at each position in the increasing and decreasing zones, thereby solving the problem of low efficiency caused by using automatic detection technology at each position.

[0073] Furthermore, the present invention also provides another method for automatically adjusting the chip pick-up depth under the deformed state of the TRAY disk based on pre-detection regional adjustment, such as... Figure 5 The method for pre-detecting regional adjustments, as shown, includes the following steps:

[0074] Step S11: Divide the TRAY disk into X regions by dividing it into N equal parts horizontally (Xn) and M equal parts vertically (Yn);

[0075] Step S12: Use the center of each area as the adjustment standard;

[0076] Step S13: At a preset standard suction depth, the nozzle automatically detects the suction depth at the center of each area;

[0077] Step S14: The automatic detection depth obtained in step S13 is used as the adjusted absorption depth and as the absorption depth of all chips in the region.

[0078] The horizontal (Xn) and vertical (Yn) dimensions of the aforementioned TRAY disk represent its length, which can be preset via software. The horizontal direction is divided into N equal parts, and the vertical direction into M equal parts, where N and M are set values ​​that can be customized manually via software. The X number of regions is a calculated value, automatically obtained from the set N and M.

[0079] When absorption fails within a region, the system will automatically perform a separate automatic detection technique on the IC chip to achieve successful absorption.

[0080] like Figure 6 The following is a specific embodiment of the pre-detection regional adjustment method:

[0081] Step 1: Set both the horizontal and vertical dimensions of the TRAY disk to 3, dividing it into 9 regions, from X1 to X9. In this embodiment, the horizontal length Xn of the TRAY disk is 18, and the vertical length Yn is 9, so each region contains 18 IC chip carriers.

[0082] Step 2: Use the center position of each area (the black filled module in the diagram) as the adjustment standard. The center position is calculated by the software. When both the number of lateral and longitudinal vehicles in the area is odd, the center vehicle is the reference vehicle, which is the adjustment standard for that area. When both the number of lateral and longitudinal vehicles in the area is even, take the vehicles within half of them as the reference vehicle, or take the vehicle after half of them as the reference vehicle. When the number of lateral and longitudinal vehicles in the area is odd and even respectively, take the center of half of the even vehicles and the center of the odd vehicles as the reference vehicle, or take the vehicle after half of the even vehicles and the center of the odd vehicles as the reference vehicle.

[0083] Step 3: Using the preset standard suction depth, the nozzle automatically detects the depth in the black filling module.

[0084] Step 4: The automatically detected depth obtained in each region is used as the chip extraction depth for all chips in that region.

[0085] This method can adapt to irregular disk vehicle deformation. If the deformation is too large, more areas can be drawn to cope with it.

[0086] In software development, since the input Xn and Yn are the dimensions of the TRAY disk and the software number starts from 0, it is necessary to perform foolproofing on the returned values ​​to avoid exceptions that exceed the index value and cause system errors.

[0087] This invention provides two methods for automatic strip sampling depth when the TRAY disc is deformed. To facilitate users changing the method when changing discs, the software system can set the method at the initial check-in and check whether the method has been changed when changing discs or when a new batch is added (IsNewLot).

[0088] The real-time numerical deformation mode formula adjustment method uses automatic detection technology and establishes a deformation mode model to predict and calculate the pick-up depth of all chips after adjustment. This deformation mode model is applicable to the automatic pick-up of chips in the concave (recessed) state of the TRAY disk.

[0089] The pre-detection regional adjustment method divides the TRAY disk into several regions and uses automatic detection technology to calculate the pick-up depth at the center of each region. This center pick-up depth is then used as the pick-up depth for all chips within that region. This method is suitable for automatic chip pick-up even with irregularly deformed TRAY disks.

[0090] In comparison, both methods can significantly improve the pick-up efficiency of IC chips.

[0091] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for automatically adjusting the chip pick-up depth when the TRAY disk is deformed, characterized in that: The method includes a real-time numerical deformation mode formula adjustment method and a pre-detection regional adjustment method. The real-time numerical deformation mode formula adjustment method uses automatic detection technology and calculates the deformation mode model based on a parabolic model to predict and calculate the absorption depth of all chips in the TRAY disk after adjustment. The pre-detection regional adjustment method divides the TRAY disk into several regions and uses the automatic detection technology to calculate the absorption depth of the center position of each region as the absorption depth of all chips in that region. The real-time numerical deformation mode formula adjustment method and the pre-detection regional adjustment method can be switched freely. The real-time numerical deformation mode formula adjustment method includes the following steps: Step 1: Using the aforementioned automatic detection technology, calculate the absorption depth of the TRAY disc after deformation; Step 2: Based on the chip's position in the TRAY disk, calculate the model of the deformation mode; Step 3: Calculate the adjusted absorption depth of all chips based on the model of the deformation mode; The automatic detection method in step 1 includes the following steps: Step 101: The nozzle rises from the standard suction depth by a preset rise value as the automatic detection suction start depth; Step 102: The suction nozzle begins to gradually move downwards at a preset displacement value, and the vacuum value sensor detects whether it has reached an effective value. Step 103: When the vacuum sensor detects a valid value, record the number of downward displacement steps, and calculate the displacement depth based on the number of downward displacement steps and the preset displacement value; Step 104: Calculate the absorption depth after deformation. The absorption depth after deformation can be obtained by adding the displacement depth in step 103 to the automatically detected absorption start depth. The deformation mode model in step 2 adopts an upward-opening parabolic model, which is symmetrical about the center position of the length of the TRAY disc and divides the TRAY disc into a deepening zone and a shallowing zone. In the deepening zone, the suction depth of the nozzle gradually decreases; in the shallowing zone, the suction depth of the nozzle gradually increases.

2. The method for automatically adjusting the chip pick-up depth under the deformed state of the TRAY disk as described in claim 1, characterized in that: The preset displacement value is much smaller than the preset rise value.

3. The method for automatically adjusting the chip pick-up depth under the deformed state of the TRAY disk as described in claim 1, characterized in that: The model method for deriving the deformation mode is as follows: Step 201: Automatically detect the position of the TRAY disk; Step 202: Calculate the adjustment coefficient based on the parabola formula; Step 203: Based on the adjustment coefficient, calculate and predict the chip extraction depth in each TRAY disk of the deepening zone and the shallowing zone respectively; Step 204: Repeat the above steps.

4. The method for automatically adjusting the chip pick-up depth under the deformed state of the TRAY disk as described in claim 1, characterized in that: The pre-detection regional adjustment method includes the following steps: Step S11: Divide the TRAY disk into several areas; Step S12: Use the center of each area as the adjustment standard; Step S13: Perform automatic suction depth detection at the center of each region using a preset standard suction depth; Step S14: Use the automatic detection depth obtained in step S13 as the adjusted absorption depth, and use it as the absorption depth of all chips in the region.

5. The method for automatically adjusting the chip pick-up depth under the deformed state of the TRAY disk as described in claim 4, characterized in that: In step S11, the TRAY disk is divided equally in both the horizontal and vertical directions.

6. The method for automatically adjusting the chip pick-up depth under the deformed state of the TRAY disk as described in any one of claims 1-5, characterized in that: The horizontal and vertical dimensions of the TRAY disk in the system software are both designed to prevent errors caused by exceeding the index value.

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